Heat dissipation module, heat dissipation system, control method, electronic device and storage medium

Abstract

The application relates to the technical field of server heat dissipation, and discloses a heat dissipation module, a heat dissipation system, a control method, electronic equipment and a storage medium, which comprise a liquid cooling assembly, a jet flow assembly and a heat conduction element, the liquid cooling assembly has a first face and a liquid cooling cavity, the first face is used for being in contact with a heating face, wherein the heating face is located on a heating part, and the heating face has a core heating area; the jet flow assembly is located on the liquid cooling assembly, the jet flow assembly has a jet flow cavity, and a jet flow hole is arranged in the jet flow cavity; a first end of the heat conduction element is located in the jet flow cavity, the jet flow hole faces the first end of the heat conduction element, a second end of the heat conduction element penetrates through the liquid cooling cavity, a part corresponding to the first face of the second end of the heat conduction element is in contact, and the second end of the heat conduction element is close to the core heating area, so that the heat dissipation requirement of a high heat flux density operation processing module is met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server heat dissipation, in particular to a heat dissipation module, a heat dissipation system, a control method, an electronic device and a storage medium. BACKGROUND

[0002] In the related art, the heat dissipation module is the core guarantee for the stable operation of the server, which can timely take away a large amount of heat generated by the hardware such as the operation processing module in the server during work, avoid performance degradation, frequent crashes, and even burning of the hardware due to high temperature, and ensure that the server always maintains in a safe temperature range.

[0003] However, as the demand for server performance improvement is getting higher and higher, the power consumption of the operation processing module is also increasing (such as the heat flux density of the operation processing module jumps from 20 W / cm 2 ~50W / cm 2 to 200W / cm 2 The above), the liquid cooling heat sink and the air cooling heat sink cannot meet the heat dissipation needs of the high heat flux density operation processing module. SUMMARY

[0004] The present application provides a heat dissipation module, a heat dissipation system, a control method, an electronic device and a storage medium to meet the heat dissipation needs of the high heat flux density operation processing module.

[0005] In a first aspect, the present application provides a heat dissipation module, comprising a liquid cooling assembly, a jet flow assembly and a heat conduction element, the liquid cooling assembly has a first face and a liquid cooling cavity, the first face is used for contacting a heat generating face, wherein the heat generating face is located on a heat generating part, and the heat generating face has a core heat generating area; the jet flow assembly is located on the liquid cooling assembly, and the jet flow assembly has a jet flow cavity, and the jet flow cavity is provided with a jet flow hole; a first end of the heat conduction element is located in the jet flow cavity, the jet flow hole faces the first end of the heat conduction element, a second end of the heat conduction element penetrates the liquid cooling cavity, and the second end of the heat conduction element contacts a part corresponding to the first face, and the second end of the heat conduction element is close to the core heat generating area.

[0006] In a second aspect, the present application further provides a heat dissipation system, comprising a cooling assembly, a liquid storage tank, a water distributor, a liquid cooling pump, a jet flow pump, a reflux device, a controller and the heat dissipation module in the first aspect: the input end of the liquid storage tank is in communication with the output end of the cooling assembly; the input end of the water distributor is in communication with the output end of the liquid storage tank; the liquid cooling pump is in communication with the output end of the water distributor; the jet flow pump is in communication with the output end of the water distributor; the input end of the jet flow cavity is in communication with the jet flow pump, and the input end of the liquid cooling cavity is in communication with the liquid cooling pump; the input end of the reflux device is in communication with the output end of the jet flow cavity and the output end of the liquid cooling cavity, and the output end of the reflux device is in communication with the input end of the cooling assembly; the controller is connected with the cooling assembly, the jet flow pump and the liquid cooling pump.

[0007] In a third aspect, the application further provides a control method of a heat dissipation system, applied to the controller, the heat generating component being an operation processing module, comprising:

[0008] obtaining an average occupancy rate of the operation processing module, a first temperature preset value and an occupancy rate preset value of the operation processing module;

[0009] obtaining a real-time temperature of the operation processing module;

[0010] determining whether the real-time temperature is not less than the first temperature preset value;

[0011] if the real-time temperature is not less than the first temperature preset value, determining whether the average occupancy rate is not less than the occupancy rate preset value;

[0012] if the average occupancy rate is not less than the occupancy rate preset value, increasing the rotation speed of the liquid cooling pump and the jet pump, and returning to the step of obtaining the real-time temperature of the operation processing module;

[0013] if the average occupancy rate is less than the occupancy rate preset value, increasing the rotation speed of the jet pump, and returning to the step of obtaining the real-time temperature of the operation processing module.

[0014] In a fourth aspect, the application further provides an electronic device, comprising a memory and a processor, the memory being used for storing a computer program, and the processor being used for executing the computer program to realize the steps of the control method of the heat dissipation system.

[0015] In a fifth aspect, the application further provides a computer readable storage medium, the computer readable storage medium storing a computer program, wherein the computer program is executed by a processor to realize the steps of the control method of the heat dissipation system.

[0016] Beneficial effects: the application provides a heat dissipation module, a heat dissipation system, a control method, an electronic device and a storage medium, a jet assembly is fixedly arranged on a liquid cooling assembly, a first end of a heat conduction element is located in a jet cavity, a second end of the heat conduction element penetrates a liquid cooling cavity, and the second end of the heat conduction element is in contact with a part corresponding to the first face, the second end of the heat conduction element is close to a core heat generating area, so that a large amount of heat generated by the core heat generating area can be transmitted to the first end of the heat conduction element located in the jet cavity, the jet flow of the heat conduction element is rapidly cooled through the jet hole in the jet cavity, so that the core heat generating area cannot be cooled, the stability of the working temperature of the heat generating component is ensured, and the heat dissipation requirement of the high heat flux operation processing module is met. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the specific embodiments or the related art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the related art description. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0018] Figure 1 Axial view of a heat dissipation module according to an embodiment of the present application;

[0019] Figure 2 Axial view of a heat dissipation module according to an embodiment of the present application;

[0020] Figure 3 Axial view of a heat dissipation module according to an embodiment of the present application;

[0021] Figure 4 Axial view of a heat dissipation module according to an embodiment of the present application; Figure 3 Axial view of a heat dissipation module according to an embodiment of the present application; Axial view of a heat dissipation module according to an embodiment of the present application;

[0022] Axial view of a heat dissipation module according to an embodiment of the present application; Figure 5 Axial view of a heat dissipation module according to an embodiment of the present application; Figure 4 Axial view of a heat dissipation module according to an embodiment of the present application; Axial view of a heat dissipation module according to an embodiment of the present application;

[0023] Axial view of a heat dissipation module according to an embodiment of the present application; Figure 6 Axial view of a heat dissipation module according to an embodiment of the present application; Figure 3 Axial view of a heat dissipation module according to an embodiment of the present application; Axial view of a heat dissipation module according to an embodiment of the present application;

[0024] Axial view of a heat dissipation module according to an embodiment of the present application; Figure 7 Axial view of a heat dissipation module according to an embodiment of the present application; Axial view of a heat dissipation module according to an embodiment of the present application;

[0025] Axial view of a heat dissipation module according to an embodiment of the present application; Figure 8 Axial view of a heat dissipation module according to an embodiment of the present application; Axial view of a heat dissipation module according to an embodiment of the present application;

[0026] Axial view of a heat dissipation module according to an embodiment of the present application; Figure 9 Axial view of a heat dissipation module according to an embodiment of the present application; Axial view of a heat dissipation module according to an embodiment of the present application;

