Film formation apparatus and method for a transparent conductive film

Abstract

The application relates to the transparent conductive film forming technology field and discloses a transparent conductive film forming device and method, which comprise a feeding pedestal, a storage frame, a limiting side stopper, a feeding belt, a switching stopper and a processing pedestal. The storage frame is arranged on the feeding pedestal, and multiple substrates are stacked on the inner side of the storage frame. The multiple substrates can be stacked and stored by arranging the storage frame and the limiting side stopper. The lowermost substrate is removed from the plate outlet hole. The hole height of the plate outlet hole is greater than the height of one substrate and smaller than the height of two substrates. Therefore, after the lowermost substrate is sent out by the feeding belt for a distance, the lowermost substrate can still shield and limit the second substrate below, and the multiple substrates can still be stably stacked and stored in the storage frame, so that the transparent conductive film forming device can conveniently transport and sputter and coat the multiple substrates one by one, and is convenient to use.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of transparent conductive film forming technology, and particularly to a transparent conductive film forming device and method. BACKGROUND

[0002] The transparent conductive film is a key material in the field of optoelectronics, and is widely used in touch screens, liquid crystal displays, solar cells, flexible electronic devices, etc. The existing transparent conductive film plating technology includes sputtering plating, including a sputtering source, and the sputtering source uses plasma to bombard the target material to make atoms sputter and deposit on the substrate, which has the advantages of high film forming uniformity, strong adhesion, and large-area deposition.

[0003] In the conventional sputtering plating of transparent conductive film, the substrate and the sputtering source are arranged opposite to each other in the plating space, and the target atoms or molecules are sputtered and then deposited on the substrate surface to form a thin film. However, when forming multiple transparent conductive films, the substrate needs to be continuously taken out, the transparent conductive film formed on the substrate is taken out, and the substrate is supplied again for the next transparent conductive film forming process. The continuous manual supply of the substrate consumes too much time, so the present application provides a transparent conductive film forming device and method to solve the above problems. SUMMARY

[0004] Therefore, the present application provides a transparent conductive film forming device and method to solve the technical problem that the existing transparent conductive film forming process requires continuous removal of the substrate, taking out the transparent conductive film formed on the substrate, and supplying the substrate again for the next transparent conductive film forming process, which consumes too much time.

[0005] The technical solution of the present application is as follows: The present application provides a transparent conductive film forming device, which comprises a feeding seat, a storage frame, a limiting side stop, a feeding belt, a switching stop and a processing seat, wherein,

[0006] The storage frame is arranged on the feeding seat, and a plurality of substrates are stacked on the inner side of the storage frame. One side of the storage frame is provided with a storage opening, and one end of the substrate extends out of the storage opening.

[0007] The limiting side stop is arranged on one side of the storage frame corresponding to the storage opening, and is used to limit the substrate from separating from the storage frame.

[0008] A feeding belt is rotationally arranged on the feeding pedestal, a first belt falling groove is arranged on the top of the feeding pedestal, a belt passing hole is arranged on one side of the feeding pedestal and is communicated with the first belt falling groove, the feeding belt passes through the belt passing hole and is located on the inner side of the first belt falling groove, and is used for conveying the substrate, a plate outlet hole is arranged between the adjacent two sides of the storage frame and is communicated with each other, the plate outlet hole is communicated with the storage opening and the bottom of the storage frame, and is used for allowing the substrate to pass out, the height of the substrate is H1, the hole height of the plate outlet hole is H2, H1

[0009] A switching baffle is rotationally arranged on the feeding pedestal and is located on one side of the storage frame, and is used for selectively shielding the substrate in the conveying direction of the feeding belt.

[0010] A processing pedestal is arranged on one side of the storage frame, and the feeding belt extends to the inside of the processing pedestal, and the processing pedestal is used for sputtering and coating the substrate.

[0011] On the basis of the above technical scheme, preferably, two first installation grooves are arranged on the top of the feeding pedestal, a connecting groove is arranged in the inside of the feeding pedestal and is communicated with the two first installation grooves, the switching baffles are rotationally arranged on the inner side of the first installation grooves and are rotated in the conveying direction of the feeding belt, the two switching baffles are connected through a connecting frame, the connecting frame is located on the inner side of the connecting groove, when the switching baffles are rotated, the switching baffles are rotated to be located on the inner side of the first installation groove, one side wall of the switching baffles is flush with the feeding belt, and the end of the switching baffles extends to the processing pedestal.

