Grinding workpiece surface skewness-based grinding processing method and system, terminal and medium

Abstract

The invention relates to the technical field of grinding machining, and discloses a grinding machining method and system based on the surface skewness of a grinding workpiece, a terminal and a medium, and the grinding machining method based on the surface skewness of the grinding workpiece comprises the steps that morphology information of the grinding workpiece ground under different grinding agents is obtained; the shape information is processed, and surface skewness information of the grinding workpiece is obtained; according to the surface skewness information, correlation information influencing the surface skewness of the grinding workpiece is obtained, and the correlation information is the relation between the hardness of the workpiece and the hardness of abrasive particles of a grinding agent; and a target grinding agent corresponding to the target workpiece is determined according to the associated information, so that the target grinding agent is adopted for grinding the target workpiece. The matching relation between the abrasive particle hardness and the workpiece hardness can be adjusted based on the hardness relation, adjustment of the surface skewness parameter of the target workpiece is achieved, and then the workpiece grinding effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of grinding processing, and particularly relates to a grinding processing method and system based on surface skewness of a grinding workpiece, a terminal and a medium. BACKGROUND

[0002] Grinding is a precision and ultra-precision machining method widely used in different fields. The abrasive particles coated or embedded on a grinding tool are used to finish the machining surface through the relative movement of the grinding tool and the workpiece under a certain pressure. In the machining process of high-precision major equipment, grinding is often the last step of machining a series of key components such as the matching surface of the integral bladed disk of an aero-engine, the square mirror of the workpiece table of a photoetching machine, and the precision bearing ball of a numerical control machine tool, directly determining the surface quality of the finished product, and is of great significance to the stable operation of the equipment and the health and safety of the operating personnel. As an important factor affecting the grinding processing effect, the grinding process has a very important influence on the quality control of the machining surface.

[0003] At present, there is a lack of relevant knowledge and experience to regulate the skewness parameter, so that the grinding effect of the grinding workpiece cannot be guaranteed when different grinding agents are selected for grinding different grinding workpieces.

[0004] Therefore, the prior art still needs to be improved and developed. SUMMARY

[0005] The main purpose of the present application is to provide a grinding processing method and system based on surface skewness of a grinding workpiece, a terminal and a medium, which aims to solve the problem of poor workpiece grinding effect when different grinding agents are selected for grinding different grinding workpieces in the prior art.

[0006] The first aspect of the embodiment of the present application provides a grinding processing method based on surface skewness of a grinding workpiece, which comprises the following steps: Obtaining the topographic information of the grinding workpiece under different grinding agents; Processing the topographic information to obtain the surface skewness information of the grinding workpiece; According to the surface skewness information, obtaining the correlation information affecting the surface skewness of the grinding workpiece, wherein the correlation information is the relationship between the hardness of the workpiece and the hardness of the abrasive particles of the grinding agent; According to the correlation information, determining the target grinding agent corresponding to the target workpiece, so as to adopt the target grinding agent to grind the target workpiece.

[0007] Optionally, in an embodiment of the present application, the topographic information comprises a first surface topographic image and a second surface topographic image. The morphology information of the grinding workpiece under different grinding agents is obtained, specifically including: A first surface morphology image of the grinding workpiece under a first grinding agent is obtained; A second surface morphology image of the grinding workpiece under a second grinding agent is obtained; The hardness of the abrasive particles of the first grinding agent is less than the hardness of the grinding workpiece, and the hardness of the abrasive particles of the second grinding agent is greater than the hardness of the grinding workpiece.

[0008] Optionally, in an embodiment of the present application, the grinding workpiece is a first workpiece; The morphology information of the grinding workpiece under different grinding agents is obtained, and then further includes: A third surface morphology image of a second workpiece under a first grinding agent is obtained; A fourth surface morphology image of the second workpiece under a second grinding agent is obtained; The hardness of the first grinding agent is greater than the hardness of the first workpiece, the hardness of the first workpiece is greater than the hardness of the second grinding agent, and the hardness of the second grinding agent is greater than the hardness of the second workpiece.

[0009] Optionally, in an embodiment of the present application, the first surface morphology image of the grinding workpiece under the first grinding agent specifically includes: First point cloud data of the grinding workpiece under the first grinding agent is obtained, and the first point cloud data is filtered to obtain first intervention data; The first intervention data is filled to obtain first spatial reconstruction data; The first surface morphology image is generated according to the first spatial reconstruction data; The second surface morphology image of the grinding workpiece under the second grinding agent specifically includes: Second point cloud data of the grinding workpiece under the second grinding agent is obtained, and the second point cloud data is filtered to obtain second intervention data; The second intervention data is filled to obtain second spatial reconstruction data; The second surface morphology image is generated according to the second spatial reconstruction data.

[0010] Optionally, in an embodiment of the present application, the surface skewness information includes first surface skewness data and second surface skewness data; The morphology information is processed to obtain the surface skewness information of the grinding workpiece, specifically including: According to the first surface profile image, first surface skewness data of the grinding workpiece under the first grinding agent is obtained; According to the second surface profile image, second surface skewness data of the grinding workpiece under the second grinding agent is obtained.

[0011] Optionally, in an embodiment of the present application, the obtaining of the correlation information affecting the surface skewness of the grinding workpiece according to the surface skewness information specifically comprises: determining that the surface skewness of the grinding workpiece is a positive skewness characteristic according to the first surface skewness data; determining that the surface skewness of the grinding workpiece is a negative skewness characteristic according to the second surface skewness data; obtaining the correlation information affecting the surface skewness of the grinding workpiece according to the positive skewness characteristic, the negative skewness characteristic, and the hardness relationship of the first grinding agent, the second grinding agent and the grinding workpiece.

[0012] Optionally, in an embodiment of the present application, the determining of the target grinding agent corresponding to the target workpiece according to the correlation information specifically comprises: obtaining the workpiece hardness of the target workpiece; determining the target grinding agent from a plurality of candidate grinding agents according to the workpiece hardness, wherein the abrasive particle hardness of the target grinding agent is less than the workpiece hardness.

