A reflow soldering apparatus having a loading port gate

Abstract

The application discloses a reflow soldering equipment with a loading port door lock, and relates to the technical field of reflow soldering equipment, which comprises a cavity bottom plate, a plurality of circular mounting holes are formed in the top end of the cavity bottom plate, a loading port door lock mechanism is arranged on one side of the cavity bottom plate, a transition cavity mechanism is arranged at the top end of one side of the loading port door lock mechanism, a thimble lifting mechanism matched with the transition cavity mechanism is arranged at the bottom end of the circular mounting hole close to the loading port door lock mechanism, a sealing disc body assembly matched with the transition cavity mechanism is arranged at the top end of the thimble lifting mechanism, a nitrogen filling and oxygen discharging assembly is arranged at one end of one side of the top end of the transition cavity mechanism, and an automatic pressure adjusting device is arranged at one side of the middle of the nitrogen filling and oxygen discharging assembly. The application is suitable for the loading port of large and super-large process cavities in a high-vacuum oxygen-free environment, and compared with similar products, has the characteristics of reducing the cost of semiconductor manufacturing, simple structure, strong adaptability and easy maintenance.

Description

Technical Field

[0001] This invention relates to the field of reflow soldering equipment, and more specifically, to a reflow soldering device with a loading port gate. Background Technology

[0002] Reflow soldering is a common process for soldering surface mount components onto printed circuit boards. Its basic principle is to achieve a reliable connection between electronic components and printed circuit boards by heating solder paste to a liquid state within a predetermined temperature and time range. This technology is widely used in the electronics manufacturing industry, especially in semiconductor manufacturing. In the traditional semiconductor manufacturing process, wafer handling has always been a technical challenge. Wafers need to go through multiple processing steps during manufacturing, such as wafer transfer and reflow soldering. The handling between these steps needs to be extremely precise to prevent damage or contamination of the wafers. However, because wafers are extremely thin and susceptible to contamination, traditional mechanical handling systems struggle to meet the requirements of high precision and high stability.

[0003] With the continuous advancement of semiconductor technology, the requirements for the speed and efficiency of wafer processing are becoming increasingly stringent. However, traditional manufacturing technologies often sacrifice precision and cleanliness when increasing processing speed, or reduce processing speed when maintaining high precision and cleanliness. This difficulty in striking a balance limits the overall efficiency of semiconductor manufacturing. Modern semiconductor manufacturing increasingly relies on complex system integration and automation technologies. Each processing step requires precise control and seamless integration, which places high demands on system design and management. Traditional technologies have many limitations in system integration and automation, and cannot meet the complexity and diversity of modern semiconductor manufacturing needs.

[0004] Semiconductor manufacturing is a process that requires extremely high cleanliness and precise environmental control. Any tiny dust particles or chemical contamination can damage the microstructure on the wafer, thereby affecting the performance of semiconductor devices. In traditional technologies, although clean rooms and other control measures are used, it is still difficult to completely avoid the risk of contamination during wafer transport and reflow soldering. At the same time, semiconductor manufacturing not only requires high precision and high efficiency, but also needs to consider cost and sustainability. With the rapid development of the semiconductor industry, how to control costs while ensuring manufacturing quality, and how to achieve more environmentally friendly and sustainable production methods, have become important issues facing the industry.

[0005] No effective solutions have yet been proposed to address the problems in the relevant technologies. Summary of the Invention

[0006] In view of the problems in the related technologies, the present invention proposes a reflow soldering equipment with a loading port gate to overcome the above-mentioned technical problems existing in the existing related technologies.

[0007] Therefore, the specific technical solution adopted by the present invention is as follows:

[0008] A reflow soldering machine with a loading port gate includes a cavity base plate. The top of the cavity base plate has several circular mounting holes. A loading port gate mechanism is provided on one side of the cavity base plate. A transition cavity mechanism is provided at the top of one side of the loading port gate mechanism. A pin lifting mechanism that cooperates with the transition cavity mechanism is provided at the bottom of the circular mounting holes near the loading port gate mechanism. A sealing disc assembly that cooperates with the transition cavity mechanism is provided at the top of the pin lifting mechanism. A nitrogen filling and oxygen venting assembly is provided at one end of the top of the transition cavity mechanism. An automatic pressure regulating device is provided on one side of the middle of the nitrogen filling and oxygen venting assembly.

[0009] Furthermore, in order to ensure the safe loading and unloading of wafers, maintain a suitable reflow soldering environment, and ensure the stability of the entire reflow soldering process, the loading port gate mechanism includes a vacuum slit valve located on one side of the cavity bottom plate. The top of the vacuum slit valve is provided with a slit valve mounting seat that connects to the transition cavity mechanism. A slit valve loading port that cooperates with the transition cavity mechanism is opened through the top of one side of the slit valve mounting seat. A gate lifting column is provided through the middle of the top of the vacuum slit valve. A slit valve gate that cooperates with the slit valve mounting seat is provided at the top of the gate lifting column.