[0012] On the basis of the above technical scheme, preferably, the technical scheme further comprises a plurality of storage soft pads, wherein,

[0013] The plurality of storage soft pads are arranged on the inner side of the storage frame and are distributed in the height direction of the storage frame, the interval between the two storage soft pads is matched with the height of the substrate, when the substrate is stored in the inner side of the storage frame, the substrate extrudes the storage soft pad and makes the storage soft pad deform to be separated from the substrate.

[0014] On the basis of the above technical scheme, preferably, the technical scheme further comprises a first telescopic component and a supporting plate, wherein,

[0015] A connecting hole is arranged on one side of the storage frame, the connecting hole is communicated to the bottom of the storage frame, the hole height of the connecting hole is H3, H1

[0016] A first telescopic component is arranged on the feeding base, and the supporting plate is arranged on the telescopic end of the first telescopic component and located inside the connecting hole, and the supporting plate is used for lifting the substrate upwards.

[0017] On the basis of the above technical scheme, preferably, it further comprises a bottom soft pad, wherein,

[0018] The bottom soft pad is arranged inside the storage frame and located on the side of the storage frame away from the supporting plate, the bottom end of the bottom soft pad extends out of the plate hole, and the opposite sides of the bottom soft pad are attached to the two substrates.

[0019] On the basis of the above technical scheme, preferably, the top of the processing base is provided with a second belt falling groove for the feeding belt to pass through, and the top of the processing base is provided with two heaters, and the two heaters are located on the opposite sides of the second belt falling groove, and the heaters are used for heating the substrate.

[0020] On the basis of the above technical scheme, preferably, it further comprises a first side clamping plate, a second side clamping plate and a stop block, wherein,

[0021] The opposite ends of the processing base in the feeding belt conveying direction are arc-shaped ends, and the processing base is provided with a first sliding groove and a second sliding groove, the first sliding groove and the second sliding groove are arranged adjacent to each other, the second sliding groove bypasses the arc-shaped end of the processing base and is connected to the upper and lower sides of the processing base;

[0022] The first side clamping plate is in sliding connection with the first sliding groove, the second side clamping plate is in sliding connection with the second sliding groove, and the first side clamping plate and the second side clamping plate are used for clamping the substrate;

[0023] The stop block is arranged on the processing base and is used for shielding the second side clamping plate in the sliding direction of the second side clamping plate.

[0024] On the basis of the above technical scheme, preferably, it further comprises an outer box body, a coated sputtering source, a sealing cover, a cover plate and a second telescopic component, wherein,

[0025] The processing base is arranged inside the outer box body, and the opposite sides of the outer box body are provided with a first material passing hole for the feeding belt and the substrate to pass through;

[0026] The coated sputtering source is arranged inside the outer box body and located opposite to the heater, and is used for sputtering and coating the substrate on the heater;

[0027] A sealing cover is arranged between the machining seat and the top wall of the inner cavity of the outer box body, the film-coating sputtering source is located on the inner side of the sealing cover, and second material passing holes for the substrate to pass through are formed on opposite sides of the sealing cover;

[0028] A cover plate is slidingly arranged on one side of the corresponding second material passing hole of the sealing cover and is used for sliding to block the second material passing hole.

[0029] A second telescopic component is arranged in the inner part of the outer box body and is used for regulating the sliding of the cover plate.

[0030] On the basis of the above technical scheme, preferably, the device further comprises a discharging baffle and a driving roller, wherein,

[0031] The discharging baffle is arranged on the side of the outer box body away from the feeding seat, and the discharging baffle comprises a connecting part and a limiting part, the connecting part is fixedly connected with the outer box body, the side wall of the connecting part close to the feeding belt is an inclined wall, and the limiting part is arranged on the side of the connecting part away from the outer box body and is used for limiting and shielding the substrate.

[0032] The driving roller is rotatably arranged on the limiting part and is in transmission connection with the feeding belt.

[0033] The application further provides a film-coating method of a transparent conductive film, which is completed by using the film-coating device of the transparent conductive film.

[0034] S1, a plurality of substrates are stacked in the inner part of the storage frame, and the adapter baffle is regulated to rotate to shield the lowermost substrate, so that the storage treatment of the plurality of substrates is completed.

[0035] S2, the adapter baffle is regulated to rotate to be separated from the lowermost substrate, the lowermost substrate is sent out by the feeding belt and moves towards the machining seat.

[0036] S3, after the lowermost substrate is sent out to be separated from the storage frame, the adapter baffle is regulated to rotate to reset, and the adapter baffle shields the next substrate.

[0037] S4, when the substrate is conveyed to the machining seat by the feeding belt, the sputtering film-coating treatment of the substrate is carried out at the machining seat.

