LED pixel packaging body and LED pixel packaging body manufacturing method

Abstract

The invention provides an LED pixel packaging body. The LED pixel packaging body comprises a packaging substrate, a driving circuit bare crystal, an LED crystal grain and an electrode connecting pad. The package substrate includes a recess. The drive circuit die is disposed in the recess and has a die top surface. The LED crystal grains are arranged in the front face pixel area at intervals, each LED crystal grain comprises a light-emitting face, and each light-emitting face is higher than the top face of the bare crystal. The electrode pads are arranged in the front pixel area at intervals. The packaging glue layer covers the driving circuit bare crystal, the LED crystal grains and the electrode connecting pads. The packaging glue layer comprises a first transparent conductive pattern and a second transparent conductive pattern. One end of each first transparent conductive pattern is connected with the driving circuit bare crystal, and the other end is connected with each LED crystal grain. One end of each second transparent conductive pattern is connected with the driving circuit bare chip, and the other end is connected with each electrode pad. Therefore, the light of the LED crystal grains is prevented from being blocked.

Description

Technical Field

[0001] This invention relates to a package and a method for manufacturing the package, and more particularly to an LED pixel package and a method for manufacturing the LED pixel package. Background Technology

[0002] Technological advancements have enabled the miniaturization of light-emitting diodes (LEDs), allowing them to be applied to a wider range of products, such as Mini LEDs or Micro LEDs in displays. In terms of manufacturing processes, a packaging substrate, three-color LED chips, and a driver chip can be packaged into an LED pixel package, which can then be assembled and used in subsequent processes.

[0003] However, the driver chip and LED chip are usually first placed on the surface of the packaging substrate and then wire bonded for electrical connection. But this process makes it difficult to reduce the size of the LED pixel package, and the top surface of the driver circuit is higher than the light-emitting surface of the LED chip, which will also cause the light to be blocked.

[0004] Therefore, some manufacturers have improved the structure of LED pixel packages by stacking LED chips on top of the driver chip and then electrically connecting them via wire bonding to solve the problems of size and light obstruction. However, this vertical stacking method causes heat from the LED chips to be transferred to the driver chip during operation, which can easily lead to overheating and damage to the components, affecting reliability and product lifespan. In addition, as the size of LED chips and LED pixel packages shrinks, the difficulty of the wire bonding process also increases, and the LED pixel packages that are wire bonded and then packaged have a certain thickness, which is not conducive to thinning.

[0005] In view of this, how to improve the structure of LED pixel package to reduce thickness and avoid obstruction of light from LED chips has become a problem that relevant manufacturers want to solve. Summary of the Invention

[0006] To address the aforementioned problems, this invention provides an LED pixel package and a method for manufacturing the LED pixel package. Through the structural configuration of the LED pixel package, the thickness can be reduced and the light from the LED chip can be prevented from being obstructed.

[0007] According to one embodiment of the present invention, an LED pixel package is provided, comprising a package substrate, a driver circuit die, a plurality of LED chips, and a plurality of electrode pads. The package substrate includes a front pixel region, a back pixel region, and a recess. The back pixel region is opposite to the front pixel region, and the recess is located in the front pixel region. The driver circuit die is disposed in the recess and has a die top surface. The plurality of LED chips are spaced apart in the front pixel region, each LED chip including a light-emitting surface, and each light-emitting surface is higher than the die top surface. The plurality of electrode pads are spaced apart in the front pixel region. An encapsulating adhesive layer is disposed in the front pixel region to cover the driver circuit die, the plurality of LED chips, and the plurality of electrode pads, and the encapsulating adhesive layer includes a plurality of first transparent conductive patterns and a plurality of second transparent conductive patterns. One end of each first transparent conductive pattern is connected to the driver circuit die, and the other end of each first transparent conductive pattern is connected to each LED chip. One end of each second transparent conductive pattern is connected to the driver circuit die, and the other end of each second transparent conductive pattern is connected to each electrode pad.

