Large-stroke wafer cutting machine suitable for large-size wafer cutting

Abstract

The invention relates to the technical field of wafer cutting machines, in particular to a large-stroke wafer cutting machine suitable for large-size wafer cutting, which comprises a base and a stand column arranged on the base, a placing assembly is movably arranged on the base; the stand column is movably provided with a movable base. A lifting seat is movably arranged on the moving seat; a cutter assembly is rotationally arranged at the bottom of the lifting base. A driving plate is movably arranged on the lifting seat; the driving plate is provided with a trigger pin in a floating manner; the lifting seat is provided with a reset plate at the top of the driving plate; a reset spring is arranged between the reset plate and the driving plate; the movable seat is provided with an ejector rod; a driving barrel is rotationally arranged on the lifting seat; a driving groove is formed in the outer wall of the driving barrel. Through one-time up-and-down circulating action of the lifting base, reversing of the cutter assembly can be achieved; after the cutter assembly is reversed, the placing assembly drives the wafer to move reversely, and the cutter assembly can continue to cut the next cutting channel of the wafer in a reverse cutting mode without returning to the initial side in an idle stroke, so that the cutting efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer cutting machines, in particular to a large-stroke wafer cutting machine suitable for cutting large-size wafers. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafer cutting process plays a key role in ensuring the quality and performance of chips. In order to effectively reduce the cutting stress and avoid the edge collapse defect of wafer cutting path, the current wafer cutting machine mostly adopts the reverse cutting mode, that is, the rotating direction of the cutting tool is opposite to the moving direction of the wafer. This cutting strategy guarantees the cutting quality to a certain extent, but has a negative impact on the cutting efficiency.

[0003] After completing a cutting, the cutting tool needs to return to the starting side of wafer cutting with an idle stroke, so as to perform the next cutting. For small-size wafers, the movement stroke of the cutting tool is short, and the time consumed by the idle stroke is relatively small, so the overall cutting efficiency is acceptable. However, with the development of semiconductor technology, large-size wafers are increasingly widely used in production. The diameter of such wafers increases, and the idle stroke return distance of the cutting tool after cutting is significantly increased, the time consumed by each idle stroke is greatly increased, resulting in a sharp decline in overall cutting efficiency, which is difficult to meet the needs of large-scale and high-efficiency production.

[0004] At present, although some researches try to optimize the cutting path and improve the movement speed of the cutting tool to alleviate this problem, there is still no effective and systematic solution to the long idle stroke problem during the cutting of large-size wafers. This not only restricts the production capacity improvement of semiconductor manufacturing enterprises, but also increases the production cost, and new technologies or equipment need to be developed to break through this bottleneck and realize the efficient cutting of large-size wafers. SUMMARY

[0005] The purpose of the present application is to provide a large-stroke wafer cutting machine suitable for cutting large-size wafers to solve the above problems in the prior art.

[0006] The purpose of the present application is achieved by the following technical scheme: a large-stroke wafer cutting machine suitable for cutting large-size wafers, comprising a base and a column provided on the base; the base is movably provided with a placing assembly; The column is movably provided with a cutting mechanism; the cutting mechanism comprises a moving seat movably provided on the column; the moving seat is movably provided with a lifting seat; the bottom of the lifting seat is rotatably provided with a cutting tool assembly; the lifting seat is movably provided with a driving plate; the driving plate is movably provided with a trigger pin; the top of the driving plate is provided with a reset plate; a reset spring is arranged between the reset plate and the driving plate; the bottom of the moving seat is provided with a top rod for abutting against the driving plate; The lifting seat is rotationally provided with a driving barrel for driving the rotary cutting tool assembly; the outer wall of the driving barrel is provided with a driving groove; the trigger pin is movably arranged in the driving groove; the driving groove comprises a first vertical groove, a first spiral groove, a second vertical groove and a second spiral groove; the bottom of the first spiral groove is connected with the bottom of the first vertical groove; the top of the first spiral groove is connected with the top of the second vertical groove; the bottom of the second spiral groove is connected with the bottom of the second vertical groove; and the top of the second spiral groove is connected with the top of the first vertical groove.

[0007] The first spiral groove is further provided with a first inclined surface. The second spiral groove is further provided with a second inclined surface.

