Laminated ceramic electronic component

Abstract

Provided is a laminated ceramic electronic component capable of suppressing squeal and improving flexural strength. A laminated ceramic electronic component (1) is provided with: a capacitor body (1A) provided with a laminated body (2) and two external electrodes respectively disposed on both end surfaces of the laminated body (2), connected to an internal electrode layer (15), and covering a part of the main surface; two spacers that are disposed on one main surface side of the capacitor body (1A), sandwich the external electrode (3) therebetween, and are respectively disposed on one end surface side and the other end surface side; and a reinforcing material (5) having a spacer-side coating portion (52) that covers 4.9% or more of the two spacers in the stacking direction, and a capacitor-side coating portion (51) that is continuous from the spacer-side coating portion (52) and covers the outer periphery of the capacitor body (1A). The spacer-side covering portion continuously covers, from among the two spacer end surfaces, opposing spacer end surfaces in which the two spacers face each other, and the two spacer side surfaces.

Description

Technical Field

[0001] This invention relates to laminated ceramic capacitors and other laminated ceramic electronic components. Background Technology

[0002] Multilayer ceramic capacitors and other multilayer ceramic electronic components are widely used in mobile terminal devices such as portable telephones or various electronic devices such as personal computers. Multilayer ceramic capacitors have a cuboid-shaped stack of alternating dielectric layers and internal electrode layers, and external electrodes formed at opposite ends of the stack.

[0003] A multilayer ceramic capacitor has an inner layer in which dielectric layers and internal electrodes are alternately stacked. Furthermore, a cuboid-shaped multilayer is formed by placing dielectric layers as outer layers on the upper and lower parts of the inner layer, and external electrodes are provided on the two end faces of the multilayer in the long side direction to form the capacitor body.

[0004] Furthermore, a multilayer ceramic capacitor is known, which, in order to suppress the occurrence of so-called "whistling", has a spacer formed in the capacitor body and mounted on one side of the substrate to cover a portion of the external electrodes.

[0005] Prior art literature

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2015-216337 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] Patent Document 1 describes a multilayer ceramic electronic component that uses conductive resin as the spacer material and is plated onto it. However, the conductive resin layer has poor conductivity, resulting in a large ESR (equivalent series resistance) for the multilayer ceramic electronic component. Therefore, although there are multilayer ceramic capacitors that use metal spacers to ensure conductivity and suppress whistling, using metal spacers weakens the resistance to flexural strength.

[0010] The purpose of this invention is to provide a laminated ceramic electronic component that can suppress howling and improve flexural strength.

[0011] Technical solutions for solving the problem

[0012] To address the aforementioned problems, the present invention provides a stacked ceramic electronic component comprising a capacitor body, two spacers, and a reinforcing member. The capacitor body includes: a stacked body, alternately stacking dielectric layers and internal electrode layers, having two main faces opposite each other in the stacking direction, two end faces opposite each other in a length direction intersecting the stacking direction, and two side faces opposite each other in a width direction intersecting the stacking direction and the length direction; and two external electrodes, respectively disposed on the two end faces, connected to the internal electrode layers, and extending to the two main faces, covering a portion of the main faces, or a portion of the opposite side faces, or both. The two spacers are located on one main face side of the capacitor body or... One side, respectively disposed on one end face and the other end face, has two spacer main faces opposite each other in the stacking direction, two spacer end faces opposite each other in the length direction, and two spacer side faces opposite each other in the width direction. The reinforcing member has: a spacer side covering portion covering more than 4.9% of the length of each of the two spacers in the stacking direction or the width direction; and a capacitor side covering portion continuously extending from the spacer side covering portion and covering the spacer side of the outer periphery of the capacitor body. The spacer side covering portion continuously covers the opposing spacer end faces of the two spacers that are opposite each other, and the two spacer side faces.

[0013] Invention Effects

[0014] According to the present invention, it is possible to provide a laminated ceramic electronic component that can suppress howling and improve flexural strength. Attached Figure Description

[0015] Figure 1 This is a schematic three-dimensional view of the multilayer ceramic capacitor 1.

[0016] Figure 2 It is along the multilayer ceramic capacitor 1 Figure 1 A sectional view along line II-II in the diagram.

[0017] Figure 3 It is along the multilayer ceramic capacitor 1 Figure 1 A sectional view along line III-III.

[0018] Figure 4 yes Figure 2 Enlarged view of the cross-sectional view of the stacked ceramic capacitor 1 and the spacer 4.

[0019] Figure 5 The figures illustrate the covering state of the spacer-side covering portion 52 in the reinforcing member 5. (a), (b), and (c) are embodiments, and (d) and (e) are comparison methods.

[0020] Figure 6 This is a diagram illustrating the coating state of the capacitor-side coating portion 51 of the reinforcing member 5 onto the capacitor body 1A.

[0021] Figure 7 This is a flowchart illustrating the manufacturing method of the multilayer ceramic capacitor 1.

[0022] Figure 8 This diagram illustrates the laminate manufacturing process S1 and the external electrode formation process S2.

[0023] Figure 9 This diagram illustrates the spacer configuration process S3.

[0024] Figure 10 This diagram illustrates the reinforcement component configuration process S4.

[0025] Figure 11 This is a table showing the results of evaluation 1 and evaluation 2 for the multilayer ceramic capacitor 1 with reinforcement 5 of the embodiment. Detailed Implementation

[0026] The following description describes a multilayer ceramic capacitor 1 as an embodiment of the multilayer ceramic electronic component of the present invention, but the present invention is not limited thereto. Furthermore, the accompanying drawings are sometimes schematically simplified for the purpose of illustrating the invention, and the dimensions of the depicted components or the ratios between the dimensions of the components may differ from those described in the specification. Additionally, the components described in the specification may sometimes be omitted in the accompanying drawings, or the number of components may be omitted, etc.

