An image processing method
By setting the horizontal step displacement related to the number of lasers and the image resolution, the problem of low laser exposure efficiency and accuracy was solved, achieving a more efficient and accurate image exposure effect.
Patent Information
- Application Number
- CN202511404938.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-29
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2045-09-29
AI Technical Summary
In existing technologies, the number of lasers differs from the image resolution, and a fixed step size exposure method is used, resulting in low exposure efficiency and accuracy.
By defining the resolution d micrometers of the initial image and the number of lasers K, the horizontal step displacement of the mounting base is set to (K divided by 42 and taken as an integer * N-1) * d micrometers. This allows for the precise selection of K columns of image bars in each sub-image, thus achieving accurate exposure of the lasers.
It improves image exposure accuracy and efficiency, ensuring that sub-images after each exposure can be accurately stitched together to restore the original image.
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Figure CN120891706B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The technical field belongs to the field of laser direct writing technology, and particularly relates to an image processing method in the field. BACKGROUND
[0002] In the field of laser direct imaging, a plurality of lasers evenly arranged in a row on a mounting seat are controlled by a computer to expose respective corresponding first column image strips in a sequence from bottom to top, then move horizontally by a certain step under the control of the computer control system, expose respective corresponding second column image strips in a sequence from top to bottom, then continue to expose respective corresponding third column image strips horizontally by a certain step, and so on until all the image strips are exposed. This exposure method does not take into account the relationship between the number of lasers and the image resolution, and if the number of lasers participating in exposure is different and the resolution of the image is different, exposure with a fixed step cannot improve the exposure efficiency and accuracy. SUMMARY
[0003] The present application provides an image processing method, which aims to solve the problem of low accuracy and efficiency when lasers expose images.
[0004] The scheme of the present application is as follows:
[0005] An image processing method applied to a laser direct writing device, comprising:
[0006] Step 1: defining an initial image to be exposed including a plurality of columns of image strips evenly arranged in a row, defining the horizontal position of the first column image strip on the right of the initial image as initial position 0, and setting the starting position of the first laser on the right of K lasers evenly distributed in a row on a mounting seat as coinciding with the initial position 0; the initial image is used for K lasers to expose in sequence in a sequence of right-to-left and up-and-down reciprocating motion;
[0007] Step 2: each time the mounting seat moves horizontally to the left from the initial position 0, K column image strips corresponding to the exposure of K lasers on the mounting seat are selected from the initial image to form a sub-image; the number of sub-images is equal to the number of horizontal movements of the mounting seat;
[0008] wherein: when the first laser on the right of the mounting seat is at the initial position 0, the sub-image composed of K column image strips corresponding to the exposure of K lasers is defined as the first sub-image; the interval distance between every two adjacent lasers in K lasers is N*d microns, N represents the number of image strips between every two adjacent lasers, and d represents the interval distance between every two adjacent columns of image strips in the initial image or the size of the pixels constituting the initial image; the step displacement of each horizontal movement of the mounting seat to the left is (an integer obtained by dividing K by 42*N-1)*d microns.
[0009] In some embodiments, the interval distance between every two adjacent columns of image strips in each sub-image is N*d microns.
[0010] In some embodiments, the K lasers on the mounting seat are at the same vertical height, and the distance h of the K lasers moving up and down in the vertical direction is equal to the height of the image strips in the initial image.
[0011] In some embodiments, the movement of the mounting seat is controlled by a control module, wherein when the mounting seat moves from top to bottom or from bottom to top, the control module controls the K lasers to expose corresponding image strips, and when the mounting seat moves horizontally under the control of the control module, the K lasers are all controlled not to emit light.
[0012] In some embodiments, the control module is a chip processor.
[0013] In some embodiments, K=128, N=42, and d=10, the interval distance between every two adjacent lasers is 420 microns, and the step displacement is 1250 microns.
[0014] In some embodiments, K=256, N=42, and d=10, the interval distance between every two adjacent lasers is 420 microns, and the step displacement is 2510 microns.
