Steel rail welding rib grinding method and device, storage medium and electronic equipment
By acquiring the profile data and reference profile data of the rail weld beads, and calibrating the grinding parameters in real time, the problem of over-grinding of the weld beads after rail welding is solved, and an efficient and safe grinding process is achieved.
Patent Information
- Application Number
- CN202510932218.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-07
- Publication Date
- 2025-10-31
AI Technical Summary
In existing technologies, the weld beads after rail welding are easily over-grinded, leading to rail damage.
By acquiring reference profile data and weld bead profile data, grinding parameters are determined, including triaxial displacement trajectory. Tensile and compressive data are acquired in real time, and grinding parameters are calibrated in real time based on the tensile and compressive data to avoid over-grinding.
It improves grinding efficiency, ensures the safety of the rails, and avoids damage to the rails caused by excessive grinding.
Smart Images
Figure CN120867150A_ABST
Abstract
Description
Technical Field
[0001] This specification relates to the field of weld bead grinding technology, and in particular to a method, apparatus, storage medium and electronic equipment for grinding rail weld beads. Background Technology
[0002] In the field of railway construction and maintenance, the grinding process of weld beads after rail welding is of paramount importance.
[0003] In the existing technology, there is a solution to grind the weld beads with mechanical equipment, but there are problems such as easy over-grinding and damage to the rail itself. Summary of the Invention
[0004] This specification provides a method, apparatus, storage medium, and electronic device for grinding rail weld bars, in order to at least partially solve the aforementioned problems existing in the prior art.
[0005] The following technical solution is adopted in this specification:
[0006] This manual provides a method for grinding rail weld beads, including:
[0007] Identify the area to be polished;
[0008] Obtain reference profile data and weld bead profile data of the area to be polished;
[0009] The grinding parameters are determined based on the reference profile data and the weld bead profile data; the grinding parameters include a three-axis displacement trajectory.
[0010] Based on the grinding parameters, the area to be ground is ground, and tensile and compressive data are acquired in real time. The tensile and compressive data includes tensile force data and compressive force data. The tensile force data represents the data collected by the tensile and compressive force sensor when the force acting on the grinding part has a component force in a first direction. The compressive force data represents the data collected by the tensile and compressive force sensor when the force acting on the grinding part has a component force in a second direction. The first direction is perpendicular to the bottom plane of the rail and faces downwards. The second direction is opposite to the first direction.
[0011] Based on the tensile and compressive data, the grinding parameters are calibrated in real time, and grinding is performed in real time based on the calibrated grinding parameters until grinding is completed.
[0012] Preferably, after performing real-time polishing based on calibrated polishing parameters, the method further includes:
[0013] Obtain the polishing profile data;
[0014] Based on the reference profile data, determine the boundary profile data;
[0015] Map the polishing profile data and the boundary profile data to the same plane, and determine whether any one of the multiple target points corresponding to the polishing profile data is located outside the graphic corresponding to the boundary profile data.
[0016] If so, then the grinding parameters are re-determined based on the reference profile data and the weld bead profile data, and grinding is performed again until all target points of the grinding profile data are inside the graphic corresponding to the boundary profile data.
[0017] If not, then the polishing is complete.
[0018] Preferably, determining the grinding parameters based on the reference profile data and the weld bead profile data includes:
[0019] Determine the target profile based on the reference profile data;
[0020] The grinding parameters are determined based on the target profile and the weld bead profile data.
[0021] Preferably, the tension and pressure data is the force acting on the grinding part at one end of the lever when it contacts the rail, and the force acting on the grinding part is transmitted through the lever fulcrum and then applied to the tension and pressure sensor at the other end of the lever.
[0022] Preferably, the step of calibrating the grinding parameters in real time based on the tensile and compressive data, and performing grinding in real time based on the calibrated grinding parameters, includes:
[0023] Determine whether the tensile or compressive force data acquired at the current moment is greater than the preset collision value;
[0024] If so, update the three-axis displacement trajectory in the grinding parameters, and continue grinding based on the updated grinding parameters;
[0025] If not, continue polishing.
