Chip test socket and test method thereof

Abstract

The invention discloses a chip test socket and a test method thereof, and relates to the technical field of chip aging tests.The chip test socket comprises an openable temperature control gland and a bearing base, the temperature control gland comprises a cooling base and a plurality of temperature sensors arranged at intervals, a to-be-tested chip is placed on the bearing base, the cooling base abuts against the upper end face of the to-be-tested chip, and the temperature sensors are arranged on the cooling base; the temperature sensor penetrates through the cooling seat and then abuts against the upper end face of the to-be-tested chip, and a heat source used for heating the to-be-tested chip is arranged on the bearing base. The plurality of temperature sensors arranged at intervals can perform temperature measurement on a plurality of temperature measurement points of the chip to be tested, the heat dissipation efficiency and the heat dissipation effect are improved through the heat dissipation base and the cooling base which are arranged in a combined mode, the aging test automation degree is high, the aging test stability is good, and the test precision is high.

Description

Technical Field

[0001] This application relates to the field of chip aging test technology, and in particular to a chip test socket and its test method. Background Technology

[0002] High-temperature aging tests on chips can, on the one hand, force devices to withstand loads and improve their reliability under high heat and humidity environments; on the other hand, chip endurance tests can detect early chip failures, which can be used for product classification to verify and screen high-quality products.

[0003] The prior art discloses a high-temperature aging test socket for on-chip chips (CN115856584A). The socket includes a base and a temperature-controlled cover. The base is used to mount the on-chip chip, and the temperature-controlled cover is used to control the operating temperature of the on-chip chip. The temperature-controlled cover includes a ball bearing, a temperature sensor, a cover body, a handle, a heat sink, a chip clamp, a fan, a heating rod, a hook, a threaded ring, and a temperature control switch. This test socket only has one temperature sensor, which can only collect data from one temperature measurement point of the chip under test. When the temperature of the heat source or the test environment is uneven, the reliability of the data based on a single temperature measurement point is insufficient. Furthermore, the existing test socket uses air cooling for heat dissipation, which cannot quickly dissipate the heat generated by the chip, resulting in poor heat dissipation. Summary of the Invention

[0004] Purpose of the invention: This application provides a chip test socket and its testing method, aiming to improve the technical problems of poor heat dissipation and insufficient temperature measurement points.

[0005] Technical solution: This application provides a chip test socket and its testing method, including an openable temperature-controlled cover and a support base. The temperature-controlled cover includes a cooling seat and a plurality of temperature sensors spaced apart. A chip under test is placed on the support base. The cooling seat abuts against the upper surface of the chip under test. The temperature sensors pass through the cooling seat and abut against the upper surface of the chip under test. A heat source for heating the chip under test is provided on the support base.

[0006] By adopting the above technical solution and using multiple temperature sensors spaced apart, it is possible to simultaneously measure the temperature at multiple temperature measurement points on the chip under test. The cooling base that is set against the chip under test improves heat dissipation efficiency and heat dissipation uniformity.

[0007] Furthermore, the temperature control cover also includes an end cap, a housing, and a heat sink disposed within the housing. The end cap is disposed on top of the housing, and a threaded ring is installed on the lower part of the end cap. The threaded ring is threadedly connected to the housing. The heat sink has a cavity inside, and the cooling seat is embedded in the cavity. The cooling seat is provided with an annular cooling pipe, and coolant flows through the annular cooling pipe.

[0008] By adopting the above technical solution, the end cap is connected to the housing through a threaded ring, and the position between the cooling base and the chip under test can be adjusted by rotating the end cap. The water cooling heat dissipation effect is good, and the combination of the cooling base and the heat sink improves the heat dissipation efficiency.

[0009] Furthermore, the bottom end of the threaded ring abuts against the upper surface of the heat sink, the end cap has a handle, and the heat sink is composed of multiple heat-conducting plates connected sequentially from top to bottom. The heat-conducting plates are made of one or more combinations of graphene plates, aluminum alloy plates, and copper plates with good thermal conductivity. A thermally conductive silicone layer is filled between two adjacent heat-conducting plates. Multiple buffers are provided on the uppermost heat-conducting plate, the upper end of which extends into the housing, and a spring is provided on the buffer.

[0010] By adopting the above technical solution, a heat-conducting plate with good heat dissipation effect is used to improve the heat dissipation effect and efficiency. The spring in the buffer component is located between the heat sink and the shell, and is used to provide buffering and protection between the heat sink and the shell when the end cover is screwed on.

