Flexible heat dissipation support

Abstract

The invention discloses a flexible heat dissipation support which comprises a heat conduction piece and a flexible heat dissipation fin, the heat conduction piece is provided with a heat dissipation face and a heat conduction face, the heat conduction piece wraps the flexible heat dissipation fin, and the heat conduction face and the heat dissipation face are located on the two opposite sides of the flexible heat dissipation fin respectively to form a flexible plate body structure; when the plate body structure is bent to form the support, the electronic equipment is placed on the heat conduction face, the heat conduction face conducts heat of the electronic equipment to the flexible cooling fins, so that part of heat of the flexible cooling fins is directly conducted out through the heat dissipation holes, the flexible cooling fins can be bent at will during bending, and therefore various placing states can be formed through conversion. The use requirements of different angles of a user can be met, and the heat can be efficiently absorbed and rapidly conducted out through the foldable cooling fins at the same time.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic device accessories, in particular to a flexible heat dissipation support. BACKGROUND

[0002] With the increasing powerfulness of electronic devices (such as smart phones, tablets), the heat problem is becoming more and more significant when the device is running large games, video editing software and other high-load programs. To solve this problem, various heat dissipation supports have appeared on the market. Traditional heat dissipation supports usually adopt fixed form structure design, such as flat adhesion type support or fixed angle support. Although such supports have certain heat dissipation function, they have many limitations. On the one hand, the fixed form is difficult to adapt to different use scenarios and the diversification needs of users. For example, users need to frequently change different types of supports to adjust the placement angle of the electronic device when watching videos, video calling or playing games.

[0003] On the other hand, the heat dissipation mode of traditional supports mainly relies on passive heat dissipation (such as metal heat conduction plate, heat dissipation hole), and the heat dissipation efficiency is limited, which is difficult to quickly dissipate the heat generated by the electronic device. As a result, the device is in a high temperature state for a long time, which may cause problems such as processor frequency reduction and battery life shortening.

[0004] In addition, some heat dissipation supports have many parts, resulting in complex structure and inconvenience in carrying, which further limits their application range.

[0005] Therefore, it is necessary to study a new technical solution to solve the above problems. SUMMARY

[0006] Therefore, the present application aims to solve the problems in the prior art. The main purpose is to provide a flexible heat dissipation support. Through the structure design of the foldable heat dissipation sheet, the foldable heat dissipation sheet can be bent at will when bent. In this way, multiple placement states can be formed, which can meet the different angle use requirements of users. When the plate body structure is bent into a support, the electronic device is placed on the heat conduction surface, so that the heat conduction surface conducts the heat of the electronic device to the foldable heat dissipation sheet and conducts the heat out of the heat dissipation surface. It can efficiently absorb heat and quickly conduct heat.

[0007] A flexible heat dissipation support includes a heat conduction member and a foldable heat dissipation sheet. The heat conduction member has a heat dissipation surface and a heat conduction surface arranged opposite to each other and used for attaching to an electronic device. The heat conduction member is covered outside the foldable heat dissipation sheet. The heat conduction surface and the heat dissipation surface are respectively located on two opposite sides of the foldable heat dissipation sheet to form a foldable plate body structure.

[0008] The heat-conducting surface and the heat-dissipating surface form a containing cavity, the heat-dissipating surface is provided with heat-dissipating holes communicating with the containing cavity, and the flexible heat-dissipating fins are arranged in the containing cavity and partially exposed to the heat-dissipating holes,

[0009] When the plate body structure is bent into a support, the electronic device is placed on the heat-conducting surface, the heat-conducting surface conducts the heat of the electronic device to the flexible heat-dissipating fins, and part of the heat of the flexible heat-dissipating fins is directly conducted out of the heat-dissipating holes;

[0010] The heat-dissipating surface is provided with a plurality of first creases arranged in parallel at intervals, the first creases are used to guide the bending and deformation of the plate body structure and can be kept after the bending and deformation, so that the plate body structure is bent into a support.

