Chip flip-chip welding tool and semiconductor production line

Abstract

The invention provides a welding tool for chip flip-chip bonding and a semiconductor production line, and belongs to the field of semiconductor machining.The welding tool for chip flip-chip bonding comprises a centrifugal bonding pad and a positioning mechanism, and the centrifugal bonding pad is rotatably arranged at a preset position around the vertical axis of the centrifugal bonding pad; the positioning mechanism comprises a chip positioning plate and a substrate positioning plate which are both arranged on the centrifugal bonding pad, the chip positioning plate and the substrate positioning plate are arranged in a stacked mode in the radius direction away from the axis of the centrifugal bonding pad, and the opposite inner side faces of the chip positioning plate and the substrate positioning plate are provided with a chip containing groove and a circuit board containing groove respectively. A welding space is defined by the chip containing groove and the circuit board containing groove, and along with rotation of the centrifugal bonding pad, the space between the chip to be welded and the circuit board is filled with welding flux located in the welding space under the centrifugal effect. Compared with the prior art, by improving the welding tool between the chip and the substrate, the technical problem of insufficient solder filling in the existing chip flip-chip bonding process is solved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing, and more specifically, relates to a welding fixture for flip-chip bonding. This invention also relates to a semiconductor production line. Background Technology

[0002] With the development of IC integrated circuits towards lighter weight, thinner profile, smaller size, increased number of I / O terminals, and more diversified functions, traditional wire bonding technology can no longer meet the packaging requirements of high density and high performance.

[0003] Flip chip (FC) is an ideal chip bonding technology. IBM developed and used this technology as early as the 1960s. However, it wasn't until recent years that flip-chip became a commonly used packaging form in high-end devices and high-density packaging. Currently, the application scope of flip-chip packaging technology is becoming increasingly widespread, and packaging forms are becoming more diversified, leading to higher requirements for flip-chip packaging technology. At the same time, flip-chip also presents manufacturers with a series of new and severe challenges, requiring reliable support for packaging, assembly, and testing of this complex technology. Previous primary sealing technologies all involved placing the active area of ​​the chip facing upwards, away from the substrate, and bonding after bonding, such as wire bonding and tape auto-bonding (TAB). FC, on the other hand, places the active area of ​​the chip facing the substrate, achieving interconnection between the chip and the substrate through an array of solder bumps on the chip.

[0004] There are generally multiple metal films (UBR: Under Bump Metallurgy) between the chip and the substrate, specifically including an adhesive layer, a diffusion barrier layer and a wetting solder layer. (1) Adhesive layer. It has good adhesion to the aluminum layer, low contact resistance with the aluminum layer, and similar thermal expansion coefficients. Adhesive layer materials are generally selected from Cr, Ti, Ti-W, V, etc. (2) Diffusion barrier layer. It can effectively prevent the bump soldering material (including the wetting layer material) from diffusing into this layer and is not dissolved by the bump soldering material, thereby avoiding the bump soldering material from entering the Al layer and forming unfavorable intermetallic compounds. Diffusion barrier layer materials are generally selected from Ti, Ni, Cu, Pd, Ti-W, etc. (3) Wetting solder layer. It can have good wetting with the bump soldering material, has good solderability, will not form intermetallic compounds that are unfavorable to soldering, and can also protect the adhesive layer and barrier layer metal from oxidation and contamination.