[0027] Axial view of a heat dissipation module according to an embodiment of the present application; Figure 10 Axial view of a heat dissipation module according to an embodiment of the present application; Axial view of a heat dissipation module according to an embodiment of the present application;

[0028] Axial view of a heat dissipation module according to an embodiment of the present application; Figure 11 Axial view of a heat dissipation module according to an embodiment of the present application; Axial view of a heat dissipation module according to an embodiment of the present application;

[0029] Axial view of a heat dissipation module according to an embodiment of the present application; Axial view of a heat dissipation module according to an embodiment of the present application;

[0030] 1, heat dissipation module; 2, cooling assembly; 3, liquid storage tank; 4, water distributor; 5, liquid cooling pump; 6, jet pump; 7, flow collector;

[0031] 11, liquid cooling assembly; 12, jet assembly; 13, heat conduction element;

[0032] 111, first face; 112, liquid cooling cavity; 1121, isolation column; 1122, heat dissipation fin; 113, via hole; 114, phase change cavity; 1141, heat conduction cylinder; 115, liquid cooling shell; 116, phase change shell; 1161, phase change lower shell; 117, sealing ring groove; 118, detection ring groove;

[0033] 121, jet flow cavity; 1211, liquid discharge port; 122, jet flow hole; 123, jet flow shell; 124, jet flow nozzle; 125, perforation;

[0034] 81, first temperature sensor; 82, first pressure sensor; 83, second temperature sensor; 84, second pressure sensor; 85, third temperature sensor. DETAILED DESCRIPTION

[0035] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0036] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the person skilled in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For the person skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] In related technologies, the heat dissipation module is the core guarantee for the stable operation of the server, which can timely take away a large amount of heat generated by the hardware such as the operation processing module in the server during work, avoid performance degradation, frequent crashes, and even burning of the hardware due to high temperature, and ensure that the server always maintains in a safe temperature range.

[0038] However, as the demand for server performance improvement becomes larger and larger, the power consumption of the operation processing module also increases continuously (such as the heat flux density of the operation processing module jumps from 20 W / cm 2 ~50W / cm 2 to 200 W / cm 2 The above), generally speaking, the heat dissipation efficiency of the liquid cooling type heat sink is higher than that of the air cooling type heat sink, and the liquid cooling type heat sink can meet the heat flux density of the operation processing module at 180 W / cm 2The following heat dissipation requirements, so that the liquid cooling radiator, air-cooled radiator has been unable to meet the high heat flux of the operation processing module of the heat dissipation requirements.

[0039] To solve the above technical problems, the application provides a heat dissipation module, a heat dissipation system, a control method, an electronic device and a storage medium to meet the heat dissipation requirements of high heat flux operation processing modules.

[0040] The embodiments of the application are described below in conjunction with Figures 1 to 11 .

[0041] According to the embodiments of the application, in a first aspect, a heat dissipation module 1 is provided, as shown in Figures 1 to 6 , comprising a liquid cooling assembly 11, a jet flow assembly 12 and a heat conducting element 13, and the specific scheme is as follows.

[0042] As shown in Figures 1 to 2 , the liquid cooling assembly 11 is an aluminum alloy component, which can also be a component of other materials, and the liquid cooling assembly 11 has a first face 111 and a liquid cooling cavity 112, and the first face 111 is used to contact the heating surface, wherein the heating surface is located on the heating part, and the heating surface has a core heating area.

[0043] It can be understood that the heating part is a component that can generate heat during operation, such as an operation processing module, etc., specifically a central processing unit and a graphics processing unit, etc., wherein the core heating area refers to the area with higher temperature than other areas on the heating surface of the heating part.

[0044] It can also be understood that the first face 111 is a surface on the liquid cooling assembly 11, which can be of any shape, such as square, circular, etc.

[0045] As shown in Figures 1 to 2 , the jet flow assembly 12 can be a component of aluminum alloy material or other materials, and the jet flow assembly 12 is located on the liquid cooling assembly 11, and the jet flow assembly 12 has a jet flow cavity 121, and the jet flow cavity 121 is provided with a jet flow hole 122.

[0046] Specifically, the jet flow assembly 12 can be fixedly arranged on the liquid cooling assembly 11 by welding or bolt connection; preferably, the connection is made by bolt connection, wherein the number of bolts can be 3-6, preferably 4, and the number of bolts can also be other numbers, which can be set according to actual needs.

[0047] The heat conducting element 13 is a component with high heat conduction efficiency, specifically, the heat conducting element 13 is a heat pipe, or a component with a cavity (the cavity is filled with a phase change medium); wherein the heat conducting element 13 can be any shape such as a cylinder or a cuboid, and is preferably a cylinder.

[0048] As shown in Figure 3and Figure 6 As shown, the first end of the heat-conducting element 13 is located inside the jet cavity 121, and the jet hole 122 faces the first end of the heat-conducting element 13. Specifically, the jet assembly 12 is provided with a perforation 125, and the first end of the heat-conducting element 13 extends into the jet cavity 121 through the perforation 125. The number of jet holes 122 can be one or more, which can be selected and set according to specific needs.

[0049] Specifically, not shown in the figure, a baffle is provided inside the jet cavity 121, which separates the jet cavity 121 into a liquid inlet cavity and a heat exchange cavity. The jet hole 122 is located on the baffle, and the number of jet holes 122 can be one or more. The first end of the heat-conducting element 13 is located inside the heat exchange cavity.

[0050] It is understandable that the jet hole 122 is directed towards the heat conduction element 13, that is, the temperature-controlled medium ejected from the jet hole 122 impacts the surface of the heat conduction element 13 to cool it down. As for whether the jet hole 122 is directed towards the end face or the side face of the first end of the heat conduction element 13, it can be selected and set according to actual needs. Preferably, the jet hole 122 jets onto the end face of the first end of the heat conduction element 13, that is, the axis of the jet hole 122 is perpendicular to the end face of the first end of the heat conduction element 13.

[0051] like Figure 3 and Figure 6 As shown, the second end of the heat-conducting element 13 penetrates the liquid cooling cavity 112, and the second end of the heat-conducting element 13 contacts the corresponding part of the first face 111. The second end of the heat-conducting element 13 is close to the core heating area.

[0052] It is understood that the part corresponding to the first face 111 refers to the part on the liquid cooling assembly 11 that is perpendicular to the first face 111 and integrally connected with the first face 111, that is, the part between the first face 111 and the liquid cooling cavity 112.

[0053] It can also be understood that the second end of the heat-conducting element 13 contacts the corresponding part of the first face 111. Specifically, the end face or side of the second end of the heat-conducting element 13 contacts the corresponding part of the first face 111. For example, the end face of the second end of the heat-conducting element 13 directly contacts the inner surface of the first face 111 in the liquid cooling cavity 112; or, for example, a blind hole is provided on the inner surface of the first face 111 in the liquid cooling cavity 112, and the second end of the heat-conducting element 13 is inserted into the blind hole; or, for example, a through hole is provided on the inner surface of the first face 111 in the liquid cooling cavity 112, and the second end of the heat-conducting element 13 is inserted into the through hole, wherein the end face of the second end of the heat-conducting element 13 directly contacts the core heating area.

[0054] It can also be understood that the second end of the heat conduction element 13 is close to the core heat generating area, that is, the heat conduction element 13 can be in contact with the core heat generating area, or can be arranged separately from the core heat generating area, but the distance is very close.

