Ultrahigh-uniformity area light source
By using a density gradient design of the inner and outer LED bead areas and a combined structure of a PC nanosphere diffuser plate and an upper and lower heat sink-VC vapor chamber, the problems of uneven light spatial distribution and poor thermal management of surface light sources are solved, achieving ultra-high uniformity and stable brightness.
Patent Information
- Application Number
- CN202511041093.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-28
- Publication Date
- 2025-11-07
AI Technical Summary
Surface light sources suffer from uneven light spatial distribution, uneven diffusion of the diffuser plate, and poor thermal management, resulting in central zebra stripes and uneven brightness.
It adopts a density gradient design for the inner and outer LED bead areas, a combined structure of PC nanosphere diffuser plate and upper and lower heat sinks-VC vapor chamber, and optimizes the uniformity of the surface light source through optical and thermal management.
It achieves ultra-high uniformity of surface light source, improves brightness uniformity, ensures consistent brightness between center and edge, and has good temperature uniformity, avoiding color temperature and brightness drift and extending the service life of surface light source.
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Figure CN120907116A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of surface light sources, in particular to a surface light source with super-high uniformity. BACKGROUND
[0002] In the field of optical illumination and display, the light illumination uniformity of a surface light source is a core index for measuring its performance. Improving the light illumination uniformity of a surface light source not only brings an improvement in visual experience, but also improves the detection quality in industrial, medical and scientific research scenes that require high-precision detection.
[0003] Therefore, it is necessary and one of the difficult challenges to improve the light illumination uniformity of a surface light source.
[0004] At present, the uniformity of a surface light source is low, and the reason for the low uniformity is that the surface light source has the following defects: 1. The light spatial distribution of the surface light source is not uniform, and the edge attenuation is serious; 2. The diffusion plate of the surface light source diffuses unevenly and is prone to failure under thermal expansion, resulting in the appearance of central zebra stripes; 3. The heat management of the surface light source is poor, which easily leads to a large temperature rise, resulting in color temperature drift, brightness drift (central bright spot) and deformation of the light guide plate (central zebra stripes are intensified). SUMMARY
[0005] The present application aims to overcome the above-mentioned defects in the prior art, and provides a surface light source with super-high uniformity, which is used to solve the problems of uneven light spatial distribution, uneven diffusion of the diffusion plate and poor heat management, thereby effectively improving the light uniformity of the surface light source.
[0006] To achieve the above-mentioned purpose, the present application provides a surface light source with super-high uniformity, comprising a shell, a PCB board is arranged inside the shell, an LED lamp bead area is arranged on the PCB board, the LED lamp bead area is composed of an inner LED lamp bead area and an outer LED lamp bead area arranged outside the inner LED lamp bead area, the inner LED lamp bead area and the outer LED lamp bead area each comprise a plurality of linearly arranged LED lamp beads, the arrangement density of the plurality of LED lamp beads of the outer LED lamp bead area is greater than the arrangement density of the plurality of LED lamp beads of the inner LED lamp bead area, a PC nanometer micro-bead diffusion plate is arranged on the top or above the PCB board, an upper heat dissipation plate is arranged at the bottom of the PCB board, a VC uniform temperature plate is arranged at the bottom of the upper heat dissipation plate, and a lower heat dissipation plate is arranged at the bottom of the VC uniform temperature plate.
[0007] Preferably, the lower heat dissipation plate is provided with a plurality of linearly arranged heat dissipation fin blocks.
[0008] As preferred, a plurality of linearly arranged heat dissipation fins form a heat dissipation area, and a plurality of longitudinal flow channels and a plurality of transverse flow channels are formed in the heat dissipation area, and the plurality of longitudinal flow channels and the plurality of transverse flow channels are arranged in a longitudinal and transverse staggered manner.
[0009] As preferred, the PC nano-bead diffusion plate is arranged on the top of the shell, and the upper heat dissipation plate is arranged on the bottom of the shell.
[0010] As preferred, the PC nano-bead diffusion plate comprises a polycarbonate (PC) matrix and silica micro-bead scatterers or zirconium oxide nano-bead scatterers mixed in the polycarbonate (PC) matrix, and the contact surface between the polycarbonate (PC) matrix and the silica micro-bead scatterers or zirconium oxide nano-bead scatterers is modified by a silane coupling agent.