[0008] The cutting tool assembly comprises a cutting tool support rotationally arranged at the bottom of the lifting seat, a cutting tool motor arranged on the cutting tool support and a cutting knife arranged at the output end of the cutting tool motor.

[0009] The lifting seat is further provided with a guide groove along the height direction; and the driving plate is slidingly arranged in the guide groove.

[0010] The bottom of the lifting seat is further provided with a through hole; and the top rod abuts against the driving plate after penetrating through the through hole.

[0011] The trigger pin is arranged at one end of the driving plate close to the driving barrel; a trigger spring is arranged between the trigger pin and the driving plate; and the trigger pin is further provided with a clearance channel. The bottom of the moving seat is provided with a jacking seat; the jacking seat is movably arranged with a jacking plate; a spring sheet is arranged between the bottom of the jacking plate and the jacking seat; and the top rod is arranged on the jacking plate.

[0012] The driving plate is further provided with a locking cavity; the locking cavity is movably arranged with a locking block; one end of the locking block is provided with a locking pin; and the locking pin is movably arranged in the clearance channel.

[0013] One end of the locking block and the locking cavity are further provided with a first spring; the other end of the locking block is provided with a linkage rod; a second spring is arranged between the other end of the locking block and the linkage rod; and the linkage rod is rotationally arranged with a roller at the end away from the locking block. The jacking seat is provided with a track strip; and the top of the track strip is provided with a locking inclined surface for abutting against the roller.

[0014] The first vertical slot is provided with a first tapered locking slot matched with the locking pin at the top.

[0015] The vertical column is provided with an X-axis linear module for driving the moving seat to move along the X-axis direction. The placing assembly comprises a placing seat and a rotary table arranged on the placing seat.

[0016] The beneficial effects of the present application are as follows: the present application can realize the reversing of the cutter assembly through one up-down cycle of the lifting seat; after the reversing of the cutter assembly, the placing assembly drives the wafer to move reversely, and the cutter assembly can continue to cut the lower cutting path of the wafer in the reverse cutting mode without returning to the starting side through the idle stroke, thereby improving the cutting efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural schematic diagram of the present application; Figure 2 is a structural schematic diagram of the cutting mechanism of the present application; Figure 3 is a structural schematic diagram of the cutting mechanism of the present application from another perspective; Figure 4 is a sectional view of the cutting mechanism when the lifting seat of the present application rises; Figure 5 is a sectional view of the cutting mechanism when the lifting seat of the present application rises; Figure 4 is a local enlarged view of the A part in Figure 6 is a sectional view of the cutting mechanism when the lifting seat of the present application descends; Figure 7 is a local enlarged view of the B part in Figure 6 Figure 8 is a structural schematic diagram of the driving plate of the present application; Figure 9 is a structural schematic diagram of the driving plate of the present application from another perspective; Figure 10 is a structural schematic diagram of the driving barrel of the present application; Figure 11 is a structural schematic diagram of the driving barrel of the present application from another perspective; ​Wherein: 1, base; 11, placing seat; 12, rotary table; 13, Y-axis linear module; 2, column; 21, X-axis linear module; 22, Z-axis linear module; 3, moving seat; 31, jacking seat; 32, jacking plate; 33, top rod; 34, elastic sheet; 35, track bar; 36, locking slope; 4, lifting seat; 41, reset plate; 42, reset spring; 43, guide groove; 44, perforation; 5, drive plate; 51, locking cavity; 52, locking block; 53, locking pin; 54, first spring; 55, linkage rod; 56, second spring; 57, roller; 6, trigger pin; 61, trigger spring; 62, give way passage; 7, drive bucket; 71, first vertical groove; 72, first spiral groove; 73, second vertical groove; 74, second spiral groove; 75, first inclined surface; 76, second inclined surface; 77, first conical locking groove; 78, second conical locking groove; 8, cutter support; 81, cutter motor; 82, cutting knife. DETAILED DESCRIPTION

[0018] The application is further described in conjunction with the following examples.