[0055] In a specific use process, as shown in Figures 1 to 6 , the heat generating part takes the central processor as an example, the heat generating surface is the top surface of the central processor, and the core heat generating area is the part corresponding to the operation processing area in the central processor on the heat generating surface.

[0056] The inner surface corresponding to the first surface part 111 in the liquid cooling cavity 112 is provided with a blind hole, and the second end of the heat conduction element 13 is inserted into the blind hole.

[0057] The first surface part 111 is attached to the top of the central processor, and specifically, the heat-conducting silicone is arranged between the first surface part 111 and the top surface of the central processor. The liquid cooling cavity 112 and the jet cavity 121 are both communicated with the temperature control device, so as to realize the circulation of the temperature control medium in the liquid cooling cavity 112, and the jet flow of the temperature control medium on the end surface of the first end of the heat conduction element 13 in the jet assembly 12.

[0058] The heat generating surface of the central processor exchanges heat with the first surface part 111 on the liquid cooling assembly 11. After the first surface part 111 receives heat, the heat on the part corresponding to the first surface part 111 is absorbed by the temperature control medium in the liquid cooling cavity 112; the heat on the part corresponding to the core heat generating area on the first surface part 111 is transmitted to the first end of the heat conduction element 13 through the second end of the heat conduction element 13, and is cooled by the temperature control medium of the jet flow.

[0059] In this embodiment, as shown in Figures 1 to 6 , the jet assembly 12 is fixedly arranged on the liquid cooling assembly 11, the first end of the heat conduction element 13 is located in the jet cavity 121, the second end of the heat conduction element 13 penetrates the liquid cooling cavity 112, and the second end of the heat conduction element 13 is in contact with the part corresponding to the first surface part 111. The second end of the heat conduction element 13 is close to the core heat generating area, so that a large amount of heat generated by the core heat generating area can be transmitted to the first end of the heat conduction element 13 located in the jet cavity 121, and the jet flow of the heat conduction element 13 is quickly cooled through the jet hole 122 in the jet cavity 121, so as to avoid the core heat generating area cannot be cooled, ensure the stability of the working temperature of the heat generating part, and meet the heat dissipation demand of the high heat flux density operation processing module.

[0060] In a specific embodiment, as shown in Figure 5As shown, the liquid cooling assembly 11 is provided with a through hole 113, and the second end of the heat conduction element 13 is located in the through hole 113. Specifically, the cross section of the through hole 113 can be adapted to the cross section of the heat conduction element 13 (i.e. the inner surface of the through hole 113 can be in close contact with the outer surface of the heat conduction element 13), or the heat conduction element 13 can be partially in contact with or spaced apart from the through hole 113. In the case where the through hole 113 is partially in communication with the liquid flow cavity, the heat conduction element 13 is in sealed close contact with the through hole 113. The second end of the heat conduction element 13 penetrates through the through hole 113 and is in contact with the core heating area.

[0061] In this embodiment, as shown in Figures 3 to 6 the liquid cooling assembly 11 is provided with a through hole 113, and the second end of the heat conduction element 13 penetrates through the through hole 113 and directly contacts the core heating area of the heat generating component. This can directly transfer the large amount of heat generated by the core heating area of the heat generating component to the heat conduction element 13 at the first end of the jet flow cavity 121 for rapid jet flow heat exchange, thereby improving the heat treatment efficiency of the core heating area and the stability of the temperature of the heat generating component, and further improving the heat dissipation performance of the heat dissipation module 1 for high heat flux density operation processing modules.

[0062] In one embodiment, as shown in Figures 3 to 6 the liquid cooling cavity 112 is provided with a partition column 1121 and a plurality of spaced apart heat dissipation fins 1122. The through hole 113 penetrates through the partition column 1121, and the heat dissipation fins 1122 are spaced apart from the partition column 1121.

[0063] Specifically, as shown in Figure 4 the middle part of the liquid cooling cavity 112 is provided with a plurality of spaced apart heat dissipation fins 1122. The plurality of heat dissipation fins 1122 are spaced apart along the width direction of the liquid cooling cavity 112. The heat dissipation fins 1122 are spaced apart from the two inner end faces of the liquid cooling cavity 112 along the length direction of the liquid cooling cavity 112, so as to form a liquid distribution area and a liquid collection area at the two ends of the liquid cooling cavity 112 along the length direction of the liquid cooling cavity 112. The liquid inlet of the liquid cooling cavity 112 is in communication with the liquid distribution area, and the liquid outlet of the liquid cooling cavity 112 is in communication with the liquid collection area.

[0064] The distance between any two adjacent heat dissipation fins 1122 can be selected and set according to actual needs. Preferably, the distance between the heat dissipation fins 1122 and the partition column 1121 is 3 to 8 times the distance between the two adjacent heat dissipation fins 1122. This can improve the flow speed of the temperature control medium between the heat dissipation fins 1122 opposite to the partition column 1121 along the length direction of the liquid cooling cavity 112, thereby improving the uniformity of heat dissipation of the liquid cooling cavity 112.

[0065] Specifically, the distance between the heat dissipation fins 1122 and the isolation column 1121 is any one of 3 times, 4 times, 5 times, 6 times, 7 times, and 8 times of the distance between two adjacent heat dissipation fins 1122, or a range between any two of the above values. Of course, other multiples can also be set according to actual needs.

[0066] In this embodiment, as shown in Figures 3 to 6 the isolation column 1121 and the plurality of heat dissipation fins 1122 are arranged in the liquid cooling cavity 112. The via hole 113 penetrates the isolation column 1121, and the heat dissipation fins 1122 are arranged at intervals with the isolation column 1121. This can improve the flow uniformity of the temperature control medium in the liquid cooling cavity 112 and improve the heat exchange efficiency of the temperature control medium.

[0067] In one embodiment, as shown in Figure 6 the liquid cooling assembly 11 further includes a phase change cavity 114. The liquid cooling cavity 112 is close to the first face 111, the phase change cavity 114 is located between the liquid cooling cavity 112 and the jet flow cavity 121, and the heat conduction element 13 penetrates the phase change cavity 114. The phase change cavity 114 is used to seal and contain the phase change medium.

[0068] It can be understood that the heat conduction element 13 penetrates the phase change cavity 114, that is, the heat conduction element 13 can be in direct contact with the phase change medium in the phase change cavity 114, or the heat conduction element 13 can be arranged in isolation from the phase change medium through other heat conduction elements to avoid corrosion of the heat conduction element 13 by the phase change medium, etc.

[0069] In a specific use process, taking the central processing unit as an example, the heat generating surface is the top surface of the central processing unit, and the core heat generating area is the part corresponding to the operation processing area in the central processing unit on the heat generating surface.

[0070] The first face 111 is attached to the top of the central processing unit. During the process of the central processing unit processing a large amount of data, the heat generation of the core heat generating area will increase sharply. Before the jet flow of the temperature control medium in the jet flow cavity 121 increases, the heat on the heat conduction element 13 cannot be transferred out in time by the jet temperature control medium, resulting in an increase in the temperature of the heat conduction element 13. When the temperature of the heat conduction element 13 rises and is higher than the vaporization temperature of the phase change medium in the phase change cavity 114, the temperature control medium can quickly and timely absorb the heat on the heat conduction element 13 and vaporize, and exchange heat with the outside through the contact part of the phase change cavity 114 and the jet flow cavity 121, to realize timely cooling of the heat conduction element 13, avoid the temperature of the heat conduction element 13 exceeding the set value, and affect the operation stability of the heat generating element.

