Display module and electronic equipment

Abstract

The invention provides a display module and electronic equipment, and the display module provided by the invention comprises a first touch control wiring layer and a source drain layer, the first touch wiring layer comprises a first insulating layer and a first metal layer; the source-drain layer comprises a first sub-layer and a second sub-layer which are stacked; in a first connecting area of the display module, a first insulating layer, a first sub-layer and a second sub-layer are stacked in sequence, the first insulating layer is provided with a first hollow part, a part, opposite to the first hollow part, of a source-drain layer is provided with a second hollow part, a first metal layer covers one side of the first insulating layer and one side of the source-drain layer, and a second metal layer covers the other side of the source-drain layer. A part of the first metal layer is arranged in the second hollow part, and the first metal layer is connected with the source-drain layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module and electronic equipment. BACKGROUND

[0002] With the rapid development of display technology, display modules are increasingly widely used in electronic devices such as smart phones and tablet computers.

[0003] In the related art, the first touch wiring layer of the display area of the display module extends to the first connection area, and then connects with the source-drain layer, and the source-drain layer further connects with the second touch wiring layer of the touch chip setting area, so as to lead the first touch wiring layer to the second touch wiring layer. The first touch wiring layer extending to the first connection area in the related art has the possibility of being layered with the source-drain layer. Further, in the case of layering the first touch wiring layer with the source-drain layer, the touch function of the display module will be disabled. SUMMARY

[0004] The embodiments of the present application provide a display module and electronic equipment to solve the problem of how to improve the product reliability of the display module.

[0005] In order to solve the above technical problems, the present application is implemented as follows: In a first aspect, the embodiments of the present application provide a display module.

[0006] The display module provided by the embodiments of the present application comprises a first touch wiring layer and a source-drain layer; the first touch wiring layer comprises a first insulating layer and a first metal layer; the source-drain layer comprises a first sub-layer and a second sub-layer which are stacked; in a first connection area of the display module, the first insulating layer, the first sub-layer and the second sub-layer are sequentially stacked, the first insulating layer is provided with a first hollow part, a part of the source-drain layer opposite to the first hollow part is provided with a second hollow part, and the first metal layer covers one side of the first insulating layer and the source-drain layer, wherein the first metal layer at least partially covers the first hollow part and the second hollow part, so that the first metal layer is connected with the source-drain layer.

[0007] In some embodiments, the second hollow part comprises a first sub-hollow part and / or a second sub-hollow part; the first sub-hollow part penetrates the first sub-layer, and the second sub-hollow part penetrates the first sub-layer and the second sub-layer.

[0008] In some embodiments, in the first connection area, the part of the source-drain layer opposite to the first hollow part is divided into a plurality of first sub-regions, and each first sub-region is provided with a first sub-hollow part and a second sub-hollow part.

[0009] In some embodiments, each first sub-region is sequentially arranged along a direction from one side of the first connection area to the opposite side.

[0010] In some embodiments, the first sub-hollowed part and the second sub-hollowed part are staggered in a direction perpendicular to the arrangement direction of each first sub-region.

[0011] In some embodiments, the first sub-hollowed part and the second sub-hollowed part of each first sub-region have the same size.

[0012] In some embodiments, the display area, the first connection area, the flexible bending area, the second connection area and the touch chip setting area of the display module are arranged in sequence; the first touch trace layer is arranged in the display area, and the first metal layer extends to the first connection area; and the source-drain layer is arranged in the first connection area, the flexible bending area, the second connection area and the touch chip setting area.

[0013] In some embodiments, the display module further comprises a second touch trace layer; the second touch trace layer is arranged in the touch chip setting area, and the second touch trace layer comprises a third metal layer, and the third metal layer extends to the second connection area; in the second connection area, the source-drain layer is connected with the third metal layer, so that the first metal layer is connected with the third metal layer through the source-drain layer.

[0014] In some embodiments, the second touch trace layer further comprises a second insulating layer; in the second connection area, the second insulating layer, the first sub-layer and the second sub-layer are sequentially stacked, the second insulating layer is provided with a third hollowed part, the part of the source-drain layer opposite to the third hollowed part is provided with a fourth hollowed part, and the third metal layer covers one side of the second insulating layer and the source-drain layer, wherein at least part of the third metal layer covers the third hollowed part and the fourth hollowed part, so that the third metal layer is connected with the source-drain layer.

[0015] In a second aspect, the embodiments of the present application provide an electronic device.

[0016] The electronic device provided by the embodiments of the present application comprises a frame body and any one of the display modules provided by the embodiments of the present application.

