Wafer detection mechanism and wafer detection equipment

Abstract

The invention relates to the technical field of wafer detection, and provides a wafer detection mechanism and wafer detection equipment. The wafer detection mechanism comprises a wafer carrying disc, an optical detection module, a moving module and a carrying module. The wafer carrying disc comprises a supporting part provided with a light through hole and a light-transmitting element arranged in the light through hole, the light-transmitting element and the hole wall of the light through hole jointly define a light-transmitting medium groove, and the light-transmitting medium groove is used for containing a light-transmitting medium filled between the light-transmitting element and the wafer to be detected; the optical detection module is arranged below the wafer carrying disc; the moving module is connected to the optical detection module and / or the wafer carrying disc and is used for driving at least one of the optical detection module and the wafer carrying disc to move relative to the other one on the horizontal plane; the carrying module is arranged above the wafer carrying disc; the liquid removing module and the wafer carrying disc are arranged in a spaced mode. According to the wafer detection mechanism provided by the invention, optical detection of different positions of the wafer can be realized, and the overall detection efficiency is obviously improved.

Description

Technical Field

[0001] This application relates to the field of wafer inspection technology, and in particular to a wafer inspection mechanism and wafer inspection equipment. Background Technology

[0002] During wafer dicing, the wafer is typically supported on a tensioned support medium (such as a blue film), resulting in the support medium adhering to the back of the diced wafer. Due to the high roughness of the support medium, it is impossible to fully detect dicing defects hidden beneath the support medium on the wafer.

[0003] In related technologies, liquid is often added to the supporting medium to reduce its surface roughness. However, current detection methods still suffer from low efficiency and functional deficiencies. Summary of the Invention

[0004] Therefore, it is necessary to provide a wafer inspection mechanism that can perform optical inspection at different locations on the wafer, significantly improving the overall inspection efficiency.

[0005] A wafer inspection mechanism includes a wafer carrier, an optical inspection module, a moving module, and a transport module. The wafer carrier has a light-transmitting hole, a support portion around the outer periphery of the light-transmitting hole, and a light-transmitting element inside the light-transmitting hole. The light-transmitting element and the hole wall together form a light-transmitting medium groove, which is used to accommodate a light-transmitting medium filled between the light-transmitting element and the wafer under test. The optical inspection module is located below the wafer carrier. The moving module is connected to the optical inspection module and / or the wafer carrier, and is used to drive at least one of the optical inspection module and the wafer carrier to move relative to the other on a horizontal plane, so that the optical inspection module can inspect different areas of the wafer under test through the light-transmitting element and the light-transmitting medium. The transport module is located above the wafer carrier and is used to place the wafer under test on the wafer carrier or to pick up the inspected wafer and move it away from the wafer carrier.

[0006] The wafer inspection mechanism provided in this application can utilize a transport module to adjust the position of the wafer relative to the wafer carrier. When the wafer is located on the wafer carrier, the refractive index can be changed by setting a light-transmitting medium between the wafer and the light-transmitting element, facilitating the acquisition of a clearer inspection image. When the wafer is far from the wafer carrier, it is convenient for the robot arm to pick up and place the wafer. Simultaneously, combined with the moving module, the position of the optical inspection module relative to the wafer can be adjusted during the inspection process to meet optical inspection needs at different positions, significantly improving overall inspection efficiency.

[0007] In some embodiments, the wafer to be tested includes a wafer body, a frame surrounding the outer periphery of the wafer body, and a support medium applied to the surfaces of the wafer body and the frame; the support portion is provided with a plurality of spaced-apart adsorption holes, and the support portion adsorbs and fixes the frame through each of the adsorption holes, and the lateral dimensions of the light-transmitting element and the lateral dimensions of the light-transmitting medium groove are adapted to the lateral dimensions of the wafer body.

[0008] In some embodiments, the light-transmitting medium includes at least a light-transmitting liquid, and the light-transmitting medium tank is a liquid accumulation tank, which is capable of containing and accumulating liquid to form a liquid film that is adapted to the shape of the liquid accumulation tank and fills the light-transmitting element and the wafer under test.

[0009] In some embodiments, the wafer carrier disk is further provided with a liquid filling channel communicating with the light-transmitting medium tank, the liquid filling channel being used to deliver liquid to the light-transmitting medium tank to form a liquid film filling the space between the light-transmitting element and the wafer under test.

[0010] In some embodiments, the wafer carrier disk further includes an annular protrusion surrounding the outer periphery of the light-transmitting aperture, the annular protrusion being used to tighten the support medium of the wafer under test and seal to form the liquid film.

[0011] In some embodiments, the wafer carrier disk further includes a liquid return channel, a drain groove, and an annular protrusion. The annular protrusion surrounds the outer periphery of the light-transmitting hole, and the drain groove is spaced around the outer periphery of the light-transmitting hole and located inside the annular protrusion. The drain groove has a drain hole communicating with the liquid return channel. The liquid return channel collects the liquid overflowing from the light-transmitting medium tank through the drain groove to form a liquid film of a predetermined thickness in the light-transmitting medium tank. And / or, the wafer carrier disk further includes a liquid return channel communicating with the light-transmitting medium tank. The liquid return channel is used to recover excess liquid in the light-transmitting medium tank to form a liquid film of a predetermined thickness in the light-transmitting medium tank.

[0012] In some embodiments, the wafer inspection mechanism further includes a liquid supply and return module, which is connected to the liquid filling channel and the liquid return channel respectively. The liquid supply and return module can replenish liquid to the light-transmitting medium tank to repair the liquid film during the relative movement of the optical inspection module and the wafer carrier.

[0013] In some embodiments, the wafer inspection mechanism further includes a liquid removal module, which is arranged at a distance from the wafer carrier disk and is used to remove liquid from the surface of the support medium of the wafer after inspection.

[0014] In some embodiments, the transport module is capable of picking up the wafer to be tested vertically away from the wafer carrier, so that there is a clearance space between the wafer to be tested and the wafer carrier. The clearance space is used for the liquid removal module to extend in for liquid removal and / or for a robot arm to pick up and place wafers relative to the transport module.

[0015] In some embodiments, the conveying module includes a lifting structure, a connecting arm connected to the lifting structure, and an adsorption structure connected to the connecting arm. The lifting structure drives the adsorption structure to move up and down in the vertical direction through the connecting arm.

[0016] In some embodiments, the liquid removal module includes an integrated base and a liquid removal structure and a liquid collection tank disposed on the integrated base. The integrated base is movable relative to the transport module on a horizontal plane. The liquid collection tank is disposed below or near the liquid removal structure and is used to receive the liquid removed by the liquid removal structure. The liquid removal structure includes an air knife and / or a scraper.

[0017] In some embodiments, the optical detection module includes an illumination structure and an imaging structure. The illumination structure is used to emit illumination light to the wafer under test, which passes through the light-transmitting element and the light-transmitting medium in sequence. The imaging structure is used to collect imaging light from the wafer under test and pass through the light-transmitting medium and the light-transmitting element in sequence to image the wafer under test.

[0018] In some embodiments, the moving module includes a first moving module, a second moving module connected to the first moving module, and a support base connected to the second moving module. The optical detection module is disposed on the support base. The first moving module is used to drive the support base to move in a first direction in a horizontal plane via the second moving module. The second moving module is able to drive the support base to move in a second direction in a horizontal plane. The support base drives the optical detection module to move synchronously. The first direction and the second direction are set at an angle.

[0019] In some embodiments, the wafer inspection mechanism further includes an air blowing structure connected to an anti-condensation air source, the air blowing direction of the air blowing structure being toward the light-transmitting element and / or the lens of the optical inspection module; and / or, the wafer inspection mechanism further includes an inspection chamber and an air filter, at least the wafer carrier and the optical inspection module being disposed in the inspection chamber, and the air filter being used to filter the gas in the inspection chamber.

[0020] This application also provides a wafer inspection device, including a wafer loading mechanism, a transport mechanism, an appearance defect inspection mechanism, and the aforementioned wafer inspection mechanism. The wafer inspection mechanism, the wafer loading mechanism, and the appearance defect inspection mechanism are arranged at intervals. The transport mechanism is capable of picking up wafers and transferring them between the wafer loading mechanism, the wafer inspection mechanism, and the appearance defect inspection mechanism.

[0021] In some embodiments, the wafer inspection equipment has a first inspection cavity and a second inspection cavity arranged at intervals, the transport mechanism and the appearance defect inspection mechanism are disposed in the first inspection cavity, and the wafer inspection mechanism is disposed in the second inspection cavity; the wafer inspection equipment also includes a movable isolation door disposed between the first inspection cavity and the second inspection cavity, the isolation door having a closed state and an open state;

[0022] In the closed state, the first detection cavity and the second detection cavity are not connected; in the open state, the first detection cavity and the second detection cavity are connected, and the conveying mechanism is used to pick up the wafer and transfer it between the wafer loading mechanism and the wafer inspection mechanism, or between the wafer inspection mechanism and the appearance defect inspection mechanism. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a first partial schematic diagram of a wafer inspection mechanism provided in an embodiment of this application;

[0025] Figure 2 This is a second partial schematic diagram of a wafer inspection mechanism provided in one embodiment of this application;

[0026] Figure 3 This is a third partial schematic diagram of a wafer inspection mechanism provided in an embodiment of this application;

[0027] Figure 4 This is a fourth partial schematic diagram of a wafer inspection mechanism provided in an embodiment of this application;

[0028] Figure 5 This is a simplified diagram of the wafer and liquid film junction in a wafer inspection mechanism provided in an embodiment of this application;

[0029] Figure 6 This is a simplified diagram of the first detection optical path in a wafer inspection mechanism provided in an embodiment of this application;

[0030] Figure 7 This is a simplified diagram of a second type of detection optical path in a wafer inspection mechanism provided in an embodiment of this application;