[0038] S5, the steps S2, S3 and S4 are repeated, and the sputtering film-coating treatment of the plurality of substrates is completed.

[0039] The film-coating device and method of the transparent conductive film have the following beneficial effects relative to the prior art:

[0040] (1) The film forming device of the transparent conductive film of the present application can stack and store multiple substrates by setting the storage frame in cooperation with the limiting side stopper. The lowermost substrate can be removed from the plate outlet hole, and the hole height of the plate outlet hole is greater than the height of one substrate and less than the height of two substrates, so that the lowermost substrate can still shield and limit the second substrate below after being sent out a distance by the feeding belt. The multiple substrates can still be stably stacked and stored inside the storage frame. The width of the feeding belt is less than the width of the substrate, so that the substrate can be shielded and limited by the switching stopper during transportation. The feeding belt is located inside the first falling slot, so that the top surface of the feeding seat can support the substrate synchronously during transportation, thereby increasing the stability of the substrate transportation, and the film forming device of the present application can conveniently transport and sputter coat multiple substrates one by one, and is convenient to use.

[0041] (2) The switching stopper shields and limits the substrate at a position after the substrate is removed a small distance, so that a gap is formed between the lowermost substrate and the second substrate below for the supporting plate. The supporting plate is pushed upward by the first telescopic member, so that the supporting plate is lifted upward to remove the substrate other than the lowermost substrate, and a gap is formed between the lowermost substrate and the second substrate below. This prevents the lowermost substrate from rubbing against the second substrate below during transportation, thereby preventing the substrate from being damaged, and is convenient to use.

[0042] (3) Multiple storage soft pads are arranged between the substrates, so that the substrates can be prevented from contacting each other during storage in the storage frame, thereby preventing the substrates from being worn during falling. The end of the substrate extends out of the storage opening, so that the limiting side stopper can position the substrate, and the substrate can be positioned at the center position for falling, so that a connection gap can be stably formed between the substrate and the storage soft pad, thereby preventing the substrate from pressing the root of the storage soft pad and causing abnormal deformation of the storage soft pad, preventing the storage soft pad from hindering the normal falling of the substrate, and being convenient to use. The bottom supporting soft pad extends out of the plate outlet hole, so that the bottom supporting soft pad can be placed between the lowermost substrate and the second substrate below in cooperation with the supporting plate, and is convenient to use. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0044] Figure 1 Right side perspective view of the film forming device for the transparent conductive film of the present application;

[0045] Figure 2 Right side perspective view of the film forming device for the transparent conductive film of the present application;

[0046] Figure 3 Right side perspective view of the film forming device for the transparent conductive film of the present application;

[0047] Figure 4 Right side perspective view of the film forming device for the transparent conductive film of the present application;

[0048] Figure 5 Right side perspective view of the film forming device for the transparent conductive film of the present application; Figure 4 Cross-sectional view of the structure at A-A shown;

[0049] Figure 6 Right side perspective view of the film forming device for the transparent conductive film of the present application;

[0050] Figure 7 Right side perspective view of the film forming device for the transparent conductive film of the present application;

[0051] Figure 8 Right side perspective view of the film forming device for the transparent conductive film of the present application;

[0052] Figure 9 Right side perspective view of the film forming device for the transparent conductive film of the present application;

[0053] Figure 10 Right side perspective view of the film forming device for the transparent conductive film of the present application;

[0054] Figure 11 Right side perspective view of the film forming device for the transparent conductive film of the present application;

[0055] In the figure: 1, feeding pedestal; 11, first falling belt groove; 12, belt passing hole; 13, first mounting groove; 131, connecting groove; 14, second mounting groove; 21, storage frame; 211, storage opening; 212, plate outlet hole; 213, connecting hole; 214, connecting gap; 22, limiting side stop frame; 3, feeding belt; 41, adapter stop frame; 42, connecting frame; 43, storage soft pad; 44, bottom support soft pad; 51, first telescopic component; 52, supporting plate; 61, processing pedestal; 611, second falling belt groove; 612, first sliding connection groove; 613, second sliding connection groove; 62, heater; 71, first side clamping plate; 72, second side clamping plate; 73, stop block; 81, outer box body; 811, first material passing hole; 82, coated sputtering source; 83, sealing cover; 831, second material passing hole; 84, cover plate; 841, connecting rod; 85, second telescopic component; 91, discharge baffle; 911, connecting part; 912, limiting part; 92, driving roller; 10, base plate. DETAILED DESCRIPTION