[0019] From Figures 1 to 11 It can be known that the large-stroke wafer cutting machine suitable for cutting large-size wafers comprises a base 1 and a column 2 arranged on the base 1; the base 1 movably arranges a placing assembly; The column 2 movably arranges a cutting mechanism; the cutting mechanism comprises a moving seat 3 movably arranged on the column 2; the moving seat 3 movably arranges a lifting seat 4; the bottom of the lifting seat 4 rotatably arranges a cutter assembly; the lifting seat 4 movably arranges a drive plate 5; the drive plate 5 movably arranges a trigger pin 6; the lifting seat 4 arranges a reset plate 41 on the top of the drive plate 5; the reset plate 41 and the drive plate 5 are arranged with a reset spring 42; the bottom of the moving seat 3 arranges a top rod 33 used for abutting against the drive plate 5; The lifting seat 4 rotatably arranges a drive bucket 7 used for driving the cutter assembly to rotate; the outer wall of the drive bucket 7 arranges a drive groove; the trigger pin 6 movably arranges the drive groove; the drive groove comprises a first vertical groove 71, a first spiral groove 72, a second vertical groove 73 and a second spiral groove 74; the bottom of the first spiral groove 72 is connected with the bottom of the first vertical groove 71; the top of the first spiral groove 72 is connected with the top of the second vertical groove 73; the bottom of the second spiral groove 74 is connected with the bottom of the second vertical groove 73; the top of the second spiral groove 74 is connected with the top of the first vertical groove 71.

[0020] Specifically, the large-stroke wafer cutting machine suitable for cutting large-size wafers described in the embodiment is initially abutted against the bottom of the lifting seat 4 under the action of the reset spring 42, and at this time the trigger pin 6 is located at the bottom of the first vertical groove 71. When it is necessary to cut the wafer, the lifting seat 4 is driven to move downward. When the lifting seat 4 moves to the position of the top rod 33, the top rod 33 pushes the driving plate 5 to move upward, so that the trigger pin 6 moves upward along the first spiral groove 72, and the driving barrel 7 drives the cutter assembly to rotate until the trigger pin 6 moves to the top of the second vertical groove 73, the driving barrel 7 drives the cutter assembly to rotate by 180 degrees, and at this time the wafer is cut in the forward direction.

[0021] After the forward cutting is completed, the lifting seat 4 is driven to move upward, and the top rod 33 is separated from the lifting seat 4. Under the action of the reset spring 42, the driving plate 5 is repositioned to abut against the bottom of the lifting seat 4. In this process, the trigger pin 6 moves from the top of the second vertical groove 73 to the bottom of the second vertical groove 73, and waits for reverse cutting.

[0022] Then the lifting seat 4 is driven to move downward again. When the lifting seat 4 moves to the position of the top rod 33, the top rod 33 pushes the driving plate 5 to move upward, so that the trigger pin 6 moves upward along the second spiral groove 74, and the driving barrel 7 drives the cutter assembly to rotate until the trigger pin 6 moves to the top of the first vertical groove 71, the driving barrel 7 drives the cutter assembly to rotate by 180 degrees, and at this time the wafer is cut in the reverse direction.

[0023] Thus, through one up-down cycle of the lifting seat 4, the direction of the cutter assembly can be changed. After the direction of the cutter assembly is changed, the wafer is moved in the reverse direction by the placing assembly, and the cutter assembly can continue to cut the lower cutting path of the wafer in the reverse cutting mode without returning to the starting side through the idle stroke, thereby improving the cutting efficiency.

[0024] The large-stroke wafer cutting machine suitable for cutting large-size wafers described in the embodiment is characterized in that the depth of the bottom of the first spiral groove 72 is greater than the depth of the bottom of the first vertical groove 71; the depth of the top of the first vertical groove 71 is greater than the depth of the top of the second spiral groove 74; and the first vertical groove 71 is provided with a first inclined surface 75. Through the above arrangement, when the trigger pin 6 is located at the bottom of the first spiral groove 72, the trigger pin 6 can only move upward along the first spiral groove 72, and when the trigger pin 6 is located at the top of the first vertical groove 71, the trigger pin 6 can only move downward along the first vertical groove 71.

[0025] The depth of the bottom of the second spiral groove 74 is greater than the depth of the bottom of the second vertical groove 73; the depth of the top of the second vertical groove 73 is greater than the depth of the top of the first spiral groove 72; and the second vertical groove 73 is provided with a second inclined surface 76. Through the above arrangement, when the trigger pin 6 is located at the bottom of the second spiral groove 74, the trigger pin 6 can only move upward along the second spiral groove 74, and when the trigger pin 6 is located at the top of the second vertical groove 73, the trigger pin 6 can only move downward along the second vertical groove 73.