[0011] As a preferred solution, the first creases are at least two, which are defined as a first bending section and a second bending section, respectively, and the plate body structure is divided into a first support body, a second support body and a third support body, the first bending section is arranged at the joint of the first support body and the second support body, and the second bending section is arranged at the joint of the second support body and the third support body.

[0012] In the bending use state, the second support body can be bent upward relative to the front end of the first support body through the first bending section, so that an electronic device placement area is formed between the first support body and the second support body, and the third support body can be bent downward relative to the rear end of the second support body through the second bending section.

[0013] As a preferred solution, the first creases are at least three, which are defined as a first bending section, a second bending section and a third bending section, respectively, and the plate body structure is divided into a first support body, a second support body, a third support body and a fourth support body, the first bending section is arranged at the joint of the first support body and the second support body, the second bending section is arranged at the joint of the second support body and the third support body, and the third bending section is arranged at the joint of the third support body and the fourth support body.

[0014] In the bending use state, the first support body can be bent upward relative to the front end of the second support body through the first bending section, so that an electronic device placement area is formed between the first support body and the second support body, the third support body can be bent downward relative to the rear end of the second support body through the second bending section, and the fourth support body can be bent forward relative to the lower end of the third support body through the third bending section, so that a triangular support structure is formed between the second support body, the third support body and the fourth support body.

[0015] As a preferred solution, the heat-conducting surface and the heat-dissipating surface are respectively provided with a first suction member and a second suction member for adsorbing adsorbable objects, and the first suction member is arranged staggered with the second suction member.

[0016] As a preferred solution, the first crease is provided with at least five first, second, third, fourth and fifth bending portions, and the plate body structure is divided into first, second, third, fourth, fifth and sixth support bodies.

[0017] The first bending portion is arranged at the joint of the first and second support bodies, the second bending portion is arranged at the joint of the second and third support bodies, the third bending portion is arranged at the joint of the third and fourth support bodies, the fourth bending portion is arranged at the joint of the fourth and fifth support bodies, and the fifth bending portion is arranged at the joint of the fifth and sixth support bodies.

[0018] In the folded use state, the first support body can be folded downward relative to the front end of the second support body through the first bending portion.

[0019] The third support body can be folded downward relative to the rear end of the second support body through the second bending portion, so that the heat-dissipating surfaces of the first, second and third support bodies form a hanging position for hanging on a display screen or an object. The fourth support body can be folded forward relative to the lower end of the third bending portion through the third bending portion, the fifth support body can be folded downward relative to the front end of the fourth bending portion through the fourth bending portion, and the sixth support body can be folded upward relative to the rear end of the fifth support body through the fifth bending portion, so that the heat-conducting surfaces of the third, fifth and sixth support bodies form an electronic device placement area.

[0020] As a preferred solution, the heat-dissipating surface is further provided with first and second inclined creases, the first and second inclined creases extend obliquely relative to the first crease, and the two ends of the first and second inclined creases extend to the adjacent two side edges of the plate body structure.

[0021] As a preferred solution, the first crease is provided with at least two first and second bending portions, and the plate body structure is divided into first, second, third, fourth and fifth support bodies.

[0022] In the bending use state, the second supporting body can be bent downward relative to the front end of the second supporting body through the first bending part, the third supporting body can be bent backward relative to the lower end of the second supporting body through the second bending part, the fourth supporting body can be bent upward relative to the left end of the third supporting body through the first inclined crease, and the fifth supporting body can be bent upward relative to the right end of the third supporting body through the second inclined crease, so that the upper ends of the fourth supporting body and the fifth supporting body abut on the heat dissipation surface of the first supporting body, and a support structure is formed between the first supporting body, the second supporting body, the third supporting body, the fourth supporting body and the fifth supporting body, wherein the heat conduction surface of the first supporting body is used for placing the electronic device.