[0026] Preferably, the method further includes:
[0027] Based on the three-axis displacement trajectory, a first grinding trajectory and a second grinding trajectory are determined; the first grinding trajectory and the second grinding trajectory are symmetrically arranged, and both the first grinding trajectory and the second grinding trajectory include part of the rail head, one side of the rail web and part of the rail bottom.
[0028] On the other hand, this specification provides a rail weld bead grinding device, comprising:
[0029] Planning unit, used to determine the area to be polished;
[0030] The acquisition unit is used to acquire reference profile data and weld bead profile data of the area to be polished;
[0031] The processing unit is used to determine grinding parameters based on the reference profile data and the weld bead profile data; the grinding parameters include a three-axis displacement trajectory.
[0032] A grinding unit is used to grind the area to be ground based on the grinding parameters and to acquire tensile and compressive data in real time.
[0033] The inspection unit is used to calibrate the grinding parameters in real time based on the tensile and compressive data, and to perform grinding in real time based on the calibrated grinding parameters until the grinding is completed.
[0034] On the other hand, the computer-readable storage medium provided in this specification stores a computer program that, when executed by a processor, implements the rail weld bead grinding method provided in the above-mentioned aspect.
[0035] On the other hand, this specification provides an electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the rail weld bead grinding method provided in one aspect above.
[0036] On the other hand, this specification provides a computer program product in which the instructions are executed by the processor of an electronic device, causing the electronic device to implement the rail weld bead grinding method provided in the above-mentioned aspect.
[0037] The above-mentioned technical solutions adopted in this specification can achieve the following beneficial effects:
[0038] In the rail weld bead grinding method provided in this instruction manual
[0039] After determining the area to be ground, reference profile data and weld bead profile data for that area can be acquired. Grinding parameters are then determined based on these data. Next, grinding is performed on the area based on these parameters, with tensile and compressive force data acquired in real time. Finally, the grinding parameters are calibrated in real time based on this data, and grinding continues until completion. The grinding parameters include a three-axis displacement trajectory. The tensile force data represents the data collected by the tensile and compressive force sensors when the force acting on the grinding component has a component in a first direction; the compressive force data represents the data collected by the sensors when the force acting on the grinding component has a component in a second direction. The first direction is perpendicular to the bottom plane of the rail and points downwards; the second direction is opposite to the first direction.
[0040] It is evident that during the rail grinding process, real-time collected tensile and compressive data can be used to determine whether the wheel flange is in contact with the rail, thereby avoiding over-grinding, improving grinding efficiency, and ensuring the safety of the rail. Attached Figure Description
[0041] The accompanying drawings, which are included to provide a further understanding of this specification and form part of this specification, illustrate exemplary embodiments and are used to explain this specification, but do not constitute an undue limitation thereof. In the drawings:
[0042] Figure 1 A schematic flowchart illustrating a method for grinding rail weld bars, provided as an embodiment of this specification;
[0043] Figure 2 A partial structural schematic diagram of a rail weld bead grinding device provided for one embodiment of this specification;
[0044] Figure 3 A schematic diagram of a target profile provided for one embodiment of this specification;
[0045] Figure 4 A schematic diagram of at least a portion of a triaxial displacement trajectory provided for one embodiment of this specification;
[0046] Figure 5 At least a partial schematic diagram of a triaxial displacement trajectory provided for one embodiment of this specification;
[0047] Figure 6 A schematic diagram of a rail weld bead grinding device provided for one embodiment of this specification;
[0048] Figure 7 The embodiment provided in this specification corresponds to Figure 1 A schematic diagram of an electronic device. Detailed Implementation
[0049] To make the objectives, technical solutions, and advantages of this specification clearer, the technical solutions of this specification will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this specification, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in this specification without creative effort are within the scope of protection of this application.
[0050] In the description of this invention, it should be noted that the term "or" is generally used to include the meaning of "and / or" unless otherwise expressly stated in the content.
[0051] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. Furthermore, in the description of this application, the terms "first," "second," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance.