[0027] Figure 1 This is a schematic perspective view of the stacked ceramic capacitor 1 according to the embodiment. Figure 2 Along the implementation of the multilayer ceramic capacitor 1 Figure 1 A sectional view along line II-II in the diagram. Figure 3 Along the implementation of the multilayer ceramic capacitor 1 Figure 1 A sectional view along line III-III.

[0028] The multilayer ceramic capacitor 1 is generally rectangular in shape and includes a capacitor body 1A comprising a multilayer body 2 and a pair of external electrodes 3 disposed at both ends of the multilayer body 2, a spacer 4 mounted on the capacitor body 1A, and a reinforcing member 5 covering the spacer 4 and a portion of the capacitor body 1A. Furthermore, the multilayer body 2 includes an inner layer 11 in which a dielectric layer 14 and an internal electrode layer 15 are stacked.

[0029] In the following description, as a term indicating the orientation of the multilayer ceramic capacitor 1, the direction in which a pair of external electrodes 3 are disposed is designated as the length direction L. The direction in which the dielectric layer 14 and the internal electrode layer 15 are stacked is designated as the stacking direction T. The direction intersecting both the length direction L and the stacking direction T is designated as the width direction W. Furthermore, in the embodiment, the width direction W is orthogonal to both the length direction L and the stacking direction T.

[0030] (Outer surface of layer 2)

[0031] Furthermore, among the six outer surfaces of the laminate 2, a pair of opposite surfaces in the lamination direction T are designated as the first main surface A1 and the second main surface A2; a pair of opposite surfaces in the width direction W are designated as the first side surface B1 and the second side surface B2; and a pair of opposite surfaces in the length direction L are designated as the first end surface C1 and the second end surface C2. Additionally, unless there is a specific distinction between the first main surface A1 and the second main surface A2, they are uniformly referred to as main surface A; unless there is a specific distinction between the first side surface B1 and the second side surface B2, they are uniformly referred to as side surface B; and unless there is a specific distinction between the first end surface C1 and the second end surface C2, they are uniformly referred to as end surface C.

[0032] Preferably, the edge portion R1 including the corner of the laminate 2 has rounded corners. The edge portion R1 is the part where two surfaces of the laminate 2 intersect, namely the main surface A and the side surface B, the main surface A and the end surface C, or the side surface B and the end surface C.

[0033] (Layered body 2)

[0034] The laminate 2 includes an inner layer 11 that forms an electrostatic capacitor, an outer layer 12 that is configured to sandwich the inner layer 11 from the lamination direction T, and a side gap 16 that is configured to sandwich the inner layer 11 and the outer layer 12 from the width direction W.

[0035] (Inner layer 11)

[0036] The inner layer 11 includes a dielectric layer 14 and an inner electrode layer 15 that are alternately stacked along the stacking direction T.

[0037] (Dielectric layer 14)

[0038] The dielectric layer 14 is made of a ceramic material. For example, a dielectric ceramic with BaTiO3 as the main component can be used as the ceramic material.

[0039] (Internal electrode layer 15)

[0040] The internal electrode layer 15 includes a plurality of first internal electrode layers 15a and a plurality of second internal electrode layers 15b. The first internal electrode layers 15a and second internal electrode layers 15b are arranged alternately. The first internal electrode layer 15a includes a first opposing portion 152a opposite to the second internal electrode layer 15b and a first lead-out portion 151a extending from the first opposing portion 152a toward the first end face C1. The end of the first lead-out portion 151a is exposed at the first end face C1 and is electrically connected to the first external electrode 3a described later. The second internal electrode layer 15b includes a second opposing portion 152b opposite to the first internal electrode layer 15a and a second lead-out portion 151b extending from the second opposing portion 152b toward the second end face C2. The end of the second lead-out portion 151b is electrically connected to the second external electrode 3b described later. Charge is accumulated in the first opposing portion 152a of the first internal electrode layer 15a and the second opposing portion 152b of the second internal electrode layer 15b.

[0041] The internal electrode layer 15 is preferably formed of a metallic material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), silver-palladium (Ag-Pd) alloy, gold (Au).

[0042] (Outer layer 12)

[0043] The outer layer 12 can be formed of the same material as the dielectric layer 14 of the inner layer 11.

[0044] (Side gap section 16)

[0045] The capacitor has a first side gap 16a that forms the first side surface B1 of the laminated ceramic capacitor 1, and a second side gap 16b that forms the second side surface B2 of the laminated ceramic capacitor 1, which are configured to sandwich the inner layer 11 and the outer layer 12 in the width direction W. The side gap 16 can be formed of the same material as the dielectric layer 14.

[0046] (External electrode 3)

[0047] The external electrode 3 includes a first external electrode 3a disposed on the first end face C1 and a second external electrode 3b disposed on the second end face C2. The external electrode 3 covers not only the end face C, but also a portion of the main surface A and the side surface B connected to the end face C.

[0048] As described above, the end of the first lead-out portion 151a of the first inner electrode layer 15a is exposed at the first end face C1 and electrically connected to the first outer electrode 3a. Furthermore, the end of the second lead-out portion 151b of the second inner electrode layer 15b is exposed at the second end face C2 and electrically connected to the second outer electrode 3b. Thus, the first outer electrode 3a and the second outer electrode 3b form a configuration where multiple capacitor elements are electrically connected in parallel.

[0049] Furthermore, the external electrode 3 may include, for example, a base electrode layer 30 and a plating layer 31. However, the external electrode 3 does not necessarily need to have such a layered structure.

[0050] The substrate electrode layer 30 is formed, for example, by applying and sintering a conductive paste containing copper (Cu). Alternatively, the substrate electrode layer 30 may also contain glass or ceramic materials. However, the structure of the substrate electrode layer 30 is not limited to these methods.

[0051] The plating layer 31 includes a nickel (Ni) plating layer 31a disposed on the surface of the substrate electrode layer 30, and a tin (Sn) plating layer 31b disposed on the surface of the nickel (Ni) plating layer 31a. However, the structure of the plating layer 31 is not limited to this.

