Cluster tool

Abstract

A cluster tool is provided with a plasma processing device having a plasma processing module, a vacuum transfer module, and a position detection sensor, the plasma processing module having a support member, a consumption ring, and a lift pin, a movable replacement device, and a control unit. The mobile replacement device has an eco-friendly pipe part for storing the consumption ring and a ring replacement robot for transporting the consumption ring, and the control part executes a ring replacement sequence including: a step for connecting the mobile replacement device and the plasma processing module; a step of placing the consumption ring in the eco-friendly pipe part on the lifting pin; a step for detecting the position of the consumption ring on the lifting pin; a step for adjusting the position of the consumption ring on the lifting pin; and a step for placing the consumable ring on the ring support surface.

Description

TECHNICAL FIELD

[0001] The present application relates to a cluster tool. BACKGROUND

[0002] A component replacement system disclosed in Patent Literature 1 includes a component storage device for storing a consumable component before use, and a component replacement device connecting a processing device and the component storage device, capable of replacing the consumable component after use in the processing device with the consumable component before use in the component storage device.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Publication No. 2021-176173 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] The present application provides a cluster tool capable of appropriately transporting a consumable component to a plasma processing module regardless of a docking error of the plasma processing module and a mobile replacement device.

[0008] MEANS OF SOLVING THE PROBLEMS

[0009] One embodiment of the present application is a cluster tool including a plasma processing apparatus, a mobile exchange apparatus, and at least one control unit. The plasma processing apparatus includes a plasma processing module having a first surface and a second surface, a vacuum transport module connected to the plasma processing module at the first surface, and a position detection sensor. The plasma processing module includes a support member having a substrate support surface and a ring support surface, a consumable ring disposed on the ring support surface, and a plurality of lift pins configured to move in a vertical direction between an exchange position above the ring support surface and a standby position below the ring support surface. The vacuum transport module includes a transport robot configured to transport the consumable ring between the plasma processing module and the vacuum transport module. The mobile exchange apparatus includes a ring storage unit configured to store the consumable ring and a ring exchange robot configured to transport the consumable ring between the ring storage unit and the plasma processing module. The at least one control unit is configured to control the plasma processing apparatus and the mobile exchange apparatus to execute a ring exchange sequence. The ring exchange sequence includes a process of connecting the mobile exchange apparatus to the plasma processing module at the second surface, a process of transporting a consumable ring in the ring storage unit to the plasma processing module using the ring exchange robot to be placed on the plurality of lift pins at the exchange position, a process of detecting a horizontal position of the consumable ring on the plurality of lift pins using the position detection sensor, a process of adjusting the horizontal position of the consumable ring on the plurality of lift pins using the transport robot based on a position detection result of the position detection sensor, and a process of moving the plurality of lift pins to the standby position to place the consumable ring on the ring support surface.

[0010] Effects of Invention

[0011] According to the present application, a cluster tool can appropriately transport a consumable component to a plasma processing module regardless of a docking error of the plasma processing module and a mobile exchange apparatus. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 FIG. 1 is a plan view showing a configuration example of a substrate processing system according to the present embodiment.

[0013] Figure 2 FIG. 3 is a perspective view showing a configuration example of a transport robot of a vacuum transport module.

[0014] Figure 3 FIG. 4 is a longitudinal sectional view showing a configuration example of the vacuum transport module.

[0015] Figure 4 FIG. 5 is a longitudinal sectional view showing a configuration example of a plasma processing module.

[0016] Figure 5 is an explanatory view showing the arrangement of the lift pins.

[0017] Figure 6 is a longitudinal sectional view showing a structural example of the mobile exchange device.

[0018] Figure 7 is a longitudinal sectional view showing a connection state of the vacuum transport module, the plasma processing module, and the mobile exchange device.

[0019] Figure 8 is a flowchart showing a flow of a ring exchange sequence of the embodiment. DETAILED DESCRIPTION

[0020] In a plasma processing apparatus that performs plasma processing such as etching processing, post-processing, and the like on a semiconductor substrate (hereinafter referred to as "substrate"), various consumable parts typified by a ring assembly are used. Such a consumable part is exchanged for a new one when the amount of consumption exceeds a predetermined amount of consumption.

[0021] The exchange of such a consumable part is performed using a component exchange device connected to the plasma processing apparatus each time the consumable part is exchanged, as disclosed in Patent Document 1. However, in Patent Document 1, positional misalignment at the time of docking of the plasma processing apparatus and the component exchange device is not taken into consideration, and there is room for improvement in this regard.

[0022] The present technology was completed in view of the above circumstances, and provides a cluster tool that can appropriately transport a consumable part to a plasma processing module regardless of the docking error of the plasma processing module and the mobile exchange device. Hereinafter, a plasma processing system of the present embodiment will be described with reference to the drawings. Furthermore, in the present specification and the drawings, elements having substantially the same functional structure are denoted by the same reference numerals, and repeated description is omitted.

[0023] <Plasma processing system>

[0024] First, the structure of the substrate processing system of the present embodiment will be described. Figure 1 is a schematic plan view showing the structure of the plasma processing system of the present embodiment. The plasma processing system has a plasma processing apparatus 1, a mobile exchange device 2, and at least one control section 3. In addition, as shown in Figure 1 , the plasma processing system is a cluster tool having a plasma processing module 60 and a vacuum transport module 50 described later. Furthermore, a wafer is an example of a substrate.

[0025] As shown in Figure 1As shown, the plasma processing apparatus 1 has a structure in which an atmospheric portion 10 and a reduced-pressure portion 11 are integrally connected via a load lock module 20. The atmospheric portion 10 includes an atmospheric module that processes and / or transports a substrate W under an atmospheric atmosphere. The reduced-pressure portion 11 includes a reduced-pressure module (vacuum module) that processes and / or transports the substrate W under a reduced-pressure (vacuum) atmosphere.

[0026] The load lock module 20 has a plurality of (two in this embodiment, for example) load lock chambers 21a, 21b (hereinafter, sometimes referred to simply as "load lock chambers 21") along an atmospheric transport module 30 described later and a vacuum transport module 50 described later. The load lock chambers 21 are configured to be able to temporarily hold the substrate W.

