PCBA welding temperature control method and system

Abstract

The invention discloses a PCBA (Printed Circuit Board Assembly) welding temperature control method and system, relates to the technical field of PCBA welding, and is used for effectively reducing the accelerated loss of a heating module so as to improve the welding quality stability. The method comprises the following steps: acquiring first real-time input power of a target heating module and a first temperature change rate of a target temperature zone; calculating a first power-temperature rise ratio of the target heating module according to the first real-time input power and the first temperature change rate; when the first temperature change rate is lower than a preset rate, the first power-temperature rise ratio is compared with a preset health reference value; determining a generation factor of a temperature rise lag phenomenon based on a comparison result; and generating a target temperature control instruction of the PCBA board to be welded according to the generation factors.

Description

Technical Field

[0001] This application relates to the field of PCBA soldering technology, and in particular to a PCBA soldering temperature control method and system. Background Technology

[0002] In modern electronics manufacturing, the soldering quality of printed circuit board assemblies (PCBAs) is a crucial factor determining the performance and reliability of the final product. Reflow soldering technology is widely used due to its efficiency and controllability. The core of a reflow oven lies in precisely controlling the temperature of each zone within the oven to ensure the solder paste melts fully and forms reliable solder joints. To accommodate the varying heat capacity characteristics of different PCBAs, existing reflow oven control systems typically dynamically adjust the hot air circulation within the oven based on the computer-aided design (CAD) layout information of the PCBAs.

[0003] When the total number of components on a PCBA board is small, the reflow oven control system sets a relatively mild overall heating profile based on its built-in simplified logic. However, when the PCBA board enters the temperature zone with a metal shield, the reflow oven control system recognizes this high-heat-capacity metal shield and, to ensure the solder joints melt, issues a high-intensity, instantaneous pulse heating command, causing the heating wire in that area to heat up explosively in a very short time. This frequent localized pulse heating is like subjecting the heating wire to high-pressure fatigue testing; over time, this leads to a decrease in its heating efficiency.

[0004] When subsequent PCBA boards of the same type pass through this temperature zone again, the reflow oven control system detects a slower-than-expected temperature rise rate due to decreased heating wire efficiency, resulting in a temperature lag. In this case, the reflow oven control system interprets this lag as insufficient heat supply and automatically intervenes with closed-loop feedback logic. It compensates for the temperature difference by increasing the drive voltage applied to the entire heating module in that area, forcing the temperature feedback reading to align with the set target curve. However, this may exacerbate the wear and tear on already degraded heating wires and cause surrounding healthy heating wires to operate under overload conditions for extended periods, accelerating the cascading aging of the entire heating module and ultimately affecting the soldering quality of subsequent PCBA boards. Summary of the Invention

[0005] This application provides a PCBA soldering temperature control method and system, which can effectively reduce the accelerated wear of the heating module, thereby improving the stability of soldering quality.

[0006] The first aspect of this application provides a PCBA soldering temperature control method, including:

[0007] Acquire the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone;

[0008] Calculate the first power-temperature rise ratio of the target heating module based on the first real-time input power and the first temperature change rate;

[0009] When the first temperature change rate is lower than the preset rate, the first power-temperature rise ratio is compared with the preset health benchmark value.

[0010] The factors contributing to the temperature rise lag phenomenon were determined based on the comparison results.

[0011] The target temperature control command for the PCBA board to be soldered is generated based on the aforementioned generating factors.

[0012] Optionally, determining the factors contributing to the temperature rise lag phenomenon based on the comparison results includes:

[0013] When the difference between the first power-temperature rise ratio and the preset health benchmark value is greater than the preset difference, the cause of the temperature rise lag phenomenon is determined to be the performance degradation of the target heating module.

[0014] When the difference between the first power-temperature rise ratio and the preset health benchmark value is less than or equal to the preset difference, the cause of the temperature rise lag phenomenon is determined to be the change in the heat demand of the PCBA board to be soldered.

[0015] Optionally, a target temperature control command for the PCBA board to be soldered is generated based on the aforementioned generating factors, including:

[0016] When it is determined that the cause of the temperature rise lag phenomenon is the performance degradation of the target heating module, a maintenance alarm command and a power compensation suppression command are generated.

[0017] When the cause of the temperature rise lag phenomenon is determined to be the change in the heat demand of the PCBA board to be soldered, a closed-loop power compensation command is generated.

[0018] Optionally, after generating the target temperature control command for the PCBA board to be soldered based on the generating factors, the method further includes:

[0019] The second real-time input power of the accompanying heating module and the second temperature change rate of the accompanying temperature zone are obtained. The accompanying temperature zone is a temperature zone in a low load or idle state, and the accompanying heating module is a heating module corresponding to the accompanying temperature zone.