[0010] Furthermore, to provide a safe and stable transport and processing environment for the wafer, precisely control the gas environment within the transition cavity body, and ensure the quality of the wafer throughout the reflow soldering process, the transition cavity mechanism includes a transition cavity body located at the top of one side of the loading port gate mechanism. The bottom of the transition cavity body has a circular lifting port that cooperates with the ejector pin lifting mechanism. One side of the transition cavity body has a cavity loading port that cooperates with the loading port gate mechanism. A cavity observation window is located in the middle of the top of the transition cavity body. A rectangular cavity hole is located on one side of the top of the transition cavity body, and a cavity cover plate is located at the top of the rectangular cavity hole. A VCR connector is inserted through one end of the other side of the top of the transition cavity body. A gas expansion component is located at the bottom of the VCR connector to control the gas environment within the transition cavity body. To ensure wafer quality during reflow soldering, the gas expansion assembly includes an acceleration tube located at the bottom of the VCR connector. The inner diameter of the acceleration tube in the middle is smaller than the inner diameters at the top and bottom. An acceleration nozzle is located on the inner side of the middle of the acceleration tube, and a tapered opening is located on one side of the bottom of the acceleration tube. An L-shaped connecting tube is located at the bottom of the acceleration tube, and an annular diffusion tube is located at one end of the L-shaped connecting tube. A diffusion channel connected to the L-shaped connecting tube is opened on the inner side of the annular diffusion tube. An annular baffle connected to the outer side of the annular diffusion tube is located inside the diffusion channel, and the top of the annular baffle is set with an arc structure. The diffusion channel is divided into an inlet channel and an outlet channel by the annular baffle. The inner diameter of the inlet channel gradually increases from bottom to top, and the inner diameter of the outlet channel gradually decreases from top to bottom. An annular diffusion port is formed between the outlet channel and the top of the annular baffle.

[0011] Furthermore, to achieve vertical lifting of the ejector pin, thereby driving the sealing disc assembly to move and form a leak-free dynamic seal with the transition cavity mechanism, providing an effective and reliable reflow soldering environment, the ejector pin lifting mechanism includes a top plate seat located at the bottom of a circular mounting hole near the loading port gate mechanism. Symmetrically arranged on both sides of the bottom of the top plate seat are I-shaped side supports, and a circular support plate is located at the bottom of the I-shaped side supports. Several thin cylinders are threaded through the bottom of the circular support plate. Symmetrically arranged on both sides of the top of the circular support plate are I-shaped main slide rails that mate with the top plate seat. A sliding support block is located on one side of the I-shaped main slide rail, and a corrugated tube assembly that mates with the sealing disc assembly is located at the top of the sliding support block. The corrugated tube assembly includes a bellows base located at the top of the sliding support block. A motor base is located at the bottom of the tube base, and a stepper motor is located at the bottom of the motor base. A photoelectric sensor connected to the motor base is located on one side of the stepper motor. The output shaft of the stepper motor passes through the top of the motor base and is equipped with a pin mounting block. A pin slider is located at one end of the pin mounting block. A lifting sensor plate that cooperates with the photoelectric sensor is located on one side of the pin mounting block. A guide rail bracket that cooperates with the pin slider is located at the top of the motor base. A first corrugated tube connected to the sealing disc assembly is located at the top of the corrugated tube base. A circular pin plate connected to the top of the pin mounting block is located on the inner side of the corrugated tube base. A second corrugated tube connected to the sealing disc assembly is located on the outer side of the top of the circular pin plate. Several pins that penetrate the sealing disc assembly are located at the center of the top of the circular pin plate.

[0012] Furthermore, in order to ensure that the transition cavity mechanism is isolated from the external environment during reflow soldering, prevent contaminants from entering, and protect the wafer from external influences, the sealing disk assembly includes a sealing disk body set at the top of the ejector pin lifting mechanism. The top of the sealing disk body is provided with several limiting blocks, a vacuum channel is opened at the top of the sealing disk body, and several limiting grooves that cooperate with the transition cavity mechanism are opened on the outer side of the top of the sealing disk body.

[0013] Furthermore, in order to maintain an ideal reflow soldering environment by venting oxygen and purging nitrogen, the nitrogen purging and oxygen venting assembly includes an exhaust flange on one end of the top of the transition cavity mechanism, an exhaust duct connected to an automatic pressure regulating device at the top of the exhaust flange, two exhaust holes at the bottom outer side of the exhaust duct, and a high vacuum valve at the top of the exhaust duct.

[0014] The beneficial effects of this invention are as follows:

[0015] 1. Improve the stability and reliability of the wafer reflow soldering transfer mechanism: By setting up a loading port gate mechanism, a transition cavity mechanism, and a ejector pin lifting mechanism, this invention achieves precise control and stable handling of the wafer. The synergistic effect of these mechanisms ensures accurate positioning and smooth transfer of the wafer throughout the entire process, greatly improving the efficiency of the process. This stability and reliability are particularly critical for high-precision semiconductor manufacturing, as any tiny error can lead to wafer damage or quality degradation. At the same time, by improving the wafer transfer stability, the scrap rate can be effectively reduced, improving the efficiency and output quality of the entire production process. In addition, this improvement also helps to reduce equipment failures and maintenance needs, thereby extending equipment life and reducing maintenance costs.

[0016] 2. Reduce the overall cost of semiconductor manufacturing: The invention features a simple and easy-to-maintain design, which not only reduces the initial investment cost of the equipment but also reduces maintenance costs during long-term operation. At the same time, the simplified design means fewer complex components and a lower failure rate, thereby reducing downtime and maintenance costs. In addition, the high versatility of this design allows the reflow soldering equipment to easily adapt to different production needs and environments, increasing the application scope and flexibility of reflow soldering equipment in the semiconductor manufacturing industry and reducing the overall operating cost of semiconductor manufacturing.

