Semiconductor wafer vapor deposition equipment

Abstract

The invention provides semiconductor wafer vapor deposition equipment which comprises a deposition base and further comprises a gas supply unit on the deposition base, the gas supply unit comprises a gas supply device arranged above the deposition base, a structural disc is arranged at the bottom end of the gas supply device, a flow guide disc is arranged below the structural disc, and a blocking inner plate is arranged in the flow guide disc. Multiple groups of nozzle holes are formed in the structural disc, limiting wall grooves are formed in the inner walls of the multiple groups of nozzle holes, deflection wall grooves are formed in the bottom ends of the limiting wall grooves, multiple groups of air supply holes are formed in the inner wall of the flow guide disc, hole outer covers are installed on the multiple groups of nozzle holes, nozzle assemblies are installed in the multiple groups of nozzle holes, and connecting mechanisms are arranged in the nozzle holes; according to the device, the nozzle can be disassembled and cleaned online through the automatic sealing and grabbing mechanism, the sealing performance is guaranteed in the disassembling and assembling process, meanwhile, the deposition air supply operation of the whole device is not affected, meanwhile, a mechanical triggering structure is adopted in the disassembling and assembling process, the operation stability is improved, and the working efficiency is improved. And the cost consumption caused by shutdown when the spray head is cleaned is effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of vapor deposition equipment technology, and more particularly to a semiconductor wafer vapor deposition equipment. Background Technology

[0002] Chemical vapor deposition is a widely used technique in the semiconductor industry for depositing thin films. CVD equipment includes a reaction chamber and a wafer substrate. When two or more gaseous raw materials are introduced into the reaction chamber, the gaseous raw materials react with each other to form a new material, which is then deposited on the surface of the heated wafer substrate to form a thin film.

[0003] Chinese patent CN202110985086.8 discloses a chemical vapor deposition (CVD) apparatus with convenient wafer lifting and clamping, including a cavity, a base, a clamping structure, a lifting drive structure, and a lifting drive device. This apparatus uses edge-pressing clamping to fix the wafer, and the clamping force can be precisely controlled by adjusting the weight of the lifting drive structure, avoiding slippage or deformation caused by excessively loose or tight clamping. The lifting drive structure is compact, micro-motion, and detachable, allowing for convenient and quick synchronous rotation of the wafer and base panel without interfering with the lifting drive device and other surrounding components during rotation. This improves the positional accuracy of the wafer entering and exiting the cavity, providing favorable positional conditions for subsequent processes. Furthermore, the clamping structure can be integrated with the wafer lifting device, simultaneously lifting and clamping the wafer in different states, saving time, simplifying the equipment structure, and reducing overall power consumption.

[0004] However, this technical solution has certain shortcomings in use. During the deposition process, residual materials or impurities may accumulate inside or on the surface of the nozzle, causing uneven flow of gas or raw materials and affecting the uniformity and quality of deposition. If not cleaned in time, it may cause deposition defects or process failure. Nozzle blockage may be caused by foreign objects (such as dust, dried deposits) or inferior raw materials. If not cleaned, it will accelerate nozzle wear, corrosion or permanent damage, increasing maintenance costs and downtime risks. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a semiconductor wafer vapor deposition apparatus that enables online nozzle cleaning through a nozzle assembly and a connecting transfer mechanism, thereby solving problems such as accelerated nozzle wear, corrosion, or permanent damage, increased maintenance costs, and downtime risks.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A semiconductor wafer vapor deposition apparatus includes a deposition stand and a gas supply unit on the deposition stand. The gas supply unit includes a gas supply device disposed above the deposition stand. A structural disk is disposed at the bottom end of the gas supply device, and a guide disk is disposed below the structural disk. A sealing inner plate is disposed inside the guide disk. Multiple sets of nozzle holes are formed on the structural disk. A limiting wall groove is formed on the inner wall of each set of nozzle holes. A deflection wall groove is formed at the bottom end of the limiting wall groove. Multiple sets of gas supply holes are formed on the inner wall of the guide disk. A hole cover is installed on each set of nozzle holes. A nozzle assembly is installed inside each set of nozzle holes. A connecting mechanism is disposed inside the nozzle holes. A removal mechanism is disposed on the outside of the gas supply device.