[0020] The second power-temperature rise ratio of the accompanying heating module is calculated based on the second real-time input power and the second temperature change rate.

[0021] When the difference between the second power-temperature rise ratio and the preset health benchmark value is less than or equal to the preset difference, the preset health benchmark value is updated based on the first power-temperature rise ratio.

[0022] Optionally, before acquiring the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone, the method further includes:

[0023] Determine whether there are high-reflectivity components in the PCBA board to be soldered;

[0024] If not, then execute the steps of obtaining the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone;

[0025] If so, then execute the high reflectivity diagnostic mode.

[0026] Optionally, the high reflectivity diagnostic mode includes:

[0027] When the welding temperature in the target temperature zone reaches the peak temperature and enters the heat preservation stage, a heat attenuation detection time window is set.

[0028] Within the thermal attenuation detection time window, all power to the target heating module is cut off and the real-time temperature value of the target temperature zone is collected.

[0029] The real-time temperature value is compared with the temperature decay curve within the thermal decay detection time window and a preset reference curve.

[0030] The performance status of the target heating module is determined based on the comparison results;

[0031] The target temperature control command for the PCBA board to be soldered is generated based on the performance status of the target heating module.

[0032] Optionally, determining the performance status of the target heating module based on the comparison results includes:

[0033] When the temperature decay curve matches the state of the preset reference curve, the performance state of the target heating module is determined to be normal.

[0034] When the temperature decay curve does not match the state of the preset reference curve, the performance state of the target heating module is determined to be in a decay state.

[0035] Optionally, generating the target temperature control command for the PCBA board to be soldered based on the performance status of the target heating module includes:

[0036] When the performance status of the target heating module is normal, a closed-loop power compensation command is generated.

[0037] When the performance state of the target heating module is in a decay state, a maintenance alarm command and a power compensation suppression command are generated.

[0038] Optionally, determining whether there are high-reflectivity components in the PCBA board to be soldered includes:

[0039] Emit electromagnetic radiation signals to the surface of the PCBA board to be soldered;

[0040] Receive electromagnetic radiation signals reflected from the surface of the PCBA board to be soldered;

[0041] The reflection characteristics of the PCBA board surface to be soldered are obtained based on the reflected electromagnetic radiation signal.

[0042] The reflection feature is compared with a preset feature;

[0043] If the reflection feature matches the preset feature, it is determined that the PCBA board to be soldered contains a high reflectivity element;

[0044] If the reflection characteristics do not match the preset characteristics, it is determined that the PCBA board to be soldered does not contain high reflectivity components.

[0045] A second aspect of this application provides a PCBA soldering temperature control system, comprising:

[0046] The acquisition unit is used to acquire the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone;

[0047] The calculation unit is used to calculate the first power-temperature rise ratio of the target heating module based on the first real-time input power and the first temperature change rate;

[0048] The comparison unit is used to compare the first power-temperature rise ratio with a preset health benchmark value when the first temperature change rate is lower than the preset rate.

[0049] The determination unit is used to identify the factors contributing to the temperature rise lag phenomenon based on the comparison results;

[0050] The generation unit is used to generate a target temperature control command for the PCBA board to be soldered based on the generated factors.

[0051] As can be seen from the above technical solutions, this application has the following effects:

[0052] First, the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone are acquired. Then, the first power-temperature rise ratio of the target heating module is calculated based on the first real-time input power and the first temperature change rate. When the first temperature change rate is lower than a preset rate, the first power-temperature rise ratio is compared with a preset health benchmark value. The factors causing the temperature rise lag phenomenon are then determined based on the comparison results. Finally, a target temperature control command for the PCBA board to be soldered is generated based on the contributing factors. In this way, by comparing the power-temperature rise ratio with a preset benchmark value, the specific factors causing the temperature rise lag phenomenon can be identified, and corresponding control commands can be generated. This avoids improper power compensation, effectively reduces accelerated wear of the heating module, and thus improves the stability of soldering quality. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of an embodiment of a PCBA soldering temperature control method according to this application;

[0054] Figure 2 This is a schematic diagram of another embodiment of a PCBA soldering temperature control method in this application;

[0055] Figure 3 This is a schematic diagram of another embodiment of a PCBA soldering temperature control method in this application;

[0056] Figure 4 This is a schematic diagram of another embodiment of a PCBA soldering temperature control method in this application;

[0057] Figure 5 This is a schematic diagram of another embodiment of a PCBA soldering temperature control method in this application;

[0058] Figure 6 This is a schematic diagram of an embodiment of a PCBA soldering temperature control system according to this application. Detailed Implementation

[0059] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0060] It should be understood that, when used in this application specification, the term "comprising" indicates the presence of the described feature, integral, step, operation, element, and / or component, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof.