[0005] Before soldering, under capillary action on the chip surface, liquid solder fills the space between the chip and the substrate from around the chip, encapsulating the bumps mentioned above. After filling, the chip and substrate are placed in a baking apparatus for baking at 130°C to solidify and shape. However, because the solder fills the space between the chip and the substrate by capillary action, as the chip surface refinement increases, the solder requires a longer capillary action time to fill the space between the chip and the substrate. Furthermore, the specific filling quality also has an adverse effect on the yield of chip packaging, which urgently needs improvement. Summary of the Invention

[0006] The purpose of this invention is to provide a welding fixture for flip-chip bonding, so as to solve the technical problem that insufficient solder filling is easily encountered in the existing flip-chip bonding process.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is: to provide a welding fixture for flip-chip bonding, comprising: Centrifugal solder pad, which is rotatable about its own vertical axis and is located at a preset position; The positioning mechanism includes a chip positioning plate and a substrate positioning plate, both disposed on the centrifugal pad. The chip positioning plate and the substrate positioning plate are stacked in a radial direction away from the axis of the centrifugal pad, and the chip positioning plate is slidably inserted into the substrate positioning plate in a first direction perpendicular to the radial line of the corresponding centrifugal pad. The chip positioning plate and the substrate positioning plate are respectively provided with a chip receiving groove and a circuit board receiving groove on their opposite inner surfaces. The chip receiving groove and the circuit board receiving groove together form a welding space. As the centrifugal pad rotates, the solder located in the welding space fills the space between the chip and the circuit board to be welded under centrifugal force.

[0008] In one feasible implementation, the chip flip-chip bonding fixture further includes a connecting mechanism, which includes a tension spring, a first limiting groove, and a second limiting groove. The first limiting groove extends along the radial line of the centrifugal pad and is located on the outer periphery of the centrifugal pad. The bottom surface of the second limiting groove is perpendicular to the radial line of the centrifugal pad. The lower surface of the substrate positioning plate is slidably adapted to the first limiting groove and the second limiting groove. The tension spring is located in the first limiting groove and extends along the radial line of the centrifugal pad. The two ends of the tension spring are respectively connected to the substrate positioning plate and the centrifugal pad. The substrate positioning plate has a first state and a second state. In the first state, the substrate positioning plate is arranged at an acute angle to the horizontal plane. In the second state, the substrate positioning plate is arranged at a right angle to the horizontal plane. The tension spring is configured to have a preload force to keep the substrate positioning plate in the first state. As the centrifugal pad rotates, the substrate positioning plate changes from the first state to the second state.

[0009] In one feasible implementation, the substrate positioning plate has a mounting groove extending along a first direction, and the outer side of the chip positioning plate is inserted and adapted to the mounting groove.

[0010] In one feasible implementation, the substrate positioning plate has a guide hole, one end of which leads to the upper surface of the substrate positioning plate and the other end communicates with the welding space.

[0011] In one feasible implementation, the chip flip-chip bonding fixture further includes a drive motor, the power output shaft of which is drivenly connected to the centrifugal bonding pad.

[0012] In one feasible implementation, the chip flip-chip bonding fixture further includes a support frame and a receiving box disposed on the support frame, the drive motor is disposed on the support frame, and the centrifugal bonding pad is disposed in the receiving box.

[0013] In one feasible implementation, the containment chamber is filled with an inert gas.

[0014] In one feasible implementation, along a direction away from the tension spring, the outer side of the substrate positioning plate is provided with a first slider and a second slider arranged sequentially at intervals. The first slider is engaged in the first limiting groove and has the degree of freedom to move along the length direction of the first limiting groove. The second slider is engaged in the second limiting groove and has the degree of freedom to move along the axial direction of the centrifugal pad.

[0015] In one feasible implementation, the connecting mechanism further includes a guide rod, which is disposed in the first limiting groove and extends along the length direction of the first limiting groove, and the tension spring is sleeved on the outer periphery of the guide rod.

[0016] Compared with existing technologies, the advantages of the chip flip-chip soldering fixture provided by this invention are as follows: First, the centrifugal pads, which can rotate around their vertical axis, provide a controllable centrifugal force source for the entire welding process. Combined with stacked chip positioning plates and substrate positioning plates that can slide and insert along a first direction (perpendicular to the radial line), the chip positioning plates and substrate positioning plates remain relatively stationary. Then, with the chip receiving grooves and circuit board receiving grooves corresponding to their inner sides, a sealed welding space is formed after enclosure. As the centrifugal pads rotate, the molten solder, driven by centrifugal force, flows continuously and directionally from the periphery of the welding space to the center, significantly improving solder filling rate and uniformity. This fundamentally solves the technical problem of insufficient solder filling leading to welding voids and poor connection reliability in high-density flip-chip soldering.