[0023] As a preferred solution, the opposite sides of the first inclined crease and the second inclined crease are further provided with a third inclined crease and a fourth inclined crease, the third inclined crease and the fourth inclined crease are arranged in an inclined manner relative to the first crease, and the two ends of the third inclined crease and the fourth inclined crease extend to the adjacent two side edges of the plate body structure, respectively, wherein one end of the first inclined crease is connected with one end of the second inclined crease, so that a first included angle is formed between the first inclined crease and the second inclined crease, one end of the third inclined crease is connected with one end of the fourth inclined crease, so that a second included angle is formed between the third inclined crease and the fourth inclined crease, and the first included angle and the second included angle are arranged in an opposite manner.

[0024] As a preferred solution, the heat dissipation fin is made of aluminum, copper, graphene or iron.

[0025] As a preferred solution, the heat conduction member is heat conduction glue or heat conduction silica gel.

[0026] Compared with the prior art, the present application has obvious advantages and beneficial effects, specifically, according to the above technical solution, the structure of the foldable heat dissipation fin is designed, which can be arbitrarily bent, so that multiple placement states can be formed when bent, and the use requirements of different angles of users can be met,

[0027] Secondly, the bending and unfolding and closing operation mode of the plate body structure is simple, in use, the foldable heat dissipation fin is bent by using the material properties of the foldable heat dissipation fin itself, so that the heat conduction surface and the heat dissipation surface together form a support structure, and in non-use, it is in a planar structure or folded up, so that it is convenient to store and carry;

[0028] And when the plate body structure is bent into a support, the electronic device is placed on the heat-conducting surface, the heat-conducting surface conducts the heat of the electronic device to the foldable heat sink, so that part of the heat of the foldable heat sink is directly conducted out of the heat dissipation hole, so when the heat-conducting surface is tightly attached to the electronic device, the heat-conducting surface conducts the heat of the electronic device to the foldable heat sink and is conducted out by the part of the flexible heat dissipation surface exposed outside the foldable heat sink, so that through the large heat dissipation area and good heat conduction performance of the foldable heat sink, the heat can be efficiently absorbed and dispersed, the operating temperature of the electronic device is effectively reduced, the problems such as performance degradation and battery consumption caused by high temperature are reduced, and the service life of the electronic device is prolonged.

[0029] In addition, the design of the plurality of first creases can guide the bending and deformation of the plate body structure and maintain the support state after the bending and deformation.

[0030] In order to more clearly illustrate the structural features and effects of the present application, the present application will be described in detail below in combination with the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a perspective view of an embodiment of the present application;

[0032] Figure 2 is a sectional view of an embodiment of the present application;

[0033] Figure 3 is an exploded view of an embodiment of the present application;

[0034] Figure 4 is another exploded view of an embodiment of the present application;

[0035] Figure 5 is Figure 2 is a partial enlarged view of A in FIG. 7;

[0036] Figure 6 is a schematic view of a first use state of an embodiment of the present application;

[0037] Figure 7 is a schematic view of a second use state of an embodiment of the present application;

[0038] Figure 8 is a schematic view of a third use state of an embodiment of the present application;

[0039] Figure 9 is a schematic view of a fourth use state of an embodiment of the present application;

[0040] Figure 10 is a schematic view of a fifth use state of an embodiment of the present application;

[0041] Figure 11is a storage state diagram of the embodiment of the present application (the plate body structure is in a half-winding state);

[0042] Figure 12 is a storage state diagram of the embodiment of the present application (the plate body structure is in a full-winding state).

[0043] Explanation of the drawing:

[0044] 10, heat-conducting part 11, heat-dissipating surface

[0045] 10A, plate body structure

[0046] 101A, first section support body 102A, second section support body

[0047] 103A, third section support body 104A, fourth section support body

[0048] 105A, fifth section support body 106A, sixth section support body

[0049] 111, heat-dissipating hole 12, heat-conducting surface

[0050] 131, first suction disc 132, second suction disc

[0051] 14, accommodating cavity 15, first crease

[0052] 151, first section bending part 152, second section bending part

[0053] 153, third section bending part 154, fourth section bending part

[0054] 155, fifth section bending part

[0055] 16, electronic device placing area 17, hanging position

[0056] 18, first inclined crease 19, second inclined crease

[0057] 20, heat-dissipating fin. DETAILED DESCRIPTION

[0058] Please refer to Figures 1 to 12 , which shows the specific structure of the embodiment of the present application.