[0026] The large-stroke wafer cutting machine for cutting large-size wafers, the cutting knife assembly comprises a cutting knife support 8 rotatably arranged at the bottom of the lifting seat 4, a cutting knife motor 81 arranged on the cutting knife support 8, and a cutting knife 82 arranged at the output end of the cutting knife motor 81; and the driving barrel 7 is sleeved outside the cutting knife support 8. By rotating the driving barrel 7, the cutting knife support 8 can be rotated by 180 degrees, so that the forward cutting and reverse cutting of the cutting knife 82 can be realized.

[0027] The large-stroke wafer cutting machine for cutting large-size wafers, the lifting seat 4 is provided with a guide groove 43 in the height direction; and the driving plate 5 is slidingly arranged in the guide groove 43. Through the above arrangement, the lifting movement of the driving plate 5 can be ensured.

[0028] The large-stroke wafer cutting machine for cutting large-size wafers, the bottom of the lifting seat 4 is provided with a through hole 44; and the top rod 33 abuts against the driving plate 5 after passing through the through hole 44. Through the above arrangement, the top rod 33 can push the driving plate 5 to move upward against the action of the return spring 42.

[0029] The trigger pin 6 is arranged at one end of the driving plate 5 close to the driving barrel 7; the trigger spring 61 is arranged between the trigger pin 6 and the driving plate 5; the trigger pin 6 is provided with the accommodation channel 62; the bottom of the moving seat 3 is provided with the jacking seat 31; the jacking seat 31 is movably provided with the jacking plate 32; the bottom of the jacking plate 32 is provided with the spring sheet 34; and the top rod 33 is arranged on the jacking plate 32. The large-stroke wafer cutting machine suitable for large-size wafer cutting, the driving plate 5 is provided with the locking cavity 51; the locking cavity 51 is movably provided with the locking block 52; one end of the locking block 52 is provided with the locking pin 53; the locking pin 53 is movably arranged in the accommodation channel 62. The large-stroke wafer cutting machine suitable for large-size wafer cutting, one end of the locking block 52 and the locking cavity 51 are provided with the first spring 54; the other end of the locking block 52 is provided with the linkage rod 55; the second spring 56 is arranged between the other end of the linkage rod 55 and the locking block 52; the rigidity of the second spring 56 is greater than that of the first spring 54; one end of the linkage rod 55 away from the locking block 52 is rotatably provided with the roller 57; the jacking seat 31 is provided with the track strip 35; the top of the track strip 35 is provided with the locking inclined surface 36 for abutting against the roller 57. The large-stroke wafer cutting machine suitable for large-size wafer cutting, the top of the first vertical groove 71 is provided with the first tapered locking groove 77 matched with the locking pin 53; and the top of the second vertical groove 73 is provided with the second tapered locking groove 78 matched with the locking pin 53.

[0030] Specifically, the large-stroke wafer cutting machine suitable for large-size wafer cutting, initially, under the action of the reset spring 42, the driving plate 5 abuts against the bottom of the lifting seat 4, at this time, the trigger pin 6 is located at the bottom of the first vertical groove 71, and in addition, under the action of the first spring 54, the locking pin 53 is retracted in the accommodation channel 62; When the wafer needs to be cut, the lifting seat 4 is driven to move downward. When the lifting seat 4 first moves to the position of the top rod 33, the top rod 33 pushes the driving plate 5 to move upward due to the rigidity of the elastic sheet 34 being greater than the rigidity of the reset spring 42, so that the trigger pin 6 moves upward along the first spiral groove 72, and the driving barrel 7 drives the cutter support 8 to rotate until the trigger pin 6 moves to the top of the second vertical groove 73, the driving barrel 7 drives the cutter support 8 to rotate by 180 degrees, and then the lifting seat 4 continues to be driven to move downward. Since the trigger pin 6 is located at the top of the second vertical groove 73 at this time, the driving plate 5 cannot continue to move relative to the lifting seat 4, so the lifting seat 4, the driving plate 5 and the lifting plate 32 move downward synchronously at this time, until the roller 57 abuts against the locking inclined surface 36, the roller 57 moves downward along the locking inclined surface 36, thereby pushing the locking pin 53 to extend out of the accommodation channel 62 through the linkage rod 55, and the end of the locking pin 53 is locked with the first tapered locking groove 77, so that the wafer is cut in the forward direction.