[0061] It should also be understood that the term “and / or” as used in this application specification means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0062] As used in this application specification, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if [the described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [the described condition or event] is detected," or "in response to detection of [the described condition or event]."

[0063] Furthermore, in the description of this application, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0064] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0065] In existing technology, when subsequent PCBA boards of the same type pass through the same temperature zone, the reflow oven control system detects a slower-than-expected temperature rise rate due to decreased heating wire efficiency, resulting in a temperature rise lag. At this point, the reflow oven control system interprets this lag as insufficient heat supply and automatically intervenes with closed-loop feedback logic. It compensates for the temperature difference by increasing the drive voltage applied to the entire heating module in that area, forcing the temperature feedback reading to align with the set target curve. However, this may exacerbate the wear and tear on already degraded heating wires and cause surrounding healthy heating wires to operate under overload conditions for extended periods, accelerating the cascading aging of the entire heating module and ultimately affecting the soldering quality of subsequent PCBA boards.

[0066] Based on this, this application discloses a PCBA welding temperature control method and system, which can effectively reduce the accelerated wear of the heating module and thus improve the stability of welding quality.

[0067] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0068] The PCBA soldering temperature control described in this application is implemented in systems, terminals, servers, or other devices with logic analysis and processing capabilities. Please refer to [link to relevant documentation]. Figure 1 As shown, one embodiment of the PCBA soldering temperature control method in this application includes:

[0069] 101. Obtain the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone;

[0070] In this embodiment, the target heating module is a component in the reflow oven responsible for heating a specific temperature zone. It can be implemented using a resistance wire heater, an infrared heater, or a hot air circulation heater, etc., to provide the required heat to the PCBA board to be soldered. The first real-time input power of the target heating module can be calculated by collecting the real-time current and voltage values ​​of the target heating module using current and voltage sensors, and then calculating the first real-time input power using a power conversion formula. The target temperature zone is a specific temperature area in the reflow oven used for soldering the PCBA board. It is formed by the combined action of multiple heating modules to provide a temperature environment for the PCBA board to complete the soldering process. The first temperature change rate represents the magnitude of temperature rise or fall in the target temperature zone per unit time, which can be obtained by collecting temperature data from temperature sensors and performing differential calculations.

[0071] 102. Calculate the first power-temperature rise ratio of the target heating module based on the first real-time input power and the first temperature change rate;

[0072] In this embodiment, after obtaining the first real-time input power and the first temperature change rate, the first real-time input power is divided by the first temperature change rate, and the quotient is the first power-temperature rise ratio of the target heating module. This first power-temperature rise ratio is used to quantify the heating efficiency or heat transfer capability of the target heating module in the current state.

[0073] 103. When the first temperature change rate is lower than the preset rate, compare the first power-temperature rise ratio with the preset health benchmark value;

[0074] In this embodiment, the preset rate refers to the threshold temperature rise rate that the target temperature zone should reach under welding process conditions. This rate can be set based on the welding process requirements of the PCBA board or historical experience data. When the first temperature change rate is lower than the preset rate, it can be determined that a temperature rise lag phenomenon has occurred in the target temperature zone. Based on this, the first power-temperature rise ratio is compared with a preset health benchmark value to further determine the factors causing the temperature rise lag phenomenon. It is understood that the preset health benchmark value represents the power-temperature rise ratio corresponding to the target heating module under normal operating conditions, which can be obtained by testing and calibrating new or calibrated equipment.

[0075] 104. Determine the factors contributing to the temperature rise lag phenomenon based on the comparison results;

[0076] In this embodiment, different factors causing the temperature rise lag phenomenon are determined based on the different comparison results between the first power-temperature rise ratio and the preset health benchmark value. For example, when the difference between the power-temperature rise ratio and the preset health benchmark value is greater than a preset difference, the factor causing the temperature rise lag phenomenon can be determined to be the performance degradation of the heating module; while when the difference between the power-temperature rise ratio and the preset health benchmark value is less than or equal to the preset difference, the factor causing the temperature rise lag phenomenon can be determined to be the change in the heat demand of the PCBA board to be soldered. Specific embodiments will be described later.

[0077] 105. Generate the target temperature control command for the PCBA board to be soldered based on the generating factors.

[0078] After identifying the factors causing the temperature rise lag, corresponding target temperature control commands are generated based on the different factors, such as maintenance alarm commands, power compensation suppression commands, or closed-loop power compensation commands.