[0017] The above at least one technical scheme adopted by the embodiments of the present application can achieve the following beneficial effects: In the embodiments of the present application, the first metal layer of the first touch trace layer extends to the part of the first connection area, covers one side of the combination of the first insulating layer and the source-drain layer, and specifically covers the surface of the combination on which the first hollowed part and the second hollowed part are arranged. Therefore, the first metal layer of the first touch trace layer is filled in the first hollowed part and the second hollowed part, so that the first metal layer of the first touch trace layer is not only connected with the surface of the source-drain layer facing the first hollowed part, but also connected with the part of the source-drain layer on which the second hollowed part is arranged.

[0018] In the case that the connecting part between the first metal layer and the source-drain layer of the first touch wiring layer is subjected to stress in a single direction, the connecting part between the first metal layer and the source-drain layer of the first touch wiring layer is not easy to separate, so that the connection firmness of the first metal layer and the source-drain layer of the first touch wiring layer can be improved. Therefore, the product reliability of the display module can be improved.

[0019] Additional aspects and advantages of the present application will be described in the description that follows, and will become apparent from the description, or can be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the related art, the drawings needed to be used in the embodiments or the related art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0021] Figure 1 A schematic diagram of a display module provided by an embodiment of the present application is shown in FIG. 1. Figure 2 A partial cross-sectional view of the display module along A-A shown in FIG. 2 is shown in FIG. 3. Figure 1 A partial schematic diagram of the display module shown in FIG. 4 is shown in FIG. 5. Figure 3 Figure 2 A schematic diagram of a first metal layer, a first insulating layer, a first sub-layer and a second sub-layer located at a first connecting area of a display module provided by an embodiment of the present application is shown in FIG. 6. Figure 4 A schematic diagram of a first metal layer, a first insulating layer, a first sub-layer and a second sub-layer shown in FIG. 7 is shown in FIG. 8. Figure 5 A schematic diagram of a first metal layer, a first insulating layer, a first sub-layer and a second sub-layer shown in FIG. 9 is shown in FIG. 10. Figure 4 A schematic diagram of a first metal layer, a first insulating layer, a first sub-layer and a second sub-layer provided by another embodiment of the present application is shown in FIG. 11. Figure 6 A schematic diagram of a first metal layer, a first insulating layer, a first sub-layer and a second sub-layer shown in FIG. 12 is shown in FIG. 13. Figure 7 Figure 6 A schematic diagram of a first metal layer, a first insulating layer, a first sub-layer and a second sub-layer provided by still another embodiment of the present application is shown in FIG. 14. Figure 8 A schematic diagram of a first metal layer, a first insulating layer, a first sub-layer and a second sub-layer shown in FIG. 15 is shown in FIG. 16. Figure 9 A schematic diagram of a first metal layer, a first insulating layer, a first sub-layer and a second sub-layer shown in FIG. 17 is shown in FIG. 18. Figure 8 ​​A schematic view of a first metal layer, a first insulating layer, a first sub-layer and a second sub-layer in a second connection area of a display module according to an embodiment of the present application is shown in FIG. 1. Figure 10 A schematic view of a third metal layer, a second insulating layer, a first sub-layer and a second sub-layer in a second connection area of a display module according to an embodiment of the present application is shown in FIG. 2.

[0022] Label explanation: 1- display module; 100- first touch trace layer; 100a- display area; 100b- first connection area; 100c- flexible bending area; 100d- second connection area; 100e- touch chip setting area; 110- first insulating layer; 111- first hollow part; 120- first metal layer; 130- second metal layer; 200- source-drain layer; 200a- second hollow part; 200b- first sub-hollow part; 200c- second sub-hollow part; 200d- first sub-area; 200e- fourth hollow part; 200f- third sub-hollow part; 200g- fourth sub-hollow part; 210- first sub-layer; 220- second sub-layer; 230- third sub-layer; 300- second touch trace layer; 310- second insulating layer; 311- third hollow part; 320- third metal layer; 330- fourth metal layer; 400- flexible circuit board. DETAILED DESCRIPTION

[0023] In order to make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described below in conjunction with specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0024] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection" and "linking" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0025] In addition, although the terms used in the present application are selected from the commonly known and used terms, some terms mentioned in the description of the present application may be selected by the applicant according to his or her judgment, and the detailed meaning of which is described in the relevant part of the description.

[0026] Furthermore, the present application is to be understood based on the meaning of each term used, not only the actual term used.

[0027] The technical solutions provided by the embodiments of the present application are described in detail below with reference to the drawings.

