Wafer transfer device and semiconductor equipment

Abstract

The invention provides a wafer transfer device and semiconductor equipment, and belongs to the semiconductor wafer machine technology, the wafer transfer device comprises two groups of Y-axis driving modules, an X-axis driving module and a wafer carrying disc module which are arranged on a damping rack, the two ends of the X-axis driving module are arranged between the two groups of Y-axis driving modules in a longitudinally driven manner, and the two ends of the X-axis driving module are arranged between the two groups of Y-axis driving modules in a longitudinally driven manner. The wafer carrying disc module is arranged on the outer side of the X-axis driving module in a transversely-driven mode. And a transverse grating assembly is connected to the outer ends of the two groups of Y-axis driving modules and is arranged on the outer side of the wafer loading disc module. The transverse position detection assembly and the X-axis driving module are relatively independent, the positioning precision is high, the damping effect is good, wafer transfer is stable, a stable damping supporting scheme is provided for overlay alignment detection, wafer quantity detection, wafer processing, chip packaging and detection, high-end precise instruments and the like, and the working efficiency is improved. And popularization and application in the fields of semiconductor detection, manufacturing and high-end precise instrument driving are facilitated.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor wafer equipment technology, specifically relating to a wafer transfer device and semiconductor equipment. Background Technology

[0002] In semiconductor inspection or processing equipment, the stability of the wafer stage is critical. Existing wafer metrology or processing equipment, such as... Figure 1 In one of the applicant's wafer fabrication equipment projects, the wafer stage is set on the X-axis, and the centroid of the wafer stage falls on the center line of the X-axis. The X-axis position measurement components, such as the X-axis grating ruler, are also set on the X-axis. Therefore, if the X-axis itself is abnormal, such as vibration or offset, it will inevitably lead to inaccurate position determination. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, the present invention provides a wafer transfer device and a semiconductor device that can solve the above-mentioned problems.

[0004] A wafer transfer device includes two sets of Y-axis drive modules, an X-axis drive module, and a wafer carrier module mounted on a vibration damping platform. The X-axis drive modules are longitudinally driven at both ends and positioned between the two sets of Y-axis drive modules. The wafer carrier module is laterally driven and positioned outside the X-axis drive modules. A lateral grating assembly is connected to the outer ends of the two sets of Y-axis drive modules and positioned outside the wafer carrier module.

[0005] Furthermore, the vibration damping platform includes a platform and multiple sets of vibration damping mechanisms. The platform is supported and limited by a limiting support assembly, and the multiple sets of vibration damping mechanisms are set at the four corners of the platform to support two sets of Y-axis drive modules.

[0006] Furthermore, the vibration damping mechanism includes a vibration isolation airbag unit and a vibration damping actuator; multiple vibration damping actuators are set on the outer periphery of the vibration isolation airbag unit through vibration damping uprights; the vibration isolation airbag unit supports the longitudinal beam of the upper Y-axis drive module with adjustable stiffness to achieve passive vibration damping; the actuator of the vibration damping actuator is connected to the side end face of the longitudinal beam, and active vibration damping is achieved by controlling the lifting and lowering.

[0007] Furthermore, the Y-axis drive module includes a longitudinal beam, a Y-axis drive module, a Y-axis adapter, and a Y-axis floating unit; the stator of the Y-axis drive module is longitudinally arranged on the inner side of the longitudinal beam, the mover of the Y-axis drive module is connected to the Y-axis adapter, and the Y-axis floating unit is arranged on the bottom surface of the Y-axis adapter and blows air towards the top surface of the damping platform.

[0008] Furthermore, the X-axis drive module includes a crossbeam and an X-axis drive module, with both ends of the crossbeam connected to the Y-axis adapters of the corresponding Y-axis drive modules.