[0031] Figure 8 A simplified optical path diagram for directly detecting the wafer under test via the supporting medium;

[0032] Figure 9 A simplified optical path diagram for forming a liquid film above a supporting medium to detect a wafer under test;

[0033] Figure 10 A simplified optical path diagram provided for the detection by the optical detection module in an embodiment of this application;

[0034] Figure 11 This is an image obtained by directly inspecting the wafer under test through the supporting medium;

[0035] Figure 12 An image obtained by inspecting a wafer under test via a support medium and a liquid film;

[0036] Figure 13 An image obtained by the wafer inspection mechanism provided in the embodiments of this application;

[0037] Figure 14 A schematic diagram of a wafer carrier disk in a wafer inspection mechanism provided in an embodiment of this application;

[0038] Figure 15 This is a partial schematic diagram of a wafer carrier disk in a wafer inspection mechanism provided in an embodiment of this application;

[0039] Figure 16 This is a first simplified diagram of the wafer carrier disk in a wafer inspection mechanism provided in an embodiment of this application;

[0040] Figure 17 This is a second simplified diagram of the wafer carrier disk in a wafer inspection mechanism provided in an embodiment of this application;

[0041] Figure 18 This is a third simplified diagram of the wafer carrier disk in a wafer inspection mechanism provided in an embodiment of this application;

[0042] Figure 19 A schematic diagram of a wafer inspection mechanism provided in one embodiment of this application;

[0043] Figure 20 This is a top view of a wafer inspection device provided in an embodiment of this application;

[0044] Figure 21 This is a first partial schematic diagram of a wafer inspection device provided in an embodiment of this application;

[0045] Figure 22 This is a second partial schematic diagram of a wafer inspection device provided in an embodiment of this application.

[0046] Reference numerals: 100, Wafer inspection mechanism; 110, Wafer carrier; 111, Support; 112, Light-transmitting element; 113, Annular protrusion; 114, Support flange; 115, Inner ring protrusion; 120, Optical inspection module; 121, Illumination module; 122, Imaging module; 130, Moving module; 131, First moving module; 132, Second moving module; 133, Support base; 140, Transport module; 141, Lifting structure; 142, Connecting arm; 143, Adsorption structure; 150, Liquid removal module; 151, Integrated base; 152, Liquid removal structure; 153, Guide structure; 154, Baffle plate; 160, Automatic focusing structure; 170, Inspection chamber; 180, Stage; 201, Loading station; 300, Transport mechanism; 310. Robotic arm; 320. Pickup structure; 400. Appearance defect detection mechanism; 500. Isolation door; 900. Wafer to be tested; 910. Wafer body; 920. Frame; 930. Support medium; 1001. Liquid film; 1002. Bubble; 1003. Second detection chamber; 1004. First detection chamber; 1101. Light-transmitting hole; 1102. Light-transmitting medium tank; 1103. Liquid filling channel; 1104. Liquid drain tank; 1105. Liquid drain hole; 1106. Liquid return channel; 1221. Image acquisition device; 1222. Optical lens group; 1222a. Objective lens; 1222b. First half-reflecting mirror; 1222c. Second half-reflecting mirror; 1222d. Reflecting mirror; 1401. Clearance space; 1521. Air knife; 1522. Scraper. Detailed Implementation

[0047] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0048] It should be noted that when a component is referred to as being "fixed to" or "attached to" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0051] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0052] Please see Figure 1 , Figure 4 , Figure 5 and Figure 6This application provides an optical inspection system for infrared detection of the side of a wafer 900 to be tested covered by a support medium 930, thereby detecting defects at the wafer's dicing points. The optical inspection system includes a liquid film formation module, a support portion 111, an illumination module 121, an imaging module 122, and a control module (not shown in the figure). Specifically, the liquid film formation module has a light-transmitting hole 1101, and a light-transmitting element 112 is provided at the bottom of the light-transmitting hole 1101. The light-transmitting element 112 and the inner wall of the light-transmitting hole 1101 together form a liquid accumulation tank (i.e., a light-transmitting medium tank 1102 as described below). The opening of the liquid accumulation tank faces the wafer 900 to be tested, and the liquid accumulation tank is used to contain the light-transmitting medium filled between the light-transmitting element 112 and the wafer 900 to be tested. The support portion 111 is used to support the edge of the wafer 900 to be tested. Both the illumination module 121 and the imaging module 122 are located at the bottom of the liquid film forming module. The illumination module 121 emits illumination light onto the wafer 900 under test, which passes sequentially through the light-transmitting element 112 and the light-transmitting medium. The imaging module 122 collects imaging light from the wafer 900 under test that passes sequentially through the light-transmitting medium and the light-transmitting element 112 to image the wafer 900 under test. The control module controls at least one of the imaging module 122 and the wafer 900 under test to move relative to each other in a plane substantially perpendicular to the optical axis, and controls the imaging module 122 to collect images of different areas of the wafer 900 under test.

[0053] Among them, the optical axes of the light-transmitting element 112, the liquid film 1001, and the imaging module 122 are all along the Z-axis direction, that is... Figure 1 and Figure 4 In the vertical direction, generally, the plane substantially perpendicular to the optical axis is the horizontal plane, i.e., the plane where the wafer 900 under test is located, which is also the plane defined by the X-axis and Y-axis, with the X-axis, Y-axis, and Z-axis being perpendicular to each other. The XY plane substantially perpendicular to the optical axis means that there can be a slight angular offset error or fine adjustment relative to the true horizontal plane. The support part 111 is located on the side of the liquid film forming module away from the imaging module 122 along the Z-axis direction, and the wafer 900 under test is supported on the support part 111. The control module can control only the imaging module 122 to move on the horizontal plane, thereby changing the position of the imaging module 122 relative to the wafer 900 under test, thus satisfying defect detection in different areas. Alternatively, the control module can control only the liquid film forming module to move on the horizontal plane, thereby changing the position of the liquid film forming module relative to the imaging module 122, thus adjusting the detection area of ​​the imaging module 122 relative to the wafer 900 under test. Or, the control module can control the imaging module 122 and the liquid film forming module to move separately on the horizontal plane. During the movement, it can move along the X-axis on a horizontal plane, or only along the Y-axis, or both along the X and Y axes, or other directions. It only needs to satisfy the defect detection requirements of different areas of the wafer under test; this is just an example.

[0054] Understandably, the light-transmitting medium within the liquid accumulation tank can alter the light refraction path, thereby facilitating the imaging module 122 to acquire a clearer image. During this process, because at least one of the imaging module 122 and the wafer 900 under test can move on the horizontal plane, the position of the imaging module 122 relative to the wafer 900 can be adjusted to meet the detection requirements of different areas. Furthermore, during the detection process, the light-transmitting medium, the light-transmitting element 112, and the wafer 900 under test are in a relatively stationary state, mitigating potential wear or static electricity issues with the support medium 930 and imaging stability problems that might arise from relative movement between the light-transmitting medium and the wafer 900.

[0055] It should be noted that this application refers to the detection method in which the light-transmitting medium, the light-transmitting element 112, and the wafer 900 under test remain relatively stationary during detection as "static detection," which will be used interchangeably thereafter. It can be understood that this "static detection" includes embodiments in which the light-transmitting medium, the light-transmitting element 112, and the wafer 900 under test are in a relatively stationary state, and their movement relative to the imaging module 122 is controlled by the control module.

[0056] More preferably, the control module only controls the imaging module 122 to move on the horizontal plane to change the relative position of the imaging module 122 with respect to the wafer 900 under test. In this way, during the detection process, the wafer under test is stably supported on the support part 111, which not only ensures that the light-transmitting medium and the support medium 930 on the wafer 900 under test are in a relatively static state, but also ensures that the light-transmitting medium, the light-transmitting element 112 and the wafer 900 under test are all fixedly set relative to the frame of the wafer detection mechanism 100 (or wafer detection device, see the relevant description below). This further avoids the problem of decreased imaging effect caused by the vibration or fluctuation of the fluid light-transmitting medium (such as light-transmitting liquid or light-transmitting gas) relative to the wafer 900 under test.

[0057] In some embodiments, the light-transmitting medium includes at least a light-transmitting liquid. A liquid accumulation tank can contain and accumulate liquid to form a liquid film 1001 that is adapted to the shape of the liquid accumulation tank and fills the light-transmitting element 112 and the wafer 900 under test. It is understood that the liquid accumulation tank contains and accumulates liquid, which can spread between the light-transmitting element 112 and the wafer 900 under tension to form the liquid film 1001, thereby changing the light refraction path and facilitating the imaging module 122 to acquire a clearer image. Simultaneously, during the detection process, the liquid film 1001 remains stable, and the liquid film 1001 and the supporting medium 930 on the wafer 900 are in a relatively static state, thereby improving the wear or static electricity problems of the supporting medium 930 and imaging stability issues that may arise from relative movement between the two.

[0058] Please see Figures 4 to 6The illumination module 121 uses an infrared light source, such as near-infrared, far-infrared, or short-wave infrared light, for example, an infrared laser with a suitable wavelength range and stable output power, which ensures that the emitted infrared light has stable energy and precise directionality. The imaging module 122 includes an image acquisition unit 1221 and an optical lens group 1222. The optical lens group 1222 includes an objective lens 1222a and a tube lens (not shown in the figure). The tube lens is positioned between the objective lens 1222a and the image acquisition unit 1221. The optical lens group 1222 is used to collect imaging light and transmit it to the image acquisition unit 1221 for imaging. The image acquisition unit 1221 can be an infrared camera. The objective lens 1222a includes multiple lenses spaced apart along the optical axis (i.e., the Z-axis direction), such as at least two plano-convex lenses and at least one plano-concave lens, or a combination of plano-convex lenses, double-convex lenses, double-concave lenses, etc., which are only examples here. Objective lens 1222a provides high resolution for image acquisition unit 1221 to identify minute defects; furthermore, objective lens 1222a can also perform primary magnification of the pattern on the surface of the wafer 900 under test, facilitating image acquisition unit 1221 to obtain a clearer image. The telescope includes at least a first semi-reflective mirror 1222b, which reflects infrared light emitted by illumination module 121 to objective lens 1222a and projects imaging light to image acquisition unit 1221. The telescope also includes at least two lenses spaced apart along the optical axis, such as at least two plano-convex lenses, with their planar sides facing each other and their convex sides facing away from each other. This is merely an example.