[0052] (Spacer 4)

[0053] The spacer 4 includes a first spacer 4a and a second spacer 4b. The first spacer 4a is disposed on one end face C1 side of the capacitor body 1A on the side of the second main surface A2, which serves as the substrate mounting surface, in the longitudinal direction L, and the second spacer 4b is disposed on the other end face C2 side. The spacers 4 are respectively configured to connect with the portion of the external electrode 3 disposed on the second main surface A2. When the substrate mounting surface of the capacitor body 1A is the first side surface B1, the first spacer 4a is disposed on one end face C1 side of the capacitor body 1A on the side of the first side surface B1, which serves as the substrate mounting surface, in the longitudinal direction L, and the second spacer 4b is disposed on the other end face C2 side.

[0054] Hereinafter, the two opposite faces of each spacer 4 in the stacking direction T will be described as the main face SA of the spacer, the two opposite faces in the length direction L will be described as the end face SC of the spacer, and the two opposite faces in the width direction W will be described as the side face SB of the spacer.

[0055] Furthermore, among the two spacer end faces SC, the spacer end face SC on the side closest to the center of the length direction L of the capacitor body 1A will be described as the central side spacer end face SC1, and the spacer end face SC on the outside of the length direction L of the laminate 2 will be described as the outer side spacer end face SC2.

[0056] Of the two spacer main surfaces SA, the spacer main surface SA on the capacitor body 1A side will be described as the body-side spacer main surface SA1, and the spacer main surface SA on the other side will be described as the mounting-side spacer main surface SA2. When the substrate mounting surface of the capacitor body 1A is the first side surface B1, of the two spacer sides SB, the spacer side SB on the capacitor body 1A side will be designated as the body-side spacer side SB1, and the spacer side SB on the other side will be designated as the mounting-side spacer side SB2.

[0057] In this embodiment, the length L of each spacer 4 is longer than the external electrode 3 disposed on the second main surface A2. That is, the central side spacer end face SC1 of each spacer 4 is configured to extend beyond the external electrode 3, and there is a portion where the main body side spacer main surface SA1 of the spacer 4 directly contacts the second main surface A2 of the laminate 2. However, this is not a limitation; the length L of each spacer 4 may also be shorter than the external electrode disposed on the second main surface A2. The same applies when the substrate mounting surface of the capacitor body 1A is the first side surface B1.

[0058] In this embodiment, an external electrode 3 is shown consisting of a base electrode layer 30 and a plating layer 31 covering the base electrode layer 30, with a spacer 4 disposed on the surface of the plating layer 31. However, for example, the spacer 4 may also be disposed on the surface of the base electrode layer 30, and a second plating layer may be disposed to cover the spacer 4 and the base electrode layer 30. By disposing of the second plating layer, the adhesion between the spacer 4 and the base electrode layer 30 is improved.

[0059] (Material of spacer 4)

[0060] Spacer 4 comprises either copper (Cu) or nickel (Ni) and tin (Sn) as metal powder. Copper (Cu) and nickel (Ni) may also be coated with silver (Ag). In addition, silver (Ag) may also be included as a metal constituting the intermetallic compound.

[0061] The intermetallic compound formed by adding either copper (Cu) or nickel (Ni) and tin (Sn) has a melting point that does not melt even when soldering the multilayer ceramic capacitor 1 onto the wiring substrate, thus preventing heat-induced deformation. Therefore, the shape of the spacer 4 can be reliably maintained, and it can be configured in a desired form even during soldering. It is particularly preferred to use an intermetallic compound formed by adding tin (Sn) to an alloy of copper (Cu) and nickel (Ni) as a component forming the spacer 4.

[0062] Phenolic resin may also be included in the metal region MP formed by metal powder. The phenolic resin is dispersed as particles coated with intermetallic compounds and fills the gaps between the particles. The phenolic resin may also be in a state where the particles are not completely coated with intermetallic compounds. Furthermore, by using phenolic resin, the amount of gas generated during the heat treatment when forming the spacer 4 can be reduced, thus reducing the voids within the spacer 4. The phenolic resin may also be exposed on the surface of the spacer 4 and coat at least a portion of the surface. By coating the surface of the spacer 4 with phenolic resin, the smoothness of the surface of the spacer 4 is improved, thereby increasing the mechanical strength of the spacer 4.

[0063] Examples of phenolic resins include phenolic varnish resin, phenolic aralkyl resin, cresol phenolic varnish resin, Tcrt-butylphenol phenolic varnish resin, nonylphenol phenolic varnish resin, etc., as well as methyl phenolic resin, poly(p-hydroxystyrene), etc.

[0064] The proportion of the area occupied by the phenolic resin in the spacer 4 in the LT section perpendicular to the width direction W of the spacer 4 is preferably 1% or more and 20% or less, and particularly preferably 5% or more and 15% or less. If it is less than 1%, the effect of the phenolic resin cannot be fully utilized, and if it exceeds 20%, the adhesion strength between the spacer and the external electrode may decrease.

[0065] Furthermore, as a method to determine the percentage of phenolic resin area in spacer 4, for example, spacer 4 is ground along its width W until the center of the width W, the ground surface is magnified to 50x using a microscope (BX-51), and photographed using a microscope digital camera (Olympus DP22). The obtained photographic image is binarized into a metal region MP and a resin region RP. Based on the areas of the metal region MP, metal powder MF, resin region RP, and voids P, the percentage of phenolic resin area is calculated using the formula: (Area of ​​resin region RP) / (Area of ​​metal region MP + Area of ​​metal powder MF + Area of ​​resin region RP + Area of ​​voids P) × 100.