[0028] The embodiments of the present application provide a display module. Referring to Figures 1 to 9 The display module 1 provided by the embodiments of the present application comprises a first touch panel (TP) trace layer 100 and a source / drain (SD) layer 200.

[0029] The first touch panel trace layer 100 comprises a first insulating layer 110 and a first metal layer 120. The source / drain layer 200 comprises a first sub-layer 210 and a second sub-layer 220 which are stacked.

[0030] In the first connecting area 100b of the display module 1, the first insulating layer 110, the first sub-layer 210 and the second sub-layer 220 are stacked in sequence. The first insulating layer 110 is provided with a first hollow part 111, and the part of the source / drain layer 200 opposite to the first hollow part 111 is provided with a second hollow part 200a. Exemplarily, the number of the second hollow part 200a can be one or more. The first metal layer 120 is covered on one side of the first insulating layer 110 and the source / drain layer 200; wherein the first metal layer 120 is at least partially covered on the first hollow part 111 and the second hollow part 200a, so that the first metal layer 120 is connected with the source / drain layer 200.

[0031] In this way, in the embodiments of the present application, the first metal layer 120 of the first touch panel trace layer 100 extends to the part of the first connecting area 100b, and is covered on one side of the combination of the first insulating layer 110 and the source / drain layer 200, specifically on the surface of the side of the combination provided with the first hollow part 111 and the second hollow part 200a. Thus, the first metal layer 120 of the first touch panel trace layer 100 is filled in the first hollow part 111 and the second hollow part 200a, so that the first metal layer 120 of the first touch panel trace layer 100 is not only connected with the surface of the source / drain layer 200 facing the first hollow part 111, but also connected with the part of the source / drain layer 200 provided with the second hollow part 200a.

[0032] In the case that the connecting part between the first metal layer 120 of the first touch panel trace layer 100 and the source / drain layer 200 is subjected to stress in a single direction, the connecting part between the first metal layer 120 of the first touch panel trace layer 100 and the source / drain layer 200 is not easy to separate, so that the connection firmness of the first metal layer 120 of the first touch panel trace layer 100 and the source / drain layer 200 can be improved. Thus, the effect of improving the product reliability of the display module can be achieved.

[0033] Exemplarily, referring to Figure 4 In the case that the connecting part between the first metal layer 120 of the first touch control wire layer 100 and the source-drain layer 200 is subjected to stress in the horizontal direction, the stress in the horizontal direction will not damage the connection between the part where the first metal layer 120 fills the second hollow part 200a and the circumferential sidewall of the second hollow part 200a. Thus, in the case that the connecting part between the first metal layer 120 of the first touch control wire layer 100 and the source-drain layer 200 is subjected to stress in the horizontal direction, the first metal layer 120 can be reliably connected with the circumferential sidewall of the second hollow part 200a.

[0034] Continuing to refer to Figure 4 In the case that the connecting part between the first metal layer 120 of the first touch control wire layer 100 and the source-drain layer 200 is subjected to stress in the vertical direction, the stress in the vertical direction will not damage the connection between the first metal layer 120 and the upper surface of the source-drain layer 200. Thus, in the case that the connecting part between the first metal layer 120 of the first touch control wire layer 100 and the source-drain layer 200 is subjected to stress in the vertical direction, the first metal layer 120 can be reliably connected with the upper surface of the source-drain layer 200.

[0035] Thus, it can be concluded from the above analysis that the scheme provided by the embodiments of the present application can improve the performance of the first connection area 100b of the display module 1 in resisting stress in a single direction, and avoid the delamination of the first metal layer 120 and the source-drain layer 200 due to excessive stress in a single direction.

[0036] In some embodiments, the part of the source-drain layer 200 opposite to the first hollow part 111 in the first connection area 100b of the display module 1 is provided with a plurality of second hollow parts 200a. In this way, even if the local part of the first metal layer 120 is separated from the sidewall of some of the second hollow parts 200a, the first metal layer 120 will still have some parts connected with the sidewall of other second hollow parts 200a. Thus, even if the first metal layer 120 and the source-drain layer 200 are delaminated locally, the first metal layer 120 and the source-drain layer 200 can still be in an electrically connected state.

[0037] In some embodiments, the second hollow part 200a includes a first sub-hollow part 200b and / or a second sub-hollow part 200c. The first sub-hollow part 200b penetrates the first sub-layer 210, and the second sub-hollow part 200c penetrates the first sub-layer 210 and the second sub-layer 220.