[0007] The nozzle assembly includes a nozzle disposed within the nozzle orifice, a connector disposed on the nozzle, an extension air tube disposed at the top of the nozzle, a nut disposed at the bottom of the extension air tube, the nut being threadedly connected to the connector, a metal retaining block disposed at the top of the extension air tube, an outer guide ring disposed on the outer side of the extension air tube, multiple sets of protrusions disposed on the outer wall of the outer guide ring, a spring disposed inside the extension air tube, and a movable air tube movably connected to the outer wall of the extension air tube.

[0008] The connection mechanism includes a sealing component, a plugging component, and a support component disposed within the nozzle orifice.

[0009] The sealing assembly includes: a bushing disposed within the nozzle orifice; an electrode shoe disposed within the bushing; a lower stop ring disposed on the bushing; an upper stop ring disposed below the bushing; an induction coil disposed within the bushing; a channel disposed within the inner cavity of the electrode shoe; and an inner conical ring disposed at the top of the bushing.

[0010] The sealing assembly includes: a blocking plate disposed within the nozzle orifice; a support fitted onto the blocking plate; two sets of metal semi-rings movably connected to the top of the support; an extension block disposed outside the two sets of metal semi-rings; two sets of telescopic posts a disposed on the extension block; a wire sleeve disposed outside the two sets of metal semi-rings; a wire harness installed within the wire sleeve; a telescopic post b disposed within the support; an insulating cone block disposed at the top of the telescopic post b; and a through hole formed on the insulating cone block.

[0011] The support assembly includes: a bottom ring disposed at the bottom end of the nozzle orifice; a telescopic rod a disposed on the bottom ring; a telescopic rod b disposed on the bottom ring; a telescopic end, which is the movable end of the telescopic rod b; a movable ring seat, which is installed at the top end of the telescopic end; a movable electrode plate, which is disposed below the movable ring seat; a fixed ring seat, which is disposed above the fixed end of the telescopic rod b; a fixed electrode plate, which is disposed on the fixed ring seat; a motor a disposed inside the orifice cover; a rotating shaft, which is disposed at the output end of the motor a; a gear a disposed on the rotating shaft; a toothed plate, two sets of toothed plates disposed on both sides of the top end of the nozzle orifice; a clamping block, which is disposed at one end of the toothed plate; and a movable wheel, which is movably connected to the inner wall of the nozzle orifice.

[0012] The transfer mechanism includes a structural ring located outside the gas supply device. A movable cavity is formed inside the structural ring, and a toothed ring is provided on the inner wall of the movable cavity. A vertical plate is movably connected to the outer side of the structural ring. A buckle is provided at the top of the vertical plate. A motor b is also installed at the top of the vertical plate. A gear b is provided at one end of the output shaft of the motor b. The transfer mechanism also includes a gripping component and a cleaning component located below the structural ring.

[0013] The gripping assembly includes: a lead screw mounted on the vertical plate; a nut mounted on the lead screw; a deflection seat movably connected to one side of the nut; an electromagnet mounted on the bottom of the deflection seat; a motor c mounted on the nut; and a pulley mounted on the shaft of the deflection seat.

[0014] The cleaning assembly includes: an opening and closing seat fixedly connected to the vertical plate; two sets of sealing slots disposed on the opening and closing seat; a hinge disposed at the bottom of the two sets of sealing slots; an inflation pipe extending through and connected to the two sets of sealing slots; an injection pipe extending through and connected to the two sets of sealing slots; a viewing window fitted into the two sets of sealing slots; a sealing gasket disposed at the connection point of the two sets of sealing slots; a slide seat disposed at one end of one set of sealing slots; a cleaning roller disposed inside the slide seat; an expansion sleeve disposed on the cleaning roller; and an exhaust port disposed on the outer wall of the cleaning roller and the expansion sleeve.

[0015] The deposition seat is provided with a deposition chamber, and an electrostatic chuck is installed in the deposition chamber.

[0016] The beneficial effects of this invention are as follows: (1) In this invention, the motor b drives the gear b to rotate on the gear ring, and the vertical plate and the lower component are moved and positioned to the nozzle to be cleaned by the connection and guidance of the buckle and the structural ring. The motor b and the transmission structure drive the lead screw to rotate. The nut and the lead screw are connected by threads to lower the electromagnet into the nozzle hole and contact the metal block. The magnet is connected to the nozzle by magnetic attraction. The lead screw is reversed to raise the nozzle to a height higher than the cleaning component. The motor c drives the nozzle to deflect between the two sets of open sealing boxes. The motor on the opening and closing seat drives the two sets of sealing boxes to rotate and close in opposite directions, providing the nozzle with an external sealing environment and multiple cleaning effects. While ensuring the cleaning effect, it can automatically and accurately pick up materials.

