Power amplification circuit, power amplifier and radio frequency front-end module

Abstract

The invention discloses a power amplification circuit, a power amplifier and a radio frequency front-end module. The power amplification circuit comprises a power amplification module, a first inductor and a matching module. The first inductor is connected between the power supply port and the output end of the power amplification module and comprises a first sub-inductor and a second sub-inductor which are connected in series. The matching module comprises a second inductor and a first capacitor, the first end of the second inductor is connected with the output end of the power amplification module, and the second end of the second inductor is connected with the signal output port; one end of the first capacitor is connected to a common end formed by connecting the first sub-inductor and the second sub-inductor, and the other end of the first capacitor is connected to the second end of the second inductor. According to the invention, the resonant circuit for suppressing the first harmonic signal multiplexes part of the structure of the first inductor, and the equivalent inductance value of the resonant circuit for suppressing the first harmonic signal can be flexibly adjusted, so that the suppression effect on the first harmonic signal is improved.

Description

Technical Field

[0001] This application relates to the field of radio frequency technology, and more specifically, to a power amplifier circuit, a power amplifier, and a radio frequency front-end module. Background Technology

[0002] Currently, radio frequency (RF) front-end modules are widely used in wireless communication, the Internet of Things (IoT), smart homes, and other fields. They can process RF signals (e.g., power amplification, filtering, impedance matching, etc.) to complete the tasks of receiving and transmitting RF signals.

[0003] In related technologies, radio frequency front-end modules have the problem of not being able to simultaneously take into account layout area and harmonic suppression performance. Summary of the Invention

[0004] This application provides a power amplifier circuit, a power amplifier, and a radio frequency front-end module.

[0005] According to a first aspect of this application, an embodiment of this application provides a power amplifier circuit. The power amplifier circuit includes a power supply port and a signal output port, comprising a power amplifier module, a first inductor, and a matching module. The power amplifier module has an output terminal for outputting a radio frequency (RF) signal. The first inductor is connected between the power supply port and the output terminal of the power amplifier module; the first inductor includes a first sub-inductor and a second sub-inductor connected in series. The first sub-inductor is connected to the output terminal of the power amplifier module, and the second sub-inductor is connected to the power supply port. The matching module includes a second inductor and a first capacitor. A first end of the second inductor is connected to the output terminal of the power amplifier module, and a second end of the second inductor is connected to the signal output port; one end of the first capacitor is connected to a common terminal formed by the first sub-inductor and the second inductor, and the other end of the first capacitor is connected to the second end of the second inductor. The first capacitor, the second inductor, and the first sub-inductor are configured to suppress a first harmonic signal in the RF signal.

[0006] This application provides a power amplifier circuit, which includes a power amplifier module, a first inductor, and a matching module. The first inductor is connected between the power supply port and the output terminal of the power amplifier module, acting as a choke. In other words, the first inductor in this application is a choke inductor. Specifically, the first inductor includes a first sub-inductor and a second sub-inductor connected in series.

[0007] The matching module in this application includes a second inductor and a first capacitor. The first end of the second inductor is connected to the output terminal of the power amplifier module, and the second end of the second inductor is connected to the signal output port; it can be considered as a series matching inductor connected between the output terminal of the power amplifier module and the signal output port. One end of the first capacitor is connected to the common terminal formed by the connection of the first sub-inductor and the second sub-inductor, and the other end of the first capacitor is connected to the second end of the second inductor. Specifically, the first capacitor, the second inductor, and the first sub-inductor are configured to suppress the first harmonic signal in the radio frequency signal. The first harmonic signal can be a harmonic signal of any order; for example, the first harmonic signal can be a third-order harmonic signal, a fourth-order harmonic signal, etc.

[0008] Therefore, in this application, when the first capacitor and the second inductor suppress the first harmonic signal, they reuse part of the structure of the first inductor (i.e., the first sub-inductor). This allows the equivalent inductance value of the resonant circuit used to suppress the first harmonic signal to be flexibly adjusted under the action of the first sub-inductor. This enables the resonant circuit formed by the first capacitor, the second inductor, and the first sub-inductor to resonate in the specified harmonic frequency band (i.e., the signal frequency band corresponding to the first harmonic signal), thereby improving the suppression effect on the first harmonic signal and ensuring the transmission quality of the radio frequency signal.

[0009] Furthermore, in this application, the resonant circuit used to suppress the first harmonic signal reuses part of the structure of the first inductor, so that there is no need to set an additional resonant inductor on the basis of the first capacitor and the second inductor. This can reduce the hardware cost of the RF front-end module with the power amplifier circuit and also save the layout area of ​​the RF front-end module, so as to realize the miniaturization design of the RF front-end module.

[0010] According to a second aspect of this application, embodiments of this application also provide a power amplifier, which has a power supply port and a signal output port. The power amplifier includes a support member, a power amplification module, a first inductor, and a matching module. The power amplification module is disposed on the support member and has an output terminal for outputting radio frequency signals. The first inductor includes a first end, a second end, and a trace portion connected between the first and second ends and wound around the support member. The first end of the first inductor is connected to the output terminal of the power amplification module, and the second end of the first inductor is connected to the power supply port. The matching module includes a second inductor and a first capacitor. The second inductor is wound around the support member, with its first end connected to the output terminal of the power amplification module and its second end connected to the signal output port. The first capacitor is disposed on the support member, with one end connected to a designated node on the trace portion and the other end connected to the second end of the second inductor. The designated node does not coincide with either the first or second end of the first inductor. The first capacitor, the second inductor, and a portion of the first inductor are configured to suppress first harmonic signals in the radio frequency signal.

[0011] This application provides a power amplifier, which includes a support member, a power amplification module, a first inductor, and a matching module. The first inductor is connected between the power supply port and the output terminal of the power amplification module, acting as a choke. In other words, the first inductor in this application is a choke inductor.

[0012] The matching module in this application includes a second inductor and a first capacitor. The first end of the second inductor is connected to the output terminal of the power amplifier module, and the second end of the second inductor is connected to the signal output port; it can be considered as a series matching inductor connected between the output terminal of the power amplifier module and the signal output port. One end of the first capacitor is connected to a designated node on the trace of the first inductor, and the other end of the first capacitor is connected to the second end of the second inductor.

[0013] Specifically, the first inductor may include a first terminal, a second terminal, and a trace portion, with the trace portion connecting the first terminal and the second terminal. The "first terminal of the first inductor" can be understood as a portion of the structure connecting the first inductor to the output terminal of the power amplifier module; the "second terminal of the first inductor" can be understood as a portion of the structure connecting the first inductor to the power supply port; and the "trace portion" can be understood as a portion of the structure located between the first terminal and the second terminal of the first inductor. Since the designated node is located on the trace portion and does not coincide with the first terminal and the second terminal of the first inductor, one end of the first capacitor can be connected to the output terminal of the power amplifier module through a "partial first inductor".

[0014] The first capacitor, the second inductor, and a portion of the first inductor in this application are configured to suppress a first harmonic signal in a radio frequency signal. The first harmonic signal can be a harmonic signal of any order; for example, it can be a third-order harmonic signal, a fourth-order harmonic signal, etc.

[0015] Therefore, in this application, when the first capacitor and the second inductor suppress the first harmonic signal, a portion of the structure of the first inductor (i.e., the aforementioned "partial first inductor") is reused. This allows the equivalent inductance value of the resonant circuit used to suppress the first harmonic signal to be flexibly adjusted under the action of the partial first inductor. This enables the resonant circuit formed by the first capacitor, the second inductor, and the partial first inductor to resonate in the specified harmonic frequency band (i.e., the signal frequency band corresponding to the first harmonic signal), thereby improving the suppression effect on the first harmonic signal and ensuring the transmission quality of the radio frequency signal.

[0016] Furthermore, in this application, the resonant circuit used to suppress the first harmonic signal reuses part of the structure of the first inductor, so that there is no need to set an additional resonant inductor on the basis of the first capacitor and the second inductor. This can reduce the hardware cost of the power amplifier and also save the layout area of ​​the RF front-end module in which the power amplifier is configured, so as to realize its miniaturization design.

[0017] According to a third aspect of this application, embodiments of this application also provide a power amplifier chip. The power amplifier chip includes a power supply port and a signal output port, comprising a chip substrate, a power amplification module, a first inductor, and a matching module. The power amplification module is disposed on the chip substrate and has an output terminal for outputting radio frequency signals. The first inductor includes a first end, a second end, and a trace portion connected between the first and second ends and wound around the chip substrate. The first end of the first inductor is connected to the output terminal of the power amplification module, and the second end of the first inductor is connected to the power supply port. The matching module includes a second inductor and a first capacitor. The second inductor is wound around the chip substrate, with its first end connected to the output terminal of the power amplification module and its second end connected to the signal output port. The first capacitor is disposed on the chip substrate, with one end connected to a designated node on the trace portion and the other end connected to the second end of the second inductor. The designated node does not coincide with either the first or second end of the first inductor. The first capacitor, the second inductor, and a portion of the first inductor are configured to suppress first harmonic signals in the radio frequency signal.

[0018] This application provides a power amplifier chip, which includes a chip substrate, a power amplification module, a first inductor, and a matching module. The first inductor is connected between the power supply port and the output terminal of the power amplification module, acting as a choke. In other words, the first inductor in this application is a choke inductor.