[0011] As preferred, the particle size of the silica micro-bead scatterers or zirconium oxide nano-bead scatterers ranges from 0.5 to 5 μm.
[0012] As preferred, the arrangement density of the plurality of LED lamp beads in the outer LED lamp bead area is twice that of the plurality of LED lamp beads in the inner LED lamp bead area.
[0013] As preferred, the LED lamp beads are three-color LED lamp beads, and the three-color LED lamp beads are white light lamp beads, IR850 infrared lamp beads and IR940 infrared lamp beads, and the color temperature of the white light lamp beads ranges from 6500±400 K.
[0014] As preferred, the VC uniform temperature plate comprises an evaporation end surface arranged on the bottom of the upper heat dissipation plate, a condensation end surface arranged on the top of the lower heat dissipation plate, a vacuum cavity arranged in the interior between the evaporation end surface and the condensation end surface, a support column arranged in the vacuum cavity, a capillary structure arranged on the inner wall of the vacuum cavity and a liquid working medium arranged in the interior of the vacuum cavity.
[0015] As preferred, the shell comprises four side plates arranged in a surrounding manner, and a power line electrically connected with the PCB plate is arranged on the outer side of the shell.
[0016] Compared with the prior art, the present application has the following beneficial effects: 1. The present application has the following beneficial effects: A. Optical compensation structure: Electronic compensation: by arranging the LED lamp bead area into an inner LED lamp bead area and an outer LED lamp bead area, the arrangement density of the plurality of LED lamp beads in the outer LED lamp bead area is greater than that of the plurality of LED lamp beads in the inner LED lamp bead area, so that the light spatial distribution of the surface light source is uniform, and the light brightness of the center and the edge (even the corners) is uniform. Physical compensation: by setting PC nanometer microbead diffusion plate, further improve the light emitted by the LED lamp bead area of light diffusion uniformity; Through the optical compensation structure electronic compensation + physical compensation, the light uniformity of the surface light source is optimized, so that the center zebra and the edge dark defects are effectively overcome. B. Heat management structure: Through the heat dissipation structure of the upper heat dissipation plate-VC uniform plate-lower heat dissipation plate, the heat management is good, the temperature is effectively cooled and the temperature is uniform, so that the surface light source temperature difference is small, thereby avoiding the color temperature drift, brightness drift and avoiding the deformation of the PC nanometer microbead diffusion plate.
[0017] C. Through the optical compensation structure, the light uniformity of the surface light source is improved, and the light brightness uniformity of the optical compensation structure is guaranteed through the heat management structure, so that the light-heat coupling design is realized, and the light uniformity of the surface light source is optimized through the cooperation of the two, so that the surface light source obtains super high uniformity.
[0018] 2. As described above, the present application provides a kind of super high uniformity surface light source, through PC nanometer microbead diffusion plate+LED lamp bead area density gradient increases optical compensation structure design and through the heat management structure design of upper heat dissipation plate-VC uniform plate-lower heat dissipation plate, so that optical structure and heat management structure optimize the light uniformity of surface light source, so that super high uniformity surface light source is obtained. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creating any creative labor.
[0020] Figure 1 is a structure schematic diagram of a super high uniformity surface light source provided by an embodiment of the present application; Figure 2 is an exploded structure schematic diagram of a super high uniformity surface light source provided by an embodiment of the present application; Figure 3 is a top view of LED lamp bead area provided by an embodiment of the present application; Figure 4 is a bottom view of lower heat dissipation plate provided by an embodiment of the present application; Figure 5 is an experimental diagram of a super high uniformity surface light source provided by an embodiment of the present application.