[0017] (2) In this invention, the blocking plate is driven to move upward along with the nozzle as a whole by the rebound force of the telescopic rods a and b until it reaches the limit position, i.e. inside the bushing. When the induction coil is energized, a stable magnetic field is formed. The fluid containing nano-magnetic particles is controlled by the magnetic field to achieve dynamic sealing in the channel. When the nozzle is removed, the pressure on the blocking plate and the insulating cone disappears. The rebound force of the telescopic rod b drives the insulating cone to rebound, and the two sets of metal half rings approach each other, so that the circuit is connected and the valve in the through hole is closed to ensure the sealing effect, thereby achieving the sealing and plugging of the nozzle hole, avoiding internal gas leakage and external gas pollution, and further enabling the nozzle to be sealed at the same time as it is removed, thus further realizing online operation.

[0018] (3) The present invention uses motors c and b to drive the cleaned nozzle to be reset above the nozzle hole. The nozzle is pushed into the nozzle hole for installation by the continuous rotation of the screw. The bottom of the nozzle first contacts the insulating cone on the blocking plate during the downward movement. The nozzle drives the blocking plate to descend. When it descends to the limit position of the elastic structure at the bottom of the blocking plate, the movable air pipe and the air supply hole are aligned and connected by the spring force. The continuous power of the nozzle causes the insulating cone to gradually move down and penetrate into the center hole of the support. During the downward movement, the conical structure of the insulating cone squeezes the two sets of metal half rings, causing the two sets of metal half rings to overcome the pull of the two sets of telescopic columns a on the outside and move away from the outside, further causing the wire harness to break. When the valve inside the through hole is de-energized and opened, the airflow to the nozzle is unobstructed and air supply is completed. When the block plate is squeezed down to the bottom, the movable electrode on the movable ring seat will contact the fixed electrode on the fixed ring seat, further connecting the circuit of motor a. The power supply is supplied to motor a. The rotation of motor a drives the rotation of gear a on the two sets of rotating shafts through the belt and gear on the other side. The gear plate meshes with it, thereby driving the two sets of clamping blocks to approach and clamp and fix the nozzle structure as a whole when it reaches the designated position. At the same time, the power of motor a can be transmitted to the movable wheel through the belt. The friction between the movable wheel and the nozzle structure causes the nozzle structure to deflect, causing multiple sets of protrusions on the outer guide ring to deflect into the deflection wall groove for further locking and positioning, ensuring the stability of the nozzle structure. Attached Figure Description

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the cross-sectional structure of the present invention; Figure 3 This is a schematic diagram of the overall structure of the gas supply unit of the present invention; Figure 4 This is a schematic diagram of the bottom structure of the gas supply unit of the present invention; Figure 5 This is a partial structural diagram of the gas supply unit of the present invention; Figure 6 This is a schematic diagram of the structure of the disk of the present invention; Figure 7 This is a schematic diagram of the cross-sectional structure of the disk of the present invention; Figure 8 This is a schematic diagram showing a partial structural detail of the structure disk of the present invention; Figure 9 This is a schematic diagram of the nozzle assembly structure of the present invention; Figure 10 This is a schematic diagram of the nozzle orifice structure of the present invention; Figure 11 This is a schematic diagram of the overall structure of the connecting mechanism of the present invention; Figure 12 This is a bottom view schematic diagram of the connecting mechanism of the present invention; Figure 13 This is a schematic diagram of the sealing assembly structure of the present invention; Figure 14 This is a schematic diagram of the sealing component structure of the present invention; Figure 15 This is a schematic diagram of the overall structure of the support component of the present invention; Figure 16 This is a schematic diagram of the telescopic column structure of the present invention; Figure 17 This is a schematic diagram of the overall structure of the transfer mechanism of the present invention; Figure 18 This is a partial structural diagram of the transfer mechanism of the present invention; Figure 19 This is a schematic diagram of a partially disassembled structure of the transfer mechanism of the present invention; Figure 20 This is a schematic diagram of the cleaning component structure of the present invention.