[0027] The load lock chambers 21 are provided so as to be able to communicate an atmospheric transport space of the atmospheric transport module 30 of the atmospheric portion 10 described later with a vacuum transport space of the vacuum transport module 50 of the reduced-pressure portion 11 described later via a substrate transport port. Also, the load lock chambers 21 are configured to be able to switch the inside to an atmospheric atmosphere and a reduced-pressure atmosphere (vacuum state). That is, the load lock module 20 is configured to be able to appropriately hand over the substrate W between the atmospheric portion 10 of the atmospheric atmosphere and the reduced-pressure portion 11 of the reduced-pressure atmosphere. In addition, the substrate transport port is configured to be able to be opened and closed by a gate valve not shown.

[0028] The atmospheric portion 10 has the atmospheric transport module 30 in which the substrate transport robot 40 described later is provided inside, and a load port 32 that places a FOUP (Front Opening Unified Pod) 31 capable of storing a plurality of substrates W. In addition, a direction module (not shown) capable of adjusting the orientation of the substrates W in the horizontal direction, a storage module (not shown) capable of storing a plurality of substrates W, and the like can be provided adjacent to the atmospheric transport module 30.

[0029] The atmospheric transport module 30 is configured by a housing that is rectangular inside, and the inside of the housing is maintained as an atmospheric atmosphere. A plurality of, for example, five load ports 32 are arranged on one side surface of the long side of the atmospheric transport module 30 on the negative direction side of the Y-axis. The load lock chambers 21a, 21b of the load lock module 20 are arranged on the other side surface of the long side of the atmospheric transport module 30 on the positive direction side of the Y-axis.

[0030] The substrate transport robot 40 that transports the substrate W is provided inside the atmospheric transport module 30. The substrate transport robot 40 is configured to move on a transport path 41 extending in the X-axis direction in one example, and is capable of transporting the substrate W between the FOUP 31 of the load port 32 and the load lock chambers 21a, 21b of the load lock module 20. In addition, the configuration of the substrate transport robot 40 is not limited thereto.

[0031] The decompression section 11 has a vacuum transport module 50 that internally transports the substrate W and a plasma processing module 60 that performs a required process on the substrate W transported from the vacuum transport module 50. The interiors of the vacuum transport module 50 and the plasma processing module 60 are respectively configured to be able to be maintained as a decompressed (vacuum) atmosphere. Further, in the present embodiment, for one vacuum transport module 50, a plurality of, for example, six plasma processing modules 60 and two load lock chambers 21a, 21b are connected. Further, the number and arrangement of the plasma processing modules 60 are not limited to the present embodiment and can be arbitrarily set.

[0032] The vacuum transport module 50 has a housing 51 of a planar rectangular shape. In the housing 51, a substrate transport port 52 that is connected to the plasma processing module 60 described later is formed. A vacuum transport space 50s (refer to FIG. 2) of the vacuum transport module 50 is in communication with the interior of the plasma processing module 60 via the substrate transport port 52. Figure 3

[0033] In the interior of the vacuum transport module 50, a transport robot 70 that transports the substrate W is provided. As shown in FIG. 1, the transport robot 70 is a multi-joint robot that includes a plurality of, for example, three transport arms 71a to 71c. The three transport arms 71 are respectively configured to be able to rotate. The front end transport arm 71a holds and transports the substrate W or the consumable component. The front end transport arm 71a is also called a so-called end effector and is configured to be able to simultaneously transport two substrates W in a vertically overlapped manner. In other words, the transport robot 70 has two transport arms 71a arranged in a vertically overlapped manner. The root end transport arm 71c is rotatably attached to a base 72. Figure 2

[0034] As shown in FIGS. 1 and 2, on the upper surface of the root end side (the side connected to the transport arm 71b) of the front end transport arm 71a, that is, the end effector, and the lower surface of the front end side (the holding side of the substrate W or the consumable component) of the end effector, first and second position detection sensors 73, 74 are respectively provided. The first and second position detection sensors 73, 74 are, for example, displacement gauges. The transport robot 70 is able to detect the relative horizontal positions of the substrate W or the consumable component with respect to the support member 120 described later within the plasma processing module 60 using these first and second position detection sensors 73, 74. Figure 2 Figure 3

[0035] ​​​​In one embodiment, the transport robot 70 is configured to transport the substrate W between the load lock module 20 and one or more plasma processing modules 60. In addition, as will be described later, the transport robot 70 is configured to temporarily hold a consumable component within the plasma processing module 60 and adjust the position of the consumable component in a component replacement sequence.

[0036] In addition, between the plasma processing module 60 inside the vacuum transport module 50 and the vacuum transport module 50, and more specifically in the vicinity of the substrate transport port 52, a plurality of position detection sensors 53 for detecting the position of the substrate W or the consumable component on the transport robot 70 are provided, and in this embodiment, two position detection sensors 53 are provided corresponding to each substrate transport port 52. In one example, the position detection sensor 53 has a light projecting portion 53a and a light receiving portion 53b. As shown, the light projecting portion 53a is provided, for example, on the top surface of the vacuum transport module 50, and the light receiving portion 53b is provided, for example, on the bottom surface of the vacuum transport module 50. Figure 3

[0037] In the vacuum transport module 50, by detecting whether the light irradiated from the light projecting portion 53a of the position detection sensor 53 can be received by the light receiving portion 52b, it is determined whether the substrate W or the consumable component is present directly below the light projecting portion 53a, in other words, in the vicinity of the substrate transport port 52. In addition, by detecting the reception of light by each of the plurality of position detection sensors 53, the relative horizontal position of the substrate W or the consumable component with respect to the substrate transport port 52 can be detected.

[0038] Furthermore, the type and structure of the position detection sensor is not particularly limited to the example shown, as long as it can detect the position of the substrate W or the consumable component on the transport robot 70. For example, the position detection sensor 53 can be integrally configured with the light projecting portion 53a and the light receiving portion 53b, or other sensors such as a length measuring sensor can be used.