[0013] The second aspect of the embodiments of the present application further provides a grinding processing system based on the surface skewness of a grinding workpiece, wherein the grinding processing system based on the surface skewness of the grinding workpiece is applied to the grinding processing method based on the surface skewness of the grinding workpiece in any of the above solutions; and the grinding processing system based on the surface skewness of the grinding workpiece comprises: a profile information acquisition module configured to acquire profile information of a grinding workpiece under different grinding agents; a skewness calculation module configured to process the profile information to obtain surface skewness information of the grinding workpiece; a hardness relationship and skewness correlation module configured to obtain correlation information affecting the surface skewness of the grinding workpiece according to the surface skewness information, wherein the correlation information is a relationship between workpiece hardness and abrasive particle hardness of a grinding agent; a grinding agent determination module configured to determine a target grinding agent corresponding to a target workpiece according to the correlation information, so as to adopt the target grinding agent to perform grinding processing on the target workpiece.

[0014] The third aspect of the embodiments of the present application further provides a terminal, wherein the terminal comprises a memory, a processor, and a grinding workpiece surface deviation based grinding processing program stored in the memory and executable on the processor, and the grinding workpiece surface deviation based grinding processing program, when executed by the processor, implements the steps of the grinding workpiece surface deviation based grinding processing method.

[0015] The fourth aspect of the embodiments of the present application further provides a computer readable storage medium, wherein the computer readable storage medium stores a grinding workpiece surface deviation based grinding processing program, and the grinding workpiece surface deviation based grinding processing program, when executed by a processor, implements the steps of the grinding workpiece surface deviation based grinding processing method.

[0016] Beneficial effects: the present application provides a grinding workpiece surface deviation based grinding processing method, system, terminal and medium, the present application analyzes the topographic map of the test piece under different grinding agents, determines the influence of the relationship between the hardness of the grinding agent abrasive particles and the hardness of the workpiece on the surface deviation of the grinding workpiece, adjusts the matching relationship between the hardness of the grinding agent particles and the hardness of the workpiece based on the hardness relationship, realizes the adjustment of the surface deviation parameters of the target workpiece, and further improves the grinding effect of the workpiece. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0018] Figure 1 Flow chart of the preferred embodiment of the grinding workpiece surface deviation based grinding processing method of the present application; Figure 2 Surface topographic map of YN10 hard alloy after white corundum grinding in the grinding workpiece surface deviation based grinding processing method of the present application; Figure 3 Surface topographic map of YN10 hard alloy after green carbon grinding in the grinding workpiece surface deviation based grinding processing method of the present application; Figure 4 Surface topographic map of YN10 hard alloy after 10 μm diamond grinding in the grinding workpiece surface deviation based grinding processing method of the present application; Figure 5 Surface topographic map of YN10 hard alloy after 4 μm diamond grinding in the grinding workpiece surface deviation based grinding processing method of the present application; Figure 6Ssk histogram of white corundum grinding YN10 hard alloy in the grinding processing method based on the surface skewness of the grinding workpiece of the application; Figure 7 Ssk histogram of green carbon grinding YN10 in the grinding processing method based on the surface skewness of the grinding workpiece of the application; Figure 8 Ssk histogram of different particle size diamond grinding YN10 hard alloy in the grinding processing method based on the surface skewness of the grinding workpiece of the application; Figure 9 Surface morphology diagram of white corundum grinding tin bronze in the grinding processing method based on the surface skewness of the grinding workpiece of the application; Figure 10 Ssk histogram of white corundum grinding tin bronze in the grinding processing method based on the surface skewness of the grinding workpiece of the application; Figure 11 Two-dimensional surface morphology diagram of green carbon grinding tin bronze in the grinding processing method based on the surface skewness of the grinding workpiece of the application; Figure 12 Ssk histogram of green carbon grinding tin bronze in the grinding processing method based on the surface skewness of the grinding workpiece of the application; Figure 13 Surface morphology diagram of 10 μm diamond grinding tin bronze in the grinding processing method based on the surface skewness of the grinding workpiece of the application; Figure 14 Surface morphology diagram of 4 μm diamond grinding tin bronze in the grinding processing method based on the surface skewness of the grinding workpiece of the application; Figure 15 Ssk histogram of different particle size diamond grinding tin bronze in the grinding processing method based on the surface skewness of the grinding workpiece of the application; Figure 16 It is a structure diagram of a preferred embodiment of the grinding processing system based on the surface skewness of the grinding workpiece of the application; Figure 17 It is a structure diagram of a preferred embodiment of the terminal of the application.

[0019] Explanation of reference signs: 100, topography information acquisition module; 200, skewness calculation module; 300, hardness relationship and skewness association module; 400, grinding agent determination module. DETAILED DESCRIPTION

[0020] For the purpose, technical solutions and effects of the present application to be clearer, more explicit, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. The described embodiments are only possible technical implementations of the present application, not all possible implementations. Based on the embodiments in the present application, those skilled in the art can certainly combine the embodiments of the present application to obtain other embodiments without creative labor, and these embodiments are also within the protection scope of the present application.

[0021] Firstly, the terms involved in the embodiments of the present application are introduced: YN10 hard alloy (WC-Ni): tungsten carbide-nickel-based hard alloy (WC-Ni is a tungsten carbide-nickel-based composite material); Tin bronze (CuSn 12 Ni2): copper-based alloy containing 12% tin and 2% nickel (standard bronze grade); White corundum (Al2O3): alumina-based abrasive; Green carbon (SiC): silicon carbide-based abrasive; Diamond: artificial diamond abrasive.