[0008] In this way, by placing the bare die of the driving circuit in the groove and making the light-emitting surface of the LED chip higher than the top surface of the bare die, the light from the LED chip can be prevented from being blocked. In addition, by including a first transparent conductive pattern and multiple second transparent conductive patterns in the encapsulating adhesive layer, the thickness of the LED pixel package can be reduced.

[0009] The LED pixel package according to the aforementioned embodiments may further include a plurality of driving circuit pads, a plurality of LED chip pads, and a plurality of conductive portions. The plurality of driving circuit pads and the plurality of LED chip pads are arranged at intervals in the reverse pixel area. The package substrate further includes a plurality of first through holes and a plurality of second through holes. Each first through hole penetrates the package substrate and connects each LED chip pad and each LED chip. Each second through hole penetrates the package substrate and connects each driving circuit pad and each electrode pad. The plurality of conductive portions are respectively filled in the plurality of first through holes and the plurality of second through holes.

[0010] The LED pixel package according to the foregoing embodiments may further include a protective layer that covers the encapsulating adhesive layer.

[0011] According to the LED pixel package of the foregoing embodiment, the package substrate may be made of a transparent material.

[0012] According to the LED pixel package of the aforementioned embodiment, each of the first transparent conductive patterns and each of the second transparent conductive patterns may be indium tin oxide.

[0013] According to another embodiment of the present invention, a method for manufacturing an LED pixel package is provided, comprising an integrated circuit wafer providing step, an encapsulating adhesive coating step, a transparent conductive pattern forming step, and a dicing step. In the integrated circuit wafer providing step, an integrated circuit wafer is provided, the integrated circuit wafer comprising a packaging substrate, a plurality of driving circuit dies, a plurality of LED pixel groups, and a plurality of electrode pad groups. The packaging substrate comprises a plurality of front-side pixel areas and a plurality of grooves, each groove being located in each front-side pixel area. Each driving circuit die is disposed in a groove and has a die top surface. Each LED pixel group is disposed in each front-side pixel area, each LED pixel group comprising a plurality of LED chips arranged at intervals, each LED chip having a light-emitting surface higher than the die top surface. Each electrode pad group is disposed in each front-side pixel area. In the encapsulating adhesive coating step, an encapsulating adhesive layer is coated on the aforementioned plurality of front-side pixel areas to cover the aforementioned plurality of driving circuit dies, the aforementioned plurality of LED pixel groups, and the aforementioned plurality of electrode pad groups. In the transparent conductive pattern forming step, multiple trenches are formed in the encapsulating colloid and covered with a transparent conductive colloid. The transparent conductive colloid flows into the aforementioned multiple trenches and forms multiple first transparent conductive pattern groups and multiple second transparent conductive pattern groups to form an encapsulating colloid layer with the encapsulating colloid. Each first transparent conductive pattern group corresponds to each front pixel area and includes multiple first transparent conductive patterns. One end of each first transparent conductive pattern in each first transparent conductive pattern group is connected to the bare die of the driving circuit in each front pixel area, and the other end of each first transparent conductive pattern in each first transparent conductive pattern group is connected to each LED chip in each front pixel area. Each second transparent conductive pattern group corresponds to each front pixel area and includes multiple second transparent conductive patterns. One end of each second transparent conductive pattern in each second transparent conductive pattern group is connected to the bare die of the driving circuit in each front pixel area, and the other end of each second transparent conductive pattern in each second transparent conductive pattern group is connected to each electrode pad of the electrode pad group in each front pixel area. In the dicing step, the integrated circuit wafer is diced to separate the aforementioned multiple front pixel areas to form multiple LED pixel packages.

[0014] The LED pixel package manufacturing method according to the foregoing embodiments may further include a protective layer forming step, which is performed before the cutting step and is used to cover a protective layer on the encapsulating adhesive layer.