[0017] 3. Ensuring the independence and continuity of the process: The unique working principle of this invention ensures that the transfer of new wafers does not interfere with the wafer fabrication operations already underway in the process chamber. This independence is crucial for maintaining the continuity and efficiency of the production line. At the same time, by avoiding interference with ongoing processes, this invention ensures the efficient operation of the production line and reduces downtime caused by equipment adjustments or waiting for new wafer transfers. In addition, this design helps maintain environmental stability within the process chamber, maintaining the precise control conditions required in semiconductor manufacturing, and ensuring the quality and consistency of the final product. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a reflow soldering equipment with a loading port gate according to an embodiment of the present invention;

[0020] Figure 2 This is a cross-sectional view of a reflow soldering apparatus with a loading port gate according to an embodiment of the present invention;

[0021] Figure 3 This is a partial structural schematic diagram of a reflow soldering equipment with a loading port gate according to an embodiment of the present invention;

[0022] Figure 4 This is a partial structural schematic diagram of a reflow soldering equipment with a loading port gate according to an embodiment of the present invention from another angle;

[0023] Figure 5 This is a partial structural schematic diagram of the loading port gate mechanism in a reflow soldering equipment with a loading port gate according to an embodiment of the present invention;

[0024] Figure 6 This is a partial structural schematic diagram of the transition cavity mechanism in a reflow soldering equipment with a loading port gate according to an embodiment of the present invention;

[0025] Figure 7 This is a partial structural schematic diagram of a gas expansion assembly in a reflow soldering equipment with a loading port gate according to an embodiment of the present invention;

[0026] Figure 8 yes Figure 7 A magnified view of a section at point A in the middle;

[0027] Figure 9 This is a schematic diagram of the ejector pin lifting mechanism in a reflow soldering equipment with a loading port gate according to an embodiment of the present invention;

[0028] Figure 10 This is a partial structural schematic diagram of the ejector pin lifting mechanism in a reflow soldering equipment with a loading port gate according to an embodiment of the present invention;

[0029] Figure 11 yes Figure 10 A magnified view of a section at point B in the middle;

[0030] Figure 12 This is a partial structural schematic diagram of a sealing disc assembly in a reflow soldering apparatus with a loading port gate according to an embodiment of the present invention.

[0031] In the picture:

[0032] 1. Cavity base plate; 2. Circular mounting hole; 3. Loading port gate mechanism; 301. Vacuum valve; 302. Valve mounting seat; 303. Valve loading port; 304. Gate lifting column; 305. Valve gate; 4. Transition cavity mechanism; 401. Transition cavity body; 402. Circular lifting port; 403. Cavity loading port; 404. Cavity observation window; 405. Cavity rectangular hole; 406. Cavity cover plate; 407 408. VCR connector; 408. Gas expansion assembly; 4081. Acceleration tube; 4082. Acceleration nozzle; 4083. Conical inlet; 4084. L-shaped connecting tube; 4085. Annular diffuser; 40851. Diffusion channel; 40852. Annular baffle; 40853. Inlet channel; 40854. Outlet channel; 40855. Annular diffuser port; 5. Pin lifting mechanism; 501. Top plate seat; 502. 503. I-shaped side bracket; 504. Circular support plate; 505. Thin cylinder; 506. I-shaped main slide rail; 507. Sliding support block; 508. Corrugated tube assembly; 509. Corrugated tube base; 5001. Motor base; 5002. Stepper motor; 5003. Photoelectric sensor; 5004. Ejector pin mounting block; 5005. Ejector pin slider; 5006. Lifting sensor plate; 50077. Guide rail bracket; 50078. 50710. Bellows 1; 50711. Circular ejector plate; 50712. Bellows 2; 50713. Ejector; 6. Sealing disc assembly; 601. Sealing disc body; 602. Limiting block; 603. Vacuum channel; 604. Limiting groove; 7. Nitrogen filling and oxygen degassing assembly; 701. Top cover exhaust flange; 702. Exhaust duct; 703. Exhaust port; 704. High vacuum valve; 8. Automatic pressure regulating device; 9. Transmission finger. Detailed Implementation

[0033] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these drawings, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the drawings are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0034] According to an embodiment of the present invention, a reflow soldering apparatus having a loading port gate is provided.

[0035] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments, such as... Figures 1-12As shown, the reflow soldering equipment with a loading port gate according to an embodiment of the present invention includes a cavity base plate 1. The top of the cavity base plate 1 is provided with a plurality of circular mounting holes 2. A loading port gate mechanism 3 is provided on one side of the cavity base plate 1. A transition cavity mechanism 4 is provided at the top of one side of the loading port gate mechanism 3. A pin lifting mechanism 5 that cooperates with the transition cavity mechanism 4 is provided at the bottom of the circular mounting holes 2 near the loading port gate mechanism 3. A sealing disc assembly 6 that cooperates with the transition cavity mechanism 4 is provided at the top of the pin lifting mechanism 5. A nitrogen filling and oxygen venting assembly 7 is provided at one end of one side of the top of the transition cavity mechanism 4. An automatic pressure regulating device 8 is provided on one side of the middle part of the nitrogen filling and oxygen venting assembly 7.

