A method for preparing a high-strength tungsten wire composite for cutting

By preparing a Ni-Mo-P coating and fixing chemical bonds, the problem of insufficient bonding force between tungsten wire and diamond was solved, and the cutting effect of high-strength tungsten wire composite material was improved.

CN120905750BActive Publication Date: 2026-06-23JIANGXI HONGJI NEW MATERIAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
JIANGXI HONGJI NEW MATERIAL TECH CO LTD
Filing Date
2025-08-13
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

In existing technologies, the bonding force between tungsten wire and diamond is insufficient, causing diamond to easily fall off during the cutting process, making it difficult to meet the high-precision cutting requirements of ultra-thin silicon wafers.

Method used

A tungsten matrix wire was prepared by mixing and ball milling tungsten powder, iridium powder, niobium carbide powder and zirconium oxide powder, followed by cryo-pressing, degreasing, pre-sintering, spark plasma sintering, blanking, wire drawing and annealing. After pretreatment and activation of diamond micropowder, a Ni-Mo-P coating was prepared on its surface and chemically bonded to the modified diamond coating to improve the bonding force.

Benefits of technology

It enhances the bonding force between diamond and the tungsten matrix wire, reduces diamond shedding, improves cutting efficiency and stability, and meets the cutting requirements of hard and brittle materials.

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Abstract

The application relates to a tungsten alloy material wire cutting technical field, in particular to a preparation method of a high-strength tungsten wire composite material for cutting. The preparation method of the high-strength tungsten wire composite material for cutting comprises the following steps: preparing a base tungsten wire, preparing surface plated diamond, preparing modified plated diamond and preparing the high-strength tungsten wire composite material. In the application, the diamond micro powder is pretreated and activated, then is added into a plating solution of nickel sulfate, sodium molybdate and sodium hypophosphite dihydrogen, and is chemically plated to prepare a Ni-Mo-P plating layer on the surface of the diamond, and after the surface plated diamond is obtained, when the diamond is embedded into the base tungsten wire, a mechanical interlocking structure can be formed between the diamond and the base tungsten wire to resist the shearing stress during cutting, therefore, the preparation of the Ni-Mo-P plating layer on the surface of the diamond can effectively improve the bonding force between the diamond and the base tungsten wire and reduce the falling amount of the diamond during cutting.
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