Conductive connector, power semiconductor module comprising said conductive connector, and method for manufacturing conductive connector

Abstract

The invention relates to an electrically conductive connection (1) for a power semiconductor module (16) having at least one power semiconductor component (19), comprising:-an external connection (2), which is configured to be connected externally in an electrically conductive manner,-an internal connection (5), which is configured to be connected to the power semiconductor component (19) in an electrically conductive manner, and-an intermediate connection (8) which connects the outer connection (2) to the inner connection (5) in an electrically conductive manner, the intermediate connection (8) comprising at least one spring (9). The invention further relates to a power semiconductor module (16) and to a method for producing an electrically conductive connection (1).

Description

Technical Field

[0001] This disclosure relates to a conductive connector for a power semiconductor module, a power semiconductor module, and a method for manufacturing the conductive connector. Summary of the Invention

[0002] Embodiments of this disclosure relate to a conductive connector that is particularly reliable and simple to implement and use. Further embodiments of this disclosure relate to a power semiconductor module having such a conductive connector, and a method for manufacturing such a conductive connector.

[0003] This is achieved through the subject matter of the independent claims. Further embodiments will be apparent from the dependent claims described below.

[0004] A conductive connector for a power semiconductor module having at least one power semiconductor component is described. The term "power" as used herein and hereinafter refers, for example, to a power semiconductor module, power semiconductor component, power semiconductor device, and / or power semiconductor chip suitable for handling voltages and currents exceeding 100 V and / or exceeding 10 A (exemplary, voltages reaching 10 kV and currents reaching 5000 A).

[0005] According to an embodiment, the conductive connector includes an external connection portion configured to be electrically connected externally.

[0006] External connections may include, for example, physical interfaces configured to connect to external circuits, external connectors, busbars, and / or external devices. Specifically, external connections are configured to receive or supply electrical signals to external circuits and / or external devices. Physical interfaces may include, for example, plugs, screws / bolts, sockets, terminals, jacks, and / or connectors.

[0007] The external connection portion has a main extending direction, which extends, for example, in a vertical direction. Exemplarily, the external connection portion includes a first end region and a second end region. The physical interface is disposed in the first end region.

[0008] Specifically, the external connection is formed of a conductive material. The external connection may include, for example, a metal, such as copper or a copper alloy.

[0009] According to an embodiment, the conductive connector includes an internal connection portion configured to be conductively connected to a power semiconductor component.

[0010] The internal connection may include, for example, an additional physical interface configured to connect to a power semiconductor component. For instance, the internal connection may be configured to be directly and electrically connected to the power semiconductor component. That is, the additional physical interface is directly connected to the power semiconductor component and therefore in direct, close contact with it.

[0011] Alternatively, an additional physical interface can be electrically connected to the power semiconductor component. That is, an auxiliary connector can be arranged between the additional physical interface and the power semiconductor component.

[0012] Power semiconductor components include, for example, at least one power semiconductor device. The power semiconductor device may include at least one insulated-gate bipolar transistor (IGBT) and / or at least one metal-oxide-semiconductor field-effect transistor (MOSFET).

[0013] The internal connection portion has a main extending direction, which extends, for example, parallel to or inclined to the vertical direction. Exemplarily, the internal connection portion includes an additional first end region and an additional second end region. An additional physical interface is arranged in the additional second end region.

[0014] Specifically, the internal connection is formed of a conductive material. The internal connection may include, for example, a metal, such as copper or a copper alloy.

[0015] According to an embodiment, the conductive connector includes an intermediate connecting portion that electrically connects the outer connecting portion and the inner connecting portion. For example, the intermediate connecting portion is fixed to a corresponding end region of the outer connecting portion and / or the inner connecting portion.

[0016] Specifically, the intermediate connection is formed of a conductive material. The intermediate connection may include, for example, metal. Exemplarily, the materials of the outer connection, the intermediate connection, and the inner connection may be the same or different from each other.