[0056] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0057] As Figures 1-11The film forming device of the transparent conductive film is shown, which comprises a feeding base 1, a storage frame 21, a limiting side stop 22, a feeding belt 3, a switching stop 41 and a processing base 61. The storage frame 21 is arranged on the feeding base 1, and a plurality of substrates 10 are stacked on the inner side of the storage frame 21. A storage opening 211 is formed on one side of the storage frame 21, and one end of the substrate 10 extends out of the storage opening 211. The limiting side stop 22 is arranged on one side of the corresponding storage opening 211 of the storage frame 21, and is used to limit the substrate 10 from separating from the storage frame 21. The feeding belt 3 is rotationally arranged on the feeding base 1. A first belt falling groove 11 is formed on the top of the feeding base 1, and a belt passing hole 12 is formed on one side of the feeding base 1 and is in communication with the first belt falling groove 11. The feeding belt 3 passes through the belt passing hole 12 and is located on the inner side of the first belt falling groove 11, and is used to transport the substrate 10. A plate outlet hole 212 is formed between the adjacent two sides of the storage frame 21 and is in communication with each other. The plate outlet hole 212 is in communication with the storage opening 211 and the bottom of the storage frame 21, and is used for the substrate 10 to pass out. The height of the substrate 10 is H1, the hole height of the plate outlet hole 212 is H2, H1 < H2 < 2H1, and the width of the feeding belt 3 is less than the width of the substrate 10. The switching stop 41 is rotationally arranged on the feeding base 1 and is located on one side of the storage frame 21, and is used to selectively shield the substrate 10 in the transport direction of the feeding belt 3. The processing base 61 is arranged on one side of the storage frame 21, and the feeding belt 3 extends to the inside of the processing base 61. The processing base 61 is used for sputtering and plating the substrate 10.

[0058] In specific implementation, the groove wall of the first belt falling groove 11 is misaligned with one side of the stacked substrate 10 in the height direction. One side of the feeding base 1 is provided with a first motor for driving the feeding belt 3 to rotate, and a second motor for driving the switching stop 41 to rotate. The processing base 61 is provided with a plating sputtering source 82 for sputtering and plating the substrate 10.

[0059] In the embodiment, the plurality of substrates 10 are stacked in the inside of the storage frame 21, and the switching block 41 is controlled to rotate to shield the lowermost substrate 10, and the storage process of the plurality of substrates 10 is completed. At this time, the plurality of substrates 10 are limited by the limiting side block 22, and are stably stored in the inside of the storage frame 21. The lowermost substrate 10 is not shielded by the limiting side block 22, and is moved outward by a distance under the conveying action of the feeding belt 3. At this time, the lowermost substrate 10 is not completely separated from the storage frame 21, and still supports the substrate 10 above it and is shielded by the switching block 41. The switching block 41 is controlled to rotate to be separated from the lowermost substrate 10, the lowermost substrate 10 is sent out by the feeding belt 3 and moves towards the processing seat 61. After the lowermost substrate 10 is sent out to be separated from the storage frame 21, at this time, the second substrate 10 moves downward to be attached to the feeding belt 3 and is sent out by a distance. The switching block 41 is controlled to rotate to reset, and the switching block 41 shields the next substrate 10. When the substrate 10 is conveyed to the processing seat 61 by the feeding belt 3, the sputtering and plating process of the substrate 10 is carried out at the processing seat 61. The above steps are repeated, so that the sputtering and plating process of the plurality of substrates 10 is completed one by one.

[0060] The film forming device of the transparent conductive film of the application can stack and store the plurality of substrates 10 by setting the storage frame 21 in cooperation with the limiting side block 22. The lowermost substrate 10 is moved out from the plate hole 212. The hole height of the plate hole 212 is greater than the height of one substrate 10 and less than the height of two substrates 10, so that the lowermost substrate 10 can still shield and limit the second substrate 10 below after being sent out by the feeding belt 3 for a distance. The plurality of substrates 10 can still be stably stacked and stored in the inside of the storage frame 21 in cooperation with the storage frame 21. The width of the feeding belt 3 is less than the width of the substrate 10, so that the switching block 41 can still shield and limit the substrate 10 when the feeding belt 3 conveys the substrate 10. The feeding belt 3 is located in the first falling groove 11, so that the top surface of the feeding seat 1 can support the substrate 10 at the same time when the feeding belt 3 conveys the substrate 10, thereby increasing the conveying stability of the substrate 10. Therefore, the film forming device of the application can conveniently convey and sputter and plate the plurality of substrates 10 one by one, and is convenient to use.

[0061] Preferably, the telescopic components of the application are all air cylinders.

