ODF laminating machine for laminating liquid crystal panel

Abstract

The invention discloses an ODF laminating machine for laminating a liquid crystal panel, the ODF laminating machine comprises a workbench, a first vacuum pumping device and a second vacuum pumping device, the workbench is provided with a connecting seat, the connecting seat is connected with the workbench through a plurality of lifting mechanisms, the lifting mechanisms are provided with sensors, the sensors monitor the resistance of the lifting mechanisms for driving the connecting seat to slide, and the first vacuum pumping device is connected with the second vacuum pumping device. An upper adsorption platform is connected to the connecting base, an upper box body is arranged on the outer side of the upper adsorption platform, a lower adsorption platform corresponding to the upper adsorption platform is fixedly connected to the workbench, a lower box body is arranged on the outer side of the lower adsorption platform, the upper box body and the lower box body are combined to form a closed box, and a plurality of air guide channels are formed in the upper adsorption platform and the lower adsorption platform. The first vacuum air extractor is communicated with the air guide channel, and the second vacuum air extractor is communicated with the closed box. According to the ODF laminating machine for laminating the liquid crystal panel, the laminating precision of the liquid crystal panel is improved by improving the parallel precision between the upper adsorption platform and the lower adsorption platform.

Description

Technical Field

[0001] This invention relates to the field of liquid crystal panel bonding technology, and more particularly to an ODF bonding machine for bonding liquid crystal panels. Background Technology

[0002] In the manufacturing process of liquid crystal display panels, the ODF process is a key step in forming the liquid crystal cell. The core process includes: first, a specific amount of liquid crystal material is dropped onto the lower glass substrate, which has a thin-film transistor array already formed, using precision equipment; then, an upper glass substrate covered with a color filter and a common electrode is precisely aligned and bonded to the lower glass substrate in a vacuum or a specific atmosphere; finally, a sealed liquid crystal cell is formed by pressing and curing.

[0003] In existing ODF (Optical Deposition Function) equipment, the key components for the final lamination of the upper and lower glass substrates are typically a pair of upper and lower lamination mechanisms. Their operation is as follows: the lower lamination mechanism carries the lower glass substrate, which has undergone liquid crystal dispensing and alignment, while the upper lamination mechanism carries the upper glass substrate. During the lamination stage, a drive mechanism causes the upper and lower lamination mechanisms to move towards each other, applying uniform pressure to the upper and lower glass substrates placed between them. This ensures a tight bond between the two substrates and promotes the curing of the pre-coated frame adhesive, ultimately forming a sealed liquid crystal cell. This process requires applying highly uniform and parallel pressure across the entire lamination surface.

[0004] However, this existing upper and lower pressing mechanism design faces a significant bottleneck in pressing accuracy in practical applications. Due to limitations in the manufacturing precision, structural rigidity, and thermal deformation of the mechanism itself, the dynamic parallelism between the working planes of the upper and lower pressing mechanisms is difficult to consistently achieve the micron-level high precision required by the ODF process during the pressing process. Summary of the Invention

[0005] The purpose of this invention is to provide an ODF bonding machine for bonding liquid crystal panels, which improves the bonding accuracy of liquid crystal panels by enhancing the parallelism between the upper and lower adsorption platforms.

[0006] The technical solution adopted by the ODF laminating machine for bonding liquid crystal panels disclosed in this invention is as follows:

[0007] The device includes a workbench, a first vacuum pumping device, and a second vacuum pumping device. A connecting seat is provided on the workbench, and the connecting seat is slidably connected to the workbench via multiple lifting mechanisms. Sensors are installed on the lifting mechanisms to monitor the resistance to the sliding of the connecting seat. An upper adsorption platform is fixedly connected to the connecting seat. A movable upper housing is provided on the outer side of the upper adsorption platform. A lower adsorption platform corresponding to the upper adsorption platform is fixedly connected to the workbench, and a lower housing is provided on the outer side of the lower adsorption platform. The upper and lower housings are combined to form a closed box. Multiple air guiding channels are provided on both the upper and lower adsorption platforms. The first vacuum pumping device is connected to the air guiding channels, and the second vacuum pumping device is connected to the closed box.

[0008] As a preferred embodiment, the connecting seat is provided with multiple first ejection mechanisms, and the worktable is provided with multiple second ejection mechanisms. Each of the first ejection mechanism and the second ejection mechanism is slidably connected to a slide plate. A gas guide pipe is fixedly connected to the slide plate. Multiple through holes are opened on both the upper adsorption platform and the lower adsorption platform. One end of the gas guide pipe passes through the sealed box and is placed in the through hole.

[0009] As a preferred embodiment, one end of the air guide tube is fixedly connected to an adhesive attachment, and the adhesive attachment has a through-hole communicating with the air guide tube.

[0010] As a preferred embodiment, multiple sealing seats are fixedly connected to the outside of the sealed box, and the sealing seats seal the gap between the air guide pipe and the sealed box.

[0011] As a preferred embodiment, the bottom of the connecting seat extends with multiple connecting parts, and the top of the upper housing is fixedly connected with multiple sliding rods. The sliding rods are slidably connected to the connecting parts, and a limit block and an elastic block are fixedly connected to the sliding rods. The connecting parts are located between the limit block and the elastic block.

[0012] As a preferred embodiment, a plurality of limiting seats are fixedly connected to the worktable, a limiting post is fixedly connected to the connecting seat, a first slide rail is fixedly connected to the limiting post, and the limiting seat is slidably connected to the first slide rail.

[0013] As a preferred embodiment, the lifting mechanism includes a lifting motor and a lifting lead screw. The lifting motor is fixedly connected to the worktable, and the output shaft of the lifting motor is fixedly connected to one end of the lifting lead screw. The other end of the lifting lead screw is slidably connected to a slide block, and the slide block is fixedly connected to a connecting seat through a sensor.

[0014] As a preferred embodiment, multiple mounting seats are fixedly connected to the worktable, the bottom of the lower housing is fixedly connected to the mounting seats, and a lower connecting assembly is fixedly connected to the worktable. The lower connecting assembly passes through the lower housing and is fixedly connected to the lower adsorption platform.

[0015] As a preferred embodiment, a resistance feedback adjustment unit is also included. During the sliding descent of the connecting seat, the four lifting mechanisms are controlled by the resistance feedback adjustment unit. The control specifically includes:

[0016] S1, collects the resistance values ​​monitored by sensors installed on the four lifting mechanisms in real time;

[0017] S2, input the resistance values ​​output by each piezoresistive sensor into the central control module to construct a resistance distribution state vector;

[0018] S3, the central control module performs a difference analysis on the resistance distribution state vector to identify the tilt direction, tilt severity, stress risk point information, and preliminary dynamic impedance adjustment requirements in the sliding direction.