[0020] The reference numerals in the accompanying drawings of this application are as follows: 1. Deposition seat; 11. Deposition chamber; 12. Electrostatic chuck; 2. Gas supply unit; 21. Gas supply device; 22. Structural plate; 23. Guide plate; 24. Inner sealing plate; 25. Nozzle orifice; 251. Restriction wall groove; 252. Deflection wall groove; 26. Gas supply hole; 27. Orifice cover; 3. Nozzle assembly; 301. Nozzle; 302. Connector; 303. Extension air pipe; 304. Nut; 305. Metal clip; 306. Outer guide ring; 3061. Protrusion; 307. Spring; 308. Movable air tube; 4. Connecting mechanism; 41. Sealing assembly; 411. Bushing; 412. Pole shoe; 413. Lower stop ring; 414. Upper stop ring; 415. Induction coil; 416. Channel; 417. Inner cone ring; 42. Sealing assembly; 421. Blocking plate; 422. Support; 423. Metal half ring; 424. Extension block; 425. Telescopic column a; 426. Wire sleeve; 427. Wire harness; 428. Telescopic column b; 4281. Insulating cone block; 4282. 43. Through hole; 43. Support assembly; 431. Bottom ring; 432. Telescopic rod a; 433. Telescopic rod b; 4331. Telescopic end; 4332. Movable ring seat; 4333. Movable pole piece; 4334. Fixed ring seat; 4335. Fixed pole piece; 434. Motor a; 435. Rotating shaft; 436. Gear a; 437. Gear plate; 438. Clamping block; 439. Movable wheel; 5. Transfer mechanism; 501. Structural ring; 5011. Movable cavity; 5012. Gear ring; 502. Vertical plate; 5 03. Buckle; 504. Motor b; 505. Gear b; 51. Grip assembly; 511. Lead screw; 512. Nut; 513. Deflector seat; 514. Electromagnet; 515. Motor c; 516. Pulley; 52. Cleaning assembly; 521. Opening / closing seat; 522. Sealing tank; 523. Hinge; 524. Inflation tube; 525. Liquid injection tube; 526. Viewing window; 527. Sealing gasket; 528. Slide; 529. Cleaning roller; 5291. Expansion sleeve; 5292. Vent. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] Example 1: As Figures 1-16 As shown, this embodiment provides a semiconductor wafer vapor deposition apparatus, including a deposition base 1 and a gas supply unit 2 on the deposition base 1. The gas supply unit 2 includes a gas supply device 21 disposed above the deposition base 1. A structure disk 22 is disposed at the bottom end of the gas supply device 21, and a guide disk 23 is disposed below the structure disk 22. A sealing inner plate 24 is disposed inside the guide disk 23. Multiple sets of nozzle holes 25 are opened on the structure disk 22. A limiting wall groove 251 is opened on the inner wall of each set of nozzle holes 25. A deflection wall groove 252 is opened at the bottom end of the limiting wall groove 251. Multiple sets of gas supply holes 26 are opened on the inner wall of the guide disk 23. A hole cover 27 is installed on each set of nozzle holes 25. A nozzle assembly 3 is installed inside each set of nozzle holes 25. A connecting mechanism 4 is disposed inside the nozzle holes 25. A removal mechanism 5 is disposed on the outside of the gas supply device 21. A deposition chamber 11 is disposed inside the deposition base 1, and an electrostatic chuck 12 is installed inside the deposition chamber 11.

[0025] The nozzle assembly 3 includes a nozzle 301 disposed in the nozzle hole 25, a connector 302 disposed on the nozzle 301, an extension air tube 303 disposed at the top of the nozzle 301, a nut 304 disposed at the bottom of the extension air tube 303, the nut 304 being threadedly connected to the connector 302, a metal locking block 305 disposed at the top of the extension air tube 303, an outer guide ring 306 disposed on the outer side of the extension air tube 303, a plurality of protrusions 3061 disposed on the outer wall of the outer guide ring 306, a spring 307 disposed inside the extension air tube 303, and a movable air tube 308 movably connected to the outer wall of the extension air tube 303.

[0026] In this embodiment, the extension air pipe 303 extends the overall length of the nozzle 301 through the threaded connection of the nut 304 and the connector 302, thereby facilitating subsequent sealing and positioning. Air is introduced through the movable air pipe 308, and the rebound characteristic of the spring 307 ensures the subsequent docking effect with the air supply port 26 without affecting the overall lifting and disassembly of the nozzle.

[0027] The connecting mechanism 4 includes a sealing component 41, a plugging component 42, and a support component 43 disposed within the nozzle orifice 25.