[0017] According to an embodiment of the conductive connector, the intermediate connecting portion includes at least one spring. Specifically, the spring is configured to be conductive. Exemplarily, the spring comprises an elastic material, such as a metal (e.g., spring steel).

[0018] A spring is configured to be mechanically flexible, so that when the spring deforms (such as being compressed or stretched), it stores mechanical energy, i.e., potential energy. When a force is applied to the spring, it deforms in proportion to the force (which is either tensile or compressive).

[0019] For example, the contact pressure between the intermediate connecting part and at least one of the external connecting part and the internal connecting part depends on the stored mechanical energy.

[0020] In summary, this conductive connector with a spring-loaded intermediate connection for power semiconductor modules offers the following advantages in particular.

[0021] Compared to commonly used signal paths based on integral terminals made of stamped and bent copper sheets or on gate printing or control boards with corresponding internal and external connectors, this conductive connector is particularly cost-effective by using a standard spring instead of a separate terminal design (which comes with high manufacturing costs). Furthermore, this conductive connector offers a high degree of design flexibility and is not limited to common interconnects that extend only in the vertical direction. Additionally, the connection between the intermediate connection and the external and internal connections does not require a specific interconnection process. Therefore, purely mechanical assembly is possible. Moreover, high flexibility is provided in the selection of spring type, as the spring in the intermediate connection is not limited to a helical spring.

[0022] According to another embodiment of the conductive connector, at least one spring in the intermediate connection portion is a tension spring.

[0023] A tension spring is configured to resist tensile or pulling forces. For example, that is, the spring stores mechanical energy when stretched. In particular, a tension spring is configured to extend in length when a force oriented away from the center of the tension spring is applied to the end region of the tension spring along the main extension direction of the tension spring.

[0024] The force required to stretch the tension spring depends on the spring constant. The spring constant, in turn, depends on at least one of the following: wire diameter, spring size, spring shape, number of coils, and material properties.

[0025] According to another embodiment of the conductive connector, the internal connection portion is configured to be conductively connected to at least one of the following: the emitter electrode and / or source electrode of the power semiconductor component, the collector electrode and / or drain electrode of the power semiconductor component, the gate electrode of the power semiconductor component, a sensor, and a control device in the power semiconductor module.

[0026] For example, the emitter electrode is an auxiliary emitter electrode and / or the source electrode is an auxiliary source electrode. Similarly, the collector electrode is an auxiliary collector electrode and / or the drain electrode is an auxiliary drain electrode.

[0027] For example, the auxiliary emitter electrode and the auxiliary collector electrode are used for sensing, thereby supporting control of the power semiconductor components, and possible protection mechanisms can be implemented based on the sensing results.

[0028] Sensors can be, for example, monitoring components for power semiconductor devices. A sensor can be a temperature sensor, such as a negative temperature coefficient (NTC) sensor.

[0029] The control device is, for example, a gate driver, such as a gate driver in a smart power semiconductor component.

[0030] According to another embodiment of the conductive connector, the intermediate connecting portion includes a first end and a second end opposite to the first end, and at least one spring is disposed between the first end and the second end. The first end, the spring, and the second end are integrally connected to each other, for example.

[0031] The main extension directions of the first end and the second end may extend parallel to each other. Alternatively, the main extension directions of the first end and the second end may extend at an angle to each other, particularly at an angle of less than 180°.

[0032] According to another embodiment of the conductive connector, at least one of the first end and the second end has a mechanical structure configured to attach to at least one of the external connection portion and the internal connection portion.

[0033] Specifically, the mechanical structure is a fixing device configured to hold and position the first end at the external connection portion in a mechanically fixed manner and / or hold and position the second end at the internal connection portion in a mechanically fixed manner.

[0034] According to another embodiment of the conductive connector, at least one of the external connecting portion and the internal connecting portion has an additional mechanical mechanism configured to attach to at least one of the first end and the second end.