[0017] Secondly, in the connecting mechanism of this invention, the first limiting groove extends radially and provides a radial movement track for the substrate positioning plate, while the bottom surface of the second limiting groove is perpendicular to the radial line to constrain axial freedom. A tension spring provides a preload force to the substrate positioning plate in the first state (at an acute angle to the horizontal plane). As the rotation speed of the centrifugal solder pad increases, the centrifugal force overcomes the preload force of the tension spring, driving the substrate positioning plate to slide radially along the first limiting groove while being limited by the second limiting groove, smoothly transitioning from the inclined first state to the vertical second state. This dynamic adjustment process achieves initial solder distribution in the inclined state during the initial soldering phase, followed by obtaining maximum centrifugal force in the vertical state for more complete filling. This achieves the technical effect of adaptively optimizing the filling path and avoiding solder splashing, thereby solving the problem of uneven solder distribution or overflow at a single angle.

[0018] In addition, the flow-through holes provided in the substrate positioning plate can utilize centrifugal force to allow the solder to flow through the flow-through holes to the soldering parts of the substrate and the chip. At the same time, the flow-through holes can also allow residual gas at the soldering parts to be discharged during the careful soldering process, preventing bubbles or solder holes from appearing at the soldering parts due to gas accumulation and heating, thus improving the density of the solder joint.

[0019] Another object of the present invention is to provide a semiconductor production line, including the chip flip-chip bonding welding fixture described above.

[0020] Compared to existing technologies, the semiconductor production line of this invention has all the advantages of the aforementioned flip-chip bonding welding fixtures, which will not be elaborated here. In addition, by integrating any of the aforementioned flip-chip bonding welding fixtures into the semiconductor production line, making it an automated unit in the packaging process, a streamlined operation from chip picking, positioning, welding to final unloading is realized, reducing labor costs, ensuring consistent welding quality of mass-produced products, and solving the technical bottlenecks of low efficiency and large yield fluctuations in the traditional semiconductor packaging field. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings: Figure 1 A schematic diagram of the overall structure of the chip flip-chip soldering fixture provided by the present invention; Figure 2 A side view of the welding fixture for flip-chip bonding provided by the present invention; Figure 3 This is a schematic diagram of the centrifugal disc structure in the chip flip-chip soldering fixture of the present invention; Figure 4 This is a schematic diagram of the positioning mechanism in the chip flip-chip soldering fixture of the present invention; Figure 5 This is a schematic diagram showing the positional relationship between the positioning mechanism and the chip and substrate in the chip flip-chip soldering fixture of the present invention.

[0022] In the picture: 1. Centrifugal solder pads; 2. Positioning mechanism; 21. Chip positioning plate; 22. Substrate positioning plate; 221. Mounting groove; 222. Guide hole; 223. First slider; 224. Second slider; 3. Connecting mechanism; 31. Tension spring; 32. First limiting groove; 33. Second limiting groove; 4. Support frame; 5. Storage box; 6. Drive motor. Detailed Implementation

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0024] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "back" appear, indicating orientation or positional relationship, they are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0025] Furthermore, in the description of this invention, unless otherwise explicitly defined, the terms "installation," "connection," "joining," and "connector" should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention in light of the specific circumstances.