[0019] S4. Based on the difference analysis results, adjust the running speed and lifting step distance of each lifting motor until the resistance values ​​of multiple sensors tend to be consistent.

[0020] S5, when the resistance difference is within the preset tolerance range, outputs a synchronous control signal to make each lifting mechanism continue to descend at a constant speed, maintaining the dynamic parallel state of the connecting seat.

[0021] As a preferred embodiment, in S3, the central control module inputs the resistance distribution state vector into the cooperative control model. The cooperative control model is a cooperative controller built based on a coupled oscillator network, specifically including:

[0022] S31: Each lifting mechanism is assigned an oscillator unit, and the four oscillator units are connected by a coupling weight that reflects the physical connection stiffness of the connecting seat (11);

[0023] S32: Convert the real-time resistance values ​​of each piezoresistive sensor into the phase excitation signal of the corresponding oscillator unit, where an increase in resistance corresponds to phase lag excitation and a decrease in resistance corresponds to phase lead excitation.

[0024] S33: The cooperative controller generates the system state output, including the phase difference matrix and amplitude difference vector, through the dynamic evolution process of the oscillator network;

[0025] S34: Based on the phase difference matrix, identify the motion timing differences between each lifting mechanism to determine the tilt direction of the connecting seat;

[0026] S35: Based on the amplitude difference vector, identify the absolute difference in load carried by each lifting mechanism to determine the severity of tilting and stress concentration risk points;

[0027] S36: The oscillator network status simultaneously generates preliminary dynamic impedance adjustment requirements.

[0028] The beneficial effects of the ODF laminating machine for bonding liquid crystal panels disclosed in this invention are:

[0029] The upper glass substrate is placed at the bottom of the upper adsorption platform, and the lower glass substrate is placed at the top of the lower adsorption platform. The air in the air guide channel is extracted by the first vacuum pumping device to achieve the adsorption of the upper glass substrate at the bottom of the upper adsorption platform and the adsorption of the lower glass substrate at the top of the lower adsorption platform.

[0030] The connecting base slides down on the worktable via a lifting mechanism, merging the upper and lower housings to form a sealed box. Once a closed space is created, a second vacuum pump evacuates the sealed box to a vacuum state. The lifting mechanism continues to lower the upper adsorption platform, enabling the upper glass substrate to be bonded to the lower glass substrate in a vacuum environment. After bonding, the second vacuum pump restores the sealed box to normal atmospheric pressure. The first vacuum pump stops evacuating air from the air guide channel in the upper adsorption platform, and the lifting mechanism resets the upper housing and upper adsorption platform, completing the high-precision ODF bonding process for the LCD panel.

[0031] When an error occurs in the parallelism between the upper and lower adsorption platforms, the operating resistance of the lifting mechanism near the inclined area increases. By monitoring the sliding resistance of the connecting seat through multiple sensors, and adjusting the sliding speed and height of the connecting seat according to the monitoring results, the sliding resistance of the connecting seat monitored by multiple sensors remains consistent, thereby improving the parallelism between the upper and lower adsorption platforms.

[0032] The resistance feedback adjustment unit introduced in this invention constructs a multi-point resistance sensing network based on piezoresistive pressure sensors, combined with a coupled oscillator cooperative control model and a multi-level adjustment mechanism, to achieve adaptive leveling control of the connecting seat's attitude during the sliding descent process. By collecting sliding resistance information at the four lifting mechanisms in real time and constructing a resistance distribution vector reflecting the platform's attitude, the cooperative controller can dynamically adjust the operating speed, step distance, and servo impedance of each lifting motor during descent, actively eliminating tilt deviations caused by structural deformation, uneven load, or initial platform inequality, ensuring that the upper and lower adsorption platforms maintain high parallelism, improving the uniformity and yield of the bonding surface. Through a coupled oscillator network constructed based on the physical stiffness of the connecting seat, simulating a phase-amplitude dynamic adjustment process similar to the cerebellum motor coordination mechanism, the system can achieve rapid synchronization and dynamic convergence under disturbance conditions, exhibiting superior anti-interference capabilities compared to traditional PID controllers. After detecting stress concentration or attitude disturbances, the control strategy can be quickly reconstructed and stably restored, effectively improving the operational stability of the equipment under complex working conditions.

[0033] When an abnormality is detected in the output of a certain sensor or oscillator, the control system can automatically eliminate the faulty channel, reconstruct the triangular coupling topology, and use the speed commands of neighboring nodes for weighted reconstruction to achieve uninterrupted control continuity, significantly enhancing the system's fault tolerance and engineering practicality. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of an ODF laminating machine for bonding liquid crystal panels according to the present invention.

[0035] Figure 2 This is a schematic diagram (partial cross-sectional view of the slide) of the lifting mechanism of an ODF laminating machine for bonding liquid crystal panels according to the present invention.

[0036] Figure 3 This is a schematic diagram of the connector structure of an ODF laminating machine for bonding liquid crystal panels according to the present invention (partial cross-sectional view of the limiting seat).

[0037] Figure 4 This invention relates to an ODF laminating machine for bonding liquid crystal panels. Figure 3 (Area A) Enlarged view.

[0038] Figure 5 This is a schematic diagram of the upper housing structure of an ODF laminating machine for bonding liquid crystal panels according to the present invention.

[0039] Figure 6 This is a cross-sectional view of the upper housing, lower housing, upper connecting assembly, and lower connecting assembly of an ODF laminating machine for bonding liquid crystal panels according to the present invention.

[0040] Figure 7 This is a cross-sectional view of the lower housing and the second vacuum pumping device of an ODF laminating machine for bonding liquid crystal panels according to the present invention.

[0041] Figure 8 This is a cross-sectional view of the first ejection mechanism of an ODF bonding machine for bonding liquid crystal panels according to the present invention.

[0042] Figure 9 This is a cross-sectional view of the second ejection mechanism of an ODF bonding machine for bonding liquid crystal panels according to the present invention.

[0043] Figure 10 This is a flowchart of the resistance feedback adjustment unit execution method of an ODF laminating machine for bonding liquid crystal panels according to the present invention. Detailed Implementation

[0044] The present invention will be further described and illustrated below with reference to specific embodiments and the accompanying drawings:

[0045] Please refer to Figures 1-4 .