[0066] Figure 4 yes Figure 2 An enlarged view of the cross-sectional view of the multilayer ceramic capacitor 1, specifically the spacer 4 portion. (See attached image.) Figure 4 As shown, metal powder MF can also be included in the resin region RP formed by phenolic resin. The metal powder MF hinders the shrinkage of phenolic resin, thereby mitigating the shrinkage stress generated by the phenolic resin.

[0067] In the region Z from the interface with the external electrode 3 to 5 μm, the porosity of the spacer 4 is preferably 20% or less. By suppressing the porosity to a lower level, the adhesion area of ​​the spacer 4 to the external electrode 3 is increased, and the adhesion force to the external electrode 3 is improved.

[0068] A gap P is formed inside the spacer 4. The maximum diameter of the gap P is preferably less than or equal to half of the maximum dimension of the thickness of the spacer 4 in the lamination direction T. If it is greater than half, cracking becomes more likely to occur starting from the gap P, and the strength of the spacer 4 decreases. When the substrate mounting surface of the capacitor body 1A is the first side surface B1, the maximum diameter of the gap P formed inside the spacer 4 is preferably less than or equal to half of the maximum dimension of the thickness of the spacer 4 in the width direction W.

[0069] Alternatively, as a method for determining the porosity (%), for example, the spacer 4 is ground along the width direction W until the center of the width direction W is reached. The ground surface is then magnified to a combined magnification of 50x using a microscope (BX-51) and photographed using a microscope digital camera (Olympus DP22). The obtained photographic image can be binarized into a metal region MP and a porosity P. Based on the areas of the metal region MP, metal powder MF, resin region RP, and porosity P, the porosity (%) is calculated using the formula: Porosity (%) = (Area of ​​porosity P) / (Area of ​​metal region MP + Area of ​​metal powder MF + Area of ​​resin region RP + Area of ​​porosity P) × 100.

[0070] In the above examples, a structure comprising an intermetallic compound and a phenolic resin is shown as an example of a spacer material, but this is not a limitation. The structure may also contain other types of metallic components, or it may contain resins such as epoxy resin, rosin, and glass components in addition to phenolic resin. Furthermore, it may be formed without resin.

[0071] It can also be made of copper or copper alloys, i.e., materials containing copper, and configured to be bonded to Ni plating via solder.

[0072] Viewed from above in a direction connecting the surface to which the spacer 4 is attached to a surface opposite to it, when the spacer 4 is smaller than the external electrode 3, it is preferable to add a direction-determining unit to at least a portion of the spacer 4. The direction-determining unit is used to determine the orientation of the second main surface A2 or the first side surface B1 where the spacer 4 is disposed when the multilayer ceramic capacitor 1 is mounted on the wiring substrate. It can be a unit that colors the spacer 4 with a different color than the external electrode 3, a unit that prints a direction identification mark such as a QR code (registered trademark) for direction determination, or a recessed portion of the multilayer. Alternatively, as a coloring unit, the phenolic resin contained in the spacer 4 can be exposed on the surface of the spacer 4, resulting in a color different from the external electrode 3. Furthermore, the direction identification mark is not limited to being provided on the spacer 4, but can also be provided on the multilayer 2. Additionally, when the spacer 4 is larger than the external electrode 3, the direction-determining unit can also be provided.

[0073] For example, if the spacer 4 and the external electrode 3 have the same color tone, it may be difficult to determine which side is the surface to which the spacer 4 is applied when viewed from the top surface, potentially leading to image processing errors. However, by setting an orientation recognition mark, such image processing errors can be prevented.

[0074] (Reinforcing component 5)

[0075] like Figure 1 As shown, the reinforcing member 5 includes a capacitor-side covering portion 51 of a given length in the stacking direction T of the capacitor body 1A, and a spacer-side covering portion 52 that is continuous from the capacitor-side covering portion 51 and disposed on the spacer 4 side. When the substrate mounting surface of the capacitor body 1A is the first side surface B1, it includes a capacitor-side covering portion 51 of a given length in the width direction W of the capacitor body 1A, and a spacer-side covering portion 52 that is continuous from the capacitor-side covering portion 51 and disposed on the spacer 4 side.

[0076] (Material of reinforcement component 5)

[0077] The reinforcing member 5 comprises an insulating resin, and in this embodiment, the reinforcing member 5 is primarily made of an insulating resin. The surface of the insulating resin may also be coated with an insulating hydrophobic treatment agent. By forming the reinforcing member 5 from an insulating resin, the flexural strength is improved, and further, by coating it with an insulating hydrophobic treatment agent, the moisture resistance is improved. The insulating resin may also contain ceramics, glass, etc. Furthermore, the reinforcing member 5 preferably has a higher adhesion to the laminate 2 than an intermetallic compound. For example, the reinforcing member 5 may be primarily composed of epoxy resin, with phenolic resin used as a curing agent in combination with the epoxy resin. Other curing agents include anhydride-based, amine-based, and ester-based curing agents. A curing accelerator may also be further added to the epoxy resin. It may also be formed solely from a hydrophobic treatment agent.

[0078] (Shape of reinforcement 5)

[0079] (52, side cover of spacer)

[0080] The spacer-side covering portion 52 includes a side portion 52a that covers two of the spacer sides SB of each of the two spacers 4, and a central portion 52b disposed between the central spacer end face SC1 of one spacer 4 and the central spacer end face SC1 of the other spacer 4 and covering the second main surface A2 side of the capacitor body 1A (laminated body 2). The central portion 52b covers the central spacer end face SC1 of each of the two spacers 4.

[0081] like Figure 2 As shown, in the embodiment, regarding the central portion 52b, when the length of the lamination direction T at the central portion in the length direction L of the capacitor body 1A (laminated body 2) is set to Tm, and the length of the lamination direction T at the end face SC1 of the central side spacer is set to Tc, Tm <Tc。

[0082] In one embodiment, the central portion 52b connects the central side spacer end face SC1 of one spacer 4 to the central side spacer end face SC1 of the other spacer 4. However, the central portion 52b does not necessarily need to be continuous between the first spacer 4a and the second spacer 4b. For example, the central portion 52b may be divided into a central portion covering the central side spacer end face SC1 of the first spacer 4a and a portion of the second main surface A2 side of the capacitor body 1A (laminated body 2), and a central portion covering the central side spacer end face SC1 of the second spacer 4b and a portion of the second main surface A2 side of the capacitor body 1A (laminated body 2), and the central portion may be arranged discontinuously.