[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0027] Please refer to the following: Figures 1 to 5The present invention will now describe the chip flip-chip soldering fixture. This chip flip-chip soldering fixture includes a centrifugal pad 1 and a positioning mechanism 2. The centrifugal pad 1 is rotatably positioned at a preset position around its vertical axis. The positioning mechanism 2 includes a chip positioning plate 21 and a substrate positioning plate 22, both disposed on the centrifugal pad. The chip positioning plate 21 and the substrate positioning plate 22 are stacked along a radial direction away from the axis of the centrifugal pad 1. The chip positioning plate 21 is slidably inserted into the substrate positioning plate 22 along a first direction perpendicular to the radial line of the corresponding centrifugal pad 1. The chip receiving groove and the substrate positioning plate 22 are respectively provided with chip receiving grooves and circuit board receiving grooves on their opposite inner surfaces. The chip receiving grooves and circuit board receiving grooves together form a soldering space. As the centrifugal pad 1 rotates, the solder within the soldering space fills the space between the chip and the circuit board to be soldered under centrifugal force.

[0028] In the specific implementation process of the above embodiments, the centrifugal pad 1 is rotatable around its own vertical axis, providing a controllable centrifugal force source for the entire welding process. With the chip positioning plate 21 and the substrate positioning plate 22 stacked and slidably inserted along the first direction (perpendicular to the radial line), the chip positioning plate 21 and the substrate positioning plate 22 can remain relatively stationary. With the help of the chip receiving groove and circuit board receiving groove correspondingly arranged on the inner side of the two, a closed welding space is formed after enclosing. When the centrifugal pad 1 rotates, the molten solder flows continuously and directionally from the periphery of the welding space to the central area under the drive of centrifugal force, which significantly improves the solder filling rate and uniformity, and fundamentally solves the technical problem of welding voids and poor connection reliability caused by insufficient solder filling in high-density flip soldering.

[0029] In addition, the positioning mechanism 2 can be a plurality of units evenly arranged around the axis of the centrifugal pad 1. Each positioning mechanism 2 can be used to fix the chip and the substrate, thereby improving the positioning and welding efficiency of the chip and the substrate.

[0030] Based on the above embodiments, a preferred embodiment is proposed. The chip flip-chip bonding fixture further includes a connecting mechanism 3. The connecting mechanism 3 includes a tension spring 31, a first limiting groove 32, and a second limiting groove 33. The first limiting groove 32 extends along the radial line of the centrifugal pad 1 and is located on the outer periphery of the centrifugal pad 1. The bottom surface of the second limiting groove 33 is perpendicular to the radial line of the centrifugal pad 1. The lower surface of the substrate positioning plate 22 is slidably adapted to the first limiting groove 32 and the second limiting groove 33. The tension spring 31 is located on the first limiting groove 32. The slot 32 extends radially along the centrifugal pad 1. The two ends of the tension spring 31 are connected to the substrate positioning plate 22 and the centrifugal pad 1, respectively. The substrate positioning plate 22 has a first state and a second state. In the first state, the substrate positioning plate 22 is arranged at an acute angle to the horizontal plane. In the second state, the substrate positioning plate 22 is arranged at a right angle to the horizontal plane. The tension spring 31 is configured to have a preload force to keep the substrate positioning plate 22 in the first state. As the centrifugal pad 1 rotates, the substrate positioning plate 22 changes from the first state to the second state.

[0031] Compared to existing technologies, in this embodiment, during specific implementation, the first limiting groove 32 extends radially and provides a radial movement track for the substrate positioning plate 22, while the bottom surface of the second limiting groove 33 is perpendicular to the radial line to constrain axial freedom. The tension spring 31 applies a preload force to the substrate positioning plate 22 towards the first state (at an acute angle to the horizontal plane). As the rotational speed of the centrifugal solder pad 1 increases, the centrifugal force overcomes the preload force of the tension spring 31, driving the substrate positioning plate 22 to slide radially along the first limiting groove 32 while being limited by the second limiting groove 33, smoothly transitioning from the inclined first state to the vertical second state. This dynamic adjustment process achieves initial solder distribution in the inclined state during the initial soldering phase, followed by maximum centrifugal force in the vertical state for more complete filling, achieving the technical effect of adaptively optimizing the filling path and avoiding solder splashing. This solves the problem of uneven solder distribution or overflow at a single angle. Furthermore, after the solder filling is completed, as the centrifugal mechanism speed decreases, the substrate positioning plate 22 returns to the first state, and the positions of the chip positioning plate 21 and the substrate positioning plate 22 are relatively stable, so that the chip and substrate in a stable state can be cured at high temperature (130°C) during the soldering process.