[0028] The sealing assembly 41 includes: a bushing 411 disposed inside the nozzle hole 25; an electrode shoe 412 disposed inside the bushing 411; a lower stop ring 413 disposed on the bushing 411; an upper stop ring 414 disposed below the bushing 411; an induction coil 415 disposed inside the bushing 411; a channel 416 disposed in the inner cavity of the electrode shoe 412; and an inner conical ring 417 disposed at the top of the bushing 411.

[0029] In this embodiment, when the induction coil 415 is energized, it can form a stable magnetic field. The fluid containing nano-magnetic particles is controlled by the magnetic field to achieve dynamic sealing within the channel 416. The magnetic fluid is collected by the upper stop ring 414 and the lower stop ring 413 to prevent overflow. The inner conical ring 417 can effectively guide the movable air tube 308 in the extension air tube 303 to prevent it from getting stuck at the bushing 411 when it rises and falls.

[0030] The sealing assembly 42 includes: a blocking plate 421 disposed within the nozzle hole 25; a support 422 fitted onto the blocking plate 421; two sets of metal semi-rings 423 movably connected to the top of the support 422; an extension block 424 disposed outside the two sets of metal semi-rings 423; two sets of telescopic columns a425 disposed on the extension block 424; a wire sleeve 426 disposed outside the two sets of metal semi-rings 423; a wire harness 427 installed within the wire sleeve 426; a telescopic column b428 disposed within the support 422; an insulating cone 4281 disposed at the top of the telescopic column b428; and a through hole 4282 formed on the insulating cone 4281.

[0031] In this embodiment, the blocking plate 421 is used to seal the nozzle hole 25 to prevent air leakage when the nozzle is removed. When the nozzle is cleaned and installed, the bottom end of the nozzle 301 first contacts the insulating cone 4281 on the blocking plate 421 during the downward movement. The nozzle drives the blocking plate 421 to descend, allowing the nozzle to connect with the air supply hole 26 for operation. When it descends to the limit position of the elastic structure at the bottom of the blocking plate 421, the continuous power of the nozzle 301 causes the insulating cone 4281 to gradually move down and penetrate into the center hole of the support 422. During the downward movement, the conical structure of the insulating cone 4281 squeezes between the two sets of metal semi-rings 423, making... The two sets of metal semi-rings 423 overcome the pulling force of the two sets of telescopic columns a425 on the outside and move away from each other, which further disconnects the wiring harness 427 and opens the valve in the through hole 4282, thereby allowing the airflow of the nozzle to be unobstructed and complete the air supply. Conversely, during disassembly, the nozzle is removed, the pressure on the blocking plate 421 and the insulating cone 4281 disappears, and the rebound force of the telescopic column b428 and the telescopic rod a432 causes the blocking plate 421 to reset and rise into the bushing 411 to seal the nozzle hole 25. The insulating cone 4281 rebounds, and the two sets of metal semi-rings 423 move closer together, so that the circuit is connected and the valve in the through hole 4282 is closed, ensuring the sealing effect.

[0032] Support assembly 43 includes: a bottom ring 431, located at the bottom end of nozzle hole 25; a telescopic rod a 432, located on the bottom ring 431; a telescopic rod b 433, located on the bottom ring 431; a telescopic end 4331, which is the movable end of telescopic rod b 433; a movable ring seat 4332, installed at the top of telescopic end 4331; a movable electrode 4333, located below the movable ring seat 4332; and a fixed ring seat 4334. Above the fixed end of the telescopic rod b433; a fixed electrode 4335, which is mounted on the fixed ring seat 4334; a motor a434, which is mounted inside the hole cover 27; a rotating shaft 435, which is mounted at the output end of the motor a434; a gear a436, which is mounted on the rotating shaft 435; a toothed plate 437, with two sets of toothed plates 437 mounted on both sides of the top of the nozzle hole 25; a clamping block 438, which is mounted at one end of the toothed plate 437; and a movable wheel 439, which is movably connected to the inner wall of the nozzle hole 25.

[0033] In this embodiment, telescopic rods a432 and b433 provide support and rebound force for the blocking plate 421, and limit the movable range of the blocking plate 421 through the telescopic end 4331 and the fixed end. When the blocking plate 421 is compressed to the bottom, the movable pole piece 4333 on the movable ring seat 4332 will contact the fixed pole piece 4335 on the fixed ring seat 4334, further connecting the circuit of motor a434, supplying power to motor a434, and the motor a434 rotates through the belt and gear on the other side. The wheel synchronously drives the gears a436 on the two sets of rotating shafts 435 to rotate, and the toothed plate 437 meshes with them, thereby driving the two sets of clamping blocks 438 to approach and clamp and fix the entire nozzle structure that has reached the designated position. At the same time, the power of the motor a434 can be transmitted to the movable wheel 439 via the belt. The friction between the movable wheel 439 and the nozzle structure causes the entire nozzle structure to deflect, so that the multiple sets of protrusions 3061 on the outer guide ring 306 deflect into the deflection wall groove 252 for further engagement and positioning, ensuring the stability of the nozzle structure.