[0059] In the description of the present application, it should be noted that, for orientation words, such as the orientation and position relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", etc. are the orientation or position relationship shown in the drawings or when normally worn and used, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific protection scope of the present application.

[0060] A flexible heat dissipation support includes a heat conducting member 10 and a flexible heat dissipation sheet 20.

[0061] The heat conducting member 10 has a heat dissipation surface 11 and a heat conducting surface 12 arranged oppositely, and the heat conducting member 10 is covered by the flexible heat dissipation sheet 20, the heat conducting surface 12 and the heat dissipation surface 11 are respectively arranged on two opposite sides of the flexible heat dissipation sheet to form a flexible plate body structure 10A; when the plate body structure 10A is bent into a support, the electronic device is placed on the heat conducting surface 12, so that the heat conducting surface 12 conducts the heat of the electronic device to the flexible heat dissipation sheet 20 and is conducted out by the heat dissipation surface 11.

[0062] The heat conducting surface 12 and the heat dissipation surface 11 form a containing cavity 14, the heat dissipation surface 11 is provided with a heat dissipation hole 111 communicating with the containing cavity, and the flexible heat dissipation sheet 20 is arranged in the containing cavity 14 and partially exposed at the heat dissipation hole 111, so that part of the heat of the flexible heat dissipation sheet is directly conducted out by the heat dissipation hole 111, and the heat is quickly conducted out by the heat dissipation surface and the heat dissipation hole at the same time, so that the heat dissipation effect is good;

[0063] Alternatively, the heat conducting surface 12 and the heat dissipation surface 11 are connected to form a containing cavity 14, the heat dissipation surface 11 is provided with a heat dissipation hole 111 communicating with the containing cavity 14, and the flexible heat dissipation sheet 20 is arranged in the containing cavity 14, so that the heat conducting surface 12 conducts the heat of the electronic device to the flexible heat dissipation sheet 20 and is conducted out by the heat dissipation hole 111. When the plate body structure 10A is bent, the plate body structure is bent into a support.

[0064] Preferably, a plurality of first creases 15 are arranged in parallel on the heat dissipation surface 11, the plurality of first creases 15 are used to guide the bending deformation of the plate body structure 10A and enable the plate body structure 10A to remain after the bending deformation, the plate body structure 10A has a non-working state and a bending use state, in the non-working state, the plate body structure 10A is in a flat plate shape, in the bending use state, the plate body structure 10A can be bent along the first creases 15, so that the plate body structure forms a support.

[0065] The heat conducting surface 12 and the heat dissipation surface 11 are respectively provided with first and second suction members for adsorbing adsorbable objects, the first and second suction members are arranged staggeredly, the first suction member is a first suction disc 131, and the second suction member is a second suction disc 132.

[0066] As Figure 6As shown, it is the first usage state of the plate structure 10A. There are at least two first folds 15, which are defined as a first section bending portion 151 and a second section bending portion 152. The plate structure 10A is divided into a first section support body 101A, a second section support body 102A and a third section support body 103A. The first section bending portion 151 is provided at the junction of the first section support body 101A and the second section support body 102A, and the second section bending portion 152 is provided at the junction of the second section support body 102A and the third section support body 103A.

[0067] When in the folded state, the second-segment support 101A can be bent upward relative to the front end of the first-segment support 102A via the first-segment bending portion 151, thereby forming an electronic device placement area 16 between the first-segment support 101A and the second-segment support 102A (at this time, the second suction cup 132 on the heat dissipation surface 11 of the first-segment support 101A is attached to the desktop). The third-segment support 103A can be bent downward relative to the rear end of the second-segment support 102A via the second-segment bending portion 152. The second suction cup 132 on the heat dissipation surface 11 of the first-segment support 101A is designed to prevent it from becoming loose during folding.

[0068] The first section support 101A is used to carry the electronic device, the second section support 102A is used to support the back of the electronic device, and the third section support 103A forms a support for the second section support 102A to ensure stability during use.