[0062] As a preferred embodiment, the top of the feeding pedestal 1 is provided with two first installation grooves 13, and the inside of the feeding pedestal 1 is provided with a connecting groove 131 in communication with the two first installation grooves 13, the adapter blocking frame 41 is rotationally arranged at the inside of the first installation groove 13 and rotates in the conveying direction of the feeding belt 3, the two adapter blocking frames 41 are connected through the connecting frame 42, the connecting frame 42 is located at the inside of the connecting groove 131, when the adapter blocking frame 41 rotates, the adapter blocking frame 41 rotates to be located at the inside of the first installation groove 13, one side wall of the adapter blocking frame 41 is flush with the feeding belt 3, and the end of the adapter blocking frame 41 extends to the machining pedestal 61.

[0063] In this way, when the adapter blocking frame 41 rotates to be separated from the substrate 10, the adapter blocking frame 41 can be supported below the substrate 10, and after the adapter blocking frame 41 rotates, the end thereof extends to the machining pedestal 61, so that the stability of the substrate 10 conveyed between the feeding pedestal 1 and the machining pedestal 61 is improved.

[0064] As a preferred embodiment, a plurality of storage soft pads 43 are further included, wherein the plurality of storage soft pads 43 are arranged at the inside of the storage frame 21 and are distributed in the height direction of the storage frame 21, the spacing between the two storage soft pads 43 is matched with the height of the substrate 10, when the substrate 10 is stored at the inside of the storage frame 21, the substrate 10 presses the storage soft pad 43 and makes the storage soft pad 43 deform to be separated from the substrate 10.

[0065] By arranging the plurality of storage soft pads 43 between the substrates 10, the plurality of substrates 10 can be prevented from contacting each other during the stacking storage in the storage frame 21, and the abrasion of the substrate 10 during the falling process is further prevented.

[0066] Further, a first telescopic component 51 and a supporting plate 52 are further included, wherein one side of the storage frame 21 is provided with a connecting hole 213, the connecting hole 213 is communicated to the bottom of the storage frame 21, the hole height of the connecting hole 213 is H3, H1

[0067] In specific implementation, one side of the feeding pedestal 1 is provided with a second installation groove 14, and the first telescopic component 51 is arranged at the inside of the second installation groove 14.

[0068] The adapter baffle 41 is arranged at the position where the substrate 10 moves out a small distance, and the substrate 10 is shielded and positioned, so that the gap for the supporting plate 52 is formed between the lowermost substrate 10 and the second substrate 10 below, the supporting plate 52 is pushed upward by the first telescopic component 51, so that the supporting plate 52 is lifted upward to remove the substrate 10 except the lowermost substrate 10, and the gap is formed between the lowermost substrate 10 and the second substrate 10 below, which prevents the lowermost substrate 10 from rubbing against the second substrate 10 below during the conveying of the lowermost substrate 10, and the technical problem that the substrate 10 is damaged is avoided, and the use is facilitated.

[0069] The end of the substrate 10 extends out of the storage opening 211, which facilitates the positioning of the substrate 10 by the limiting side baffle 22, and facilitates the positioning of the substrate 10 at the center position, so that the connecting gap 214 can be stably formed between the substrate 10 and the storage soft pad 43, and the deformation of the storage soft pad 43 is prevented due to the extrusion of the substrate 10 to the root of the storage soft pad 43, and the normal falling of the substrate 10 is prevented by the storage soft pad 43, and the use is facilitated.

[0070] The bottom supporting soft pad 44 is also included, which is arranged inside the storage frame 21 and located on the side of the storage frame 21 away from the supporting plate 52, the bottom end of the bottom supporting soft pad 44 extends out of the plate hole 212, and the opposite sides of the bottom supporting soft pad 44 are in contact with the two substrates 10.

[0071] The bottom supporting soft pad 44 is arranged, and the end of the bottom supporting soft pad 44 extends out of the plate hole 212, so that the bottom supporting soft pad 44 can be placed between the lowermost substrate 10 and the second substrate 10 below in cooperation with the supporting plate 52, and the use is facilitated.

[0072] As a preferred embodiment, the top of the processing seat 61 is provided with a second falling belt groove 611 for the feeding belt 3 to pass through, and the top of the processing seat 61 is provided with two heaters 62, which are respectively located on the opposite sides of the second falling belt groove 611, and the heater 62 is used for heating the substrate 10.

[0073] The feeding belt 3 passes through the second falling belt groove 611, which facilitates the heating of the substrate 10 by the heater 62. The heater 62 is arranged as an extension of the feeding belt 3, and since the width of the feeding belt 3 is smaller than the width of the substrate 10, the heater 62 can heat the substrate 10 from both sides of the feeding belt 3, and the use is facilitated.