[0039] The plasma processing module 60 performs plasma processing such as etching processing on the substrate W. In one example, as shown, Figure 4 the plasma processing module 60 includes a plasma processing chamber 110, a support member 120, a plasma generating portion 130, and an exhaust system 140.

[0040] ​The plasma processing chamber 110 has a plasma processing space 110s. The plasma processing chamber 110 (plasma processing module 60) has a first face 110a and a second face 110b located on the opposite side of the first face 110a. A first opening 110c is formed in the first face 110a, and the first opening 110c is connected to the vacuum transport module 50 via the substrate transport port 52. Thus, the plasma processing space 110s communicates with the vacuum transport space 50s via the first opening 110c and the substrate transport port 52. A gate valve 111 is provided on the first face 110a side, and is configured to be able to open and close the substrate transport port 52 using the gate valve 111. A second opening 110d is formed in the second face 110b, and the second opening 110d is connected to the movable replacement device 2 described later via a component transport port 201 described later. A gate valve 112 is provided on the second face 110b side, and is configured to be able to open and close the component transport port 201 using the gate valve 112.

[0041] The support member 120 includes a main body portion 121, a ring assembly 122, and a lifter 123. The main body portion 121 has a central region 120a for supporting the substrate W and a ring-shaped region 120b for supporting the ring assembly 122. The ring-shaped region 120b of the main body portion 121 encloses the central region 120a of the main body portion 121 when viewed from above. The substrate W is disposed on the central region 120a of the main body portion 121, and the ring assembly 122 is disposed on the ring-shaped region 120b of the main body portion 121 in a manner that encloses the substrate W on the central region 120a of the main body portion 121. Thus, the central region 120a is also referred to as a substrate support surface for supporting the substrate W, and the ring-shaped region 120b is also referred to as a ring support surface for supporting the ring assembly 122.

[0042] In one embodiment, the main body 121 includes a base 121a and an electrostatic chuck 121b. The base 121a includes an electrically conductive member. The electrically conductive member of the base 121a can function as a lower electrode. The electrostatic chuck 121b is disposed on the base 121a. The electrostatic chuck 121b includes an unillustrated ceramic member and an unillustrated electrostatic electrode disposed in the ceramic member. The ceramic member has a central region 120a. In one embodiment, the ceramic member also has a ring-shaped region 120b. Further, other members surrounding the electrostatic chuck 121b, such as a ring-shaped electrostatic chuck, a ring-shaped insulating member, etc., can also have the ring-shaped region 120b. In this case, the ring assembly 122 can be disposed on either the ring-shaped electrostatic chuck or the ring-shaped insulating member, or on both the electrostatic chuck 121b and the ring-shaped insulating member. In addition, at least one RF / DC electrode coupled to an RF (Radio Frequency) power source and / or a DC (Direct Current) power source can also be disposed in the ceramic member. In this case, the at least one RF / DC electrode functions as a lower electrode. In the case where a bias RF signal and / or a DC signal is supplied to the at least one RF / DC electrode, the RF / DC electrode is also referred to as a bias electrode. In addition, the electrically conductive member of the base 121a and the at least one RF / DC electrode can also function as a plurality of lower electrodes. In addition, the electrostatic electrode can also function as a lower electrode. Thus, the support member 120 includes at least one lower electrode.

[0043] The ring assembly 122 includes one or more ring-shaped members. In one embodiment, the one or more ring-shaped members include one or more edge rings and at least one cover ring. The edge rings are formed of an electrically conductive material or an insulating material, and the cover ring is formed of an insulating material. In the present embodiment, the ring assembly 122 is a consumable ring that is an example of a consumable part that is a replacement target. Thus, the ring assembly 122 before use is stored in the mobile replacement device 2 described later, and is replaced with the ring assembly 122 after use in the plasma processing chamber 110.

[0044] The lifters 123 are disposed in plurality corresponding to through-holes formed in the main body 121, and in the present embodiment, three are disposed. Each of the lifters 123 has 3 ring lift pins 123a that move the ring assembly 122 on the ring-shaped region 120b (a ring support surface) in the longitudinal direction, and 3 wafer lift pins 123b that move the wafer W on the central region 120a (a wafer support surface) in the longitudinal direction. In addition, the lifters 123 have an actuator 124 that moves the ring lift pins 123a and the wafer lift pins 123b in the longitudinal direction. Among them, the actuator 124 can be disposed in common to the ring lift pins 123a and the wafer lift pins 123b, or can be disposed independently for the ring lift pins 123a and the wafer lift pins 123b.

[0045] The actuator 124 moves the ring lift pin 123a between an exchange position H1 above the ring support surface and a standby position H2 below the ring support surface (see FIG. 2). Figure 5 The standby position H2 is a position in which the front end of the ring lift pin 123a does not protrude from the ring support surface. Thus, the actuator 124 moves the ring lift pin 123a in the axial direction (longitudinal direction) to raise and lower the ring assembly 122 on the electrostatic chuck 121b. An example of the actuator includes an electric actuator, a pneumatic cylinder, a motor, or the like.

[0046] The support member 120 can also include a temperature adjustment module configured to adjust at least one of the electrostatic chuck 121b, the ring assembly 122, and the substrate W to a target temperature. The temperature adjustment module can include a heater, a heat transfer medium, a flow path, or a combination thereof. A heat transfer fluid such as brine or gas flows in the flow path. In one embodiment, the flow path is formed in the susceptor 121a, and one or more heaters are disposed in the ceramic member of the electrostatic chuck 121b. In addition, the support member 120 can also include a heat transfer gas supply portion configured to supply a heat transfer gas (backside gas) to a gap between the back surface of the substrate W and the upper surface of the electrostatic chuck 121b.

[0047] The plasma generation portion 130 is configured to generate plasma from at least one type of process gas supplied into the plasma processing space 110s. The plasma generation portion 130 includes a gas introduction portion, a gas supply portion 132, and a power source 133.