[0071] In this embodiment, as shown in Figures 3 to 6As shown, the phase change cavity 114 is arranged in the liquid cooling assembly 11, and the phase change cavity 114 is located between the liquid cooling cavity 112 and the jet flow cavity 121, and the heat conduction element 13 penetrates the phase change cavity 114, so that in the case that the temperature of the heat conduction element 13 cannot be timely exchanged by the jet flow, the phase change medium in the phase change cavity 114 can timely absorb the heat on the heat conduction element 13 for vaporization to cope with the case that the heat generation of the core heating area increases sharply, and the temperature of the heat conduction element 13 can be prevented from being too high to affect the heat dissipation performance of the heat dissipation module 1 on the core heating area.

[0072] In one embodiment, as shown in Figure 6 The phase change cavity 114 has a heat conduction cylinder 1141 penetrating the phase change cavity 114, and the heat conduction element 13 penetrates the heat conduction cylinder 1141, and the heat conduction element 13 is arranged in close contact with the heat conduction cylinder 1141.

[0073] The material of the heat conduction cylinder 1141 is a heat conduction material, such as copper, aluminum, etc., and the heat conduction cylinder 1141 is connected with the heat conduction element 13 by welding to improve the heat exchange efficiency.

[0074] In the specific assembly process, the arrangement of the heat conduction cylinder 1141 does not need to seal the connection between the heat conduction element 13 and the phase change cavity 114.

[0075] In this embodiment, as shown in Figure 6 The arrangement of the heat conduction cylinder 1141 in the phase change cavity 114 can avoid sealing the connection between the heat conduction element 13 and the phase change cavity 114 in the assembly process, thereby improving the assembly efficiency of the heat dissipation module 1.

[0076] In one embodiment, as shown in Figure 1 The liquid cooling assembly 11 includes a liquid cooling shell 115 and a phase change shell 116, and specifically, the liquid cooling shell 115 and the phase change shell 116 can be aluminum alloy shells or shells made of other materials. The liquid cooling shell 115 and the phase change shell 116 are connected by welding or bolt connection, and the phase change shell 116 and the jet flow assembly 12 are connected by welding or bolt connection.

[0077] Specifically, the liquid cooling shell 115 includes a liquid cooling bottom plate and a liquid cooling upper shell, and the liquid cooling upper shell is arranged with an opening on the side facing the liquid cooling bottom plate. The liquid cooling bottom plate is provided with an annular groove, and the opening edge of the liquid cooling upper shell is inserted into the annular groove and sealed and connected with the annular groove by welding.

[0078] As shown in Figure 8As shown, the phase change shell 116 includes a phase change lower shell 1161 and a phase change top cover, the upper opening of the phase change lower shell 1161 is provided, the phase change top cover covers the upper opening of the phase change lower shell 1161, the upper opening edge of the phase change lower shell 1161 is provided with a sealing ring groove 117, and a rubber sealing element is arranged in the sealing ring groove 117 to improve the sealing performance of the phase change lower shell 1161 and the phase change top cover; wherein the heat conduction cylinder 1141 is arranged in the phase change lower shell 1161 and is in sealing butt joint with the phase change top cover.

[0079] In this embodiment, as shown in Figure 8 The liquid cooling assembly 11 includes a liquid cooling shell 115 and a phase change shell 116, the phase change shell 116 is connected with the liquid cooling shell 115, and the phase change shell 116 is connected with the jet flow assembly 12, which is simple in structure, easy to manufacture, and low in cost.

[0080] In one embodiment, as shown in Figure 2 and Figure 6 The jet flow cavity 121 is provided with a liquid discharge port 1211, and specifically, the liquid discharge port 1211 is close to the liquid cooling assembly 11, along the direction of the central axis of the heat conduction element 13, the distance between the heat conduction element 13 and the jet flow hole 122 is less than the distance between the liquid discharge port 1211 and the jet flow hole 122.

[0081] The central axis of the heat conduction element 13 coincides with the axis of the jet flow hole 122.

[0082] It can be understood that, along the direction of the central axis of the heat conduction element 13, the distance between the liquid discharge port 1211 and the jet flow hole 122 is greater than the distance between the end face of the first end of the heat conduction element 13 and the jet flow hole 122.

[0083] In the specific use process, as shown in Figure 2 and Figure 6 The temperature control medium forming jet flow through the jet flow hole 122 impacts the end face of the first end of the heat conduction element 13, and since along the direction of the central axis of the heat conduction element 13, the distance between the heat conduction element 13 and the jet flow hole 122 is less than the distance between the liquid discharge port 1211 and the jet flow hole 122, the part of the jet flow cavity 121 away from the liquid cooling assembly 11 can accommodate a part of the gas, which can prevent the temperature control medium after impacting the heat conduction element 13 from submerging the end face of the first end of the heat conduction element 13, so that the temperature control medium is directly discharged through the liquid discharge port 1211.

[0084] In this embodiment, as shown in Figure 2 and Figure 6As shown, the distance between the heat-conducting element 13 and the jet hole 122 is less than the distance between the liquid outlet 1211 and the jet hole 122 in the direction along the central axis of the heat-conducting element 13, and a part of the gas can be accommodated at the position of the jet cavity 121 away from the liquid cooling assembly 11, so that the end face of the first end of the heat-conducting element 13 can be prevented from being submerged by the temperature control medium after impacting the heat-conducting element 13, thereby affecting the cooling and heat exchange efficiency of the jet on the first end of the heat-conducting element 13.

[0085] In one embodiment, as shown in Figure 6 the ratio of the area of the jet hole 122 to the area of the region of the heat-conducting element 13 subjected to the jet is 0.2 to 1, and specifically, the ratio of the area of the jet hole 122 to the area of the region of the heat-conducting element 13 subjected to the jet can be any one of 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, and 1 or a range between any two of them.

[0086] In this embodiment, as shown in Figure 6 the ratio of the area of the jet hole 122 to the area of the region of the heat-conducting element 13 subjected to the jet is 0.2 to 1, which is reasonable and has high jet heat exchange efficiency.

[0087] If the ratio of the area of the jet hole 122 to the area of the region of the heat-conducting element 13 subjected to the jet is less than 0.2, the area of the region of the heat-conducting element 13 subjected to the jet is too large, the jet cannot cover the entire region, and the volume of the heat-conducting element 13 and the heat dissipation module 1 will be increased; if the ratio of the area of the jet hole 122 to the area of the region of the heat-conducting element 13 subjected to the jet is greater than 1, the area of the region of the heat-conducting element 13 subjected to the jet is too small, the jet cannot be completely received, and the jet heat exchange efficiency will be reduced.

[0088] In one embodiment, as shown in Figure 6 the ratio of the aperture of the jet hole 122 to the distance between the jet hole 122 and the heat-conducting element 13 is 0.2 to 1, and specifically, the ratio of the aperture of the jet hole 122 to the distance between the jet hole 122 and the heat-conducting element 13 can be any one of 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, and 1 or a range between any two of them.

[0089] In this embodiment, as shown in Figure 1 the ratio of the aperture of the jet hole 122 to the distance between the jet hole 122 and the heat-conducting element 13 is 0.2 to 1, which is reasonable and has high jet heat exchange efficiency.