[0022] In the related art, the quality of the ground surface is usually characterized by using surface topography parameters. The surface topography parameters are usually represented by roughness parameters, and the most known and widely used roughness parameter is the arithmetic mean deviation Ra. However, it cannot completely describe the contact surface, because completely different surfaces can have similar or even identical average surface roughness values, and vice versa. If the parameter is evaluated on a three-dimensional surface, the parameter is denoted by a capital letter S. The research results of three-dimensional surface topography characterization and parameters have formed international standards, which are mainly divided into height parameters, spatial parameters, mixed parameters, material ratio functions and related parameters, layered surface parameters, area material probability parameters, volume parameters, multi-scale geometric parameters and functions. The three-dimensional surface topography parameters related to the quality of the ground surface mainly include the arithmetic mean height Sa, the root mean square deviation of surface height Sq, the kurtosis of surface height distribution Sku, and the skewness of surface height distribution Ssk. The arithmetic mean height Sa of the surface represents the average value of the absolute value of the surface height in the sampling area, which is used to describe the overall roughness of the surface. The root mean square deviation of surface height Sq represents the root mean square value of the surface height in the sampling area, which reflects the dispersion degree of the surface height. The kurtosis of surface height distribution Sku is used to describe the sharpness of the surface height distribution. The skewness of surface height distribution Ssk is used to describe the asymmetry of the surface height distribution, which is sensitive to occasional deep valleys or high peaks. Zero skewness reflects a symmetric height distribution, while positive and negative skewness describes surfaces with high peaks and filled valleys, and surfaces with deep grooves and lack of peaks.

[0023] A large number of studies have been conducted to explore the influence of roughness on the tribological properties and fatigue life of contact surfaces. At present, many studies on surface topography focus on the Ra (surface arithmetic average roughness parameter, which is the average of the absolute values of the height values relative to the surface centerline) and Rq (surface root mean square roughness parameter, which is the average of the square roots of the sum of the squares of the height values relative to the surface centerline) of the lapped surface formed by lapping, and emphasize the influence of these parameters on the performance of various equipment. However, the skewness of the lapped surface height distribution cannot be ignored, as it also has a certain degree of influence on the performance of various mechanical equipment. Further research and development in this area are needed. Some researchers have studied the influence of surface roughness parameters on mixed lubrication characteristics through modeling and found that skewness and kurtosis have a great influence on the contact parameters of mixed lubrication. Some researchers have studied the influence of skewness and kurtosis of Gaussian distributed surfaces on static friction coefficient under different roughness conditions. Based on this, some researchers have set the same root mean square value to observe and analyze the correlation between skewness, kurtosis and surface dynamic friction coefficient, and have clarified the influence of height distribution parameters on surface friction performance, revealing that the standard roughness parameters Sa and Sq are not sufficient to fully describe the tribological properties of contact surfaces, and that the skewness and kurtosis parameters have a stronger correlation with friction performance. Surfaces with high Sku values and negative Ssk values tend to reduce friction under dry friction and lubrication conditions. To reveal the mapping relationship between height statistical distribution parameters and friction and wear performance, some researchers have studied the correlation between height distribution parameters and surface bearing area ratio, established a relationship between bearing area ratio and friction coefficient in dry friction and lubrication friction, and explained the influence mechanism of height distribution parameters on friction and wear. In terms of the correlation analysis between contact performance and roughness, some researchers have analyzed the influence of roughness parameters on contact performance using statistical correlation theory, neural networks and sensitivity analysis methods.

[0024] Current research generally believes that lapping is a material removal process, which usually produces a negative skewness surface. In the early lapping test, it was found that the machined surface has a stable and reproducible positive skewness parameter. In order to explore the causes of this phenomenon, green carbon, white corundum and diamond were used as three kinds of lapping agents to carry out lapping tests on WC-Ni (YN10) hard alloy and tin bronze (CuSn 12 Ni2). The surface topography, composition changes of the workpieces after lapping were characterized by white light interferometry, scanning electron microscopy and energy dispersive spectroscopy, and the relative relationship between the lapping agent and the workpiece hardness was revealed as the key to this phenomenon.

[0025] In view of the problem of poor workpiece grinding effect when different grinding agents are selected for grinding processing of different grinding workpieces, the application determines the influence of the relationship between the hardness of the grinding agent particles (grains) and the hardness of the workpiece on the surface skewness of the grinding workpiece by analyzing the morphology of the test piece (grinding workpiece) under different grinding agents, so as to adjust the matching relationship between the hardness of the grinding agent particles and the hardness of the workpiece based on the hardness relationship, realize the adjustment of the surface skewness parameter of the target workpiece, and further improve the workpiece grinding effect. The application explores the causes of the stable and reproducible positive skewness parameter on the grinding processing surface, provides a theoretical basis for the optimization of the grinding process, so as to better control the surface quality of the grinding processing, and improve the mechanical equipment contact mechanics performance and tribology performance.

[0026] The application selects three materials with different properties, namely white corundum, green carbon and diamond, as grinding agents, and prepares them into grinding liquids, which are applied to the grinding processing of two typical engineering materials, YN10 hard alloy (WC-Ni) (first workpiece) and tin bronze (CuSn12Ni2) (second workpiece). The surface morphology and composition change of the workpiece after grinding are characterized by means of white light interference morphology instrument, scanning electron microscope (SEM, Scanning Electron Microscope) and energy dispersive spectrometer (EDS, Energy Dispersive X-ray Spectroscopy).

[0027] The surface hardness relationship is known as: diamond > YN10 > green carbon > white corundum > tin bronze. The experimental results show that in the process of grinding YN10 hard alloy by using white corundum grinding liquid (first grinding agent) and green carbon grinding liquid (first grinding agent), the skewness parameter of the processed surface is stable and positive, and this phenomenon has good repeatability. In contrast, when diamond grinding liquid (second grinding agent) is used for grinding YN10 hard alloy, or the above three kinds of grinding liquids are used for grinding tin bronze, the skewness parameter of the obtained processed surface is negative. Other surface morphology parameters, such as arithmetic mean height (Sa) and root mean square deviation (Sq), have a weak negative correlation with the hardness of the grinding agent, and the SEM and EDS results of the processed surfaces further verify the influence of relative hardness on the generation of positive / negative skew surfaces. That is, the relative relationship between the hardness of the grinding agent and the hardness of the workpiece is the key to the generation of positive / negative skew surfaces. That is, when the hardness of the grinding agent is lower than the hardness of the workpiece, the grinding surface skewness tends to be positive; otherwise, it is more likely to produce a negative skew surface.