[0052] Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0053] The technical solutions provided in the various embodiments of this specification are described in detail below with reference to the accompanying drawings.
[0054] Figure 1 A schematic flowchart of a rail weld bead grinding method provided as an embodiment of this specification is shown below. Figure 1 As shown, the method specifically includes the following steps:
[0055] S100: Determine the area to be polished.
[0056] In this specification, the method can be implemented by a rail weld bead grinding device, which is equipped with a lever structure. A grinding element is mounted at the first end of the lever structure, and a tension / compression sensor is mounted at the second end. The fulcrum of the lever structure is a movable shaft. The grinding element has a rim that does not rotate under the influence of other structures within the grinding element. The grinding element has a grinding surface, and the height of the rim is higher than the grinding surface. This grinding surface is the structure that contacts and grinds the weld bead.
[0057] Figure 2 A partial structural schematic diagram of a rail weld bead grinding device provided in one embodiment of this specification is shown below. Figure 2 As shown, the movable shaft 5 serves as the fulcrum of the lever structure, which is L-shaped, with tension / compression sensors 2 and a grinding component 3 at each end. The rim 31 of the grinding component 3 is higher than the grinding surface 32, thereby grinding the rail 4.
[0058] Preferably, the rail weld bead grinding device can prioritize the area to be ground.
[0059] Preferably, the rail weld bead grinding device can determine the area to be ground in response to user operation. Alternatively, the rail weld bead grinding device can determine the area to be ground based on stored rail welding position information. Of course, other methods can also be used to determine the area to be ground, and this specification does not limit this.
[0060] Preferably, the area to be ground is the area where the weld bead is located.
[0061] S102: Obtain reference profile data and weld bead profile data of the area to be ground.
[0062] Preferably, after determining the area to be ground, the rail weld bead grinding device can acquire reference profile data and weld bead profile data of the area to be ground.
[0063] Specifically, in one or more preferred embodiments provided in this specification, the rail weld bead grinding device can acquire weld bead profile data of the area to be ground using visual acquisition devices such as laser sensors and binocular cameras. The rail weld bead grinding device can also acquire the rail profile at a preset distance from the area to be ground and use this rail profile as reference profile data. Alternatively, the rail weld bead grinding data can be determined by using a stored standard profile as reference profile data. Those skilled in the art will understand that data acquisition technology has become relatively mature, and the reference profile data and the weld bead profile data can be obtained in other ways, which are not limited herein.
[0064] S104: Determine the grinding parameters based on the reference profile data and the weld bead profile data.
[0065] Preferably, the rail weld bead grinding device can determine the grinding parameters based on the reference profile data of the weld bead profile.
[0066] Specifically, in one or more preferred embodiments provided in this specification, the rail weld bead grinding device can determine grinding parameters such as the initial grinding position, grinding feed amount, and triaxial displacement trajectory based on the reference profile data and the weld bead profile data.
[0067] Preferably, the initial grinding position represents the position of the grinding element of the rail weld bead grinding device when the grinding begins. Those skilled in the art will understand that different weld beads have different shapes and thicknesses, resulting in different initial grinding positions when grinding different weld beads.
[0068] Preferably, the grinding feed rate is the change in the Euclidean distance between the grinding workpiece and the rail surface during a single grinding process.
[0069] Preferably, the three-axis displacement trajectory is the movement trajectory of the grinding part.
[0070] S106: Based on the grinding parameters, grind the area to be ground and acquire tensile and compressive data in real time.
[0071] Preferably, the rail weld bead grinding device can grind the area to be ground based on the grinding parameters.
[0072] Furthermore, the rail weld bead grinding device can acquire tensile and compressive data during the grinding process.
[0073] Those skilled in the art will understand that during the grinding process, only the weld bead should be ground, avoiding grinding the rail surface. Furthermore, when grinding the weld bead, a 1-5mm section should be left to preserve the stress transition zone, enhance structural strength, improve fatigue resistance, and facilitate later observation and maintenance. Therefore, in one or more preferred embodiments of this specification, a flange that does not rotate under the influence of other structures on the grinding component is provided at the grinding component, and the height of this flange is higher than the grinding surface, so that when the flange contacts the rail surface, the grinding surface does not contact the rail surface. When the flange contacts the rail, the interaction force experienced by the grinding component is much greater than the force experienced by the grinding component during the grinding process, resulting in significant changes in the collected tensile and compressive stress data.
