Nickel-64 electroplating solution, electroplating solution preparation method, electroplating method and electroplated layer

Abstract

The invention provides a nickel-64 electroplating solution, an electroplating solution preparation method, an electroplating method and an electroplated layer, and belongs to the technical field of electroplating, and the nickel-64 electroplating solution comprises sulfuric acid, nickel salt, sodium salt and a solvent. Wherein the nickel salt comprises a nickel-64 element, the concentration of nickel-64 ions in the electroplating solution is 10-35 g / L, the concentration of sodium ions in the electroplating solution is 10-40 g / L, and the pH value of the electroplating solution is 1.2-2.0. According to the nickel-64 electroplating solution disclosed by the invention, the current dispersion capability and the current stability of the electroplating solution in the electroplating process are enhanced by introducing sodium ions with a proper concentration, so that a nickel-64 plating layer with relatively high thickness and relatively high surface quality can be formed in a short time.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, and in particular to a nickel-64 electroplating solution, a method for preparing the electroplating solution, an electroplating method, and an electroplated layer. Background Technology

[0002] Nickel-64 coated targets are solid targets used for preparing copper-64 by cyclotron irradiation. They have a simple structure and are relatively easy to fabricate. Currently, nickel-64 coated targets are typically prepared by electroplating, and the electroplating solution used for preparing the nickel-64 coating is mostly hydrochloric acid. However, if... Figure 1 As shown, the nickel-64 plating layer formed by the hydrochloric acid system electroplating solution has a large number of pores and air channels on its surface, and the plating density is low, making it difficult to withstand the long-term irradiation test of the cyclotron.

[0003] Therefore, it is necessary to design a nickel-64 electroplating solution, a method for preparing the electroplating solution, an electroplating method, and an electroplating layer to improve the above-mentioned problems. Summary of the Invention

[0004] This invention provides a nickel-64 electroplating solution, a method for preparing the electroplating solution, an electroplating method, and an electroplated layer, in order to improve the technical defects of existing nickel-64 electroplating solutions that result in electroplated layers with numerous pores and low density on the surface.

[0005] In a first aspect, the present invention provides a nickel-64 electroplating solution comprising sulfuric acid, nickel salt, sodium salt, and solvent.

[0006] The nickel salt includes nickel-64, the concentration of nickel-64 ions in the electroplating solution is 10~35 g / L, the concentration of sodium ions in the electroplating solution is 10~40 g / L, and the pH value of the electroplating solution is 1.2~2.0.

[0007] In one example of the present invention, the nickel salt includes nickel sulfate, and the sodium salt includes sodium sulfate.

[0008] In one example of the present invention, the solvent is deionized water.

[0009] In a second aspect, the present invention also provides a method for preparing a nickel-64 electroplating solution, the method comprising: A sulfuric acid solution and a hydrogen peroxide solution are mixed to obtain a first mixed solution; Nickel-64 raw material and sodium hydroxide in a predetermined mass ratio are placed into a first mixed solution to prepare nickel-64 electroplating solution.

[0010] In one example of the present invention, the mixing of sulfuric acid solution and hydrogen peroxide solution to obtain a first mixed solution includes: A sulfuric acid solution and a hydrogen peroxide solution are mixed in a volume ratio of (1~3):(2~3) to obtain a first mixed solution; wherein the concentration of the sulfuric acid solution is 2~6 mol / L and the solubility of the hydrogen peroxide solution is 10~30 wt%.

[0011] In one example of the present invention, the step of placing nickel-64 raw material and sodium hydroxide in a first mixed solution in a predetermined mass ratio to prepare a nickel-64 electroplating solution includes: A second mixed solution is prepared by dissolving nickel-64 raw material in a predetermined mass ratio in the first mixed solution; Sodium hydroxide solution is added to the second mixed solution to adjust the pH value of the second mixed solution to 1.2~2.0 to prepare a nickel-64 electroplating solution; the concentration of nickel-64 ions in the nickel-64 electroplating solution is 10~35 g / L; the concentration of sodium ions in the nickel-64 electroplating solution is 10~40 g / L.

[0012] In one example of the present invention, the enrichment degree of the nickel-64 raw material is 90%~99%; the dissolution temperature of the nickel-64 raw material in the first mixed solution is 80~120℃; and the concentration of the sodium hydroxide solution is 2~10 mol / L.