[0028] The technical solutions of the application will be described in detail below with specific examples. The following specific examples can be combined with each other, and the same or similar concepts or processes may not be described in detail in some examples.

[0029] The grinding processing method based on the surface skewness of the grinding workpiece provided by the preferred embodiment of the application comprises the following steps, as shown in Figure 1 The grinding processing method based on the surface skewness of the grinding workpiece provided by the preferred embodiment of the application comprises the following steps, as shown in In step S101, the topography information of the grinding workpiece under different abrasives is obtained.

[0030] Specifically, before the surface topography measurement process, the grinding test of the grinding workpiece is performed. The test material of the application is selected to be YN10 hard alloy (WC-Ni, φ30 mm*10 mm) and tin bronze (CuSn 12 Ni2, φ30 mm*10 mm). The grinding test adopts three kinds of grinding liquid, which are white corundum grinding liquid (second abrasive), green silicon carbide grinding liquid (first abrasive) and diamond grinding liquid. The white corundum grinding liquid (second abrasive) is prepared by white corundum and grinding oil, and the green silicon carbide grinding liquid (first abrasive) is prepared by green carbon and grinding oil. It can be known from the enlarged image that there is no significant difference in the shape of the particles of various grinding liquids.

[0031] The grinding machine used in this test belongs to a free abrasive processing equipment. In the grinding processing process, with the addition, flow of the grinding liquid and the relative movement between the test piece and the grinding tool, the free abrasive in the grinding liquid is guided into the processing area to grind the surface of the test piece under the load of the weight above the test piece, and then the free abrasive and debris are discharged with the grinding liquid.

[0032] The surface mechanical grinding treatment is performed on the YN10 hard alloy sample (grinding workpiece, first workpiece) with a diameter of φ30 mm and a thickness of 10 mm and the tin bronze sample on the grinding machine. The grinding treatment time is 20 min, 3 sets of repeated tests are performed for each kind of grinding liquid, the load is 3 kg, the rotating speed is 20 r / min, and the dropping speed of the peristaltic pump for dropping the grinding liquid is 3.00 mL / min. After the mechanical grinding is completed, the surface mechanical grinding test piece is cleaned in the ultrasonic cleaning machine for 10 min with anhydrous ethanol as the cleaning agent, and the surface topography measurement of the surface mechanical grinding test piece is completed by using the white light interference topography instrument after the cleaning is completed.

[0033] The application determines the influence of the relationship between the hardness of the grinding workpiece and the abrasive grain hardness of the abrasive on the processed surface Ssk, so as to select the abrasive according to the determined hardness relationship.

[0034] In one possible implementation, the topography information includes a first surface topography image and a second surface topography image. The first surface topography image of the grinding workpiece under the first abrasive is obtained; the second surface topography image of the grinding workpiece under the second abrasive is obtained; wherein the abrasive grain hardness of the first abrasive is less than the hardness of the grinding workpiece, and the abrasive grain hardness of the second abrasive is greater than the hardness of the grinding workpiece.

[0035] It can be understood that the first abrasive is one of white corundum abrasive or green carbon abrasive, or both can be used to grind the workpiece.

[0036] Specifically, in the process of processing the grinding workpiece with the first abrasive (white corundum abrasive), in order to improve the accuracy and reliability of data analysis, threshold filtering processing is performed on the surface height data, and the abnormal values in the descending order of height distribution are removed. The first 0.005%. This operation aims to eliminate the noise interference caused by a small number of abnormal peaks, so as to more accurately characterize the true characteristics of the surface topography. The original image will produce NM points during measurement. NM points (i.e. Non Measured Points) refer to non-measured points, which can also be called data points or missing points. These points refer to positions that cannot obtain effective measurement data due to various reasons during data acquisition. NM points are usually used to represent blank, invalid area or area beyond the measurement range of the device. The NM points are filled by using smooth interpolation, that is, the missing data is filled by fitting adjacent points. The processed surface topography is shown in Figure 2 , Figure 2 The surface topography of YN10 hard alloy (grinding workpiece) after white corundum grinding is shown, and the color gradient reflects the height distribution at different positions, Figure 2 (a) of FIG. 8 shows a three-dimensional topography, Figure 2 (b) of FIG. 8 shows a two-dimensional topography.

[0037] In the process of processing the grinding workpiece with another first abrasive (green carbon abrasive), see Figure 3 , Figure 3 The surface topography of YN10 hard alloy after green carbon grinding is shown, and the color gradient represents different height values. The surface data is processed similarly as mentioned above, threshold filtering processing is performed, and the NM points are removed, Figure 3 (a) of FIG. 9 shows a three-dimensional topography, Figure 3 (b) of FIG. 9 shows a two-dimensional topography.

[0038] In the process of processing the grinding workpiece with the second abrasive (green carbon abrasive), see Figure 4 and Figure 5 , Figure 4 The surface topography of YN10 hard alloy after 10μm diamond grinding is shown, and the color gradient represents different height values, Figure 5 The surface topography of YN10 hard alloy after 4μm diamond grinding is shown, and the color gradient represents different height values, Figure 4 (a) of FIG. 10 shows a three-dimensional topography, Figure 4 (b) of FIG. 10 shows a two-dimensional topography, Figure 5 (a) of FIG. 11 shows a three-dimensional topography, Figure 5In the diagram, (b) represents a two-dimensional topographic image. The surface data processing is similar to that mentioned earlier, with threshold filtering and removal of NM points.

[0039] It should be noted that this application conducted three sets of experiments, using white corundum, green carbon, and diamond to grind YN10 cemented carbide respectively, and set up a control group experiment, which used white corundum, green carbon, and diamond to grind tin bronze. Each experiment was conducted three times.