[0035] Specifically, the additional mechanical structure is a separate fixing device configured to receive the intermediate connecting portion. Alternatively, the mechanical structure is configured to receive another mechanical structure. That is, the fixing device and the additional fixing device advantageously improve the mechanical fixing connection between the intermediate connecting portion and the external connecting portion and / or the intermediate connecting portion and the internal connecting portion.

[0036] According to another embodiment of the conductive connector, at least one of the outer connecting portion and the inner connecting portion has a recess for receiving at least one of the first end and the second end. In particular, the recess is an additional mechanical structure.

[0037] For example, the recess extends perpendicular to the vertical direction. The recess may completely and / or partially penetrate at least one of the outer connecting portion and the inner connecting portion. The recess may be arranged, for example, in the second end region of the outer connecting portion and / or, for example, in the first end region of the inner connecting portion.

[0038] According to another embodiment of the conductive connector, the recess is formed as a hole or groove.

[0039] Specifically, the hole completely penetrates at least one of the outer connecting portion and the inner connecting portion. Specifically, the groove partially penetrates at least one of the outer connecting portion and the inner connecting portion. The groove may extend completely or partially around the periphery of at least one of the outer connecting portion and the inner connecting portion. Exemplarily, the groove extends around the periphery by up to 50%, and the groove is arranged on the side of at least one of the outer connecting portion and the inner connecting portion opposite to the intermediate connecting portion.

[0040] According to another embodiment of the conductive connector, a portion of at least one of the first end and the second end extends regionally inclined to the main extending direction of the intermediate connecting portion. For example, a portion of at least one of the first end and the second end extends regionally perpendicular to the main extending direction of the intermediate connecting portion.

[0041] Specifically, the segment faces at least one of the external connecting portion (particularly the second end region of the external connecting portion) and the internal connecting portion (particularly the first end region of the internal connecting portion). Another segment, facing the spring, extends, for example, parallel to the main extending direction of the intermediate connecting portion, from at least one of the first and second ends. The segment and the other segment each form a first end and a second end.

[0042] That is, this section can be advantageously received by another mechanical structure.

[0043] According to another embodiment of the conductive connector, at least one of the first end and the second end has a curved portion. Exemplarily, at least one of the first end and the second end has a hook-shaped or loop-shaped portion. The portion is, for example, a mechanical structure that can be received by another mechanical structure. Alternatively, the other mechanical structure has a hook-shaped or loop-shaped portion.

[0044] For example, it is possible that the segment surrounds at least one of the external connecting portion and the internal connecting portion, or at least one of the external connecting portion and the internal connecting portion surrounds the segment.

[0045] According to another embodiment of the conductive connector, at least one of the first end and the second end is connected to at least one of the external connection portion and the internal connection portion by clamping connection, adhesive connection, welding connection and / or fusion connection or any other suitable connection method.

[0046] According to another embodiment of the conductive connector, the intermediate connecting portion is formed as a separate component relative to at least one of the outer connecting portion and the inner connecting portion.

[0047] According to another embodiment of the conductive connector, the intermediate connection portion is electrically connected to at least one of the external connection portion and the internal connection portion via a dry contact.

[0048] For example, a dry contact is a conductive connection formed through physical contact between two conductive surfaces (i.e., the end of the intermediate connection portion and at least one of the outer and inner connections portions) without any additional substance or material (such as solder, liquid, or gel). For example, a dry contact is held in place by pressure and / or tensile force.

[0049] Advantageously, this dry contact can be maintained and repaired in a particularly simple and convenient manner.

[0050] Additionally, the intermediate connection is electrically connected to at least one of the external and internal connection portions via a connection portion (e.g., additional solder). Exemplarily, the solder may mechanically secure and / or fasten the dry contact.

[0051] According to another embodiment of the conductive connector, the intermediate connecting portion is integrally formed with at least one of the outer connecting portion and the inner connecting portion.

[0052] Specifically, the intermediate connecting portion is integrally formed with at least one of the external and internal connecting portions through welding, casting, and / or forging processes. This creates a strong and reliable connection between the different parts, minimizing the risk of failure or separation over time.