[0074] As a preferred implementation, the first side clamping plate 71, the second side clamping plate 72 and the stop block 73 are further included, wherein the machining pedestal 61 is arc-shaped at opposite ends in the conveying direction of the feeding belt 3, and the machining pedestal 61 is provided with a first sliding slot 612 and a second sliding slot 613, the first sliding slot 612 is arranged adjacent to the second sliding slot 613, the second sliding slot 613 bypasses the arc-shaped end of the machining pedestal 61 and is connected to the upper and lower sides of the machining pedestal 61; the first side clamping plate 71 is slidingly connected with the first sliding slot 612, the second side clamping plate 72 is slidingly connected with the second sliding slot 613, and the first side clamping plate 71 and the second side clamping plate 72 are used for clamping the substrate 10; the stop block 73 is arranged on the machining pedestal 61 and is used for shielding the second side clamping plate 72 in the sliding direction of the second side clamping plate 72.

[0075] In specific implementation, the number of the second side clamping plate 72 and the first side clamping plate 71 is two, and they are arranged on opposite sides of the substrate 10 respectively.

[0076] In specific implementation, the second side clamping plate 72 is located below the machining pedestal 61, so as not to hinder the movement of the substrate 10 to the heater 62. After the substrate 10 moves to the heater 62, the second side clamping plate 72 and the first side clamping plate 71 are adjusted to slide towards the substrate 10, and the clamping process of the substrate 10 is completed. By clamping the substrate 10, the stability of the position of the substrate 10 is improved, which facilitates the sputtering coating process of the substrate 10.

[0077] The first side clamping plate 71 and the second side clamping plate 72 are arranged as an extension of the feeding belt 3. Since the width of the feeding belt 3 is smaller than the width of the substrate 10, the first side clamping plate 71 and the second side clamping plate 72 can clamp the substrate 10 from four sides. By arranging the stop block 73 to shield the second side clamping plate 72, the second side clamping plate 72 can be positioned and shielded from the discharge side of the substrate 10 during the conveying process of the substrate 10, thereby facilitating clamping the substrate 10 at the sputtering coating position of the machining pedestal 61.

[0078] As a preferred implementation, it further comprises an outer box 81, a coated sputtering source 82, a sealing cover 83, a cover plate 84 and a second telescopic component 85, wherein the processing seat 61 is arranged in the inner part of the outer box 81, and the opposite sides of the outer box 81 are provided with first material passing holes 811 for the feeding belt 3 and the substrate 10 to pass through; the coated sputtering source 82 is arranged in the inner part of the outer box 81 and is opposite to the heater 62, and is used for sputtering coating on the substrate 10 on the heater 62; the sealing cover 83 is arranged between the processing seat 61 and the top wall of the inner cavity of the outer box 81, the coated sputtering source 82 is located on the inner side of the sealing cover 83, and the opposite sides of the sealing cover 83 are provided with second material passing holes 831 for the substrate 10 to pass through; the cover plate 84 is slidingly arranged on one side of the corresponding second material passing hole 831 of the sealing cover 83 and is used for sliding to block the second material passing hole 831; and the second telescopic component 85 is arranged in the inner part of the outer box 81 and is used for regulating the sliding of the cover plate 84.

[0079] In specific implementation, the two cover plates 84 are connected through connecting rods 841. In this way, only one second telescopic component 85 can be arranged to drive and process the two cover plates 84.

[0080] In specific implementation, the substrate 10 moves to the inner part of the sealing cover 83 through the first material passing hole 811 and the second material passing hole 831, is clamped by the side clamping plate, and then the cover plate 84 is regulated to move to block the second material passing hole 831 through the second telescopic component 85, so that a closed space can be formed in the inner cavity of the sealing cover 83. The closed space facilitates the vacuumization of the inner part of the sealing cover 83 and facilitates the sputtering coating of the coated sputtering source 82 in a vacuum environment, and is convenient to use.

[0081] As a preferred implementation, it further comprises a discharging baffle 91 and a driving roller 92, wherein the discharging baffle 91 is arranged on the side of the outer box 81 away from the feeding seat 1, and the discharging baffle 91 comprises a connecting part 911 and a limiting part 912, the connecting part 911 is fixedly connected with the outer box 81, the side wall of the connecting part 911 close to the feeding belt 3 is an inclined wall, the limiting part 912 is arranged on the side of the connecting part 911 away from the outer box 81 and is used for limiting and shielding the substrate 10; and the driving roller 92 is rotationally arranged on the limiting part 912 and is in transmission connection with the feeding belt 3.