[0040] In one possible implementation, first point cloud data of the workpiece being ground under a first abrasive is acquired, and the first point cloud data is filtered to obtain first intervention data; the first intervention data is filled in to obtain first spatial reconstruction data; and a first surface morphology image is generated based on the first spatial reconstruction data. Second point cloud data of the workpiece being ground under a second abrasive is acquired, and the second point cloud data is filtered to obtain second intervention data; the second intervention data is filled in to obtain second spatial reconstruction data; and a second surface morphology image is generated based on the second spatial reconstruction data.

[0041] Specifically, the workpiece surface is scanned using a white-light interferometric profilometer to acquire 3D point cloud data containing X / Y position coordinates and Z height values. A color gradient is then mapped to the height distribution. Noise is then removed, and the height data is sorted in descending order, discarding the top 0.005% of extreme high-value points. Missing values ​​are then filled in, and the processed height data is mapped to a color gradient, visually displaying the surface peak and valley distribution.

[0042] In step S102, the morphology information is processed to obtain the surface deviation information of the grinding workpiece.

[0043] In one possible implementation, the surface deflection information includes first surface deflection data and second surface deflection data. Based on the first surface topography image, the first surface deflection data of the workpiece under a first abrasive is obtained; based on the second surface topography image, the second surface deflection data of the workpiece under a second abrasive is obtained.

[0044] Understandably, the first surface morphology image includes morphology images at different grinding times.

[0045] Specifically, regarding the machining of YN10 cemented carbide with white fused alumina abrasives, see [link to relevant documentation]. Figure 6 The horizontal axis represents grinding time, and the vertical axis represents the Ssk value. Nine sample points were tested for each grinding time. Figure 6 The bar chart for each color represents the results of nine repeated tests. From... Figure 6As can be seen, after grinding YN10 cemented carbide with white fused alumina slurry, the machined surface generally exhibits positive bias characteristics, and the Ssk value does not change significantly with the extension of grinding time. Given that the hardness of white fused alumina abrasive particles is lower than that of YN10 cemented carbide, it can be concluded that when YN10 cemented carbide is ground with a slurry with a lower hardness than YN10 cemented carbide, the machined surface will exhibit positive bias characteristics.

[0046] For the machining of YN10 cemented carbide with green carbon abrasives, see [link to relevant documentation]. Figure 7 The horizontal axis represents grinding time, and the vertical axis represents the Ssk value. Nine sample points were tested for each grinding time. Figure 7 The bar chart for each color represents the results of nine repeated tests. From... Figure 7 As can be seen, after grinding YN10 cemented carbide with green carbon polishing slurry, the machined surface generally exhibits positive bias characteristics, and the Ssk value does not change significantly with the extension of polishing time. Given that the hardness of green carbon is lower than that of YN10 cemented carbide, this further verifies that when YN10 cemented carbide is ground with polishing slurry with a lower hardness than YN10 cemented carbide, the machined surface will exhibit positive bias characteristics.

[0047] For the machining of YN10 cemented carbide with diamond abrasives, see [link to relevant documentation]. Figure 8 , Figure 8 (a) in the figure is a bar chart of diamond particles with a size of 10 μm. Figure 8 (b) in the figure is a bar chart showing the diamond particle size of 4 μm. The horizontal axis represents grinding time, and the vertical axis represents the Ssk value. As can be seen from the figure, after grinding YN10 cemented carbide with diamond polishing slurry, the machined surface generally exhibits negative bias characteristics. When grinding with 10 μm diamond, the negative bias effect of Ssk value increases with increasing grinding time. When grinding with 4 μm diamond, the negative bias effect of Ssk value decreases slightly with increasing grinding time.

[0048] Given that diamond abrasive particles have a higher hardness than YN10 cemented carbide, it can be concluded that grinding YN10 cemented carbide with a slurry that has a higher hardness than YN10 cemented carbide will result in a negative bias on the machined surface.

[0049] Table 1: Positive and negative values ​​of average deflection when grinding YN10 cemented carbide with three different grinding slurries

[0050] according to Figure 6 to Figure 8From the analysis of Table 1, it can be seen that different types of grinding fluid can significantly affect the positive and negative changes of the Ssk value of the processed surface. It is preliminarily concluded that when the hardness of the grinding fluid is higher than that of the processed material YN10 hard alloy, the surface topography after processing tends to have a negative bias feature. This means that when a harder grinding fluid acts on a softer material, the pit structure in the surface topography dominates. This conclusion is highly consistent with the results of intuitive physical analysis, and can be reasonably explained by the material removal and deformation mechanism.

[0051] From the mechanism point of view, when the hardness of the grinding fluid is significantly higher than that of the processed material, the local contact stress generated in the contact process is high. Because the harder grinding fluid particles have a larger elastic modulus, the impact and cutting effect on the material surface is stronger, and the processed material will have a large plastic deformation or even micro cutting removal in the local area. This processing method is easy to form deep concave structures on the surface, resulting in a negative Ssk value of the surface topography. This negative bias feature indicates that the surface is mainly dominated by pits, and the protruding area is relatively small.

[0052] In addition, this phenomenon can also be explained in combination with the abrasive wear theory. In the grinding process, the harder grinding fluid particles have stronger removal ability due to their higher hardness and strength, so that the processed surface is mainly removed by plastic flow and shear of the material, and less uniform grinding smoothing effect is generated. The relatively soft material is more likely to form local concave areas under the action of high stress, which is consistent with the negative Ssk characteristic in the experimental results.

[0053] In a possible implementation, the grinding workpiece is a first workpiece. A third surface topography image of a second workpiece ground by a first grinding agent is obtained; a fourth surface topography image of the second workpiece ground by a second grinding agent is obtained; wherein the hardness of abrasive particles of the first grinding agent is greater than the hardness of the first workpiece, the hardness of the first workpiece is greater than the hardness of abrasive particles of the second grinding agent, and the hardness of abrasive particles of the second grinding agent is greater than the hardness of the second workpiece.