[0069] like Figure 7 As shown, it is the second usage state of the plate structure 10A, and the first fold 15 is provided with at least three, which are respectively defined as the first section bending portion 151, the second section bending portion 152, the third section bending portion 153 and the fourth section bending portion 154. The plate structure 10A is divided into the first section support body 101A, the second section support body 102A, the third section support body 103A, the fourth section support body 104A and the fifth section support body 105A. The first section bending portion 151 is provided at the junction of the first section support body 101A and the second section support body 102A, the second section bending portion 152 is provided at the junction of the second section support body 102A and the third section support body 103A, and the third section bending portion 153 is provided at the junction of the third section support body 103A and the fourth section support body 104A.

[0070] When in the bent state, the second section support body 101A can be bent upward relative to the front end of the first section support body 102A through the first section bending portion 151, so that the electronic device placement area 16 is formed between the first section support body 101A and the second section support body 102A (at this time, the second suction cup 132 of the heat dissipation surface 11 of the first section support body 101A is adsorbed on the desktop), and the electronic device placement area 16 is set at an obtuse angle to form a primary support, the third section support body 103A can be bent downward relative to the rear end of the second section support body 102A through the second section bending portion 152, and the fourth section support body 104A can be bent forward relative to the lower end of the third section support body 103A through the third section bending portion 153, so that the second section support body 102A , a triangular support structure is formed between the third section support body 103A and the fourth section support body 104A, thereby forming a secondary support, the fifth section support body 105A can be bent upward relative to the front end of the fourth section support body 104A through the fourth section bending portion 154, so that the front end of the fifth section support body 105A abuts against the rear end surface of the second section support body 102A, further forming support for the second section support body 102A, wherein the second section support body 102A and the third section support body 103A are both arranged at an angle, when the mobile phone is placed in the electronic device placement area 16, the non-screen side of the electronic device is attached to the heat conductive surface 12 of the second section support body 102A, and the charging interface end of the electronic device abuts against the heat conductive surface 12 of the first section support body 101A;

[0071] Alternatively, the fifth support section 105A can be bent downward relative to the front end of the fourth support section 104A through the fourth bending portion 154, so that the second suction cup on the heat dissipation surface of the fifth support section 105A can be adsorbed on the desktop to improve its stability.

[0072] like Figure 8 As shown, this is the third usage state of the plate structure 10A (wall bracket). When the wall bracket is used, it only needs to provide a first suction cup 131 and a second suction cup 132 on the heat conducting surface 12 and the heat dissipating surface 11 respectively. The heat conducting surface 12 is adsorbed to the electronic device via the first suction cup 131 to form a connection, and the heat dissipating surface 11 is adsorbed and connected to the adsorbable object (wall or mirror) via the second suction cup 132. In this way, the plate structure 10A can be used as a wall bracket without any bending.

[0073] like Figure 9As shown, it is the fourth use state (wall-mounted support) of the plate body structure 10A, the first crease 15 is provided with at least five, which are respectively defined as the first section bending part 151, the second section bending part 152, the third section bending part 153, the fourth section bending part 154 and the fifth section bending part 155, the plate body structure 10A is divided into the first section support body 101A, the second section support body 102A, the third section support body 103A, the fourth section support body 104A, the fifth section support body 105A and the sixth section support body 106A, the first section bending part 151 is arranged at the joint of the first section support body 101A and the second section support body 102A, the second section bending part 152 is arranged at the joint of the second section support body 102A and the third section support body 103A, the third section bending part 153 is arranged at the joint of the third section support body 103A and the fourth section support body 104A, the fourth section bending part 154 is arranged at the joint of the fourth section support body 104A and the fifth section support body 105A, and the fifth section bending part 155 is arranged at the joint of the fifth section support body 105A and the sixth section support body 106A,

[0074] In the bending use state, the first section support body 101A can be bent downward relative to the front end of the second section support body 102A through the first section bending part 151,