[0034] Example 2: Figures 17-20 As shown, components that are the same as or corresponding to those in Embodiment 1 are referred to using the same reference numerals as in Embodiment 1. For simplicity, only the differences from Embodiment 1 are described below. The difference between Embodiment 2 and Embodiment 1 is as follows: The transfer mechanism 5 includes a structural ring 501 located outside the gas supply device 21. A movable cavity 5011 is provided inside the structural ring 501. A toothed ring 5012 is provided on the inner wall of the movable cavity 5011. A vertical plate 502 is movably connected to the outer side of the structural ring 501. A buckle 503 is provided at the top of the vertical plate 502. A motor b504 is also installed at the top of the vertical plate 502. A gear b505 is provided at one end of the output shaft of the motor b504. The transfer mechanism 5 also includes a gripping component 51 and a cleaning component 52 located below the structural ring 501.

[0035] In this embodiment, the motor b504 is energized and drives the gear b505 to rotate on the gear ring 5012. The connection between the buckle 503 and the structural ring 501 enables the rotation, movement and positioning of the vertical plate 502 and the lower components as a whole. With the help of infrared sensing equipment, the nozzle position can be accurately located.

[0036] The gripping assembly 51 includes: a lead screw 511, which is mounted on the vertical plate 502; a nut 512, which is mounted on the lead screw 511; a deflection seat 513, which is movably connected to one side of the nut 512; an electromagnet 514, which is mounted on the bottom of the deflection seat 513; a motor c515, which is mounted on the nut 512; and a pulley 516, which is mounted on the shaft of the deflection seat 513.

[0037] In this embodiment, the motor b504 and the transmission structure drive the lead screw 511 to rotate, and the nut 512 is threadedly connected to it to achieve lifting. The electromagnet 514 is used to attract the metal clip 305 on the nozzle to grasp the nozzle. After the nozzle is removed, the motor c515 can drive the nozzle to deflect as a whole and dock with the cleaning component 52.

[0038] Cleaning component 52 includes: an opening / closing seat 521, which is fixedly connected to the vertical plate 502; two sets of sealing slots 522, which are disposed on the opening / closing seat 521; a hinge 523, which is disposed at the bottom of the two sets of sealing slots 522; an inflation pipe 524, which is connected through the two sets of sealing slots 522; an injection pipe 525, which is connected through the two sets of sealing slots 522; and a viewing window 526, which allows for viewing... A window 526 is fitted onto two sets of sealing groove boxes 522; a sealing gasket 527 is located at the connection between the two sets of sealing groove boxes 522; a slide 528 is located at one end of a set of sealing groove boxes 522; a cleaning roller 529 is located inside the slide 528; an expansion sleeve 5291 is located on the cleaning roller 529; and an exhaust hole 5292 is located on the outer wall of the cleaning roller 529 and the expansion sleeve 5291.

[0039] In this embodiment, the two sets of sealing groove boxes 522 are rotated and opened and closed in opposite directions by the motor on the opening and closing seat 521 to achieve the connection with the nozzle. The nozzle is cleaned multiple times by components such as the air inlet pipe 524, the liquid injection pipe 525 and the movable cleaning roller 529 to ensure the cleaning effect of the nozzle.