[0074] Preferably, the tensile and compressive data includes tensile data and compressive data.
[0075] Preferably, the tensile data represents the data collected by the tensile and compressive sensors when the force acting on the grinding part has a component force in the first direction; the compressive data represents the data collected by the tensile and compressive sensors when the force acting on the grinding part has a component force in the second direction; the first direction is perpendicular to the bottom plane of the rail and faces downward; the second direction is opposite to the first direction.
[0076] Preferably, the tension and pressure data is the force acting on the grinding part at one end of the lever when it contacts the rail, and the force acting on the grinding part is transmitted through the lever fulcrum and then acts on the tension and pressure sensor at the other end of the lever.
[0077] Preferably, the tension and pressure data is the force acting on the grinding part when the rim of the grinding part at one end of the lever contacts the rail, which is transmitted through the lever fulcrum and then acts on the tension and pressure sensor at the other end of the lever.
[0078] Using the above method, the rail weld bead grinding device can collect tensile and compressive data in real time to determine whether the wheel flange is in contact with the rail.
[0079] S108: Based on the tensile and compressive data, the grinding parameters are calibrated in real time, and grinding is performed in real time based on the calibrated grinding parameters until grinding is completed.
[0080] Preferably, the rail weld bead grinding device can calibrate the grinding parameters in real time based on the tensile and compressive data, and perform grinding in real time based on the calibrated grinding parameters until the grinding is completed.
[0081] Specifically, the rail weld bead grinding device can determine whether the currently acquired tensile or compressive data exceeds a preset collision value based on the tensile and compressive data included in the tensile and compressive data. If so, it updates the three-axis displacement trajectory in the grinding parameters and continues grinding based on the updated grinding parameters. If not, it continues grinding.
[0082] based on Figure 1 The illustrated rail weld bead grinding method involves a rail weld bead grinding device that, after determining the area to be ground, acquires reference profile data and weld bead profile data for that area. Grinding parameters are then determined based on these parameters. The area is then ground using these parameters, and tensile and compressive force data are acquired in real-time. Finally, the grinding parameters are calibrated in real-time based on this data, and grinding continues until completion. The grinding parameters include a three-axis displacement trajectory. The tensile and compressive force data includes tensile force and compressive force data. Specifically, the tensile and compressive force data represents the force acting on the grinding component at one end of the lever when it contacts the rail, transmitted through the lever fulcrum, and then acting on the tensile and compressive force sensor at the other end of the lever.
[0083] It is evident that during the rail grinding process, real-time collected tensile and compressive data can be used to determine whether the wheel flange is in contact with the rail, thereby avoiding over-grinding, improving grinding efficiency, and ensuring the safety of the rail.
[0084] More preferably, in step S108, before grinding is completed, the rail weld bead grinding device can acquire grinding profile data. This grinding profile data characterizes the profile of the weld bead in the area to be ground after one grinding operation.
[0085] Then, the rail weld bead grinding device can determine the boundary profile data based on the reference profile data. This boundary profile data characterizes the target profile to be ground.
[0086] Preferably, the target profile is 1-5mm thicker than the standard rail profile or reference profile, that is, leaving 1-5mm of weld bead.
[0087] Preferably, the target profile is 3mm thicker than the standard rail profile or reference profile, that is, leaving 3mm of weld bead.
[0088] Figure 3 A schematic diagram of the target profile provided for one embodiment of this specification, such as Figure 3 As shown, 1-5mm of weld beads remain on the surface of rail 4.
[0089] Finally, the rail weld bead grinding device maps the grinding profile data and the boundary profile data to the same plane and determines whether any of the multiple target points corresponding to the grinding profile data are located outside the shape corresponding to the boundary profile data. If so, the grinding parameters are re-determined based on the reference profile data and the weld bead profile data, and grinding is performed again until all target points of the grinding profile data are located inside the shape corresponding to the boundary profile data. If not, the grinding is considered complete.