[0079] In this embodiment, the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone are first obtained. Then, the first power-temperature rise ratio of the target heating module is calculated based on the first real-time input power and the first temperature change rate. When the first temperature change rate is lower than a preset rate, the first power-temperature rise ratio is compared with a preset health benchmark value. Then, the factors causing the temperature rise lag phenomenon are determined based on the comparison results. Finally, a target temperature control command for the PCBA board to be soldered is generated based on the factors. In this way, by comparing the power-temperature rise ratio with a preset benchmark value, the specific factors causing the temperature rise lag phenomenon can be distinguished, and corresponding control commands can be generated. This avoids improper power compensation, effectively reduces the accelerated loss of the heating module, and thus improves the stability of soldering quality.

[0080] Please see Figure 2 As shown, another embodiment of the PCBA soldering temperature control method in this application includes:

[0081] 201. Obtain the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone;

[0082] 202. Calculate the first power-temperature rise ratio of the target heating module based on the first real-time input power and the first temperature change rate;

[0083] 203. When the first temperature change rate is lower than the preset rate, compare the first power-temperature rise ratio with the preset health benchmark value;

[0084] Steps 201 to 203 in this embodiment are the same as those described above. Figure 1 Steps 101 to 103 in the illustrated embodiment are similar and will not be described again here.

[0085] 204. When the difference between the first power-temperature rise ratio and the preset health benchmark value is greater than the preset difference, the cause of the temperature rise lag phenomenon is determined to be the performance degradation of the target heating module.

[0086] 205. Generate maintenance alarm commands and suppress power compensation commands;

[0087] 206. When the difference between the first power-temperature rise ratio and the preset health benchmark value is less than or equal to the preset difference, the cause of the temperature rise lag phenomenon is determined to be the change in the heat demand of the PCBA board to be soldered.

[0088] 207. Generate closed-loop power compensation command;

[0089] Optionally, in this embodiment, the first power-temperature rise ratio is used to measure the efficiency of the target heating module in converting electrical energy into effective heat energy and raising the temperature of the temperature zone. It is understood that for a healthy heating module, under similar heat dissipation conditions, its first power-temperature rise ratio should remain within a relatively stable range. This stable range can be referenced based on a preset health benchmark value. Therefore, when the difference between the first power-temperature rise ratio and the preset health benchmark value is greater than a preset difference, it indicates that the heat conversion efficiency or output capability of the target heating module itself has declined. In this case, the cause of the temperature rise lag phenomenon can be identified as the performance degradation of the heating module. When the difference between the first power-temperature rise ratio and the preset health benchmark value is less than a preset difference, it indicates that the performance deviation of the target heating module is within an acceptable range. In this case, the temperature rise lag is more likely due to changes in the heat capacity or heat absorption characteristics of the PCBA board to be soldered, such as changes in the component layout or materials on the PCBA board, leading to an increase in its heat demand. In this case, the cause of the temperature rise lag phenomenon can be identified as a change in the heat demand of the PCBA board to be soldered. This allows for the differentiation of the root cause of temperature rise lag, namely whether it stems from performance degradation of the heating module or changes in the thermal demands of the PCBA board being soldered. This distinction avoids adopting inappropriate power increase strategies when the heating module's performance deteriorates, thereby reducing additional losses to the heating module. Simultaneously, when the temperature rise lag is caused by changes in the PCBA board's thermal demands, the system can employ a more appropriate temperature control strategy to ensure soldering quality. This contributes to improving the stability of the PCBA board soldering process and extending the equipment's lifespan.

[0090] Furthermore, once the causes of the temperature rise lag are identified, different target temperature control commands are generated based on these causes. Specifically, when the root cause of the temperature rise lag is identified as performance degradation of the heating module, a maintenance alarm command is immediately generated to alert operators or maintenance teams to intervene. Simultaneously, a power compensation suppression command is generated to prevent further damage to the degraded target heating module and to avoid accelerating the wear and tear of other healthy components. It should be noted that the maintenance alarm command is a signal or message used to notify operators or maintenance systems of potential performance problems with the heating module. This can be achieved through audible and visual alarms, system log recording, remote notifications, or displaying warning information on the human-machine interface. It prompts maintenance personnel to promptly inspect, diagnose, and perform necessary repairs on the target heating module to prevent potential hardware failures from worsening. The power compensation suppression command is a control command that limits or prevents the system from automatically increasing the power output of the heating module to compensate for temperature lag. Specifically, it can be achieved by disabling the automatic power adjustment module, setting the power compensation upper limit to zero or a negative value, or switching the control mode to manual intervention mode. This is used to avoid blindly increasing the power to cover up hardware problems when the heating module performance deteriorates, thereby preventing accelerated equipment wear or other safety hazards.