[0013] In a third aspect, the present invention also provides an electroplating method, the electroplating method comprising applying a constant electroplating current to a nickel-64 electroplating solution in any of the above examples at a preset electroplating temperature to electroplat a nickel-64 electroplating layer; wherein the electroplating temperature is 10~50°C and the current density of the electroplating current is 10~30 mA / cm². 2 .

[0014] In one example of the present invention, a constant current is applied to the nickel-64 electroplating solution using an electroplating anode and an electroplating cathode, wherein the distance between the electroplating anode and the electroplating cathode is 1 to 2 cm.

[0015] In one example of the present invention, during the electroplating process, the nickel-64 electroplating solution is stirred at a speed of 100-300 rpm.

[0016] In a fourth aspect, the present invention also provides an electroplated layer formed by electroplating using the nickel-64 electroplating solution in any of the above examples.

[0017] The nickel-64 electroplating solution provided by this invention enhances the current dispersion and stability of the electroplating solution during the electroplating process by introducing an appropriate concentration of sodium ions, thereby enabling the formation of a relatively thick and high-quality nickel-64 coating in a short time. The formed nickel-64 coating has advantages such as high density, no obvious pores, no cracks, and strong adhesion to the substrate, and can withstand long-term accelerator irradiation. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other embodiments based on these drawings without inventive effort.

[0019] In the attached diagram: Figure 1 This is a photograph of a nickel-64 coating prepared in Comparative Example 1 of this disclosure; Figure 2 This is a schematic flowchart of a method for preparing nickel-64 electroplating solution in one embodiment of this disclosure; Figure 3 This is a flowchart illustrating step S2 in one embodiment of the present disclosure; Figure 4 This is a schematic diagram of an electroplating apparatus for preparing a nickel-64 coating in one embodiment of the present disclosure; Figure 5 This is a photograph of a nickel-64 coating prepared according to Example 1 of this disclosure; Figure 6 The surface microstructure of the nickel-64 coating prepared in Example 1 of this disclosure is magnified 130 times under an optical microscope; Figure 7 Scanning electron microscope (SEM) image of the surface of the nickel-64 coating prepared in Example 1 of this disclosure; Figure 8 The X-ray fluorescence spectroscopic characterization results are for the nickel-64 coating prepared in Example 1 of this disclosure; Figure 9 This is a photograph of a nickel-64 coating prepared according to Example 2 of this disclosure; Figure 10 The surface microstructure of the nickel-64 coating prepared in Example 2 of this disclosure is magnified 130 times under an optical microscope; Figure 11 This is a physical image of the nickel-64 coating prepared in Example 3 of this disclosure; Figure 12 This is a physical image of the nickel-64 coating prepared in Example 4 of this disclosure.

[0020] The attached figures are labeled as follows: 10. Power supply; 11. Electroplating anode; 12. Electroplating cathode; 20. Heating platform; 30. Electroplating tank; 31. Stirring unit. Detailed Implementation

[0021] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification. This disclosure can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this disclosure. It should be noted that, unless otherwise specified, the following embodiments and features can be combined with each other. It should also be understood that the terminology used in the embodiments of this disclosure is for describing specific implementation schemes and not for limiting the scope of protection of this disclosure. Test methods in the following embodiments that do not specify specific conditions are generally performed under conventional conditions or according to the conditions recommended by the respective manufacturers.

[0022] It should be noted that the terms such as "upper", "lower", "left", "right", "middle" and "one" used in this specification are only for clarity of description and are not intended to limit the scope of this disclosure. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this disclosure.

[0023] In a first aspect, this disclosure provides a nickel-64 electroplating solution comprising sulfuric acid, a nickel salt, a sodium salt, and a solvent. In this nickel-64 electroplating solution, the nickel salt is any nickel-containing compound soluble in the solvent, and the nickel salt includes nickel-64 element. The concentration of nickel-64 ions in the electroplating solution is any value within the range of 10 to 35 g / L, for example, the concentration of nickel-64 ions can be 10 g / L, 15 g / L, 20 g / L, 25 g / L, 30 g / L, or 35 g / L; the concentration of sodium ions in the electroplating solution is any value within the range of 10 to 40 g / L, for example, the concentration of sodium ions can be 10 g / L, 20 g / L, 30 g / L, or 40 g / L. The nickel-64 electroplating solution is improved by adding an appropriate amount of sulfuric acid, which promotes the full dissolution of nickel and sodium salts in the solution. The pH value of the nickel-64 electroplating solution can be any value in the range of 1.2 to 2.0, such as 1.2, 1.4, 1.6 or 2.0.