[0031] After the forward cutting is completed, the lifting seat 4 is driven to move upward, the top rod 33 is separated from the lifting seat 4, and the roller 57 is separated from the locking inclined surface 36. Under the action of the reset spring 42, the driving plate 5 moves to abut against the bottom of the lifting seat 4 again, and under the action of the first spring 54, the locking pin 53 is retracted into the accommodation channel 62, and the trigger pin 6 moves from the top of the second vertical groove 73 to the bottom of the second vertical groove 73, waiting for reverse cutting.

[0032] Then the lifting seat 4 is driven to move downward again. When the lifting seat 4 first moves to the position of the top rod 33, the top rod 33 pushes the driving plate 5 to move upward due to the rigidity of the elastic sheet 34 being greater than the rigidity of the reset spring 42, so that the trigger pin 6 moves upward along the second spiral groove 74, and the driving barrel 7 drives the cutter support 8 to rotate until the trigger pin 6 moves to the top of the first vertical groove 71, the driving barrel 7 drives the cutter support 8 to rotate by 180 degrees, and then the lifting seat 4 continues to be driven to move downward. Since the trigger pin 6 is located at the top of the first vertical groove 71 at this time, the driving plate 5 cannot continue to move relative to the lifting seat 4, so the lifting seat 4, the driving plate 5 and the lifting plate 32 move downward synchronously at this time, until the roller 57 abuts against the locking inclined surface 36, the roller 57 moves downward along the locking inclined surface 36, thereby pushing the locking pin 53 to extend out of the accommodation channel 62 through the linkage rod 55, and the end of the locking pin 53 is locked with the first tapered locking groove 77, so that the wafer is cut in the reverse direction.

[0033] Thus, the direction of the cutter assembly can be changed through one up-down cycle of the lifting seat 4. After the direction of the cutter assembly is changed, the wafer is moved in the reverse direction by the placing assembly, and the cutter assembly can continue to cut the lower cutting path of the wafer in the reverse cutting mode, without returning to the starting side in the empty stroke, so that the cutting efficiency is improved.

[0034] Due to the gap between the trigger pin 6 and the driving slot, the embodiment can effectively lock the driving barrel 7 by locking the first and second tapered locking slots 77 and 78 with the locking pin 53, thereby preventing the stability of the wafer cutting by the cutting knife 82.

[0035] The large-stroke wafer cutting machine for large-size wafer cutting has a column 2 provided with an X-axis linear module 21 for driving a moving seat 3 to move along the X-axis direction; the moving seat 3 is provided with a Z-axis linear module 22 for driving a lifting seat 4 to move up and down. The placing assembly comprises a placing seat 11 and a rotary table 12 arranged on the placing seat 11; the base 1 is provided with a Y-axis linear module 13 for driving the placing seat 11 to move along the Y-axis direction.

[0036] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the protection scope of the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the present application.

Claims

1. A large-stroke wafer cutting machine suitable for cutting large-size wafers, characterized by: It includes a base (1) and a column (2) arranged on the base (1); the base (1) is movably provided with a placing assembly; The column (2) is movably provided with a cutting mechanism; the cutting mechanism includes a moving seat (3) movably arranged on the column (2); the moving seat (3) is movably provided with a lifting seat (4); the bottom of the lifting seat (4) is rotatably provided with a cutter assembly; the lifting seat (4) is movably provided with a driving plate (5); the driving plate (5) is movably provided with a trigger pin (6); the top of the driving plate (5) is provided with a reset plate (41); the reset plate (41) and the driving plate (5) are provided with a reset spring (42); the bottom of the moving seat (3) is provided with a top rod (33) for abutting against the driving plate (5). The lifting seat (4) is rotatably provided with a driving barrel (7) for driving the cutter assembly to rotate; the outer wall of the driving barrel (7) is provided with a driving groove; the trigger pin (6) is movably arranged in the driving groove; the driving groove includes a first vertical groove (71), a first spiral groove (72), a second vertical groove (73) and a second spiral groove (74); the bottom of the first spiral groove (72) is connected with the bottom of the first vertical groove (71); the top of the first spiral groove (72) is connected with the top of the second vertical groove (73); the bottom of the second spiral groove (74) is connected with the bottom of the second vertical groove (73); the top of the second spiral groove (74) is connected with the top of the first vertical groove (71).