[0019] The matching module in this application includes a second inductor and a first capacitor. The first end of the second inductor is connected to the output terminal of the power amplifier module, and the second end of the second inductor is connected to the signal output port; it can be considered as a series matching inductor connected between the output terminal of the power amplifier module and the signal output port. One end of the first capacitor is connected to a designated node on the trace of the first inductor, and the other end of the first capacitor is connected to the second end of the second inductor.

[0020] Specifically, the first inductor may include a first terminal, a second terminal, and a trace portion, with the trace portion connecting the first terminal and the second terminal. The "first terminal of the first inductor" can be understood as a portion of the structure connecting the first inductor to the output terminal of the power amplifier module; the "second terminal of the first inductor" can be understood as a portion of the structure connecting the first inductor to the power supply port; and the "trace portion" can be understood as a portion of the structure located between the first terminal and the second terminal of the first inductor. Since the designated node is located on the trace portion and does not coincide with the first terminal and the second terminal of the first inductor, one end of the first capacitor can be connected to the output terminal of the power amplifier module through a "partial first inductor".

[0021] The first capacitor, the second inductor, and a portion of the first inductor in this application are configured to suppress a first harmonic signal in a radio frequency signal. The first harmonic signal can be a harmonic signal of any order; for example, it can be a third-order harmonic signal, a fourth-order harmonic signal, etc.

[0022] Therefore, in this application, when the first capacitor and the second inductor suppress the first harmonic signal, a portion of the structure of the first inductor (i.e., the aforementioned "partial first inductor") is reused. This allows the equivalent inductance value of the resonant circuit used to suppress the first harmonic signal to be flexibly adjusted under the action of the partial first inductor. This enables the resonant circuit formed by the first capacitor, the second inductor, and the partial first inductor to resonate in the specified harmonic frequency band (i.e., the signal frequency band corresponding to the first harmonic signal), thereby improving the suppression effect on the first harmonic signal and ensuring the transmission quality of the radio frequency signal.

[0023] Furthermore, in this application, the resonant circuit used to suppress the first harmonic signal reuses part of the structure of the first inductor, so that there is no need to set an additional resonant inductor on the basis of the first capacitor and the second inductor. This can reduce the hardware cost of the power amplifier chip and also save the layout area of ​​the RF front-end module in which the power amplifier chip is configured, so as to realize its miniaturization design.

[0024] According to a fourth aspect of this application, embodiments of this application also provide a radio frequency (RF) front-end module. The RF front-end module includes a power supply port and a signal output port, comprising a substrate, a power amplification module, a first inductor, and a matching module. The power amplification module is disposed on the substrate and has an output terminal for outputting RF signals. The first inductor includes a first end, a second end, and a trace portion connected between the first and second ends and wound around the substrate. The first end of the first inductor is connected to the output terminal of the power amplification module, and the second end of the first inductor is connected to the power supply port. The matching module includes a second inductor and a first capacitor. The second inductor is wound around the substrate, with its first end connected to the output terminal of the power amplification module and its second end connected to the signal output port. The first capacitor is disposed on the substrate, with one end connected to a designated node on the trace portion and the other end connected to the second end of the second inductor. The designated node does not coincide with either the first or second end of the first inductor. The first capacitor, the second inductor, and a portion of the first inductor are configured to suppress first harmonic signals in the RF signal.

[0025] This application provides a radio frequency (RF) front-end module, which includes a substrate, a power amplifier module, a first inductor, and a matching module. The first inductor is connected between the power supply port and the output terminal of the power amplifier module, acting as a choke. In other words, the first inductor in this application is a choke inductor.

[0026] The matching module in this application includes a second inductor and a first capacitor. The first end of the second inductor is connected to the output terminal of the power amplifier module, and the second end of the second inductor is connected to the signal output port; it can be considered as a series matching inductor connected between the output terminal of the power amplifier module and the signal output port. One end of the first capacitor is connected to a designated node on the trace of the first inductor, and the other end of the first capacitor is connected to the second end of the second inductor.

[0027] Specifically, the first inductor may include a first terminal, a second terminal, and a trace portion, with the trace portion connecting the first terminal and the second terminal. The "first terminal of the first inductor" can be understood as a portion of the structure connecting the first inductor to the output terminal of the power amplifier module; the "second terminal of the first inductor" can be understood as a portion of the structure connecting the first inductor to the power supply port; and the "trace portion" can be understood as a portion of the structure located between the first terminal and the second terminal of the first inductor. Since the designated node is located on the trace portion and does not coincide with the first terminal and the second terminal of the first inductor, one end of the first capacitor can be connected to the output terminal of the power amplifier module through a "partial first inductor".

[0028] The first capacitor, the second inductor, and a portion of the first inductor in this application are configured to suppress a first harmonic signal in a radio frequency signal. The first harmonic signal can be a harmonic signal of any order; for example, it can be a third-order harmonic signal, a fourth-order harmonic signal, etc.

[0029] Therefore, in this application, when the first capacitor and the second inductor suppress the first harmonic signal, a portion of the structure of the first inductor (i.e., the aforementioned "partial first inductor") is reused. This allows the equivalent inductance value of the resonant circuit used to suppress the first harmonic signal to be flexibly adjusted under the action of the partial first inductor. This enables the resonant circuit formed by the first capacitor, the second inductor, and the partial first inductor to resonate in the specified harmonic frequency band (i.e., the signal frequency band corresponding to the first harmonic signal), thereby improving the suppression effect on the first harmonic signal and ensuring the transmission quality of the radio frequency signal.

[0030] Furthermore, in this application, the resonant circuit used to suppress the first harmonic signal reuses part of the structure of the first inductor, so that there is no need to set an additional resonant inductor on the basis of the first capacitor and the second inductor. This can reduce the hardware cost of the RF front-end module and also help save the layout area of ​​the RF front-end module, so as to realize its miniaturization design. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a circuit diagram of a power amplifier circuit provided in an embodiment of this application.

[0033] Figure 2 yes Figure 1 The diagram shows a simulation of the power amplifier circuit.

[0034] Figure 3 This is another circuit diagram of the power amplifier circuit provided in the embodiments of this application.

[0035] Figure 4 This is another circuit diagram of the power amplifier circuit provided in the embodiments of this application.

[0036] Figure 5 This is a schematic diagram of a power amplifier provided in an embodiment of this application.

[0037] Figure 6 yes Figure 5 A cross-sectional view of the support component in the power amplifier shown.

[0038] Figure 7 This is another schematic diagram of the power amplifier provided in the embodiments of this application.

[0039] Figure 8 This is another structural schematic diagram of the power amplifier provided in the embodiments of this application.

[0040] Figure 9 This is a schematic diagram of the power amplifier chip provided in the embodiments of this application.

[0041] Figure 10 This is a schematic diagram of the structure of the radio frequency front-end module provided in the embodiments of this application.

[0042] Figure 11 This is a structural block diagram of the electronic device provided in the embodiments of this application. Detailed Implementation

[0043] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.

[0044] This application provides a power amplifier circuit 100, which can be applied in an RF front-end module to amplify and impedance match RF signals. Please refer to... Figure 1 The power amplifier circuit 100 is provided with a power supply port 12 and a signal output port 14. The power supply port 12 is used to input the power supply voltage (Volt Current Condenser, VCC), for example, the power supply voltage VCC can be 2.5V, 3.3V, 5V, etc. The signal output port 14 is used to output the power amplified radio frequency signal.

[0045] In some possible examples, the power amplifier circuit 100 is also provided with a signal input port 16, which is used to input the radio frequency signal to be power amplified.

[0046] In this embodiment, the power amplifier circuit 100 may include a power amplifier module 20, a first inductor L1, and a matching module 30. The power amplifier module 20 has an input terminal (not shown in the figure) for inputting radio frequency signals and an output terminal 201 for outputting radio frequency signals. The input terminal of the power amplifier module 20 is connected to the signal input port 16 to amplify the input radio frequency signals.

[0047] Specifically, the power amplifier module 20 can be a single-stage amplifier circuit or a multi-stage amplifier circuit. In a multi-stage amplifier circuit, each stage can have N amplifying transistors connected in parallel, where N can be 1, 2, 4, 8, etc. The amplifying transistors can be heterojunction bipolar transistors (HBTs), metal-oxide-semiconductor field-effect transistors (MOSFETs), etc. This embodiment does not limit the implementation method of the power amplifier module 20.

[0048] In this embodiment, the first inductor L1 is connected between the power supply port 12 and the output terminal 201 of the power amplifier module 20, serving as a choke. That is, the first inductor L1 in this embodiment is a choke inductor. Specifically, the first inductor L1 may include a first sub-inductor L11 and a second sub-inductor L12 connected in series. The first sub-inductor L11 is connected to the output terminal 201 of the power amplifier module 20, and the second sub-inductor L12 is connected to the power supply port 12.

[0049] Specifically, "first sub-inductor L11" can be understood as a part of the inductor connected to the output terminal 201 of the power amplifier module 20, and "second sub-inductor L12" can be understood as another part of the inductor connected to the power supply port 12. In other words, the first sub-inductor L11 and the second sub-inductor L12 can be regarded as two parts of the first inductor L1.

[0050] It should be noted that the "output terminal 201 of the power amplifier module 20" in this embodiment is not only used to output radio frequency signals, but also serves as the power supply terminal of the power amplifier module 20, so that the power supply voltage VCC can supply power to the electronic components (e.g., amplifying transistors) in the power amplifier module 20 through this port, thereby ensuring the normal operation of the power amplifier module 20.