[0036] Furthermore, it should be noted that the automatic pressure regulating device 8 consists of a high-precision differential pressure measuring device (in this embodiment, a Pitot tube) and a valve device precisely positioned by a servo motor. Since the compression of the waveform tube assembly 507 in the pin lifting mechanism 5 causes a change in the volume within the transition cavity mechanism 4, and gas is more easily compressed than liquid, if the opening and closing angle of the exhaust port does not change in time, the gas pressure will fluctuate significantly. The function of the automatic pressure regulating device 8 is to address this situation, ensuring that the fluctuations in the transition cavity mechanism 4 are within a controllable range, minimizing and stabilizing the extreme values ​​of peaks and troughs. The differential pressure measuring device in the automatic pressure regulating device 8 linearly displays the pressure difference between the transition cavity mechanism 4 and atmospheric pressure by outputting current or voltage. Then, it determines the opening and closing angle of the valve via communication using a PID software algorithm. Subsequently, the servo motor drives the valve to rotate to the relative position, ensuring the stability of the pressure within the transition cavity mechanism 4. This is existing technology and will not be elaborated upon further here.

[0037] In one embodiment, the loading port gate mechanism 3 includes a vacuum slot valve 301 disposed on one side of the cavity base plate 1. The top of the vacuum slot valve 301 is provided with a slot valve mounting seat 302 connected to the transition cavity mechanism 4 (in addition, in specific applications, the vacuum slot valve 301 and the slot valve mounting seat 302 are connected by bolts, and the two are sealed by an annular sealing ring). The top of one side of the slot valve mounting seat 302 is provided with a slot valve loading port 303 that cooperates with the transition cavity mechanism 4. The top center of the vacuum slot valve 301 is provided with a gate lifting column 304, and the top of the gate lifting column 304 is provided with a slot valve gate 305 that cooperates with the slot valve mounting seat 302 (in addition, in specific applications, the inner side of the slot valve mounting seat 302 is provided with a guide rail that cooperates with the slot valve gate 305), thereby realizing the safe entry and exit of wafers, maintaining a suitable reflow soldering environment, and ensuring the stability of the entire reflow soldering process.

[0038] In addition, it should be noted that the vacuum valve 301 is equipped with a transmission unit and a control unit. The transmission unit is a motor or pneumatic device, which can achieve rapid response and precise control, and is used to provide power for the lifting of the gate bollard 304. The control system consists of sensors and controllers, which are used to accurately monitor and adjust the lifting height of the valve gate 305 through the gate bollard 304. This is existing technology and will not be elaborated on here.

[0039] The working principle of the loading port gate mechanism 3 is as follows: First, the vacuum slit valve 301 ensures a static seal between the front-end delivery port and the transition cavity mechanism 4 without leakage. The slit valve gate 305 and the slit valve mounting seat 302 achieve a sealing structure through an annular sealing ring, and the slit valve mounting seat 302 and the transition cavity mechanism 4 also achieve a seal through an annular sealing ring, ensuring stable sealing inside the cavity. Simultaneously, the vacuum slit valve 301 employs a high-efficiency transmission system, enabling rapid response and precise control. With the cooperation of the slit valve mounting seat 302 and the slit valve gate 305, the vacuum slit valve 301 can... The lifting and lowering of the top gate lifting column 304 is controlled to control the lifting and lowering of the slot valve gate 305. When the slot valve gate 305 is lowered to the bottom, the loading port gate mechanism 3 opens from the closed state. At this time, the wafer carrier can be placed into the transition cavity mechanism 4 through the wafer transfer finger 9. When the slot valve gate 305 is raised to the top, the loading port gate mechanism 3 changes from the open state to the closed state. The precise movement of the loading port gate mechanism 3 tightly compresses the annular sealing ring. At this time, a sealed vacuum is formed inside the transition cavity mechanism 4, realizing the function of static sealing without leakage, and reflow soldering can be performed.