[0083] In one embodiment, the spacer-side covering portion 52 further covers the outer spacer end face SC2, but it is not limited thereto, and the outer spacer end face SC2 may not be covered.

[0084] Figure 5 This figure illustrates the covering state of the spacer-side covering portion 52 in the reinforcing member 5. Figure 5 (a), (b), and (c) are implementation methods. Figure 5 (d) and (e) are comparison methods. In the embodiment, when the stacking direction length (total length) of the spacer 4 is set to Ts, and the stacking direction length at the side portion 52a of the spacer-side covering portion 52 in the reinforcing member 5 is set to T1, the stacking direction length T1 of the side portion 52a is 4.9% or more of the stacking direction length Ts of the spacer 4. Moreover, as described later, the side portion 52a does not cover the mounting side spacer main surface SA2 in the spacer main surface SA of the spacer 4, and therefore is less than 100%. That is, 0.049 ≤ T1 / Ts < 1.

[0085] Figure 5 (a) represents the case where T1 / Ts is 0.5. Figure 5 (b) is the case where T1 / Ts is 0.95.

[0086] Figure 5 (c) shows the case where the mounting side spacer main surface SA2 is inclined relative to the main body side spacer main surface SA1. Figure 5 In (c), T1 / Ts is approximately 0.7 at the portion of the mounting-side spacer main surface SA2 furthest from the main surface SA1 of the main body spacer, but approximately 1 at the portion of the mounting-side spacer main surface SA2 closest to the main surface SA1 of the main body spacer. However, even at the portion of the mounting-side spacer main surface SA2 closest to the main surface SA1 of the main body spacer, the reinforcement 5 does not extend to the mounting-side spacer main surface SA2, and the reinforcement 5 is not configured to the mounting-side spacer main surface SA2.

[0087] Figure 5(d) is the comparison method. T1 / Ts is greater than 1, which means that the reinforcing member 5 is also configured on the main surface SA2 of the mounting side spacer.

[0088] Figure 5 (e) is the comparison method, which is the case where the main surface SA2 of the mounting side spacer is inclined relative to the main surface SA1 of the main body side spacer. Figure 5 Unlike case (c), where T1 / Ts is approximately 0.9 at the part of the mounting-side spacer main surface SA2 furthest from the main surface SA1 of the main body spacer, T1 / Ts is 1 or more at the part of the mounting-side spacer main surface SA2 closest to the main surface SA1 of the main body spacer. Furthermore, a reinforcing member 5 is present on the mounting-side spacer main surface SA2 at the part of the mounting-side spacer main surface SA2 closest to the main surface SA1 of the main body spacer.

[0089] In the comparison method Figure 5 (d) and Figure 5 In (e), the reinforcing member 5 extends to the mounting-side spacer main surface SA2. Therefore, when the multilayer ceramic capacitor 1 is mounted on the substrate, the conduction between the spacer 4 and the substrate is hindered due to the presence of the reinforcing member 5. Furthermore, if the reinforcing member 5 covers the mounting-side spacer main surface SA2 of the spacer 4, the solder will not adhere to the spacer 4 during installation, thus increasing the possibility of installation defects.

[0090] However, in the implementation method Figure 5 (a) to Figure 5 In (c), there is no reinforcing member 5 on the main surface SA2 of the mounting side spacer, thus ensuring good conductivity between the spacer 4 and the substrate, i.e., good conductivity between the substrate and the external electrode 3. Moreover, the solder adheres to the spacer 4 during installation, thus reducing the possibility of poor installation.

[0091] The reinforcing member 5 is preferably not disposed between the external electrode 3 and the spacer 4 on the main surface SA1 of the spacer 4 on the main body side of the spacer 4. Since the reinforcing member 5 is not disposed between the external electrode 3 and the spacer 4, the electrical connection between the external electrode 3 and the spacer 4 can be guaranteed.

[0092] However, if there is a gap between the spacer 4 and the portion of the second main surface A2 of the laminate 2 where the external electrode 3 is not disposed, the reinforcing member 5 can also be configured to enter this gap. By entering the gap, the adhesive area between the reinforcing member 5 and the spacer 4 increases, thus increasing the adhesive force. In addition, even if the gap is not completely filled with the reinforcing member 5, the propagation of vibration can be mitigated through the gap.

[0093] In addition, the larger the area covered by the reinforcing member 5 on the surface other than the main surface SA of the spacer, the better the reinforcing effect, so it is preferred.

[0094] (Capacitor-side coating 51)

[0095] Figure 6 This diagram illustrates the coating state of the capacitor-side covering portion 51 of the reinforcing member 5 onto the capacitor body 1A. The capacitor-side covering portion 51 covers a given length range in the stacking direction on the second main surface A2 side of the capacitor body 1A. When the length in the stacking direction of the capacitor body 1A is set to Tc, and the length in the stacking direction of the capacitor-side covering portion 51 is set to T2, Figure 6 The extent to which T2 / Tc is 0.05 in (a) Figure 6 The extent to which T2 / Tc is 0.5 in (b) Figure 6 The degree to which T2 / Tc is 1.1 in (c).

[0096] As long as the capacitor-side covering portion 51 of the reinforcing member 5 covers the capacitor body 1A, the covered area can also be as follows. Figure 6 (a) and Figure 6 As in (a), it is part of, but preferably as in Figure 6 The reinforcement 5 covers the entire capacitor body 1A as shown in (c). That is, the reinforcement 5 preferably covers a portion of the spacer 4 and the entire capacitor body 1A. By covering the entire capacitor body 1A with the reinforcement 5, the buffering capacity of the reinforcement 5 is improved, thereby increasing the impact resistance when an impact is applied to the multilayer ceramic capacitor 1.