[0059] It should be noted that the infrared light source is used primarily because it is necessary to penetrate the supporting medium 930 on the wafer, such as blue film, PET film, UV film, etc., used to support and fix the wafer or cut the wafer, in order to obtain a clearer image of internal defects. Of course, visible light, monochromatic light, or other light sources in other wavelengths can also be used.

[0060] like Figure 7 As shown, in some embodiments, the optical inspection system further includes an autofocus structure 160, and the tube lens in the optical lens group 1222 also includes a second semi-reflective mirror 1222c corresponding to the autofocus structure 160. The autofocus structure 160 can automatically adjust the distance between the objective lens 1222a and the light-transmitting element 112, so that the image on the image acquisition unit 1221 achieves a clearer image. The second semi-reflective mirror 1222c can project the light beam emitted from the autofocus structure 160 onto the wafer 900 under test for diagonal adjustment, and can project the imaging light onto the image acquisition unit 1221 for image acquisition. This type of embodiment can be applied to some occasions with high-precision inspection requirements, using the autofocus structure 160 to achieve timely adjustment of the object distance to the object under test to achieve a clear image. The object under test is a wafer.

[0061] In other embodiments, the optical lens group 1222 includes a telecentric lens, specifically an object-side telecentric lens or a double telecentric lens. This type of embodiment can be applied to situations where high-speed inspection is required but accuracy can be appropriately reduced. By setting a telecentric lens to increase the depth of field on the object side, it can better cope with the undulations of the focusing surface and ensure that the wafer under test 900 is quickly and clearly imaged under a large depth-of-field lens.

[0062] like Figure 6 and Figure 7 As shown, in some embodiments, the optical lens assembly 1222 further includes a reflector 1222d, which is used to reflect the infrared light emitted by the illumination module 121 to the first semi-reflector 1222b. In actual use, the optical lens assembly 1222 is disposed inside the lens barrel.

[0063] In some embodiments, the light-transmitting element 112 has an anti-reflection coating on at least one side along its thickness direction, and the anti-reflection coating has an infrared band. For example, it may be an anti-reflection coating that increases the transmittance in the short-wave infrared band (1100nm-1500nm), reduces the reflection loss of infrared light passing through the upper and lower surfaces of the liquid film forming module, and reduces the impact of ghosting caused by reflection on imaging. For example, the light-transmitting element 112 may have anti-reflection coatings on both sides along the Z-axis, or only the lower surface of the light-transmitting element 112 may have an anti-reflection coating, or the upper surface of the light-transmitting element 112 may have an anti-reflection coating.

[0064] The light-transmitting element 112 can be a light-transmitting element that can transmit infrared light and / or visible light, and the light-transmitting element can be made of a planar plate-shaped glass with a light transmittance of 90% or more. The lateral dimension of the light-transmitting element 112 and / or the liquid accumulation tank covers or overlaps at least part of the wafer 900 under test to ensure the widest possible range of action and to ensure that the light refraction path can be changed at all points of the wafer 900 under test through the light-transmitting element 112 and the light-transmitting medium housed in the liquid accumulation tank during the testing process.

[0065] Specifically, the area of ​​at least a portion of the wafer under test must be at least larger than the current image acquisition area (or the current field of view of the imaging module), or it can be greater than or equal to the area of ​​two current image acquisition areas (or twice the current field of view of the imaging module). This ensures that multiple images acquired during the movement of the imaging module 122 are transmitted through the liquid film 1001 and the light-transmitting element 112 without relative movement of the wafer and the liquid film 1001.

[0066] In some specific embodiments, the lateral dimensions of the light-transmitting element 112 and / or the liquid accumulation tank cover or overlap the entire lateral dimension range of the wafer. Alternatively, the lateral dimensions of the light-transmitting element 112 and / or the liquid accumulation tank may cover or overlap one-half, one-third, or so on, of the entire lateral dimension of the wafer.

[0067] Furthermore, the support portion 111 is arranged around the outer periphery of the light-transmitting aperture 1101 to support the edge of the wafer 900 under test. This ensures a wide support range while avoiding interference in the central region of the wafer 900. In practical use, the optical inspection system also includes a wafer carrier 110, with the support portion 111 and the liquid film formation module integrated into the wafer carrier 110. The control module controls the relative movement of at least one of the imaging module 122 and the wafer carrier 110 on the horizontal plane.

[0068] In some embodiments, the support 111 and the liquid film forming module remain relatively fixed at least while the imaging module 122 acquires images of different regions of the wafer 900 under test. Specific possible embodiments are as follows:

[0069] As a specific embodiment, the support portion 111 and the liquid film forming module can be integrally structured with the wafer carrier body, for example, they can be integrally formed, or they can be fixed by means of bonding or welding. In this case, the support portion 111 and the liquid film forming module are fixedly set relative to each other. Whether the imaging module 122 is moving to acquire images or in a stationary state, it can be ensured that the wafer under test 900 is relatively stationary with respect to the liquid film 1001 and the light-transmitting element 112, so as to ensure stable and clear imaging of the wafer under test 900 during large-scale multiple image acquisitions.

[0070] In another specific embodiment, the support portion 111 and the liquid film forming module can also be separately arranged. The support portion 111 surrounds the outer periphery of the liquid film forming module, and the liquid film forming module is provided with a liquid filling channel 1103 and a liquid return channel 1106 communicating with the liquid accumulation tank to realize the formation of the liquid film 1001. The inner diameter of the support portion 111 can be larger than the outer diameter of the liquid film forming module, and an adjustment structure for connecting the support portion 111 and the liquid film forming module can be provided between the two to facilitate adjustment of their assembly positions. In this case, it is necessary to ensure that when the imaging module 122 moves to acquire images, the locking adjustment structure keeps the support portion 111 and the liquid film forming module relatively fixed, thereby ensuring that the wafer 900 under test, the liquid film 1001, and the light-transmitting element 112 are relatively fixed to improve imaging stability.

[0071] Therefore, regardless of whether the support portion 111 and the liquid film formation module are integrated into the wafer carrier 110 and fixedly arranged, or whether the support portion 111 and the liquid film formation module are separately arranged, it is preferable to ensure that the support portion 111 and the liquid film formation module remain relatively fixed when the imaging module 122 acquires images of different areas of the wafer 900 under test. This ensures that when detecting a large area of ​​the wafer 900 under test, light can stably pass through the liquid film 1001 and the light-transmitting element 112, and the imaging optical path can be complete without moving the liquid film 1001 or the light-transmitting element 112. Of course, in other embodiments, the support portion 111 and the liquid film formation module can also be relatively adjustable during part of the detection process, so that the wafer 900 under test and the liquid film 1001 can be relatively adjustable during part of the detection process. This detection method is referred to as "dynamic detection" in this document, realizing a detection state that combines "static detection" and "dynamic detection". Other variable embodiments will not be described in detail.

[0072] Please see Figure 1 , Figure 2 , Figure 3 , Figure 14 , Figure 15 and Figure 16 Some embodiments of this application also provide a wafer inspection mechanism 100. Specifically, the wafer inspection mechanism 100 includes a wafer carrier 110, an optical inspection module 120, a moving module 130, and a transport module 140. The optical inspection module 120 is the aforementioned imaging module 122 (or an integration of the aforementioned illumination module 121 and imaging module 122). In this series of embodiments, the integration of the liquid film forming module and the support portion 111 into the wafer carrier 110 is used as an example for description. For the case of separate components, please refer to the previous text, which will not be repeated here.

[0073] Specifically, the wafer carrier 110 is provided with a light-transmitting hole 1101, and a light-transmitting element 112 is provided inside the light-transmitting hole 1101. The light-transmitting element and the hole wall of the light-transmitting hole 1101 together form a light-transmitting medium groove 1102, which is used to accommodate the light-transmitting medium filled between the light-transmitting element 112 and the wafer 900 under test. The optical inspection module 120 is located below the wafer carrier 110. The moving module 130 is connected to the optical inspection module 120 and / or the wafer carrier 110, and is used to drive at least one of the optical inspection module 120 and the wafer carrier 110 to move relative to the other on a horizontal plane, so that the optical inspection module 120 can inspect different areas of the wafer 900 under test through the light-transmitting element 112 and the light-transmitting medium. The transport module 140 is located above the wafer carrier 110 and is used to place the wafer to be tested on the wafer carrier 110 or to pick up the tested wafer away from the wafer carrier 110.

[0074] like Figures 1 to 3As shown, taking the connection between the moving module 130 and the optical inspection module 120 as an example, the moving module 130 drives the optical inspection module 120 to move along the X-axis and Y-axis directions on the horizontal plane to change the position of the optical inspection module 120 relative to the wafer carrier 110, thereby adjusting the different inspection areas of the optical inspection module 120 relative to the wafer 900 to be tested.

[0075] In other words, the wafer inspection mechanism 100 provided in this application can use the transfer module 140 to adjust the position of the wafer relative to the wafer carrier 110. When the wafer is located on the wafer carrier 110, the refractive index can be changed by setting a light-transmitting medium between the wafer and the light-transmitting element 112, making it easier for the optical inspection module 120 to obtain a clearer inspection image. When the wafer is far away from the wafer carrier 110, it is convenient for the robot to pick up and place the wafer. At the same time, combined with the setting of the moving module 130, it is easy to adjust the position of the optical inspection module 120 relative to the wafer during the inspection process to meet the optical inspection at different positions, and the overall inspection efficiency is significantly improved.