[0015] The beneficial technical effects of the present application are as follows: According to the resolution d microns of the initial image and the number K of lasers, the present application sets the horizontal step displacement of the mounting seat each time as (the integer obtained by dividing K by 42*N-1)*d, and after each horizontal movement of the mounting seat (the mounting seat is defined as having moved 0 times horizontally when it is at the initial position 0), K columns of image strips corresponding to the K lasers on the mounting seat are extracted from the initial image to form a sub-image. The more times the mounting seat moves horizontally, the more sub-images are obtained. Each sub-image is used for exposure by the K lasers on the mounting seat at different horizontal positions. The precise setting of the horizontal step displacement affects the accurate selection of the K columns of image strips in each sub-image, so that the distribution of the K columns of image strips in each sub-image is more accurate, and the K lasers can accurately expose the corresponding K columns of image strips after moving horizontally by the step displacement each time, thereby improving the image exposure accuracy and efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 FIG. 1 shows a schematic diagram of the K uniformly distributed lasers on the mounting seat 10 moving horizontally a plurality of times, and each time the step displacement is (the integer obtained by dividing K by 42*N-1)*d microns to expose the initial image 20;
[0017] Figure 2 Fig. 1 shows a schematic diagram of a first sub-image 21 extracted from the initial image 20 of the K columns of image strips corresponding to the K laser exposures when the mounting seat 10 is in the initial position 0 (i.e. not horizontally moved); Figure 1 Fig. 1 shows a schematic diagram of a first sub-image 21 extracted from the initial image 20 of the K columns of image strips corresponding to the K laser exposures when the mounting seat 10 is in the initial position 0 (i.e. not horizontally moved);
[0018] Figure 3 Fig. 1 shows a schematic diagram of a first sub-image 21 extracted from the initial image 20 of the K columns of image strips corresponding to the K laser exposures when the mounting seat 10 is in the initial position 0 (i.e. not horizontally moved);
[0019] Figure 4 Fig. 1 shows a schematic diagram of a first sub-image 21 extracted from the initial image 20 of the K columns of image strips corresponding to the K laser exposures when the mounting seat 10 is in the initial position 0 (i.e. not horizontally moved); Figure 1 Fig. 1 shows a schematic diagram of a first sub-image 21 extracted from the initial image 20 of the K columns of image strips corresponding to the K laser exposures when the mounting seat 10 is in the initial position 0 (i.e. not horizontally moved);
[0020] Figure 5 Fig. 1 shows a schematic diagram of a first sub-image 21 extracted from the initial image 20 of the K columns of image strips corresponding to the K laser exposures when the mounting seat 10 is in the initial position 0 (i.e. not horizontally moved); Figure 1 Fig. 1 shows a schematic diagram of a first sub-image 21 extracted from the initial image 20 of the K columns of image strips corresponding to the K laser exposures when the mounting seat 10 is in the initial position 0 (i.e. not horizontally moved); DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.
[0022] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application; the terms "first", "second", "third" are only used for description and cannot be understood as indicating or implying relative importance; in addition, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through an intermediate object, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0023] Reference Figure 1 , the initial image 20 includes several columns of image strips evenly distributed in a row, and the interval distance between every two adjacent columns of image strips is d microns (see Figure 1 enlarged in A of FIG. 1), that is, the resolution of the initial image 20 is also d microns, but in order to ensure the clarity of image display, there are 8 columns of image strips evenly distributed between every two columns of image strips not shown in the initial image 20, so Figure 1 the distance between every two columns of image strips shown in FIG. 1 is 9*d, but this does not represent the actual interval distance between every two adjacent columns of image strips of the initial image 20. For example, if the resolution of the initial image 20 is 2540 dpi, the value of d is 10 microns, that is, the size of each pixel constituting each column of image strips is 10 microns. Among the K lasers on the mounting seat 10, the interval distance between every two adjacent lasers (the lasers are schematically represented by circles) is N*d microns, that is, the number of columns of image strips between every two adjacent lasers is N. It should be noted that before exposure, the position of the first column of image strips on the right of the initial image 20 in the horizontal direction is defined as the initial position 0, and the first laser on the right of the mounting seat 10 is arranged to be aligned with the initial position 0 in the horizontal direction (see Figure 1 enlarged in A of FIG. 1). That is, before exposure, the first laser on the right of the mounting seat 10 is in the same vertical direction as the first column of image strips on the right of the initial image 20, that is, the initial position of the first laser on the right is also arranged to be aligned with 0. The overall exposure path of the K lasers on the mounting seat 10 is as follows: first, the K lasers are arranged to be at the lower end of the several columns of image strips of the initial image 20, and it is ensured that the first laser on the right and the first column of image strips on the right of the initial image 20 are both at the initial position 0, and then the control module (not shown) is started, which controls the mounting seat 10 to move upwards from the lower end of the image strips, that is, the K lasers are flush with the lower end of the image strips, and the K lasers emit light while moving upwards, until the K lasers are at the top end of the image strips after moving upwards by a distance h (h is the height of the image strips), so that the first exposure of the mounting seat 10 without horizontal movement is completed. During the first exposure of the K lasers, since the mounting seat 10 does not move horizontally, it is defined that the mounting seat 10 moves horizontally by the 0th step. Before the K lasers are exposed from the bottom to the top for the first time, the K columns of image strips in the initial image 20 corresponding to the exposure of the K lasers are extracted to form a first sub-image 21, see Figure 2 . It can be understood that the K columns of image strips of the first sub-image 21 are just aligned with the K lasers when exposed, and at this time the first laser on the right is just at the initial position 0 and is aligned with the first column of image strips on the right of the initial image 20 in the vertical direction.