[0015] According to the LED pixel package manufacturing method of the foregoing embodiments, the package substrate may be made of a transparent material.

[0016] According to the LED pixel package manufacturing method of the aforementioned embodiments, each of the first transparent conductive patterns and each of the second transparent conductive patterns can be indium tin oxide.

[0017] According to the LED pixel package manufacturing method of the aforementioned embodiments, the integrated circuit wafer may further include a plurality of driving circuit pad groups, a plurality of LED chip pad groups, and a plurality of conductive portions. The package substrate further includes a plurality of reverse pixel regions, each reverse pixel region being opposite to each front pixel region. The driving circuit pad groups and the LED chip pad groups are arranged at intervals in each reverse pixel region. The package substrate further includes a plurality of first via groups and a plurality of second via groups. Each first via group includes a plurality of first vias, each first via penetrating the package substrate and connecting each LED chip pad and each LED chip. Each second via group includes a plurality of second vias, each second via penetrating the package substrate and connecting each driving circuit pad and each electrode pad. The aforementioned plurality of conductive portions are respectively filled in the aforementioned plurality of first vias and the aforementioned plurality of second vias. Attached Figure Description

[0018] Figure 1 This diagram shows a front view of an LED pixel package according to an embodiment of the present invention;

[0019] Figure 2 Show Figure 1 A cross-sectional schematic diagram of the LED pixel package in the embodiment;

[0020] Figure 3 A block flowchart illustrating a method for manufacturing an LED pixel package according to another embodiment of the present invention is shown.

[0021] Figure 4 Show Figure 3 A schematic diagram of the manufacturing process of the LED pixel package fabrication method of the embodiment; and

[0022] Figure 5 Show Figure 3 A cutting diagram illustrating the LED pixel package fabrication method of the embodiment.

[0023] Explanation of reference numerals in the attached figures:

[0024] 100, 200: LED pixel package

[0025] 110, 210: Packaging substrate

[0026] 111,211: Front pixel area

[0027] 112,212: Reverse pixel area

[0028] 113,213: Groove

[0029] 114: First through hole

[0030] 115: Second through hole

[0031] 120, 220: Bare die for driver circuit

[0032] 121: Top surface of bare crystal

[0033] 122: Bare crystal body

[0034] 123, 124: Pin pads

[0035] 130, 230: Electrode pads

[0036] 140, 240: LED chips

[0037] 141: Light-emitting surface

[0038] 142: Grain body

[0039] 143: On-grain electrode

[0040] 150, 250: Encapsulating adhesive layer

[0041] 151,251: First transparent conductive pattern

[0042] 151a, 151b: First connecting segment

[0043] 151c: First intermediate segment

[0044] 152,252: Second transparent conductive pattern

[0045] 152a, 152b: Second connecting segment

[0046] 152c: Second intermediate section

[0047] 160: LED chip bonding pad

[0048] 170: Drive circuit solder pad

[0049] 180: Conductive part

[0050] 190, 290: Protective layer

[0051] 253: Encapsulating colloid

[0052] 254: Trench

[0053] 255: Transparent conductive colloid

[0054] S100: LED Pixel Package Manufacturing Method

[0055] S110: Integrated Circuit Wafer Provision Steps

[0056] S120: Encapsulating colloid coating step

[0057] S130: Transparent Conductive Pattern Formation Steps

[0058] S140: Protective layer formation steps

[0059] S150: Cutting Steps

[0060] W1: Integrated circuit wafer Detailed Implementation

[0061] Embodiments of the present invention will now be described with reference to the accompanying drawings. For clarity, many practical details will be set forth in the following description. However, the reader should understand that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not essential. Furthermore, for the sake of simplicity in the drawings, some conventionally used structures and elements will be shown in a simple schematic manner; and repeated elements may be denoted by the same or similar designations.