[0032] Based on the above embodiments, a preferred implementation is proposed. The substrate positioning plate 22 has a mounting groove 221 extending along a first direction. The outer side of the chip positioning plate 21 is inserted and fitted into the mounting groove 221. This structure enables the chip positioning plate 21 to slide and position precisely on a fixed track, ensuring that the chip and substrate remain aligned during assembly and welding. This fit improves assembly accuracy, reduces human adjustment errors, and helps solve welding defects such as short circuits and bridging caused by alignment deviations.

[0033] Based on the above embodiments, a preferred embodiment is proposed. The substrate positioning plate 22 has a flow-guiding hole 222. One end of the flow-guiding hole 222 leads to the upper surface of the substrate positioning plate 22, and the other end communicates with the welding space. It should be noted that the solder enters the edge area corresponding to the chip and the substrate through the flow-guiding hole 222. Under the centrifugal action of the centrifugal pad 1, the solder flows through the flow-guiding hole 222 to the welding area of ​​the substrate and the chip. At the same time, the flow-guiding hole 222 can also realize the discharge of residual gas at the welding area during careful welding, preventing bubbles or welding holes from appearing at the welding area due to gas accumulation and heating, and improving the density of the solder joint.

[0034] Based on the above embodiments, a preferred embodiment is proposed. The welding fixture for flip-chip bonding also includes a drive motor 6. The power output shaft of the drive motor 6 is connected to the centrifugal pad 1 to achieve precise control of the rotation speed of the centrifugal pad 1. This combination allows the welding process to be carried out under the optimal speed curve, achieving the technical effect of precise matching between the centrifugal force and the welding process requirements.

[0035] Based on the above embodiments, a preferred implementation is proposed. The chip flip-chip bonding fixture further includes a support frame 4 and a housing 5 disposed on the support frame 4. The drive motor 6 is disposed on the support frame 4, and the centrifugal bonding pad 1 is disposed inside the housing 5. In this embodiment, the support frame 4 provides a stable foundation and mounts the drive motor 6 on it. At the same time, the entire centrifugal bonding pad 1 is encapsulated inside the housing 5, achieving structural rigidity, operational stability, and process protection for the fixture. This arrangement achieves the technical effects of dust prevention, vibration reduction, ease of integration, and maintenance, which helps to solve the problems of precision welding processes being susceptible to environmental interference and difficult to integrate into automated production lines.

[0036] Based on the above embodiments, a preferred implementation is proposed, wherein the containment chamber 5 is filled with an inert gas (such as nitrogen), and the temperature of the inert gas can be controlled at the welding temperature to provide a curing temperature for the welding of the chip and the substrate. Compared with the prior art, this embodiment provides an oxygen-free protective environment for the entire welding space. This measure effectively isolates oxygen during high-temperature centrifugal welding, prevents oxidation of the solder and welding surface, and achieves the technical effect of significantly improving the wettability and connection strength of the solder joint, which is beneficial to solving long-term reliability problems such as poor solder joint strength caused by oxidation.