[0048] The gas introduction portion includes a showerhead 131. The showerhead 131 is disposed above the support member 120. In one embodiment, the showerhead 131 constitutes at least a portion of the ceiling of the plasma processing chamber 110.

[0049] The showerhead 131 is configured to introduce at least one process gas from the gas supply section 132 into the plasma processing space 110s. The showerhead 131 has at least one gas supply port 131a, at least one gas diffusion chamber 131b, and a plurality of gas introduction ports 131c. The process gas supplied from the gas supply section 132 to the gas supply port 131a is introduced into the plasma processing space 110s from the plurality of gas introduction ports 131c through the gas diffusion chamber 131b. In addition, the showerhead 131 includes at least one upper electrode. Furthermore, the gas introduction section can include, in addition to the showerhead 131, one or more side gas injectors (SGI) installed to one or more opening sections formed in the side wall of the plasma processing chamber 110. Furthermore, in the present embodiment, the showerhead 131 can be an example of a consumable part that is subject to replacement. Therefore, the showerhead 131 before use is stored in the mobile replacement device 2 described later, and can be replaced with the showerhead 131 after use in the plasma processing chamber 110.

[0050] The gas supply section 132 can include at least one gas source 132a and at least one flow controller 132b. In one embodiment, the gas supply section 132 is configured to supply at least one process gas from the respective corresponding gas source 132a to the showerhead 131 via the respective corresponding flow controller 132b. Each flow controller 132b can include, for example, a mass flow controller or a pressure-controlled flow controller. Also, the gas supply section 132 can include at least one flow modulation device that modulates or pulses the flow of at least one process gas.

[0051] The power source 133 includes an RF power source 133a coupled to the plasma processing chamber 110 via at least one impedance matching circuit. The RF power source is configured to supply at least one RF signal (RF electric power) to at least one lower electrode and / or at least one upper electrode. Thereby, a plasma can be formed from at least one process gas supplied to the plasma processing space 110s. In addition, by supplying a bias RF signal to at least one lower electrode, a bias potential can be generated at the substrate W, and an ion component in the formed plasma can be introduced into the substrate W.

[0052] In one embodiment, the RF power source 133a includes a first RF generating section 133al and a second RF generating section 133a2. The first RF generating section 133al is configured to be coupled to the at least one lower electrode and / or the at least one upper electrode via at least one impedance matching circuit, and is capable of generating a generating-source RF signal (generating-source RF electric power) for generating plasma. In one embodiment, the generating-source RF signal has a frequency in a range of 10 MHz to 150 MHz. In one embodiment, the first RF generating section 133al can also be configured to be capable of generating a plurality of generating-source RF signals having different frequencies. The generated generating-source RF signal(s) is / are supplied to the at least one lower electrode and / or the at least one upper electrode.

[0053] The second RF generating section 133a2 is configured to be coupled to the at least one lower electrode via at least one impedance matching circuit, and is capable of generating a bias RF signal (bias RF electric power). The bias RF signal can have the same frequency as the generating-source RF signal, or can have a different frequency. In one embodiment, the bias RF signal has a frequency lower than that of the generating-source RF signal. In one embodiment, the bias RF signal has a frequency in a range of 100 kHz to 60 MHz. In one embodiment, the second RF generating section 133a2 can also be configured to be capable of generating a plurality of bias RF signals having different frequencies. The generated bias RF signal(s) is / are supplied to the at least one lower electrode. In addition, in various embodiments, at least one of the generating-source RF signal and the bias RF signal can be pulsed.

[0054] In addition, the power source 133 can also include a DC power source 133b coupled to the plasma processing chamber 110. The DC power source 133b includes a first DC generating section 133bl and a second DC generating section 133b2. In one embodiment, the first DC generating section 133bl is connected to the at least one lower electrode, and is configured to be capable of generating a first DC signal. The generated first DC signal is applied to the at least one lower electrode. In one embodiment, the second DC generating section 133b2 is connected to the at least one upper electrode, and is configured to be capable of generating a second DC signal. The generated second DC signal is applied to the at least one upper electrode.

[0055] In various embodiments, the first and second DC signals can also be pulsed. In this case, a sequence of voltage pulses is applied to the at least one lower electrode and / or the at least one upper electrode. The voltage pulses can have a pulse waveform that is rectangular, trapezoidal, triangular, or a combination thereof. In one embodiment, a waveform generation section for generating a sequence of voltage pulses from the DC signal is connected between the first DC generation section 133b1 and the at least one lower electrode. Thus, the first DC generation section 133b1 and the waveform generation section constitute a voltage pulse generation section. When the second DC generation section 133b2 and the waveform generation section constitute a voltage pulse generation section, the voltage pulse generation section is connected to the at least one upper electrode. The voltage pulses can have a positive polarity, or a negative polarity. In addition, the sequence of voltage pulses can include one or more positive polarity voltage pulses and one or more negative polarity voltage pulses in one cycle. In addition, the first and second DC generation sections 133b1, 133b2 can be provided in addition to the RF power source, and the first DC generation section 133b1 can be provided instead of the second RF generation section 133a2.

[0056] In addition, in the illustrated example, a case where the plasma processing module 60 has a capacitively coupled plasma (CCP) plasma generation section 130 is described. However, the structure of the plasma generation section is not limited to this, and can be an inductively coupled plasma (ICP), an electron-cyclotron-resonance plasma (ECR plasma), a helicon wave plasma (HWP), a surface wave plasma (SWP), or the like. In addition, various types of plasma generation sections including an AC (alternating current) plasma generation section and a DC (direct current) plasma generation section can be used. In one embodiment, the AC signal (AC electric power) used in the AC plasma generation section has a frequency in the range of 100 kHz to 10 GHz. Thus, the AC signal includes an RF (radio frequency) signal and a microwave signal. In one embodiment, the RF signal has a frequency in the range of 100 kHz to 150 MHz.

[0057] The exhaust system 140 is connected to, for example, a gas exhaust port 110e provided in the bottom of the plasma processing chamber 110. The exhaust system 140 can also include a pressure regulating valve and a vacuum pump. The internal pressure of the plasma processing space 110s can be regulated using the pressure regulating valve. The vacuum pump can include a turbo molecular pump, a dry pump, or a combination thereof.