[0062] Furthermore, in this document, when a component (or mechanism or module, etc.) is "connected," "set," or "coupled" to another component, it can mean that the component is directly connected, directly set, or directly coupled to the other component, or it can mean that the component is indirectly connected, indirectly set, or indirectly coupled to the other component, that is, there is another component between the component and the other component. Only when it is explicitly stated that a component is "directly connected," "directly set," or "directly coupled" to another component does it indicate that there is no other component between the component and the other component. The terms "first," "second," and "third" are only used to describe different components or components and do not limit the components / components themselves; therefore, the first component / component can also be referred to as the second component / component. Moreover, the combinations of components / components / mechanisms / modules in this document are not combinations generally known, conventional, or existing in this field. Whether the components / components / mechanisms / modules themselves are existing cannot be used to determine whether their combination relationship is easily accomplished by someone of ordinary skill in the art.

[0063] Please see Figure 1 and Figure 2 ,in Figure 1 This diagram shows a front view of an LED pixel package 100 according to an embodiment of the present invention. Figure 2 Show Figure 1 The LED pixel package 100 of the embodiment is shown in a cross-sectional view. Note that for the sake of clarity, the cross-sectional views of the present invention do not show cross-sectional lines. The LED pixel package 100 includes a package substrate 110, a driving circuit die 120, a plurality of LED chips 140 and a plurality of electrode pads 130.

[0064] The encapsulation substrate 110 may include a front pixel region 111, a back pixel region 112, and a recess 113. The back pixel region 112 is opposite to the front pixel region 111, and the recess 113 is located in the front pixel region 111. A driver circuit die 120 is disposed in the recess 113 and has a die top surface 121. The aforementioned plurality of LED chips 140 are spaced apart in the front pixel region 111 of the encapsulation substrate 110, and each LED chip 140 includes a light-emitting surface 141, which is higher than the die top surface 121. The aforementioned plurality of electrode pads 130 are spaced apart in the front pixel region 111. An encapsulating adhesive layer 150 is disposed in the front pixel region 111 of the encapsulation substrate 110 to cover the driver circuit die 120, the aforementioned plurality of LED chips 140, and the aforementioned plurality of electrode pads 130, and the encapsulating adhesive layer 150 includes a plurality of first transparent conductive patterns 151 and a plurality of second transparent conductive patterns 152. One end of each first transparent conductive pattern 151 is connected to the bare die 120 of the driving circuit, and the other end of each first transparent conductive pattern 151 is connected to each LED chip 140. One end of each second transparent conductive pattern 152 is connected to the bare die 120 of the driving circuit, and the other end of each second transparent conductive pattern 152 is connected to each electrode pad 130.

[0065] Therefore, by placing the bare die 120 of the driving circuit in the recess 113 and making the light-emitting surface 141 of the LED chip 140 higher than the top surface 121 of the bare die, the light from the LED chip 140 can be prevented from being blocked. In addition, by including the first transparent conductive pattern 151 and the second transparent conductive pattern 152 in the encapsulating adhesive layer 150, the thickness of the LED pixel package 100 can be reduced.

[0066] At Figure 1 and Figure 2 In this embodiment, the packaging substrate 110 may be made of a transparent material and be rectangular in shape. The packaging substrate 110 may have recesses 113 that conform to the dimensions of the drive circuit die 120, thus providing a space for the drive circuit die 120. Electrode pads 130 may be disposed on the packaging substrate 110 using existing methods; details of this are not the focus of this invention and will not be described further.

[0067] The driver circuit die 120 refers to an unpackaged integrated circuit. The driver circuit die 120 may include a die body 122 and multiple lead pads 123 and 124. The die top surface 121 refers to the upper surface of the die body 122, and the lead pads 123 and 124 may be arranged at intervals on the die top surface 121. When the driver circuit die 120 is disposed in the recess 113, the die top surface 121 can be flush with the pixel surface of the front pixel area 111, so that the lead pads 123 and 124 can protrude from the pixel surface. The number of lead pads 123 corresponds to the number of LED chips 140 and can be used for electrical connection to the LED chips 140. The lead pads 123 are used to drive the LED chips 140 to output power. The number of lead pads 124 can correspond to the number of electrode pads 130 and can be used to electrically connect to the electrode pads 130. The lead pads 124 are used as power supply positive, power supply negative, main display data output, main display data input, secondary display data output and secondary display data input, but are not limited thereto.