[0091] When the root cause of the temperature rise lag is identified as a change in the heat demand of the PCBA board to be soldered, a closed-loop power compensation command is generated. This command dynamically adjusts the heating power through precise feedback control to ensure the soldering temperature curve accurately tracks the preset target, thereby maintaining stable soldering quality. It should be noted that the closed-loop power compensation command is a command that dynamically adjusts the power output of the target heating module based on real-time temperature feedback to precisely control the temperature zone. Specifically, this can be achieved by activating a proportional-integral-derivative (PID) controller or other control algorithms, calculating and outputting the required power value in real time based on the deviation between the target temperature and the actual temperature. This ensures a rapid and accurate response to and maintenance of a stable soldering temperature curve when the heat demand of the PCBA board to be soldered changes normally, thus guaranteeing soldering quality.

[0092] In other embodiments, please refer to Figure 3 As shown, the PCBA soldering temperature control method in this application may further include:

[0093] 301. Obtain the second real-time input power of the accompanying heating module and the second temperature change rate of the accompanying temperature zone, wherein the accompanying temperature zone is a temperature zone in a low load or idle state, and the accompanying heating module is a heating module corresponding to the accompanying temperature zone.

[0094] 302. Calculate the second power-temperature rise ratio of the accompanying heating module based on the second real-time input power and the second temperature change rate;

[0095] 303. When the difference between the second power-temperature rise ratio and the preset health benchmark value is less than or equal to the preset difference, the preset health benchmark value is updated based on the first power-temperature rise ratio.

[0096] Optionally, in this embodiment, since the preset health benchmark value may deviate due to various factors such as environmental changes and long-term use, the judgment based on the preset health benchmark value may be biased, affecting the accuracy of temperature control. Therefore, after generating the target temperature control command based on the factors causing the temperature rise lag phenomenon, data from other temperature zones in the furnace can be used to self-correct the preset health benchmark value to dynamically adjust the reliability of the factors causing the temperature rise lag phenomenon. It should be noted that the accompanying temperature zone refers to the temperature zone in the furnace that is under low load or idle during the PCBA soldering process. It can be a temperature zone where no soldering operation is performed or a temperature zone where only low-power operations such as preheating are performed, providing a relatively stable environment with less external interference. The accompanying heating module is the heating module located in the area of ​​the accompanying temperature zone. Since the accompanying temperature zone is under low load or idle, the corresponding accompanying heating module is less affected by external heat load interference, and its operating data can more accurately reflect the performance status of the heating module itself, thus providing a relatively pure reference value. When the difference between the second power-temperature rise ratio of the accompanying heating module corresponding to the accompanying temperature zone and the current preset health benchmark value is less than or equal to the preset difference, it indicates that the performance state of the accompanying heating module is sufficiently close to the preset health benchmark value. At this time, the system can update the preset health benchmark value based on the first power-temperature rise ratio of the target heating module. For example, different weights can be assigned to the current preset health benchmark value and the first power-temperature rise ratio, and then a new preset health benchmark value can be calculated by weighted summation. Through this conditional update mechanism, the deviation data generated by the target heating module under specific high loads or abnormal operating conditions avoids erroneous influence on the benchmark value, thereby ensuring the stability and accuracy of the preset health benchmark value.

[0097] When high-reflectivity components are present on the PCBA board to be soldered, these components significantly affect heat absorption efficiency, leading to temperature control deviations. Even if the target heating module performs normally, insufficient heat absorption may result in a delayed temperature rise, affecting soldering quality and potentially misleading the system's assessment of the heating module's performance. Therefore, during the execution of… Figure 1 Before steps 101 to 105 in the illustrated embodiment, it can be first determined whether there are high-reflectivity components in the PCBA board to be soldered. If there are no high-reflectivity components in the PCBA board to be soldered, then the process continues. Figure 1Steps 101 to 105 in the illustrated embodiment; if there are high reflectivity components in the PCBA board to be soldered, then the high reflectivity diagnostic mode is executed.

[0098] It should be noted that high-reflectivity components refer to electronic components with high reflectivity to heat radiation during the soldering process, such as shielding covers, connectors, or heat sinks with bright metal surfaces or special coatings. High-reflectivity diagnostic mode refers to a temperature control strategy or detection process specifically designed for PCBA boards containing high-reflectivity components. This allows for the pre-identification of special circumstances that may affect heat absorption, avoiding misjudgments and improper power compensation that might occur during the initial power-temperature rise ratio calculation when high-reflectivity components are present. This improves the accuracy and reliability of PCBA board soldering temperature control, effectively preventing insufficient heat absorption or localized overheating caused by high-reflectivity components, and further ensuring the soldering quality of the PCBA boards to be soldered.