[0058] Returning to the explanation of the plasma processing system.

[0059] The mobile exchange device 2 internally stores a consumable component, such as a ring assembly 122, before use, and further exchanges the ring assembly 122 before use with a ring assembly 122 after use in the plasma processing module 60. As shown in FIG. 1, the mobile exchange device 2 has an upper chamber 200, a lower chamber 210, and a mobile mechanism 220. The mobile mechanism 220, the lower chamber 210, and the upper chamber 200 are stacked in this order. Figure 6

[0060] As shown in FIG. 2, a component transport port 201 connected to the second face 110b of the plasma processing chamber 110 and a gate valve 202 that opens and closes the component transport port 201 are provided in the upper chamber 200. In addition, as shown in FIG. 3, an opening portion 203 connected to a component storage portion 230 that stores a plurality of consumable components, such as a ring assembly 122 and a shower head 131, and a gate valve 204 that opens and closes the opening portion 203 are provided in the upper chamber 200. Thus, the mobile exchange device 2 is connected to the plasma processing chamber 110 of the plasma processing module 60 at the second face 110b, and the plasma processing space 110s communicates with an exchange space 200s inside the upper chamber 200 via the component transport port 201. Figure 1 Figure 6 Figure 1

[0061] A component exchange robot 240 that transports a ring assembly 122 and the like as a consumable component is provided inside the upper chamber 200. The component exchange robot 240 is a multi-joint robot including a plurality of, for example, three, transport arms 241. The three transport arms 241 are each configured to be rotatable. A front end transport arm 241a holds and transports a consumable component. The front end transport arm 241a is also called a so-called end effector. A root end transport arm 241c is rotatably attached to a base 242. The component exchange robot 240 is configured to be able to transport a consumable component between the component storage portion 230 and the plasma processing module 60.

[0062] ​​​​An exhaust system 211 and a gas supply system 212 are provided inside the lower chamber 210. The exhaust system 211 and the gas supply system 212 are connected to the exchange space 200s inside the upper chamber 200, respectively. In the mobile exchange device 2, by the operation of these exhaust system 211 and the gas supply system 212, the internal pressure of the exchange space 200s can be regulated.

[0063] Further, the mobile exchange device 2 is configured to be able to move to in front of any of the plasma processing modules 60 which are the exchange targets of the consumable parts by the moving mechanism 220. In an example, as shown in FIG. 2, the moving mechanism 220 is provided with wheels 221, a power source such as a battery, a power source, a steering mechanism, and the like, but as long as the mobile exchange device 2 can be moved, the structure is not particularly limited. The mobile exchange device 2 is moved to in front of any of the plasma processing modules 60 by the moving mechanism 220 like this, then connected to the second face 110b of the plasma processing module 60, then the exchange of the consumable parts is performed. The details of the exchange method of the consumable parts will be described later. Figure 6

[0064] ​In the above plasma processing system, at least one control section 3 is provided as described above. The control section 3 processes computer executable commands that cause the plasma processing system to perform various processes described in the present application. The control section 3 can be configured to control each element of the plasma processing system to perform various processes described herein. In one embodiment, part or all of the control section 3 can also be included in the plasma processing system. The control section 3 can include a processing section 3a1, a storage section 3a2, and a communication interface 3a3. The control section 3 is implemented by, for example, a computer 2a. The processing section 3a1 can be configured to perform various control actions by reading a program from the storage section 3a2 and executing the read program. The program can be pre-stored in the storage section 3a2, or can be acquired via a medium as needed. The acquired program is stored in the storage section 3a2, read from the storage section 3a2 by the processing section 3a1, and executed. The medium can be various storage media readable by the computer 2a, or can be a communication line connected to the communication interface 3a3. The processing section 3a1 can be a CPU (Central Processing Unit). The storage section 3a2 can include a RAM (Random Access Memory), a ROM (Read Only Memory), an HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface 3a3 can also communicate with the plasma processing system via a communication line such as a LAN (Local Area Network). In addition, the above storage medium can be temporary or non-temporary.

[0065] The plasma processing system of the present embodiment is configured as described above. Next, a ring replacement sequence as an example of a component replacement sequence using the plasma processing system will be described. Figure 7 is a cross-sectional view showing a state in which the mobile replacement device 2 is connected to the plasma processing module 60. In the following description, replacement of the ring assembly 122 as a consumable ring, which is an example of a consumable component, is performed, and the component storage section 230 and the component replacement robot 240 of the mobile replacement device 2 correspond to the ring storage section and the ring replacement robot in the technology of the present application, respectively. In addition, in one example, the ring replacement sequence is performed under the control of the control section 3.

[0066] When the ring replacement sequence is performed, first, the mobile replacement device 2 is moved in front of the plasma processing module 60 to which the ring assembly 122 to be replaced is attached by the movement mechanism 220. Figure 8 Step S1 of FIG. 8.

[0067] Next, the mobile exchange device 2 is connected to the second surface 110b of the plasma processing module 60 (step S2). The connection of the mobile exchange device 2 to the plasma processing module 60 is performed using a fastening member or the like, for example, after the relative horizontal position of the mobile exchange device 2 with respect to the plasma processing module 60 is determined by a positioning pin or the like. Figure 8

[0068] Next, the gate valve 202 of the upper chamber 200 is closed, and pressure adjustment and purge of the exchange space 200s are performed in a state in which the plasma processing space 110s is separated from the exchange space 200s (step S3). When the internal pressure of the exchange space 200s and the internal pressure of the plasma processing space 110s, which is the exchange target of the ring assembly 122, are substantially identical, the gate valve 202 of the upper chamber 200 and the gate valve 112 of the plasma processing chamber 110 are opened, and the plasma processing space 110s is made to communicate with the exchange space 200s. Figure 8

[0069] When the plasma processing space 110s and the exchange space 200s are made to communicate, the used ring assembly 122 in the plasma processing module 60 is then recovered (step S4). Figure 8

[0070] Specifically, first, the ring lift pin 123a is caused to rise from the standby position H2 to the handover position Hl, and the used ring assembly 122, which is supported on the ring support surface of the support member 120, is lifted on the ring support surface.