[0024] ReferenceFigure 4 When the K lasers complete the first exposure, the mount 10 at the top of the image strip is controlled by the control module to move left for the first time, and the step distance is: (the integer N-1 of K divided by 42)*d microns. It can be understood that after the first left movement of the mount 10, the K columns of image strips of the initial image 20 corresponding to the K lasers are different from the K columns of image strips of the initial image 20 corresponding to the mount 10 at the initial position 0. After the first left movement of the mount 10, the K columns of image strips of the initial image 20 corresponding to the K lasers are extracted to form a second sub-image 22, as shown in Figure 4 The K lasers on the mount 10 move from top to bottom, and after the K columns of image strips of the second sub-image 22 are exposed, the mount 10 at the lower end of the image strip moves downward by a distance h in the vertical direction.
[0025] Reference Figure 5 When the K lasers complete the second exposure, the mount 10 at the lower end of the image strip is controlled by the control module to move left for the second time, and the step distance is still: (the integer N-1 of K divided by 42)*d microns. During the second movement, the K lasers are controlled by the control module to not emit light. It can be understood that at this time, the mount 10 moves horizontally left by a total distance of 2*(the integer N-1 of K divided by 42)*d microns relative to the initial position. After the second movement, the control module controls the K lasers on the mount 10 to expose the corresponding K columns of image strips in the direction from bottom to top. The K columns of image strips are extracted from the corresponding columns of image strips in the initial image 20 in Figure 1 to form a third sub-image 23 for exposure.
[0026] The mount 10 continues to move back and forth in the vertical direction in the above-mentioned manner, and moves left by (the integer N-1 of K divided by 42)*d microns in the horizontal direction each time to successively expose the remaining columns of image strips of the initial image 20 in Figure 1 to achieve the purpose of finally exposing all the image strips. It should be noted that each time the mount 10 moves in the horizontal direction, the corresponding K columns of image strips in the initial image 20 are extracted to form a sub-image for exposure by the K lasers.
[0027] It should be further noted that Figure 1 in the vertical direction are shown in different positions for the convenience of the reader to understand the positions after the step displacement in the horizontal direction: (the integer N-1 of K divided by 42)*d microns. In fact, the actual positions of the mount 10 in the vertical direction are either at the lower end of the image strips of the initial image 20 or at the upper end of the image strips of the initial image 20.
[0028] It is also necessary to point out that during the whole process of the K laser exposure initial image of the mounting seat 10, the initial image 20 remains stationary in the horizontal direction.
[0029] In this application, the control module is a chip processor, which can be a chip processor with various data processing capabilities.
[0030] In this application, according to the resolution d microns of the initial image and the number K of lasers, the horizontal step displacement of the mounting seat is set reasonably and accurately, which is: (the integer obtained by dividing K by 42*N-1)*d. After each horizontal movement of the mounting seat (the initial position 0 is defined as 0 horizontal movement), K column image strips corresponding to the K lasers on the mounting seat are extracted from the initial image to form a sub-image. The more the horizontal movements of the mounting seat, the more sub-images are obtained. Each sub-image is used for exposure of the K lasers on the mounting seat at different horizontal positions. The accurate selection of K column image strips in each sub-image is affected by the accurately set horizontal step displacement, so that the distribution of K column image strips in each sub-image is more accurate, and K lasers can accurately expose the corresponding K column image strips after each overall horizontal step displacement of K lasers, thereby improving the image exposure accuracy and efficiency.