[0038] It should be noted that the first sub-hollow part 200b only penetrates the first sub-layer 210, and the first sub-hollow part 200b can be referred to as a "shallow hole" provided in the source-drain layer 200, and the second sub-hollow part 200c penetrates the first sub-layer 210 and the second sub-layer 220, and the second sub-hollow part 200c can be referred to as a "deep hole" provided in the source-drain layer 200.

[0039] With reference to Figure 4 and Figure 5 , the second hollow part 200a includes the first sub-hollow part 200b. Exemplarily, the number of the first sub-hollow part 200b is multiple. The first sub-hollow part 200b penetrates the first sub-layer 210. The part of the first metal layer 120 filled in the first sub-hollow part 200b can be connected with the part of the second sub-layer 220 facing the first sub-hollow part 200b, and the part of the first metal layer 120 filled in the first sub-hollow part 200b is also connected with the circumferential sidewall of the first sub-hollow part 200b.

[0040] With reference to Figure 6 and Figure 7 , the second hollow part 200a includes the second sub-hollow part 200c. Exemplarily, the number of the second sub-hollow part 200c is multiple. The second sub-hollow part 200c penetrates the first sub-layer 210 and the second sub-layer 220. The part of the first metal layer 120 filled in the second sub-hollow part 200c can be connected with the circumferential sidewall of the second sub-hollow part 200c.

[0041] With reference to Figure 8 and Figure 9 , the second hollow part 200a includes the first sub-hollow part 200b and the second sub-hollow part 200c. The first sub-hollow part 200b penetrates the first sub-layer 210, and the second sub-hollow part 200c penetrates the first sub-layer 210 and the second sub-layer 220. In this way, the connection effect of the first metal layer 120 and the source-drain layer 200 can be improved by setting the shallow hole and the deep hole in the source-drain layer 200 respectively.

[0042] It can be understood that, compared with the scheme that the second hollow part 200a includes the first sub-hollow part 200b or the scheme that the second hollow part 200a includes the second sub-hollow part 200c, the scheme that the second hollow part 200a includes the first sub-hollow part 200b and the second sub-hollow part 200c has a better connection effect of the first metal layer 120 and the source-drain layer 200. However, compared with the scheme that no hollow part is provided in the related art, the scheme that the second hollow part 200a includes the first sub-hollow part 200b or the scheme that the second hollow part 200a includes the second sub-hollow part 200c can also improve the connection effect of the first metal layer 120 and the source-drain layer 200. Therefore, in the process of implementing the scheme provided in the embodiments of the present application, the specific type and number of the second hollow part 200a can be flexibly selected according to actual needs.

[0043] Reference is made to Figure 8 and Figure 9 In some embodiments, the portion of the source-drain layer 200 opposite to the first hollow part 111 in the first connecting area 100b is divided into a plurality of first sub-areas 200d. Each first sub-area 200d is provided with a first sub-hollow part 200b and a second sub-hollow part 200c.

[0044] In other words, in some embodiments, the portion of the source-drain layer 200 opposite to the first hollow part 111 in the first connecting area 100b is divided into a plurality of first sub-areas 200d. For example, the plurality of first sub-areas 200d includes a first sub-area, a second sub-area, a third sub-area, and so on. The first sub-area is respectively provided with a shallow hole and a deep hole, the second sub-area is respectively provided with a shallow hole and a deep hole, the third sub-area is respectively provided with a shallow hole and a deep hole, and so on.

[0045] In the case that one of the first sub-layer 210 and the second sub-layer 220 is subjected to a greater stress, the other layer can be in a better connecting state with the first metal layer 120. For example, reference is made to Figure 8 In the case that the first sub-layer 210 is subjected to a greater horizontal stress, the portion of the first metal layer 120 located in the via of the second sub-layer 220 can be in a better connecting state with the second sub-layer 220. Further, since each first sub-area 200d is provided with a shallow hole and a deep hole, in the case that the connecting portion between the first metal layer 120 of the first touch trace layer 100 and the source-drain layer 200 is subjected to a stress in a single direction, the first metal layer 120 and the source-drain layer 200 in each first sub-area 200d can be reliably connected, so as to further reduce the possibility of delamination of the first metal layer 120 and the source-drain layer 200.

[0046] Reference is made to Figure 8 and Figure 9 In some embodiments, each first sub-area 200d is arranged in sequence along a direction from one side of the first connecting area 100b to the opposite side. In this way, the portion of the source-drain layer 200 opposite to the first hollow part 111 can be divided into a plurality of first sub-areas 200d along a direction from one side of the first connecting area 100b to the opposite side, and a shallow hole only penetrating the first sub-layer 210 and a deep hole penetrating the first sub-layer 210 and the second sub-layer 220 are respectively arranged in each first sub-area 200d, so as to improve the connection firmness between the first metal layer 120 of the first touch trace layer 100 and the source-drain layer 200.