[0090] If the ratio of the aperture of the jet hole 122 to the distance between the jet hole 122 and the heat-conducting element 13 is less than 0.2, the jet will spread during movement, affecting the concentration of the jet, thereby reducing the jet heat exchange efficiency; if the ratio of the aperture of the jet hole 122 to the distance between the jet hole 122 and the heat-conducting element 13 is greater than 1, the jet cannot reach the maximum jet speed, also reducing the jet heat exchange efficiency.

[0091] In one embodiment, as shown in Figure 6 and Figure 1 , the jet assembly 12 comprises a jet shell 123 and a jet nozzle 124, the jet shell 123 has a jet cavity 121, and the jet nozzle 124 has a jet hole 122, the part of the jet hole 122 of the jet nozzle 124 penetrates through the jet shell 123 and is located in the jet shell 123.

[0092] Specifically, the jet nozzle 124 is connected with the jet shell 123 by threaded connection, which has strong connection stability and good sealing effect.

[0093] It can be understood that the inner diameter of the input end of the jet nozzle 124 is greater than the inner diameter of the jet hole 122, and the cross-sectional area of the channel is reduced to increase the flow rate of the temperature control medium; or the inner diameter of the input end of the jet nozzle 124 is equal to the inner diameter of the jet hole 122, and the speed of the temperature control medium in the jet nozzle 124 is fully utilized for jetting.

[0094] In this embodiment, as shown in Figure 6 and Figure 6 , the jet nozzle 124 has a part of the jet hole 122 penetrating through the jet shell 123 and being located in the jet shell 123, which has a simple structure and is convenient for assembly and manufacturing.

[0095] In one embodiment, as shown in Figure 7 , the surface of the jet assembly 12 facing the liquid cooling assembly 11 is provided with a through hole 125, the through hole 125 is in communication with the jet cavity 121, and the first end of the heat-conducting element 13 penetrates through the through hole 125 and is located in the jet cavity 121.

[0096] Specifically, the cross-sectional shape of the through hole 125 is adapted to the cross-sectional shape of the heat-conducting element 13, that is, the heat-conducting element 13 and the through hole 125 are slidingly contacted and matched, or are spaced apart and matched, preferably, the heat-conducting element 13 and the through hole 125 are slidingly contacted and matched.

[0097] As shown in Figure 7As shown, the liquid cooling assembly 11 is provided with a sealing ring groove 117 and a detection ring groove 118 on the surface facing the jet assembly 12, the sealing ring groove 117 is coaxially arranged inside the detection ring groove 118, and a sealing ring is arranged in the sealing ring groove 117. Specifically, the sealing ring is a rubber sealing element, and can also be a sealing element made of other materials; and a liquid leakage detector is arranged in the detection ring groove 118.

[0098] It should be noted that the liquid leakage detector is a product available on the market.

[0099] Specifically, the liquid leakage detector is connected with a controller, and the controller is connected with an alarm assembly, which can be a warning light and / or a sound alarm.

[0100] In this embodiment, as shown in the figure, Figure 9 the liquid cooling assembly 11 is provided with a sealing ring groove 117 and a detection ring groove 118 on the surface facing the jet assembly 12, the sealing ring groove 117 is coaxially arranged inside the detection ring groove 118, and a sealing ring is arranged in the sealing ring groove 117. During the operation of the heat dissipation module 1, the liquid leakage detector can timely detect the leakage of the sealing ring to avoid damage to other components such as the server mainboard caused by the leakage of the liquid.

[0101] According to the embodiments of the present application, in another aspect, a heat dissipation system is provided, as shown in the figure, Figure 9 which comprises a cooling assembly 2, a liquid storage tank 3, a water distributor 4, a liquid cooling pump 5, a jet pump 6, a flow collector 7, a controller, and the heat dissipation module 1 in any one of the embodiments of the first aspect, and the specific scheme is as follows.

[0102] The cooling assembly 2 is a device capable of cooling the temperature control medium, which is a product available on the market.

[0103] The liquid storage tank 3 is a metal tank or a plastic tank, which is used for storing the temperature control medium, and the input end of the liquid storage tank 3 is in communication with the output end of the cooling assembly 2 through a pipeline.

[0104] The water distributor 4 has one input end and multiple output ends, and the water distributor 4 is a product available on the market, and the input end of the water distributor 4 is in communication with the output end of the liquid storage tank 3 through a pipeline.

[0105] The liquid cooling pump 5 is a liquid driven pump such as a gear pump, and the liquid cooling pump 5 is in communication with the output end of the water distributor 4 through a pipeline.

[0106] The jet pump 6 is a liquid driven pump such as a gear pump, and the jet pump 6 is in communication with the output end of the water distributor 4 through a pipeline.

[0107] The input end of the jet cavity 121 is in communication with the jet pump 6 through a pipeline, and the input end of the liquid cooling cavity 112 is in communication with the liquid cooling pump 5 through a pipeline.

[0108] The manifold 7 has multiple input terminals and one output terminal. The manifold 7 is an existing product and can be purchased on the market. The input terminals of the manifold 7 are connected to the output terminals of the jet cavity 121 and the liquid cooling cavity 112 through pipelines. The output terminal of the manifold 7 is connected to the input terminal of the cooling component 2 through a pipeline.

[0109] The controller can be any one of a microcontroller, a micro circuit board, or a computer host, and is connected to the cooling component 2, the jet pump 6, and the liquid cooling pump 5.

[0110] In specific usage, such as Figure 9 As shown, the cooling component 2 cools the temperature-controlled medium flowing out of the heat dissipation module 1 and stores it in the liquid storage tank 3. The temperature-controlled medium in the liquid storage tank 3 is divided into two paths by the water distributor 4. One path of the temperature-controlled medium passes through the jet pump 6, the jet cavity 121 and the manifold 7 in sequence and enters the cooling component 2. The other path of the temperature-controlled medium passes through the liquid cooling pump 5, the liquid cooling cavity 112 and the manifold 7 in sequence and enters the cooling component 2.

[0111] In this embodiment, such as Figure 9 As shown, the jet pump 6 and the liquid cooling pump 5 deliver a certain pressure of temperature-controlled medium to the jet cavity 121 and the liquid cooling cavity 112 respectively, which makes it easy to adjust the jet heat exchange efficiency and the liquid cooling heat exchange efficiency separately, thereby improving the intelligent control of the heat dissipation system on the temperature of the heat-generating components.

[0112] In one embodiment, such as Figure 9 As shown, a first temperature sensor 81 and a first pressure sensor 82 are installed on the connecting pipe between the jet cavity 121 and the water distributor 4; a second temperature sensor 83 and a second pressure sensor 84 are installed on the connecting pipe between the liquid cooling cavity 112 and the water distributor 4; and a third temperature sensor 85 is installed on the connecting pipe between the liquid storage tank 3 and the water distributor 4.

[0113] Specifically, the first temperature sensor 81, the first pressure sensor 82, the second temperature sensor 83, the second pressure sensor 84, and the third temperature sensor 85 are all existing products that can be purchased on the market, and the specific model can be selected according to the needs.

[0114] In specific usage, such as Figure 10 As shown, the temperature-controlled medium after jetting passes through the first pressure sensor 82, and the pressure value is measured. The pressure value can be used to determine whether the jet pump 6 is working properly. The temperature-controlled medium output from the liquid cooling chamber 112 passes through the second pressure sensor 84, and the pressure value is measured. The pressure value can be used to determine whether the liquid cooling pump 5 is working properly.