[0099] For further details, please refer to Figure 4 As shown, the specific process for determining whether there are high-reflectivity components in the PCBA board to be soldered can include:

[0100] 401. Emit electromagnetic radiation signals to the surface of the PCBA board to be soldered;

[0101] 402. Receive electromagnetic radiation signals reflected from the surface of the PCBA board to be soldered;

[0102] 403. Obtain the reflection characteristics of the PCBA board surface to be soldered based on the reflected electromagnetic radiation signal;

[0103] 404. Compare the reflection features with the preset features;

[0104] 405. If the reflection characteristics match the preset characteristics, it is determined that there are high reflectivity components in the PCBA board to be soldered;

[0105] 406. If the reflection characteristics do not match the preset characteristics, it is determined that there are no high reflectivity components on the PCBA board to be soldered.

[0106] Optionally, in this embodiment, the electromagnetic radiation signal is an electromagnetic wave propagating in space, which can be implemented in the form of microwaves, millimeter waves, terahertz waves, or infrared radiation. The reflection characteristics are the specific properties exhibited by the electromagnetic radiation signal after reflection on the surface of the PCBA board to be soldered. These can include reflection intensity, phase change, frequency shift, polarization state change, or spectral response, etc., with the aim of quantifying the response characteristics of the PCBA board surface to electromagnetic radiation. The preset characteristics are pre-stored electromagnetic radiation reflection characteristic data corresponding to known high-reflectivity components or materials. These can be established by experimental measurement, simulation modeling, or accumulation of empirical data on standard high-reflectivity materials. By actively emitting electromagnetic radiation signals to the surface of the PCBA board to be soldered and receiving the electromagnetic radiation signals reflected from the surface, the reflection characteristics of the PCBA board surface to be soldered are obtained. This process can directly and non-contactly sense the response of the PCBA board surface material to electromagnetic waves, overcoming the limitations of relying solely on CAD data or component type for judgment. By comparing the acquired reflection characteristics with preset characteristics, it is possible to accurately identify whether there are areas on the surface of the PCBA board to be soldered that match known high-reflectivity components or materials. If the reflection characteristics match the preset characteristics, it can be determined that the PCBA board to be soldered contains high-reflectivity components; otherwise, it can be determined that no high-reflectivity components exist. This judgment mechanism based on actual physical measurements significantly improves the accuracy and reliability of the judgment, effectively avoiding deviations in subsequent soldering processes caused by misjudging or omitting high-reflectivity components.

[0107] For further details, please refer to Figure 5 As shown, this high reflectivity diagnostic mode may specifically include:

[0108] 501. When the welding temperature in the target temperature zone reaches the peak temperature and enters the heat preservation stage, set the heat decay detection time window;

[0109] 502. Within the thermal attenuation detection time window, cut off all power to the target heating module and collect the real-time temperature value of the target temperature zone;

[0110] 503. Compare the temperature decay curve of the real-time temperature value within the thermal decay detection time window with the preset reference curve;

[0111] 504. Determine the performance status of the target heating module based on the comparison results;

[0112] 505. Generate the target temperature control command for the PCBA board to be soldered based on the performance status of the target heating module.

[0113] Optionally, in this embodiment, when a high-reflectivity component is detected in the PCBA board to be soldered, this high-reflectivity diagnostic mode is triggered. In this high-reflectivity diagnostic mode, when the soldering temperature of the target temperature zone reaches its peak and enters the heat preservation stage, a thermal decay detection time window is set. Detection is performed during the heat preservation stage because the solder paste has melted and the temperature is relatively stable, which is beneficial for observing the natural temperature decay process and reducing interference from other factors. Within the set time window, all power to the target heating module is cut off, and real-time temperature values ​​of the target temperature zone are continuously collected. Cutting off the power is to eliminate the influence of external heating and directly observe the heat dissipation characteristics of the heating module under no-power input, which can more directly reflect its heat transfer and energy storage performance. The collected real-time temperature values ​​will form a temperature decay curve, which will then be compared with a preset reference curve. The preset reference curve represents the standard temperature decay behavior of the heating module under normal conditions. By comparing the degree of fit between the actual decay curve and the reference curve, the performance status of the target heating module can be determined, such as whether it is normal or experiencing decay. Finally, based on the evaluation results of the heating module's performance status, a corresponding target temperature control command for the PCBA board to be soldered is generated. It should be noted that the thermal decay detection time window refers to the time period used to monitor the natural temperature decrease process of the target temperature zone during a specific soldering stage. This can be achieved by using a preset fixed duration, dynamically calculating the duration based on the PCBA board's thermal capacity characteristics, or determining the duration based on historical data analysis. This allows for accurate evaluation of the actual performance status of the target heating module in complex soldering environments with high-reflectivity components. By cutting off the power supply during the heat preservation stage and analyzing the temperature decay curve, interference from external heating and PCBA board thermal capacity changes can be eliminated, directly reflecting the inherent performance of the heating module. This enables the identification of heating module performance degradation even if it has not reached the traditional fault threshold, avoiding excessive power compensation due to misjudgment, and effectively preventing accelerated aging of normal heating modules and soldering defects such as cold solder joints. Simultaneously, the target temperature control command generated based on the evaluation results allows for more precise adjustment of soldering parameters, optimization of the soldering process, and improvement of PCBA board soldering quality and production line reliability.