[0047] Reference is made to Figure 8 and Figure 9In some embodiments, the first sub-hollow part 200b and the second sub-hollow part 200c are staggered in a direction perpendicular to the arrangement direction of each first sub-region 200d. In this way, in the direction perpendicular to the arrangement direction of each first sub-region 200d, there are "shallow holes" only penetrating the first sub-layer 210 and "deep holes" penetrating the first sub-layer 210 and the second sub-layer 220 staggered, thereby improving the connection firmness between the first metal layer 120 of the first touch trace layer 100 and the source-drain layer 200.

[0048] Reference is made to Figure 8 and Figure 9 In some embodiments, the size specification of the first sub-hollow part 200b and the size specification of the second sub-hollow part 200c of each first sub-region 200d are the same. In this way, in the case of stress on the display module 1, the stress can be evenly offset by the part of the first metal layer 120 embedded in the first sub-hollow part 200b and the second sub-hollow part 200c, thereby improving the connection firmness between the first metal layer 120 of the first touch trace layer 100 and the source-drain layer 200.

[0049] Reference is made to Figures 1 to 3 In some embodiments, the display area 100a, the first connection area 100b, the flexible bending area 100c, the second connection area 100d, and the touch chip setting area 100e of the display module 1 are arranged in sequence. In other words, the display module 1 is divided into the display area 100a, the first connection area 100b, the flexible bending area 100c, the second connection area 100d, and the touch chip setting area 100e arranged in sequence.

[0050] It should be noted that the display area 100a of the display module 1 refers to the area where the display module 1 displays a picture. The touch chip setting area 100e refers to the area of the display module 1 where the touch integrated circuit (IC) chip is arranged. In addition, in the case where the display module 1 includes a display integrated circuit (IC) chip, the display integrated circuit chip is also arranged in the touch chip setting area 100e. For example, the display module 1 includes a display panel and a flexible circuit board 400 connected together. For example, the touch integrated circuit chip and the display integrated circuit chip can be arranged on the flexible circuit board 400. The flexible circuit board 400 is connected with a board-to-board (BTB) connector, and in the case where the display module 1 is arranged on an electronic device, the display module 1 can be connected with the circuit board (e.g. mainboard) of the electronic device through the board-to-board connector.

[0051] The first touch wiring layer 100 is arranged in the display area 100a. In some embodiments, the first touch wiring layer 100 further comprises a second metal layer 130 in addition to the first insulating layer 110 and the first metal layer 120. In the display area 100a, the first insulating layer 110 is arranged between the first metal layer 120 and the second metal layer 130. In this way, the first metal layer 120 and the second metal layer 130 form two plates of a capacitor respectively, and the first insulating layer 110 forms a dielectric layer between the two plates of the capacitor. Thus, the first insulating layer 110, the first metal layer 120 and the second metal layer 130 collectively form a capacitive touch panel.

[0052] The first metal layer 120 extends to the first connecting area 100b. The source-drain layer 200 is arranged in the first connecting area 100b, the flexible bending area 100c, the second connecting area 100d and the touch chip arrangement area 100e. In this way, the signal of the first touch wiring layer 100 can be transmitted to the touch chip arrangement area 100e through the first metal layer 120 by connecting the first metal layer 120 with the part of the source-drain layer 200 arranged in the first connecting area 100b. Further, in the case that the display module 1 is arranged in an electronic device, the touch chip arrangement area 100e can be connected with a circuit board (e.g. a mainboard) of the electronic device, so that the signal of the first touch wiring layer 100 can be transmitted to the circuit board of the electronic device.

[0053] In order to reduce the size of the display module 1 along the length direction, with reference to Figure 1 In the case that the display module 1 is assembled in an electronic device, the display module 1 is bent at the flexible bending area 100c to form a C-shaped structure, so that the touch chip arrangement area 100e of the display module 1 is located at the back of the display area 100a of the display module 1. Thus, the flexible bending area 100c of the display module 1 needs to be convenient for bending. In the embodiments of the present application, the following solutions can be used to improve the convenience of bending of the flexible bending area 100c of the display module 1.

[0054] In some embodiments, the display module 1 further comprises a second touch wiring layer 300. The second touch wiring layer 300 is arranged in the touch chip arrangement area 100e, and the second touch wiring layer 300 comprises a third metal layer 320 extending to the second connecting area 100d.