[0054] Specifically, in order to avoid the particularity of YN10 hard alloy material, a similar grinding experiment is performed using tin bronze.

[0055] Figure 9 The surface topography of tin bronze (second workpiece) after white corundum grinding is shown, and the color gradient represents different height values. The surface data is processed as mentioned above, and the NM points are removed after threshold filtering. Figure 9 In (a) of FIG. 9, a three-dimensional topography is shown, and in (b) of FIG. 9, a two-dimensional topography is shown. Figure 10 In FIG. 10, the abscissa represents the grinding time, and the ordinate represents the Ssk value. Six sample points are tested under each grinding time, so Figure 10The columnar data corresponding to each color represents the results of 6 repeated tests. From Figure 10 It can be seen from the figure that after tin bronze is polished using white corundum polishing liquid, the machined surface generally exhibits negative skewness characteristics, and the Ssk value does not change significantly as the polishing time is prolonged. Since the hardness of white corundum polishing particles is higher than that of tin bronze, it is proved that polishing tin bronze with a polishing liquid whose hardness is higher than that of tin bronze will cause the machined surface to exhibit negative skewness.

[0056] Figure 11 The surface morphology of tin bronze after green carbon polishing is shown, and the color gradient represents different height values. The surface data is processed similarly as mentioned above, threshold filtering is performed, and NM points are removed. Figure 12 In the figure, the horizontal coordinate represents the polishing time, and the vertical coordinate represents the Ssk value. Six sample points are tested under each polishing time, so Figure 12 The columnar data corresponding to each color represents the results of 6 repeated tests. From Figure 12 It can be seen from the figure that after tin bronze is polished using green carbon polishing liquid, the machined surface generally exhibits negative skewness characteristics, and the Ssk value does not change significantly as the polishing time is prolonged. Since the hardness of green carbon polishing particles is higher than that of tin bronze, it is proved that polishing tin bronze with a polishing liquid whose hardness is higher than that of tin bronze will cause the machined surface to exhibit negative skewness.

[0057] Figure 13 and Figure 14 The surface morphology of tin bronze after diamond polishing is shown, and the color gradient represents different height values, Figure 13 In the figure, the particle size of diamond is 10 μm, Figure 14 In the figure, the particle size of diamond is 4 μm. The surface data is processed similarly as mentioned above, threshold filtering is performed, and NM points are removed. Figure 15 In the figure, (a) is the Ssk columnar graph of tin bronze polished by diamond 10 μm particles, Figure 15 In the figure, (b) is the Ssk columnar graph of tin bronze polished by diamond 4 μm particles; the horizontal coordinate represents the polishing time, and the vertical coordinate represents the Ssk value. Six sample points are tested under each polishing time, so Figure 15 The columnar data corresponding to each color represents the results of 6 repeated tests. From Figure 15 It can be seen from the figure that after tin bronze is polished using diamond polishing liquid, the machined surface generally exhibits negative skewness characteristics, and the Ssk value does not change significantly as the polishing time is prolonged. Since the hardness of diamond polishing particles is higher than that of tin bronze, it is proved that polishing tin bronze with a polishing liquid whose hardness is higher than that of tin bronze will cause the machined surface to exhibit negative skewness.

[0058] The hardness of green carbon, white corundum and diamond is greater than that of tin bronze, and the machined surface of the tin bronze obtained by using the grinding fluid with green carbon, white corundum or diamond as the abrasive agent presents a negative skewness characteristic.

[0059] In step S103, according to the surface skewness information, associated information affecting the surface skewness of the ground workpiece is obtained, wherein the associated information is the relationship between the hardness of the workpiece and the hardness of the abrasive particles.

[0060] In a possible implementation, it is determined according to the first surface skewness data that the surface skewness of the ground workpiece is a positive skewness characteristic, it is determined according to the second surface skewness data that the surface skewness of the ground workpiece is a negative skewness characteristic, and according to the positive skewness characteristic, the negative skewness characteristic and the hardness relationship of the first abrasive agent, the second abrasive agent and the ground workpiece, the associated information affecting the surface skewness of the ground workpiece is obtained.

[0061] It is worth noting that in tribology, the negative skewness of the abrasive part means that the pits of the surface topography are dominant, and such surface topography can improve the lubrication performance, improve the sealing performance, improve the wear resistance and have important influence in many aspects. It is observed through experiments that the relative relationship between the hardness of the abrasive agent and the hardness of the workpiece is the key to produce positive / negative skewness surface. That is, when the hardness of the abrasive agent is lower than the hardness of the workpiece, the grinding surface skewness tends to be positive; otherwise, it is more likely to produce a negative skewness surface. The scheme of the present application is based on the theory of tribology, uses the control variable experiment method, strictly controls the factors such as the drop speed of the grinding fluid, the grinding load and the time, only changes the relative hardness, uses the white light interferometer to obtain data, and the results are real and reliable and can be repeated. The present application fills the research blank in the field, verifies the importance of hardness matching in the selection of grinding fluid, and also provides a theoretical basis for the optimization of grinding process.

[0062] In step S104, according to the associated information, a target abrasive agent corresponding to a target workpiece is determined, so as to grind and process the target workpiece by using the target abrasive agent.

[0063] In a possible implementation, the hardness of the target workpiece is obtained, and the target abrasive agent is determined from a plurality of to-be-selected abrasive agents according to the hardness of the workpiece, wherein the hardness of abrasive particles of the target abrasive agent is less than the hardness of the workpiece.

[0064] Specifically, in actual processing, in order to obtain a specific surface topography feature (such as positive skewness or negative skewness), precise control can be realized by adjusting the matching relationship between the hardness of the grinding fluid and the hardness of the processed material. For example, in order to realize a negative skewness surface, an abrasive medium with a hardness significantly higher than that of the workpiece material can be preferentially selected. Such targeted selection will help to improve the processing efficiency and optimize the surface topography quality.