[0114] More specifically, step 504 can be implemented as follows: when the temperature decay curve matches the state of the preset reference curve, the performance state of the target heating module is determined to be normal; when the temperature decay curve does not match the state of the preset reference curve, the performance state of the target heating module is determined to be decaying. Simultaneously, step 505 can be implemented as follows: when the performance state of the target heating module is normal, a closed-loop power compensation command is generated; when the performance state of the target heating module is decaying, a maintenance alarm command and a power compensation suppression command are generated.

[0115] The temperature decay curve refers to the trajectory of the real-time temperature value of the target temperature zone over time after all power to the target heating module is cut off. It can be composed of a series of temperature data points collected within the thermal decay detection time window. The preset reference curve is a pre-established benchmark curve representing the temperature decay behavior of the target heating module under ideal or healthy conditions. If the temperature decay curve and the preset reference curve show a high degree of consistency in shape, trend, or key feature points, it can be determined that the temperature decay curve matches the state of the preset reference curve; otherwise, it can be determined that the temperature decay curve does not match the state of the preset reference curve. Specifically, this can be achieved by calculating the error between the two curves and comparing it with a preset threshold, or by evaluating whether the slope, inflection point, and other characteristics of the curves are within the allowable deviation range. When the real-time temperature decay curve matches the state of the preset reference curve, it indicates that the heat dissipation characteristics and heat capacity performance of the heating module are consistent with the expected behavior under healthy conditions, and its performance state can be determined to be normal. This means that the heating module can effectively heat and dissipate heat according to design requirements, meeting the stability requirements of the welding process, and based on this, a closed-loop power compensation command can be generated. Conversely, when the real-time temperature decay curve does not match the preset reference curve, it indicates that the actual thermal decay behavior of the heating module has deviated from the expected normal behavior, and its performance state can be determined to be in a decay state. This discrepancy may manifest as the temperature decay rate being too fast or too slow, indicating potential problems such as decreased heating efficiency or weakened heat dissipation capacity, respectively. Based on this, maintenance alarm commands and power compensation suppression commands can be generated.

[0116] Please see Figure 6 As shown, one embodiment of the PCBA soldering temperature control system in this application includes:

[0117] The acquisition unit 601 is used to acquire the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone;

[0118] The calculation unit 602 is used to calculate the first power-temperature rise ratio of the target heating module based on the first real-time input power and the first temperature change rate;

[0119] The comparison unit 603 is used to compare the first power-temperature rise ratio with a preset health benchmark value when the first temperature change rate is lower than the preset rate.

[0120] Unit 604 is used to determine the factors causing the temperature rise lag phenomenon based on the comparison results;

[0121] The generation unit 605 is used to generate a target temperature control command for the PCBA board to be soldered based on the generating factors.

[0122] In this embodiment, the acquisition unit 601 acquires the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone; the calculation unit 602 calculates the first power-temperature rise ratio of the target heating module based on the first real-time input power and the first temperature change rate; the comparison unit 603 compares the first power-temperature rise ratio with a preset health benchmark value when the first temperature change rate is lower than a preset rate; the determination unit 604 determines the factors causing the temperature rise lag phenomenon based on the comparison results; and the generation unit 605 generates a target temperature control command for the PCBA board to be soldered based on the factors. In this way, by comparing the power-temperature rise ratio with a preset benchmark value, the specific factors causing the temperature rise lag phenomenon can be distinguished, and corresponding control commands can be generated. This avoids improper power compensation, effectively reduces the accelerated wear of the heating module, and thus improves the stability of soldering quality.

[0123] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0124] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between apparatuses or units through some interfaces, and may be electrical, mechanical, or other forms.

[0125] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0126] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0127] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A PCBA soldering temperature control method, characterized in that, include: Acquire the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone; Calculate the first power-temperature rise ratio of the target heating module based on the first real-time input power and the first temperature change rate; When the first temperature change rate is lower than the preset rate, the first power-temperature rise ratio is compared with the preset health benchmark value. The factors contributing to the temperature rise lag phenomenon were determined based on the comparison results. The target temperature control command for the PCBA board to be soldered is generated based on the aforementioned generating factors.