[0055] In the first connection area 100b, the first metal layer 120 is at least partially covered on the first hollow part 111 and the second hollow part 200a, so that the first metal layer 120 is connected with the source-drain layer 200. Further, in some embodiments, in the second connection area 100d, the source-drain layer 200 is connected with the third metal layer 320. In this way, the first metal layer 120 is connected with the third metal layer 320 extending from the touch chip setting area 100e to the second connection area 100d through the source-drain layer 200. Thus, the signal of the first touch wiring layer 100 is transmitted to the touch chip setting area 100e. Further, the signal of the first touch wiring layer 100 is transmitted to the mainboard of the electronic device through the connection between the touch chip setting area 100e and the mainboard of the electronic device.

[0056] In other words, the first touch wiring layer 100 is arranged in the display area 100a, extends to the first connection area 100b, and is connected with the source-drain layer 200 in the first connection area 100b. The second touch wiring layer 300 is arranged in the touch chip setting area 100e, extends to the second connection area 100d, and is connected with the source-drain layer 200 in the second connection area 100d. In this way, the touch wiring layer is not arranged in the flexible bending area 100c, so that the problem that the hardness of the flexible bending area 100c is too high to be bent due to the arrangement of the touch wiring layer in the flexible bending area 100c can be avoided. That is, the touch wiring layer is "broken" in the flexible bending area 100c, and is divided into the first touch wiring layer 100 and the second touch wiring layer 300. Thus, the hardness of the flexible bending area 100c of the display module 1 is reduced by not arranging the touch wiring layer in the flexible bending area 100c, so that the flexible bending area 100c of the display module 1 is convenient to bend.

[0057] Further, since the touch wiring layer is "broken" in the flexible bending area 100c, the first metal layer 120 of the first touch wiring layer 100 is connected with the third metal layer 320 of the second touch wiring layer 300 located in the touch chip setting area 100e through the source-drain layer 200 in the first connection area 100b and the second connection area 100d, so that the signal of the first touch wiring layer 100 is transmitted to the touch chip setting area 100e. Further, the signal of the first touch wiring layer 100 is transmitted to the mainboard of the electronic device through the connection between the touch chip setting area 100e and the mainboard of the electronic device.

[0058] In some embodiments, the second touch trace layer 300 further comprises a second insulating layer 310. In the second connection area 100d, the second insulating layer 310, the first sub-layer 210 and the second sub-layer 220 are sequentially stacked, and the second insulating layer 310 is provided with a third hollow part 311. The source-drain layer 200 is provided with a fourth hollow part 200e at a position opposite to the third hollow part 311. The third metal layer 320 covers one side of the second insulating layer 310 and the source-drain layer 200; wherein the third metal layer 320 at least partially covers the third hollow part 311 and the fourth hollow part 200e, so that the third metal layer 320 is connected with the source-drain layer 200.

[0059] In this way, similar to the connection scheme that the first metal layer 120 of the first touch trace layer 100 is connected with the source-drain layer 200 at the first connection area 100b, the source-drain layer 200 is provided with the fourth hollow part 200e at the position in the second connection area 100d, and the third metal layer 320 of the second touch trace layer 300 extends to the position in the second connection area 100d and covers one side of the combination of the second insulating layer 310 and the source-drain layer 200, specifically covers the surface of the combination provided with the third hollow part 311 and the fourth hollow part 200e. Thus, the third metal layer 320 of the second touch trace layer 300 is filled in the third hollow part 311 and the fourth hollow part 200e, so that the third metal layer 320 of the second touch trace layer 300 is not only connected with the surface of the source-drain layer 200 facing the third hollow part 311, but also connected with the position of the source-drain layer 200 where the fourth hollow part 200e is opened.

[0060] In the case that the connection position between the third metal layer 320 of the second touch trace layer 300 and the source-drain layer 200 is subjected to stress in a single direction, the connection position between the third metal layer 320 of the second touch trace layer 300 and the source-drain layer 200 is not easy to separate, so that the connection firmness of the third metal layer 320 of the second touch trace layer 300 and the source-drain layer 200 can be improved. Thus, the product reliability of the display module can be improved.

[0061] In some embodiments, the second touch trace layer 300 further comprises a fourth metal layer 330. In the touch chip setting area 100e, the second insulating layer 310 is arranged between the third metal layer 320 and the fourth metal layer 330.