[0068] The number of LED chips 140 can be three, and the three LED chips 140 can emit light of different colors, such as red, blue, and yellow. Each LED chip 140 can have a vertical LED chip structure including a chip body 142 and a chip upper electrode 143. The chip upper electrode 143 can be disposed above the chip body 142. The chip substrate (not shown) of the chip body 142 can be metal and directly used as the chip lower electrode. Therefore, the chip body 142 can be directly soldered to the front pixel area 111 of the packaging substrate 110. In other embodiments, the LED chip can be additionally provided with a chip lower electrode below the chip body to facilitate the soldering of the LED chip to the front pixel area, which is not limited to the above disclosure.

[0069] The LED pixel package 100 may further include a plurality of driving circuit pads 170, a plurality of LED chip pads 160, and a plurality of conductive portions 180. The aforementioned plurality of driving circuit pads 170 and the aforementioned plurality of LED chip pads 160 may be arranged at intervals on the reverse pixel region 112 of the package substrate 110. The package substrate 110 may further include a plurality of first through holes 114 and a plurality of second through holes 115. Each first through hole 114 penetrates the package substrate 110 and connects each LED chip pad 160 and each LED chip 140. Each second through hole 115 penetrates the package substrate 110 and connects each driving circuit pad 170 and each electrode pad 130. The aforementioned plurality of conductive portions 180 are respectively filled in the aforementioned plurality of first through holes 114 and the aforementioned plurality of second through holes 115.

[0070] Specifically, the packaging substrate 110 can be fabricated with a first through-hole 114 and a second through-hole 115 during the process. Since both the first through-hole 114 and the second through-hole 115 penetrate the packaging substrate 110, conductive vias (VIAs) can be formed after filling the conductive portion 180, enabling electrical connection of components located in the front pixel area 111 and the back pixel area 112. Therefore, the LED chip pad 160 can be electrically connected to the LED chip 140, and the driver circuit pad 170 can be electrically connected to the driver circuit die 120. In this way, the LED pixel package 100 can be electrically connected to other components via the driver circuit pad 170 and the LED chip pad 160.

[0071] During the fabrication of the encapsulating adhesive layer 150, an encapsulating adhesive can first be applied to the front pixel area 111, and then multiple trenches can be formed using a photolithography process. These trenches can correspond to the electrode pads 130, lead pads 123 and 124, and the on-die electrode 143. Afterwards, a first transparent conductive pattern 151 and a second transparent conductive pattern 152 can be fabricated. Figure 1 and Figure 2 In one embodiment, a transparent conductive colloid (such as indium tin oxide) can be used to fill the trench to form a first transparent conductive pattern 151 and a second transparent conductive pattern 152. Therefore, the first transparent conductive pattern 151 and the second transparent conductive pattern 152 can be indium tin oxide, which can avoid blocking light.

[0072] In the process, a transparent conductive colloid is coated onto the encapsulating colloid and flows into the trench. Then, an unnecessary part is removed by photolithography, so that the first transparent conductive pattern 151 includes two first connecting segments 151a and 151b and a first intermediate segment 151c, and the second transparent conductive pattern 152 includes two second connecting segments 152a and 152b and a second intermediate segment 152c. The first connecting segments 151a and 151b are respectively connected to the lead pad 123 and the on-die electrode 143, and the first intermediate segment 151c is connected between the first connecting segments 151a and 151b; the second connecting segments 152a and 152b are respectively connected to the lead pad 124 and the electrode pad 130, and the second intermediate segment 152c is connected between the second connecting segments 152a and 152b, so as to complete the electrical connection.