[0024] This nickel-64 plating solution, by introducing an appropriate amount of sodium ions, effectively increases the conductivity of the plating solution and improves the plating current efficiency during the plating process, thus making the plating process more stable. Simultaneously, the appropriate amount of sodium ions enhances the dispersion of the plating current in the solution, resulting in a more uniform distribution of the current and a tighter bond between metal atoms in the formed nickel-64 plating layer. This reduces porosity and cracking on the plating surface, improving the density of the plating layer. Furthermore, this nickel-64 plating solution has low requirements for plating temperature, enabling the formation of high-quality nickel-64 plating layers at room temperature, and can be used for plating nickel-64 plating layers with different enrichment levels.

[0025] In some embodiments, the nickel salt in the nickel-64 plating solution may include at least nickel sulfate, and the sodium salt may include at least sodium sulfate.

[0026] In some embodiments, the solvent may be deionized water.

[0027] In a second aspect, this disclosure also provides a method for preparing the nickel-64 electroplating solution in any of the above embodiments. For example... Figure 2 As shown, the preparation method includes the following steps: S1. Mix sulfuric acid solution and hydrogen peroxide solution to obtain a first mixed solution; S2. Place the nickel-64 raw material and sodium hydroxide in a predetermined mass ratio into the first mixed solution to prepare the nickel-64 electroplating solution.

[0028] In some embodiments, in step S1, sulfuric acid solution and hydrogen peroxide solution are mixed at a volume ratio of (1~3):(2~3), that is, sulfuric acid solution and hydrogen peroxide solution are mixed at a volume ratio of 0.33~1.5 to obtain a first mixed solution. The concentration of the sulfuric acid solution used is 2~6 mol / L, for example, 2 mol / L, 3 mol / L, 4 mol / L, 5 mol / L, or 6 mol / L; the solubility of the hydrogen peroxide solution used is 10~30 wt%, for example, 10 wt%, 15 wt%, 20 wt%, 25 wt%, or 30 wt%.

[0029] like Figure 3 As shown, in some embodiments, step S2 includes the following steps: S21. Dissolve the nickel-64 raw material in a predetermined mass ratio in the first mixed solution to obtain the second mixed solution.

[0030] In step S21, a predetermined mass of nickel-64 raw material is weighed according to the volume of the electroplating solution and the predetermined concentration of nickel-64 ions in the electroplating solution. Under heating conditions, the nickel-64 raw material is dissolved in a first mixed solution. The enrichment of the elemental nickel-64 raw material used is 90% to 99%, for example, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, or 99%. Under heating conditions, the dissolution temperature of the nickel-64 raw material in the first mixed solution is 80 to 120°C, for example, 80°C, 90°C, 100°C, 110°C, or 120°C.

[0031] S22. Add sodium hydroxide solution to the second mixed solution to adjust the pH value of the second mixed solution to 1.2~2.0 to prepare nickel-64 electroplating solution.

[0032] In step S22, the concentration of the sodium hydroxide solution used is 2~10 mol / L, for example, it can be 2mol / L, 4mol / L, 6mol / L, 8mol / L or 10mol / L. By adjusting the amount of sodium hydroxide solution added, the pH value of the prepared nickel-64 electroplating solution is controlled at 1.2~2.0, and the concentration of nickel-64 ions in the nickel-64 electroplating solution is 10~35 g / L and the concentration of sodium ions is 10~40 g / L.

[0033] In a third aspect, this disclosure also provides an electroplating method for forming a nickel-64 electroplating layer using the nickel-64 electroplating solution in any of the above embodiments.