[0021] In the drawings, there are: 1, shell; 10, power cord; 11, side plate; 2, PCB board; 21, LED lamp bead area; 211, inner side LED lamp bead area; 212, outer side LED lamp bead area; 215, LED lamp bead; 3, PC nanometer microsphere diffusion plate; 4, upper heat dissipation plate; 5, VC uniform temperature plate; 6, lower heat dissipation plate; 7, heat dissipation fin block; 8, longitudinal flow channel; 9, transverse flow channel. DETAILED DESCRIPTION
[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are one of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0023] Please refer to Figures 1 to 5 The embodiment of the present application provides a super-high uniformity surface light source, which comprises a shell 1, a PCB board 2 is arranged in the shell 1, an LED lamp bead area 21 is arranged on the PCB board 2, the LED lamp bead area 21 is composed of an inner side LED lamp bead area 211 and an outer side LED lamp bead area 212 arranged outside the inner side LED lamp bead area 211, the inner side LED lamp bead area 211 and the outer side LED lamp bead area 212 each comprise a plurality of linearly arranged LED lamp beads 215, the arrangement density of the plurality of LED lamp beads 215 of the outer side LED lamp bead area 212 is greater than the arrangement density of the plurality of LED lamp beads 215 of the inner side LED lamp bead area 211, a PC nanometer microsphere diffusion plate 3 is arranged on or above the top of the PCB board 2, an upper heat dissipation plate 4 is arranged at the bottom of the PCB board 2, a VC uniform temperature plate 5 is arranged at the bottom of the upper heat dissipation plate 4, and a lower heat dissipation plate 6 is arranged at the bottom of the VC uniform temperature plate 5.
[0024] A plurality of linearly arranged heat dissipation fin blocks 7 are arranged at the bottom of the lower heat dissipation plate 6. A plurality of longitudinal flow channels 8 and a plurality of transverse flow channels 9 are respectively arranged in the heat dissipation area formed by the plurality of linearly arranged heat dissipation fin blocks 7, and the plurality of longitudinal flow channels 8 and the plurality of transverse flow channels 9 are arranged in a longitudinal and transverse staggered manner. The heat dissipation fluid (such as heat dissipation air or heat dissipation cooling water) passes through the staggered longitudinal flow channels 8 and transverse flow channels 9 respectively, thereby performing maximum area contact heat dissipation on the heat dissipation fin blocks 7, so as to realize high-efficiency heat dissipation and effectively improve the service life and thermal management stability of the surface light source.
[0025] The PC nanometer microsphere diffusion plate 3 is arranged at the top of the shell 1, and the upper heat dissipation plate 4 is arranged at the bottom of the shell 1.
[0026] The PC nano-bead diffusion plate 3 comprises a polycarbonate (PC) base and silica micro-bead scatterers or zirconium oxide nano-bead scatterers mixed in the polycarbonate (PC) base, and the contact surface between the polycarbonate (PC) base and the silica micro-bead scatterers or zirconium oxide nano-bead scatterers is modified by a silane coupling agent. The particle size of the silica micro-bead scatterers or zirconium oxide nano-bead scatterers ranges from 0.5 to 5 microns. By adding the micron-sized (0.5-5 microns) silica micro-bead scatterers or zirconium oxide nano-bead scatterers, the multiple refraction of the light path emitted by the LED light area can be effectively controlled, thereby realizing uniform body scattering. The contact surface between the polycarbonate (PC) base and the silica micro-bead scatterers or zirconium oxide nano-bead scatterers is modified by a silane coupling agent, thereby effectively preventing the silica micro-bead scatterers or zirconium oxide nano-bead scatterers from agglomerating and improving the stability of the silica micro-bead scatterers or zirconium oxide nano-bead scatterers after uniform mixing.
[0027] The arrangement density of the plurality of LED lamp beads 215 in the outer LED lamp bead area 212 is twice that of the plurality of LED lamp beads 215 in the inner LED lamp bead area 211.
[0028] The LED lamp beads 215 are three-color LED lamp beads 215, which are white light lamp beads, IR850 infrared lamp beads and IR940 infrared lamp beads, respectively. The color temperature of the white light lamp beads ranges from 6500±400K.
[0029] The VC uniform temperature plate 5 comprises an evaporation end surface arranged at the bottom of the upper heat dissipation plate 4, a condensation end surface arranged at the top of the lower heat dissipation plate 6, a vacuum cavity arranged inside the evaporation end surface and the condensation end surface, a support column arranged between the vacuum cavities, a capillary structure arranged on the inner wall of the vacuum cavity, and a liquid working medium arranged inside the vacuum cavity. The heat dissipation principle of the VC uniform temperature plate 5 is as follows: the liquid working medium contacts the evaporation end surface and absorbs heat to vaporize -> the vaporized steam diffuses to the low-temperature condensation end surface due to the pressure difference -> the steam absorbs heat to condense and flow back -> the liquid working medium driven by the capillary structure contacts the evaporation end surface, thereby realizing effective cooling and temperature uniformity.