[0009] Furthermore, the wafer carrier module includes a carrier base, a carrier-side air-bearing guide module, a support module, an adjustment module, a gravity balance module, and an air-suction carrier. The carrier base, with an air-bearing pad at the bottom, includes an inner lateral drive support area and an outer carrier area. Two sets of carrier-side air-bearing guide modules with lateral air-bearing pads are installed in the lateral drive support area. The support module, adjustment module, gravity balance module, and air-suction carrier are arranged in the carrier area. The adjustment module and gravity balance module are located between the support module and the upper air-suction carrier.

[0010] Furthermore, the transverse grating assembly includes a longitudinal grating frame, a grating air-bearing adapter block, a transverse end air-bearing pad, a grating beam, a transverse grating reading head, and a transverse grating ruler; the inner end of the longitudinal grating frame is connected to the outer end of the beam, and the outer end of the longitudinal grating frame is connected to the grating air-bearing adapter block; one end of the grating air-bearing adapter block is connected to the transverse end air-bearing pad facing the longitudinal beam, and the other end of the grating air-bearing adapter block is connected to the end of the beam; the transverse grating ruler is mounted on the beam, and the transverse grating reading head is mounted on the substrate of the wafer carrier module.

[0011] Furthermore, a transfer frame is installed below the vibration damping platform.

[0012] The present invention also provides a semiconductor device, including a transfer device, an optical head, and a controller. The transfer device adopts the aforementioned wafer transfer device. The optical head is configured as one of a dot matrix measurement optical system, a bright field wafer measurement optical system, a dark field wafer measurement optical system, or a lithography optical system according to different scenario requirements. The controller is electrically connected to the transfer device and the optical head and is used for driving and optical control, as well as optical image processing.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the lateral position detection component of the wafer transfer device of this application is relatively independent from the X-axis drive module, with high positioning accuracy, good vibration reduction effect, and stable wafer transfer. It provides a stable vibration reduction support solution for overlay alignment detection, wafer quantity detection, wafer processing, chip packaging and detection, high-end precision instruments, etc., which is convenient for promotion and application in the fields of semiconductor detection, manufacturing and high-end precision instrument drive. Attached Figure Description

[0014] Figure 1 This is a schematic diagram showing the centroid of the wafer stage coinciding with the center line of the X-axis. Figure 2 This is a schematic diagram of the wafer transfer device of the present invention; Figure 3 This is a schematic diagram of part of the wafer transfer device; Figure 4 This is a schematic diagram of the vibration damping mechanism; Figure 5 This is a schematic diagram of a wafer carrier module; Figure 6 for Figure 3 Enlarged view of point A; Figure 7 This is a schematic diagram of a semiconductor device.

[0015] In the picture, 10. Vibration damping platform; 11. Platform; 12. Vibration damping mechanism; 13. Limiting support assembly; 121. Vibration isolation airbag unit; 122. Vibration damping actuator; 123. Vibration damping upright plate; 20. Y-axis drive module; 21. Longitudinal beam; 22. Y-axis drive module; 23. Y-axis adapter; 24. Y-axis lowering unit; 30. X-axis drive module; 31. Crossbeam; 32. X-axis drive module; 40. Wafer carrier module; 41. Carrier base; 42. Carrier side air-bearing guide module; 43. Support module; 44. Adjustment module; 45. Gravity balance module; 46. Air suction carrier; 47. Carrier top plate; 48. Subdivision box; 49. Stator adapter plate; 50. Horizontal grating assembly; 51. Vertical grating frame; 52. Grating air-bearing adapter block; 53. Horizontal end air-bearing pad; 54. Grating crossbeam; 55. Horizontal grating reading head; 56. Grating leaf spring; 60. Transfer frame; 100. Transfer device; 200. Optical head; 300. Controller. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] A wafer transfer device, see Figures 2-6 The wafer transfer device includes two sets of Y-axis drive modules 20, X-axis drive modules 30 and wafer carrier modules 40, which are mounted on the vibration damping platform 10.

[0018] Arrangement: The X-axis drive module 30 is driven longitudinally at both ends and is positioned between the two sets of Y-axis drive modules 20. The wafer carrier module 40 is driven laterally and is positioned outside the X-axis drive module 30. A lateral grating assembly 50 is connected to the outer ends of the two sets of Y-axis drive modules 20 and is positioned outside the wafer carrier module 40.