[0046] The present invention discloses an ODF bonding machine for bonding liquid crystal panels, comprising a worktable 1, a first vacuum pumping device and a second vacuum pumping device 5;

[0047] The workbench 1 is provided with a connecting seat 11, which is slidably connected to the workbench 1 through multiple lifting mechanisms 2. In this embodiment, it is preferred that there are four lifting mechanisms 2, which are located in the four directions of the workbench 1 respectively. The lifting mechanism 2 is provided with a sensor 221, which is preferably a piezoresistive sensor 221 in this embodiment.

[0048] Furthermore, the lifting mechanism 2 includes a lifting motor 21 and a lifting screw 211; the lifting motor 21 is fixedly connected to the worktable 1, the output shaft of the lifting motor 21 is fixedly connected to one end of the lifting screw 211, and the other end of the lifting screw 211 is slidably connected to a slide block 22. The slide block 22 is fixedly connected to the connecting seat 11 through a sensor 221. The sensor 221 monitors the resistance of the lifting mechanism 2 in driving the connecting seat 11 to slide. The four sensors 221 are located in the four directions of the connecting seat 11 respectively.

[0049] The output shafts of the four lifting motors 21 operate synchronously, driving the slide block 22 to slide up or down on the lifting screw 211 by rotating the lifting screw 211.

[0050] The bottom of the connecting seat 11 extends with multiple connecting parts 111. In this embodiment, it is preferred that there are four connecting parts 111, and the four connecting parts 111 are respectively close to the four lifting mechanisms 2. A limiting post 112 is fixedly connected to the connecting seat 11, and a first slide rail 113 is fixedly connected to the limiting post 112. The first slide rail 113 is parallel to the lifting screw 211.

[0051] Furthermore, multiple limiting seats 12 are fixedly connected on the workbench 1. In this embodiment, it is preferred that there are four limiting seats 12, and the four limiting seats 12 correspond to four limiting posts 112. A first slider 121 is fixedly connected inside the limiting seat 12, and the first slider 121 of the limiting seat 12 is slidably connected to the first slide rail 113.

[0052] Furthermore, four through slots 18 are provided on the workbench 1, and the through slots 18 are close to the limiting seat 12;

[0053] When the lifting mechanism 2 drives the connecting seat 11 to slide down, the limiting post 112 slides down on the first slider 121 via the first slide rail 113, and the through groove 18 increases the movement space of the limiting post 112 as it slides down.

[0054] Please refer to Figure 1 and Figures 5-7 .

[0055] Multiple upper connecting components 13 are fixedly connected to the bottom of the connecting seat 11. In this embodiment, it is preferred that there are four upper connecting components 13, and the four upper connecting components 13 are respectively close to the four lifting mechanisms 2. An upper adsorption platform 14 is fixedly connected to the connecting seat 11. The upper adsorption platform 14 is fixedly connected to the bottom of the connecting seat 11 through the upper connecting components 13. The four lifting mechanisms 2 surround the outer side of the upper adsorption platform 14.

[0056] Furthermore, the upper connecting assembly 13 includes a first connecting plate 131 and a first connecting post 133; the first connecting plate 131 is fixedly connected to the bottom of the connecting seat 11, a first adjusting piece 132 is detachably connected to the first connecting plate 131, one end of the first connecting post 133 is detachably connected to the first adjusting piece 132, and the other end of the first connecting post 133 is fixedly connected to the top of the upper adsorption platform 14.

[0057] The levelness of the bottom surface of the upper adsorption platform 14 can be adjusted by disassembling and replacing the first adjustment piece 132 of different thicknesses.

[0058] The upper adsorption platform 14 is provided with a movable upper box 3 on the outside. The bottom of the upper box 3 is provided with an upper cavity, and the upper adsorption platform 14 is located in the upper cavity. Multiple sliding rods 31 are fixedly connected to the top of the upper box 3. In this embodiment, four sliding rods 31 are preferred. The sliding rods 31 are parallel to the lifting screw 211. The four sliding rods 31 are close to the four lifting mechanisms 2 respectively. The sliding rods 31 are slidably connected to the connecting part 111.

[0059] Furthermore, a limiting block 311 and an elastic block 312 are fixedly connected to the slide rod 31. The connecting part 111 is located between the limiting block 311 and the elastic block 312, and the connecting part 111 can slide a certain distance between the limiting block 311 and the elastic block 312. The limiting block 311 is close to the end of the slide rod 31 and touches the connecting part 111 to prevent the slide rod 31 from detaching from the connecting part 111. The elastic block 312 is close to the upper housing 3. When the slide rod 31 slides down to the limit position, the connecting part 111 pushes out the elastic block 312. The elastic block 312 buffers and increases the sliding stroke of the connecting part 111 slightly to prevent damage to the connecting part 111.

[0060] Furthermore, a second slide rail 222 is fixedly connected to the slide block 22, and the second slide rail 222 is parallel to the lifting screw 211; four connecting plates 32 are fixedly connected to the outside of the upper housing 3, and a second slider 321 is fixedly connected to the connecting plate 32, and the second slider 321 is slidably connected to the second slide rail 222; so that the upper housing 3 can move up or down on the connecting seat 11.

[0061] The upper connecting assembly 13 also includes a first sealing sleeve 134; the first connecting post 133 penetrates the upper housing 3, the first sealing sleeve 134 is sleeved on the outside of the first connecting post 133, one end of the first sealing sleeve 134 is fixedly connected to the first connecting post 133, and the other end of the first sealing sleeve 134 is fixedly connected to the upper housing 3.

[0062] The first sealing sleeve 134 seals the gap between the upper box body 3 and the first connecting column 133, thereby improving the sealing effect of the sealed box. In this embodiment, the middle part of the first sealing sleeve 134 is preferably wavy, so that the first sealing sleeve 134 has a certain elastic deformation. When the upper box body 3 slides a certain distance on the connecting seat 11, the upper box body 3 can stretch the first sealing sleeve 134 to prevent the first sealing sleeve 134 from breaking and losing its sealing effect.

[0063] Multiple lower connecting components 15 are fixedly connected to the worktable 1. In this embodiment, four lower connecting components 15 are preferably located near four lifting mechanisms 2. A lower adsorption platform 16 corresponding to the upper adsorption platform 14 is fixedly connected to the worktable 1. The lower adsorption platform 16 is located below the upper adsorption platform 14, and the bottom surface of the upper adsorption platform 14 is parallel to the top surface of the lower adsorption platform 16. In this embodiment, both the upper adsorption platform 14 and the lower adsorption platform 16 are preferably made of marble. The upper adsorption platform 14 and the lower adsorption platform 16 made of marble can achieve uniform texture, good stability, high strength, high hardness, and maintain high precision under heavy load, thereby improving the bonding accuracy.