[0053] According to another embodiment of the conductive connector, the internal connection portion is formed by a sheet-like solid terminal or a lead terminal, or the internal connection portion is formed by a compression spring. The compression spring is configured, for example, to provide a compressive contact force to the power semiconductor component (particularly the substrate of the power semiconductor device or the base plate of the power semiconductor component).

[0054] According to another embodiment of the conductive connector, the main extension direction of the inner connection portion is inclined relative to the main extension direction of the intermediate connection portion. Exemplarily, the main extension direction of the inner connection portion and the main extension direction of the intermediate connection portion form an angle. This angle is, for example, 90° or less, such as 45°.

[0055] For example, the main extension direction of the external connecting portion is inclined relative to the main extension direction of the intermediate connecting portion. Exemplarily, the main extension direction of the external connecting portion is perpendicular to the main extension direction of the intermediate connecting portion.

[0056] According to another embodiment of the conductive connector, the intermediate region includes at least two springs. Directly adjacent springs are, for example, directly connected to each other. That is, directly adjacent springs are integrally formed together. Alternatively, directly adjacent springs are connected by a connector (such as a support member) or by a connector (such as a corresponding portion of the housing of a power semiconductor module in which springs are disposed).

[0057] For example, the springs are connected in series and / or in parallel.

[0058] According to another embodiment of the conductive connector, at least two springs extend in directions parallel to or inclined to each other. If the two springs extend in directions parallel to each other, the connector is formed as straight. If the two springs extend in directions inclined relative to each other, the connector is formed as curved.

[0059] Furthermore, a power semiconductor module is described herein that may include conductive connectors as described above. Therefore, features relating to the conductive connectors are also disclosed in conjunction with this power semiconductor module, and vice versa.

[0060] According to an embodiment, a power semiconductor module includes a power semiconductor component having a substrate extending in a main extending plane. Exemplarily, the power semiconductor component includes at least one power semiconductor device disposed on the substrate. That is, the power semiconductor component may include, for example, at least one power semiconductor device, a substrate, and / or a base plate. For example, one or more substrates are disposed on the base plate. The main extending plane of the substrate is, for example, perpendicular to the vertical direction. That is, the main extending plane of the substrate extends in a lateral direction perpendicular to the vertical direction.

[0061] For example, a power semiconductor device includes a power semiconductor chip mounted on a substrate. Exemplarily, the substrate is part of or mounted on a substrate of the power semiconductor device.

[0062] According to an embodiment, the power semiconductor module includes a conductive connector, which includes an external connection portion, an internal connection portion, and an intermediate connection portion that conductively connects the external connection portion and the internal connection portion.

[0063] According to an embodiment of the power semiconductor module, the intermediate connection includes at least one spring disposed between a first end and a second end.

[0064] According to embodiments of the power semiconductor module, an internal connection is electrically connected to a power semiconductor component. For example, the internal connection is disposed on and in direct, close contact with the power semiconductor component. If the internal connection is formed by a compression spring, the compression spring is configured to be pressed, for example, in a direction toward the substrate and / or the chip, thereby forming a pressing contact. Alternatively, the internal connection is indirectly electrically connected to the power semiconductor component via at least one auxiliary connector.

[0065] According to another embodiment, the power semiconductor module includes a housing for a power semiconductor component. The housing surrounds the power semiconductor component, particularly in three dimensions. Specifically, the housing completely surrounds the substrate of the power semiconductor device and the power semiconductor component.

[0066] According to another embodiment of the power semiconductor module, the external connection portion is disposed within the housing. Specifically, the external connection portion may be integrated and / or mounted within the housing.

[0067] For example, the housing includes a recess that completely penetrates a wall of the housing. The wall extends, for example, in a lateral direction perpendicular to the vertical direction. Exemplarily, an external connection is disposed within the recess. Specifically, the external connection protrudes vertically beyond the wall.