[0076] Please combine Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6 The wafer under test 900 includes a wafer body 910, a frame 920 surrounding the wafer body 910, and a support medium 930 attached to the surfaces of the wafer body 910 and the frame 920. The support portion 111 can be fixed to the frame 920 to support and fix the wafer under test 900. The lateral dimensions of the light-transmitting element 112 and the light-transmitting medium groove 1102 are adapted to the lateral dimensions of the wafer body 910. Here, the lateral dimension refers to the cross-sectional dimension. This arrangement ensures that the overall lateral dimension of the light-transmitting medium filling the light-transmitting medium groove 1102 is adapted to the lateral dimension of the wafer body 910, thereby ensuring that the light-transmitting medium can adhere as much as possible to the area of ​​the wafer body 910 to be tested, facilitating that the optical inspection module 120 always has corresponding light-transmitting medium when it moves to the target position.

[0077] It should be noted that the compatibility here does not mean that the lateral dimensions of the light-transmitting element 112 and the light-transmitting medium groove 1102 are completely consistent with the lateral dimensions of the wafer body 910. It is only necessary to cover the area of ​​the wafer body 910 to be detected with the light-transmitting medium at the light-transmitting medium groove 1102.

[0078] In practical use, the light-transmitting medium includes at least a light-transmitting liquid. The following explanation assumes that the light-transmitting medium consists only of a liquid. The aforementioned matching of lateral dimensions ensures that the lateral dimensions of the formed liquid film 1001 are adapted to the lateral dimensions of the wafer body 910. This guarantees that the formed liquid film 1001 can adhere as much as possible to the area of ​​the wafer body 910 to be inspected, ensuring that the optical inspection module 120 has a corresponding liquid film 1001 each time it moves to the target position.

[0079] During the inspection process, the wafer carrier 110 remains stable, thereby maintaining the stability of the liquid film 1001 and ensuring that the liquid film 1001 covers the area of ​​the wafer body 910 to be inspected. Thus, when the optical inspection module 120 moves on the horizontal plane under the action of the moving module 130 to change different inspection areas, a stable liquid film 1001 is always present. This ensures that when the optical inspection module 120 acquires images of each area of ​​interest on the wafer 900 under test, the incident light path and the imaging light path can uniformly pass through the liquid film 1001. Throughout the entire inspection process, the liquid film 1001 and the supporting medium 930 on the wafer 900 under test remain in a relatively stationary state, thereby mitigating the wear or static electricity problems of the supporting medium 930 caused by relative movement between the two. Simultaneously, this setup effectively divides the surface of the wafer 900 under test into multiple smaller detection areas. The liquid film 1001 can consistently cover the current area of ​​interest on the wafer 900 and the field of view of the optical inspection module 120. By improving the detection accuracy of each area of ​​interest on the wafer 900, the overall detection accuracy of the wafer is improved. Furthermore, because the wafer carrier 110 and the optical inspection module 120 can move relative to each other under the action of the moving module 130 during the inspection process, it is easy to change the detection position in a timely manner, thereby improving the detection efficiency.

[0080] In some embodiments, the wafer carrier 110 is further provided with a liquid filling channel 1103 communicating with the light-transmitting medium tank 1102. The liquid filling channel is used to deliver liquid to the light-transmitting medium tank 1102 to form a liquid film 1001 filling between the light-transmitting element 112 and the wafer 900 to be tested.

[0081] In practical use, the transport module 140 picks up the wafer 900 to be tested and places it on the wafer carrier 110, where it is fixed and supported by the support portion 111. Then, liquid is injected into the light-transmitting medium tank 1102 through the liquid filling channel 1103. Under its own surface tension, the liquid diffuses within the light-transmitting medium tank 1102 and forms a liquid film 1001 filling the space between the light-transmitting element 112 and the wafer 900 to be tested. The optical inspection module 120 can collect imaging light from the wafer 900 to be tested, which passes sequentially through the support medium 930 and the liquid film 1001, to image the wafer 900 to be tested. In this process, it is precisely because of the setting of the liquid film 1001 that the incident angle of light can be reduced when it is incident from air to the liquid film 1001; and since the refractive index of the liquid forming the liquid film 1001 is relatively small compared with that of the film layer (i.e., the aforementioned support medium 930), water can be selected. In this way, the angle of light deviating from the optical axis is small, so the degree of asymmetric reflection between the wafer reflection imaging light and the incident light is reduced, thereby improving the detection accuracy.

[0082] In some embodiments, the wafer inspection mechanism 100 further includes a liquid removal module 150, which is spaced apart from the wafer carrier 110 and is used to remove liquid from the surface of the wafer support medium 930 after inspection. After inspection is completed, the transport module 140 picks up the wafer from the wafer carrier 110 and moves the wafer away from the wafer carrier 110, and uses the liquid removal structure 152 to remove liquid from the surface of the support medium 930.

[0083] In other words, the wafer inspection mechanism 100 provided in this embodiment can use the transport module 140 to adjust the position of the wafer relative to the wafer carrier 110. When the wafer is on the wafer carrier 110, it can satisfy the formation of the liquid film 1001 and inspection. When the wafer is away from the wafer carrier 110, it can be deliquified by the deliquencing module 150, thereby realizing the integrated function of forming the liquid film 1001, inspection and deliquencing. At the same time, combined with the setting of the moving module 130, it is convenient to adjust the position of the optical inspection module 120 relative to the wafer during the inspection process to meet the optical inspection at different positions, and the overall inspection efficiency is significantly improved. Moreover, this setting can also ensure that the inspected wafer is still in a clean state, which is convenient for direct input into the next process, reducing intermediate processing steps and thus improving overall efficiency.

[0084] Alternatively, the moving module 130 is connected to the wafer carrier 110 to drive the wafer carrier 110 to move relative to the optical inspection module 120. Alternatively, both the wafer carrier 110 and the optical inspection module 120 may be connected to corresponding moving modules 130 to allow them to move independently. This is merely an example.

[0085] Please see Figure 1 , Figure 4 and Figure 6In some embodiments, the optical detection module 120 includes an illumination structure and an imaging structure. The illumination structure is the aforementioned illumination module 121, and the imaging structure is the aforementioned imaging module 122. The illumination module 121 is used to emit illumination light, such as infrared light, that passes sequentially through the light-transmitting element 112 and the light-transmitting medium (i.e., the aforementioned liquid film 1001) to the wafer 900 under test. The imaging module 122 is used to collect the imaging light from the wafer 900 under test that passes sequentially through the light-transmitting medium (i.e., the aforementioned liquid film 1001) and the light-transmitting element 112 to image the wafer 900 under test. The optical axis of the imaging module 122 is parallel to the optical axis of the liquid film 1001.

[0086] The imaging light is formed by infrared light emitted by the illumination module 121 incident on the wafer 900 under test and the support medium 930. Theoretically, this includes reflected light from the back of the wafer, scattered light from the surface of microcracks inside the wafer, or transmitted light that has been reflected or scattered and penetrated the back of the wafer. It may also include a small amount of light that is not beneficial to the detection requirements, such as reflected and scattered light from the support medium 930. The image ultimately acquired by the imaging module 122 is formed by its image sensor receiving all of the above light. The image sensor is located within the image acquisition unit 1221. Because infrared light has high penetrability, it can effectively penetrate the support medium 930, allowing the imaging module 122 to clearly capture the image inside the wafer 900 under test, thus enabling the detection of internal defects (such as microcracks and microchips) in the wafer body 910. The optical axis of the imaging module 122 is parallel to the optical axis of the entire liquid film 1001, and the imaging module 122 is set with the liquid film 1001 in the corresponding detection area on the same optical axis. This ensures that the incident light can accurately pass through the liquid film 1001 and the support medium 930 and be projected onto the wafer 900 under test. The imaging light can also pass through the support medium 930 and the liquid film 1001 in sequence to reach the imaging module 122, thereby improving the clarity and accuracy of the imaging.

[0087] The detection principle of the optical detection module 120 can be found in [reference needed]. Figures 8 to 10 θ0 is the incident angle of the incident light, θ1 is the angle of refraction of the incident light after refraction, θ2 is the incident angle to the wafer, and θ3 is the angle between the incident light and the reflected light. Figure 8 In the solution without liquid film 1001 and without light-transmitting element 112, the surface of the support medium 930 is rough and uneven, and the air interface angle of the support medium 930 is not uniform. This results in a large incident angle θ0 of the incident light on the surface of the support medium 930. Furthermore, because the incident beam may have different incident points on the air interface of the support medium 930, multiple different incident angles may occur. Consequently, under the effect of light refraction, a large amount of imaging light (or reflected light) deviates far from the original incident direction, ultimately causing the image of the wafer under test 900 to be blurred. The corresponding imaging image is shown in Figure 1. Figure 11As shown. To verify the effectiveness of the scheme with liquid film 1001 and no light-transmitting element 112, the wafer under test 900 was inverted (i.e., back side up) and liquid was added to the support medium 930 on the back side of the wafer body 910 for simulation, as shown. Figure 9 As shown, in the scheme with liquid film 1001 and no light-transmitting element 112, although the problem of uneven surface of the supporting medium 930 is alleviated, the unevenness of the liquid surface still causes some problems of image light deviation due to refraction, resulting in unclear imaging. The corresponding imaging image is shown below. Figure 12 As shown. In Figure 10 In the scheme shown, which includes a liquid film 1001 and a light-transmitting element 112, since the air interface of the light-transmitting element 112 is flat and the incident angle is basically consistent, if the refractive index of the liquid is chosen to be approximately the same as that of the light-transmitting element 112, the problem of light refraction or scattering can be effectively solved. The angle θ3 between the incident light and the reflected light is significantly reduced, allowing the imaging light to be effectively collected by the imaging module 122, thereby achieving the purpose of clear imaging. The corresponding imaging image is shown below. Figure 13 As shown.