[0064] Furthermore, the lower connecting assembly 15 includes a second connecting plate 151, a second connecting post 153, and a connecting post 154; the second connecting plate 151 is fixedly connected to the worktable 1, a second adjusting piece 152 is detachably connected to the second connecting plate 151, one end of the second connecting post 153 is detachably connected to the second adjusting piece 152, the other end of the second connecting post 153 is fixedly connected to one end of the connecting post 154, and the other end of the connecting post 154 is fixedly connected to the bottom of the lower adsorption platform 16;

[0065] The parallelism between the bottom surface of the upper adsorption platform 14 and the top surface of the lower adsorption platform 16 can be adjusted by disassembling and replacing the second adjustment plate 152 of different thicknesses.

[0066] The lower adsorption platform 16 is provided with a lower box 4 on the outside, and a lower cavity is opened on the top of the lower box 4. The lower adsorption platform 16 is located in the lower cavity. Two mounting seats 17 are fixedly connected on the workbench 1. The mounting seats 17 are fixedly connected to the bottom of the lower box 4. A sealing ring 41 is embedded in the top of the lower box 4. The sealing ring 41 surrounds the opening of the lower cavity.

[0067] The lower connecting assembly 15 also includes a connecting sleeve 155 and a second sealing sleeve 156; the connecting post 154 penetrates the lower housing 4, the connecting sleeve 155 is sleeved on the outside of the connecting post 154 and the outside of the second connecting post 153, the second sealing sleeve 156 is sleeved on the outside of the second connecting post 153, one end of the second sealing sleeve 156 is fixedly connected to the second connecting post 153, the other end of the second sealing sleeve 156 is fixedly connected to one end of the connecting post 154, and the other end of the connecting post 154 is fixedly connected to the bottom of the lower housing 4;

[0068] The gap between the lower housing 4 and the connecting post 154 is sealed by the connecting sleeve 155 and the second sealing sleeve 156, thereby improving the sealing effect of the sealed housing. In this embodiment, the middle part of the second sealing sleeve 156 is preferably wavy, so that the second sealing sleeve 156 has a certain elastic deformation. Since the position and height of the lower housing 4 fixed on the workbench 1 remain unchanged, when the second adjusting piece 152 is replaced to adjust the parallelism between the upper adsorption platform 14 and the lower adsorption platform 16, the height of the lower adsorption platform 16 is lowered, and the second sealing sleeve 156 can be stretched a certain distance to avoid the first sealing sleeve 134 from breaking and losing its sealing effect.

[0069] The lifting mechanism 2 drives the connecting seat 11 to slide down on the worktable 1, so that the upper box 3 and the lower box 4 merge to form a closed box, and the upper cavity and the lower cavity merge to form a closed cavity; the sealing ring 41 touches the upper box 3, and the sealing ring 41 is used to seal the gap between the upper box 3 and the lower box 4, thereby improving the sealing performance of the closed box.

[0070] Furthermore, the second vacuum pumping device 5 is connected to the lower chamber 4 of the sealed box;

[0071] After the upper box 3 and the lower box 4 are combined, the sealed box is evacuated to a vacuum state by the second vacuum pumping device 5. The upper box 3 covers the lower box 4 by its own weight, while the lifting mechanism 2 continuously drives the upper adsorption platform 14 to descend. The upper box 3 slides on the connecting seat 11 and the slide seat 22 respectively by the slide rod 31 and the second slider 321. The upper adsorption platform 14 approaches the lower adsorption platform 16 with high dynamic parallelism, so as to achieve bonding of the upper glass substrate and the lower glass substrate in a vacuum environment.

[0072] Please refer to Figure 1 and Figures 5-9 .

[0073] Multiple gas guiding channels 141 are provided on both the upper adsorption platform 14 and the lower adsorption platform 16;

[0074] Furthermore, one end of the gas guiding channel 141 on the upper adsorption platform 14 is located on the bottom surface of the upper adsorption platform 14, and a rectangular array of multiple gas guiding channels 141 on the upper adsorption platform 14 is arranged on the bottom surface of the upper adsorption platform 14.

[0075] Furthermore, one end of the gas guiding channel 141 on the lower adsorption platform 16 is located on the top surface of the lower adsorption platform 16, and a rectangular array of multiple gas guiding channels 141 on the lower adsorption platform 16 is arranged on the top surface of the lower adsorption platform 16.

[0076] Furthermore, the other end of the air guide channel 141 is connected to an air nozzle 142. Both the upper box 3 and the lower box 4 are fixedly connected to a flow divider 33, which is connected to the air nozzle 142 through an air pipe. The first vacuum pumping device is connected to the flow divider 33 inside the upper box 3 through an air pipe, and the first vacuum pumping device is connected to the flow divider 33 inside the lower box 4 through an air pipe.

[0077] Multiple sealing seats 34 are fixedly connected to the outside of the sealed box. In this embodiment, it is preferred that there are six sealing seats 34 on both the upper box body 3 and the lower box body 4. The sealing seats 34 of the upper box body 3 are located at the top of the upper box body 3, and the sealing seats 34 of the lower box body 4 are located at the bottom of the lower box body 4.

[0078] Furthermore, the connecting seat 11 is provided with a plurality of first ejection mechanisms 6. In this embodiment, it is preferred that there are three first ejection mechanisms 6, which are arranged at intervals on the top of the connecting seat 11; the worktable 1 is provided with a plurality of second ejection mechanisms 7. In this embodiment, it is preferred that there are three second ejection mechanisms 7, which are arranged at intervals on the worktable 1; both the first ejection mechanism 6 and the second ejection mechanism 7 include a lead screw device 61;

[0079] Furthermore, the lead screw device 61 of the first ejection mechanism 6 is fixedly connected to the connecting seat 11, and the lead screw device 61 of the first ejection mechanism 6 passes through the connecting seat 11;

[0080] Furthermore, the lead screw device 61 of the second ejection mechanism 7 is fixedly connected to the worktable 1, and the lead screw device 61 of the second ejection mechanism 7 extends out of the worktable 1;

[0081] Furthermore, a slide plate 611 is slidably connected to both the first ejection mechanism 6 and the second ejection mechanism 7, and the slide plate 611 is slidably connected to the lead screw device 61; an air guide pipe 62 is fixedly connected to the slide plate 611. In this embodiment, it is preferred that there are two air guide pipes 62 on the slide plate 611, and the two air guide pipes 62 are located at both ends of the slide plate 611 respectively.

