Method for embedding bridge chip in glass substrate

Abstract

The invention discloses a method for embedding a bridge chip in a glass substrate. The method comprises the following steps: taking a glass substrate on which a through hole circuit is electroplated; manufacturing a blind groove in the front surface of the glass substrate; embedding the bridging chip into the blind slot; and thinning the back surface of the glass substrate through a glass substrate thinning technology until the convex blocks on the back surface of the bridging chip are exposed, so as to realize double-sided conduction of the bridging chip. In the application, the back surface of the glass substrate is thinned through a glass substrate thinning technology until the back surface bumps of the bridging chips are exposed, so that double-sided conduction of the bridging chips is realized, and compared with the prior art, higher-density signal interconnection can be realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, in particular to a method for embedding a bridge die in a glass substrate. BACKGROUND

[0002] As shown in the prior art, the bridge die 3 is embedded in the glass substrate 1 by first making a blind groove 2 and then bonding the bridge die 3 by DAF glue. The bridge die 3 is single-sided conductive, and high-density signal interconnection is achieved by embedding the bridge die 3. However, in the field of chip packaging, the signal interconnection of this structure does not meet the requirements, and a glass substrate bridge die embedding method that can achieve higher density signal interconnection is needed to replace it. Figure 1

[0003] Therefore, it is necessary to develop a method for embedding a bridge die in a glass substrate to solve the above problems. SUMMARY

[0004] The purpose of the present application is to design a method for embedding a bridge die in a glass substrate to solve the above problems.

[0005] The present application achieves the above-mentioned purposes through the following technical solutions: A method for embedding a bridge die in a glass substrate, comprising the following steps: S1, taking a glass substrate with a through-hole plating circuit; S2, making a blind groove on the front surface of the glass substrate; S3, embedding a bridge die in the blind groove; S4, thinning the back surface of the glass substrate by glass substrate thinning technology until the back surface bump of the bridge die is exposed, to realize double-sided conduction of the bridge die.

[0006] The present application has the following advantages: In the present application, the back surface of the glass substrate is thinned by glass substrate thinning technology until the back surface bump of the bridge die is exposed, to realize double-sided conduction of the bridge die. Compared with the prior art, higher density signal interconnection can be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 is a schematic diagram of the prior art; Figure 2 is a schematic diagram of step S1 in a method for embedding a bridge die in a glass substrate; Figure 3 is a schematic diagram of step S2 in a method for embedding a bridge die in a glass substrate; Figure 4 is a schematic diagram of step S3 in a method for embedding a bridge die in a glass substrate; Figure 5 ​A schematic view of step S4 in a method of embedding a bridge chip in a glass substrate.

[0008] Legend: 1. glass substrate, 2. blind slot, 3. bridge chip. DETAILED DESCRIPTION

[0009] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0010] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents the selected embodiments of the application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative work fall within the scope of protection of the present application.

[0011] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0012] In the description of the present application, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0013] In addition, the terms "first", "second", etc. are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0014] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "provided", "connected" and the like should be understood broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrally connected; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0015] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0016] A method for embedding a bridging chip in a glass substrate includes the following steps: S1, such as Figure 2 As shown, a glass substrate 1 with electroplated through-hole circuitry is taken; S2, such as Figure 3 As shown, a blind groove 2 is formed on the front side of the glass substrate 1 by laser-induced etching; S3, such as Figure 4 As shown, the bridging chip 3 is embedded in the blind slot 2; S4, such as Figure 5 As shown, the back side of the glass substrate 1 is thinned by chemical mechanical polishing (CMP) until the back bump of the bridging chip 3 is exposed, so as to achieve double-sided conduction of the bridging chip 3.

[0017] In this application, the bridge chip 3 transmits and interconnects signals through both the front and back sides, thereby increasing the number and density of signal channels and supporting higher signal transmission rates.

[0018] In some embodiments, the glass substrate 1 thinning technology can employ chemical etching thinning technology. The principle is: using hydrofluoric acid chemical solution to chemically react with silicon dioxide on the surface of the glass substrate 1 to generate soluble fluorosilicic acid, thereby thinning the glass thickness; or physical grinding thinning technology can be employed. The principle is: through mechanical grinding action on the glass substrate 1, a polishing medium formed by polishing powder and pure water is used, which flows between the machine tray and the glass substrate 1 under a certain pressure. The relative motion caused by the machine rotation allows the hard abrasive particles to directly contact the surface of the glass substrate 1, thereby cutting the surface thickness of the glass substrate 1.

[0019] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for embedding a bridging chip in a glass substrate, characterized in that: Includes the following steps: S1. Take a glass substrate that has already been electroplated with through-hole circuitry; S2. A blind groove is formed on the front side of the glass substrate; S3. Embed the bridging chip into the blind slot; S4. The back side of the glass substrate is thinned using glass substrate thinning technology until the back bumps of the bridging chip are exposed, so as to achieve double-sided conduction of the bridging chip.

2. The method for embedding a bridging chip in a glass substrate according to claim 1, characterized in that: In step S2, the blind trench is obtained by laser-induced etching on the front side of the glass substrate.

3. The method for embedding a bridging chip in a glass substrate according to claim 1, characterized in that: In step S4, the glass substrate thinning technique is chemical mechanical polishing.

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