[0068] According to another embodiment of the power semiconductor module, the first end and the second end are at the same distance from the substrate, particularly at the same distance from the substrate in the vertical direction. Exemplarily, the first end and the second end are at the same distance from the horizontal wall. That is, the main extension direction of the intermediate connection is parallel to the lateral direction.

[0069] According to another embodiment of the power semiconductor module, the first end and the second end are at different distances from the substrate, particularly in the vertical direction. Exemplarily, the first end and the second end are at different distances from the horizontal wall. That is, the main extension direction of the intermediate connection is inclined relative to the lateral direction.

[0070] Furthermore, this paper describes a method for manufacturing conductive connectors, by which conductive connectors as described above can be manufactured or produced. Therefore, features related to conductive connectors are also disclosed in conjunction with this method, and vice versa.

[0071] According to an embodiment of the method, an external connection portion is provided, which is configured to be electrically connected externally.

[0072] According to an embodiment of the method, an internal connection portion is provided, which is configured to be conductively connected to a power semiconductor component.

[0073] According to an embodiment of the method, an intermediate connecting portion is provided.

[0074] According to an embodiment of the method, the first end of the intermediate connecting portion is attached to the outer connecting portion.

[0075] According to an embodiment of the method, the second end of the intermediate connecting portion is attached to the inner connecting portion. Attached Figure Description

[0076] The accompanying drawings are included to provide further understanding. In the drawings, elements with the same structure and / or function may be designated by the same reference numerals. It should be understood that the embodiments shown in the drawings are illustrative and not necessarily drawn to scale.

[0077] Figure 1 This is a schematic diagram of a conductive connector according to an exemplary embodiment, and Figure 2 This is a schematic diagram of a power semiconductor module according to an exemplary embodiment. Detailed Implementation

[0078] according to Figure 1 The conductive connector 1 of the exemplary embodiment includes an external connecting part 2, an intermediate connecting part 8 and an internal connecting part 5.

[0079] The external connection portion 2 has a main extending direction that extends vertically. Further, the external connection portion 2 has a first end region 3 and a second end region 4. The first end region 3 of the external connection portion is configured for external conductive connection. Exemplarily, the first end region 3 of the external connection portion includes a physical interface. Therefore, for example, an external connector or busbar can be connected to the first end region 3 both electrically and mechanically.

[0080] The second end region 4 of the external connection is configured to be conductive and mechanically connected to the intermediate connection 8.

[0081] The internal connection portion 5 has a main extending direction that extends vertically. Further, the internal connection portion 5 has a first end region 6 and a second end region 7. The second end region 7 of the internal connection portion is configured to be electrically connected to a power semiconductor component. Exemplarily, the second end region 7 of the internal connection portion includes an additional physical interface. The second end region 7 of the internal connection portion can provide electrical and mechanical connections to the power semiconductor component, particularly to the substrate 20 of the power semiconductor component or the power semiconductor device 22.

[0082] The intermediate connecting portion 8 includes a first end portion 10, a spring 9, and a second end portion 13, wherein the spring 9 is arranged between the first end portion 10 and the second end portion 13. The intermediate connecting portion 8 has a main extending direction that extends in a lateral direction inclined to, and particularly perpendicular to, the vertical direction.

[0083] The first end portion 10 is electrically connected to the second end region 4 of the external connection portion. The first end portion 10 includes a segment 11 and another segment 12, wherein the segment 11 faces the external connection portion 2, and the other segment 12 faces the spring 9.

[0084] The first end segment 11 may extend at a regional angle to the main extending direction of the intermediate connecting portion 8. For example, the first end segment 11 may be formed as a curved shape. That is, the first end segment 11 may be formed as a hook.

[0085] The first end portion 11 may include a mechanical structure, such as a hook. The second end region 4 of the external connection portion may include an additional mechanical structure, such as a recess, hole, or groove. The first end portion 11 may be received by the additional mechanical structure of the second end region of the external connection portion 2.

[0086] The other segment 12 at the first end extends parallel to the main extension direction of the intermediate connecting portion 8.