[0019] Among them, see Figures 3-5 The vibration damping platform 10 includes a platform 11 and multiple sets of vibration damping mechanisms 12. The platform 11 is supported and limited by a limiting support assembly 13. The multiple sets of vibration damping mechanisms 12 are arranged at the four corners of the platform 11 to support two sets of Y-axis drive modules 20.

[0020] See Figure 4 The vibration damping mechanism 12 includes a vibration isolation airbag unit 121 and a vibration damping driver 122; multiple vibration damping drivers 122 are arranged on the outer periphery of the vibration isolation airbag unit 121 via vibration damping uprights 123.

[0021] The vibration isolation airbag unit 121 supports the longitudinal beam 21 of the Y-axis drive module 20 above with adjustable stiffness, thereby achieving passive vibration reduction.

[0022] The driver mover of the vibration damping driver 122 is connected to the side end face of the longitudinal beam 21, and active vibration damping is achieved by controlling the lifting and lowering.

[0023] The vibration isolation airbag unit 121 includes an outer airbag, a float, a vibration isolation valve assembly, and a vibration isolation top plate. The float is coaxially embedded in the outer airbag and passively floats and rises. The vibration isolation valve assembly is connected to the outer airbag to adjust the internal pressure of the vibration isolation airbag unit. The vibration isolation top plate is horizontally set on the top of the float to support the longitudinal beam 21, specifically the bottom surfaces at both ends of the longitudinal beam 21.

[0024] The vibration damping actuator 122 includes a vibration damping drive stator and a vibration damping drive mover; the vibration damping drive stator is connected to the middle side shoulder of the stator fixing plate or the vibration damping upright plate 123, and the side of the vibration damping drive mover adjacent to the vibration isolation airbag unit 121 is connected to the outer side of the end of the longitudinal beam 21.

[0025] The vibration damping actuator 122 also includes a mover baffle, which is disposed on the outside of the vibration damping actuator mover and is used for limiting and stopping.

[0026] The Y-axis drive module 20 includes a longitudinal beam 21, a Y-axis drive module 22, a Y-axis adapter 23, and a Y-axis floating unit 24. The stator of the Y-axis drive module 22 is arranged longitudinally on the inner side of the longitudinal beam 21, and the mover of the Y-axis drive module 22 is connected to the Y-axis adapter 23. The Y-axis floating unit 24 is arranged on the bottom surface of the Y-axis adapter 23 and blows air off towards the top surface of the platform 11 of the shock-absorbing stand 10.

[0027] Two sets of Y-axis drive modules 22 are independently driven and can be calibrated in real time and periodically to eliminate the residuals caused by the non-orthogonality between the X-axis drive module 30 and the two sets of Y-axis drive modules 20.

[0028] Among them, see Figure 3 The X-axis drive module 30 includes a crossbeam 31 and an X-axis drive module 32. The two ends of the crossbeam 31 are respectively connected to the Y-axis adapter 23 of the corresponding Y-axis drive module 20.

[0029] Among them, see Figure 5 The wafer carrier module 40 includes a carrier base 41, a carrier-side air-bearing guide module 42, a support module 43, an adjustment module 44, a gravity balance module 45, and an air-suction carrier 46.

[0030] Arrangement: The carrier base 41 with an air-floating pad at the bottom includes an inner lateral drive support area and an outer carrier area. Two sets of carrier-side air-floating guide modules 42 with lateral air-floating pads are installed in the lateral drive support area. A support module 43, an adjustment module 44, a gravity balance module 45, and an air-suction carrier 46 are arranged in the carrier area. The adjustment module 44 and the gravity balance module 45 are arranged between the support module 43 and the upper air-suction carrier 46.