2. The large-stroke wafer cutting machine suitable for cutting large-size wafers according to claim 1, characterized in that: The depth of the bottom of the first spiral groove (72) is greater than the depth of the bottom of the first vertical groove (71); the depth of the top of the first vertical groove (71) is greater than the depth of the top of the second spiral groove (74); the first vertical groove (71) is provided with a first inclined surface (75); The depth of the bottom of the second spiral groove (74) is greater than the depth of the bottom of the second vertical groove (73); the depth of the top of the second vertical groove (73) is greater than the depth of the top of the first spiral groove (72); the second vertical groove (73) is provided with a second inclined surface (76).

3. The large-stroke wafer cutting machine suitable for cutting large-size wafers according to claim 1, characterized in that: The cutter assembly includes a cutter bracket (8) rotatably arranged on the bottom of the lifting seat (4), a cutter motor (81) arranged on the cutter bracket (8) and a cutting knife (82) arranged on the output end of the cutter motor (81); the driving barrel (7) is sleeved on the outside of the cutter bracket (8).

4. The large-stroke wafer cutting machine suitable for cutting large-size wafers according to claim 1, characterized in that: The lifting seat (4) is provided with a guide groove (43) in the height direction; the driving plate (5) is slidably arranged in the guide groove (43).

5. The large-stroke wafer cutting machine suitable for cutting large-size wafers according to claim 1, characterized in that: The bottom of the lifting seat (4) is provided with a through hole (44); the top rod (33) abuts against the driving plate (5) after passing through the through hole (44).

6. The large travel wafer cutting machine suitable for cutting large size wafers according to claim 1, wherein: The trigger pin (6) is arranged at one end of the driving plate (5) close to the driving barrel (7); the trigger pin (6) and the driving plate (5) are provided with a trigger spring (61); the trigger pin (6) is provided with a clearance channel (62); The bottom of the mobile seat (3) is provided with a jacking seat (31); the jacking seat (31) is provided with a jacking plate (32) which is lifted and lowered; the bottom of the jacking plate (32) is provided with a spring sheet (34) between the jacking seat (31); and the jacking rod (33) is arranged on the jacking plate (32).

7. A large-stroke wafer cutting machine suitable for cutting large-size wafers according to claim 6, characterized in that: The driving plate (5) is provided with a locking cavity (51); the locking cavity (51) is movably provided with a locking block (52); one end of the locking block (52) is provided with a locking pin (53); and the locking pin (53) is arranged in the accommodation channel (62) in an extendable and retractable manner.

8. The large travel wafer cutting machine suitable for cutting large size wafers according to claim 7, wherein: One end of the locking block (52) is provided with a first spring (54) between the locking cavity (51); the other end of the locking block (52) is provided with a linkage rod (55); the linkage rod (55) is provided with a second spring (56) between the other end of the locking block (52); and one end of the linkage rod (55) away from the locking block (52) is rotatably provided with a roller (57). The jacking seat (31) is provided with a track bar (35); the top of the track bar (35) is provided with a locking inclined surface (36) for abutting against the roller (57).

9. The large travel wafer cutting machine suitable for cutting large size wafers according to claim 7, wherein: The top of the first vertical groove (71) is provided with a first conical locking groove (77) matched with the locking pin (53); and the top of the second vertical groove (73) is provided with a second conical locking groove (78) matched with the locking pin (53).

10. The large-stroke wafer cutting machine suitable for cutting large-size wafers according to claim 1, characterized in that: The stand column (2) is provided with an X-axis linear module (21) for driving the mobile seat (3) to move along the X-axis direction; and the mobile seat (3) is provided with a Z-axis linear module (22) for driving the lifting seat (4) to move up and down. The placing assembly comprises a placing seat (11) and a rotating table (12) arranged on the placing seat (11); and the base (1) is provided with a Y-axis linear module (13) for driving the placing seat (11) to move along the Y-axis direction.

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