[0051] In this embodiment, the matching module 30 serves to perform impedance matching on the radio frequency signal output by the power amplifier module 20. The matching module 30 may include a second inductor L2 and a first capacitor C1. The first end 302 of the second inductor L2 is connected to the output terminal 201 of the power amplifier module 20, and the second end 304 of the second inductor L2 is connected to the signal output port 14. That is, the "second inductor L2" can be regarded as a series matching inductor connected between the output terminal 201 of the power amplifier module 20 and the signal output port 14.

[0052] It should be noted that "the second end 304 of the second inductor L2 is connected to the signal output port 14" can be understood as the second end 304 of the second inductor L2 being directly connected to the signal output port 14, or it can be understood as the second end 304 of the second inductor L2 being connected to the signal output port 14 through other components (e.g., matching capacitor, matching inductor, filter, RF switch, etc.). This embodiment does not limit this.

[0053] In this embodiment, one end of the first capacitor C1 is connected to the common terminal formed by the connection of the first sub-inductor L11 and the second sub-inductor L12, and the other end of the first capacitor C1 is connected to the second terminal 304 of the second inductor L2. Specifically, the first capacitor C1, the second inductor L2, and the first sub-inductor L11 are configured to suppress the first harmonic signal in the radio frequency signal. The first harmonic signal can be a harmonic signal of any order.

[0054] As an example, the first harmonic signal is a K-order harmonic signal, where K is greater than or equal to 3. For example, the first harmonic signal can be a third-order harmonic signal, a fourth-order harmonic signal, and so on. In some other possible examples, the first harmonic signal can also be a second-order harmonic signal.

[0055] It is easy to understand that the resonant circuit (tank circuit) formed by the first capacitor C1, the second inductor L2, and the first sub-inductor L11 is in a high-impedance state with respect to the first harmonic signal, and can be regarded as an open circuit, thus blocking the first harmonic signal; while it is in a low-impedance state with respect to the fundamental frequency signal in the radio frequency signal, and can be regarded as a closed circuit. Therefore, the addition of the first sub-inductor L11 and the first capacitor C1 does not affect the normal transmission of the fundamental frequency signal, and the fundamental frequency signal can pass smoothly through the resonant circuit.

[0056] It should be noted that, since the second inductor L2 in this embodiment is a series matching inductor, its inductance value is usually fixed to achieve a good matching effect for the radio frequency signal. Adjusting the inductance value of the second inductor L2 may worsen the impedance matching of the radio frequency signal. Therefore, if the first capacitor C1 is directly connected in parallel across the second inductor L2, the resonant frequency formed by the two cannot be flexibly adjusted, making it difficult to achieve a good and flexible suppression effect on the first harmonic signal.

[0057] Therefore, in this embodiment, when the first capacitor C1 and the second inductor L2 suppress the first harmonic signal, they reuse part of the structure of the first inductor L1 (that is, the first sub-inductor L11). This allows the equivalent inductance value of the resonant circuit used to suppress the first harmonic signal to be flexibly adjusted under the action of the first sub-inductor L11. This enables the resonant circuit formed by the first capacitor C1, the second inductor L2 and the first sub-inductor L11 to resonate in the specified harmonic frequency band (that is, the signal frequency band corresponding to the first harmonic signal), thereby improving the suppression effect of the first harmonic signal and ensuring the transmission quality of the radio frequency signal.

[0058] Furthermore, in this embodiment, the resonant circuit used to suppress the first harmonic signal reuses part of the structure of the first inductor L1, so that there is no need to set an additional resonant inductor on the basis of the first capacitor C1 and the second inductor L2. This can reduce the hardware cost of the RF front-end module with the power amplifier circuit 100 configured, and also help to save the layout area of ​​the RF front-end module, so as to realize the miniaturization design of the RF front-end module.

[0059] Please see Figure 2 , Figure 2 This is a simulation diagram provided in this embodiment. Curve 21 is the harmonic suppression curve corresponding to the power amplifier circuit 100 in this application. Curve 23 is the harmonic suppression curve corresponding to another scheme (a scheme in which an additional resonant inductor is added on top of the first capacitor C1 and the second inductor L2). Specifically, in the other scheme, the first capacitor C1 and the additional resonant inductor are connected in series and then connected in parallel across the second inductor L2.

[0060] from Figure 2 It is not difficult to see that curves 21 and 23 roughly overlap, indicating that even when reusing part of the structure of the first inductor L1 (i.e., replacing the additional resonant inductor with the first sub-inductor L11), the power amplifier circuit 100 can still achieve almost the same harmonic suppression effect. Furthermore, since this embodiment does not require the setting of an additional resonant inductor, it can save the layout area (load-line area) of the RF front-end module in which the power amplifier circuit 100 is configured, which is beneficial to the miniaturization design of the RF front-end module.

[0061] The specific circuit structure of the power amplifier circuit 100 is described below.

[0062] In some possible embodiments, the ratio between the inductance value of the first sub-inductor L11 and the inductance value of the first inductor L1 is greater than or equal to 0.1 and less than or equal to 0.2. For example, the ratio can be 0.1, 0.12, 0.15, 0.18, 0.2, etc. Therefore, in this embodiment, the resonant circuit used to suppress the first harmonic signal only reuses a small portion of the structure of the first inductor L1, and will not affect the normal power supply of the power amplifier module 20. Specifically, the inductance value of the first sub-inductor L11 can be greater than or equal to 0.5nH and less than or equal to 1nH. For example, the inductance value of the first sub-inductor L11 can be 0.5nH, 0.6nH, 0.8nH, 1nH, etc.

[0063] Specifically, the inductance value of the first sub-inductor L11, the capacitance value of the first capacitor C1, and the inductance value of the second inductor L2 can be determined according to the signal frequency of the first harmonic signal, but this embodiment does not limit this.

[0064] Here according to Figure 1 It is not difficult to see that, since the first capacitor C1 in this embodiment is connected between the common terminal formed by the connection of the first sub-inductor L11 and the second sub-inductor L12 and the second terminal 304 of the second inductor L2, it can also play the role of "blocking DC" to prevent the power supply voltage VCC input to the power supply port 12 from flowing to the signal output port 14, so as to ensure the normal power supply of the power amplifier module 20.

[0065] Please see Figure 3 The matching module 30 may further include a second capacitor C2. One end of the second capacitor C2 is connected to the second terminal 304 of the second inductor L2, and the other end is grounded. Specifically, the second capacitor C2 and the second inductor L2 are configured to perform impedance matching for the fundamental signal in the radio frequency signal. Figure 3 It is easy to see that the second capacitor C2 and the second inductor L2 can form an "LC-type" matching circuit to improve the transmission efficiency of radio frequency signals. This embodiment does not limit the specific value range of the second capacitor C2.

[0066] exist Figure 3 In the illustrated embodiment, the power amplifier circuit 100 may further include a third inductor L3, which is connected in series with the second capacitor C2. Specifically, one end of the second capacitor C2 is connected to the second terminal 304 of the second inductor L2, and the other end is grounded through the third inductor L3. Therefore, connecting the second capacitor C2 between the second inductor L2 and the third inductor L3 can prevent coupling between the second inductor L2 and the third inductor L3 from deteriorating the impedance matching effect for the radio frequency signal.

[0067] Specifically, the second capacitor C2 and the third inductor L3 are configured to suppress the second harmonic signal in the radio frequency signal. The second harmonic signal is an L-order harmonic signal, where L is greater than or equal to 2. For example, the second harmonic signal can be a second-order harmonic signal, a third-order harmonic signal, a fourth-order harmonic signal, etc. Specifically, the capacitance value of the second capacitor C2 and the inductance value of the third inductor L3 can be determined based on the signal frequency of the second harmonic signal; this embodiment does not limit this.

[0068] Therefore, in this embodiment, the power amplifier circuit 100 reuses the second capacitor C2 in the matching module 30 when suppressing the second harmonic signal. This reduces the hardware cost of the RF front-end module equipped with the power amplifier circuit 100 and also facilitates the miniaturization of the RF front-end module. Furthermore, the power amplifier circuit 100 in this embodiment can simultaneously suppress the first and second harmonic signals to further improve the suppression effect of harmonic signals and ensure the transmission quality of the RF signal.

[0069] In some possible embodiments, the first harmonic signal and the second harmonic signal can be the same harmonic signal, for example, both being second-order harmonic signals. The power amplifier circuit 100 can improve the suppression effect of the harmonic signal by performing dual suppression on the harmonic signal.

[0070] In some other possible embodiments, the first harmonic signal and the second harmonic signal can be different harmonic signals. For example, the first harmonic signal is a third-order harmonic signal and the second harmonic signal is a second-order harmonic signal, so that the power amplifier circuit 100 can suppress different harmonic signals.

[0071] In some possible examples, the frequency of the fundamental signal in the radio frequency signal is less than 1 GHz. For example, the frequency of the fundamental signal may be greater than or equal to 663 MHz and less than or equal to 915 MHz. In this case, the first harmonic signal is a K-order harmonic signal, the second harmonic signal is an L-order harmonic signal, where L is less than K. For example, the second harmonic signal is a second-order harmonic signal, and the first harmonic signal is a third-order harmonic signal, a fourth-order harmonic signal, and so on.