[0031] Between the two sets of carrier-side air-float guide modules 42 with lateral air-float pads is the crossbeam 31 of the X-axis drive module 30. The lateral air-float pads non-contactly clamp the two sides of the crossbeam 31, playing a role in air-float guidance and support.

[0032] The air cushion at the bottom of the carrier base 41 blows air off the top surface of the platform 11 of the shock-absorbing stand 10.

[0033] Furthermore, a tray top plate 47 is provided on top of the two sets of tray-side air-bearing guide modules 42 for connecting the two sets of tray-side air-bearing guide modules 42 from the top. This enhances stability.

[0034] A subdivision box 48 is installed on the top plate 47 of the carrier plate to improve the control accuracy of the lifting, leveling and rotation angle of the adjustment module 44 around Z.

[0035] Furthermore, a stator adapter plate 49 is provided between the carrier base 41 and the support module 43. The end of the stator adapter plate 49 facing the transverse drive support area of ​​the carrier base 41 is connected to the drive rotor of the X-axis drive module 32. The top surface of the stator adapter plate 49 facing the carrier area of ​​the carrier base 41 is used to support the bottom of the adjustment module 44 and the gravity balance module 45. The bottom surface of the stator adapter plate 49 facing the carrier area of ​​the carrier base 41 is supported and connected to the top surface of the carrier base 41.

[0036] Among them, see Figure 6The transverse grating assembly 50 includes a longitudinal grating frame 51, a grating air-bearing adapter block 52, a transverse end air-bearing pad 53, a grating beam 54, a transverse grating reading head 55, and a transverse grating ruler. The inner end of the longitudinal grating frame 51 is connected to the outer end of the beam 31, and the outer end of the longitudinal grating frame 51 is connected to the grating air-bearing adapter block 52. One end of the grating air-bearing adapter block 52 is connected to the transverse end air-bearing pad 53 facing the longitudinal beam 21, and the other end of the grating air-bearing adapter block 52 is connected to the end of the grating beam 54. The transverse grating ruler is disposed on the grating beam 54, and the transverse grating reading head 55 is disposed on the wafer carrier base 41 of the wafer carrier module 40.

[0037] Furthermore, the transverse grating assembly 50 also includes a grating leaf spring 56, and the grating air-bearing adapter block 52 is connected to the longitudinal grating frame 51 through the grating leaf spring 56.

[0038] See Figure 2 A transfer frame 60 is installed below the vibration damping platform 10. The transfer frame 60 includes a frame body and frame feet and casters located below the frame body, wherein the frame feet are wedge-shaped adjustable feet.

[0039] A semiconductor device, see Figure 7 The semiconductor equipment includes a transfer device 100, an optical head 200, and a controller 300. The transfer device 100 adopts the aforementioned wafer transfer device. The optical head 200 is configured as one of a dot matrix measurement optical system, a bright field wafer measurement optical system, a dark field wafer measurement optical system, or a lithography optical system according to different scenario requirements. The controller 300 is electrically connected to the transfer device 100 and the optical head 200 and is used for driving and optical control, as well as optical image processing.

[0040] This solution has been used in wafer nanoscale overlay inspection systems and wafer quantity inspection systems with and without images (including bright field and dark field). In the future, it will be extended to processing scenarios such as photolithography, PCB, and IC substrate.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer transfer device, comprising two sets of Y-axis drive modules (20), X-axis drive modules (30), and wafer carrier modules (40) mounted on a vibration damping platform (10), characterized in that: The X-axis drive module (30) is driven longitudinally at both ends and is located between the two sets of Y-axis drive modules (20). The wafer carrier module (40) is driven laterally and is located outside the X-axis drive module (30). A lateral grating assembly (50) is connected to the outer ends of the two sets of Y-axis drive modules (20) and is located outside the wafer carrier module (40).

2. The wafer transfer apparatus according to claim 1, characterized in that: The vibration damping platform (10) includes a platform (11) and multiple sets of vibration damping mechanisms (12). The platform (11) is supported and limited by a limiting support assembly (13). The multiple sets of vibration damping mechanisms (12) are set at the four corners of the platform (11) to support two sets of Y-axis drive modules (20).