[0082] Furthermore, both the upper adsorption platform 14 and the lower adsorption platform 16 are provided with multiple through holes 143. In this embodiment, it is preferred that the upper adsorption platform 14 has six through holes 143, which correspond to six gas guide pipes 62. The six through holes 143 on the upper adsorption platform 14 are arranged in a rectangular array on the bottom surface of the upper adsorption platform 14. In this embodiment, it is preferred that the lower adsorption platform 16 has six through holes 143, which correspond to six gas guide pipes 62. The six through holes 143 on the lower adsorption platform 16 are arranged in a rectangular array on the top surface of the lower adsorption platform 16. One end of the gas guide pipe 62 is inserted into the sealing seat 34 and the sealing box in sequence and placed in the through hole 143. The gas guide pipe 62 is slidably connected to the sealing seat 34, and the sealing seat 34 seals the gap between the gas guide pipe 62 and the sealing box.

[0083] Furthermore, one end of the air guide tube 62 is fixedly connected to an adhesive attachment 621, and the adhesive attachment 621 has a through hole communicating with the air guide tube 62; the first vacuum pumping device is connected to the other end of the air guide tube 62 through an air pipe.

[0084] Furthermore, it also includes a resistance feedback adjustment unit. During the sliding descent of the four lifting mechanisms (2) driving the connecting seat (11), the resistance feedback adjustment unit is used for control. The resistance feedback adjustment unit includes the following steps:

[0085] S1, real-time acquisition of resistance values ​​monitored by the piezoresistive sensors (221) installed on the four lifting mechanisms (2);

[0086] Piezoresistive sensors (221) installed in the hydraulic circuits or transmission screws of the four lifting mechanisms (2) synchronously acquire resistance-related voltage signals at a sampling frequency of not less than 1kHz, and amplify and convert them to A / D. The analog signals are first filtered by a hardware low-pass filter circuit to eliminate high-frequency electromagnetic interference, and then filtered a second time by a digital filter in the central control module to suppress signal fluctuations caused by mechanical structure vibration.

[0087] The central control module has a built-in FPGA coprocessor, which timestamps the data from each channel sensor to ensure that the data sampling of the four resistance signals is strictly aligned.

[0088] The voltage signal from the piezoresistive sensor is converted into a sliding resistance value as follows:

[0089] Step 1: Read the pressure value: The analog voltage signal V output by the piezoresistive sensor is converted into pressure through the calibration coefficient k: p = k·V; where p is the pressure, V represents the sensor output voltage, and k is the pressure sensitivity of the piezoresistive sensor;

[0090] Step 2: Calculate the local force: F = p·A; where A is the area of ​​action and F is the local force exerted by the sensor.

[0091] Step 3: Convert the resistance value to the sliding direction: If the sensor is not in the sliding direction, the sliding component can be obtained through force decomposition: F slide = F·cos(θ); where θ is the angle between the measurement direction and the sliding direction, F slide This represents the actual resistance component in the sliding direction.

[0092] S2, input the resistance values ​​output by each piezoresistive sensor (221) into the central control module to construct the resistance distribution state vector;

[0093] S21, Vector Space Mapping: Mapping the drag value f after four-way filtering LF ,f RF ,f LB ,f RB A resistance distribution state vector is constructed based on the physical orientation of the lifting mechanism (representing left front, right front, left rear, and right rear, respectively):

[0094]

[0095] S22, Normalization process: For each component f i Perform a normalization operation to convert it to a dimensionless value f′. i The normalization formula is as follows:

[0096]

[0097] Among them, f max f represents the upper limit of the sensor's measurement range. min This represents the reference value under pre-calibrated no-load conditions.

[0098] S23, Dynamic baseline calibration: During the first 100m of the initial descent phase of the connector (11), the mean of the normalized vector components is continuously recorded, denoted as... To construct a dynamic baseline; subsequently, all resistance data are converted into a baseline-de-baseline vector.

[0099]

[0100] in, This represents the mean of the four normalized resistance components in the initial stage.

[0101] S3, the central control module inputs the resistance distribution state vector into a cooperative control model; the core of the cooperative control model is a cooperative controller built based on a coupled oscillator network, specifically including:

[0102] S31, each lifting mechanism is assigned an oscillator unit, and the four oscillator units are connected by coupling weights that reflect the physical connection stiffness of the connecting seat to form an oscillator network;

[0103] Each of the four lifting mechanisms (2) is assigned a nonlinear oscillator unit, forming an oscillator unit set: Ω={osc LF ,osc RF ,osc LB ,osc RB}; These correspond to the four lifting mechanisms: left front (LF), right front (RF), left rear (LB), and right rear (RB), respectively.

[0104] Define the coupling weight matrix between oscillator units: K couple =[k ij ] 4×4 The diagonal elements satisfy k ii =0, off-diagonal element k ij (i≠j) represents the structural coupling stiffness between positions i and j on the connector (11), defined as: Where α is the coupling calibration coefficient (empirical value), E is the elastic modulus of the connector material, and A ij Let L be the equivalent cross-sectional area of ​​the forces acting on points i and j. ij This represents the physical distance between points i and j.

[0105] S32 maps the real-time resistance values ​​of each piezoresistive sensor into the phase excitation signal of the corresponding oscillator unit, where an increase in resistance corresponds to phase lag excitation and a decrease in resistance corresponds to phase lead excitation (increased resistance → phase lag excitation, decreased resistance → phase lead excitation).

[0106] Drag-phase excitation mapping: This maps the normalized drag distribution state vector.

[0107]

[0108] The input is fed into the corresponding oscillator unit, and a phase excitation signal is constructed for each oscillator unit:

[0109] in, β represents the phase perturbation input of the i-th oscillator, β>0 represents the phase excitation gain coefficient, and Δf i This represents the normalized deviation of the resistance, including Δf. LF ,Δf RF ,Δf LB ,Δf RB .

[0110] When the resistance increases, Δf i >0, corresponding to A phase-lag excitation is formed; when the resistance decreases, Δf i <0 indicates phase advance excitation.

[0111] S33, the cooperative controller generates system state output, including phase difference matrix and amplitude difference vector, through the dynamic evolution of the oscillator network (phase synchronization and amplitude equalization);

[0112] Dynamic Evolution and State Output: The nonlinear dynamic model of each oscillator unit is defined as follows:

[0113]

[0114] Where, θ i Let ω0 represent the phase of the i-th oscillator, ω0 be the reference frequency (Hz) of the oscillator, and k ij Indicates the coupling weight between oscillators. ξ represents the external phase excitation term. i (t) represents the system noise term, which follows a zero-mean Gaussian distribution. The following two state indicators are output in real time:

[0115] Phase difference matrix: ΔΘ=[δθ ij ] 4×4 ,δθ ij =θ i -θ j ;

[0116] Amplitude difference vector:

[0117] Where a i Indicates the instantaneous amplitude of the oscillator. For the average amplitude, θ j Let δθ be the phase of the j-th oscillator. ij =θ i -θ j Let Δθ represent the phase difference between the i-th and j-th oscillators, and let ΔΘ represent the set of pairwise phase differences between the four oscillators.