[0115] The first temperature sensor 81 is used to measure the temperature of the temperature control medium output from the fluidic chamber 121 to adjust the rotating speed of the fluidic pump 6; the second temperature sensor 83 is used to measure the temperature of the temperature control medium output from the liquid cooling chamber 112 to adjust the rotating speed of the liquid cooling pump 5; and the third temperature sensor 85 is used to measure the temperature of the temperature control medium output from the liquid storage tank 3 to adjust the working state of the cooling assembly 2, such as reducing the temperature of the temperature control medium output by the cooling assembly 2 or increasing the temperature of the temperature control medium output by the cooling assembly 2.

[0116] According to the embodiments of the present application, in a third aspect, a control method of a heat dissipation system is provided, as shown in Figure 11 The controller applied in the second aspect, the heat generating component is an operation processing module, and the method comprises the following steps.

[0117] S101: acquiring the average occupancy rate of the operation processing module, a first temperature preset value, and an occupancy rate preset value of the operation processing module.

[0118] Specifically, the occupancy rate of the operation processing module is a core index for measuring the proportion of the actual working load of the operation processing module (central processing unit, graphics processing unit, etc.) in the maximum processing capacity in a unit time, and directly reflects the busy degree of the module; the occupancy rate = (actual working time of the module / total time of the statistical period) x 100%; for example, if the central processing unit processes tasks for forty seconds in one minute, then the occupancy rate of the central processing unit in one minute is 67%.

[0119] The average occupancy rate of the operation processing module can be the average value of the occupancy rates of the operation processing module detected in multiple set time lengths, wherein the set time length can be 10 seconds or 30 seconds.

[0120] The occupancy rate preset value can be any one value or a range between any two values in 35%, 40%, 45%, and 50%, or other numerical values can be selected according to specific conditions, and the occupancy rate preset value is preferably 40%.

[0121] The first temperature preset value can be the limit working temperature of the operation processing module, or a temperature value lower than the limit working temperature, specifically, the first temperature preset value can be any one value or a range between any two values in 69℃, 70℃, and 71℃, or other numerical values can be selected according to specific conditions, and the first temperature preset value is preferably 70℃.

[0122] S102: acquiring the real-time temperature of the operation processing module.

[0123] Specifically, the real-time temperature is acquired by setting a temperature sensor on the operation processing module, or the average value of multiple temperature sensors is taken as the real-time temperature.

[0124] S103: obtaining a second temperature preset value, wherein the second temperature preset value is less than the first temperature preset value.

[0125] Specifically, the second temperature preset value can be the optimal working temperature of the operation processing module, or other values lower than the first temperature preset value; the second temperature preset value can be any one of 66℃, 67℃ and 68℃ or a range between any two values, or other values can be selected according to specific conditions, and the second temperature preset value is preferably 68℃.

[0126] S104: judging whether the real-time temperature is less than the second temperature preset value.

[0127] S105: if the real-time temperature is less than the second temperature preset value, obtaining the temperature of the warm control medium output by the fluidic chamber 121, the temperature of the warm control medium output by the liquid cooling chamber 112, a third temperature difference preset value and a fourth temperature difference preset value, wherein the third temperature difference preset value is less than zero, and the fourth temperature difference preset value is greater than zero.

[0128] Wherein, the temperature of the warm control medium output by the fluidic chamber 121 can be measured by the first temperature sensor 81; the temperature of the warm control medium output by the liquid cooling chamber 112 can be measured by the second temperature sensor 83.

[0129] It should be noted that the third temperature difference preset value is less than zero, i.e. the third temperature difference preset value is a negative number; the fourth temperature difference preset value is greater than zero, i.e. the fourth temperature difference preset value is a positive number; wherein the third temperature difference preset value and the fourth temperature difference preset value can be opposite numbers, such as ±5, etc.

[0130] S106: obtaining the difference between the temperature of the warm control medium output by the fluidic chamber 121 and the temperature of the warm control medium output by the liquid cooling chamber 112 to obtain a second temperature difference value.

[0131] S107: respectively judging whether the second temperature difference value is not greater than the third temperature difference preset value, whether the second temperature difference value is not less than the fourth temperature difference preset value, and whether the second temperature difference value is greater than the third temperature difference preset value and less than the fourth temperature difference preset value.

[0132] S108: if the second temperature difference value is not greater than the third temperature difference preset value, controlling the rotation speed of the liquid cooling pump 5 to increase, and returning to obtaining the real-time temperature of the operation processing module.

[0133] It can be understood that the second temperature difference value is not greater than the third temperature difference preset value, i.e. the temperature of the warm control medium output by the fluidic chamber 121 is lower than the temperature of the warm control medium output by the liquid cooling chamber 112, and by controlling the rotation speed of the liquid cooling pump 5 to increase, the temperature of the warm control medium output by the liquid cooling chamber 112 can be reduced, thereby improving the uniformity of heat dissipation of the heat dissipation module 1.

[0134] S109: If the second temperature difference value is not less than the fourth temperature difference preset value, the rotation speed of the jet pump 6 is controlled to increase, and the real-time temperature of the operation processing module is acquired again.

[0135] It can be understood that the second temperature difference value not less than the fourth temperature difference preset value indicates that the temperature of the temperature control medium output from the jet cavity 121 is higher than the temperature of the temperature control medium output from the liquid cooling cavity 112. By controlling the rotation speed of the jet pump 6 to increase, the temperature of the temperature control medium output from the jet cavity 121 can be reduced, thereby improving the uniformity of heat dissipation of the heat dissipation module 1.

[0136] S110: If the second temperature difference value is greater than the third temperature difference preset value and less than the fourth temperature difference preset value, the rotation speeds of the jet pump 6 and the liquid cooling pump 5 are controlled to decrease at a set ratio, and the real-time temperature of the operation processing module is acquired again.

[0137] It can be understood that the second temperature difference value greater than the third temperature difference preset value and less than the fourth temperature difference preset value indicates that the difference between the temperature of the temperature control medium output from the jet cavity 121 and the temperature of the temperature control medium output from the liquid cooling cavity 112 is within an acceptable range.

[0138] By controlling the rotation speeds of the jet pump 6 and the liquid cooling pump 5 to decrease at a set ratio, the energy consumption can be reduced while ensuring the heat dissipation demand of the operation processing module.

[0139] It should be noted that controlling the rotation speeds of the jet pump 6 and the liquid cooling pump 5 to decrease at a set ratio means that there is a certain ratio between the rotation speed value of the jet pump 6 and the rotation speed value of the liquid cooling pump 5, which can maintain the uniformity of heat dissipation in the jet cavity 121 and the liquid cooling cavity 112.

[0140] If the real-time temperature is not less than the second temperature preset value, step S111 is performed.

[0141] S111: It is judged whether the real-time temperature is not less than the first temperature preset value.

[0142] S112: If the real-time temperature is not less than the first temperature preset value, it is judged whether the average occupancy rate is not less than the occupancy rate preset value.

[0143] It can be understood that the average occupancy rate of the operation processing module reflects the heat generation of the core heat generation area of the operation processing module, that is, the higher the average occupancy rate, the higher the heat generation of the core heat generation area, and the lower the average occupancy rate, the less the heat generation of the core heat generation area.

[0144] S113: If the average occupancy rate is not less than the occupancy rate preset value, the rotation speeds of the liquid cooling pump 5 and the jet pump 6 are controlled to increase, and the real-time temperature of the operation processing module is acquired again.