2. The PCBA soldering temperature control method according to claim 1, characterized in that, The factors contributing to the temperature rise lag phenomenon determined based on the comparison results include: When the difference between the first power-temperature rise ratio and the preset health benchmark value is greater than the preset difference, the cause of the temperature rise lag phenomenon is determined to be the performance degradation of the target heating module. When the difference between the first power-temperature rise ratio and the preset health benchmark value is less than or equal to the preset difference, the cause of the temperature rise lag phenomenon is determined to be the change in the heat demand of the PCBA board to be soldered.

3. The PCBA soldering temperature control method according to claim 2, characterized in that, Based on the aforementioned generating factors, a target temperature control command is generated for the PCBA board to be soldered, including: When it is determined that the cause of the temperature rise lag phenomenon is the performance degradation of the target heating module, a maintenance alarm command and a power compensation suppression command are generated. When the cause of the temperature rise lag phenomenon is determined to be the change in the heat demand of the PCBA board to be soldered, a closed-loop power compensation command is generated.

4. The PCBA soldering temperature control method according to claim 1, characterized in that, After generating the target temperature control command for the PCBA board to be soldered based on the generating factors, the method further includes: The second real-time input power of the accompanying heating module and the second temperature change rate of the accompanying temperature zone are obtained. The accompanying temperature zone is a temperature zone in a low load or idle state, and the accompanying heating module is a heating module corresponding to the accompanying temperature zone. The second power-temperature rise ratio of the accompanying heating module is calculated based on the second real-time input power and the second temperature change rate. When the difference between the second power-temperature rise ratio and the preset health benchmark value is less than or equal to the preset difference, the preset health benchmark value is updated based on the first power-temperature rise ratio.

5. The PCBA soldering temperature control method according to claim 1, characterized in that, Before acquiring the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone, the method further includes: Determine whether there are high-reflectivity components in the PCBA board to be soldered; If not, then execute the steps of obtaining the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone; If so, then execute the high reflectivity diagnostic mode.

6. The PCBA soldering temperature control method according to claim 5, characterized in that, The high reflectivity diagnostic mode includes: When the welding temperature in the target temperature zone reaches the peak temperature and enters the heat preservation stage, a heat attenuation detection time window is set. Within the thermal attenuation detection time window, all power to the target heating module is cut off and the real-time temperature value of the target temperature zone is collected. The real-time temperature value is compared with the temperature decay curve within the thermal decay detection time window and a preset reference curve. The performance status of the target heating module is determined based on the comparison results; The target temperature control command for the PCBA board to be soldered is generated based on the performance status of the target heating module.

7. The PCBA soldering temperature control method according to claim 6, characterized in that, Determining the performance status of the target heating module based on the comparison results includes: When the temperature decay curve matches the state of the preset reference curve, the performance state of the target heating module is determined to be normal. When the temperature decay curve does not match the state of the preset reference curve, the performance state of the target heating module is determined to be in a decay state.

8. The PCBA soldering temperature control method according to claim 7, characterized in that, The step of generating the target temperature control command for the PCBA board to be soldered based on the performance status of the target heating module includes: When the performance status of the target heating module is normal, a closed-loop power compensation command is generated. When the performance state of the target heating module is in a decay state, a maintenance alarm command and a power compensation suppression command are generated.

9. The PCBA soldering temperature control method according to claim 5, characterized in that, The determination of whether there are high reflectivity components in the PCBA board to be soldered includes: Emit electromagnetic radiation signals to the surface of the PCBA board to be soldered; Receive electromagnetic radiation signals reflected from the surface of the PCBA board to be soldered; The reflection characteristics of the PCBA board surface to be soldered are obtained based on the reflected electromagnetic radiation signal. The reflection feature is compared with a preset feature; If the reflection feature matches the preset feature, it is determined that the PCBA board to be soldered contains a high reflectivity element; If the reflection characteristics do not match the preset characteristics, it is determined that the PCBA board to be soldered does not contain high reflectivity components.

10. A PCBA soldering temperature control system, characterized in that, include: The acquisition unit is used to acquire the first real-time input power of the target heating module and the first temperature change rate of the target temperature zone; The calculation unit is used to calculate the first power-temperature rise ratio of the target heating module based on the first real-time input power and the first temperature change rate; The comparison unit is used to compare the first power-temperature rise ratio with a preset health benchmark value when the first temperature change rate is lower than the preset rate. The determination unit is used to identify the factors contributing to the temperature rise lag phenomenon based on the comparison results; The generation unit is used to generate a target temperature control command for the PCBA board to be soldered based on the generated factors.

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