[0118] S34, based on the phase difference matrix, identify the motion timing difference between the lifting mechanisms to determine the tilt direction of the connecting seat (11);

[0119] Eigenvalue decomposition is performed on the phase difference matrix ΔΘ to extract the principal phase difference mode vector.

[0120] according to The sign of the component determines the tilt direction of the connector, for example:

[0121] If sgn(v LF ) = sgn(v LB )>0 and sgn(v RF ) = sgn(v RB If ) < 0, then it is judged as left-leaning;

[0122] If sgn(v LF ) = sgn(v RF )>0 and sgn(v LB ) = sgn(v RB If the value is less than 0, it is considered forward leaning.

[0123] Right now:

[0124] If the components of the left front (LF) and left rear (LB) are positive, and the components of the right front (RF) and right rear (RB) are negative, it indicates that the connector is tilted to the left.

[0125] If the components of the left front (LF) and right front (RF) are positive, and the components of the left rear (LB) and right rear (RB) are negative, it indicates that the connector is tilted forward.

[0126] Main phase difference mode vector It is the principal eigenvector of ΔΘ, reflecting the overall phase shift trend of the connector, v LF ,v RF ,v LF ,v LB These are the components corresponding to the four positions of left front, right front, left back, and right back in the main feature vector, respectively. sgn() is the sign function used to determine the positive or negative value (>0 for positive, <0 for negative).

[0127] S35, based on amplitude difference vector, identifies the absolute difference of load at each point, and is used to determine the severity of tilt and stress concentration risk points;

[0128] Calculate the 2-norm of the amplitude difference vector: As a quantitative indicator of the severity of the tilt;

[0129] Find the component with the largest absolute deviation: The corresponding orientation k is considered as a stress concentration risk point.

[0130] S36, at the same time, the network status directly generates the initial dynamic impedance adjustment requirement;

[0131] Mapping the phase difference to a velocity coupling coefficient: in, This represents the speed coordination compensation amount between the lifting motors, where γ>0 represents the speed compensation gain coefficient.

[0132] Amplitude difference is mapped to dynamic impedance adjustment: Where, ΔZ i η represents the equivalent impedance adjustment amount of the i-th lifting mechanism, and η>0 represents the impedance adjustment gain coefficient.

[0133] when This indicates that the load is too large, and the impedance should be increased to improve the impulse resistance; when This indicates that the load is too small, and the impedance should be reduced to improve the response sensitivity.

[0134] S4. Based on the identified tilt direction, severity, stress risk point information and preliminary dynamic impedance adjustment requirements, adjust the running speed, lifting step distance and equivalent impedance parameters of each lifting motor (21) and servo loop respectively. Through coordinated speed adjustment and dynamic impedance matching, make the resistance values ​​of multiple piezoresistive sensors (221) tend to be consistent.

[0135] S41: Speed ​​Coordination Control Based on Phase Difference: For any two lifting mechanisms i and j, based on the phase difference δγ ij =θ i -θ j Calculate the bidirectional speed compensation:

[0136] When δθ ij >0 indicates that point i is ahead of point j, so motor i slows down and motor j accelerates, with a compensation amount of |Δv|. i→j |;

[0137] When δθ ij <0 indicates that point j is ahead of point i, and the opposite should be applied.

[0138] By summing all compensation commands related to the i-th motor, we obtain its final speed command:

[0139] Where v0 represents the baseline descent speed set by the system. This is the speed control command for the i-th lifting motor.

[0140] S42, Step size adjustment based on amplitude difference: based on the 2-norm of the amplitude difference vector Determine the severity of the tilt and set the step scaling factor λ according to rule table 1;

[0141] For the point k with the largest absolute value of the amplitude difference, that is:

[0142] An additional step size limit is imposed, restricting the maximum step size to:

[0143] Among them, f k f represents the current actual load at point k. safe K represents the maximum safe load allowed by the material. elastic This represents the equivalent elastic stiffness of the connector. This indicates the maximum permissible step size for risk points.

[0144] S43, Real-time matching of dynamic impedance parameters:

[0145] The impedance regulation ΔZ at the output of the oscillator network i Inject servo control loop:

[0146] Position ring stiffness parameter adjustment:

[0147] Speed ​​ring damping parameter adjustment:

[0148] If ΔZ i <0 indicates that the load at the current point is too small. To prevent motion lag, virtual negative stiffness compensation needs to be added.

[0149] in, K represents the position / speed servo gain of the i-th motor. p0 ,K d0 This represents the system's default stiffness and damping reference values, and μ represents the virtual negative stiffness compensation gain coefficient. This represents the virtual compliance parameter additionally applied to light load points.

[0150] S44, Coupled Reconstruction of Fault Point: When the oscillator output amplitude at a certain point m continuously returns to zero (considered as sensor failure), the following fault tolerance mechanism is executed:

[0151] S441, Remove the oscillator unit corresponding to point m from the network;

[0152] S442, reconstruct the triangular coupling topology based on the remaining three points, and recalculate the new coupling weights.

[0153] S443, the velocity control command for point m is generated by weighting the velocities of two adjacent points according to stiffness weights:

[0154]

[0155] Where, k mL ,k mR This represents the coupling stiffness between point m and its left and right neighbors. Indicates the speed commands for the left and right neighbors. This indicates the operating speed allocated to the motor at the fault point after reconstruction.

[0156] S5, when the resistance difference is within the preset tolerance range, output a synchronous control signal to make each lifting mechanism (2) continue to descend at the same speed and maintain the dynamic parallel state of the connecting seat (11).

[0157] S51, Tolerance Composite Judgment: When the following conditions are met simultaneously, the resistance difference is determined to be within the preset tolerance range:

[0158] Relative tolerance: (For dynamic baseline);

[0159] Absolute tolerance: And max(|δθ) ij |)<θ max (θ max =0.1rad);

[0160] S52: If condition S51 is met, the central control module will use all current dynamic adjustment results as the final execution parameters and put them in a "frozen and locked" state, specifically including:

[0161] Speed ​​command lock: Speed ​​execution for each lifting mechanism: That is: use the cooperative compensation speed output by S4.

[0162] Step size limits are maintained: the currently set step size scaling factor λ and the maximum allowable step size for each point. Keep it unchanged and continue to control the motor stepping process.

[0163] Impedance parameter freezing: The impedance parameters of the servo system at each point are maintained as follows:

[0164] If a virtual stiffness compensation term exists It will no longer be updated.