[0034] This electroplating method uses, for example... Figure 4 The electroplating apparatus shown includes a power supply 10, a heating platform 20, and an electroplating tank 30. The electroplating tank 30 is mounted on the heating platform 20 and is used to hold a nickel-64 electroplating solution. A stirring unit 31 is located in the electroplating tank 30. The stirring unit 31 is used to uniformly stir the electroplating solution in the electroplating tank 30 during the electroplating process to ensure uniform concentration throughout the electroplating solution, reduce concentration polarization, and ensure uniform deposition of the nickel-64 coating on the electrode to be plated. The stirring unit 31 can be a magnetic stirrer, and it can be positioned in the electroplating tank 30 between the electroplating anode 11 and the electroplating cathode 12.

[0035] The power supply 10 is electrically connected to an electroplating anode 11 and an electroplating cathode 12, which are disposed in an electroplating tank 30. For example, the electroplating anode 11 and electroplating cathode 12 can be snapped and fixed in slots within the electroplating tank 30. The shape and area of ​​the electroplating anode 11 and electroplating cathode 12 can be adjusted according to the required electroplating layer area. The shapes of the electroplating anode 11 and electroplating cathode 12 can be rectangular, square, or other irregular sheet shapes. For example, the distance between the electroplating anode 11 and electroplating cathode 12 disposed in the electroplating tank 30 can be fixed at 1~2 cm. Both the electroplating anode 11 and electroplating cathode 12 are rectangular, with the electroplating cathode 12 serving as the electrode to be electroplated. Electroplating forms a polished surface area of ​​1~2 cm² on the electroplating cathode 12. 2 The electroplated layer.

[0036] It should be noted that the materials of the electroplated anode 11 and the electroplated cathode 12 are not limited and can be any conductive material available on the market. For example, the electroplated anode 11 can be selected from one or more combinations of gold, platinum, and platinum-niobium metals, and the electroplated cathode 12 can be selected from one or more combinations of tantalum, gold, silver, platinum, or niobium.

[0037] The electroplating method specifically includes the following steps: Pour the nickel-64 electroplating solution into the electroplating tank 30; insert the electroplating anode 11 and electroplating cathode 12 into the slots of the electroplating tank 30, immersing the electroplating anode 11 and electroplating cathode 12 in the nickel-64 electroplating solution; activate the heating stage 20 to heat the electroplating tank 30 to the preset electroplating temperature, which can be 10~50℃, for example, 10℃, 20℃, 30℃, 40℃, or 50℃. The electroplating anode 11 is connected to the positive terminal of the power supply 10, and the electroplating cathode 12 is connected to the negative terminal of the power supply 10. The power supply 10 applies a voltage to the electroplating anode 11 and the electroplating cathode 12 to apply a preset electroplating current to the nickel-64 electroplating solution in the electroplating tank 30 through the electroplating anode 11 and the electroplating cathode 12. The electroplating solution is stirred at a speed of 100~300 rpm by the stirring unit 31, so that the electroplating solution forms a nickel-64 electroplating layer with uniform thickness and good surface quality on the electrode to be plated under a suitable electroplating temperature and electroplating time. The power supply 10 outputs a constant electroplating current through the electroplating anode 11 and the electroplating cathode 12, and the current density of the electroplating current can be 10~30 mA / cm. 2 Any value within the range, for example, the electroplating current can be 10 mA / cm. 2 15mA / cm 2 20mA / cm 2 25mA / cm 2 Or 30mA / cm 2 .

[0038] This electroplating method, by controlling the electroplating current density and the composition of the electroplating solution, can obtain a nickel-64 electroplating layer with dense surface bonding, good surface quality, no blistering, no peeling, and no cracking in a short time at lower or higher electroplating temperatures.

[0039] In a fourth aspect, the present invention also provides an electroplating layer formed by electroplating using the nickel-64 electroplating solution in any of the above embodiments.

[0040] The technical solutions of this disclosure will be described in detail below through several specific embodiments and comparative examples. Unless otherwise stated, the raw materials and reagents used in the following embodiments are commercially available products or can be prepared by conventional methods in the art.

[0041] Example 1 This embodiment provides a nickel-64 electroplating solution and utilizes the nickel-64 electroplating solution to form a nickel-64 plating layer. The concentration of nickel-64 ions in the nickel-64 electroplating solution is 28.78 g / L, the concentration of sodium ions is 38.71 g / L, and the pH value of the nickel-64 electroplating solution is 1.2.