[0062] In some embodiments, the source-drain layer 200 opposite to the third hollow part 311 in the second connection area 100d of the display module 1 is provided with a plurality of fourth hollow parts 200e. The fourth hollow parts 200e include third sub-hollow parts 200f and / or fourth sub-hollow parts 200g. The third sub-hollow parts 200f penetrate the first sub-layer 210, and the fourth sub-hollow parts 200g penetrate the first sub-layer 210 and the second sub-layer 220. It should be noted that the third sub-hollow parts 200f only penetrate the first sub-layer 210, which can be referred to as "shallow holes" provided in the source-drain layer 200, and the fourth sub-hollow parts 200g penetrate the first sub-layer 210 and the second sub-layer 220, which can be referred to as "deep holes" provided in the source-drain layer 200.

[0063] In some embodiments, the source-drain layer 200 opposite to the third hollow part 311 in the second connection area 100d is divided into a plurality of second sub-areas. Each second sub-area is provided with a third sub-hollow part 200f and a fourth sub-hollow part 200g.

[0064] In other words, in some embodiments, the source-drain layer 200 opposite to the third hollow part 311 in the second connection area 100d is divided into a plurality of second sub-areas. For example, the plurality of second sub-areas include a first second sub-area, a second second sub-area, a third second sub-area, and so on. The first second sub-area is respectively provided with a shallow hole and a deep hole, the second second sub-area is respectively provided with a shallow hole and a deep hole, the third second sub-area is respectively provided with a shallow hole and a deep hole, and so on. In this way, when one of the first sub-layer 210 and the second sub-layer 220 is subjected to a greater stress, the other layer can be in a better connection state with the third metal layer 320.

[0065] In some embodiments, each second sub-area is arranged in sequence along a direction from one side of the second connection area 100d to the opposite side. In this way, the source-drain layer 200 opposite to the third hollow part 311 can be divided into a plurality of second sub-areas along a direction from one side of the second connection area 100d to the opposite side, and a "shallow hole" penetrating only the first sub-layer 210 and a "deep hole" penetrating the first sub-layer 210 and the second sub-layer 220 can be respectively arranged in each second sub-area, thereby improving the connection firmness between the third metal layer 320 of the second touch wiring layer 300 and the source-drain layer 200.

[0066] In some embodiments, the third sub-hollowed part 200f and the fourth sub-hollowed part 200g are staggered in the direction perpendicular to the arrangement direction of each second sub-region. In this way, in the direction perpendicular to the arrangement direction of each second sub-region, there are "shallow holes" only penetrating the first sub-layer 210 and "deep holes" penetrating the first sub-layer 210 and the second sub-layer 220 staggered, thereby improving the connection firmness between the third metal layer 320 of the second touch trace layer 300 and the source-drain layer 200.

[0067] In some embodiments, the size specification of the third sub-hollowed part 200f and the size specification of the fourth sub-hollowed part 200g of each second sub-region are the same. In this way, in the case that the display module 1 is stressed, the stress can be evenly offset by the parts of the third metal layer 320 embedded in the third sub-hollowed part 200f and the fourth sub-hollowed part 200g, thereby improving the connection firmness between the third metal layer 320 of the second touch trace layer 300 and the source-drain layer 200.

[0068] Reference Figure 2 and Figure 3 In some embodiments, the source-drain layer 200 further comprises a third sub-layer 230. The third sub-layer 230 is arranged on the side of the second sub-layer 220 away from the first sub-layer 210. In the flexible bending area 100c, the second sub-layer 220 is provided with an intermittent area, and the two parts of the second sub-layer 220 are connected through the third sub-layer 230.

[0069] Exemplarily, in the process of manufacturing the display module 1, the source-drain layer 200 can be manufactured first, and then the second hollowed part 200a can be processed at the part of the source-drain layer 200 located in the first connecting area 100b and the fourth hollowed part 200e can be processed at the part of the source-drain layer 200 located in the second connecting area 100d by implementing etching process on the source-drain layer 200.

[0070] Further, the deposition process can be performed on the side of the source-drain layer 200 where the second hollow part 200a and the fourth hollow part 200e are formed. The first insulating layer 110 and the second insulating layer 310 can be formed on the side of the source-drain layer 200 where the second hollow part 200a and the fourth hollow part 200e are formed by the deposition process. The first insulating layer 110 is not deposited on the region of the source-drain layer 200 where the second hollow part 200a is formed, and the second insulating layer 310 is not deposited on the region of the source-drain layer 200 where the fourth hollow part 200e is formed. Further, the deposition process can be performed on the combination of the source-drain layer 200, the first insulating layer 110 and the second insulating layer 310, so that the first metal layer 120 and the fourth metal layer 330 are formed on the surface of the combination of the source-drain layer 200, the first insulating layer 110 and the second insulating layer 310. The region of the combination of the source-drain layer 200, the first insulating layer 110 and the second insulating layer 310 located in the flexible bending area 100c is neither deposited with the insulating layer nor deposited with the metal layer, so that the bending convenience of the flexible bending area 100c is improved.