[0165] S53: Synchronous descent execution: The central control module generates a synchronous execution signal and drives the four lifting mechanisms (2) to descend at a stable and constant speed according to the locking parameters, so that the connecting seat (11) maintains a dynamic parallel state.

[0166] During synchronous descent, no further coordinated adjustment calculations are performed;

[0167] The control system enters a low-frequency sampling mode, monitoring only abnormal disturbances to improve efficiency;

[0168] If any sensor feedback deviates from the threshold range, it will automatically exit the synchronization state and re-enter the S4 dynamic adjustment.

[0169] Table 1 Step Scaling Factor Rules

[0170]

[0171] Please refer to Figures 1-9 .

[0172] When the device is running:

[0173] The upper glass substrate is placed on the bottom surface of the upper adsorption platform 14, and the air guide channel 141 on the upper adsorption platform 14 that is not covered by the upper glass substrate enters the standby state. The air nozzle 142 on the standby air guide channel 141 is removed. The lower glass substrate is placed on the top surface of the lower adsorption platform 16, and the air guide channel 141 on the lower adsorption platform 16 that is not covered by the lower glass substrate enters the standby state. The air nozzle 142 on the standby air guide channel 141 is removed. The air in the air guide channel 141 is extracted by the first vacuum pumping device, so that the upper glass substrate is adsorbed on the bottom surface of the upper adsorption platform 14 and the lower glass substrate is adsorbed on the top surface of the lower adsorption platform 16.

[0174] The upper glass substrate is in contact with the adjacent adhesive attachment 621. The adhesive attachment 621 uses its own adhesive force to constrain the upper glass substrate, and the air in the air guide tube 62 is extracted by the first vacuum pumping device, so that the adhesive attachment 621 has both adhesive force and adsorption force to constrain the upper glass substrate. The lower glass substrate is in contact with the adjacent adhesive attachment 621. The adhesive attachment 621 uses its own adhesive force to constrain the lower glass substrate, and the air in the air guide tube 62 is extracted by the first vacuum pumping device, so that the adhesive attachment 621 has both adhesive force and adsorption force to constrain the lower glass substrate, thus preventing the upper and lower glass substrates from shifting and affecting the bonding accuracy.

[0175] Four lifting mechanisms 2 operate synchronously, driving the connecting seat 11 to slide down on the worktable 1. Multiple sensors 221 monitor the sliding resistance of the connecting seat 11. After the resistance feedback adjustment unit adjusts the control, a synchronous control signal is output. Multiple lifting mechanisms 2 adjust the sliding speed and height position of the connecting seat 11 to keep the sliding resistance of the connecting seat 11 monitored by multiple sensors 221 consistent, thereby improving the parallel accuracy between the upper adsorption platform 14 and the lower adsorption platform 16.

[0176] After the connecting seat 11 descends to a certain height, the upper box 3 and the lower box 4 merge to form a closed box, and the upper cavity and the lower cavity merge to form a closed cavity. At this time, there is a certain distance between the upper glass substrate and the lower glass substrate. The upper box 3 covers the lower box 4 with its own weight. The second vacuum pumping device 5 extracts the closed cavity to a vacuum state, so that the upper glass substrate and the lower glass substrate can be attached in the vacuum space.

[0177] The lifting mechanism 2 continuously drives the upper adsorption platform 14 to descend. The upper box 3 slides on the connecting seat 11 and the slide seat 22 respectively via the slide bar 31 and the second slider 321. The upper adsorption platform 14 approaches the lower adsorption platform 16 with high dynamic parallelism until the upper glass substrate is attached to the lower glass substrate.

[0178] After bonding is completed, the sealed box is restored to normal atmospheric pressure by the second vacuum pumping device 5, and the first vacuum pumping device stops pumping air from the air guide channel 141 in the upper adsorption platform 14. Simultaneously, as the lifting mechanism 2 resets the upper box 3 and the upper adsorption platform 14, the lead screw devices 61 of the three first ejection mechanisms 6 are activated sequentially. The lead screw device 61 that is activated first pushes the upper glass substrate from the bottom surface of the upper adsorption platform 14 via the slide plate 611 and the air guide pipe 62, allowing air to enter between the upper adsorption platform 14 and the upper glass substrate. This reduces the pressure of the first ejection mechanism 6 pushing the upper glass substrate from the upper adsorption platform. The force of detachment from the upper glass substrate is used to avoid damage to the upper glass substrate. Although the lead screw devices 61 of the three first ejection mechanisms 6 are started sequentially, their operating speeds increase sequentially. When the adhesive attachments 621 of the three first ejection mechanisms 6 are all on the same horizontal plane, the operating speeds of the lead screw devices 61 of the three first ejection mechanisms 6 are kept consistent. When the upper glass substrate is completely detached from the upper adsorption platform 14, the first vacuum pumping device stops pumping air from the air guide tube 62 of the first ejection mechanism 6, causing the adhesive attachments 621 to detach from the upper glass substrate. The lead screw device 61 drives the air guide tube 62 to be drawn into the through hole 143 through the slide plate 611.

[0179] The first vacuum pumping device stops extracting air from the air guide channel 141 in the lower adsorption platform 16. The lead screw devices 61 of the three second ejection mechanisms 7 are activated sequentially. The lead screw device 61 that is activated first drives the air guide pipe 62 via the slide plate 611, pushing the lower glass substrate off the top surface of the lower adsorption platform 16. This allows air to enter between the lower adsorption platform 16 and the lower glass substrate, thereby reducing the force required by the second ejection mechanisms 7 to detach the lower glass substrate from the lower adsorption platform 16 and preventing damage to the bonded glass substrate. Although the lead screw devices 61 of the three second ejection mechanisms 7 are activated sequentially, their operating speed... The process is sequentially increased. When the adhesive attachments 621 of the three second ejection mechanisms 7 are all on the same horizontal plane, the running speed of the lead screw devices 61 of the three second ejection mechanisms 7 is kept consistent. After the second ejection mechanism 7 lifts the glass substrate that has been bonded to a certain height, the first vacuum pumping device stops pumping air from the air guide pipe 62 of the second ejection mechanism 7. The external robot grabs the glass substrate that has been bonded, and the lead screw device 61 drives the air guide pipe 62 to enter the through hole 143 through the slide plate 611, so that the adhesive attachments 621 are detached from the glass substrate that has been bonded. The external robot then sends out the glass substrate that has been bonded.