[0042] The preparation process of this nickel-64 electroplating solution includes: weighing 0.4 g of 99% pure nickel-64 powder into a 25 mL round-bottom flask using an electronic balance, adding 6 mL of 2M sulfuric acid and 4 mL of 30% hydrogen peroxide, and magnetically stirring in a 90°C oil bath until completely dissolved. The pH of the solution is adjusted to 1.2 using approximately 3.9 mL of 6M sodium hydroxide to obtain the nickel-64 electroplating solution.

[0043] The electroplating process includes: using a platinum sheet as the electroplating anode 11 and a tantalum sheet as the electroplating cathode 12, rinsing the electroplating anode 11 and cathode 12 with deionized water and wiping them clean with lint-free paper. First, the electroplating anode 11 and cathode 12 are placed in the slots of the electroplating tank 30, with the electroplating anode 11 connected to the positive terminal of the power supply 10 and the electroplating cathode 12 connected to the negative terminal of the power supply 10. Then, the nickel-64 electroplating solution is poured into the electroplating tank, and a magnetic stirring unit 31 is placed inside. The electroplating tank is placed on an electrically heated magnetic stirring table, the power supply 10 and the magnetic stirring unit 31 are turned on, the stirring speed is adjusted to 200 rpm, and the heating temperature of the magnetic stirring table is maintained at 50°C. A nickel-64 electroplating layer is obtained using a constant current electroplating method with a current density of 25 mA / cm². 2 The electroplating time was 6 hours. After electroplating, the electroplating cathode 12 was removed, rinsed with deionized water, and wiped clean with lint-free paper to obtain a nickel-64 plating layer.

[0044] Example 2 This embodiment provides a nickel-64 electroplating solution and utilizes it to form a nickel-64 plating layer. The concentration of nickel-64 ions in the nickel-64 electroplating solution is 33.78 g / L, the concentration of sodium ions is 35.43 g / L, and the pH value of the nickel-64 electroplating solution is 1.2.

[0045] The preparation process of this nickel-64 electroplating solution includes: weighing 0.5 g of 99% pure nickel-64 powder into a 25 mL round-bottom flask using an electronic balance, adding 6 mL of 2M sulfuric acid and 5 mL of 30% hydrogen peroxide, and magnetically stirring in an oil bath at 100°C until completely dissolved. The pH of the solution is adjusted to 1.2 using approximately 3.8 mL of 6M sodium hydroxide to obtain the nickel-64 electroplating solution.

[0046] The electroplating process includes: using a platinum sheet as the electroplating anode 11 and a copper sheet as the electroplating cathode 12, rinsing the electroplating anode 11 and cathode 12 with deionized water and wiping them clean with lint-free paper. First, place the electroplating anode 11 and cathode 12 in the slots of the electroplating tank 30, connecting the electroplating anode 11 to the positive terminal of the power supply 10 and the electroplating cathode 12 to the negative terminal of the power supply 10. Then, pour the nickel-64 electroplating solution into the electroplating tank and place the magnetic stirring unit 31 inside. Place the electroplating tank on an electrically heated magnetic stirring table, turn on the power supply 10 and the magnetic stirring unit 31, adjust the stirring speed to 200 rpm, maintain the heating temperature of the magnetic stirring table at 50℃, and use a constant current electroplating method to obtain a nickel-64 electroplated layer with a current density of 20 mA / cm². 2 The electroplating time was 8 hours. After electroplating, the electroplating cathode 12 was removed, rinsed with deionized water, and wiped clean with lint-free paper to obtain a nickel-64 plating layer.

[0047] Example 3 This embodiment provides a nickel-64 electroplating solution and utilizes it to form a nickel-64 plating layer. The concentration of nickel-64 ions in the nickel-64 electroplating solution is 29.41 g / L, the concentration of sodium ions is 27.06 g / L, and the pH value of the nickel-64 electroplating solution is 2.0.

[0048] The preparation process of this nickel-64 electroplating solution includes: weighing 0.3 g of 99% pure nickel-64 powder into a 25 mL round-bottom flask using an electronic balance, adding 3 mL of 2M sulfuric acid and 6 mL of 30% hydrogen peroxide, and magnetically stirring in an oil bath at 100°C until completely dissolved. The pH of the solution is adjusted to 2.0 using approximately 1.2 mL of 10M sodium hydroxide to obtain the nickel-64 electroplating solution.