[0071] Next, the transport arm 241 of the mobile exchange device 2 is caused to enter the plasma processing space 110s, and the transport arm 241 is inserted below the used ring assembly 122 that is lifted by the ring lift pin 123a.

[0072] Next, the ring lift pin 123a is caused to descend from the handover position Hl to the standby position H2, and thereby the used ring assembly 122 is handed over from the ring lift pin 123a to the transport arm 241 of the mobile exchange device 2.

[0073] Finally, the transport arm 241 that holds the used ring assembly 122 is caused to move toward the exchange space 200s, and then the used ring assembly 122 is transported to the component storage section 230, and thereby the recovery of the used ring assembly 122 is completed.

[0074] Next, the pre-use ring assembly 122 is transported into the plasma processing module 60 (step S5). Figure 8

[0075] ​​​​Specifically, first, the transport arm 241 of the component replacement robot 240 is caused to enter the component storage section 230, and the ring assembly 122 before use is held.

[0076] Next, the transport arm 241 holding the ring assembly 122 before use is caused to enter the plasma processing space 110s.

[0077] Next, the ring lift pin 123a is caused to rise from the standby position H2 to the handover position Hl, whereby the ring assembly 122 before use is handed over from the transport arm 241 to the ring lift pin 123a.

[0078] After that, by causing the transport arm 241 to retreat to the replacement space 200s, the transport of the ring assembly 122 before use into the plasma processing module 60 is completed.

[0079] Thus, by using the mobile replacement device 2, it is possible to appropriately replace the ring assembly 122 after use in the plasma processing module 60 with the ring assembly 122 before use. At this time, the inside of the upper chamber 200 of the mobile replacement device 2, that is, the replacement space 200s that communicates with the plasma processing space 110s is preliminarily depressurized to the same degree of vacuum as the plasma processing space 110s (step S3). Therefore, it is not necessary to open the plasma processing module 60, which is the object of replacement of the ring assembly 122, to the atmosphere, and it is possible to perform component replacement in a depressurized environment, so it is possible to shorten the evacuation time after replacement of the component and the mean time between cleaning (MTBC).

[0080] However, the mobile replacement device 2 and the plasma processing module 60 are repeatedly disassembled and assembled each time component replacement is performed, so, as described above, there are cases in which the position of the mobile replacement device 2 and the plasma processing module 60 is shifted due to docking (step S2). Therefore, due to this shift in position, the positional relationship of the support member 120 in the plasma processing module 60 and the transport arm 241, that is, the relationship of the replacement position (placement intended position) of the ring assembly 122 and the transport position of the transport arm 241 becomes unstable, and it can not be possible to place the ring assembly 122 at the intended position.

[0081] Therefore, in the ring replacement sequence of the present technology, instead of placing the ring assembly 122 before use handed over to the ring lift pin 123a by the transport arm 241 directly on the support member 120, a position adjustment using the transport robot 70 disposed in the vacuum transport module 50 is performed. Therefore, the feeding of the ring assembly 122 before use by the mobile replacement device 2 (step S5) can be said to be a temporary placement step of temporarily placing the ring assembly 122 before use on the ring lift pin 123a (the plasma processing module 60).

[0082] When the ring assembly 122 before use is handed over from the transport arm 241 to the ring lift pin 123a, the transport arm 71 of the transport robot 70 is then caused to enter the plasma processing space 110s from the vacuum transport space 50s, and the transport arm 71 is inserted under the ring assembly 122 before use held by the ring lift pin 123a.

[0083] At this time, based on the measurement results of the first position detection sensor 73 and the second position detection sensor 74 mounted to the end effector of the transport arm 71, the position of the ring assembly 122 before use within the plasma processing module 60 is detected (step S6). Figure 8

[0084] As an example, the position of the ring assembly 122 before use on the ring lift pin 123a is detected by the first position detection sensor 73 disposed on the upper surface of the end effector, and the position of the support member 120 is detected by the second position detection sensor 74 disposed on the lower surface of the end effector. By integrating the positions of the ring assembly 122 before use and the support member 120 obtained from the measurement results of these first and second position detection sensors 73, 74, the amount of shift of the relative horizontal position of the ring assembly 122 before use with respect to the support member 120 can be detected.

[0085] When the position of the ring assembly 122 before use is detected, the ring lift pin 123a is then caused to descend from the handover position H1 to the standby position H2, whereby the ring assembly 122 before use is handed over from the ring lift pin 123a to the transport arm 71.

[0086] The transport arm 71 holding the ring assembly 122 before use is then moved in the horizontal direction, whereby the positional shift of the ring assembly 122 before use and the support member 120 detected in step S6 is corrected (step S7). Figure 8 The correction of the positional shift can be performed inside the plasma processing module 60 or inside the vacuum transport module 50.

[0087] At this time, the vacuum transport module 50 and the plasma processing module 60 are not disassembled each time a component is replaced, and the docking state (the relative horizontal position of the vacuum transport module 50 with respect to the plasma processing module 60) is fixed. Therefore, the positional relationship of the support member 120 within the plasma processing module 60 with respect to the transport arm 71, in other words, the relationship of the replacement position (placement predetermined position) of the ring assembly 122 before use with respect to the transport position of the transport arm 71 is determined, and thus the ring assembly 122 before use can be appropriately positioned at the required position.

[0088] ​Further, the position detection sensor 53 capable of detecting the horizontal positional relationship of the ring assembly 122 with respect to the substrate transport port 52 is installed in the vacuum transport module 50. Thereby, the relative positional relationship of the vacuum transport module 50 and the plasma processing module 60 can be grasped, and the positioning of the ring assembly 122 can be more appropriately performed (step S7).