[0030] The upper heat dissipation plate 4 is a copper plate.
[0031] The shell 1 comprises four side plates 11 arranged around, and the shell 1 is externally provided with a power line 10 electrically connected with the PCB 2.
[0032] The super-high uniformity surface light source of the embodiment of the application has the following advantages: A. Optical compensation structure: Through electronic compensation: by setting the LED lamp bead area 21 into the inner LED lamp bead area 211 and the outer LED lamp bead area 212, the arrangement density of the plurality of LED lamp beads 215 of the outer LED lamp bead area 212 is greater than that of the plurality of LED lamp beads 215 of the inner LED lamp bead area 211, so that the light spatial distribution of the surface light source is uniform, and the light brightness of the center and the edge (even the corner) is uniform. Therefore, by the special arrangement of the LED lamp bead area 21, by adopting the edge area LED lamp bead 215 density gradient encryption design (the LED lamp bead 215 is a three-color LED lamp bead 215 arranged independently in three wave bands of W / IR850 / IR940), by the supplementary algorithm, based on the Fresnel loss model, the peripheral light flux is increased by 30%±5%, and the corner dark area is effectively eliminated. Through physical compensation: by setting the PC nano micro-bead diffusion plate 3, the diffusion uniformity of the light emitted by the LED lamp bead area 21 is further improved. Among them, the 0.5-5 μm silica micro-bead scatterer or zirconium oxide nano micro-bead scatterer (modified and treated by silane coupling agent) is embedded in the polycarbonate (PC) matrix, which effectively realizes the uniformization of the body scattering (scattering angle > 170°), and eliminates the appearance of the heat deformation zebra pattern of the conventional diffusion plate Through the electronic compensation of the optical compensation structure and the physical compensation, the light uniformity of the surface light source is optimized, so that the defects of the center zebra pattern and the darker edge are effectively overcome. B. Heat management structure: Through the heat dissipation structure of the upper heat sink 4-VC uniform plate 5-lower heat sink 6, the heat management is good, the temperature is effectively cooled and uniformly, the temperature difference of the surface light source is small, so that the color temperature drift, the brightness drift and the deformation of the PC nano micro-bead diffusion plate 3 are avoided.
[0033] Among them, the thermal conductivity of the VC uniform plate 5 is > 400 W / mK, which effectively realizes ≤1.5℃ temperature control, and the lower heat sink 6 is longitudinally and transversely arranged, which effectively enhances the heat dissipation of the natural convection of the heat dissipation fluid. C. By the optical compensation structure, the light uniformity of the surface light source is improved, and the heat management structure guarantees the light brightness uniformity of the optical compensation structure, which realizes the light-heat coupling design, and the two are optimized to optimize the light uniformity of the surface light source, so that the surface light source obtains super high uniformity. The super high uniformity surface light source of the embodiment of the present application can obtain super high uniformity of more than 98%, which is much higher than the 95% uniformity of the traditional surface light source, and the experimental graph is as shown in Figure 5 , Therefore, the super high uniformity surface light source of the embodiment of the present application has the following technical effects: 1. The full-area uniformity of the surface light source is more than 98%. 2、LED lamp beads 215 three color band consistency to achieve ± 2%; 3、The working temperature difference of the surface light source is ± 2 degrees; 4、The white light color temperature stability is ± 400K; 5、In the application of OLED screen defect detection: The IR940 infrared lamp bead band of the LED lamp bead 215 penetrates the thin film layer of the OLED screen, and the white light lamp bead develops the surface scratch, and the false judgment rate of the surface light source of the application is reduced from 5.2% to 0.7%; 6、In the application of mobile phone screen bonding glue road detection: The IR850 infrared lamp bead band of the LED lamp bead 215 penetrates the glass cover plate to form an internal bubble image; The white light lamp bead develops the surface scratch and dirt; Synergistic effect: the false detection rate is reduced from 7.1% to 0.9%, and the detection speed is increased to 150fps. (The detection speed of the traditional surface light source is less than 90fps) 7、The technical advantages of the surface light source structure: Optical structure: It is the first to create "electronic compensation (LED lamp bead 215 density gradient encryption design) + physical compensation (PC nanometer microsphere diffusion plate 3 nanometer scattering homogenization)" double mechanism, and to solve the problem of corner dark area of surface light source; Heat management level: The heat dissipation structure of the upper heat dissipation plate 4-VC uniform plate 5-lower heat dissipation plate 6 realizes ± 1.5 degree temperature control (the traditional surface light source is ± 5 degree temperature control) Application level: The LED lamp bead 215 adopts three color LED lamp bead 215, adopts multi-band independent control technology, and solves the interference problem of visible light and infrared light.