[0040] Work steps Step 1, Deposition process: The wafer is fixed by the electrostatic chuck 12, and the gas supply device 21 sends the gas through the gas supply hole 26 on the guide plate 23 into the nozzle hole 25 of the structure plate 22, and finally sprays it from the nozzle 301 into the deposition chamber 11 to perform the deposition operation on the wafer. Each nozzle within the cavity is individually monitored online by its corresponding airflow sensor and gas-sensitive sensor. Step 2, Disassembly and Material Removal Process: When the nozzle is clogged or contaminated, the sensor sends a signal, and the motor b504 is energized to drive the gear b505 to rotate on the gear ring 5012. Through the connection and guidance of the buckle 503 and the structural ring 501, the vertical plate 502 and the lower components are moved and positioned to the nozzle to be cleaned. The motor b504 and the transmission structure drive the lead screw 511 to rotate. The nut 512 is threadedly connected to the lead screw 511, which lowers the electromagnet 514 into the nozzle hole 25 and into contact with the metal block 305. The electromagnet is connected to the nozzle by magnetic attraction. The lead screw 511 is reversed to raise the nozzle to a height higher than the cleaning assembly 52. ​​The motor c515 drives the nozzle to deflect between the two sets of unfolded sealing boxes 522. The motor on the opening and closing seat 521 drives the two sets of sealing boxes 522 to rotate in opposite directions and close, providing an external sealing environment for the nozzle. Step 3, Sealing and Plugting Process: When the nozzle is removed as a whole, driven by the rebound force of telescopic rods a432 and b433, the plug plate 421 will quickly move upward along with the nozzle until it reaches the limit position, i.e., inside the bushing 411. When the induction coil 415 is energized, a stable magnetic field can be formed. The fluid containing nano-magnetic particles is controlled by the magnetic field to achieve dynamic sealing in the channel 416. When the nozzle is removed, the pressure on the plug plate 421 and the insulating cone 4281 disappears. The rebound force of the telescopic rod b428 drives the insulating cone 4281 to rebound, and the two sets of metal half rings 423 approach each other, so that the circuit is connected and the valve in the through hole 4282 is closed, ensuring the sealing effect. This achieves the sealing and plugging of the nozzle hole 25, avoiding internal gas leakage and external gas pollution, and further enabling the nozzle to be sealed at the same time as it is removed, thus achieving online operation. Step 4, First cleaning process: Inject a diluted citric acid solution with a concentration of about 10% into the sealed environment through the injection pipe 525 and mix it with compressed air to form a gas-liquid two-phase flow circulation to dissolve the alkaline deposits in the nozzle; The solution can be injected into the roller body through the connecting end on the cleaning roller 529, and the inner cavity of the nozzle is cleaned by the reciprocating rotation and extension of the cleaning roller 529 in the nozzle. The high-pressure solution is discharged from the exhaust port 5292, further improving the cleaning effect. Step 5, Secondary Cleaning Process: After the primary cleaning is completed, a diluted alkaline solution is injected into the sealed environment through another set of injection tubes 525 to neutralize the residual acidic solution; To address the polymer residue inside the nozzle, acetone solvent is injected again into the sealed environment through injection tube 525, and the blockage is removed through swelling. Step 6, Drying process: After cleaning, hot air is slowly injected into the sealed environment through the air inlet pipe 524. The hot air dries the nozzle. The low-speed airflow can carry away dust and debris in the environment, while not blowing away blockages. This improves cleaning efficiency and reduces wear on the outer coating of the nozzle. Step 7, Reinstallation process: Driven by motors C515 and B504, the cleaned nozzle is reset to above the nozzle hole 25. The nozzle is then pushed into the nozzle hole 25 for installation by the continuous rotation of the lead screw 511. During the downward movement, the bottom of the nozzle 301 first contacts the insulating cone 4281 on the blocking plate 421. The nozzle drives the blocking plate 421 to descend. When it reaches the limit position of the elastic structure at the bottom of the blocking plate 421, the movable air pipe 308 and the air supply hole 26 are aligned and connected by the elastic force of the spring 307. The continuous power of the nozzle 301 causes the insulating cone 4281 to gradually move down and penetrate into the center hole of the support 422. During the downward movement, the conical structure of the insulating cone 4281 squeezes the two sets of metal half rings 423, causing the two sets of metal half rings 423 to overcome the pulling force of the two sets of telescopic columns a425 on the outside and move away from the outside. This further disconnects the wiring harness 427 and de-energizes and opens the valve in the through hole 4282, thereby allowing the nozzle airflow to be unobstructed and complete the air supply. When the blocked plate 421 is compressed and descends to its lowest point, the movable electrode 4333 on the movable ring seat 4332 will contact the fixed electrode 4335 on the fixed ring seat 4334, further connecting the motor a434 circuit. The power supply is then provided to the motor a434, and the rotation of the motor a434 synchronously drives the gears a436 on the two sets of rotating shafts 435 to rotate via the belt and gears on the other side. The gear plate 437 meshes with it, thereby driving the two sets of clamping blocks 438 to approach and clamp and fix the entire nozzle structure that has reached the designated position. At the same time, the power of the motor a434 can be transmitted to the movable wheel 439 via the belt. The friction between the movable wheel 439 and the nozzle structure causes the entire nozzle structure to deflect, causing multiple sets of protrusions 3061 on the outer guide ring 306 to deflect into the deflection wall groove 252 for further engagement and positioning, ensuring the stability of the nozzle structure.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A semiconductor wafer vapor deposition apparatus, comprising a deposition stand (1), characterized in that, Also includes: The deposition seat (1) is provided with an air supply unit (2), which includes an air supply device (21), a structural disk (22), a guide disk (23), a sealing inner plate (24), multiple sets of nozzle holes (25), a limiting wall groove (251), a deflection wall groove (252), and multiple sets of air supply holes (26) located above the deposition seat (1). The multiple sets of nozzle holes (25) are equipped with hole covers (27). The nozzle assembly (3) is located inside the nozzle orifice (25) and is used to stabilize the jet flow for deposition operations; The connecting mechanism (4) is located inside the nozzle hole (25) and is used to seal the nozzle. The removal mechanism (5) is provided on the air supply device (21) and is used to disassemble and clean the nozzle; The connecting mechanism (4) includes a sealing component (41), a plugging component (42), and a support component (43) disposed within the nozzle hole (25). The transfer mechanism (5) includes a gripping component (51) and a cleaning component (52) disposed above the structure disk (22).