[0087] The second end portion 13 is electrically connected to the first end region 6 of the internal connection portion. The second end portion 13 includes a segment 14 and another segment 15, wherein the segment 14 faces the internal connection portion 5, and the other segment 15 faces the spring 9.

[0088] The second end segment 14 may extend at a regional angle to the main extending direction of the intermediate connecting portion 8. For example, the second end segment 14 may be formed as a curved shape. That is, the second end segment 14 may be formed as a hook.

[0089] The second end portion 14 may include a mechanical structure, such as a hook. The first end region 6 of the internal connecting portion may include an additional mechanical structure, such as a recess, hole, or groove. The second end portion 14 may be received by the additional mechanical structure of the first end region 6 of the internal connecting portion.

[0090] The other segment 15 at the second end extends parallel to the main extension direction of the intermediate connecting portion 8.

[0091] according to Figure 2 The power semiconductor module 16 of the exemplary embodiment includes, according to Figure 1 The conductive connector 1. The power semiconductor module 16 further includes a housing 17 and a power semiconductor component 19. Figure 2 In this exemplary embodiment, the power semiconductor component includes a substrate 20 and a power semiconductor device 22. The power semiconductor device 22 is disposed on the substrate 20.

[0092] The housing 17 surrounds the power semiconductor component, particularly in three dimensions. That is, the housing 17 provides a cavity for the power semiconductor component. Furthermore, a conductive connection 1 is also arranged at least partially within the housing 17. Specifically, the conductive connection 1 provides a conductive connection from the inside of the cavity to the outside of the cavity, i.e., a signal line. The conductive connection 1 may be part of the electrical connection between the power semiconductor device 22 of the power semiconductor component 19 and the outside of the cavity.

[0093] Therefore, the external connection part 2 is provided in the housing 17. For this purpose, the housing 17 includes a recess that completely penetrates the wall 18 of the housing 17. The external connection part 2 is fed through the recess. That is, the external connection part 2 is specifically a feed-through connection part.

[0094] The first end 10 and the second end 13 of the intermediate connecting portion 8 are at the same distance from the substrate 20. That is, the main extending direction of the intermediate connecting portion 8 extends parallel to the main extending plane of the substrate 20. In particular, the main extending direction of the intermediate connecting portion 8 extends parallel to the main extending plane of the wall 18. The wall 18 may be a module cover.

[0095] Figure Labels 1 Conductive connector 2 External connection part 3. First end region of the external connection part 4. Second end region of the external connection part 5 Internal connection parts 6. First end region of the internal connection part 7. Second end region of the internal connection part 8 Intermediate connecting part 9 springs 10 First end 11. The first end section 12 Other sections at the first end 13 Second end 14. The section at the second end 15. Other sections at the second end 16 power semiconductor modules 17 housing 18 walls 19 power semiconductor components 20 substrate 21 recess 22 power semiconductor devices

Claims

1. A conductive connector (1) for a power semiconductor module (16) having at least one power semiconductor component (19), the conductive connector comprising: - External connection part (2), which is configured to be electrically connected externally. - Internal connection portion (5), the internal connection portion being configured to be conductively connected to the power semiconductor component (19), and - An intermediate connecting portion (8) electrically connects the outer connecting portion (2) and the inner connecting portion (5), wherein, - The intermediate connecting part (8) includes at least one spring (9).

2. The conductive connector (1) according to claim 1, wherein, - The at least one spring (9) of the intermediate connecting part (8) is a tension spring (9).

3. The conductive connector (1) according to claim 1 or 2, wherein, The internal connection portion (5) is configured to be electrically connected to at least one of the following: - The emitter electrode and / or source electrode of the power semiconductor component (19), - The collector and / or drain electrode of the power semiconductor component (19), - The gate electrode of the power semiconductor component (19), - Sensors or control devices in the power semiconductor module (16).