[0072] Please see Figure 4 The matching module 30 may further include a third capacitor C3 and a fourth inductor L4. The third capacitor C3 is connected in series with the second inductor L2, and the second terminal 304 of the second inductor L2 is connected to the signal output port 14 through the third capacitor C3. One end of the fourth inductor L4 is connected to the signal output port 14, and the other end is grounded. Specifically, the second capacitor C2, the second inductor L2, the third capacitor C3, and the fourth inductor L4 are configured to perform impedance matching for the fundamental frequency signal in the radio frequency signal. Figure 4It is easy to see that the second capacitor C2, the second inductor L2, the third capacitor C3, and the fourth inductor L4 can form an "LCCL type" matching circuit, which can reduce energy loss and improve the transmission efficiency of radio frequency signals through resonance compensation. This embodiment does not limit the specific value range of the third capacitor C3 and the fourth inductor L4.

[0073] It should be noted here that, Figure 4 In this design, the matching module 30 employs a second-order LPHP matching architecture. The capacitor in the LP (i.e., the second capacitor C2) can be connected in series with an inductor (i.e., the third inductor L3) to lower the resonant frequency and form a resonant circuit (trap circuit), thereby suppressing the second harmonic signal. However, it cannot effectively suppress higher-order harmonic signals (e.g., third-order harmonic signals, fourth-order harmonic signals, etc.). Therefore, to solve this technical problem, this application achieves suppression of higher-order harmonic signals by connecting a capacitor (i.e., the first capacitor C1) in parallel across the second inductor L2 and reusing part of the structure of the first inductor L1, thus ensuring the transmission quality of the radio frequency signal.

[0074] This application provides a power amplifier circuit 100, which has a power supply port 12 and a signal output port 14. The power amplifier circuit 100 may include a power amplifier module 20, a first inductor L1, and a matching module 30. The power amplifier module 20 has an output terminal 201 for outputting radio frequency signals.

[0075] In this embodiment, the first inductor L1 is connected between the power supply port 12 and the output terminal 201 of the power amplifier module 20. The matching module 30 may include a second inductor L2 and a first capacitor C1. The first end 302 of the second inductor L2 is connected to the output terminal 201 of the power amplifier module 20, and the second end 304 of the second inductor L2 is connected to the signal output port 14. One end of the first capacitor C1 is connected to the common terminal formed by the connection of the first sub-inductor L11 and the second sub-inductor L12, and the other end of the first capacitor C1 is connected to the second end 304 of the second inductor L2. Specifically, the first capacitor C1, the second inductor L2, and the first sub-inductor L11 are configured to suppress the first harmonic signal in the radio frequency signal.

[0076] In this embodiment, when the first capacitor C1 and the second inductor L2 suppress the first harmonic signal, they reuse part of the structure of the first inductor L1 (that is, the first sub-inductor L11). This allows the equivalent inductance value of the resonant circuit used to suppress the first harmonic signal to be flexibly adjusted under the action of the first sub-inductor L11. This enables the resonant circuit formed by the first capacitor C1, the second inductor L2 and the first sub-inductor L11 to resonate in the specified harmonic frequency band (that is, the signal frequency band corresponding to the first harmonic signal), thereby improving the suppression effect of the first harmonic signal and ensuring the transmission quality of the radio frequency signal.

[0077] Furthermore, in this embodiment, the resonant circuit used to suppress the first harmonic signal reuses part of the structure of the first inductor L1, so that there is no need to set an additional resonant inductor on the basis of the first capacitor C1 and the second inductor L2. This can reduce the hardware cost of the RF front-end module with the power amplifier circuit 100 configured, and also help to save the layout area of ​​the RF front-end module, so as to realize the miniaturization design of the RF front-end module.

[0078] This application embodiment also provides a power amplifier 400, which can be applied in an RF front-end module to amplify and impedance match RF signals. Specifically, the power amplifier 400 corresponds to the power amplifier circuit 100 mentioned above, wherein the power amplifier circuit 100 is a circuit architecture diagram corresponding to the power amplifier 400, and the power amplifier 400 is a hardware layout diagram corresponding to the power amplifier circuit 100.

[0079] Please see Figure 5 The power amplifier 400 is provided with a power supply port 12 and a signal output port 14. For details regarding the power supply port 12 and the signal output port 14, please refer to the specific description above in the instruction manual; further details will not be provided here. In some possible examples, the power amplifier 400 also includes a signal input port (not shown in the figure), which is used to input the radio frequency signal to be amplified.

[0080] In this embodiment, the power amplifier 400 may include a support member 50, a power amplification module 20, a first inductor L1, and a matching module 30. The support member 50 provides fixation and support for the power amplification module 20, the first inductor L1, and the matching module 30. In some possible examples, the support member 50 may be a chip substrate. In other possible examples, the support member 50 may be a substrate.

[0081] The power amplifier module 20 is disposed on the support member 50. For example, when the support member 50 is a chip substrate, the power amplifier module 20 can be integrated on the chip substrate to form at least a partial structure of the power amplifier chip; or, when the support member 50 is a substrate, the power amplifier module 20 can be integrated on the chip, which can be fixed on the substrate by wire bonding or flip-chip bonding to form at least a partial structure of the radio frequency front-end module.

[0082] Specifically, the power amplifier module 20 has an input terminal (not shown in the figure) for inputting radio frequency signals and an output terminal 201 for outputting radio frequency signals. The input terminal of the power amplifier module 20 is connected to the signal input port so that the power amplifier module 20 amplifies the input radio frequency signals. For a detailed description of the power amplifier module 20, please refer to the above-mentioned specification; it will not be repeated here.

[0083] In this embodiment, the first inductor L1 is connected between the power supply port 12 and the output terminal 201 of the power amplifier module 20, serving as a choke. That is, the first inductor L1 in this embodiment is a choke inductor. Specifically, the first inductor L1 may include a first end 601, a second end 603, and a wiring portion 610. The wiring portion 610 is connected between the first end 601 and the second end 603 and is wound around the support member 50. The first end 601 of the first inductor L1 is connected to the output terminal 201 of the power amplifier module 20, and the second end 603 of the first inductor L1 is connected to the power supply port 12.

[0084] It should be noted that the first inductor L1 is wound around the support member 50 in the form of a metal trace. The names "first end," "second end," and "trace portion" are all given for ease of description. In specific examples, there may or may not be a clear dividing line between the three structures. In some possible embodiments, the first end 601, the second end 603, and the trace portion 610 may be integrally formed structures. For example, they may be three parts at different locations on the same metal trace.

[0085] Specifically, "the first end 601 of the first inductor L1" can be understood as a part of the structure connecting the first inductor L1 to the output end 201 of the power amplifier module 20, "the second end 603 of the first inductor L1" can be understood as a part of the structure connecting the first inductor L1 to the power supply port 12, and "the wiring part 610" can be understood as a part of the structure located between the first end 601 and the second end 603 of the first inductor L1.

[0086] The matching module 30 in this embodiment may include a second inductor L2 and a first capacitor C1. The second inductor L2 is wound around the support member 50. The first end 302 of the second inductor L2 is connected to the output terminal 201 of the power amplifier module 20, and the second end 304 of the second inductor L2 is connected to the signal output port 14. That is, the second inductor L2 can be regarded as a series matching inductor connected between the output terminal 201 of the power amplifier module 20 and the signal output port 14. The first capacitor C1 is disposed on the support member 50. One end of the first capacitor C1 is connected to a designated node K on the wiring portion 610, and the other end of the first capacitor C1 is connected to the second end 304 of the second inductor L2.

[0087] Since the designated node K is located on the trace portion 610, and the designated node K does not coincide with the first end 601 and the second end 603 of the first inductor L1, one end of the first capacitor C1 can be connected to the output terminal 201 of the power amplifier module 20 through a "part of the first inductor L1". Here, the "designated node K" can be regarded as the node formed by the connection between the first capacitor C1 and the trace portion 610, that is, the connection position of the first capacitor C1 on the trace portion 610.

[0088] Specifically, a portion of the first inductor L1 can be understood as the part of the structure where the trace 610 connects the designated node K and the first end 601 of the first inductor L1. In this embodiment, the first capacitor C1, the second inductor L2, and a portion of the first inductor L1 are configured to suppress the first harmonic signal in the radio frequency signal. The first harmonic signal can be a harmonic signal of any order. In one example, the first harmonic signal is a K-order harmonic signal, where K is greater than or equal to 3. For example, the first harmonic signal can be a third-order harmonic signal, a fourth-order harmonic signal, etc. In some other possible examples, the first harmonic signal can also be a second-order harmonic signal.

[0089] Therefore, in this embodiment, when the first capacitor C1 and the second inductor L2 suppress the first harmonic signal, they reuse part of the structure of the first inductor L1 (that is, the "partial first inductor L1" mentioned above). Under the action of the partial first inductor L1, the equivalent inductance value of the resonant circuit used to suppress the first harmonic signal can be flexibly adjusted so that the resonant circuit formed by the first capacitor C1, the second inductor L2 and the partial first inductor L1 can resonate in the specified harmonic frequency band (that is, the signal frequency band corresponding to the first harmonic signal), thereby improving the suppression effect of the first harmonic signal and ensuring the transmission quality of the radio frequency signal.

[0090] Furthermore, in this application, the resonant circuit used to suppress the first harmonic signal reuses part of the structure of the first inductor L1, so that there is no need to set an additional resonant inductor on the basis of the first capacitor C1 and the second inductor L2. This can reduce the hardware cost of the power amplifier 400 and also save the layout area of ​​the RF front-end module in which the power amplifier 400 is configured, so as to realize its miniaturization design.