[0073] The LED pixel package 100 may further include a protective layer 190 that covers the encapsulating adhesive layer 150. This achieves the effect of protecting the first transparent conductive pattern 151 and the second transparent conductive pattern 152.

[0074] Please see Figure 3 , Figure 4 and Figure 5 ,in Figure 3This diagram shows a block flowchart of an LED pixel package manufacturing method S100 according to another embodiment of the present invention. Figure 4 Show Figure 3 A schematic diagram of the manufacturing process of the LED pixel package manufacturing method S100 in this embodiment. Figure 5 Show Figure 3 A dicing diagram of the LED pixel package fabrication method S100 of the embodiment. The LED pixel package fabrication method S100 includes an integrated circuit wafer providing step S110, an encapsulant coating step S120, a transparent conductive pattern forming step S130, and a dicing step S150.

[0075] In step S110 of providing an integrated circuit wafer, an integrated circuit wafer W1 is provided. The integrated circuit wafer W1 includes a packaging substrate 210, a plurality of driving circuit dies 220, a plurality of LED pixel groups, and a plurality of electrode pad groups. The packaging substrate 210 includes a plurality of front pixel areas 211 and a plurality of recesses 213. Each recess 213 is located in each front pixel area 211. Each driving circuit die 220 is disposed in a recess 213 and has a die top surface (not shown). Figures 3 to 5 (As indicated by the label), each LED pixel group is disposed in each front pixel area 211, each LED pixel group contains multiple LED chips 240 arranged at intervals, and each LED chip 240 includes a light-emitting surface (not shown). Figures 3 to 5 (As indicated by the label), each light-emitting surface is higher than the top surface of each bare crystal, and each electrode pad group is set in each front pixel area 211.

[0076] In the encapsulation colloid coating step S120, an encapsulation colloid 253 is coated on the aforementioned plurality of front pixel areas 211 of the encapsulation substrate 210 to cover the aforementioned plurality of driving circuit bare dies 220, the aforementioned plurality of LED pixel groups and the aforementioned plurality of electrode pad groups.

[0077] In the transparent conductive pattern forming step S130, a plurality of trenches 254 can be formed in the encapsulating colloid 253 and covered with a transparent conductive colloid 255. The transparent conductive colloid 255 flows into the aforementioned plurality of trenches 254 and forms a plurality of first transparent conductive pattern groups and a plurality of second transparent conductive pattern groups to form an encapsulating adhesive layer 250 with the encapsulating colloid 253. Each first transparent conductive pattern group corresponds to each front pixel area 211 and includes multiple first transparent conductive patterns 251. One end of each first transparent conductive pattern 251 in each first transparent conductive pattern group is connected to the driving circuit die 220 of each front pixel area 211, and the other end of each first transparent conductive pattern 251 in each first transparent conductive pattern group is connected to each LED chip 240 in each front pixel area. Each second transparent conductive pattern group corresponds to each front pixel area 211 and includes multiple second transparent conductive patterns 252. One end of each second transparent conductive pattern 252 in each second transparent conductive pattern group is connected to the driving circuit die 220 of each front pixel area 211, and the other end of each second transparent conductive pattern 252 in each second transparent conductive pattern group is connected to each electrode pad 230 of each electrode pad group in each front pixel area 211.

[0078] In the cutting step S150, the integrated circuit wafer W1 is cut to separate the aforementioned plurality of front pixel areas 211 to form a plurality of LED pixel packages 200.

[0079] Furthermore, the LED pixel package manufacturing method S100 may also include a protective layer forming step S140, which is performed before the cutting step S150, and the protective layer forming step S140 is used to cover a protective layer 290 on the encapsulating adhesive layer 250.