[0089] When the positional deviation of the ring assembly 122 and the support member 120 before use is corrected, the ring assembly 122 before use can be subsequently placed on the ring support surface of the support member 120 (step S8). Figure 8 of step S8).

[0090] Specifically, first, the ring lift pin 123a is raised from the standby position H2 to the handover position Hl, whereby the ring assembly 122 before use is handed over from the transport arm 711 to the ring lift pin 123a.

[0091] Subsequently, the transport arm 71 is retracted from the vacuum transport space 50s.

[0092] Finally, the ring lift pin 123a holding the ring assembly 122 before use is lowered from the handover position Hl to the standby position H2, whereby the ring assembly 122 before use can be placed on the ring support surface from the ring lift pin 123a.

[0093] When the ring assembly 122 is placed on the ring support surface, the series of ring replacement sequences is completed.

[0094] In the above, according to the plasma processing system of the present technology, even in the case where the positional deviation due to the docking (step S2) occurs between the plasma processing module 60 which is the replacement target of the consumable part and the mobile replacement device 2, the positional deviation can be corrected by the transport robot 70 of the vacuum transport module 50, and the consumable part can be appropriately transported to the required position.

[0095] Further, the mobile replacement device 2 which generally stores and transports the consumable parts is set with emphasis on the transportable weight because the types of the consumable parts are various, and the positional accuracy of the transport is not high, but by performing the positional correction using the transport robot 70 as in the present application, the consumable part can be transported to the required position without depending on the transport accuracy of these mobile replacement devices 2.

[0096] Further, as described above, in the plasma processing system of the present application, when the consumable part is replaced, the plasma processing module 60 does not need to be opened to the atmosphere. Therefore, the replacement of the consumable part can be performed under reduced pressure (vacuum) or in a dry environment, and the evacuation time after the replacement of the part and the mean time between cleaning (MTBC) can be shortened.

[0097] Thus, according to the technology of the present application, the module including the consumable part to be replaced is not limited to the module that performs the processing of the substrate W by depressurization, such as the plasma processing module 60 described above, and an arbitrary substrate processing module can be selected. Likewise, the module connected to the substrate processing module is not limited to the module that performs the transport of the substrate W by depressurization, such as the vacuum transport module 50 described above, and an arbitrary substrate transport module that transports the substrate W under atmospheric pressure or in a dry environment can be connected.

[0098] Further, according to the present application, the used consumable part can be recovered by the transport arm 241 of the mobile replacement device 2 without passing through the vacuum transport module 50 (step S4). Thus, it is not necessary to bring the used consumable part into the vacuum transport module 50, and the contamination of the vacuum transport module 50 can be suppressed. In addition, at the same time, by not using the transport arm 71 of the vacuum transport module 50 for the recovery of the used consumable part, the use of the transport arm 71 involved in the replacement of the parts can be minimized, and the influence on other processing performed in the plasma processing module 60 can be reduced.

[0099] Further, in the above embodiment, the case where the consumable part to be replaced is the ring assembly 122 (cover ring, focus ring) that is a consumable ring has been described as an example, but the type of the consumable part is not limited thereto. Specifically, for example, the shower head 131 described above, a deposit shield for preventing the deposition of deposits on the sidewall of the plasma processing chamber 110 can be used as the consumable part, and the replacement thereof can be performed by the mobile replacement device 2 and the transport arm 71.

[0100] In addition, for example, the second chamber for making the maintenance of the plasma processing chamber 110 easy, disclosed in Japanese Patent Application Publication No. 2022-8057, more specifically, the second chamber that is arranged inside the plasma processing chamber 110 and divides the processing space in the plasma processing chamber 110 can be used as the consumable part, and the replacement thereof can be performed by the mobile replacement device 2 and the transport arm 71.

[0101] In this way, even in the case of replacing other consumable parts, by performing the position offset correction by the transport arm 71 after the temporary introduction of the consumable part by the mobile replacement device 2, the consumable part can be appropriately transported to the required position.

[0102] Further, in the above embodiment, the position of the consumable component to be replaced is grasped by the first position detection sensor 73 and the second position detection sensor 74 attached to the transport arm 71 of the transport robot 70 and the position detection sensor 53 attached to the vacuum transport module 50, and the transport of the consumable component is performed. However, the number and arrangement of the position detection sensors are not limited to this, and other position detection sensors can also be provided at any position in the plasma processing system.

[0103] Specifically, for example, other position detection sensors can be attached to the top surface of the plasma processing module 60 (plasma processing chamber 110) instead of the position detection sensor 53 and any one of the first and second position detection sensors 73, 74 or in addition to these. The structure and type of the other position detection sensors are not particularly limited as long as the position of the consumable component on the transport arm can be determined. In this way, by providing the other position detection sensors at the plasma processing module 60, the position of the consumable component can be more accurately determined when the component replacement sequence is performed, and the correction of the positional deviation (step S7), the transport to the desired position can be more precisely performed.

[0104] Further, in the above embodiment, the position of the consumable component to be replaced is grasped by the first and second position detection sensors 73, 74 attached to the transport arm 71 of the transport robot 70 and the position detection sensor 53 arranged at the vacuum transport module 50. However, when detecting the horizontal position of the consumable component, it is not necessary to use both the first and second position detection sensors 73, 74 and the position detection sensor 53, and only one of them can be used for position detection. Thus, in the technology of the present application, the position detection of the consumable component can be performed inside the plasma processing module 60 (first and second position detection sensors 73, 74) or inside the vacuum transport module 50 (position detection sensor 53).

[0105] Further, in the above embodiment, the position of the consumable component is detected using the position detection sensor, but it can be configured to be able to detect the orientation of the rotation direction of the consumable component in addition to the position of the consumable component. For example, in the case where the consumable component is the ring assembly 122, the orientation of the rotation direction can be detected by confirming the position of the orientation flat formed in the ring assembly 122.

[0106] Further, in the above embodiment, the consumable component before use stored in the mobile replacement device 2 is sequentially handed over to the transport arm 241, the ring lift pin 123a, the transport arm 71, and the ring lift pin 123a, and the component replacement sequence is performed (see FIG. 6). ​). In other words, the consumable component is handed over from the transport arm 241 of the mobile exchange device 2 to the transport arm 71 of the vacuum transport module 50 via the ring lift pin 123a.