[0071] The electronic device provided by the embodiment of the present application includes a frame and any one of the display modules 1 provided by the embodiment of the present application. In the case that the electronic device is a mobile phone, the frame is a mobile phone middle frame. The display module 1 is connected with the mobile phone middle frame. Of course, in other embodiments, the electronic device can also be a tablet computer or the like, which will not be listed one by one here.

[0072] It should be noted that, in this document, the terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device.

[0073] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made thereto without departing from the principles and spirit of the embodiments of the present application, and the scope of the embodiments of the present application is defined by the appended claims and their equivalents.

Claims

1. A display module, characterized by The display module comprises: a first touch wire layer (100) and a source-drain layer (200); the first touch wire layer (100) comprises a first insulating layer (110) and a first metal layer (120); the source-drain layer (200) comprises a first sub-layer (210) and a second sub-layer (220) arranged in layers; in the first connecting area (100b) of the display module, the first insulating layer (110), the first sub-layer (210) and the second sub-layer (220) are arranged in layers in sequence, the first insulating layer (110) is provided with a first hollow part (111), the part of the source-drain layer (200) opposite to the first hollow part (111) is provided with a second hollow part (200a), and the first metal layer (120) is arranged on one side of the first insulating layer (110) and the source-drain layer (200), wherein the first metal layer (120) is at least partially arranged on the first hollow part (111) and the second hollow part (200a) so that the first metal layer (120) is connected with the source-drain layer (200).

2. The display module of claim 1, wherein, the second hollow part (200a) comprises a first sub-hollow part (200b) and / or a second sub-hollow part (200c); the first sub-hollow part (200b) penetrates the first sub-layer (210), and the second sub-hollow part (200c) penetrates the first sub-layer (210) and the second sub-layer (220).

3. The display module of claim 2, wherein, in the first connecting area (100b), the part of the source-drain layer (200) opposite to the first hollow part (111) is divided into a plurality of first sub-areas (200d), and each first sub-area (200d) is provided with the first sub-hollow part (200b) and the second sub-hollow part (200c).

4. The display module of claim 3, wherein, each first sub-area (200d) is arranged in sequence along a direction from one side of the first connecting area (100b) to the opposite side.

5. The display module of claim 4, wherein, in a direction perpendicular to the arrangement direction of each first sub-area (200d), the first sub-hollow part (200b) and the second sub-hollow part (200c) are arranged alternately.

6. The display module of claim 3, wherein, the size specification of the first sub-hollow part (200b) and the size specification of the second sub-hollow part (200c) of each first sub-area (200d) are the same.

7. The display module of any one of claims 1 to 6, wherein, the display area (100a), the first connecting area (100b), the flexible bending area (100c), the second connecting area (100d) and the touch chip setting area (100e) of the display module are arranged in sequence; the first touch wire layer (100) is arranged in the display area (100a), and the first metal layer (120) extends to the first connecting area (100b); the source-drain layer (200) is located in the first connecting area (100b), the flexible bending area (100c), the second connecting area (100d) and the touch chip setting area (100e).

8. The display module of claim 7, wherein, The display module further comprises a second touch wire layer (300); the second touch wire layer (300) is arranged in the touch chip arrangement area (100e), and the second touch wire layer (300) comprises a third metal layer (320), and the third metal layer (320) extends to the second connecting area (100d); In the second connecting area (100d), the source-drain layer (200) is connected with the third metal layer (320), so that the first metal layer (120) is connected with the third metal layer (320) through the source-drain layer (200).

9. The display module of claim 8, wherein, The second touch wire layer (300) further comprises a second insulating layer (310); In the second connecting area (100d), the second insulating layer (310), the first sub-layer (210) and the second sub-layer (220) are sequentially laminated, the second insulating layer (310) is provided with a third hollow part (311), the part opposite to the third hollow part (311) of the source-drain layer (200) is provided with a fourth hollow part (200e), and the third metal layer (320) covers one side of the second insulating layer (310) and the source-drain layer (200), wherein the third metal layer (320) covers at least part of the third hollow part (311) and the fourth hollow part (200e), so that the third metal layer (320) is connected with the source-drain layer (200).

10. An electronic device, comprising: Comprise: The frame and the display module according to any one of claims 1 to 9.

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