[0145] It can be understood that by simultaneously increasing the rotation speed of the liquid cooling pump 5 and the jet flow pump 6, the heat exchange efficiency of the jet flow cavity 121 and the liquid cooling cavity 112 can be improved, so as to reduce the working temperature of the operation processing module to be lower than the first temperature preset value.

[0146] S114: If the average occupancy rate is less than the occupancy rate preset value, the rotation speed of the jet flow pump 6 is controlled to be increased, and the real-time temperature of the operation processing module is acquired again.

[0147] It can be understood that in the case that the average occupancy rate is low, the operation processing module mainly generates heat by the core heat generation area, and in the case that the temperature of the operation processing module exceeds the first temperature preset value, only the rotation speed of the jet flow pump 6 needs to be increased, so as to reduce the temperature of the operation processing module.

[0148] S115: If the real-time temperature is less than the first temperature preset value, a first temperature difference preset value and a second temperature difference preset value are acquired, wherein the first temperature difference preset value is less than zero, and the second temperature difference preset value is greater than zero.

[0149] It should be noted that the first temperature difference preset value is less than zero, that is, the first temperature difference preset value is a negative number; the second temperature difference preset value is greater than zero, that is, the second temperature difference preset value is a positive number; wherein the first temperature difference preset value and the second temperature difference preset value can be opposite numbers such as ±5.

[0150] S116: The temperature of the temperature control medium output by the jet flow cavity 121 and the temperature of the temperature control medium output by the liquid cooling cavity 112 are acquired.

[0151] The temperature of the temperature control medium output by the jet flow cavity 121 can be measured by the first temperature sensor 81; and the temperature of the temperature control medium output by the liquid cooling cavity 112 can be measured by the second temperature sensor 83.

[0152] S117: The difference between the temperature of the temperature control medium output by the jet flow cavity 121 and the temperature of the temperature control medium output by the liquid cooling cavity 112 is obtained to obtain a first temperature difference value.

[0153] S118: It is respectively judged whether the first temperature difference value is not greater than the first temperature difference preset value, whether the first temperature difference value is not less than the second temperature difference preset value, and whether the first temperature difference value is greater than the first temperature difference preset value and less than the second temperature difference preset value.

[0154] S119: If the first temperature difference value is not greater than the first temperature difference preset value, the rotation speed of the liquid cooling pump 5 is controlled to be increased, and the temperature of the temperature control medium output by the jet flow cavity 121 and the temperature of the temperature control medium output by the liquid cooling cavity 112 are acquired again.

[0155] It can be understood that the first temperature difference value is not less than the first temperature difference preset value, that is, the temperature of the temperature control medium output from the jet flow cavity 121 is lower than the temperature of the temperature control medium output from the liquid cooling cavity 112. By controlling the rotation speed of the liquid cooling pump 5 to be increased, the temperature of the temperature control medium output from the liquid cooling cavity 112 can be reduced, thereby improving the uniformity of heat dissipation of the heat dissipation module 1.

[0156] S120: If the first temperature difference value is not less than the second temperature difference preset value, the rotation speed of the jet flow pump 6 is controlled to be increased, and the step of obtaining the temperature of the temperature control medium output from the jet flow cavity 121 and the temperature of the temperature control medium output from the liquid cooling cavity 112 is returned.

[0157] It can be understood that the first temperature difference value is not less than the second temperature difference preset value, that is, the temperature of the temperature control medium output from the jet flow cavity 121 is higher than the temperature of the temperature control medium output from the liquid cooling cavity 112. By controlling the rotation speed of the jet flow pump 6 to be increased, the temperature of the temperature control medium output from the jet flow cavity 121 can be reduced, thereby improving the uniformity of heat dissipation of the heat dissipation module 1.

[0158] S121: If the first temperature difference value is greater than the first temperature difference preset value and less than the second temperature difference preset value, the step of obtaining the real-time temperature of the operation processing module is returned.

[0159] In this embodiment, the average occupancy rate of the operation processing module and the temperature of the temperature control medium output from the jet flow cavity 121 and the temperature of the temperature control medium output from the liquid cooling cavity 112 are combined to control the heat dissipation system, which can improve the uniformity of heat dissipation of the heat dissipation module 1 and reduce energy consumption.

[0160] According to the embodiments of the present application, in a fourth aspect, an electronic device is provided, as shown in the figure, comprising a memory 10 and a processor 20, the memory 10 stores a computer program, and the processor 20 is configured to run the computer program to execute the steps in any of the above-mentioned heat dissipation system control method embodiments. ​

[0161] The embodiments of the present application also provide a computer readable storage medium, which stores a computer program, wherein the computer program is configured to execute the steps in any of the above-mentioned heat dissipation system control method embodiments when running.

[0162] In an exemplary embodiment, the above-mentioned computer readable storage medium can include but is not limited to: a U disk, a read-only memory (Read-Only Memory, ROM for short), a random access memory (Random Access Memory, RAM for short), a mobile hard disk, a magnetic disk or an optical disk, and various media that can store computer programs.

[0163] ​The embodiment of the present application further provides a computer program product, which comprises a computer program, and the computer program realizes the steps in the control method embodiments of the heat dissipation system when executed by a processor.

[0164] The embodiment of the present application further provides another computer program product, which comprises a non-volatile computer readable storage medium, and the non-volatile computer readable storage medium stores a computer program, and the computer program realizes the steps in the control method embodiments of the heat dissipation system when executed by a processor.

[0165] Those skilled in the art can further realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be realized in electronic hardware, computer software or a combination of both. In order to clearly illustrate the interchangeability of hardware and software, the components and steps of the examples have been described in the above description in general terms. Whether the functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0166] The above describes in detail the heat dissipation module 1, the heat dissipation system, the control method, the electronic device and the storage medium provided by the present application. The principles and implementation modes of the present application are described by applying specific examples in this paper. The above description of the examples is only applicable to help understand the method and core idea of the present application. It should be pointed out that those skilled in the art can make some improvements and modifications to the present application without departing from the principles of the present application. These improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A heat dissipation module, characterized in that, include: A liquid cooling assembly has a first face and a liquid cooling cavity, the first face being for contacting a heating surface, wherein the heating surface is located on a heating element and has a core heating area; A jet assembly is located on the liquid cooling assembly, and the jet assembly has a jet cavity with jet holes disposed inside the jet cavity; A heat-conducting element, wherein the first end of the heat-conducting element is located in the jet cavity, the jet hole faces the first end of the heat-conducting element, the second end of the heat-conducting element penetrates the liquid cooling cavity, the second end of the heat-conducting element contacts the part corresponding to the first surface, and the second end of the heat-conducting element is close to the core heating area; The jet assembly includes a jet shell and a jet nozzle. The jet shell has the jet cavity, and the jet nozzle has the jet hole. The portion of the jet nozzle with the jet hole penetrates the jet shell and is located inside the jet shell.

2. The heat dissipation module according to claim 1, characterized in that, The liquid cooling assembly is provided with a through hole, and the second end of the heat-conducting element is located in the through hole, and the second end of the heat-conducting element passes through the through hole and contacts the core heat-generating area.

3. The heat dissipation module according to claim 2, characterized in that, The liquid cooling cavity is provided with an isolation column and a plurality of spaced heat dissipation fins. The through hole passes through the isolation column, and the heat dissipation fins are spaced apart from the isolation column.

4. The heat dissipation module according to any one of claims 1 to 3, characterized in that, The heat-conducting element is a heat pipe.