[0091] In some possible embodiments, the first inductor L1, the first capacitor C1, and the second inductor L2 can all be located on the same side of the power amplifier module 20, for example, on the side where the power amplifier module 20 has the output terminal 201. On the one hand, this facilitates the connection of the first inductor L1 and the second inductor L2 to the output terminal 201 of the power amplifier module 20, reducing the difficulty of wiring. On the other hand, having the first inductor L1, the first capacitor C1, and the second inductor L2 on the same side also facilitates the formation of the resonant circuit used to suppress the first harmonic signal, making the overall structure of the power amplifier 400 more compact and reasonable.

[0092] The specific structure of the power amplifier 400 is described below.

[0093] Please see Figure 6 The support member 50 may include multiple metal layers 520 stacked at intervals, which can be used to lay out the metal traces of the inductor, the primary and secondary traces of the balun, the grounding metal plate, etc. Figure 6 In this structure, the support member 50 may further include multiple dielectric layers 540, each dielectric layer 540 being disposed between two adjacent metal layers 520, serving as electrical isolation. Furthermore, metal vias may be provided on the dielectric layers 540 to enable signal transmission between two adjacent metal layers 520. Specifically, the metal layers 520 may be copper layers, aluminum layers, etc., and the dielectric layers 540 may be silicon dioxide layers, silicon nitride layers, etc.

[0094] In some possible embodiments, the first inductor L1 and the second inductor L2 are both wound on the same metal layer 520 in the form of metal traces, so that the distance between the first inductor L1 and the second inductor L2 and the metal layer used for grounding is approximately equal. This can avoid the situation where one of the inductors is too close to the metal layer used for grounding, thereby affecting the normal transmission of radio frequency signals.

[0095] Specifically, the trace width of the second inductor L2 is greater than that of the first inductor L1. In other words, in this embodiment, the second inductor L2 (series matching inductor) has a larger trace width than the first inductor L1 (choke inductor). On one hand, the larger trace width of the second inductor L2 ensures that it has a better quality factor (Q value), thereby improving the impedance matching effect for RF signals. On the other hand, since the first inductor L1, as a choke inductor, does not have a high requirement for Q value, its smaller trace width saves layout space in the support component 50.

[0096] Please refer to it again. Figure 5 In this embodiment, the routing section 610 may include a first sub-routing section 6120 and a second sub-routing section 6140 connected in series. The first sub-routing section 6120 is connected between a designated node K and a first end 601 of the first inductor L1, and the second sub-routing section 6140 is connected between the designated node K and a second end 603 of the first inductor L1. The first capacitor C1, the second inductor L2, and the first sub-routing section 6120 are configured to suppress the first harmonic signal.

[0097] It is easy to understand that, with the specified node K as the boundary, the routing section 610 can be divided into a first sub-routing section 6120 and a second sub-routing section 6140, wherein the first sub-routing section 6120 can be considered as Figure 1 The "first sub-inductor L11" and the second sub-wiring section 6140 can be considered as Figure 1 The "second sub-inductor L12" in the text.

[0098] In some possible embodiments, the ratio between the equivalent inductance of the first sub-trace portion 6120 and the inductance of the first inductor L1 is greater than or equal to 0.1 and less than or equal to 0.2. For example, the ratio could be 0.1, 0.12, 0.15, 0.18, 0.2, etc. Therefore, in this embodiment, the resonant circuit for suppressing the first harmonic signal reuses only a small portion of the structure of the first inductor L1 to avoid affecting the normal power supply of the power amplifier module 20. Specifically, the equivalent inductance of the first sub-trace portion 6120 is greater than or equal to 0.5nH and less than or equal to 1nH. For example, the equivalent inductance of the first sub-trace portion 6120 could be 0.5nH, 0.6nH, 0.8nH, 1nH, etc.

[0099] In this embodiment, the first capacitor C1 is disposed on the support member 50. For example, when the support member 50 is a chip substrate, the first capacitor C1 may include two spaced metal plates, and the two metal plates are respectively located on two different metal layers 520. Also, when the support member 50 is a substrate, the first capacitor C1 may be a surface-mounted device (SMD), and the first capacitor C1 may be mounted on the substrate to save the layout space of the substrate.

[0100] In this embodiment, the second inductor L2 may be wound around the support member 50 in the form of a metal trace. For the relevant introduction of the second inductor L2 and the first capacitor C1, reference can be made to the specific description in the foregoing text of the specification, which will not be elaborated here.

[0101] In some possible embodiments, as Figure 5 shown, the first inductor L1 and the second inductor L2 are spaced apart on the support member 50 to form a gap (not marked in the figure), and the first capacitor C1 is located within the gap. On the one hand, the first capacitor C1 being located within the gap can save the layout space of the support member 50; on the other hand, the presence of the first capacitor C1 can also increase the distance between the first inductor L1 and the second inductor L2, so as to avoid the situation that the radio frequency signal leaks to the first inductor L1 due to the too-close distance between the first inductor L1 and the second inductor L2, and to ensure the normal transmission of the radio frequency signal.

[0102] In some other possible embodiments, please refer to Figure 7 , the second inductor L2 is wound around the support member 50 to define a surrounding area Q, and the first inductor L1 is located within the surrounding area Q. Specifically, the second inductor L2 is wound at least three-quarters of a turn so that the second inductor L2 can be in a "匚" shape to define the surrounding area Q. Of course, the number of turns of the second inductor L2 can also be greater than or equal to 1, for example, one turn, three-halves turns, two turns, etc.

[0103] Therefore, in this embodiment, the first inductor L1 is arranged within the surrounding area Q defined by the second inductor L2, so that the first inductor L1 and the second inductor L2 can share the same layout area of the support member 50, which is beneficial to saving the layout space of the support member 50 and making the overall structure of the power amplifier 400 more compact and reasonable.

[0104] It should be noted here that "the first inductor L1 is located within the surrounding area Q" can be understood as that all the structures of the first inductor L1 are located within the surrounding area Q, or it can be understood as that some of the structures of the first inductor L1 are located within the surrounding area Q. This embodiment does not make a limitation on this.

[0105] In some possible embodiments, the first inductor L1 and the second inductor L2 are coupled in the same direction. "Coupling in the same direction" means that the signal flow direction in the first inductor L1 is the same as the signal flow direction in the second inductor L2. When they are coupled in the same direction, the effective inductance of the first inductor L1 is equal to the actual inductance of the first inductor L1 plus the coupling inductance (the coupling inductance is a positive value), and the effective inductance of the second inductor L2 is equal to the actual inductance of the second inductor L2 plus the coupling inductance.

[0106] Therefore, under the condition of co-directional coupling, by utilizing the coupling inductance formed by the two, the actual inductance of the first inductor L1 and the actual inductance of the second inductor L2 can be reduced. For example, if the target value of the equivalent inductance of the first inductor L1 is 5nH, the target value of the equivalent inductance of the second inductor L2 is 4nH, and the coupling inductance is 1nH, the actual inductance of the first inductor L1 only needs to be 4nH, and the actual inductance of the second inductor L2 only needs to be 3nH. This further shortens the trace length of the metal traces corresponding to the first inductor L1 and the second inductor L2, thereby further saving the layout space of the support member 50.

[0107] In some possible embodiments, the first inductor L1 is wound around the support member 50 in a first specified direction, starting from the end connected to the power supply port 12 (i.e., the second end 603). The first specified direction can be clockwise or counterclockwise. The second inductor L2 is wound around the support member 50 in a second specified direction, starting from the end connected to the output terminal 201 of the power amplifier module 20 (i.e., the first end 302). The second specified direction can also be clockwise or counterclockwise. Specifically, the second specified direction is the same as the first specified direction.

[0108] exist Figure 7 In the illustrated embodiment, both the first designated direction and the second designated direction are clockwise. Specifically, the signal in the first inductor L1 originates from the second end 603 of the first inductor L1 and flows clockwise to the first end 601 of the first inductor L1. The signal in the second inductor L2 originates from the first end 302 of the second inductor L2 and flows clockwise to the second end 304 of the second inductor L2. Therefore, in the portion between the first inductor L1 and the second inductor L2, the signal flow direction is clockwise to achieve co-directional coupling between the first inductor L1 and the second inductor L2. Of course, in some other possible examples, both the first designated direction and the second designated direction are counterclockwise, but this embodiment does not limit this.

[0109] Specifically Figure 7In the illustrated embodiment, the trace portion 610 may include a first sub-trace portion 6120 and a second sub-trace portion 6140 connected in succession. The first sub-trace portion 6120 is connected between a designated node K and a first end 601 of the first inductor L1, and the second sub-trace portion 6140 is connected between the designated node K and a second end 603 of the first inductor L1. The second sub-trace portion 6140 is spaced apart from the second inductor L2, and the second sub-trace portion 6140 and the second inductor L2 are coupled in the same direction.

[0110] In some possible embodiments, the minimum spacing L between the second sub-trace 6140 and the second inductor L2 is greater than or equal to 50 μm. For example, the minimum spacing L can be 50 μm, 60 μm, 70 μm, etc. Since the minimum spacing L is greater than or equal to 50 μm, it avoids the situation where the distance between the second sub-trace 6140 and the second inductor L2 is too close, preventing RF signal leakage to the first inductor L1, thus ensuring normal RF signal transmission. Furthermore, it also avoids the situation where the distance between the second sub-trace 6140 and the second inductor L2 is too close, leading to increased coupling and affecting the quality factor (Q value) of the second inductor L2, thus ensuring impedance matching for the RF signal.