[0037] Based on the above embodiments, a preferred implementation is proposed. Along the direction away from the tension spring 31, the outer side of the substrate positioning plate 22 is provided with a first slider 223 and a second slider 224 arranged sequentially at intervals. The first slider 223 is engaged in the first limiting groove 32 and has the degree of freedom to move along the length direction of the first limiting groove 32. The second slider 224 is engaged in the second limiting groove 33 and has the degree of freedom to move along the axis of the centrifugal solder pad 1. In this embodiment, the first slider 223 and the second slider 224 are respectively engaged in the radial first limiting groove 32 and the axial second limiting groove 33, forming a dual-degree-of-freedom constraint system. Under the action of centrifugal force, the first slider 223 slides along the radial groove to determine the tilt angle, and the second slider 224 moves in the axial groove to prevent uncontrollable displacement of the board. The two work together to achieve a smooth and precise attitude change of the substrate positioning plate 22, achieving the technical effect of controllable motion trajectory and stable operation. After the attitude adjustment, the substrate positioning plate 22 and the chip positioning plate 21 can better utilize centrifugal force to fully fill the solder.

[0038] Based on the above embodiments, a preferred embodiment is proposed. The connecting mechanism 3 further includes a guide rod, which is disposed within the first limiting groove 32 and extends along the length direction of the first limiting groove 32. A tension spring 31 is sleeved on the outer periphery of the guide rod. This structure provides rigid guidance and support to prevent lateral bending of the tension spring 31 during its extension and retraction. This cooperation enables the linear application and release of preload, making the state transition process of the base plate positioning plate 22 smoother and more precise. This achieves the technical effect of improving the mechanical response accuracy and durability of the system, and helps to solve the control inaccuracy problem caused by disordered deformation of the spring.

[0039] Based on the same inventive concept, another objective of this invention is to provide a semiconductor production line that includes the chip flip-chip bonding fixture described above.

[0040] Compared to existing technologies, the semiconductor production line of this invention has all the advantages of the aforementioned flip-chip bonding welding fixtures, which will not be elaborated here. In addition, by integrating any of the aforementioned flip-chip bonding welding fixtures into the semiconductor production line, making it an automated unit in the packaging process, a streamlined operation from chip picking, positioning, welding to final unloading is realized, reducing labor costs, ensuring consistent welding quality of mass-produced products, and solving the technical bottlenecks of low efficiency and large yield fluctuations in the traditional semiconductor packaging field.

[0041] In summary, compared with existing technologies, this flip-chip soldering fixture generates controllable centrifugal force through the rotation of the centrifugal pad 1 around a vertical axis. Combined with the stacked chip positioning plate 21 and substrate positioning plate 22, which can slide and insert along a first direction, the chip receiving groove and circuit board receiving groove on their inner sides form a sealed soldering space. This allows the molten solder to continuously and directionally flow from the periphery to the center under centrifugal force, significantly improving filling uniformity and efficiency, and fundamentally solving the problems of solder voids and unreliable connections that are common in traditional processes. Its connection mechanism 3, through the cooperation of the tension spring 31, the first limiting groove 32, and the second limiting groove 33, allows the substrate positioning plate 22 to smoothly transition from a tilted first state to a vertical second state under centrifugal force, adaptively optimizing the solder flow path and avoiding uneven distribution and spatter. The mounting groove 221 on the substrate positioning plate 22 precisely inserts into the chip positioning plate 21, ensuring accurate alignment of the chip and substrate and reducing the risk of short circuits; the guide hole 222 effectively discharges gas, eliminating bubbles and improving solder joint density. The drive motor 6 provides precise speed control, while the support frame 4 and housing 5 enhance structural stability and environmental protection. The inert gas protection within the housing effectively prevents solder oxidation, improving welding reliability. The dual-slider design on the outer side of the substrate positioning plate 22 and the tension spring 31 guided by the guide rod further ensure smooth movement and control precision. When integrated into a semiconductor production line, this fixture enables high-precision, high-efficiency, and automated chip welding, significantly improving production yield and consistency, and solving the technical bottlenecks of low efficiency and large quality fluctuations in traditional packaging.