[0080] like Figure 3 and Figure 4 As shown, in the integrated circuit wafer providing step S110, the provided integrated circuit wafer W1 already includes components other than the encapsulant layer 250 and the protective layer 290, and the driver circuit die 220 and LED pixel group have been set up. The encapsulant layer 250 can then be fabricated using photolithography. Therefore, the integrated circuit wafer W1 may also include multiple driver circuit pad groups, multiple LED die pad groups, and multiple conductive parts (not shown in the diagram). Figures 3 to 5 (As indicated by the label), the packaging substrate 210 further includes multiple reverse pixel areas 212, with each driving circuit pad group and each LED die pad group arranged at intervals in each reverse pixel area 212. The packaging substrate 210 may also include multiple first via groups and multiple second via groups, each first via group including multiple first vias (not shown in the label). Figures 3 to 5 (As indicated by the label), each first through-hole penetrates the packaging substrate 210 and connects to each LED chip pad of each LED chip pad group (not shown in the label). Figures 3 to 5(as indicated by the label) and each LED chip 240, each second through-hole group includes multiple second through-holes (not shown in the label). Figures 3 to 5 (As indicated by the label), each second through-hole penetrates the package substrate 210 and connects to each drive circuit pad of each drive circuit pad group (not shown in the label). Figures 3 to 5 (as indicated by the label) and each electrode pad 230, the aforementioned multiple conductive parts are respectively filled in the aforementioned multiple first through holes and the aforementioned multiple second through holes.

[0081] In the encapsulant coating step S120, after coating the encapsulant 253, trenches 254 connecting the LED chip 240, the driver circuit die 220, and the electrode pads 230 can be formed through processes such as exposure, development, and etching. Furthermore, in the transparent conductive pattern forming step S130, transparent conductive colloid 255 is coated. The transparent conductive colloid 255 flows into and fills the trenches 254, forming a transparent conductive film on the surface of the encapsulant 253. Afterwards, a portion of the transparent conductive film can be removed to disconnect unnecessary electrical connections, forming a first transparent conductive pattern 251 and a second transparent conductive pattern 252. Finally, a protective layer 290 can be formed.

[0082] After completing the above steps, the integrated circuit wafer W1 can be laser-cut in cutting step S150. Therefore, it can be done as follows: Figure 5 As shown, the originally connected reverse pixel areas 212 (which are also equivalent to the front pixel areas 211) are separated from each other to form multiple LED pixel packages 200.

[0083] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the concept and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. An LED pixel package, characterized in that, Include: A packaging substrate, comprising: One front-facing pixel area; A reverse pixel area, opposite to the front pixel area; and A groove is located in the front pixel area; A bare die for a driving circuit is disposed in the groove and has a bare die top surface; Multiple LED chips are spaced apart in the front pixel area, each LED chip includes a light-emitting surface, and each light-emitting surface is higher than the top surface of the bare chip; Multiple electrode pads are arranged at intervals in the front pixel area; and An encapsulating adhesive layer is disposed on the front pixel area to cover the bare die of the driving circuit, the plurality of LED chips, and the plurality of electrode pads, and the encapsulating adhesive layer comprises: Multiple first transparent conductive patterns, one end of each first transparent conductive pattern is connected to the bare die of the driving circuit, and the other end of each first transparent conductive pattern is connected to each LED chip; and Multiple second transparent conductive patterns, one end of each second transparent conductive pattern is connected to the bare die of the driving circuit, and the other end of each second transparent conductive pattern is connected to the electrode pad.

2. The LED pixel package as described in claim 1, characterized in that, It also includes multiple driving circuit pads, multiple LED chip pads, and multiple conductive portions. The multiple driving circuit pads and the multiple LED chip pads are arranged at intervals in the reverse pixel area. The packaging substrate also includes multiple first through holes and multiple second through holes. Each of the first through holes penetrates the packaging substrate and connects each of the LED chip pads and each of the LED chips. Each of the second through holes penetrates the packaging substrate and connects each of the driving circuit pads and each of the electrode pads. The multiple conductive portions are respectively filled in the multiple first through holes and the multiple second through holes.