[0075] The third section support body 103A can be bent downward relative to the rear end of the second section support body 102A through the second section bending part 152, so that the heat dissipation surface 11 of the first section support body 101A, the second section support body 102A and the third section support body 103A form a hanging position 17 for hanging on a display screen or an object, and the display screen or the object is adsorbed by the second suction cup 132 at the heat dissipation surface 11 of the first section support body 101A to prevent it from falling off,

[0076] The fourth section support body 104A can be bent forward relative to the lower end of the third section bending part 153 through the third section bending part 153, the fifth section support body 105A can be bent downward relative to the front end of the fourth section bending part 154 through the fourth section bending part 154, and the sixth section support body 106A is bent upward relative to the rear end of the fifth section support body 105A through the fifth section bending part 155, so that the heat conduction surface 12 of the third section support body 103A, the fifth section support body 105A and the sixth section support body 106A form an electronic device placement area 16, when a mobile phone is placed in the electronic device placement area 16, the bent sixth section support body 106A can form a limit for the mobile phone to prevent it from sliding out,

[0077] The heat dissipation surface 11 is further provided with a first inclined fold 18 and a second inclined fold 19. The first inclined fold 18 and the second inclined fold 19 are arranged to extend obliquely relative to the first fold 15, and the ends of the first inclined fold 18 and the second inclined fold 19 extend to two adjacent side edges of the plate structure 10A respectively.

[0078] like Figure 10 As shown, it is the fifth use state of the plate structure 10A. There are at least two first folds 15, which are defined as a first section bending portion 151 and a second section bending portion 152. The plate structure 10A is divided into a first section support body 101A, a second section support body 102A, a third section support body 103A, a fourth section support body 104A and a fifth section support body 105A.

[0079] In the bent use state, the second section support body 102A can be bent downward relative to the front end of the second section support body 102A through the first section bending portion 151, the third section support body 103A can be bent backward relative to the lower end of the second section support body 102A through the second section bending portion 152, the fourth section support body 104A can be bent upward relative to the left end of the third section support body 103A through the first inclined fold 18, and the fifth section support body 105A can be bent upward relative to the left end of the third section support body 105A through the second inclined fold 19. The right end of the third section support body 103A can be bent upwards so that the upper ends of the fourth section support body 104A and the fifth section support body 105A respectively abut against the heat dissipation surface 11 of the first section support body 101A, thereby forming a bracket structure among the first section support body 101A, the second section support body 102A, the third section support body 103A, the fourth section support body 104A and the fifth section support body 105A, wherein the heat conductive surface 12 of the first section support body 101A is used for placing electronic equipment.

[0080] In this embodiment, a third inclined fold and a fourth inclined fold are further provided on the opposite sides of the first inclined fold 18 and the second inclined fold 19, and the third inclined fold and the fourth inclined fold are extended obliquely relative to the first fold, and the two ends of the third inclined fold and the fourth inclined fold respectively extend to two adjacent side edges of the plate structure, wherein one end of the first inclined fold is connected to one end of the second inclined fold, so that a first angle is formed between the first inclined fold and the second inclined fold, and one end of the third inclined fold is connected to one end of the fourth inclined fold, so that a second angle is formed between the third inclined fold and the fourth inclined fold, and the first angle and the second angle are arranged relative to each other.

[0081] The heat conducting member 10 is a heat conducting adhesive or a heat conducting silica gel. Preferably, the heat sink is made of aluminum, copper, graphene or iron. The heat conducting silica gel itself has a certain heat conducting capacity. Generally, its thermal conductivity is about 1-10W / (m·K).

[0082] The thermal conductivity of aluminum is about 237 W / (m·K), which is much higher than most materials, when combined, heat can be first transmitted to aluminum through the heat-conducting silica gel, and then rapidly dissipated by the excellent heat conduction performance of aluminum, thereby realizing efficient heat dissipation;

[0083] Secondly, good interface fitting, the heat-conducting silica gel has good flexibility and adhesion, can tightly fit the aluminum surface, fill the small unevenness on the aluminum surface, reduce the air gap, air is a poor conductor of heat, reducing the air gap can effectively reduce the thermal resistance, so that heat can be more smoothly transmitted from the heat source to the aluminum through the heat-conducting silica gel,

[0084] And the heat-conducting silica gel has stable performance in long-term use, can adapt to a certain temperature change range, is not easy to be affected by aging, deformation and other problems, and can ensure long-term stable heat conduction effect.