[0034] The above is only a preferred embodiment of the application, and is not used to limit the application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application shall be included in the protection scope of the application.
Claims
1. An ultra-high uniformity area light source, characterized by, The application relates to a shell (1) internally provided with a PCB board (2), wherein the PCB board (2) is provided with an LED lamp bead area (21), the LED lamp bead area (21) is composed of an inner LED lamp bead area (211) and an outer LED lamp bead area (212) arranged outside the inner LED lamp bead area (211), the inner LED lamp bead area (211) and the outer LED lamp bead area (212) each comprise a plurality of linearly arranged LED lamp beads (215), the arrangement density of the plurality of LED lamp beads (215) of the outer LED lamp bead area (212) is greater than that of the inner LED lamp bead area (211), the top or upper side of the PCB board (2) is provided with a PC nano micro bead diffusion plate (3), the bottom of the PCB board (2) is provided with an upper heat dissipation plate (4), the bottom of the upper heat dissipation plate (4) is provided with a VC uniform temperature plate (5), and the bottom of the VC uniform temperature plate (5) is provided with a lower heat dissipation plate (6).
2. An ultra-high uniformity area light source as defined in claim 1, wherein, The bottom of the lower heat dissipation plate (6) is provided with a plurality of linearly arranged heat dissipation fin blocks (7).
3. An ultra-high uniformity area light source according to claim 2, wherein, A plurality of linearly arranged heat dissipation fin blocks (7) form a heat dissipation area, a plurality of longitudinal flow channels (8) and a plurality of transverse flow channels (9) are arranged in the heat dissipation area, and the plurality of longitudinal flow channels (8) and the plurality of transverse flow channels (9) are arranged in a longitudinal and transverse staggered mode.
4. An ultra-high uniformity area light source as defined in claim 1, wherein, The PC nano micro bead diffusion plate (3) is arranged on the top of the shell (1), and the upper heat dissipation plate (4) is arranged on the bottom of the shell (1).
5. An ultra-high uniformity area light source as claimed in claim 1, characterized in that, The PC nano micro bead diffusion plate (3) comprises a polycarbonate (PC) matrix and silica micro bead scattering bodies or zirconium oxide nano micro bead scattering bodies mixed in the polycarbonate (PC) matrix, and the contact surface between the polycarbonate (PC) matrix and the silica micro bead scattering bodies or zirconium oxide nano micro bead scattering bodies is modified by a silane coupling agent.
6. An ultra-high uniformity area light source as claimed in claim 1, characterized in that, The particle size of the silica micro bead scattering bodies or zirconium oxide nano micro bead scattering bodies ranges from 0.5 to 5 mu m.
7. An ultra-high uniformity area light source as claimed in claim 1, characterized in that, The arrangement density of the plurality of LED lamp beads (215) of the outer LED lamp bead area (212) is twice that of the inner LED lamp bead area (211).
8. An ultra-high uniformity area light source as claimed in claim 1, characterized in that, The LED lamp beads (215) are tricolor LED lamp beads (215), the tricolor LED lamp beads (215) are white light lamp beads, IR850 infrared lamp beads and IR940 infrared lamp beads, and the color temperature of the white light lamp beads ranges from 6500 to 400 K.
9. An ultra-high uniformity area light source as claimed in claim 1, characterized in that, The VC uniform temperature plate (5) comprises an evaporation end face arranged on the bottom of the upper heat dissipation plate (4), a condensation end face arranged on the top of the lower heat dissipation plate (6), a vacuum cavity arranged between the evaporation end face and the condensation end face, a supporting column arranged between the vacuum cavities, a capillary structure arranged on the inner wall of the vacuum cavity and a liquid working medium arranged in the vacuum cavity.
10. An ultra-high uniformity area light source as claimed in claim 1, characterized in that, The shell (1) comprises four side plates (11) arranged in a surrounding mode, and the outer side of the shell (1) is provided with a power line (10) electrically connected with the PCB board (2).