[0065] Secondly, the grinding processing system based on surface skewness of a grinding workpiece is described with reference to the accompanying drawings according to the embodiments of the present application, which is applied to the grinding processing method based on surface skewness of a grinding workpiece in any of the above-mentioned solutions.

[0066] Figure 16 is a structural diagram of the grinding processing system based on surface skewness of a grinding workpiece according to the embodiments of the present application.

[0067] As shown in Figure 16 , the grinding processing system based on surface skewness of a grinding workpiece includes a topography information acquisition module 100, a skewness calculation module 200, a hardness relationship and skewness correlation module 300, and a grinding agent determination module 400.

[0068] Specifically, the topography information acquisition module 100 is configured to acquire topography information of a grinding workpiece under different grinding agents; The skewness calculation module 200 is configured to process the topography information to obtain surface skewness information of the grinding workpiece; The hardness relationship and skewness correlation module 300 is configured to obtain correlation information affecting the surface skewness of the grinding workpiece according to the surface skewness information, wherein the correlation information is a relationship between workpiece hardness and grinding agent abrasive hardness; The grinding agent determination module 400 is configured to determine a target grinding agent corresponding to a target workpiece according to the correlation information, so as to adopt the target grinding agent to perform grinding processing on the target workpiece.

[0069] Figure 17 is a structural diagram of a terminal provided by the embodiments of the present application. The terminal can include: a memory 501, a processor 502, and a computer program stored in the memory 501 and executable on the processor 502.

[0070] The processor 502 implements the grinding processing method based on surface skewness of a grinding workpiece provided in the above-mentioned embodiments when executing the program.

[0071] Further, the terminal further includes: a communication interface 503 for communication between the memory 501 and the processor 502.

[0072] The memory 501 is configured to store the computer program executable on the processor 502.

[0073] The memory 501 can include a high-speed RAM memory, and can also include a non-volatile memory, such as at least one disk memory.

[0074] If the memory 501, the processor 502 and the communication interface 503 are implemented independently, the communication interface 503, the memory 501 and the processor 502 can be connected with each other through a bus and complete communication between each other. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For convenience of representation, Figure 17 Only one thick line is used to represent the bus in the figure, but it does not mean that there is only one bus or only one type of bus.

[0075] Optionally, in a specific implementation, if the memory 501, the processor 502 and the communication interface 503 are integrated on a chip, the memory 501, the processor 502 and the communication interface 503 can complete communication between each other through an internal interface.

[0076] The processor 502 can be a Central Processing Unit (CPU), or an Application Specific Integrated Circuit (ASIC), or one or more integrated circuits configured to implement one or more embodiments of the present application.

[0077] The embodiment also provides a computer readable storage medium, which stores a computer program, and the program is executed by a processor to implement the above-mentioned grinding processing method based on surface eccentricity of a grinding workpiece.

[0078] One embodiment of the present application provides a computer program product, which includes a computer program, and the computer program is executed by a processor to implement the above-mentioned grinding processing method based on surface eccentricity of a grinding workpiece. Figure 1 The above-mentioned grinding processing method based on surface eccentricity of a grinding workpiece is implemented by the processor.

[0079] In the description of the application, reference to "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" means that a particular feature, structure, material, or characteristic being described is included in at least one embodiment or example of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment or example. Furthermore, the described specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples. In addition, the usage of "N" means at least two, for example, two, three or the like, unless explicitly stated otherwise.

[0080] Furthermore, the terms "first", "second", or the like, are used merely as a designation of certain elements or features of the application, and do not imply or connote relative importance or a specific order of precedence. Thus, features defined with "first", "second", etc. can include at least one of the features, either explicitly or implicitly.

[0081] Any process or method descriptions or blocks in flow charts or otherwise described herein represent embodiments which can be managed as one or more modules, segments, or portions of code which include one or more executable instructions for implementing specific logic functions or steps, and alternate implementations are possible. In some embodiments, the processes and methods described can be executably encoded on a machine- readable medium in a data signal embodied in an electromagnetic signal, a wireless signal, or a propagated signal.

[0082] The logic and / or steps represented in flow diagrams or otherwise described herein, for example, can be considered as a sequence of instructions to implement logic functions, and can be embodied in any computer-readable storage medium for use by an instruction execution system, apparatus, or device, such as a computer-based system, processor- containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. In the context of this specification, a "computer-readable storage medium" can be any means that can contain, store, communicate, propagate or transport the program for use by or in connection with the instruction execution system, apparatus, or device. The computer-readable storage medium can be a computer- readable storage medium that can be any media that can be used to store the desired program instructions in a form readable by a computer. More specific examples (a non-exhaustive list) of the computer-readable storage medium include the following: an electrical connection having one or more wires (electrical, optical, and / or other communications medium), a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, and a portable compact disc read-only memory (CD-ROM). In addition, the computer-readable storage medium can even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via, for example, optical scanning of the paper or other medium, then compiled, interpreted, or otherwise processed in a suitable manner, if necessary, and then stored in a computer memory.

[0083] It should be understood that aspects of the application can be implemented in hardware, software, firmware or combinations thereof. In the above embodiments, the N steps or methods can be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system. As such, if implemented in hardware, and in another embodiment, any of the following technologies, known in the art, or their combinations can be used: discrete logic circuitry having logic gates for implementing logic functions on data signals, application specific integrated circuits having appropriate combinational logic gates, programmable gate arrays (PGA), field programmable gate arrays (FPGA), etc.

[0084] Those of skill in the art will understand that the steps carried out by the above-mentioned embodiments of the method can be implemented by programs instructing the relevant hardware, and the programs can be stored in a computer-readable storage medium. When the programs are executed, they include one or a combination of the steps of the method embodiments.

[0085] In addition, each of the function units in each of the embodiments of the present application can be integrated in one processing module, or each unit can be physically present separately, or two or more units can be integrated in one module. The integrated module can be realized in the form of hardware or in the form of a software function module. When the integrated module is realized in the form of a software function module and sold or used as an independent product, it can also be stored in a computer readable storage medium.