[0088] In some embodiments, the wafer inspection mechanism 100 further includes a control module (not shown in the figure). The control module controls the moving module 130 to move the optical inspection module 120 relative to the wafer carrier 110 on a horizontal plane, and also controls the transport module 140 to transport the wafer. The control module can be a host computer, and the moving module 130, optical inspection module 120, transport module 140, and liquid removal module 150 are respectively connected to the host computer via signal connections, such as electrical or wireless connections, as long as signal transmission is possible. The wafer inspection mechanism 100 also includes sensors, which can be located on the wafer carrier 110 to detect the wafer's position. Sensors can also be located on the liquid removal module 150. For example, when the sensor on the wafer carrier 110 detects that the wafer 900 to be inspected has arrived, the control module controls the moving module 130 to move the optical inspection module 120 below the wafer carrier 110 to perform optical inspection. After the inspection is completed, the transport module 140 picks up the wafer and moves it away from the wafer carrier 110. The control module can control the dehydration module 150 to perform dehydration based on the detection signal from the sensor at the dehydration module 150. This is just an example.

[0089] like Figure 4 and Figure 5As shown, in some embodiments, the support portion 111 has multiple spaced-apart adsorption holes (not shown in the figure), through which the support portion 111 adsorbs and fixes the frame 920. A suction cup may be provided at the adsorption hole to adsorb and fix the frame 920 of the wafer 900 under test. Alternatively, the adsorption holes can be used directly for adsorption and fixation. Or, a Bernoulli suction cup may be provided at the adsorption hole, allowing the frame 920 and the support portion 111 to avoid direct contact while achieving adsorption, thus reducing wear. Alternatively, the support portion 111 may also utilize positioning blocks or clamping arms to fix the wafer; this is only an example.

[0090] Please see Figure 4 , Figure 5 , Figure 14 and Figure 15 In some embodiments, the wafer carrier 110 further includes an annular protrusion 113 surrounding the outer periphery of the light-transmitting aperture 1101. The annular protrusion 113 is used to tighten the support medium 930 of the wafer 900 under test and seal it to form a liquid film 1001. Specifically, the annular protrusion 113 protrudes from the support portion 111 and is arranged in a closed ring shape. The annular protrusion 113 can be made of a material with a certain frictional force to facilitate tightening of the support medium 930, thereby flattening the diced wafer body 910. At the same time, when the support medium 930 contacts and tightens with the annular protrusion 113, an annular sealing surface can be formed between the two, thereby sealing the liquid film 1001 located in the light-transmitting medium groove 1102 inside the annular protrusion 113, preventing the liquid forming the liquid film 1001 from spreading to the outside under tension, and improving the safety of use.

[0091] like Figure 14 and Figure 15 As shown, in some embodiments, a supporting flange 114 extends radially inward from the lower wall of the light-transmitting hole 1101, and the axial dimension of the supporting flange 114 is smaller than the axial dimension of the light-transmitting hole 1101. The aforementioned light-transmitting element 112 can be supported and fixed on the supporting flange 114. Sealing elements are provided between the light-transmitting element 112 and the supporting flange 114, and between the light-transmitting element 112 and the wall of the light-transmitting hole 1101, to prevent the liquid forming the liquid film 1001 from diffusing out from the gaps between the light-transmitting element 112 and the hole wall, and between the light-transmitting element 112 and the supporting flange 114. Alternatively, a groove can be provided radially outward from the lower wall of the light-transmitting hole 1101, and the outer diameter of the light-transmitting element 112 can be slightly larger than the aperture of the light-transmitting hole 1101, so that the edge of the light-transmitting element 112 is inserted into the groove for positioning and sealing. This is only an example.

[0092] Among them, the light-transmitting element 112 can be bonded and fixed to the hole wall of the light-transmitting hole 1101, which facilitates the processing, forming and installation of various components of the wafer carrier 110.

[0093] In other embodiments, the light-transmitting element 112 and the support portion 111 (or the support flange 114 or the body of the wafer carrier 110) may also be integrally formed, using an overall light-transmitting material, or using a partially light-transmitting material in the area of ​​the light-transmitting element 112, and a light-transmitting medium groove 1102 is formed in a recess above the area of ​​the light-transmitting element 112.

[0094] Please see Figures 14 to 17 In some embodiments, the wafer carrier disk 110 is further provided with a liquid return channel 1106, a liquid draining groove 1104 and an annular protrusion 113. The annular protrusion 113 surrounds the outer periphery of the light-transmitting hole 1101. The liquid draining groove 1104 is spaced around the outer periphery of the light-transmitting hole 1101 and located inside the annular protrusion 113. The liquid draining groove 1104 is provided with a liquid draining hole 1105 communicating with the liquid return channel 1106. The liquid return channel 1106 collects the liquid overflowing from the light-transmitting medium groove 1102 through the liquid draining groove 1104 so that a liquid film 1001 of a preset thickness is formed in the light-transmitting medium groove 1102.

[0095] Understandably, since the liquid film 1001 covers the entire wafer body 910 and has a large area, there may be some areas between the upper surface of the liquid film 1001 and the support medium 930 where air bubbles 1002 may exist, preventing the support medium 930 from being completely wetted. If the optical inspection module 120 moves to the location of these air bubbles for inspection, the imaging effect will be poor. Moreover, even if there are no air bubbles in this area at the moment, new air bubbles 1002 will be generated at unspecified times and in unspecified areas due to the vibration of the wafer inspection mechanism 100 and the loss and evaporation of liquid. Therefore, during the inspection process, the liquid addition channel 1103 needs to continuously add liquid to the light-transmitting medium tank 1102 to perfect the liquid film 1001, which will cause some liquid to overflow from the light-transmitting medium tank 1102. Therefore, the overflowing liquid can flow into the drain tank 1104 and be collected through the drain hole 1105 to the return channel 1106 to maintain the stability and controllable thickness of the liquid film 1001 in the light-transmitting medium tank 1102.

[0096] like Figure 14 and Figure 15As shown, the outer periphery of the light-transmitting hole 1101 is surrounded by an inner ring protrusion 115 arranged in a closed annular pattern. The drain groove 1104 is located outside the inner ring protrusion 115 and inside the annular protrusion 113. That is, the drain groove 1104 is formed by the outer wall of the inner ring protrusion 115 and the inner wall of the annular protrusion 113. The inner ring protrusion 115 forms part of the hole wall of the light-transmitting hole 1101 along the radial side wall away from the drain groove 1104. Liquid overflowing from the light-transmitting medium tank 1102 flows over the inner ring protrusion 115 into the drain groove 1104. The outlet of the liquid filling channel 1103, used to supply liquid to the light-transmitting medium tank 1102, is located on the side wall of the inner ring protrusion 115 away from the drain trough 1104 and above the light-transmitting element 112; alternatively, the outlet of the liquid filling channel 1103 is located on the upper surface of the inner ring protrusion 115 along the Z-axis direction. In this case, a guide surface that slopes radially from the outside to the inside and from top to bottom along the light-transmitting hole 1101 can be provided to guide the liquid toward the light-transmitting medium tank 1102. The drain trough 1104 is arranged in a ring shape to ensure that there is a liquid receiving area in the circumference of the light-transmitting medium tank 1102, preventing the liquid from spreading to other locations. The return channel 1106 can be located in the area of ​​the support 111 below the drain trough 1104 and is connected to the drain hole 1105 to form an integral structure. Of course, the return channel 1106 can also be located on the side of the drain trough 1104 facing the annular protrusion 113. This is only an example.

[0097] The portion of the support 111 located on the outer periphery of the annular protrusion 113 can be used to support large-sized wafers, while the inner protrusion 115 can be used to support small-sized wafers. This is merely an example.

[0098] like Figure 14 , Figure 15 and Figure 18As shown, in other embodiments, the wafer carrier 110 is further provided with a liquid return channel 1106 communicating with the light-transmitting medium tank 1102. The liquid return channel 1106 is used to recover excess liquid in the light-transmitting medium tank 1102 to form a liquid film 1001 of a preset thickness. That is, the liquid return channel 1106 does not need to pass through the aforementioned drain tank 1104 and is directly connected to the light-transmitting medium tank 1102. Similarly, the liquid return channel 1106, which is directly connected to the light-transmitting medium tank 1102, can be used to drain the liquid overflowing from the light-transmitting medium tank 1102, maintaining the stability and controllable thickness of the liquid film 1001 in the light-transmitting medium tank 1102. Specifically, the portion of the light-transmitting element 112 that is adapted to the aforementioned support flange 114 can be provided with a first through hole, and the support flange 114 is provided with a second through hole. The first through hole and the second through hole are connected and together form the liquid return channel 1106. The first through hole extends axially through the light-transmitting hole 1101 to the supporting flange 114. The second through hole can be L-shaped, with the vertical section of the L-shape aligned with and connected to the first through hole, and the horizontal section of the L-shape extending radially outward along the light-transmitting hole 1101.

[0099] Please see Figures 14 to 18 In some embodiments, the wafer inspection mechanism 100 further includes a liquid supply and return module (not shown in the figure). The liquid supply and return module is connected to the liquid filling channel 1103 and the liquid return channel 1106, respectively. The liquid supply and return module can replenish liquid into the light-transmitting medium tank 1102 to repair the liquid film 1001 during the relative movement of the optical inspection module 120 and the wafer carrier 110. Specifically, the control module can control the liquid supply and return module to replenish liquid into the light-transmitting medium tank 1102 through the liquid filling channel 1103 according to actual needs. As mentioned above, air bubbles 1002 exist in a certain area between the upper surface of the liquid film 1001 and the support medium 930, which prevents the support medium 930 from being completely wetted. In addition, new air bubbles will also be generated in unspecified areas within the liquid film 1001. These will all affect the inspection quality of the optical inspection module 120. Therefore, by utilizing the liquid supply and return module, liquid can be dynamically added to the light-transmitting medium tank 1102 through the liquid addition channel 1103 during the detection process to expel air bubbles 1002 from the liquid film 1001, thereby ensuring the formation of a complete and flat liquid film 1001 to meet the requirements of stable detection over a wide range. Moreover, liquid overflowing from the light-transmitting medium tank 1102 into the drain tank 1104 during the liquid replenishment process can be discharged through the liquid return channel 1106, reducing the risk of liquid leakage.