[0090] In a further preferred embodiment, in step S104, the rail weld bead grinding device can first determine the target profile based on the reference profile data. Then, based on the target profile and the weld bead profile data, the grinding parameters are determined.
[0091] More preferably, in step S106, the rail weld bead grinding device can grind the rail head tread surface based on the grinding parameters and collect tensile or compressive data in real time. The rail weld bead grinding device can also grind the rail head lower jaw based on the grinding parameters and collect compressive or tensile data in real time. The area to be ground includes both the rail head tread surface and the rail head lower jaw. It should be emphasized that if tensile data is collected when grinding the rail head tread surface, compressive data is collected when grinding the rail head lower jaw. Conversely, if compressive data is collected when grinding the rail head tread surface, tensile data is collected when grinding the rail head lower jaw.
[0092] More preferably, in step S104, the rail weld bead grinding device can determine a first grinding trajectory and a second grinding trajectory based on the three-axis displacement trajectory. The first grinding trajectory and the second grinding trajectory are symmetrically arranged, and both the first grinding trajectory and the second grinding trajectory include a portion of the rail head, a single side of the rail web, and a portion of the rail bottom.
[0093] Figure 4 A schematic diagram of at least a portion of the triaxial displacement trajectory provided for one embodiment of this specification, as shown below. Figure 4 As shown, the three-axis displacement trajectory includes a first grinding trajectory 61 and a second grinding trajectory 62.
[0094] Further preferably, the width of the grinding component is greater than the width of the weld bead. To fully utilize the grinding component, the triaxial displacement trajectory includes a progressive grinding trajectory. This progressive grinding trajectory involves, as the grinding component moves towards the rail, firstly, while maintaining a constant Euclidean distance between the grinding component and the rail, moving the component so that its first end is flush with the first boundary of the weld bead; then, while decreasing the Euclidean distance between the grinding component and the rail, moving the component so that its second end is flush with the second boundary of the weld bead. Here, the first and second ends of the grinding component are the two ends of the grinding component in the width direction, respectively. The first and second boundaries of the weld bead are the two boundaries in the width direction, respectively.
[0095] Figure 5 At least a partial schematic diagram of a triaxial displacement trajectory provided for one embodiment of this specification, such as Figure 5 The first end 33 and the second end 34 of the grinding part shown can be flush with the first boundary 411 and the second boundary 412 of the weld bead 41, respectively, and the grinding part can be advanced according to the grinding trajectory 63.
[0096] It should be noted that all actions involving the acquisition of signals, information, or data in this application are carried out in compliance with the relevant data protection laws and policies of the country where the application is located, and with the authorization granted by the owner of the relevant device.
[0097] The above are one or more embodiments of the rail weld bead grinding method provided in this specification. Based on the same idea, this specification also provides a corresponding rail weld bead grinding device, such as... Figure 6 As shown.
[0098] Figure 6 A schematic diagram of a rail weld bead grinding device provided for one embodiment of this specification, specifically including:
[0099] Planning unit 800 is used to determine the area to be polished.
[0100] The acquisition unit 802 is used to acquire reference profile data and weld bead profile data of the area to be polished.
[0101] The processing unit 804 is used to determine grinding parameters based on the reference profile data and the weld bead profile data; the grinding parameters include a three-axis displacement trajectory.
[0102] The grinding unit 806 is used to grind the area to be ground based on the grinding parameters and to acquire tensile and compressive data in real time.
[0103] The inspection unit 808 is used to calibrate the grinding parameters in real time based on the tensile and compressive data, and to perform grinding in real time based on the calibrated grinding parameters until the grinding is completed.
[0104] This specification also provides a computer-readable storage medium storing a computer program that can be used to execute the above-described... Figure 1 The provided method for grinding the weld beads of the rails.
[0105] This specification also provides a computer-readable storage medium storing a computer program that can be used to execute the above-described... Figure 1 The provided method for grinding the weld beads of the rails.