2. The semiconductor wafer vapor deposition apparatus according to claim 1, characterized in that, The nozzle assembly (3) includes a nozzle (301) disposed in the nozzle hole (25), a connector (302), an extension air tube (303), a nut (304), a metal clip (305), an outer guide ring (306), a spring (307), and a movable air tube (308).

3. The semiconductor wafer vapor deposition apparatus according to claim 1, characterized in that, The sealing assembly (41) includes a bushing (411), a pole shoe (412), a lower stop ring (413), an upper stop ring (414), an induction coil (415), a channel (416), and an inner cone ring (417) disposed within the nozzle hole (25) for dynamically sealing a fluid containing nano-magnetic particles by using a magnetic field.

4. The semiconductor wafer vapor deposition apparatus according to claim 1, characterized in that, The sealing assembly (42) includes a blocking plate (421), a support (422), a metal half-ring (423), an extension block (424), a telescopic post a (425), a wire sleeve (426), a wire harness (427), a telescopic post b (428), an insulating cone block (4281), and a through hole (4282) disposed in the nozzle hole (25) for automatic mechanized control of the generation and disappearance of the magnetic field.

5. A semiconductor wafer vapor deposition apparatus according to claim 1, characterized in that, The support assembly (43) includes a bottom ring (431), a telescopic rod a (432), a telescopic rod b (433), a telescopic end (4331), a movable ring seat (4332), a movable electrode (4333), a fixed ring seat (4334), and a fixed electrode (4335) disposed in the nozzle hole (25) for automatic mechanized control of nozzle positioning.

6. The semiconductor wafer vapor deposition apparatus according to claim 1, characterized in that, The support assembly (43) includes a motor a (434), a rotating shaft (435), a gear a (436), a toothed plate (437), a clamping block (438), and a movable wheel (439) disposed inside the hole cover (27) for clamping and positioning the nozzle.

7. A semiconductor wafer vapor deposition apparatus according to claim 1, characterized in that, The transfer mechanism (5) includes a structural ring (501), a movable cavity (5011), a toothed ring (5012), a vertical plate (502), a buckle (503), a motor b (504), and a gear b (505) located outside the gas supply device (21).

8. A semiconductor wafer vapor deposition apparatus according to claim 7, characterized in that, The gripping assembly (51) includes a lead screw (511), a nut (512), a deflector (513), an electromagnet (514), a motor (515), and a pulley (516) mounted on the vertical plate (502) for lifting and lowering the gripping nozzle.

9. A semiconductor wafer vapor deposition apparatus according to claim 7, characterized in that, The cleaning assembly (52) includes an opening and closing seat (521), a sealing groove (522), a hinge (523), an air inlet pipe (524), an injection pipe (525), a viewing window (526), ​​and a sealing gasket (527) disposed on the vertical plate (502) for creating a sealed space for the cleaning operation of the nozzle.

10. A semiconductor wafer vapor deposition apparatus according to claim 9, characterized in that, The cleaning assembly (52) includes a slide (528), a cleaning roller (529), an expansion sleeve (5291), and an exhaust port (5292) disposed on the sealing tank (522) for improving the cleaning effect of the nozzle.

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