[0097] (Determination Method)

[0098] As an example, the length of the lamination direction T of the reinforcing member 5 described above can be measured as follows.

[0099] When the wiring substrate and the multilayer ceramic capacitor 1 are bonded together by solder, the multilayer ceramic capacitor 1 bonded to the wiring substrate by solder is ground in the width direction W, and ground until the LT cross-section position of the multilayer ceramic capacitor 1 and the reinforcing member 5 is visible.

[0100] Next, using a microscope (e.g., BX-51, Olympus) connected to a digital microscope camera (e.g., DP22, Olympus), and appropriately adjusted to a comprehensive magnification of 10 to 50 times, the length of the stacking direction T of the reinforcing member 5 is measured.

[0101] (Effect of reinforcement part 5)

[0102] According to the embodiment, a reinforcing member 5 is provided, having a spacer-side covering portion 52 covering 4.9% or more of the stacking direction T of each of the two spacers, and a capacitor-side covering portion 51 on the spacer side that extends continuously from the spacer-side covering portion 52 and covers the outer periphery of the capacitor body 1A. This allows for maintaining the effect of whistling suppression and ensuring resistance to substrate bending.

[0103] Furthermore, in each of the spacers 4, the spacer-side covering portion 52 of the reinforcing member 5 continuously covers the central spacer end face SC1 and the two spacer side faces SB of the two spacer end faces SC.

[0104] As a result, the area of ​​the reinforcing member 5 covering the spacer 4 is increased, thus making the substrate more resistant to bending.

[0105] Furthermore, with the reinforcing member 5 covering the entire capacitor body 1A, the substrate bending resistance can be made more robust.

[0106] (Manufacturing method of multilayer ceramic capacitor 1)

[0107] Figure 7 This is a flowchart illustrating the manufacturing method of the multilayer ceramic capacitor 1. The manufacturing method of the multilayer ceramic capacitor 1 includes a multilayer body manufacturing process S1, an external electrode forming process S2, a spacer arrangement process S3, and a reinforcing member arrangement process S4.

[0108] Figure 8 This diagram illustrates the laminate manufacturing process S1 and the external electrode formation process S2.

[0109] Figure 9 This diagram illustrates the spacer configuration process S3.

[0110] Figure 10 This diagram illustrates the reinforcement component configuration process S4.

[0111] (Laminated body manufacturing process S1)

[0112] A ceramic slurry containing ceramic powder, binder, and solvent is formed into a sheet on the surface of a carrier film using a die coater, gravure coater, or micro-gravure coater to create a laminated ceramic green sheet 101 that forms the dielectric layer 14. Next, a conductive paste is printed into a strip on the laminated ceramic green sheet 101 using screen printing, inkjet printing, or gravure printing to create a conductive pattern 102 that forms the internal electrode layer 15, thus creating a raw material sheet 103.

[0113] Next, as Figure 8 As shown in (a), multiple raw material sheets 103 are stacked such that the conductive patterns 102 face the same direction and are staggered by, for example, half a pitch in the length direction L between adjacent raw material sheets 103. Furthermore, on both sides of the stacked raw material sheets 103, outer layer ceramic green sheets 112 are stacked to form the outer layer 12.

[0114] Multiple stacked raw material sheets 103 and the outer layer are pressed together using ceramic green sheets 112 through isostatic pressing and other methods to produce... Figure 8 The mother block 110 shown in (b)

[0115] Next, move the mother block 110 along... Figure 8 Cut along the cutting line X shown in (b) and the cutting line Y intersecting with the cutting line X to manufacture multiple [products / processes]. Figure 8 The stacked body 2 shown in (c)

[0116] (External electrode formation process S2)

[0117] Next, a conductive paste containing copper (Cu) is applied and sintered onto the end face C of the laminate 2 to form a base electrode layer 30. The base electrode layer 30 is formed to cover not only the end faces C on both sides of the laminate 2, but also to the main face A and the side face B of the laminate 2, and to cover a portion of the end face C side of the main face A.

[0118] Next, on the surface of the base electrode layer 30, a nickel (Ni) plating layer 31a and a tin (Sn) plating layer 31b disposed on the surface of the nickel (Ni) plating layer 31a are formed as plating layers 31, thus manufacturing the substrate electrode layer 30. Figure 8 The capacitor body 1A is shown in (d).

[0119] (Spacer configuration process S3)

[0120] Prepare spacer manufacturing paste 41 for use in spacer manufacturing.

[0121] The spacer manufacturing paste 41 contains metals including copper (Cu), nickel (Ni), tin (Sn), and silver (Ag), phenolic resin, solvent, and additives. In this case, rosin may be included instead of phenolic resin.

[0122] Examples of phenolic resins include phenolic varnish resin, phenolic aralkyl resin, cresol phenolic varnish resin, TCRT-butylphenol phenolic varnish resin, nonylphenol phenolic varnish resin, etc., as well as methyl phenolic resin, poly(p-hydroxystyrene), etc.

[0123] Figure 9 This diagram illustrates the spacer configuration process S3.

[0124] like Figure 9 As shown in (a), firstly, spacer manufacturing paste 41 is applied to the holding substrate 40 by means of screen printing or dispensing.

[0125] Next, as Figure 9As shown in (b), the capacitor body 1A is mounted on the upper surface of the holding substrate 40 with its second main surface A2 facing the holding substrate 40. At this time, the external electrode 3 of the capacitor body 1A is aligned with the spacer manufacturing paste 41, and the spacer manufacturing paste 41 is attached to the capacitor body 1A.