[0111] In some possible embodiments, the minimum spacing L between the second sub-trace portion 6140 and the second inductor L2 is less than or equal to 100 μm. For example, the minimum spacing L can be 100 μm, 90 μm, 80 μm, etc. Since the minimum spacing L is less than or equal to 100 μm, the situation where the area of ​​the surrounding region Q is small due to the distance between the second sub-trace portion 6140 and the second inductor L2 is avoided. This ensures that the first inductor L1 can be smoothly wound around the surrounding region Q and has a certain trace length, thereby ensuring the choking effect on the supply voltage VCC.

[0112] Please see Figure 8 In some possible embodiments, the matching module 30 may further include a second capacitor C2. One end of the second capacitor C2 is connected to the second terminal 304 of the second inductor L2, and the other end is grounded. The second capacitor C2 and the second inductor L2 are configured to perform impedance matching for the fundamental signal in the radio frequency signal.

[0113] In some possible embodiments, the power amplifier 400 may further include a third inductor L3 (not shown in the figure), which is connected in series with the second capacitor C2. The second capacitor C2 and the third inductor L3 are configured to suppress a second harmonic signal in the radio frequency signal. The second harmonic signal is an L-order harmonic signal, where L is greater than or equal to 2. For a detailed description of the second capacitor C2, the third inductor L3, and the second harmonic signal, please refer to the above description in the specification; it will not be repeated here.

[0114] Specifically, the third inductor L3 can be wound around the support member 50 in the form of metal traces, and the second capacitor C2 is disposed on the support member 50. For example, if the support member 50 is a chip substrate, the second capacitor C2 may include two spaced-apart metal plates, which are located on two different metal layers 520. Alternatively, if the support member 50 is a substrate, the second capacitor C2 can be a surface mount device (SMD), which can be mounted on the substrate to save substrate layout space.

[0115] exist Figure 8 In the illustrated embodiment, the matching module 30 may further include a third capacitor C3 and a fourth inductor L4. The third capacitor C3 is connected in series with the second inductor L2, and the second terminal 304 of the second inductor L2 is connected to the signal output port 14 through the third capacitor C3. One end of the fourth inductor L4 is connected to the signal output port 14, and the other end is grounded. The second capacitor C2, the second inductor L2, the third capacitor C3, and the fourth inductor L4 are configured to perform impedance matching for the fundamental frequency signal in the radio frequency signal.

[0116] Specifically, the fourth inductor L4 can be wound around the support member 50 in the form of metal traces, and the third capacitor C3 is disposed on the support member 50. For example, when the support member 50 is a chip substrate, the third capacitor C3 can include two spaced-apart metal plates, which are located on two different metal layers 520. Alternatively, when the support member 50 is a substrate, the third capacitor C3 can be a surface mount device (SMD), which can be mounted on the substrate to save substrate layout space.

[0117] This application provides a power amplifier 400, which has a power supply port 12 and a signal output port 14. The power amplifier 400 may include a support member 50, a power amplification module 20, a first inductor L1, and a matching module 30. The power amplification module 20 is disposed on the support member 50 and has an output terminal 201 for outputting radio frequency signals.

[0118] In this embodiment, the first inductor L1 is connected between the power supply port 12 and the output terminal 201 of the power amplifier module 20. It may include a first end 601, a second end 603, and a wiring portion 610. The wiring portion 610 is connected between the first end 601 and the second end 603 and is wound around the support member 50. The first end 601 of the first inductor L1 is connected to the output terminal 201 of the power amplifier module 20, and the second end 603 of the first inductor L1 is connected to the power supply port 12.

[0119] The matching module 30 in this embodiment may include a second inductor L2 and a first capacitor C1. The second inductor L2 is wound around the support member 50. The first end 302 of the second inductor L2 is connected to the output end 201 of the power amplifier module 20, and the second end 304 of the second inductor L2 is connected to the signal output port 14. The first capacitor C1 is disposed on the support member 50. One end of the first capacitor C1 is connected to a designated node K on the wiring portion 610, and the other end of the first capacitor C1 is connected to the second end 304 of the second inductor L2.

[0120] Since the designated node K is located on the trace portion 610, and the designated node K does not coincide with the first end 601 and the second end 603 of the first inductor L1, one end of the first capacitor C1 can be connected to the output terminal 201 of the power amplifier module 20 through a "part of the first inductor L1". Here, the "designated node K" can be regarded as the node formed by the connection between the first capacitor C1 and the trace portion 610, that is, the connection position of the first capacitor C1 on the trace portion 610.

[0121] Specifically, a portion of the first inductor L1 can be understood as a partial structure where the trace portion 610 connects the designated node K and the first end 601 of the first inductor L1. In this embodiment, the first capacitor C1, the second inductor L2, and a portion of the first inductor L1 are configured to suppress the first harmonic signal in the radio frequency signal.

[0122] Therefore, in this embodiment, when the first capacitor C1 and the second inductor L2 suppress the first harmonic signal, they reuse part of the structure of the first inductor L1 (that is, the "partial first inductor L1" mentioned above). Under the action of the partial first inductor L1, the equivalent inductance value of the resonant circuit used to suppress the first harmonic signal can be flexibly adjusted so that the resonant circuit formed by the first capacitor C1, the second inductor L2 and the partial first inductor L1 can resonate in the specified harmonic frequency band (that is, the signal frequency band corresponding to the first harmonic signal), thereby improving the suppression effect of the first harmonic signal and ensuring the transmission quality of the radio frequency signal.

[0123] Furthermore, in this application, the resonant circuit used to suppress the first harmonic signal reuses part of the structure of the first inductor L1, so that there is no need to set an additional resonant inductor on the basis of the first capacitor C1 and the second inductor L2. This can reduce the hardware cost of the power amplifier 400 and also save the layout area of ​​the RF front-end module in which the power amplifier 400 is configured, so as to realize its miniaturization design.

[0124] This application also provides a power amplifier chip 700, which can be used in an RF front-end module to amplify and impedance match RF signals. Specifically, the power amplifier chip 700 corresponds to the power amplifier circuit 100 described above, wherein the power amplifier circuit 100 is a circuit architecture diagram corresponding to the power amplifier chip 700, and the power amplifier chip 700 is a hardware layout diagram corresponding to the power amplifier circuit 100.

[0125] Please see Figure 9 The power amplifier chip 700 has a power supply port 12 and a signal output port 14. For details regarding the power supply port 12 and the signal output port 14, please refer to the specific description above in the instruction manual; they will not be repeated here. In some possible examples, the power amplifier chip 700 also has a signal input port (not shown in the figure), which is used to input the radio frequency signal to be amplified.

[0126] In this embodiment, the power amplifier chip 700 may include a chip substrate 720, a power amplifier module 20, a first inductor L1, and a matching module 30. The chip substrate 720 provides fixation and support for the power amplifier module 20, the first inductor L1, and the matching module 30. Specifically, the chip substrate 720 refers to the base material of the power amplifier chip 700, which may be cut from a wafer. The wafer is a thin sheet made of extremely pure semiconductor materials, such as silicon (Si) or gallium arsenide (GaAs), to ensure that the power amplifier chip 700 has good thermal stability, mechanical strength, and dimensional stability.

[0127] The power amplifier module 20 is disposed on the chip substrate 720; for example, the power amplifier module 20 can be integrated on the chip substrate 720. Specifically, the power amplifier module 20 has an input terminal (not shown in the figure) for inputting radio frequency signals and an output terminal 201 for outputting radio frequency signals. The input terminal of the power amplifier module 20 is connected to the signal input port so that the power amplifier module 20 amplifies the power of the input radio frequency signals. For a detailed description of the power amplifier module 20, please refer to the above description in the instruction manual; it will not be repeated here.

[0128] In this embodiment, the first inductor L1 is connected between the power supply port 12 and the output terminal 201 of the power amplifier module 20, serving as a choke. That is, the first inductor L1 in this embodiment is a choke inductor. Specifically, the first inductor L1 may include a first end 601, a second end 603, and a trace portion 610. The trace portion 610 is connected between the first end 601 and the second end 603 and is wound around the chip substrate 720. The first end 601 of the first inductor L1 is connected to the output terminal 201 of the power amplifier module 20, and the second end 603 of the first inductor L1 is connected to the power supply port 12.

[0129] It should be noted that the first inductor L1 is wound on the chip substrate 720 in the form of a metal trace. The names "first end," "second end," and "trace portion" are all given for ease of description. In specific examples, there may or may not be a clear dividing line between the three structures. In some possible embodiments, the first end 601, the second end 603, and the trace portion 610 can be integrally formed structures. For example, they are three parts at different locations on the same metal trace.

[0130] Specifically, "the first end 601 of the first inductor L1" can be understood as a part of the structure connecting the first inductor L1 to the output end 201 of the power amplifier module 20, "the second end 603 of the first inductor L1" can be understood as a part of the structure connecting the first inductor L1 to the power supply port 12, and "the wiring part 610" can be understood as a part of the structure located between the first end 601 and the second end 603 of the first inductor L1.