[0085] As shown in Figures 11 to 12 , it shows that the plate body structure is in a folded state when not in use, and it respectively shows that the plate body structure is in a half-wound or full-wound state, so that it is convenient to store and carry.

[0086] The design emphasis of the present application is that it is mainly through the structural design of the foldable heat dissipation fin, which can be arbitrarily bent, so that when bent, it can be transformed to form a plurality of placement states, which can meet the different angle use requirements of the user,

[0087] Secondly, the bending and unfolding and closing operation mode of the plate body structure is simple, in use, the foldable heat dissipation fin is bent by using its own material properties, so that the heat conduction surface and the heat dissipation surface together form a support structure, in non-use, it is in a planar structure or folded up, so that it is convenient to store and carry;

[0088] And when the plate body structure is bent into a support, the electronic device is placed on the heat conduction surface, the heat conduction surface conducts the heat of the electronic device to the foldable heat dissipation fin, so that part of the heat of the foldable heat dissipation fin is directly conducted out of the heat dissipation hole, so when the heat conduction surface is tightly fitted with the electronic device, the heat conduction surface conducts the heat of the electronic device to the foldable heat dissipation fin and is conducted out by the part of the flexible heat dissipation surface exposed outside the foldable heat dissipation fin, thereby through the large heat dissipation area and good heat conduction performance of the foldable heat dissipation fin, the heat can be efficiently absorbed and dispersed, the operating temperature of the electronic device can be effectively reduced, the problems such as performance degradation and battery consumption caused by high temperature can be reduced, and the service life of the electronic device can be prolonged;

[0089] Also, the design of the plurality of first creases can guide the plate body structure to bend and deform and maintain the support state after bending and deforming.

[0090] The above merely describes preferred embodiments of the present application, and is not intended to limit the technical scope of the present application in any way. Any minor modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application shall still fall within the technical scope of the present application.

Claims

1. A flexible heat sink support, characterized by: The heat-conducting part has opposite heat-dissipating surfaces and heat-conducting surfaces for attaching to electronic devices, and the heat-conducting part is covered by the foldable heat-dissipating sheet, and the heat-conducting surfaces and the heat-dissipating surfaces are respectively located at two opposite sides of the foldable heat-dissipating sheet to form a foldable plate structure. The heat-conducting surfaces and the heat-dissipating surfaces form a containing cavity, and the heat-dissipating surfaces are provided with heat-dissipating holes communicating with the containing cavity, and the foldable heat-dissipating sheet is arranged in the containing cavity and partially exposed at the heat-dissipating holes, When the plate structure is bent into a support, the electronic device is placed on the heat-conducting surface, and the heat-conducting surface conducts the heat of the electronic device to the foldable heat-dissipating sheet, so that part of the heat of the foldable heat-dissipating sheet is directly conducted out of the heat-dissipating holes. The heat-dissipating surfaces are provided with a plurality of first creases arranged in parallel at intervals, and the first creases are used to guide the bending and deformation of the plate structure and can be maintained after the bending and deformation, so that the plate structure is bent into a support.

2. The flexible heat sink support of claim 1, wherein: The first creases are at least provided with two first bending sections and second bending sections, and correspondingly, the plate structure is divided into first, second and third support sections, the first bending sections are arranged at the junctions of the first and second support sections, and the second bending sections are arranged at the junctions of the second and third support sections. In the bent use state, the second support section can be bent upward relative to the front end of the first support section through the first bending section, so that an electronic device placement area is formed between the first and second support sections, and the third support section can be bent downward relative to the rear end of the second support section through the second bending section.