[0106] This specification also provides a computer program product in which instructions, when executed by the processor of an electronic device, cause the electronic device to perform the above-described functions. Figure 1 The provided method for grinding the weld beads of the rails.
[0107] This instruction manual also provides Figure 7 The diagram shows a schematic structural representation of the electronic device. Figure 7 At the hardware level, the electronic device includes a processor, internal bus, network interface, memory, and non-volatile memory, and may also include other hardware required for the business operations. The processor reads the corresponding computer program from the non-volatile memory into memory and then runs it to achieve the above-mentioned functions. Figure 1 The method for grinding the welded steel bars described herein. Of course, besides software implementation, this specification does not exclude other implementation methods, such as logic devices or a combination of hardware and software, etc. That is to say, the execution entity of the following processing flow is not limited to individual logic units, but can also be hardware or logic devices.
[0108] In the 1990s, improvements to a technology could be clearly distinguished as either hardware improvements (e.g., improvements to the circuit structure of diodes, transistors, switches, etc.) or software improvements (improvements to the methodology). However, with technological advancements, many methodological improvements today can be considered direct improvements to the hardware circuit structure. Designers almost always obtain the corresponding hardware circuit structure by programming the improved methodology into the hardware circuit. Therefore, it cannot be said that a methodological improvement cannot be implemented using hardware physical modules. For example, a Programmable Logic Device (PLD) (such as a Field Programmable Gate Array (FPGA)) is such an integrated circuit whose logic function is determined by the user programming the device. Designers can program and "integrate" a digital system onto a PLD themselves, without needing chip manufacturers to design and manufacture dedicated integrated circuit chips. Furthermore, nowadays, instead of manually manufacturing integrated circuit chips, this programming is mostly implemented using "logic compiler" software. Similar to the software compiler used in program development, the original code before compilation must be written in a specific programming language, called a Hardware Description Language (HDL). There are many HDLs, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, and RHDL (Ruby Hardware Description Language). Currently, the most commonly used are VHDL (Very-High-Speed Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art should also understand that by simply performing some logic programming on the method flow using one of these hardware description languages and programming it into an integrated circuit, the hardware circuit implementing the logical method flow can be easily obtained.
[0109] The controller can be implemented in any suitable manner. For example, it can take the form of a microprocessor or processor and a computer-readable medium storing computer-readable program code (e.g., software or firmware) executable by the (micro)processor, logic gates, switches, application-specific integrated circuits (ASICs), programmable logic controllers, and embedded microcontrollers. Examples of controllers include, but are not limited to, the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20, and Silicon Labs C8051F320. A memory controller can also be implemented as part of the control logic of the memory. Those skilled in the art will also recognize that, in addition to implementing the controller in purely computer-readable program code form, the same functionality can be achieved by logically programming the method steps to make the controller take the form of logic gates, switches, ASICs, programmable logic controllers, and embedded microcontrollers. Therefore, such a controller can be considered a hardware component, and the means included therein for implementing various functions can also be considered as structures within the hardware component. Alternatively, the means for implementing various functions can be considered as both software modules implementing the method and structures within the hardware component.
[0110] The systems, devices, modules, or units described in the above embodiments can be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, a computer can be, for example, a personal computer, laptop computer, cellular phone, camera phone, smartphone, personal digital assistant, media player, navigation device, email device, game console, tablet computer, wearable device, or any combination of these devices.
[0111] For ease of description, the above devices are described in terms of function, divided into various units. Of course, in implementing this specification, the functions of each unit can be implemented in one or more software and / or hardware components.
[0112] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.
[0113] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.
[0114] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.
[0115] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.
[0116] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.
[0117] Memory may include non-persistent storage in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.
[0118] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.
[0119] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0120] Those skilled in the art will understand that the embodiments of this specification can be provided as methods, systems, or computer program products. Therefore, this specification may take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this specification may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.
[0121] This specification can be described in the general context of computer-executable instructions that are executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform a specific task or implement a specific abstract data type. This specification can also be practiced in distributed computing environments, where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.