[0131] The matching module 30 in this embodiment may include a second inductor L2 and a first capacitor C1. The second inductor L2 is wound on the chip substrate 720. The first end 302 of the second inductor L2 is connected to the output terminal 201 of the power amplifier module 20, and the second end 304 of the second inductor L2 is connected to the signal output port 14. That is, the second inductor L2 can be regarded as a series matching inductor connected between the output terminal 201 and the signal output port 14 of the power amplifier module 20. The first capacitor C1 is disposed on the chip substrate 720. One end of the first capacitor C1 is connected to a designated node K on the trace portion 610, and the other end of the first capacitor C1 is connected to the second end 304 of the second inductor L2.

[0132] Since the designated node K is located on the trace portion 610, and the designated node K does not coincide with the first end 601 and the second end 603 of the first inductor L1, one end of the first capacitor C1 can be connected to the output terminal 201 of the power amplifier module 20 through a "part of the first inductor L1". Here, the "designated node K" can be regarded as the node formed by the connection between the first capacitor C1 and the trace portion 610, that is, the connection position of the first capacitor C1 on the trace portion 610.

[0133] Specifically, a portion of the first inductor L1 can be understood as the part of the structure where the trace 610 connects the designated node K and the first end 601 of the first inductor L1. In this embodiment, the first capacitor C1, the second inductor L2, and a portion of the first inductor L1 are configured to suppress the first harmonic signal in the radio frequency signal. The first harmonic signal can be a harmonic signal of any order. In one example, the first harmonic signal is a K-order harmonic signal, where K is greater than or equal to 3. For example, the first harmonic signal can be a third-order harmonic signal, a fourth-order harmonic signal, etc. In some other possible examples, the first harmonic signal can also be a second-order harmonic signal.

[0134] Therefore, in this embodiment, when the first capacitor C1 and the second inductor L2 suppress the first harmonic signal, they reuse part of the structure of the first inductor L1 (that is, the "partial first inductor L1" mentioned above). Under the action of the partial first inductor L1, the equivalent inductance value of the resonant circuit used to suppress the first harmonic signal can be flexibly adjusted so that the resonant circuit formed by the first capacitor C1, the second inductor L2 and the partial first inductor L1 can resonate in the specified harmonic frequency band (that is, the signal frequency band corresponding to the first harmonic signal), thereby improving the suppression effect of the first harmonic signal and ensuring the transmission quality of the radio frequency signal.

[0135] Furthermore, in this application, the resonant circuit used to suppress the first harmonic signal reuses part of the structure of the first inductor L1, so that there is no need to set an additional resonant inductor on the basis of the first capacitor C1 and the second inductor L2. This can reduce the hardware cost of the power amplifier chip 700 and also save the layout area of ​​the RF front-end module in which the power amplifier chip 700 is configured, so as to realize its miniaturization design.

[0136] It should be noted that, without conflict, the relevant technical features of power amplifier 400 can be incorporated into the corresponding embodiments of power amplifier chip 700, and the relevant technical features of power amplifier chip 700 can also be incorporated into the corresponding embodiments of power amplifier 400. To save space in the specification, these will not be elaborated further.

[0137] This application also provides an RF front-end module 800, which is a component that integrates two or more discrete devices such as RF switches, low-noise amplifiers, filters, duplexers, and power amplifiers into a single independent module, thereby improving integration and hardware performance, and miniaturizing the size. Specifically, the RF front-end module 800 corresponds to the power amplifier circuit 100 mentioned above in the specification, wherein the power amplifier circuit 100 is the circuit architecture diagram corresponding to the RF front-end module 800, and the RF front-end module 800 is the hardware layout diagram corresponding to the power amplifier circuit 100. Of course, the RF front-end module 800 may also include other hardware modules (e.g., filters, RF switches, duplexers, etc.).

[0138] Please see Figure 10 The RF front-end module 800 is provided with a power supply port 12 and a signal output port 14. For details regarding the power supply port 12 and the signal output port 14, please refer to the specific description above in the instruction manual; they will not be repeated here. In some possible examples, the RF front-end module 800 also includes a signal input port (not shown in the figure), which is used to input the RF signal to be amplified.

[0139] In this embodiment, the RF front-end module 800 may include a substrate 810, a power amplifier module 20, a first inductor L1, and a matching module 30. The substrate 810 provides fixation and support for the power amplifier module 20, the first inductor L1, and the matching module 30. Specifically, the substrate 810 may be generally rectangular, serving to fix and support the components (e.g., the power amplifier module 20, the first inductor L1, and the matching module 30) in the RF front-end module 800. Specifically, the substrate 810 may be a copper-clad laminate. By performing hole processing, chemical copper plating, electroplating, etching, and other processes on the copper-clad laminate, circuitry can be printed on the surface of the substrate 810.

[0140] The power amplifier module 20 is disposed on the substrate 810. For example, the power amplifier module 20 can be integrated into a chip, which can be fixed on the substrate 810 using wire bonding or flip-chip bonding. Specifically, the power amplifier module 20 has an input terminal (not shown in the figure) for inputting radio frequency signals and an output terminal 201 for outputting radio frequency signals. The input terminal of the power amplifier module 20 is connected to the signal input port so that the power amplifier module 20 amplifies the power of the input radio frequency signal. For a detailed description of the power amplifier module 20, please refer to the above description in the instruction manual; it will not be repeated here.

[0141] In this embodiment, the first inductor L1 is connected between the power supply port 12 and the output terminal 201 of the power amplifier module 20, serving as a choke. That is, the first inductor L1 in this embodiment is a choke inductor. Specifically, the first inductor L1 may include a first end 601, a second end 603, and a trace portion 610. The trace portion 610 connects the first end 601 and the second end 603 and is wound around the substrate 810. The first end 601 of the first inductor L1 is connected to the output terminal 201 of the power amplifier module 20, and the second end 603 of the first inductor L1 is connected to the power supply port 12.

[0142] It should be noted that the first inductor L1 is wound on the substrate 810 in the form of a metal trace. The names "first end," "second end," and "trace portion" are all given for ease of description. In specific examples, there may or may not be a clear dividing line between the three structures. In some possible embodiments, the first end 601, the second end 603, and the trace portion 610 may be integrally formed structures. For example, they may be three parts at different locations on the same metal trace.

[0143] Specifically, "the first end 601 of the first inductor L1" can be understood as a part of the structure connecting the first inductor L1 to the output end 201 of the power amplifier module 20, "the second end 603 of the first inductor L1" can be understood as a part of the structure connecting the first inductor L1 to the power supply port 12, and "the wiring part 610" can be understood as a part of the structure located between the first end 601 and the second end 603 of the first inductor L1.

[0144] The matching module 30 in this embodiment may include a second inductor L2 and a first capacitor C1. The second inductor L2 is wound on the substrate 810. The first end 302 of the second inductor L2 is connected to the output end 201 of the power amplifier module 20, and the second end 304 of the second inductor L2 is connected to the signal output port 14. That is, the second inductor L2 can be regarded as a series matching inductor connected between the output end 201 of the power amplifier module 20 and the signal output port 14. The first capacitor C1 is disposed on the substrate 810. One end of the first capacitor C1 is connected to a designated node K on the trace portion 610, and the other end of the first capacitor C1 is connected to the second end 304 of the second inductor L2.

[0145] Since the designated node K is located on the trace portion 610, and the designated node K does not coincide with the first end 601 and the second end 603 of the first inductor L1, one end of the first capacitor C1 can be connected to the output terminal 201 of the power amplifier module 20 through a "part of the first inductor L1". Here, the "designated node K" can be regarded as the node formed by the connection between the first capacitor C1 and the trace portion 610, that is, the connection position of the first capacitor C1 on the trace portion 610.

[0146] Specifically, a portion of the first inductor L1 can be understood as the part of the structure where the trace 610 connects the designated node K and the first end 601 of the first inductor L1. In this embodiment, the first capacitor C1, the second inductor L2, and a portion of the first inductor L1 are configured to suppress the first harmonic signal in the radio frequency signal. The first harmonic signal can be a harmonic signal of any order. In one example, the first harmonic signal is a K-order harmonic signal, where K is greater than or equal to 3. For example, the first harmonic signal can be a third-order harmonic signal, a fourth-order harmonic signal, etc. In some other possible examples, the first harmonic signal can also be a second-order harmonic signal.

[0147] Therefore, in this embodiment, when the first capacitor C1 and the second inductor L2 suppress the first harmonic signal, they reuse part of the structure of the first inductor L1 (that is, the "partial first inductor L1" mentioned above). Under the action of the partial first inductor L1, the equivalent inductance value of the resonant circuit used to suppress the first harmonic signal can be flexibly adjusted so that the resonant circuit formed by the first capacitor C1, the second inductor L2 and the partial first inductor L1 can resonate in the specified harmonic frequency band (that is, the signal frequency band corresponding to the first harmonic signal), thereby improving the suppression effect of the first harmonic signal and ensuring the transmission quality of the radio frequency signal.

[0148] Furthermore, in this application, the resonant circuit used to suppress the first harmonic signal reuses part of the structure of the first inductor L1, so that there is no need to set an additional resonant inductor on the basis of the first capacitor C1 and the second inductor L2. This can reduce the hardware cost of the RF front-end module 800 and also help save the layout area of ​​the RF front-end module 800, so as to realize its miniaturized design.

[0149] It should be noted that, without conflict, the relevant technical features of the power amplifier 400 can be incorporated into the corresponding embodiment of the RF front-end module 800, and the relevant technical features of the RF front-end module 800 can also be incorporated into the corresponding embodiment of the power amplifier 400. To save space in the specification, these will not be elaborated further.