[0082] The discharging baffle 91 is arranged at the discharging position of the processing seat 61 to limit the substrate 10, thereby increasing the stability of the discharging of the substrate 10. The discharging baffle 91 comprises the connecting part 911 and the limiting part 912, and the side wall of the connecting part 911 close to the feeding belt 3 is an inclined wall, which facilitates the positioning of the substrate 10 to be sent out on the feeding belt 3, and the substrate 10 after being sent out is stably shielded and limited by the limiting part 912, thereby increasing the stability of the discharging of the substrate 10 and being convenient to use.

[0083] The application further provides a film forming method of the transparent conductive film, which is completed by the film forming device of the transparent conductive film and comprises the following steps.

[0084] Step one: stack the plurality of substrates 10 in the inside of the storage frame 21, and control the adapter baffle 41 to rotate to shield the lowermost substrate 10, so as to complete the storage treatment of the plurality of substrates 10;

[0085] Step two: control the adapter baffle 41 to rotate to be separated from the lowermost substrate 10, the lowermost substrate 10 is sent out by the feeding belt 3 and moves towards the processing seat 61, at this time, the plurality of substrates 10 are limited by the limiting side baffle 22 and are stably stored in the inside of the storage frame 21, while the lowermost substrate 10 is not shielded by the limiting side baffle 22 and moves outward a distance under the conveying action of the feeding belt 3, at this time, the lowermost substrate 10 is not completely separated from the storage frame 21 and still supports the substrates 10 above it and is shielded by the adapter baffle 41;

[0086] Step three: after the lowermost substrate 10 is sent out to be separated from the storage frame 21, at this time, the second substrate 10 moves downwards to be attached to the feeding belt 3 and is sent out a distance by the feeding belt 3, the adapter baffle 41 is controlled to rotate to reset, and the adapter baffle 41 shields the next substrate 10;

[0087] Step four: when the substrate 10 is conveyed to the processing seat 61 by the feeding belt 3, the sputtering and plating film treatment of the substrate 10 is carried out at the processing seat 61;

[0088] Step five: repeat steps two, three and four to complete the sputtering and plating film treatment of the plurality of substrates 10 one by one.

[0089] The above only describes the preferred embodiments of the application and is not used to limit the application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application shall be included in the protection scope of the application.

Claims

1. A film forming apparatus of a transparent conductive film, characterized by comprising: The device comprises a feeding pedestal, a storage frame, a limiting side stop, a feeding belt, an adapter stop and a processing pedestal, wherein, The storage frame is arranged on the feeding pedestal, and a plurality of substrates are stacked on the inner side of the storage frame. One side of the storage frame is provided with a storage opening, and one end of the substrate extends out of the storage opening. The limiting side stop is arranged on one side of the storage frame corresponding to the storage opening, and is used to limit the substrate from separating from the storage frame. The feeding belt is rotatably arranged on the feeding pedestal. The top of the feeding pedestal is provided with a first belt falling groove, and one side of the feeding pedestal is provided with a belt passing hole communicating with the first belt falling groove. The feeding belt passes through the belt passing hole and is located on the inner side of the first belt falling groove, and is used to transport the substrate. Adjacent sides of the storage frame are provided with mutually communicating plate outlet holes, which communicate with the storage opening and the bottom of the storage frame, and are used for the substrate to pass out. The height of the substrate is H1, the hole height of the plate outlet hole is H2, and H1 The adapter stop is rotatably arranged on one side of the storage frame of the feeding pedestal, and is used to selectively shield the substrate in the transport direction of the feeding belt. The processing pedestal is arranged on one side of the storage frame, and the feeding belt extends to the inside of the processing pedestal. The processing pedestal is used for sputtering and coating the substrate.

2. The film forming apparatus of the transparent conductive film according to claim 1, characterized by: The top of the feeding pedestal is provided with two first mounting grooves, and the inside of the feeding pedestal is provided with a connecting groove communicating with the two first mounting grooves. The adapter stop is rotatably arranged on the inner side of the first mounting groove and rotates in the transport direction of the feeding belt. The two adapter stops are connected by a connecting frame. The connecting frame is located on the inner side of the connecting groove. When the adapter stop rotates, the adapter stop rotates to the inner side of the first mounting groove. The side wall of the adapter stop is flush with the feeding belt, and the end of the adapter stop extends to the processing pedestal.