[0049] The electroplating process includes: using a platinum sheet as the electroplating anode 11 and a pure silver sheet as the electroplating cathode 12, rinsing the electroplating anode 11 and cathode 12 with deionized water and wiping them clean with lint-free paper. First, the electroplating anode 11 and cathode 12 are placed in the slots of the electroplating tank 30, with the electroplating anode 11 connected to the positive terminal of the power supply 10 and the electroplating cathode 12 connected to the negative terminal of the power supply 10. Then, the nickel-64 electroplating solution is poured into the electroplating tank, and a magnetic stirring unit 31 is placed inside. The electroplating tank is placed on an electrically heated magnetic stirring table, the power supply 10 and the magnetic stirring unit 31 are turned on, the stirring speed is adjusted to 100 rpm, and the heating temperature of the magnetic stirring table is maintained at 30°C. A nickel-64 electroplating layer is obtained using a constant current electroplating method with a current density of 20 mA / cm². 2 The electroplating time was 3 hours. After electroplating, the electroplating cathode 12 was removed, rinsed with deionized water, and wiped clean with lint-free paper to obtain a nickel-64 plating layer.

[0050] Example 4 This embodiment provides a nickel-64 electroplating solution and utilizes it to form a nickel-64 plating layer. The concentration of nickel-64 ions in the nickel-64 electroplating solution is 10 g / L, the concentration of sodium ions is 11.50 g / L, and the pH value of the nickel-64 electroplating solution is 1.2.

[0051] The preparation process of this nickel-64 electroplating solution includes: weighing 0.1 g of 99% pure nickel-64 powder into a 25 mL round-bottom flask using an electronic balance, adding 1.5 mL of 2M sulfuric acid and 2 mL of 30% hydrogen peroxide, and magnetically stirring in an oil bath at 100°C until completely dissolved. The pH of the solution is adjusted to 1.2 using approximately 6 mL of deionized water and 0.5 mL of 10M sodium hydroxide to obtain the nickel-64 electroplating solution.

[0052] The electroplating process includes: using a platinum sheet as the electroplating anode 11 and a pure copper sheet as the electroplating cathode 12, rinsing the electroplating anode 11 and cathode 12 with deionized water and wiping them clean with lint-free paper. First, place the electroplating anode 11 and cathode 12 in the slots of the electroplating tank 30, connecting the electroplating anode 11 to the positive terminal of the power supply 10 and the electroplating cathode 12 to the negative terminal of the power supply 10. Then, pour the nickel-64 electroplating solution into the electroplating tank and place the magnetic stirring unit 31 inside. Place the electroplating tank on an electrically heated magnetic stirring table, turn on the power supply 10 and the magnetic stirring unit 31, adjust the stirring speed to 100 rpm, maintain the heating temperature of the magnetic stirring table at 30°C, and use a constant current electroplating method to obtain a nickel-64 electroplated layer with a current density of 20 mA / cm². 2 The electroplating time was 3 hours. After electroplating, the electroplating cathode 12 was removed, rinsed with deionized water, and wiped clean with lint-free paper to obtain a nickel-64 plating layer.

[0053] like Figure 1 and Figures 5 to 7 , Figures 9 to 12 As shown, compared to Figure 1 The existing hydrochloric acid-based nickel-64 plating solution used to prepare nickel-64 plating layers exhibits numerous porosity defects on its surface. In this embodiment, the nickel-64 plating solution used to prepare nickel-64 plating layers demonstrates excellent surface quality. (See photographs for reference.) Figure 5 , Figure 9 , Figure 11 , Figure 12 It can be seen that the nickel-64 electroplated layer prepared in the embodiments of this disclosure has a smooth surface, free from obvious defects such as cracks, bulges, and pores. The surface of the nickel-64 electroplated layer has good density and metallic luster. Furthermore, the surface microstructure photographs under optical microscope magnification and electron scanning observation are also provided. Figure 6 , Figure 7 , Figure 10It can be seen that, at the microscopic scale, the surface of the nickel-64 electroplated layer prepared in the embodiments of this disclosure is dense and uniform, and there are no obvious defects.