3. The wafer transfer apparatus according to claim 2, characterized in that: The vibration damping mechanism (12) includes a vibration isolation airbag unit (121) and a vibration damping actuator (122); multiple vibration damping actuators (122) are arranged on the outer periphery of the vibration isolation airbag unit (121) via vibration damping uprights (123); The vibration isolation airbag unit (121) supports the longitudinal beam (21) of the Y-axis drive module (20) above with adjustable stiffness, thereby achieving passive vibration reduction; The driver mover of the vibration damping actuator (122) is connected to the side end face of the longitudinal beam (21) and active vibration damping is achieved by controlling the lifting and lowering.

4. The wafer transfer apparatus according to claim 2, characterized in that: The Y-axis drive module (20) includes a longitudinal beam (21), a Y-axis drive module (22), a Y-axis adapter (23), and a Y-axis floating unit (24). The stator of the Y-axis drive module (22) is arranged longitudinally on the inner side of the longitudinal beam (21), and the mover of the Y-axis drive module (22) is connected to the Y-axis adapter (23). The Y-axis floating unit (24) is arranged on the bottom surface of the Y-axis adapter (23) and blows air off towards the top surface of the platform (11) of the shock-absorbing platform (10).

5. The wafer transfer apparatus according to claim 4, characterized in that: The X-axis drive module (30) includes a crossbeam (31) and an X-axis drive module (32). The two ends of the crossbeam (31) are respectively connected to the Y-axis adapter (23) of the corresponding Y-axis drive module (20).

6. The wafer transfer apparatus according to claim 4, characterized in that: The wafer carrier module (40) includes a carrier base (41), a carrier side air-bearing guide module (42), a support module (43), an adjustment module (44), a gravity balance module (45), and an air-suction carrier (46). The carrier base (41) with air float pads at the bottom includes an inner lateral drive support area and an outer carrier area. Two sets of carrier side air float guide modules (42) with lateral air float pads are installed in the lateral drive support area. A support module (43), an adjustment module (44), a gravity balance module (45), and an air suction carrier (46) are provided in the carrier area. The adjustment module (44) and the gravity balance module (45) are located between the support module (43) and the upper air suction carrier (46).

7. The wafer transfer apparatus according to claim 6, characterized in that: The transverse grating assembly (50) includes a longitudinal grating frame (51), a grating air-bearing adapter block (52), a transverse end air-bearing pad (53), a grating beam (54), a transverse grating reading head (55), and a transverse grating ruler; the inner end of the longitudinal grating frame (51) is connected to the outer end of the beam (31), and the outer end of the longitudinal grating frame (51) is connected to the grating air-bearing adapter block (52); one end of the grating air-bearing adapter block (52) is connected to the transverse end air-bearing pad (53) facing the longitudinal beam (21), and the other end of the grating air-bearing adapter block (52) is connected to the end of the grating beam (54); the transverse grating ruler is set on the grating beam (54), and the transverse grating reading head (55) is set on the disk base (41) of the wafer disk module (40).

8. The wafer transfer apparatus according to claim 7, characterized in that: The transverse grating assembly (50) also includes a grating leaf spring (56), and the grating air-bearing adapter block (52) is connected to the longitudinal grating frame (51) via the grating leaf spring (56).

9. The wafer transfer apparatus according to claim 1, characterized in that: A transfer frame (60) is installed below the shock-absorbing platform (10).

10. A semiconductor device, characterized in that: The semiconductor device includes a transfer device (100), an optical head (200), and a controller (300). The transfer device (100) is a wafer transfer device according to any one of claims 1-9. The optical head (200) is configured as one of a dot matrix measurement optical system, a bright field wafer measurement optical system, a dark field wafer measurement optical system, or a lithography optical system according to different scenario requirements. The controller (300) is electrically connected to the transfer device (100) and the optical head (200) for driving and optical control, as well as optical image processing.

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