[0040] In one embodiment, for the transition cavity mechanism 4 and the nitrogen filling and oxygen venting assembly 7, the transition cavity mechanism 4 includes a transition cavity body 401 disposed at the top of one side of the loading port gate mechanism 3. The bottom end of the transition cavity body 401 has a circular lifting port 402 that cooperates with the ejector pin lifting mechanism 5. One side of the transition cavity body 401 has a cavity loading port 403 that cooperates with the loading port gate mechanism 3. A cavity observation window 404 is disposed at the center of the top of the transition cavity body 401, and a cavity observation window 404 is provided on one side of the top of the transition cavity body 401. A rectangular cavity hole 405 is provided, and a cavity cover plate 406 is provided at the top of the rectangular cavity hole 405. A VCR connector 407 is provided through one end of the other side of the top of the transition cavity body 401. A gas expansion component 408 is provided at the bottom of the VCR connector 407 to control the gas environment inside the transition cavity body 401 to ensure the quality of the wafer during the reflow soldering process. The gas expansion component 408 includes an acceleration tube 4081 provided at the bottom of the VCR connector 407, and the inner diameter of the middle part of the acceleration tube 4081 is smaller than the inner diameter of the top and bottom ends. An accelerating nozzle 4082 is provided on the inner side of the middle part of the accelerating tube 4081 (in addition, in specific applications, the inner diameter of the accelerating nozzle 4082 is smaller than the inner diameter of the middle part of the accelerating tube 4081). A tapered opening 4083 is provided on one side of the bottom of the accelerating tube 4081. An L-shaped connecting tube 4084 is provided at the bottom end of the accelerating tube 4081. An annular diffuser 4085 is provided at one end of the L-shaped connecting tube 4084. A diffusion channel 40851 connected to the L-shaped connecting tube 4084 is opened on the inner side of the annular diffuser 4085. The diffusion channel 40851 is connected to the L-shaped connecting tube 4084. An annular baffle 40852 is provided inside the 51 and is connected to the outside of the annular diffuser 4085. The top of the annular baffle 40852 is set as an arc structure. The diffuser channel 40851 is divided into an air inlet channel 40853 and an air outlet channel 40854 by the annular baffle 40852. The inner diameter of the air inlet channel 40853 gradually increases from bottom to top, and the inner diameter of the air outlet channel 40854 gradually decreases from top to bottom. An annular diffuser 40855 is formed between the air outlet channel 40854 and the top of the annular baffle 40852.The nitrogen filling and oxygen removal assembly 7 includes an upper cover exhaust flange 701 located at one end of the top of the transition cavity mechanism 4. An exhaust duct 702 connected to the automatic pressure regulating device 8 is located at the top of the upper cover exhaust flange 701 (in practical applications, the exhaust duct 702, the upper cover exhaust flange 701, and the automatic pressure regulating device 8 are statically sealed by an annular sealing ring and sealing silicone grease). Two exhaust holes 703 are located on the outer bottom of the exhaust duct 702 (in practical applications, one of the exhaust holes 703 contains an air separation membrane). A high-vacuum valve 704 is located at the top of the exhaust duct 702 (in practical applications, the high-vacuum valve 704 and the automatic pressure regulating device 8 are statically sealed by a sealing strip and sealing silicone grease). This provides a safe and stable transport and processing environment for the wafer, maintaining an ideal reflow soldering environment by venting oxygen and filling with nitrogen, ensuring the quality of the wafer throughout the reflow soldering process.

[0041] The working principle of the transition cavity mechanism 4 and the nitrogen filling and oxygen removal assembly 7 is as follows: A circular lifting port 402 is opened at the bottom of the transition cavity body 401, which cooperates with the ejector pin lifting mechanism 5 to ensure accurate positioning and stable handling of the wafer. The cavity loading port 403 is connected to the loading port gate mechanism 3 to realize smooth wafer transfer. The cavity observation window 404 allows operators to monitor the status of the wafer in the transition cavity to ensure the normal operation of the process. The VCR connector 407 and the gas expansion assembly 408 work together to regulate and control the gas environment in the transition cavity. At the same time, when nitrogen is introduced into the gas... After the expansion component 408, the gas first enters the acceleration nozzle 4082 through the acceleration pipe 4081. Due to Bernoulli's principle, the gas velocity increases after entering the low-pressure acceleration nozzle 4082, thus forming a high-speed airflow that is ejected from the acceleration nozzle 4082 and enters the L-shaped connecting pipe 4084. At this time, the low-speed air introduced from the outside of the conical orifice 4083 is mixed with nitrogen under the entrainment of the high-speed airflow and then enters the annular diffuser 4085 through the L-shaped connecting pipe 4084. Then, the airflow entering the diffusion channel 40851 diffuses in the intake channel 40853 and exits from the intake channel 40851. The nitrogen gas flows from the bottom of the small inner diameter of the inlet channel 40853 to the top of the large inner diameter of the inlet channel 40853, and is finally squeezed out from the annular diffuser 40855 through the outlet channel 40854. When the airflow is squeezed out, due to Bernoulli's principle, the gas flowing out of the outlet channel 40854, which has a smaller inner diameter, will be accelerated a second time due to the decrease in pressure. This further accelerates the diffusion speed of the nitrogen gas squeezed out from the annular diffuser 40855 in the transition cavity mechanism 4, ensuring that the introduced nitrogen gas is rapidly and uniformly distributed in the transition cavity mechanism 4. Then, because the density of nitrogen gas is less than that of air, the nitrogen gas will pass through the transition cavity mechanism 4. The bottom of the cavity mechanism 4 begins to rise, forcing the air in the transition cavity mechanism 4 out through the exhaust pipe 702 of the nitrogen filling and oxygen removal component 7, thereby improving the efficiency of nitrogen filling and oxygen removal and reducing the PPM value of oxygen in the environment. In addition, the exhaust port 703 utilizes the different permeation and diffusion rates of oxygen and nitrogen in the air separation membrane to achieve the enrichment and venting of oxygen in the sealed disc component 6, while nitrogen permeates through the membrane wall at a relatively slow rate and is enriched in the membrane, further reducing the PPM value of oxygen in the environment. This precisely controls the gas environment in the transition cavity and ensures the quality of the wafer throughout the reflow soldering process.