[0054] Furthermore, through actual thickness and surface area measurements, it was determined that the embodiments of this disclosure can produce a nickel-64 electroplated layer with high surface density and a large thickness in a short time under near-room temperature conditions, thereby saving electroplating time and costs and improving the quality of the nickel-64 electroplated layer. For example, the measured area of ​​the nickel-64 electroplated layer obtained in Example 1 was 1.76 cm². 2 The thickness is 40 μm; in Example 2, the area of ​​the nickel-64 electroplated layer is 1.76 cm². 2 The thickness is 60 μm; in Example 3, the area of ​​the nickel-64 electroplated layer is 1.95 cm². 2 The thickness is 20 μm; in Example 4, the area of ​​the nickel-64 electroplated layer is 1.95 cm². 2 The thickness is 15μm.

[0055] like Figure 8 As shown, the composition of the nickel-64 electroplated layer prepared in Example 1 was analyzed using X-ray fluorescence spectrometry. The nickel content was 98.84%, and only copper and iron were detected as other impurity metals in the plating layer, with copper accounting for 0.68% and iron for 0.26%. After conversion, the nickel-64 content among the detected metals was 99.06%, which is sufficient for accelerator irradiation production of nickel-64.

[0056] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Anyone skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A nickel-64 electroplating solution, characterized in that, The solution includes sulfuric acid, nickel salt, sodium salt, and solvent; the nickel salt includes nickel-64 element, the concentration of nickel-64 ions in the electroplating solution is 10~35 g / L, the concentration of sodium ions in the electroplating solution is 10~40 g / L, and the pH value of the electroplating solution is 1.2~2.

0.

2. The nickel-64 electroplating solution according to claim 1, characterized in that, The nickel salt includes nickel sulfate, and the sodium salt includes sodium sulfate.

3. The nickel-64 electroplating solution according to claim 1, characterized in that, The solvent is deionized water.

4. A method for preparing the nickel-64 electroplating solution according to any one of claims 1 to 3, characterized in that, include: A sulfuric acid solution and a hydrogen peroxide solution are mixed to obtain a first mixed solution; Nickel-64 raw material and sodium hydroxide in a predetermined mass ratio are placed into a first mixed solution to prepare nickel-64 electroplating solution.

5. The preparation method according to claim 4, characterized in that, The step of mixing sulfuric acid solution and hydrogen peroxide solution to obtain a first mixed solution includes: A sulfuric acid solution and a hydrogen peroxide solution are mixed in a volume ratio of (1~3):(2~3) to obtain a first mixed solution; wherein the concentration of the sulfuric acid solution is 2~6 mol / L and the solubility of the hydrogen peroxide solution is 10~30 wt%.

6. The preparation method according to claim 4, characterized in that, The step of placing nickel-64 raw material and sodium hydroxide in a predetermined mass ratio into a first mixed solution to prepare a nickel-64 electroplating solution includes: A second mixed solution is prepared by dissolving nickel-64 raw material in a predetermined mass ratio in the first mixed solution; Sodium hydroxide solution is added to the second mixed solution to adjust the pH value of the second mixed solution to 1.2~2.0 to prepare a nickel-64 electroplating solution; the concentration of nickel-64 ions in the nickel-64 electroplating solution is 10~35 g / L; the concentration of sodium ions in the nickel-64 electroplating solution is 10~40 g / L.

7. The preparation method according to claim 6, characterized in that, The enrichment degree of the nickel-64 raw material is 90%~99%; the dissolution temperature of the nickel-64 raw material in the first mixed solution is 80~120℃; and the concentration of the sodium hydroxide solution is 2~10 mol / L.

8. An electroplating method, characterized in that, include: At a preset electroplating temperature, a constant current is applied to the nickel-64 electroplating solution according to any one of claims 1 to 3 to electroplat a nickel-64 electroplating layer on a metal substrate. The electroplating temperature is 10~50℃, and the electroplating current density is 10~30mA / cm². 2 .

9. The electroplating method according to claim 8, characterized in that, A constant current is applied to the nickel-64 electroplating solution using an electroplating anode and an electroplating cathode, with a distance of 1 to 2 cm between the electroplating anode and the electroplating cathode; during the electroplating process, the nickel-64 electroplating solution is stirred at a stirring speed of 100 to 300 rpm.

10. An electroplated layer formed by electroplating using the nickel-64 electroplating solution according to any one of claims 1 to 3.

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