[0042] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A welding fixture for flip-chip bonding, characterized in that, include: Centrifugal solder pad (1), the centrifugal solder pad (1) is rotatably disposed in a preset position around its own vertical axis; The positioning mechanism (2) includes a chip positioning plate (21) and a substrate positioning plate (22) both disposed on the centrifugal pad. The chip positioning plate (21) and the substrate positioning plate (22) are stacked in a radial direction away from the axis of the centrifugal pad (1). The chip positioning plate (21) is slidably inserted into the substrate positioning plate (22) in a first direction. The first direction is perpendicular to the radial line corresponding to the centrifugal pad (1). The chip positioning plate (21) and the substrate positioning plate (22) are respectively provided with a chip receiving groove and a circuit board receiving groove on their opposite inner surfaces. The chip receiving groove and the circuit board receiving groove together form a welding space. As the centrifugal pad (1) rotates, the solder in the welding space is filled between the chip and the circuit board to be welded under centrifugal action.

2. The chip flip-chip soldering fixture as described in claim 1, characterized in that, The chip flip-chip soldering fixture also includes a connecting mechanism (3), which includes a tension spring (31), a first limiting groove (32), and a second limiting groove (33). The first limiting groove (32) extends along the radial line of the centrifugal pad (1) and is located on the outer periphery of the centrifugal pad (1). The bottom surface of the second limiting groove (33) is perpendicular to the radial line of the centrifugal pad (1). The lower surface of the substrate positioning plate (22) is slidably adapted to the first limiting groove (32) and the second limiting groove (33). The tension spring (31) is located in the first limiting groove (32) and extends along the radial line of the centrifugal pad (1). The two ends of the tension spring (31) are respectively connected to the substrate positioning plate (22) and the centrifugal pad (1). The substrate positioning plate (22) has a first state and a second state. In the first state, the substrate positioning plate (22) is arranged at an acute angle to the horizontal plane. In the second state, the substrate positioning plate (22) is arranged at a right angle to the horizontal plane. The tension spring (31) is configured to have a preload force that puts the substrate positioning plate (22) in the first state. As the centrifugal pad (1) rotates, the substrate positioning plate (22) changes from the first state to the second state.

3. The chip flip-chip soldering fixture as described in claim 2, characterized in that, The substrate positioning plate (22) has a mounting groove (221) extending along a first direction, and the outer side of the chip positioning plate (21) is inserted and adapted to the mounting groove (221).

4. The chip flip-chip soldering fixture as described in claim 3, characterized in that, The substrate positioning plate (22) has a guide hole (222), one end of which leads to the upper surface of the substrate positioning plate (22), and the other end is connected to the welding space.

5. The soldering fixture for flip-chip bonding as described in claim 1, characterized in that, The chip flip-chip soldering fixture also includes a drive motor (6), the power output shaft of which is driven to the centrifugal solder pad (1).

6. The chip flip-chip soldering fixture as described in claim 5, characterized in that, The chip flip-chip soldering fixture also includes a support frame (4) and a housing (5) located on the support frame (4). The drive motor (6) is located on the support frame (4), and the centrifugal solder pad (1) is located inside the housing (5).

7. The chip flip-chip soldering fixture as described in claim 6, characterized in that, The container (5) is filled with inert gas.

8. The chip flip-chip soldering fixture as described in claim 2, characterized in that, Along the direction away from the tension spring (31), the outer side of the substrate positioning plate (22) is provided with a first slider (223) and a second slider (224) arranged in sequence at intervals. The first slider (223) is engaged in the first limiting groove (32) and has the degree of freedom to move along the length direction of the first limiting groove (32). The second slider (224) is engaged in the second limiting groove (33) and has the degree of freedom to move along the axial direction of the centrifugal pad (1).

9. The chip flip-chip soldering fixture as described in claim 8, characterized in that, The connecting mechanism (3) further includes a guide rod, which is disposed in the first limiting groove (32) and extends along the length direction of the first limiting groove (32), and the tension spring (31) is sleeved on the outer periphery of the guide rod.

10. A semiconductor production line, characterized in that, Including the welding fixture for flip-chip bonding as described in any one of claims 1 to 9.

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