3. The film forming apparatus of the transparent conductive film according to claim 1, characterized by: It also comprises a plurality of storage soft pads, wherein, The plurality of storage soft pads are arranged on the inner side of the storage frame and distributed in the height direction of the storage frame. The distance between the two storage soft pads is adapted to the height of the substrate. When the substrate is stored in the inner side of the storage frame, the substrate extrudes the storage soft pad, and the storage soft pad is deformed to separate from the substrate.

4. The film forming apparatus of the transparent conductive film according to claim 3, characterized by: It also comprises a first telescopic component and a supporting plate, wherein, One side of the storage frame is provided with a connecting hole, which communicates with the bottom of the storage frame. The hole height of the connecting hole is H3, and H1 The first telescopic component is arranged on the feeding pedestal, and the supporting plate is arranged on the telescopic end of the first telescopic component and located on the inner side of the connecting hole. The supporting plate is used to lift the substrate upward.

5. The film forming apparatus for a transparent conductive film according to claim 4, wherein It also comprises a bottom supporting soft pad, wherein, The bottom soft pad is arranged inside the storage frame and located on the side of the storage frame away from the supporting plate, the bottom end of the bottom soft pad extends out of the plate hole, and the opposite sides of the bottom soft pad are attached to the two base plates.

6. The film forming apparatus of the transparent conductive film according to claim 1, characterized by: The top of the processing pedestal is provided with a second belt falling groove for the feeding belt to pass through, and the top of the processing pedestal is provided with two heaters, and the two heaters are respectively located on the opposite sides of the second belt falling groove.

7. The film forming apparatus of the transparent conductive film according to claim 6, wherein Further comprising a first side clamping plate, a second side clamping plate and a stop block, The opposite ends of the processing pedestal in the conveying direction of the feeding belt are arc-shaped ends, and the processing pedestal is provided with a first sliding groove and a second sliding groove, the first sliding groove and the second sliding groove are arranged adjacent to each other, the second sliding groove bypasses the arc-shaped end of the processing pedestal and is connected to the upper and lower sides of the processing pedestal; The first side clamping plate is in sliding connection with the first sliding groove, and the second side clamping plate is in sliding connection with the second sliding groove, and the first side clamping plate and the second side clamping plate are used for clamping the substrate; The stop block is arranged on the processing pedestal and is used for shielding the second side clamping plate in the sliding direction of the second side clamping plate.

8. The film forming apparatus of the transparent conductive film according to claim 7, wherein Further comprising an outer box body, a coated sputtering source, a sealing cover, a cover plate and a second telescopic component, The processing pedestal is arranged inside the outer box body, and the opposite sides of the outer box body are provided with a first material passing hole for the feeding belt and the substrate to pass through; The coated sputtering source is arranged inside the outer box body and is located opposite to the heater, and is used for sputtering coating on the substrate on the heater; The sealing cover is arranged between the processing pedestal and the inner cavity top wall of the outer box body, the coated sputtering source is located on the inner side of the sealing cover, and the opposite sides of the sealing cover are provided with a second material passing hole for the substrate to pass through; The cover plate is slidingly arranged on one side of the sealing cover corresponding to the second material passing hole, and is used for sliding to block the second material passing hole; The second telescopic component is arranged inside the outer box body and is used for controlling the sliding of the cover plate.

9. The film forming apparatus of the transparent conductive film according to claim 8, wherein: Further comprising a discharge baffle and a driving roller, The discharge baffle is arranged on the side of the outer box body away from the feeding pedestal, and the discharge baffle comprises a connecting portion and a limiting portion, the connecting portion is fixedly connected with the outer box body, the side wall of the connecting portion close to the feeding belt is an inclined wall, and the limiting portion is arranged on the side of the connecting portion away from the outer box body and is used for limiting and shielding the substrate; The driving roller is rotatably arranged on the limiting portion and is in transmission connection with the feeding belt.

10. A film formation method of a transparent conductive film, characterized by: The transparent conductive film is formed by the film forming device of any one of claims 1 to 9, comprising the following steps: S1, stack a plurality of substrates inside the storage frame, and control the adapter block to rotate to shield the lowermost substrate, to complete the storage processing of the plurality of substrates; S2, control the adapter block to rotate to be separated from the lowermost substrate, and the lowermost substrate is sent out by the feeding belt and moves towards the processing pedestal; S3, after the lowermost substrate is sent out to be separated from the storage frame, control the adapter block to rotate to reset, and the adapter block shields the next substrate; S4, after the substrate is conveyed to the processing seat by the feeding belt, the sputtering coating treatment of the substrate is carried out at the processing seat; S5, the steps S2, S3 and S4 are repeated to complete the sputtering coating treatment of the plurality of substrates.

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