[0042] In one embodiment, for the pin lifting mechanism 5 and the sealing disc assembly 6, the pin lifting mechanism 5 includes a top plate seat 501 disposed at the bottom end of the circular mounting hole 2 near the loading port gate mechanism 3. I-shaped side supports 502 are symmetrically arranged on both sides of the bottom end of the top plate seat 501. A circular support plate 503 is disposed at the bottom end of the I-shaped side supports 502 (in addition, in specific applications, the top plate seat 501, the I-shaped side supports 502, and the circular support plate 503 are all connected by bolts). A plurality of thin cylinders 504 are threaded through the bottom end of the circular support plate 503 (in addition, in specific applications, the thin cylinders 504 are connected to the circular support plate 503 by bolts). The top of the circular support plate 503 is symmetrically provided with I-shaped main slide rails 505 that cooperate with the top plate seat 501. A sliding support block 506 is provided on one side of the I-shaped main slide rail 505. The top of the sliding support block 506 is provided with a corrugated tube assembly 507 that cooperates with the sealing disc assembly 6. The corrugated tube assembly 507 includes a corrugated tube base 5071 provided at the top of the sliding support block 506. A motor base 5072 is provided at the bottom of the corrugated tube base 5071 (in addition, in specific applications, the motor base 5072 and the corrugated tube base 5071 are connected by bolts). A stepper motor 5073 is provided at the bottom of the motor base 5072. A photoelectric sensor 5074 connected to the motor base 5072 is provided on one side of stepper motor 5073. The output shaft of stepper motor 5073 passes through the top of motor base 5072 and is provided with a pin mounting block 5075. A pin slider 5076 is provided at one end of pin mounting block 5075. A lifting sensor plate 5077 cooperating with photoelectric sensor 5074 is provided on one side of pin mounting block 5075. A guide rail bracket 5078 cooperating with pin slider 5076 is provided at the top of motor base 5072. A bellows 5079 connected to sealing disc assembly 6 is provided at the top of bellows base 5071. (In addition, in specific applications, bellows 5079...) The top and bottom are respectively connected to the sealing disc assembly 6 and the bellows base 5071, and internal static sealing is achieved through an annular sealing ring. A circular ejector plate 50710 connected to the top of the ejector mounting block 5075 is provided on the inner side of the bellows base 5071. A bellows 50711 connected to the sealing disc assembly 6 is provided on the outer side of the top of the circular ejector plate 50710. Several ejector pins 50712 penetrating the sealing disc assembly 6 are provided in the middle of the top of the circular ejector plate 50710. (In addition, in specific applications, the ejector pins 50712 and the circular ejector plate 50710 are connected by adjusting screws and sealed with sealing silicone grease through an annular sealing ring.)The sealing disc assembly 6 includes a sealing disc body 601 disposed at the top of the ejector pin lifting mechanism 5. Several limiting blocks 602 are provided at the top of the sealing disc body 601. A vacuum channel 603 is opened at the top of the sealing disc body 601. Several limiting grooves 604, which cooperate with the transition cavity mechanism 4, are opened on the outer side of the top of the sealing disc body 601 (in addition, in specific applications, an annular sealing ring that cooperates with the transition cavity mechanism 4 is provided in the limiting grooves 604). This achieves a leak-free dynamic seal between the sealing disc assembly 6 and the transition cavity mechanism 4 through the vertical lifting of the ejector pin lifting mechanism 5, providing an effective and reliable reflow soldering environment.

[0043] The working principle of the ejector pin lifting mechanism 5 and the sealing disk assembly 6 is as follows: First, the ejector pin lifting mechanism 5, consisting of the top plate seat 501, the I-shaped side bracket 502, and the circular support plate 503, forms a stable support and fixing structure, providing support and positioning functions to ensure precise position control of the wafer during transport. The circular support plate 503 and the thin cylinder 504 work together. The thin cylinder 504, in motion, drives the bellows base 5071 upward, thereby driving the ejector pin 50712 fixed on the bellows base 5071 to move upward, achieving a tight seal with the transition cavity mechanism 4. The design of the I-shaped main slide rail 505 and the sliding support block 506 provides a smooth and stable sliding mechanism to adapt to the dynamic adjustment of the wafer during transport. Simultaneously, the bellows assembly 5... The bellows base 5071, motor base 5072, stepper motor 5073, and photoelectric sensor 5074 in component 07 together constitute the power and control center of the ejector pin lifting mechanism 5. The coordinated work of these components ensures the precise movement and response speed of the ejector pin. Then, the ejector pin mounting block 5075, ejector pin slider 5076, and lifting sensor 5077, together with the photoelectric sensor 5074, realize the precise monitoring and adjustment of the ejector pin position. In addition, the lifting of the ejector pin 50712 drives the lifting of the sealing disk assembly 6, thereby stably supporting and accurately positioning the wafer. The bellows 5079, bellows 50711, and circular ejector pin plate 50710 cooperate with each other to achieve effective connection with the sealing disk assembly 6, ensuring sealing and stability during the ejector pin lifting process.

[0044] The limiting groove 604 in the sealing disc assembly 6 forms a double-layer stepped structure on the outer edge of the sealing disc body 601. The annular sealing ring is set in the limiting groove 604. The limiting groove 604 and the bottom of the transition cavity mechanism 4 form two sealing structures. This structure of matching concave and convex grooves makes the smooth sealing gap become tortuous, increases the flow resistance, and improves the sealing efficiency.

[0045] To facilitate understanding of the above technical solutions of the present invention, the working principle or operation method of the present invention in actual process will be described in detail below.