[0126] In this state, a heating process is performed. When at least a portion of the metal in the paste forms an intermetallic compound to form a metal region MP, a portion of the phenolic resin is taken into the metal region MP, and a portion is discharged from the metal region MP and cured to form a spacer 4 that is bonded to the capacitor body 1A.

[0127] In the above examples, a structure comprising an intermetallic compound and a phenolic resin is shown as an example of a spacer material, but this is not a limitation. The structure may also contain other types of metallic components, or it may contain resins such as epoxy resin, rosin, and glass components in addition to phenolic resin. Furthermore, it may be formed without resin.

[0128] After that, as Figure 9 As shown in (c), the capacitor body 1A and the spacer 4 are separated from the holding substrate 40. Alternatively, not limited to this manufacturing method, the spacer manufacturing paste can be directly applied to the surface of the capacitor body 1A in the desired shape and then heat-treated to form the spacer.

[0129] (Reinforcing component configuration process S4)

[0130] Figure 10 This diagram illustrates the reinforcement component configuration process S4. First, the surface of the capacitor body 1A, to which the spacer 4 is configured, is cleaned with a solvent. (As shown...) Figure 10 As shown in (a), after cleaning, the capacitor bodies 1A with spacers 4 are arranged so that the spacers 4 face upwards.

[0131] Next, as Figure 10 As shown in (b), for a capacitor body 1A equipped with spacers 4, an insulating resin layer is formed between the first spacer 4a and the second spacer 4b, forming the central portion 52b of the reinforcing member 5, using a distributor or squeegee printing. The amount of wetting creep towards the end face SC1 of the central spacer can be varied by the amount of insulating resin.

[0132] When the insulating resin is introduced into the interface between the spacer 4 and the laminate 2, it can be introduced by evacuating a vacuum after the insulating resin has been applied. The amount introduced can be controlled by varying the evacuation time and pressure.

[0133] Next, as Figure 10As shown in (c), an insulating resin is applied so that it extends across the outer periphery of the capacitor body 1A and the outer periphery of the spacer 4.

[0134] Then, by heating the applied insulating resin at 100-200°C for 20-80 minutes, the insulating resin is cured, forming a capacitor-side coating 51 on the outer periphery of the capacitor body 1A and a spacer-side coating 52 on the outer periphery of the spacer 4. The multilayer ceramic capacitor 1 is manufactured through the above process.

[0135] (Evaluation of the implementation method)

[0136] Next, the results of evaluation 1 and evaluation 2 for the multilayer ceramic capacitor 1 with the reinforcing member 5 of the embodiment will be explained.

[0137] (The multilayer ceramic capacitor used in the evaluation 1)

[0138] The capacitor body 1A was used under the following conditions.

[0139] Length direction L: 1.6mm

[0140] Width direction W: 0.8mm

[0141] Stacking direction T: 0.8mm

[0142] Main component of internal electrode: Ni

[0143] Dielectric layer: BaTiO3

[0144] The main component of the substrate electrode layer: Cu

[0145] First plating layer: Ni

[0146] Second plating layer: Sn

[0147] The composition of spacer 4 is as follows.

[0148] The composition of solder powder is 31.5 wt% Cu-10wt%Ni powder with a D50 of 5μm, 3 wt% Sn-0.5 wt% Ag-3μm solder powder with a D50 of 5μm, and 10 wt% rosin, solvent and additives.

[0149] Reinforcing component 5 is an insulating resin with epoxy resin as the main agent and phenolic resin as the curing agent.

[0150] (Evaluation 1)

[0151] (1) Ten of each of the five types of stacked ceramic capacitors 1 with the length of the spacer side covering portion 52 relative to the length of the spacer 4 being 0%, 1.2%, 3.6%, 4.9%, and 13.5% respectively were prepared.

[0152] Next, the multilayer ceramic capacitor 1 was mounted on a 1.6mm thick JIS substrate using lead-free solder and held for 5 seconds with a 4mm bend.

[0153] Next, in order to confirm the presence or absence of cracks in the multilayer ceramic capacitor 1, cutting was performed until the width W was reduced to 1 / 2.

[0154] The stacked ceramic capacitors near the mounting surface were observed using a microscope (BX-51, Olympus) connected to a digital microscope camera (DP22, Olympus) and appropriately adjusted to a comprehensive magnification of 10x.

[0155] Confirm the presence or absence of cracks in the multilayer ceramic capacitor 1. Set multilayer ceramic capacitors with a crack occurrence rate (number of multilayer ceramic capacitors 1 with cracks / number of confirmed multilayer ceramic capacitors 1) of 50% or more to ×, and set multilayer ceramic capacitors with a crack occurrence rate of less than 50% to 0.

[0156] (Evaluation 2)

[0157] It is mounted on the same multilayer ceramic capacitor mounting substrate as the multilayer ceramic capacitor used in Evaluation 1, and is housed in a sound-absorbing box.

[0158] The microphone is configured to face the mounting substrate portion on which the stacked ceramic capacitor 1 is located.

[0159] An AC voltage of 1Vpp at a frequency of 3kHz was applied to the multilayer ceramic capacitor 1, and the howling level of the multilayer ceramic capacitor 1 was measured using a sound-collecting microphone. The howling of the multilayer ceramic capacitor 1 was collected by the sound-collecting microphone, and the output of the sound-collecting microphone was input to an FFT (Fast Fourier Transform) analyzer via a sound collector, where the sound pressure level was analyzed.

[0160] Based on the sound pressure level of the multilayer ceramic capacitor 1, multilayer ceramic capacitors with an improvement of less than 10% are set as Δ, and multilayer ceramic capacitors with an improvement of more than 10% are set as 0.

[0161] Figure 11 This is a table showing the results of evaluation 1 and evaluation 2 for the multilayer ceramic capacitor 1 with reinforcement 5 of the embodiment.