[0086] The storage medium mentioned above can be a read-only memory, a magnetic disk or an optical disk, etc. Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

[0087] It should be understood that the application of the present application is not limited to the above examples, and those skilled in the art can improve or change the above examples according to the above description, and all these improvements and changes should belong to the protection scope of the claims attached to the present application.

[0088] Finally, it should be pointed out that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the above embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A polishing method for polishing a surface of a workpiece based on a degree of skewness of the surface, characterized by, The grinding processing method based on the surface deviation of the grinding workpiece comprises the following steps: Obtaining the surface topography information of the grinding workpiece under different grinding agents; Processing the surface topography information to obtain the surface deviation information of the grinding workpiece; According to the surface deviation information, the correlation information affecting the surface deviation of the grinding workpiece is obtained, wherein the correlation information is the relationship between the hardness of the workpiece and the hardness of the grinding agent; According to the correlation information, the target grinding agent corresponding to the target workpiece is determined, so as to adopt the target grinding agent to grind the target workpiece.

2. The polishing method according to claim 1, wherein The surface topography information comprises a first surface topography image and a second surface topography image; The surface topography information of the grinding workpiece under different grinding agents comprises the following steps: Obtaining the first surface topography image of the grinding workpiece under the first grinding agent; Obtaining the second surface topography image of the grinding workpiece under the second grinding agent; The hardness of the abrasive particles of the first grinding agent is smaller than the hardness of the grinding workpiece, and the hardness of the abrasive particles of the second grinding agent is greater than the hardness of the grinding workpiece.

3. The method according to claim 2, wherein The grinding workpiece is a first workpiece; After obtaining the surface topography information of the grinding workpiece under different grinding agents, the following steps are further included: Obtaining the third surface topography image of the second workpiece under the first grinding agent; Obtaining the fourth surface topography image of the second workpiece under the second grinding agent; The hardness of the abrasive particles of the first grinding agent is greater than the hardness of the first workpiece, the hardness of the first workpiece is greater than the hardness of the abrasive particles of the second grinding agent, and the hardness of the abrasive particles of the second grinding agent is greater than the hardness of the second workpiece.

4. The method of claim 2, wherein the surface of the workpiece is ground to a degree of curvature. The first surface topography image of the grinding workpiece under the first grinding agent comprises the following steps: Obtaining the first point cloud data of the grinding workpiece under the first grinding agent, and performing filtering processing on the first point cloud data to obtain first intervention data; Performing filling processing on the first intervention data to obtain first spatial reconstruction data; Generating the first surface topography image according to the first spatial reconstruction data; The second surface topography image of the grinding workpiece under the second grinding agent comprises the following steps: Obtaining the second point cloud data of the grinding workpiece under the second grinding agent, and performing filtering processing on the second point cloud data to obtain second intervention data; Performing filling processing on the second intervention data to obtain second spatial reconstruction data; Generating the second surface topography image according to the second spatial reconstruction data.

5. The method of claim 3, wherein the surface of the workpiece is ground to a degree of curvature. The surface deviation information comprises first surface deviation data and second surface deviation data; The surface topography information is processed to obtain the surface deviation information of the grinding workpiece, and specifically comprises the following steps: According to the first surface topography image, the first surface deviation data of the grinding workpiece under the first grinding agent is obtained; According to the second surface topography image, the second surface deviation data of the grinding workpiece under the second grinding agent is obtained.

6. The method of claim 5, wherein the surface of the workpiece is ground to a degree of curvature. According to the surface deviation information, the correlation information affecting the surface deviation of the grinding workpiece is obtained, and specifically comprises the following steps: According to the first surface deviation data, it is determined that the surface deviation of the grinding workpiece is a positive deviation characteristic; determining, according to the second surface skewness data, that the surface skewness of the grinding workpiece is a negative skewness characteristic; obtaining, according to the positive skewness characteristic, the negative skewness characteristic, and hardness relationships of the first grinding agent, the second grinding agent, and the grinding workpiece, correlation information that affects the surface skewness of the grinding workpiece.

7. The method of claim 6, wherein the surface of the workpiece is ground to a degree of curvature. The determining, according to the correlation information, of a target grinding agent corresponding to a target workpiece specifically includes: obtaining a workpiece hardness of the target workpiece; determining, according to the workpiece hardness, a target grinding agent from a plurality of candidate grinding agents, wherein a hardness of abrasive particles of the target grinding agent is less than the workpiece hardness.

8. A grinding system based on the surface deviation of a workpiece, characterized in that, The grinding processing system based on surface skewness of a grinding workpiece is applied to the grinding processing method based on surface skewness of a grinding workpiece in any one of claims 1-7. The grinding processing system based on surface skewness of a grinding workpiece includes: a topography information acquisition module configured to obtain topography information of the grinding workpiece under grinding by different grinding agents; a skewness calculation module configured to process the topography information to obtain surface skewness information of the grinding workpiece; a hardness relationship and skewness correlation module configured to obtain, according to the surface skewness information, correlation information that affects the surface skewness of the grinding workpiece, wherein the correlation information is a relationship between a workpiece hardness and a hardness of abrasive particles of a grinding agent; a grinding agent determination module configured to determine, according to the correlation information, a target grinding agent corresponding to a target workpiece, so as to grind the target workpiece by using the target grinding agent.

9. A terminal, characterized by comprising: The terminal includes a memory, a processor, and a grinding processing program based on surface skewness of a grinding workpiece stored on the memory and executable on the processor, and the grinding processing program based on surface skewness of a grinding workpiece, when executed by the processor, implements steps of the grinding processing method based on surface skewness of a grinding workpiece in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores a grinding processing program based on surface skewness of a grinding workpiece, and the grinding processing program based on surface skewness of a grinding workpiece, when executed by the processor, implements steps of the grinding processing method based on surface skewness of a grinding workpiece in any one of claims 1-7.

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