[0100] The aforementioned liquid addition channel 1103 and liquid return channel 1106 are both connected to the liquid supply and return module via pipes. The liquid addition channel 1103 and liquid return channel 1106 are independently configured and do not interfere with each other. After the wafer 900 under test is positioned relative to the wafer carrier 110, the liquid supply and return module slowly inputs liquid into the light-transmitting medium tank 1102 through the liquid addition channel 1103 and recovers excess liquid through the liquid return channel 1106. By controlling the difference in the rates of liquid addition and return, the volume of the formed liquid film 1001 remains stable. Due to the slow liquid flow rate and the close proximity between the supporting medium 930 and the light-transmitting element 112 (i.e., the shallow depth of the light-transmitting medium tank 1102 along the thickness direction of the light-transmitting element 112), a liquid film 1001 will eventually form between the supporting medium 930 and the light-transmitting element 112 due to liquid tension, thus improving detection accuracy. Meanwhile, if the liquid film 1001 ruptures during the testing process, the liquid on the support medium 930 can be sucked away using the return liquid channel 1106 to prevent the liquid from spreading to other locations. Furthermore, during the testing process, liquid can be added to the light-transmitting medium tank 1102 using the liquid addition channel 1103, which not only stabilizes the liquid film 1001 but also reduces the amount of air bubbles in the liquid film 1001. After the testing is completed, the liquid is first recovered using the return liquid channel 1106, and then the transport module 140 transports the wafer to a position away from the wafer carrier 110. The liquid removal module 150 then removes any residual liquid from the surface of the support medium 930, maintaining the cleanliness of the wafer after testing.

[0101] Furthermore, multiple liquid filling channels 1103 and liquid return channels 1106 can be provided, and they are arranged alternately along the circumference of the light-transmitting hole 1101. The outlet of the liquid filling channel 1103, which connects to the light-transmitting medium tank 1102, can be located on the wall of the light-transmitting hole 1101 that forms the light-transmitting medium tank 1102. The shapes of the liquid filling channel 1103 and liquid return channel 1106 can be adjusted according to actual assembly requirements, as long as they can meet the requirements for liquid inlet and liquid return; this is only an example.

[0102] The input liquid can be water, or other liquids or combinations such as glycerol or ethanol, as long as the liquid's refractive index is similar to that of the light-transmitting element 112, or similar to that of both the light-transmitting element 112 and the supporting medium 930. Simultaneously, the liquid film 1001 can be formed from any liquid or light-transmitting medium with high light transmittance, facilitating improved transmission and capture of high-quality images. Furthermore, the supply and return liquid module can control the liquid's temperature, viscosity, etc., to achieve optimal light transmittance and refractive index, and can also control the flow of different liquids to the light-transmitting medium tank 1102 to form liquid films 1001 composed of different media.

[0103] Furthermore, the refractive index of the light-transmitting medium can be between 1.4 and 2 to ensure a clear image can be formed. Even further, the refractive index of the light-transmitting medium is between 1.4 and 1.6. Meanwhile, the light-transmitting element 112 is generally made of light-transmitting glass with a refractive index between 1.5 and 1.9, but other light-transmitting medium films composed of organic or inorganic materials can also be used.

[0104] In other embodiments, the light-transmitting medium in the light-transmitting medium tank 1102 can be a combination of light-transmitting liquid and light-transmitting solid, such as a combination of light-transmitting liquid and light-transmitting glass, with the following order from top to bottom: blue film, light-transmitting liquid one, light-transmitting glass, light-transmitting liquid two, light-transmitting element 112, and so on. Alternatively, the light-transmitting medium can be a combination of liquid and gas, in which case a light-transmitting film is provided between them, with the following order from top to bottom: blue film, light-transmitting liquid one, light-transmitting film, light-transmitting gas, light-transmitting film, light-transmitting liquid two, light-transmitting element 112, and so on. This ensures high light transmittance while separating the liquid and gas. As long as the light-transmitting medium maintains high transmittance and approximately the same refractive index, the blue film and light-transmitting element 112 on both the upper and lower sides of the light-transmitting medium are wetted to form a low-refractive-index, high-transmittance incident light path and / or imaging light path.

[0105] In some embodiments, the wafer inspection mechanism further includes a liquid filling module connected to the aforementioned liquid filling channel for delivering liquid into the light-transmitting medium tank 1102 to form a liquid film 1001 between the light-transmitting element 112 and the wafer 900 to be tested.

[0106] Please see Figure 2 , Figure 3 , Figure 5 and Figure 16 In some embodiments, the transport module 140 can pick up the wafer 900 to be tested vertically away from the wafer carrier 110, so that there is a clearance space 1401 between the wafer 900 to be tested and the wafer carrier 110. The clearance space 1401 is used for the liquid removal module 150 to extend into for liquid removal and / or for the robot arm to pick up and place the wafer relative to the transport module 140. Specifically, the transport module 140 includes a lifting structure 141, a connecting arm 142 connected to the lifting structure 141, and an adsorption structure 143 connected to the connecting arm 142. The lifting structure 141 drives the adsorption structure 143 to move up and down vertically through the connecting arm 142.

[0107] In practical use, the adsorption structure 143 is located away from the wafer carrier 110 along the Z-axis. A robot arm can transport wafers from the loading station 201 or other stations to the adsorption structure 143 and extend into the space between the adsorption structure 143 and the wafer carrier 110. The adsorption structure 143 adsorbs and fixes the wafer, and the robot arm exits the space. The adsorption structure 143 carries the wafer and moves downward along the Z-axis under the action of the lifting structure 141 to place the wafer on the wafer carrier 110, where it is adsorbed and fixed. Then, the adsorption structure 143 releases its adsorption and moves upward under the action of the lifting structure 141, away from the wafer. Next, the liquid supply and return module inputs liquid into the light-transmitting medium tank 1102 to form a stable liquid film 1001 between the light-transmitting element 112 and the wafer (i.e., the wafer 900 to be tested). Then, the optical inspection module 120 moves to below the light-transmitting element 112 under the action of the moving module 130 to perform optical inspection. After the test is completed, the liquid forming the liquid film 1001 can be recovered from the return channel 1106 through the liquid supply and return module. The adsorption structure 143 descends again under the action of the lifting structure 141 and adsorbs the wafer, then carries the wafer upward to move the wafer away from the wafer carrier 110 and form a certain clearance space 1401 between them. After moving into position, the liquid removal module 150 can extend into the clearance space 1401 to remove the liquid on the surface of the support medium 930 on the wafer, maintaining the cleanliness of the surface of the wafer support medium 930 after the test. After the liquid removal is completed, the liquid removal module 150 withdraws from the clearance space 1401, and the robot arm extends into the clearance space 1401 again to pick up the wafer. The adsorption structure 143 releases its adsorption and is transported to other workstations by the robot arm.

[0108] The lifting structure 141 can be a lifting cylinder or other linear motion module capable of linear motion, such as an electric push rod. The adsorption structure 143 includes a base plate and multiple suction nozzles connected to the base plate, with the nozzles spaced apart. The base plate is connected to a connecting arm 142, thereby assembling the adsorption structure 143 and the lifting structure 141. Each suction nozzle is provided with a corresponding connecting arm 142 and a rotating shaft connected to the connecting arm 142, with the rotating shaft rotatably connected to the base plate. The rotating shaft can rotate around its own axis to drive the connecting arm 142 to swing synchronously, and the connecting arm 142 drives the corresponding suction nozzle to move synchronously, thereby changing the position of the suction nozzle. Both the connecting arm 142 and the rotating shaft are provided with air passages communicating with the suction nozzles, and the air passages can be connected to a pneumatic source through air pipes to meet adsorption requirements.

[0109] Please see Figure 2 and Figure 3In some embodiments, the liquid removal module 150 includes an integrated base 151 and a liquid removal structure 152 and a liquid collection tank (not shown in the figure) disposed on the integrated base 151. The integrated base 151 is movable relative to the transport module 140 on a horizontal plane. The liquid collection tank is located below or near the liquid removal structure 152 and is used to receive the liquid removed by the liquid removal structure 152. The liquid removal structure 152 includes an air knife 1521 and / or a scraper 1522.

[0110] In practical use, the liquid removal module 150 also includes a guide structure 153 and a drive source (not shown in the figure). The integrated base 151 is connected to both the guide structure 153 and the drive source. The integrated base 151 moves on a horizontal plane under the action of the drive source. The guide structure 153 guides the movement of the integrated base 151. For example, the drive source drives the integrated base 151 to move along the Y-axis on a horizontal plane. The guide structure 153 includes a guide rail and a slider. The length of the guide rail is set along the Y-axis, and the slider is connected to the integrated base 151 and slidably connected to the guide rail. The drive source can be a linear motion module that can achieve linear drive, such as a cylinder or an electric push rod. The liquid removal structure 152 includes air knives 1521 and scrapers 1522 arranged at intervals along the Y-axis. The liquid collection tank is located between the air knives 1521 and the scrapers 1522 and below the air outlet of the air knives 1521. As the integrated mounting base 151 moves relative to the wafer along the Y-axis within the clearance space 1401, the air knife 1521 can blow away the liquid remaining on the surface of the support medium 930, and the scraper 1522 can scrape the liquid on the surface of the support medium 930, which then drips and collects in the collection tank to satisfy the liquid removal from the surface of the support medium 930; moreover, the dual cooperation of the air knife 1521 and the scraper 1522 improves the liquid removal effect.