[0162] As shown in Evaluation 1, in embodiments where the length of the spacer-side covering portion 52 in the stacking direction T is 4.9% and 13.5% of the spacer length, the crack incidence rate is less than 50%, while in comparison embodiments where the length of the spacer-side covering portion 52 in the stacking direction T is 0%, 1.2%, and 3.6% of the spacer length, the crack incidence rate is 50% or more.

[0163] As shown in Evaluation 2, the sound pressure level is improved by providing the reinforcing member 5. In particular, the improvement is more than 10% when the length of the spacer-side covering portion in the stacking direction is more than 1.2% of the length of the spacer, including 4.9% or more in the embodiment.

[0164] As shown in the evaluation results above, the multilayer ceramic capacitor 1 according to the embodiment has verified a reduction in crack occurrence rate, and in addition, a reduction in howling occurrence.

[0165] Furthermore, in the above-described experimental examples of spacer materials, a structure containing intermetallic compounds and rosin was shown, but this is not a limitation. The structure may also contain other types of metallic components, or it may contain resins such as epoxy resin and phenolic resin, or glass components in addition to rosin. Alternatively, it may be formed without resin.

[0166] The embodiments of the present invention have been described above, but the present invention is not limited to these embodiments and can be implemented in various ways without departing from the spirit of the present invention. The present invention includes the following combinations.

[0167] <1> A laminated ceramic electronic component includes a capacitor body, two spacers, and a reinforcing member. The capacitor body comprises: a laminated body, alternatingly stacked dielectric layers and internal electrode layers, having two main faces opposite each other in a stacking direction, two end faces opposite each other in a length direction intersecting the stacking direction, and two side faces opposite each other in a width direction intersecting the stacking direction and the length direction; and two external electrodes, respectively disposed on the two end faces, connected to the internal electrode layers, and extending to the two main faces, covering a portion of the main faces. The two spacers are located on one main face side of the capacitor body, separating the external electrodes covering the portion of the main face. The electrodes are sandwiched between two spacer sides, each having two spacer main faces facing each other in the stacking direction, two spacer end faces facing each other in the length direction, and two spacer side faces facing each other in the width direction. The reinforcing member has a spacer side covering portion covering more than 5.0% of each of the two spacers in the stacking direction, and a capacitor side covering portion of the spacer side that extends from the spacer side covering portion and covers the outer periphery of the capacitor body. The spacer side covering portion continuously covers the opposing spacer end faces of the two spacer end faces that face each other, and the two spacer side faces.

[0168] <2> according to <1> or <2> The described laminated ceramic electronic component includes spacers having two opposing spacer main faces in the lamination direction, two opposing spacer end faces in the length direction, and two opposing spacer side faces in the width direction. In each spacer, the spacer side cover of the reinforcing member covers the outer spacer end face of one of the two spacer end faces, which is located outside the lamination in the length direction.

[0169] <3> according to <1> or <2> The described laminated ceramic electronic component, wherein the reinforcing member covers the entire capacitor body.

[0170] <4> according to <1> to <3> The laminated ceramic electronic component described in any one of the following, wherein an orientation identification mark is disposed in the laminate.

[0171] <5> according to <1> to <4> The laminated ceramic electronic component described in any one of the following, wherein an orientation identification mark is provided in the spacer.

[0172] Explanation of reference numerals in the attached figures

[0173] SA spacer main surface

[0174] SA1 Main body side spacer main surface

[0175] SA2 Mounting Side Spacer Main Surface

[0176] SB spacer side

[0177] SC spacer end face

[0178] SC1 Central side spacer end face

[0179] SC2 outer spacer end face

[0180] 1. Multilayer ceramic capacitor

[0181] 1A capacitor body

[0182] 2-layered body

[0183] 3 External Electrodes

[0184] 3a First external electrode

[0185] 3b Second external electrode

[0186] 4 spacers

[0187] 4a First spacer

[0188] 4b Second spacer

[0189] 5 Reinforcing components

[0190] 51 Capacitor-side coating

[0191] 52 Spacer side cover

[0192] 52a Side view

[0193] 52b Central Department.

Claims

1. A laminated ceramic electronic component comprising a capacitor body, two spacers, and a reinforcing member. The capacitor body comprises: A laminate, alternately stacked with dielectric layers and internal electrode layers, having two main faces opposite each other in the stacking direction, two end faces opposite each other in the length direction intersecting the stacking direction, and two side faces opposite each other in the width direction intersecting both the stacking direction and the length direction; and Two external electrodes are respectively disposed on the two end faces, connected to the internal electrode layer, and extend to the two main faces, covering a portion of the main faces, or a portion of opposite side faces, or both faces. The two spacers are disposed on one main surface or one side surface of the capacitor body, respectively on one end surface and the other end surface, and each has two spacer main surfaces opposite each other in the stacking direction, two spacer end surfaces opposite each other in the length direction, and two spacer side surfaces opposite each other in the width direction. The reinforcing member has: The spacer-side covering portion covers at least 4.9% of the length of each of the two spacers in the stacking direction or the width direction; and The capacitor-side covering portion continues from the spacer-side covering portion and covers the spacer side of the outer periphery of the capacitor body. The spacer side cover continuously covers one of the two spacer end faces, the opposing spacer end faces of the two spacers that are opposite each other, and the two spacer side faces.

2. The laminated ceramic electronic component according to claim 1, wherein, The spacers each have two spacer main faces opposite each other in the stacking direction, two spacer end faces opposite each other in the length direction, and two spacer side faces opposite each other in the width direction. In each of the spacers, the spacer-side covering portion of the reinforcing member covers the outer spacer end face of one of the two spacer end faces, which is located outside the longitudinal direction of the laminate.

3. The laminated ceramic electronic component according to claim 1 or claim 2, wherein, The reinforcing member covers the entire capacitor body.

4. The laminated ceramic electronic component according to any one of claims 1 to 3, wherein, The stacked body is equipped with orientation identification marks.

5. The laminated ceramic electronic component according to any one of claims 1 to 4, wherein, The spacer is equipped with a direction identification mark.

Images