3. The flexible heat-dissipating support of claim 1, wherein: The first creases are at least provided with three first, second and third bending sections, and correspondingly, the plate structure is divided into first, second, third and fourth support sections, the first bending sections are arranged at the junctions of the first and second support sections, the second bending sections are arranged at the junctions of the second and third support sections, and the third bending sections are arranged at the junctions of the third and fourth support sections. In the bent use state, the first support section can be bent upward relative to the front end of the second support section through the first bending section, so that an electronic device placement area is formed between the first and second support sections, the third support section can be bent downward relative to the rear end of the second support section through the second bending section, and the fourth support section can be bent forward relative to the lower end of the third support section through the third bending section, so that a triangular support structure is formed between the second, third and fourth support sections.

4. The flexible heat-dissipating support of claim 1, wherein: The heat-conducting surfaces and the heat-dissipating surfaces are respectively provided with first and second suction members for adsorbing adsorbable objects, and the first and second suction members are arranged staggered.

5. The flexible heat-dissipating support of claim 1, wherein: The first crease is provided with at least five, which are defined as first, second, third, fourth and fifth bending parts, and the plate structure is divided into first, second, third, fourth, fifth and sixth support bodies correspondingly, The first bending part is arranged at the joint of the first and second support bodies, the second bending part is arranged at the joint of the second and third support bodies, the third bending part is arranged at the joint of the third and fourth support bodies, the fourth bending part is arranged at the joint of the fourth and fifth support bodies, and the fifth bending part is arranged at the joint of the fifth and sixth support bodies, In the folded use state, the first support body can be folded downward relative to the front end of the second support body through the first bending part, The third support body can be folded downward relative to the rear end of the second support body through the second bending part, so that the heat dissipation surfaces of the first, second and third support bodies form a hanging position for hanging on a display screen or an object, the fourth support body can be folded forward relative to the lower end of the third bending part through the third bending part, the fifth support body can be folded downward relative to the front end of the fourth bending part through the fourth bending part, and the sixth support body can be folded upward relative to the rear end of the fifth support body through the fifth bending part, so that the heat conduction surfaces of the third, fifth and sixth support bodies form an electronic device placement area.

6. The flexible heat-dissipating support of claim 1, wherein: The heat dissipation surface is also provided with first and second inclined creases, the first and second inclined creases are arranged obliquely relative to the first crease, and the two ends of the first and second inclined creases extend to the adjacent two side edges of the plate structure.

7. The flexible heat sink support of claim 6, wherein: The first crease is provided with at least two, which are defined as first and second bending parts, and the plate structure is divided into first, second, third, fourth and fifth support bodies, In the folded use state, the second support body can be folded downward relative to the front end of the second support body through the first bending part, the third support body can be folded backward relative to the lower end of the second support body through the second bending part, the fourth support body can be folded upward relative to the left end of the third support body through the first inclined crease, and the fifth support body can be folded upward relative to the right end of the third support body through the second inclined crease, so that the upper ends of the fourth and fifth support bodies abut on the heat dissipation surface of the first support body, and a support structure is formed between the first, second, third, fourth and fifth support bodies, wherein the heat conduction surface of the first support body is used for placing an electronic device.

8. The flexible heat sink support of claim 6, wherein: The opposite sides of the first inclined crease and the second inclined crease are also provided with a third inclined crease and a fourth inclined crease, the third inclined crease and the fourth inclined crease are arranged in an inclined manner relative to the first crease, and the two ends of the third inclined crease and the fourth inclined crease extend to the adjacent two side edges of the plate body structure respectively, wherein one end of the first inclined crease is connected with one end of the second inclined crease, so that a first included angle is formed between the first inclined crease and the second inclined crease, one end of the third inclined crease is connected with one end of the fourth inclined crease, so that a second included angle is formed between the third inclined crease and the fourth inclined crease, and the first included angle and the second included angle are arranged opposite to each other.

9. The flexible heat-dissipating support of claim 1, wherein: The heat dissipation fin is made of aluminum, copper, graphene or iron.

10. The flexible heat-dissipating support of claim 1, wherein: The heat-conducting member is heat-conducting glue or heat-conducting silica gel.

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