5. The heat dissipation module according to any one of claims 1 to 3, characterized in that, The liquid cooling assembly further includes a phase change cavity, which is located near the first face and between the liquid cooling cavity and the jet cavity. The heat-conducting element passes through the phase change cavity, and the phase change cavity is used to seal and accommodate the phase change medium.

6. The heat dissipation module according to claim 5, characterized in that, The phase change cavity has a heat-conducting cylinder that penetrates the phase change cavity, and the heat-conducting element penetrates the heat-conducting cylinder and is fitted to the heat-conducting cylinder.

7. The heat dissipation module according to claim 5, characterized in that, The liquid cooling assembly includes a liquid cooling housing and a phase change housing, the liquid cooling housing being connected to the phase change housing, and the phase change housing being connected to the jet assembly.

8. The heat dissipation module according to any one of claims 1 to 3, characterized in that, The jet cavity is provided with a drain port. Along the direction of the central axis of the heat-conducting element, the distance between the heat-conducting element and the jet hole is less than the distance between the drain port and the jet hole.

9. The heat dissipation module according to claim 8, characterized in that, The ratio of the area of ​​the jet hole to the area of ​​the region on the heat-conducting element that receives the jet is in the range of 0.2 to 1.

10. The heat dissipation module according to claim 8, characterized in that, The ratio of the diameter of the jet hole to the distance between the jet hole and the heat-conducting element is in the range of 0.2 to 1.

11. The heat dissipation module according to any one of claims 1 to 3, characterized in that, The inner diameter of the input end of the jet nozzle is larger than the inner diameter of the jet orifice.

12. The heat dissipation module according to any one of claims 1 to 3, characterized in that, The surface of the jet assembly facing the liquid cooling assembly has a perforation, the perforation is connected to the jet cavity, and the first end of the heat-conducting element passes through the perforation and is located inside the jet cavity; The liquid cooling assembly has a sealing ring groove and a detection ring groove on its surface facing the jet assembly. The sealing ring groove is coaxially disposed inside the detection ring groove. A sealing ring is disposed inside the sealing ring groove, and a leakage detector is disposed inside the detection ring groove.

13. A heat dissipation system, characterized in that, include: Cooling components; A liquid storage tank, the input end of which is connected to the output end of the cooling assembly; A water distributor, wherein the input end of the water distributor is connected to the output end of the liquid storage tank; A liquid-cooled pump is connected to the output end of the water distributor; A jet pump is connected to the output end of the water distributor; The heat dissipation module as described in any one of claims 1 to 12, wherein the input end of the jet cavity is connected to the jet pump, and the input end of the liquid cooling cavity is connected to the liquid cooling pump; A manifold, the input end of which is connected to both the output end of the jet cavity and the output end of the liquid cooling cavity, and the output end of which is connected to the input end of the cooling assembly; The controller is connected to the cooling assembly, the jet pump, and the liquid cooling pump.

14. The heat dissipation system according to claim 13, characterized in that, A first temperature sensor and a first pressure sensor are installed on the connecting pipe between the jet cavity and the water distributor; A second temperature sensor and a second pressure sensor are installed on the connecting pipe between the liquid cooling chamber and the water distributor. A third temperature sensor is installed on the connecting pipe between the liquid storage tank and the water distributor.

15. A control method for a heat dissipation system, applied to the controller described in claim 13 or 14, wherein the heat-generating element is a processing module, characterized in that, include: Obtain the average occupancy rate of the computing module, the first temperature preset value, and the occupancy rate preset value of the computing module; Obtain the real-time temperature of the processing module; Determine whether the real-time temperature is not less than the first preset temperature value; If the real-time temperature is not less than the first temperature preset value, then determine whether the average occupancy rate is not less than the occupancy rate preset value. If the average occupancy rate is not less than the preset occupancy rate value, then the speed of both the liquid cooling pump and the jet pump is increased, and the real-time temperature of the processing module is returned. If the average occupancy rate is less than the preset occupancy rate value, the speed of the jet pump is increased, and the real-time temperature of the processing module is returned.

16. The control method for the heat dissipation system according to claim 15, characterized in that, After the step of determining whether the real-time temperature is not less than the first preset temperature value, the method further includes: If the real-time temperature is less than the first preset temperature value, then a first preset temperature difference value and a second preset temperature difference value are obtained, wherein the first preset temperature difference value is less than zero and the second preset temperature difference value is greater than zero. The temperatures of the temperature-controlled medium output from the jet cavity and the temperature of the temperature-controlled medium output from the liquid cooling cavity are obtained. The temperature difference between the temperature of the temperature control medium output from the jet cavity and the temperature of the temperature control medium output from the liquid cooling cavity is calculated to obtain the first temperature difference value; Determine whether the first temperature difference value is not greater than the first temperature difference preset value, whether the first temperature difference value is not less than the second temperature difference preset value, and whether the first temperature difference value is greater than the first temperature difference preset value and less than the second temperature difference preset value. If the first temperature difference value is not greater than the first temperature difference preset value, then control the speed of the liquid cooling pump to increase, and return to the point of obtaining the temperature of the temperature control medium output from the jet cavity and the temperature of the temperature control medium output from the liquid cooling cavity; If the first temperature difference value is not less than the second temperature difference preset value, then the speed of the jet pump is increased, and the process returns to obtaining the temperature of the temperature control medium output from the jet cavity and the temperature of the temperature control medium output from the liquid cooling cavity. If the first temperature difference value is greater than the first preset temperature difference value and less than the second preset temperature difference value, then the real-time temperature of the processing module is returned.

17. The control method for the heat dissipation system according to claim 16, characterized in that, Before the step of determining whether the real-time temperature is not less than the first preset temperature value, the method further includes the following step: Obtain a second preset temperature value, wherein the second preset temperature value is less than the first preset temperature value; Determine whether the real-time temperature is less than the second preset temperature value; If the real-time temperature is less than the second preset temperature value, then the temperature of the temperature control medium output from the jet cavity, the temperature of the temperature control medium output from the liquid cooling cavity, the third preset temperature difference value, and the fourth preset temperature difference value are obtained, wherein the third preset temperature difference value is less than zero, and the fourth preset temperature difference value is greater than zero. The temperature difference between the temperature of the temperature control medium output from the jet cavity and the temperature of the temperature control medium output from the liquid cooling cavity is calculated to obtain the second temperature difference value; Determine whether the second temperature difference value is not greater than the third temperature difference preset value, whether the second temperature difference value is not less than the fourth temperature difference preset value, and whether the second temperature difference value is greater than the third temperature difference preset value and less than the fourth temperature difference preset value. If the second temperature difference value is not greater than the third temperature difference preset value, then the speed of the liquid cooling pump is increased, and the real-time temperature of the processing module is obtained. If the second temperature difference value is not less than the fourth temperature difference preset value, then the speed of the jet pump is increased, and the real-time temperature of the processing module is obtained. If the second temperature difference value is greater than the third preset temperature difference value and the second temperature difference value is less than the fourth preset temperature difference value, then the jet pump and the liquid cooling pump are controlled to reduce their speeds by a set ratio, and the real-time temperature of the processing module is returned.

18. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor, configured to implement the steps of the control method for the heat dissipation system as described in any one of claims 15 to 17 when executing the computer program.

19. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein when the computer program is executed by a processor, it implements the steps of the control method for the heat dissipation system as described in any one of claims 15 to 17.

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