[0111] In actual use, the liquid remaining on the surface of the support medium 930 can be scraped off first using the scraper 1522, and then blown off using the air knife 1521, which significantly improves the liquid removal effect.

[0112] The air knife 1521 and the wiper blade 1522 are both angled relative to the integrated base 151, and they are also angled to each other. Along the Z-axis from top to bottom, the distance between the air knife 1521 and the wiper blade 1522 along the Y-axis gradually increases.

[0113] Alternatively, the liquid removal structure 152 can use only the air knife 1521, or the liquid removal structure 152 can use only the scraper 1522, as long as it can meet the liquid removal requirements.

[0114] Please see Figure 2 and Figure 3In some embodiments, the liquid removal module 150 further includes liquid baffles 154, which are spaced apart on the side of the scraper 1522 opposite to the air knife 1521, to prevent the liquid being scraped or blown from splashing to other places. Multiple liquid baffles 154 are provided and spaced apart along the Y-axis to form multiple water-blocking mechanisms. The tilt direction of the liquid baffles 154 is opposite to the tilt direction of the scraper 1522.

[0115] Furthermore, the liquid removal module 150 may also include a roller brush (not shown in the figure), which is mounted on the integrated base 151 via a mounting base and is rotatably connected to the mounting base. The roller brush is made of absorbent material and removes liquid from the wafer surface by rotating around its own axis. Liquid baffles 154 may be provided on both sides of the roller brush along the Y-axis, or only on the side of the roller brush facing away from the air knife 1521 along the Y-axis. Liquid collection grooves are provided on both sides of the roller brush along the Y-axis.

[0116] In other embodiments, the liquid removal module 150 can achieve liquid removal through the cooperation of a scraper 1522 and a roller brush, or through the cooperation of an air knife 1521 and a roller brush, or simply through at least two roller brushes spaced apart along the Y-axis. This is merely an example.

[0117] like Figure 2 and Figure 3 As shown, in some embodiments, the moving module 130 includes a first moving module 131, a second moving module 132 connected to the first moving module 131, and a support base 133 connected to the second moving module 132. An optical detection module 120 is disposed on the support base 133. The first moving module 131 drives the support base 133 to move in a first direction in a horizontal plane via the second moving module 132. The second moving module 132 drives the support base 133 to move in a second direction in a horizontal plane. The support base 133 drives the optical detection module 120 to move synchronously. The first and second directions are angled. For example, the first direction is the X-axis direction, and the second direction is the Y-axis direction. The support base 133 is fixedly connected to a slider on the second moving module 132 and is used to stably support the optical detection module 120. Both the first moving module 131 and the second moving module 132 can be linear modules. The structure of linear modules is a mature existing technology and will not be described in detail here.

[0118] In practical use, the wafer inspection mechanism 100 also includes a lifting module (not shown in the figure). The lifting module can be mounted on the support base 133 and connected to the optical inspection module 120. The lifting module is used to drive the optical inspection module 120 to move up and down along the Z-axis to adjust the distance between the optical inspection module 120 and the light-transmitting element 112. The lifting module can be driven by a lead screw or a linear motion module such as a cylinder to achieve linear movement.

[0119] The wafer inspection mechanism 100 also includes a stage 180, on which a moving module 130 is disposed. The stage 180 can install the wafer inspection mechanism 100 at a target location.

[0120] In some embodiments, the wafer inspection mechanism 100 further includes an air blowing structure (not shown in the figure), which is connected to an anti-condensation air source. The air blowing direction of the air blowing structure is towards the light-transmitting element 112 and / or the lens (i.e., objective lens 1222a) of the optical inspection module 120. In actual use, the wafer carrier 110 is supported on a support substrate and is spaced apart from the support substrate along the Z-axis direction. The air blowing structure can be an air knife, located on the side of the support substrate facing the bottom of the light-transmitting element 112, blowing air onto the bottom surface of the light-transmitting element 112. Alternatively, it can be located between the objective lens 1222a and the Z-axis direction of the light-transmitting element 112, blowing air onto the bottom surface of the light-transmitting element 112 and the top surface of the objective lens 1222a, respectively. Since the wafer carrier 110 needs to be filled with liquid to form a liquid film 1001 on the side facing the wafer, this increases the moisture content of the air surrounding the wafer inspection unit 100. Therefore, an air blowing structure is used to blow anti-condensation gas to the bottom of the light-transmitting element 112 to prevent water vapor from condensing at the bottom of the light-transmitting element 112 and the top of the objective lens 1222a, forming unevenly distributed liquids of varying sizes. This avoids problems such as unclear imaging caused by deflection of the incident light path and / or imaging light path. The anti-condensation gas source can be dry air at room temperature to reduce the moisture content of the air.

[0121] like Figure 19 As shown, in some embodiments, the wafer inspection mechanism 100 further includes an inspection chamber 170 and an air filter (not shown). At least the wafer carrier 110 and the optical inspection module 120 are disposed within the inspection chamber 170. The air filter is used to filter the gas within the inspection chamber 170 to maintain the air cleanliness within the inspection chamber 170. In actual use, the wafer inspection mechanism 100 also includes an isolation door 500. The inspection chamber 170 has an opening, and the isolation door 500 is movably disposed within the inspection chamber to block or open the opening. When optical inspection and liquid removal are required, the isolation door 500 blocks the opening. After the operation is completed, the isolation door 500 moves to open the opening, facilitating the aforementioned robotic arm to reach into the inspection chamber 170 to pick up and place wafers.

[0122] Please see Figures 19 to 22 This application also provides a wafer inspection device, including a wafer loading mechanism (not shown in the figure), a transport mechanism 300, an appearance defect inspection mechanism 400 and the aforementioned wafer inspection mechanism 100. The wafer inspection mechanism 100, the wafer loading mechanism and the appearance defect inspection mechanism 400 are arranged at intervals. The transport mechanism 300 is capable of picking up wafers and transferring them between the wafer loading mechanism, the wafer inspection mechanism 100 and the appearance defect inspection mechanism 400.

[0123] Understandably, the wafer inspection mechanism 100 primarily uses infrared light to detect internal wafer defects, i.e., the aforementioned defect detection at the wafer dicing chute, while the external defect inspection mechanism 400 primarily uses visible light to detect surface defects on the wafer's exterior. The handling mechanism 300 can be the aforementioned robotic arm. Specifically, the handling mechanism 300 includes a robotic arm 310 and a pick-up structure 320 connected to the robotic arm 310. The pick-up structure 320 is used to pick up the wafer, and the robotic arm 310 can be a multi-axis robotic arm with a 360° range of motion. In practical use, the pick-up structure 320 picks up the wafer 900 to be tested from the wafer loading mechanism and, under the action of the robotic arm 310, transports it to the transport module 140 in the wafer inspection mechanism 100. At this time, the adsorption structures 143 in the transport module 140 are spaced above the wafer carrier 110. The pick-up structure 320 can extend between the two and approach the position of the adsorption structure 143. After the adsorption structure 143 adsorbs and fixes the wafer, the pick-up structure 320 withdraws and can wait for the inspection to end or move to other stations under the action of the robotic arm 310. The lifting structure 141 drives the adsorption structure 143 to descend, so that the wafer is stably fixed on the wafer carrier 110, which is convenient for internal defect inspection using the optical inspection module 120. After the inspection is completed, the adsorption structure 143 lifts the wafer for liquid removal operation using the liquid removal module 150. Then, the pick-up structure 320 picks up the wafer and transports it to the appearance defect inspection mechanism 400 for appearance surface defect inspection.

[0124] Furthermore, it is worth emphasizing that wafer appearance defect inspection is generally performed on the front side of the wafer, which contains solder joints, wiring layers, and components. Internal wafer defect inspection requires penetration through the support medium on the back side to improve the signal-to-noise ratio. Since the wafers under test are generally stored upright (front side up) in the wafer loading mechanism, after being removed, they can be directly placed at the inspection station of the wafer inspection unit 100 and / or the appearance defect inspection unit 400 for inspection. No additional flipping operation is required for either the inspection or liquid removal process. This integrated wafer inspection equipment can effectively reduce the inspection time per wafer and increase WPH (Wafers Per Hour).

[0125] The specific structure and working principle of the appearance defect detection mechanism 400 are existing mature technologies, and will not be described in detail here.

[0126] In some embodiments, the wafer inspection equipment has a first inspection cavity 1004 and a second inspection cavity 1003 arranged at intervals. A transport mechanism 300 and an appearance defect inspection mechanism 400 are disposed in the first inspection cavity 1004, and the wafer inspection mechanism 100 is disposed in the second inspection cavity 1003. The second inspection cavity 1003 is formed by the aforementioned inspection chamber 170. That is, the appearance defect inspection mechanism 400 and the wafer inspection mechanism 100 are disposed in different inspection cavities, and the pick-up structure 320 in the transport mechanism 300 can move between the two inspection cavities to achieve wafer transport. It is understood that because the wafer inspection mechanism 100 needs to form a liquid film 1001 during inspection, the water vapor content in the air surrounding the wafer inspection mechanism 100 may be higher than the water vapor content in the air surrounding the appearance defect inspection mechanism 400. Therefore, the appearance defect inspection mechanism 400 and the wafer inspection mechanism 100 are disposed in different inspection cavities to reduce the impact of water vapor evaporating from the liquid film 1001 on the appearance defect inspection mechanism 400.

[0127] The wafer inspection equipment also includes a movable isolation door 500 located between the first inspection chamber 1004 and the second inspection chamber 1003. The isolation door 500 has a closed state and an open state. In the closed state, the first inspection chamber 1004 and the second inspection chamber 1003 are not connected. In the open state, the first inspection chamber 1004 and the second inspection chamber 1003 are connected, and the conveying mechanism 300 is used to pick up wafers and move them between the wafer loading mechanism and the wafer inspection mechanism 100, or between the wafer inspection mechanism 100 and the appearance defect inspection mechanism 400. The location where the wafer loading mechanism is installed is the loading station 201.