[0107] However, the method of the component exchange sequence is not limited to this, and the consumable component can be handed over from the transport arm 241 to the transport arm 71 directly without passing through the ring lift pin 123a.

[0108] Even in this case, by detecting the position of the consumable component on the transport arm 241 using the first position detection sensor 73 provided to the transport arm 71, and detecting the position of the support member 120 using the second position detection sensor 74, and grasping the relative positional relationship of the consumable component and the support member 120 from the detection results thereof, the consumable component can be appropriately transported to the required position.

[0109] It should be considered that the embodiments of the present application are illustrative in all respects rather than restrictive. The above-described embodiments can be omitted, replaced, changed in various ways without departing from the scope and spirit of the present application. For example, the constituent elements of the above-described embodiments can be combined arbitrarily. According to this arbitrary combination, the effects of each of the constituent elements involved in the combination can of course be obtained, and other effects apparent to those skilled in the art from the description of the present specification can be obtained.

[0110] In addition, the effects described in the present specification are merely illustrative or exemplified and are not limited. That is, the technology of the present application can achieve one or more of the above-mentioned effects and other effects apparent to those skilled in the art from the description of the present specification.

[0111] Explanation of Reference Signs

[0112] 1 Plasma processing device

[0113] 2 Mobile exchange device

[0114] 3 Control section

[0115] 50 Vacuum transport module

[0116] 53 Position detection sensor

[0117] 60 Plasma processing module

[0118] 70 Transport robot

[0119] 73 First position detection sensor

[0120] 74 Second position detection sensor

[0121] 110a First surface

[0122] 110b second surface

[0123] 120 support member

[0124] 120a central region

[0125] 120b annular region

[0126] 122 ring assembly

[0127] 123a ring lift pin

[0128] 230 component storage section

[0129] 240 component replacement robot

[0130] H1 handover position

[0131] H2 standby position

Claims

1. A cluster tool comprising a plasma processing device, a mobile replacement device, and at least one control unit, characterized in that: The plasma processing device has: A plasma processing module having a first surface and a second surface; A vacuum transport module connected to the plasma processing module on the first side; and Position detection sensor, The plasma processing module has: The supporting component has a substrate support surface and a ring support surface; Consumption ring, which is disposed on the ring support surface; and Multiple lifting pins are configured to move longitudinally between a junction position above the ring support surface and a standby position below the ring support surface. The vacuum transport module includes a transport robot configured to transport the consumable ring between the plasma processing module and the vacuum transport module. The mobile replacement device has: Environmental protection management unit, configured to store the aforementioned consumable ring; and The ring-changing robot is configured to transport the consumable ring between the environmental protection pipe section and the plasma processing module. The at least one control unit is configured to control the plasma processing device and the mobile replacement device to execute a ring replacement sequence. The ring replacement sequence includes: The process of connecting the mobile replacement device to the plasma processing module on the second side; The process of using the ring replacement robot to transport the consumable ring in the environmental protection pipe section to the plasma processing module and place it on the plurality of lifting pins located at the handover position; The process of detecting the horizontal position of the consumption rings on the plurality of lifting pins using the position detection sensor; Based on the position detection results of the position detection sensor, the process of using the transport robot to adjust the horizontal position of the consumption rings on the multiple lifting pins; and The process of moving the plurality of lifting pins to the standby position and placing the consumption ring on the ring support surface.

2. The clustering tool according to claim 1, characterized in that: The second face is located on the opposite side of the first face.

3. The clustering tool according to claim 1, characterized in that: The position detection sensor is mounted on the delivery arm of the delivery robot.

4. The clustering tool according to claim 3, characterized in that: The position detection sensor includes: A first detection sensor configured to detect the position of the consumption ring within the plasma processing module; and It is configured as a second detection sensor capable of detecting the position of the support member. The at least one control unit is configured to determine the relative positional relationship between the consumption ring and the support member based on the detection results of the first detection sensor and the second detection sensor.

5. The clustering tool according to claim 1, characterized in that: The position detection sensor is installed in the plasma processing module.

6. The clustering tool according to claim 1, characterized in that: The position detection sensor is installed on the vacuum transport module.

7. The clustering tool according to claim 6, characterized in that: The position detection sensor is positioned between the plasma processing module and the vacuum transport module.

8. The clustering tool according to claim 7, characterized in that: The position detection sensor includes: The light-projecting section is configured to emit light; and The light-receiving part is configured to detect the light. The at least one control unit is configured to determine the position of the consumption ring between the plasma processing module and the vacuum transport module based on the detection result of the light by the light receiving unit.

9. A clustering tool comprising a substrate processing unit, a mobile replacement unit, and at least one control unit, characterized in that: The substrate processing apparatus has: A substrate processing module with a first side and a second side; A substrate transport module connected to the substrate processing module on the first side; and Position detection sensor, The substrate processing module has consumable components. The substrate transport module includes a transport robot configured to transport the substrate between the substrate processing module and the substrate transport module. The mobile replacement device has: A component storage unit, configured to store the consumable components; and A component replacement robot is configured to transport consumable components between the component storage section and the substrate processing module. The at least one control unit is configured to control the substrate processing apparatus and the mobile replacement device to execute a component replacement sequence. The component replacement sequence includes: The process of connecting the mobile replacement device to the substrate processing module on the second side; The process of using the component replacement robot to transport consumable components from the component storage area to the substrate processing module; The process of detecting the position of the transported consumable component using the position detection sensor: and The process of adjusting the position of the consumable component being transported using the transport robot based on the position detection result of the position detection sensor.

10. The clustering tool according to claim 9, characterized in that: The second face is located on the opposite side of the first face.

11. The clustering tool according to claim 9, characterized in that: The position detection sensor is mounted on the delivery arm of the delivery robot.

12. The clustering tool according to claim 9, characterized in that: The position detection sensor is installed on the substrate transport module.

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