[0122] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.
[0123] The above description is merely an embodiment of this specification and is not intended to limit this specification. Various modifications and variations can be made to this specification by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this specification should be included within the scope of the claims of this application.
Claims
1. A method for grinding rail weld beads, characterized in that, include: Identify the area to be polished; Obtain reference profile data and weld bead profile data of the area to be polished; The grinding parameters are determined based on the reference profile data and the weld bead profile data; the grinding parameters include a three-axis displacement trajectory. Based on the grinding parameters, the area to be ground is ground, and tensile and compressive data are acquired in real time; the tensile and compressive data includes tensile data and compressive data; the tensile data represents the data collected by the tensile and compressive sensors when the force acting on the grinding part has a component force in the first direction; the compressive data represents the data collected by the tensile and compressive sensors when the force acting on the grinding part has a component force in the second direction. The first direction is perpendicular to the bottom plane of the rail and faces downwards; The second direction is opposite to the first direction; Based on the tensile and compressive data, the grinding parameters are calibrated in real time, and grinding is performed in real time based on the calibrated grinding parameters until grinding is completed.
2. The method for grinding rail weld beads according to claim 1, characterized in that, After real-time polishing based on calibrated polishing parameters, the method further includes: Obtain the polishing profile data; Based on the reference profile data, determine the boundary profile data; Map the polishing profile data and the boundary profile data to the same plane, and determine whether any one of the multiple target points corresponding to the polishing profile data is located outside the graphic corresponding to the boundary profile data. If so, then the grinding parameters are re-determined based on the reference profile data and the weld bead profile data, and grinding is performed again until all target points of the grinding profile data are inside the graphic corresponding to the boundary profile data. If not, then the polishing is complete.
3. The method for grinding rail weld beads according to claim 1, characterized in that, The step of determining grinding parameters based on the reference profile data and the weld bead profile data includes: Determine the target profile based on the reference profile data; The grinding parameters are determined based on the target profile and the weld bead profile data.
4. The method for grinding rail weld beads according to claim 1, characterized in that, The tension and pressure data refers to the force acting on the grinding part at one end of the lever when it contacts the rail, which is transmitted through the lever fulcrum and then acts on the tension and pressure sensor at the other end of the lever.
5. The method for grinding rail weld beads according to claim 1, characterized in that, The step of calibrating the grinding parameters in real time based on the tensile and compressive data, and performing grinding in real time based on the calibrated grinding parameters, includes: Determine whether the tensile or compressive force data acquired at the current moment is greater than the preset collision value; If so, update the three-axis displacement trajectory in the grinding parameters, and continue grinding based on the updated grinding parameters; If not, continue polishing.
6. The method for grinding rail weld beads according to claim 1, characterized in that, The method further includes: Based on the three-axis displacement trajectory, a first grinding trajectory and a second grinding trajectory are determined; the first grinding trajectory and the second grinding trajectory are symmetrically arranged, and both the first grinding trajectory and the second grinding trajectory include part of the rail head, one side of the rail web and part of the rail bottom.
7. A rail weld bead grinding device, characterized in that, include: Planning unit, used to determine the area to be polished; The acquisition unit is used to acquire reference profile data and weld bead profile data of the area to be polished; The processing unit is used to determine grinding parameters based on the reference profile data and the weld bead profile data; the grinding parameters include a three-axis displacement trajectory. A grinding unit is used to grind the area to be ground based on the grinding parameters and to acquire tensile and compressive data in real time. The inspection unit is used to calibrate the grinding parameters in real time based on the tensile and compressive data, and to perform grinding in real time based on the calibrated grinding parameters until the grinding is completed.
8. A computer-readable storage medium, characterized in that, The storage medium stores a computer program, which, when executed by a processor, implements the method described in any one of claims 1 to 6.
9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the method described in any one of claims 1 to 6.
10. A computer program product, characterized in that, When the instructions in the computer program product are executed by the processor of the electronic device, the electronic device causes the electronic device to perform the method as described in any one of claims 1-6.