[0128] In practical use, the wafer inspection equipment also includes a machine base, a frame mounted on the machine base, and a baffle plate connecting the machine base and the frame. An isolation door 500 is slidably positioned between the first inspection chamber 1004 and the second inspection chamber 1003 on the baffle plate, and is equipped with a cylinder or similar structure for driving the isolation door 500 up and down. The baffle plate has an opening to facilitate communication between the first inspection chamber 1004 and the second inspection chamber 1003 when the isolation door 500 is open. When the isolation door 500 blocks the opening, it is in a closed state. The wafer inspection mechanism 100 performs internal defect inspection and post-inspection liquid removal on the wafer. During this process, because the two inspection chambers are not connected, splashed liquid during liquid removal and water vapor in the second inspection chamber 1003 will not flow into the first inspection chamber 1004, improving testing safety and stability. After the wafer inspection mechanism 100 completes its operation, the isolation door 500 can open the port, i.e., it is in the open state. The picking structure 320 of the transport module 140 extends into the second inspection cavity 1003 to take out the wafer, and can move it to the wafer loading mechanism or the appearance defect inspection mechanism 400 for appearance surface defect inspection.

[0129] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0130] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A wafer inspection mechanism, characterized in that, include: A wafer carrier (110) is provided with a light-transmitting hole (1101). A support portion (111) is provided on the outer periphery of the light-transmitting hole (1101). A light-transmitting element (112) is provided inside the light-transmitting hole (1101). The light-transmitting element (112) and the hole wall of the light-transmitting hole (1101) together form a light-transmitting medium groove (1102). The light-transmitting medium groove (1102) is used to accommodate the light-transmitting medium filled between the light-transmitting element (112) and the wafer (900) to be tested. An optical inspection module (120) is disposed below the wafer carrier (110); A moving module (130), connected to the optical detection module (120) and / or the wafer carrier (110), is used to drive at least one of the optical detection module (120) and the wafer carrier (110) to move relative to the other on a horizontal plane, so that the optical detection module (120) can detect different areas of the wafer (900) under test through the light-transmitting element (112) and the light-transmitting medium; A transport module (140) is disposed above the wafer carrier (110) for placing the wafer to be tested (900) on the wafer carrier (110) or for picking up the tested wafer away from the wafer carrier (110).

2. The wafer inspection mechanism according to claim 1, characterized in that, The wafer to be tested (900) includes a wafer body (910), a frame (920) surrounding the outer periphery of the wafer body (910), and a support medium (930) attached to the surface of the wafer body (910) and the frame (920). The support (111) is provided with a plurality of spaced adsorption holes. The support (111) adsorbs and fixes the frame (920) through each of the adsorption holes. The lateral dimensions of the light-transmitting element (112) and the lateral dimensions of the light-transmitting medium groove (1102) are adapted to the lateral dimensions of the wafer body (910).

3. The wafer inspection mechanism according to claim 1, characterized in that, The light-transmitting medium includes at least a light-transmitting liquid, and the light-transmitting medium tank (1102) is a liquid accumulation tank. The liquid accumulation tank can contain and accumulate liquid to form a liquid film (1001) that is adapted to the shape of the liquid accumulation tank and fills the light-transmitting element (112) and the wafer to be tested (900).

4. The wafer inspection mechanism according to claim 3, characterized in that, The wafer carrier (110) is also provided with a liquid filling channel (1103) communicating with the light-transmitting medium tank (1102). The liquid filling channel (1103) is used to deliver liquid to the light-transmitting medium tank (1102) to form a liquid film (1001) filling between the light-transmitting element (112) and the wafer to be tested (900).

5. The wafer inspection mechanism according to claim 4, characterized in that, The wafer carrier (110) also includes an annular protrusion (113) surrounding the outer periphery of the light-transmitting hole (1101). The annular protrusion (113) is used to tighten the support medium (930) of the wafer to be tested (900) and seal to form the liquid film (1001).

6. The wafer inspection mechanism according to claim 4, characterized in that, The wafer carrier disk (110) is further provided with a liquid return channel (1106), a liquid drain groove (1104), and an annular protrusion (113). The annular protrusion (113) surrounds the outer periphery of the light-transmitting hole (1101). The liquid drain groove (1104) is spaced around the outer periphery of the light-transmitting hole (1101) and located inside the annular protrusion (113). The liquid drain groove (1104) is provided with a liquid drain hole (1105) communicating with the liquid return channel (1106). The liquid return channel (1106) collects the liquid overflowing from the light-transmitting medium tank (1102) through the liquid drain groove (1104) to form a liquid film (1001) of a preset thickness in the light-transmitting medium tank (1102); and / or, The wafer carrier (110) is also provided with a liquid return channel (1106) communicating with the light-transmitting medium tank (1102). The liquid return channel (1106) is used to recover excess liquid in the light-transmitting medium tank (1102) so that a liquid film (1001) of a preset thickness is formed in the light-transmitting medium tank (1102).

7. The wafer inspection mechanism according to claim 6, characterized in that, The wafer inspection mechanism (100) also includes a liquid supply and return module, which is connected to the liquid filling channel (1103) and the liquid return channel (1106) respectively. The liquid supply and return module can replenish liquid to the light-transmitting medium tank (1102) to repair the liquid film (1001) during the relative movement of the optical inspection module (120) and the wafer carrier (110).

8. The wafer inspection mechanism according to claim 3, characterized in that, The wafer inspection mechanism (100) further includes a liquid removal module (150), which is arranged at intervals with the wafer carrier (110) to remove liquid from the surface of the support medium (930) of the wafer after inspection.

9. The wafer inspection mechanism according to claim 8, characterized in that, The transport module (140) can pick up the wafer to be tested (900) and move it away from the wafer carrier (110) in a vertical direction so that there is a clearance space (1401) between the wafer to be tested (900) and the wafer carrier (110). The clearance space is used for the liquid removal module (150) to extend into it for liquid removal and / or for the robot arm to pick up and place the wafer relative to the transport module (140).

10. The wafer inspection mechanism according to claim 1 or claim 8, characterized in that, The transport module (140) includes a lifting structure (141), a connecting arm (142) connected to the lifting structure (141), and an adsorption structure (143) connected to the connecting arm (142). The lifting structure (141) drives the adsorption structure (143) to move up and down in the vertical direction through the connecting arm (142).

11. The wafer inspection mechanism according to claim 8, characterized in that, The liquid removal module (150) includes an integrated base (151), a liquid removal structure (152) disposed on the integrated base (151), and a liquid collection tank. The integrated base (151) is movable relative to the transport module (140) on a horizontal plane. The liquid collection tank is disposed below or near the liquid removal structure (152) and is used to receive the liquid removed by the liquid removal structure (152). The liquid removal structure (152) includes an air knife (1521) and / or a scraper (1522).

12. The wafer inspection mechanism according to claim 1, characterized in that, The optical detection module (120) includes an illumination structure and an imaging structure. The illumination structure is used to emit illumination light to the wafer under test (900) that passes through the light-transmitting element (112) and the light-transmitting medium in sequence. The imaging structure is used to collect imaging light from the wafer under test (900) that passes through the light-transmitting medium and the light-transmitting element (112) in sequence to image the wafer under test.

13. The wafer inspection mechanism according to claim 1, characterized in that, The mobile module (130) includes a first mobile module (131), a second mobile module (132) connected to the first mobile module (131), and a support base (133) connected to the second mobile module (132). The optical detection module (120) is disposed on the support base (133). The first mobile module (131) is used to drive the support base (133) to move in a first direction in the horizontal plane through the second mobile module (132). The second mobile module (132) can drive the support base (133) to move in a second direction in the horizontal plane. The support base (133) drives the optical detection module (120) to move synchronously. The first direction and the second direction are set at an angle.

14. The wafer inspection mechanism according to claim 1 or claim 3, characterized in that, The wafer inspection mechanism (100) further includes an air blowing structure, which is connected to an anti-condensation air source. The air blowing direction of the air blowing structure is towards the light-transmitting element (112) and / or the lens of the optical inspection module (120); and / or The wafer inspection mechanism (100) further includes an inspection chamber (170) and an air filter. At least the wafer carrier (110) and the optical inspection module (120) are located in the inspection chamber (170), and the air filter is used to filter the gas in the inspection chamber (170).

15. A wafer inspection device, characterized in that, The device includes a wafer loading mechanism, a transport mechanism (300), an appearance defect detection mechanism (400), and a wafer inspection mechanism according to any one of claims 1 to 14. The wafer inspection mechanism (100), the wafer loading mechanism, and the appearance defect detection mechanism (400) are arranged at intervals. The transport mechanism (300) is capable of picking up wafers and transferring them between at least two of the wafer loading mechanism, the wafer inspection mechanism (100), and the appearance defect detection mechanism (400).

16. The wafer inspection equipment according to claim 15, characterized in that, The wafer inspection equipment has a first inspection cavity (1004) and a second inspection cavity (1003) arranged at intervals. The transport mechanism (300) and the appearance defect inspection mechanism (400) are located in the first inspection cavity (1004), and the wafer inspection mechanism (100) is located in the second inspection cavity (1003). The wafer inspection equipment also includes a movable isolation door (500) disposed between the first inspection chamber (1004) and the second inspection chamber (1003), the isolation door (500) having a closed state and an open state; In the closed state, the first detection cavity (1004) and the second detection cavity (1003) are not connected; in the open state, the first detection cavity (1004) and the second detection cavity (1003) are connected, and the conveying mechanism (300) is used to pick up the wafer and move it between the wafer loading mechanism and the wafer inspection mechanism (100), or between the wafer inspection mechanism (100) and the appearance defect inspection mechanism (400).

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