[0180] This invention provides an ODF bonding machine for bonding liquid crystal panels. The upper glass substrate is placed at the bottom of the upper adsorption platform and the lower glass substrate is placed at the top of the lower adsorption platform. The air in the air guide channel is extracted by a first vacuum pumping device to achieve the adsorption of the upper glass substrate at the bottom of the upper adsorption platform and the adsorption of the lower glass substrate at the top of the lower adsorption platform.

[0181] The connecting base slides down on the worktable via a lifting mechanism, merging the upper and lower housings to form a sealed box. Once a closed space is created, a second vacuum pump evacuates the sealed box to a vacuum state. The lifting mechanism continues to lower the upper adsorption platform, enabling the upper glass substrate to be bonded to the lower glass substrate in a vacuum environment. After bonding, the second vacuum pump restores the sealed box to normal atmospheric pressure. The first vacuum pump stops evacuating air from the air guide channel in the upper adsorption platform, and the lifting mechanism resets the upper housing and upper adsorption platform, completing the high-precision ODF bonding process for the LCD panel.

[0182] When an error occurs in the parallelism between the upper and lower adsorption platforms, the operating resistance of the lifting mechanism near the inclined area increases. By monitoring the sliding resistance of the connecting seat through multiple sensors, and adjusting the sliding speed and height of the connecting seat according to the monitoring results, the sliding resistance of the connecting seat monitored by multiple sensors remains consistent, thereby improving the parallelism between the upper and lower adsorption platforms.

[0183] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. An ODF laminating machine for bonding liquid crystal panels, characterized in that, include: A workbench is provided with a connecting seat, which is slidably connected to the workbench via multiple lifting mechanisms. The lifting mechanisms are equipped with sensors that monitor the resistance to the sliding of the connecting seat by the lifting mechanisms. An upper adsorption platform is fixedly connected to the connecting seat. An movable upper box is provided on the outside of the upper adsorption platform. A lower adsorption platform corresponding to the upper adsorption platform is fixedly connected to the worktable. A lower box is provided on the outside of the lower adsorption platform. The upper box and the lower box are combined to form a closed box. The first vacuum pumping device has multiple gas guiding channels on both the upper and lower adsorption platforms, and the first vacuum pumping device is connected to the gas guiding channels. The second vacuum pumping device is connected to the sealed box.

2. The ODF laminating machine for bonding liquid crystal panels as described in claim 1, characterized in that, The connecting seat is provided with multiple first ejection mechanisms, and the worktable is provided with multiple second ejection mechanisms. Each of the first ejection mechanism and the second ejection mechanism is slidably connected to a slide plate. A gas guide pipe is fixedly connected to the slide plate. Multiple through holes are opened on both the upper adsorption platform and the lower adsorption platform. One end of the gas guide pipe passes through the sealed box and is placed in the through hole.

3. An ODF laminating machine for bonding liquid crystal panels as described in claim 2, characterized in that, An adhesive attachment is fixedly connected to one end of the air guide tube, and an air hole communicating with the air guide tube is passed through the adhesive attachment.

4. An ODF laminating machine for bonding liquid crystal panels as described in claim 3, characterized in that, Multiple sealing seats are fixedly connected to the outside of the sealed box, and the sealing seats seal the gap between the air guide pipe and the sealed box.

5. An ODF laminating machine for bonding liquid crystal panels as described in claim 1, characterized in that, The bottom of the connecting seat extends with multiple connecting parts, and the top of the upper housing is fixedly connected with multiple sliding rods. The sliding rods are slidably connected to the connecting parts, and a limit block and an elastic block are fixedly connected to the sliding rods. The connecting parts are located between the limit block and the elastic block.

6. An ODF laminating machine for bonding liquid crystal panels as described in claim 5, characterized in that, Multiple limiting seats are fixedly connected to the worktable. A limiting post is fixedly connected to the connecting seat. A first slide rail is fixedly connected to the limiting post. The limiting seat and the first slide rail are slidably connected.

7. An ODF laminating machine for bonding liquid crystal panels as described in claim 1, characterized in that, The lifting mechanism includes a lifting motor and a lifting screw. The lifting motor is fixedly connected to the worktable. The output shaft of the lifting motor is fixedly connected to one end of the lifting screw. The other end of the lifting screw is slidably connected to a slide block. The slide block is fixedly connected to a connecting seat through a sensor.

8. An ODF laminating machine for bonding liquid crystal panels as described in claim 1, characterized in that, Multiple mounting bases are fixedly connected to the workbench. The bottom of the lower housing is fixedly connected to the mounting bases. A lower connecting assembly is fixedly connected to the workbench. The lower connecting assembly passes through the lower housing and is fixedly connected to the lower adsorption platform.

9. An ODF laminating machine for bonding liquid crystal panels as described in claim 1, characterized in that, It also includes a resistance feedback adjustment unit. During the sliding descent of the connecting seat, the four lifting mechanisms are controlled by the resistance feedback adjustment unit. The control specifically includes: S1, collects the resistance values ​​monitored by sensors installed on the four lifting mechanisms in real time; S2, input the resistance values ​​output by each piezoresistive sensor into the central control module to construct a resistance distribution state vector; S3, the central control module performs a difference analysis on the resistance distribution state vector to identify the tilt direction, tilt severity, stress risk point information, and preliminary dynamic impedance adjustment requirements in the sliding direction. S4. Based on the difference analysis results, adjust the running speed and lifting step distance of each lifting motor until the resistance values ​​of multiple sensors tend to be consistent. S5, when the resistance difference is within the preset tolerance range, outputs a synchronous control signal to make each lifting mechanism continue to descend at a constant speed, maintaining the dynamic parallel state of the connecting seat.

10. An ODF laminating machine for bonding liquid crystal panels as described in claim 1, characterized in that, The execution difference analysis in S3 includes: the central control module inputs the resistance distribution state vector into the cooperative control model, which is a cooperative controller built based on a coupled oscillator network, specifically including: S31, each lifting mechanism is assigned an oscillator unit, and the four oscillator units are connected by a coupling weight that reflects the physical connection stiffness of the connecting seat (11); S32 converts the real-time resistance values ​​of each piezoresistive sensor into the phase excitation signal of the corresponding oscillator unit, where an increase in resistance corresponds to phase lag excitation and a decrease in resistance corresponds to phase lead excitation. S33, the cooperative controller generates the system state output, including the phase difference matrix and amplitude difference vector, through the dynamic evolution process of the oscillator network; S34, based on the phase difference matrix, identifies the motion timing differences between each lifting mechanism, and is used to determine the tilt direction of the connecting seat; S35, based on amplitude difference vector, identifies the absolute difference in load carried by each lifting mechanism, and is used to determine the severity of tilting and stress concentration risk points; S36, the oscillator network status simultaneously generates the initial dynamic impedance adjustment requirement.

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