[0046] In practical applications, before the wafer is fed by the transfer finger 9 at the front-end interface, all components are in their zero-position state; the first step is that the sealing disc assembly 6 rises from the low position to the high position, forming a static plane seal with the transition cavity mechanism 4 (the working principle of the sealing disc assembly 6 is as described above); the second step is that the loading port gate mechanism 3 opens from the closed state (the working principle of the loading port gate mechanism 3 is as described above), and the wafer enters the transition cavity mechanism 4 through the transfer finger 9 (the working principle of the transition cavity mechanism 4 is as described above); the third step is that the ejector pin lifting mechanism 5... The wafer is lifted from the low position to the high position and picked up from the transfer finger 9 (the working principle of the ejector pin lifting mechanism 5 is as described above); in the fourth step, the transfer finger 9 leaves the transition cavity mechanism 4, and the loading port gate mechanism 3 changes from the open state to the closed state; in the fifth step, the ejector pin lifting mechanism 5 descends from the high position to the low position, opening the vacuum on the upper surface of the sealing disk assembly 6 to reach the required vacuum value; in the sixth step, the transition cavity mechanism 4 is evacuated by the nitrogen filling and oxygen purging assembly 7 (the working principle of the nitrogen filling and oxygen purging assembly 7 is as described above), and after reaching a certain value, high-purity nitrogen gas is started to be filled. After a certain delay, the oxygen content analyzer is activated to monitor the oxygen concentration of the transition cavity mechanism 4 in real time. In the seventh step, when the oxygen concentration of the transition cavity mechanism 4 matches the requirements of the process cavity, the nitrogen purging pipeline is closed. During this period, the automatic pressure regulating device 8 adjusts the gas pressure of the transition cavity mechanism 4 in real time. The difference between the pressure value measured by the pitot tube in the exhaust pipe 702 and the detected ambient pressure is used to determine the opening and closing angle of the air valve based on the PID software algorithm. Subsequently, the servo motor drives the air valve to rotate to the relative position to ensure the transition cavity mechanism... 4. Stable and controllable internal pressure; Step 8: The sealing disk assembly 6 is lowered from a high position to a low position to release the vacuum used to adsorb the wafer and prevent it from drifting; Step 9: The ejector pin lifting mechanism 5 is raised from a low position to a high position, waiting for the wafer transfer fingers 9 of the process cavity to pick up the wafer; Step 9: After the wafer transfer fingers 9 pick up the wafer, the ejector pin lifting mechanism 5 is lowered from a high position to a low position. Through this process, the wafer enters the transition cavity mechanism 4 from the front-end module, without affecting the environment inside the transition cavity mechanism 4, ensuring the stability and consistency of the process, and ensuring a high yield in semiconductor manufacturing.

[0047] In summary, by employing the above-mentioned technical solution of this invention, and by setting the loading port gate mechanism 3, the transition cavity mechanism 4, and the ejector pin lifting mechanism 5, this invention achieves precise control and stable handling of wafers. Simultaneously, by improving the wafer transport stability, it can effectively reduce the scrap rate, improve the efficiency and output quality of the entire production process. Furthermore, this improvement also helps reduce equipment failures and maintenance needs, thereby extending equipment life and reducing maintenance costs. The invention features a simple and easy-to-maintain structure, reducing not only the initial investment cost of the equipment but also long-term maintenance costs. The simplified design means fewer complex components and a lower failure rate, thus reducing downtime and maintenance costs. This highly adaptable design allows the reflow soldering equipment to easily adapt to different production needs and environments. This invention expands the application scope and flexibility of reflow soldering equipment in the semiconductor manufacturing industry, reducing the overall operating costs of semiconductor manufacturing. Its unique working principle ensures that the transfer of new wafers does not interfere with ongoing wafer fabrication operations within the process chamber; this independence is crucial for maintaining production line continuity and efficiency. Simultaneously, by avoiding interference with ongoing processes, this invention ensures efficient production line operation, reducing downtime caused by equipment adjustments or waiting for new wafer transfers. This design also helps maintain environmental stability within the process chamber, preserving the precise control conditions required in semiconductor manufacturing, and ensuring the quality and consistency of the final product. The synergistic effect of these mechanisms ensures accurate wafer positioning and smooth transfer throughout the reflow soldering process, significantly improving its efficiency.