[0150] Please see Figure 11 This embodiment also provides an electronic device 900, which can be a 4G or 5G communication device such as a smartphone, tablet, or smartwatch. Specifically, the electronic device 900 may include the radio frequency front-end module 800 in the above embodiment to realize the reception and transmission of radio frequency signals.

[0151] Furthermore, with the development of 5G technology, the requirements for the performance of radio frequency front-end modules are becoming increasingly stringent. The technical solution of this application can be applied to 5G radio frequency front-end modules to improve the communication performance of 5G communication equipment.

[0152] In the specification of this application, certain words are used to refer to specific components in the specification and claims. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in name as a way to distinguish components, but use the difference in function of the components as the criterion for distinction. For example, "including" mentioned throughout the specification and claims is an open term and should be interpreted as "including but not limited to"; "substantially" means that those skilled in the art can solve the technical problem within a certain error range and basically achieve the technical effect.

[0153] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inside", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are only used to simplify the description for the convenience of describing this application, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on this application.

[0154] In this application, unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or merely surface contact. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0155] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0156] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0157] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A power amplifier circuit, characterized in that, It is equipped with a power supply port and a signal output port, including: The power amplifier module is equipped with an output terminal for outputting radio frequency signals; A first inductor is connected between the power supply port and the output terminal of the power amplifier module; the first inductor includes a first sub-inductor and a second sub-inductor connected in series, the first sub-inductor being connected to the output terminal of the power amplifier module, and the second inductor being connected to the power supply port; and The matching module includes a second inductor and a first capacitor. The first end of the second inductor is connected to the output terminal of the power amplifier module, and the second end of the second inductor is connected to the signal output port. One end of the first capacitor is connected to the common terminal formed by the connection of the first sub-inductor and the second sub-inductor, and the other end of the first capacitor is connected to the second end of the second inductor. The first capacitor, the second inductor, and the first sub-inductor are configured to suppress the first harmonic signal in the radio frequency signal.

2. The power amplifier circuit according to claim 1, characterized in that, The ratio between the inductance value of the first sub-inductor and the inductance value of the first inductor is greater than or equal to 0.1 and less than or equal to 0.

2.

3. The power amplifier circuit according to claim 1, characterized in that, The inductance value of the first sub-inductor is greater than or equal to 0.5nH and less than or equal to 1nH.

4. The power amplifier circuit according to claim 1, characterized in that, The first harmonic signal is a K-order harmonic signal, where K is greater than or equal to 3.

5. The power amplifier circuit according to any one of claims 1 to 4, characterized in that, The matching module further includes a second capacitor; one end of the second capacitor is connected to the second end of the second inductor, and the other end is grounded; The second capacitor and the second inductor are configured to perform impedance matching on the fundamental signal in the radio frequency signal.

6. The power amplifier circuit according to claim 5, characterized in that, The power amplifier circuit also includes a third inductor, which is connected in series with the second capacitor; The second capacitor and the third inductor are configured to suppress a second harmonic signal in the radio frequency signal; wherein the second harmonic signal is an L-order harmonic signal, where L is greater than or equal to 2.

7. The power amplifier circuit according to claim 6, characterized in that, The frequency of the fundamental wave signal in the radio frequency signal is less than 1 GHz; The first harmonic signal is a K-order harmonic signal, and L is less than K.

8. The power amplifier circuit according to claim 5, characterized in that, The matching module further includes a third capacitor and a fourth inductor; the third capacitor and the second inductor are connected in series, and the second end of the second inductor is connected to the signal output port through the third capacitor; one end of the fourth inductor is connected to the signal output port, and the other end is grounded; The second capacitor, the second inductor, the third capacitor, and the fourth inductor are configured to perform impedance matching on the fundamental signal in the radio frequency signal.

9. A power amplifier, characterized in that, It is equipped with a power supply port and a signal output port, including: Support components; A power amplifier module is disposed on the support member; the power amplifier module is provided with an output terminal for outputting radio frequency signals. A first inductor includes a first end, a second end, and a wiring portion, the wiring portion being connected between the first end and the second end and wound around the support member; the first end of the first inductor is connected to the output terminal of the power amplifier module, and the second end of the first inductor is connected to the power supply port; and The matching module includes a second inductor and a first capacitor. The second inductor is wound on the support member, with its first end connected to the output terminal of the power amplifier module and its second end connected to the signal output port. The first capacitor is disposed on the support member, with one end connected to a designated node on the trace portion and the other end connected to the second end of the second inductor. The designated node does not coincide with either the first or second end of the first inductor. The first capacitor, the second inductor, and a portion of the first inductor are configured to suppress the first harmonic signal in the radio frequency signal.

10. The power amplifier according to claim 9, characterized in that, Part of the first inductor is a portion of the structure in which the trace is connected between the designated node and the first end of the first inductor.

11. The power amplifier according to claim 9, characterized in that, The first harmonic signal is a K-order harmonic signal, where K is greater than or equal to 3.

12. The power amplifier according to claim 9, characterized in that, The support member comprises multiple metal layers stacked at intervals between each other; Both the first inductor and the second inductor are wound on the same metal layer in the form of metal traces, and the trace width of the second inductor is greater than the trace width of the first inductor.

13. The power amplifier according to any one of claims 9 to 12, characterized in that, The routing section includes a first sub-routing section and a second sub-routing section connected in series. The first sub-routing section is connected between the designated node and the first end of the first inductor, and the second sub-routing section is connected between the designated node and the second end of the first inductor. The first capacitor, the second inductor, and the first sub-trace portion are configured to suppress the first harmonic signal.

14. The power amplifier according to claim 13, characterized in that, The ratio between the equivalent inductance of the first sub-trace portion and the inductance of the first inductor is greater than or equal to 0.1 and less than or equal to 0.

2.

15. The power amplifier according to claim 13, characterized in that, The equivalent inductance of the first sub-trace section is greater than or equal to 0.5nH and less than or equal to 1nH.

16. The power amplifier according to any one of claims 9 to 12, characterized in that, The second inductor is wound on the support to define the surrounding area; The first inductor is located within the surrounding area.

17. The power amplifier according to claim 16, characterized in that, The first inductor and the second inductor are coupled in the same direction.

18. The power amplifier according to claim 17, characterized in that, The first inductor is wound around the support member in a first specified direction, starting from the end connected to the power supply port; wherein, the first specified direction is either clockwise or counterclockwise. The second inductor is wound around the support member in a second specified direction, starting from the end connected to the output terminal of the power amplifier module; wherein, the second specified direction is either clockwise or counterclockwise. The second specified direction is the same as the first specified direction.

19. The power amplifier according to claim 16, characterized in that, The routing section includes a first sub-routing section and a second sub-routing section connected in series. The first sub-routing section is connected between the designated node and the first end of the first inductor, and the second sub-routing section is connected between the designated node and the second end of the first inductor. The minimum spacing between the second sub-trace portion and the second inductor is greater than or equal to 50 μm; or / and the minimum spacing between the second sub-trace portion and the second inductor is less than or equal to 100 μm.

20. The power amplifier according to any one of claims 9 to 12, characterized in that, The first inductor and the second inductor are spaced apart on the support to form a gap; The first capacitor is located within the gap.

21. The power amplifier according to any one of claims 9 to 12, characterized in that, The support is a chip substrate, and the power amplifier module, the first inductor, and the matching module are disposed on the chip substrate; or, The support is a substrate, and the power amplifier module, the first inductor, and the matching module are disposed on the substrate.

22. A power amplifier chip, characterized in that, It is equipped with a power supply port and a signal output port, including: Chip substrate; A power amplifier module is disposed on the chip substrate; the power amplifier module is provided with an output terminal for outputting radio frequency signals. A first inductor includes a first end, a second end, and a trace portion, the trace portion being connected between the first end and the second end and wound around the chip substrate; the first end of the first inductor is connected to the output terminal of the power amplifier module, and the second end of the first inductor is connected to the power supply port; and The matching module includes a second inductor and a first capacitor. The second inductor is wound on the chip substrate, with a first end connected to the output terminal of the power amplifier module and a second end connected to the signal output port. The first capacitor is disposed on the chip substrate, with one end connected to a designated node on the trace portion and the other end connected to the second end of the second inductor. The designated node does not coincide with either the first or second end of the first inductor. The first capacitor, the second inductor, and a portion of the first inductor are configured to suppress the first harmonic signal in the radio frequency signal.

23. A radio frequency front-end module, characterized in that, It is equipped with a power supply port and a signal output port, including: substrate; A power amplifier module is disposed on the substrate; the power amplifier module is provided with an output terminal for outputting radio frequency signals. A first inductor includes a first end, a second end, and a trace portion, the trace portion being connected between the first end and the second end and wound around the substrate; the first end of the first inductor is connected to the output terminal of the power amplifier module, and the second end of the first inductor is connected to the power supply port; and The matching module includes a second inductor and a first capacitor. The second inductor is wound on the substrate, with a first end connected to the output terminal of the power amplifier module and a second end connected to the signal output port. The first capacitor is disposed on the substrate, with one end connected to a designated node on the trace portion and the other end connected to the second end of the second inductor. The designated node does not coincide with the first and second ends of the first inductor. The first capacitor, the second inductor, and a portion of the first inductor are configured to suppress the first harmonic signal in the radio frequency signal.

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