4. The conductive connector (1) according to any one of claims 1 to 3, wherein, - The intermediate connecting portion (8) includes a first end (10) and a second end (13) opposite to the first end (10), and the at least one spring (9) is arranged between the first end and the second end. - At least one of the first end (10) and the second end (13) has a mechanical structure configured to be attached to at least one of the external connection portion (2) and the internal connection portion (5).

5. The conductive connector (1) according to claim 4, wherein, - At least one of the external connecting portion (2) and the internal connecting portion (5) has an additional mechanical structure configured to be attached to at least one of the first end (10) and the second end (13).

6. The conductive connector (1) according to claim 5, wherein, - At least one of the external connecting portion (2) and the internal connecting portion (5) has a recess for receiving at least one of the first end portion (10) and the second end portion (13), and - The recess is formed as a hole or groove.

7. The conductive connector (1) according to any one of claims 4 to 6, wherein, - A segment (11, 14) of at least one of the first end (10) and the second end (13) extends regionally at an angle to the main extension direction of the intermediate connecting portion (8).

8. The conductive connector (1) according to claim 7, wherein, - The segment (11, 14) of at least one of the first end (10) and the second end (13) is curved.

9. The conductive connector (1) according to any one of claims 4 to 8, wherein, - At least one of the first end (10) and the second end (13) is connected to at least one of the external connection part (2) and the internal connection part (5) by clamping connection, adhesive connection, welding connection and / or fusion connection.

10. The conductive connector (1) according to any one of claims 1 to 9, wherein, - The intermediate connecting part (8) is formed as a separate piece relative to at least one of the external connecting part (2) and the internal connecting part (5).

11. The conductive connector (1) according to any one of claims 1 to 10, wherein, - The intermediate connecting part (8) is electrically connected to at least one of the external connecting part (2) and the internal connecting part (5) via a dry contact.

12. The conductive connector (1) according to any one of claims 1 to 9, wherein, - The intermediate connecting part (8) is integrally formed with at least one of the external connecting part (2) and the internal connecting part (5).

13. The conductive connector (1) according to any one of claims 1 to 12, wherein, - The internal connection part (5) is formed by a sheet-like solid terminal or a pin terminal, or - The internal connecting part (5) is formed by a compression spring.

14. The conductive connector (1) according to any one of claims 1 to 13, wherein, - The main extension direction of the inner connecting part (5) is inclined relative to the main extension direction of the intermediate connecting part (8).

15. The conductive connector (1) according to any one of claims 1 to 14, wherein, - The intermediate region includes at least two springs (9), and - The main extension directions of the at least two springs (9) are parallel to each other or inclined to each other.

16. A power semiconductor module (16), comprising: - A power semiconductor component (19) having a substrate (20) extending in a main extension plane, and - A conductive connector (1) includes an external connecting portion (2), an internal connecting portion (5), and an intermediate connecting portion (8) electrically connecting the external connecting portion (2) and the internal connecting portion (5), wherein, - The intermediate connecting part (8) includes at least one spring (9), which is arranged between the first end (10) and the second end (13). - The internal connection part (5) is electrically connected to the power semiconductor component (19).

17. The power semiconductor module (16) according to claim 16, further comprising: - A housing (17) for the power semiconductor component (19), wherein, - The external connection part (2) is disposed in the housing (17).

18. The power semiconductor module (16) according to any one of claims 16 or 17, wherein, - The first end (10) and the second end (13) are at the same distance from the substrate (20).

19. The power semiconductor module (16) according to any one of claims 16 or 17, wherein, - The first end (10) and the second end (13) are at different distances from the substrate (20).

20. A method for manufacturing a conductive connector (1) for a power semiconductor module (16), the power semiconductor module (16) having at least one power semiconductor component (19), the method comprising: - Provide an external connection part (2), the external connection part being configured to be electrically connected externally. - Provides an internal connection portion (5) configured to be conductively connected to a power semiconductor component (19), and - Provide an intermediate connecting part (8). - Attach the first end (10) of the intermediate connecting part (8) to the external connecting part (2), and - Attach the second end (13) of the intermediate connecting part (8) to the inner connecting part (5).

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