[0048] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "setting," "connection," "fixing," "screw connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A reflow soldering apparatus with a loading port gate, comprising a cavity base plate (1), characterized in that, The top of the cavity bottom plate (1) is provided with several circular mounting holes (2). A loading port gate mechanism (3) is provided on one side of the cavity bottom plate (1). A transition cavity mechanism (4) is provided on the top of one side of the loading port gate mechanism (3). A pin lifting mechanism (5) that cooperates with the transition cavity mechanism (4) is provided at the bottom of the circular mounting holes (2) near the loading port gate mechanism (3). A sealing disc assembly (6) that cooperates with the transition cavity mechanism (4) is provided at the top of the pin lifting mechanism (5). A nitrogen filling and oxygen venting assembly (7) is provided at one end of the top of the transition cavity mechanism (4). An automatic pressure regulating device (8) is provided on one side of the middle of the nitrogen filling and oxygen venting assembly (7). The transition cavity mechanism (4) includes a transition cavity body (401) located at the top of one side of the loading port gate mechanism (3). The bottom end of the transition cavity body (401) has a circular lifting port (402) that cooperates with the ejector pin lifting mechanism (5). One side of the transition cavity body (401) has a cavity loading port (403) that cooperates with the loading port gate mechanism (3). A cavity observation window (40) is located at the center of the top of the transition cavity body (401). 4) A rectangular cavity hole (405) is provided on one side of the top end of the transition cavity body (401). A cavity cover plate (406) is provided at the top end of the rectangular cavity hole (405). A VCR connector (407) is provided through one end of the other side of the top end of the transition cavity body (401). A gas expansion component (408) is provided at the bottom end of the VCR connector (407) to control the gas environment inside the transition cavity body (401) to ensure the quality of the wafer during the reflow soldering process. The gas expansion assembly (408) includes an acceleration tube (4081) disposed at the bottom end of the VCR connector (407), wherein the inner diameter of the middle part of the acceleration tube (4081) is smaller than the inner diameter of the top and bottom ends, an acceleration nozzle (4082) is disposed on the inner side of the middle part of the acceleration tube (4081), a tapered mouth (4083) is disposed on one side of the bottom of the acceleration tube (4081), an L-shaped connecting tube (4084) is disposed at the bottom end of the acceleration tube (4081), and an annular diffuser (4085) is disposed at one end of the L-shaped connecting tube (4084). The annular diffuser tube (4085) has a diffuser channel (40851) connected to the L-shaped connecting tube (4084) on its inner side. The diffuser channel (40851) has an annular baffle (40852) connected to the outer side of the annular diffuser tube (4085) inside, and the top of the annular baffle (40852) is set as an arc structure. The diffusion channel (40851) is divided into an air inlet channel (40853) and an air outlet channel (40854) by the annular baffle (40852). The inner diameter of the air inlet channel (40853) gradually increases from bottom to top, and the inner diameter of the air outlet channel (40854) gradually decreases from top to bottom. An annular diffuser (40855) is formed between the top of the air outlet channel (40854) and the top of the annular baffle (40852).

2. The reflow soldering equipment with a loading port gate according to claim 1, characterized in that, The loading port gate mechanism (3) includes a vacuum slit valve (301) disposed on one side of the cavity bottom plate (1). The top of the vacuum slit valve (301) is provided with a slit valve mounting seat (302) connected to the transition cavity mechanism (4). A slit valve loading port (303) cooperating with the transition cavity mechanism (4) is provided through the top of one side of the slit valve mounting seat (302). A gate lifting column (304) is provided through the middle of the top of the vacuum slit valve (301). A slit valve gate (305) cooperating with the slit valve mounting seat (302) is provided at the top of the gate lifting column (304).

3. A reflow soldering equipment with a loading port gate according to claim 1, characterized in that, The pin lifting mechanism (5) includes a top plate seat (501) located at the bottom of the circular mounting hole (2) near the loading port gate mechanism (3). The bottom of the top plate seat (501) is symmetrically provided with I-shaped side brackets (502). The bottom of the I-shaped side brackets (502) is provided with a circular support plate (503). The bottom of the circular support plate (503) is provided with a plurality of thin cylinders (504). The top of the circular support plate (503) is symmetrically provided with I-shaped main slide rails (505) that cooperate with the top plate seat (501). The side of the I-shaped main slide rail (505) is provided with a sliding support block (506). The top of the sliding support block (506) is provided with a wave tube assembly (507) that cooperates with the sealing disc assembly (6).

4. A reflow soldering equipment with a loading port gate according to claim 3, characterized in that, The corrugated tube assembly (507) includes a corrugated tube base (5071) disposed at the top of the sliding support block (506). A motor mount (5072) is disposed at the bottom end of the corrugated tube base (5071), and a stepper motor (5073) is disposed at the bottom end of the motor mount (5072). A photoelectric sensor (5074) connected to the motor mount (5072) is disposed on one side of the stepper motor (5073). The output shaft of the motor base (5072) passes through the top end of the motor base (5072) and is provided with a pin mounting block (5075). One end of the pin mounting block (5075) is provided with a pin slider (5076). One side of the pin mounting block (5075) is provided with a lifting sensor (5077) that cooperates with the photoelectric sensor (5074). The top end of the motor base (5072) is provided with a guide rail bracket (5078) that cooperates with the pin slider (5076). The top of the corrugated base (5071) is provided with a corrugated pipe one (5079) connected to the sealing disc assembly (6). The inner side of the corrugated base (5071) is provided with a circular ejector plate (50710) connected to the top of the ejector mounting block (5075). The outer side of the top of the circular ejector plate (50710) is provided with a corrugated pipe two (50711) connected to the sealing disc assembly (6). The middle of the top of the circular ejector plate (50710) is provided with a plurality of ejectors (50712) that penetrate the sealing disc assembly (6).

5. A reflow soldering equipment with a loading port gate according to claim 1, characterized in that, The sealing disc assembly (6) includes a sealing disc body (601) disposed at the top of the ejector pin lifting mechanism (5). The top of the sealing disc body (601) is provided with several limiting blocks (602). The top of the sealing disc body (601) is provided with a vacuum channel (603). The outer side of the top of the sealing disc body (601) is provided with several limiting grooves (604) that cooperate with the transition cavity mechanism (4).

6. A reflow soldering equipment with a loading port gate according to claim 1, characterized in that, The nitrogen filling and oxygen depletion assembly (7) includes an upper cover exhaust flange (701) disposed at one end of the top side of the transition cavity mechanism (4). The top of the upper cover exhaust flange (701) is provided with an exhaust pipe (702) connected to the automatic pressure regulating device (8). The bottom outer side of the exhaust pipe (702) is provided with two exhaust holes (703). The top of the exhaust pipe (702) is provided with a high vacuum valve (704).

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