[0031] In one of the application scenarios of the laser direct technology, one of the values of K is 128, i.e. there are 128 lasers uniformly distributed on the mounting seat 10, N is 42, d=10 microns, and the distance between each adjacent two lasers is 420 microns, so the step displacement is: (the integer obtained by dividing 128 by 42*42-1)*d=1250 microns. That is, the step displacement of the mounting seat 10 is set to 1250 microns each time, which is equivalent to 10 microns less than the distance between every adjacent 4 lasers, i.e. 3*420 microns=1250 microns, and the 10 microns is exactly equal to the distance between each adjacent two rows of image strips, which makes the position of the first laser on the right of the mounting seat lag behind the position of the fourth laser from the right of the mounting seat by 10 microns after each translation of 1250 microns, i.e. lagging behind the distance of 1 column image strip by 10 microns. The advantage of this design is that the sub-image composed of the extracted image strips each time can be spliced to restore the initial image, thereby improving the image exposure accuracy and efficiency.
[0032] In one application scenario of the laser direct technology, one of the values of K is 256, i.e. 256 lasers are uniformly distributed on the mounting base 10, N is 42, d=10 microns, and the interval distance between every two adjacent lasers is 420 microns, so the step displacement is: (the integer obtained by dividing 256 by 42*42-1)*d=2510 microns. That is, the step displacement of the mounting base 10 is set to 2510 microns each time, which is 10 microns less than the interval distance between every 4 adjacent lasers, i.e. 6*420 microns=2520 microns, and the 10 microns is just equal to the distance between every two adjacent image strips, which makes the position of the first laser on the right of the mounting base lag behind the position of the seventh laser from the right of the mounting base by 10 microns after the mounting base is translated by 2510 microns each time, i.e. just lags behind the position of the first laser on the right of the mounting base by the distance of one image strip, so the advantage of this design is that the sub-image composed of the image strips extracted each time can be spliced to restore the initial image, thereby improving the exposure accuracy and exposure efficiency of the image.
[0033] Finally, it should be noted that: the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or replace some of the technical features with equivalent ones, as long as they are within the spirit and principles of the present application. Any modification, equivalent replacement, improvement, etc. shall be included in the protection scope of the present application.
Claims
1. An image processing method applied in a laser direct writing device, characterized in that, The method comprises the following steps: Step 1: defining an initial image to be exposed as comprising a row of evenly distributed image strips, defining the horizontal position of the first image strip on the right of the initial image as initial position 0, and setting the starting position of the first laser on the right of K lasers evenly distributed in a row on the mounting seat as coinciding with the initial position 0; the initial image is used for exposure of the K lasers in turn in the order of right-to-left and up-and-down reciprocating motion; Step 2: each time the mounting seat moves horizontally to the left from the initial position 0, K image strips corresponding to the exposure of the K lasers on the mounting seat are selected from the initial image to form a sub-image; the number of the sub-images is equal to the number of horizontal movements of the mounting seat; wherein: when the first laser on the right of the mounting seat is at the initial position 0, the sub-image formed by K image strips corresponding to the exposure of the K lasers is defined as the first sub-image; the interval distance between every two adjacent lasers of the K lasers is N*d microns, N represents the number of image strips between every two adjacent lasers, and d represents the interval distance between every two adjacent image strips in the initial image or the size of the pixels constituting the initial image; the step displacement of each horizontal movement of the mounting seat to the left is (the integer obtained by dividing K by 42*N-1)*d microns.
2. The image processing method of claim 1, wherein, In each sub-image, the interval distance between every two adjacent image strips is N*d microns.
3. The image processing method of claim 1, wherein: The K lasers on the mounting seat are located at the same vertical height, and the distance h of the K lasers moving up and down in the vertical direction is equal to the height of the image strips in the initial image.
4. The image processing method of claim 1, wherein: The mounting seat is controlled to move by a control module, wherein when the mounting seat moves from top to bottom or from bottom to top, the control module controls the image strips corresponding to the exposure of the K lasers, and when the mounting seat moves horizontally under the control of the control module, the K lasers are all controlled not to emit light.
5. The image processing method of claim 4, wherein: The control module is a chip processor.
6. The image processing method of any one of claims 1 to 5, wherein: K=128, N=42, d=10, the interval distance between every two adjacent lasers is 420 microns, and the step displacement is 1250 microns.
7. The image processing method of any one of claims 1 to 5, wherein: K=256, N=42, d=10, the interval distance between every two adjacent lasers is 420 microns, and the step displacement is 2510 microns.
Citation Information
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