3. The LED pixel package as described in claim 1, characterized in that, It also includes a protective layer that covers the encapsulating adhesive layer.

4. The LED pixel package as described in claim 1, characterized in that, The packaging substrate is made of a transparent material.

5. The LED pixel package as described in claim 1, characterized in that, Each of the first transparent conductive pattern and each of the second transparent conductive patterns is indium tin oxide.

6. A method for manufacturing an LED pixel package, characterized in that, Include: An integrated circuit wafer providing step, wherein an integrated circuit wafer is provided, the integrated circuit wafer comprising a packaging substrate, a plurality of driving circuit dies, a plurality of LED pixel groups and a plurality of electrode pad groups, the packaging substrate comprising a plurality of front pixel areas and a plurality of grooves, each groove being located in each of the front pixel areas, each driving circuit die being disposed in each groove and having a die top surface, each LED pixel group being disposed in each of the front pixel areas, each LED pixel group comprising a plurality of LED chips arranged at intervals, each LED chip having a light emitting surface, each light emitting surface being higher than the die top surface, and each electrode pad group being disposed in each of the front pixel areas; An encapsulating colloid coating step involves coating an encapsulating colloid onto the plurality of front-side pixel areas to cover the plurality of driving circuit bare dies, the plurality of LED pixel groups, and the plurality of electrode pad groups. A transparent conductive pattern forming step involves forming multiple trenches in the encapsulating colloid and covering it with a transparent conductive colloid. The transparent conductive colloid flows into the multiple trenches and forms multiple first transparent conductive pattern groups and multiple second transparent conductive pattern groups to form an encapsulating colloid layer with the encapsulating colloid. Each first transparent conductive pattern group corresponds to each front pixel area and includes multiple first transparent conductive patterns. One end of each first transparent conductive pattern in each first transparent conductive pattern group is connected to the bare die of the driving circuit in each front pixel area, and the other end of each first transparent conductive pattern in each first transparent conductive pattern group is connected to each LED chip in each front pixel area. Each second transparent conductive pattern group corresponds to each front pixel area and includes multiple second transparent conductive patterns. One end of each second transparent conductive pattern in each second transparent conductive pattern group is connected to the bare die of the driving circuit in each front pixel area, and the other end of each second transparent conductive pattern in each second transparent conductive pattern group is connected to each electrode pad of the electrode pad group in each front pixel area. as well as A dicing step involves dicing the integrated circuit wafer to separate the plurality of front-side pixel regions, thereby forming a plurality of LED pixel packages.

7. The method for manufacturing an LED pixel package as described in claim 6, characterized in that, It also includes a protective layer forming step, which is performed before the cutting step, and the protective layer forming step is used to cover a protective layer on the encapsulating adhesive layer.

8. The method for manufacturing an LED pixel package as described in claim 6, characterized in that, The packaging substrate is made of a transparent material.

9. The method for manufacturing an LED pixel package as described in claim 6, characterized in that, Each of the first transparent conductive pattern and each of the second transparent conductive patterns is indium tin oxide.

10. The method for manufacturing an LED pixel package as described in claim 6, characterized in that, The integrated circuit wafer further includes multiple driver circuit pad groups, multiple LED chip pad groups, and multiple conductive portions. The packaging substrate further includes multiple reverse pixel areas, each of which is opposite to each of the front pixel areas. The driver circuit pad groups and LED chip pad groups are arranged at intervals in each of the reverse pixel areas. The packaging substrate further includes multiple first via groups and multiple second via groups. Each first via group includes multiple first vias, each of which penetrates the packaging substrate and connects to each of the LED chip pads and each of the LED chips. Each second via group includes multiple second vias, each of which penetrates the packaging substrate and connects to each of the driver circuit pads and each of the electrode pads. The multiple conductive portions are respectively filled in the multiple first vias and the multiple second vias.

Images