[0011] Furthermore, the cooling base is also provided with a soft protective cover layer, which is attached to the bottom of the cooling base. The soft protective cover layer is made of soft silicone sheet, and the bottom wall thickness of the soft protective cover layer is 1-5mm. The soft protective cover layer abuts against the chip under test.

[0012] By adopting the above technical solution, the soft silicone sheet attached to the bottom of the cooling base not only has high thermal conductivity, but also has the characteristics of being soft and elastic. When the cooling base comes into contact with the chip under test, it is used to protect the chip under test and prevent the cooling base from hard collision with the chip under test.

[0013] Furthermore, the support base includes a support seat, an aging test board, and a base plate. The support seat has an installation opening in the middle, and a frame is embedded in the installation opening. The aging test board is set in the frame, and limiting plates are respectively provided on the four sides of the upper surface of the aging test board. The chip under test is placed on the aging test board between the four limiting plates, and the base plate is fixed to the lower part of the support seat.

[0014] By adopting the above technical solution, the support base is used as the test stage for the chip under test, the frame and the limiting plate are used for limiting, and the aging test board is used for information exchange with the chip tester.

[0015] Furthermore, each of the limiting plates is provided with a guide rod, and the upper part of the bearing seat is also provided with a guide post. The guide rod and the guide post are slidably connected to the temperature control cover. The lower end face of the aging test plate is also provided with multiple PIN pins. The PIN pins pass downward through the base plate and are used to connect to the chip tester.

[0016] By adopting the above technical solution, the guide rod and guide column correspond one-to-one with the guide holes on the temperature control cover, which is used for the stable and precise movement of the temperature control cover when it moves downward. The chip tester, as the host computer, mainly plays the role of parameter setting and control, and the test socket is connected to it through PIN pins.

[0017] Furthermore, the housing is provided with at least two side pressure covers, which are symmetrically and oppositely arranged on both sides of the housing. Each side pressure cover includes a cover body with a hook at the bottom and a pin that passes through the cover body and the housing respectively, forming a pivot connection between the cover body and the housing. A spring is also sleeved in the middle of the pin, and the spring is located between the cover body and the housing. The side pressure cover is used to snap the temperature control cover and the support base together.

[0018] By adopting the above technical solution, the side pressure cover is used to fix the temperature control pressure cover and the support base, so that the two can fit tightly together during the test, providing a good test environment for aging test.

[0019] Furthermore, a chip testing method includes the following steps: 1) Open the side cover to separate the temperature control cover from the carrier base, place the chip under test on the corresponding position on the aging test board, and finally reset the temperature control cover to press the chip under test in place to form a sealed test environment. 2) The chip tester initializes the test parameters and settings, and the environmental components detect the environmental conditions at the location of the chip under test and feed back the information to the chip tester through the aging test board; 3) The chip tester loads preset parameters based on the current environmental information, the heat source starts to heat the test environment, the environmental components detect the current environmental information in real time, and when the preset parameters are reached, the aging test board applies the set working voltage to the chip under test and exchanges information. 4. Synchronously, apply the operating voltage to the chip at high temperature, while providing clock signals and functional test vectors, so that the chip under test can simulate the actual working state as much as possible, continuously or periodically apply the input vector to the chip under test, and collect the output response of the chip under test. 5) Multiple temperature sensors are arranged at intervals to detect the temperature at multiple points on the chip under test. The chip tester adjusts the environmental parameters based on real-time environmental information to increase the ambient heat or reduce the ambient heat through the cooling pad. 6) After the preset aging test time is reached, first remove the electrical stress, then control the heat source and cooling base to slowly reduce the temperature of the test environment to a safe temperature, and finally open the side pressure cover, open the temperature control pressure cover, and remove the chip that has completed aging.

[0020] By adopting the above technical solutions, a highly automated aging test method is provided, which improves test efficiency and test accuracy.

[0021] Furthermore, the environmental component includes multiple temperature and humidity sensors respectively mounted on the limiting plate, with the multiple temperature and humidity sensors arranged in pairs around the chip under test, and the temperature and humidity sensors embedded in the limiting plate.

[0022] By adopting the above technical solution, the test environment is monitored in real time through environmental components and the information is fed back to the chip tester, which facilitates the chip tester to adjust the ambient temperature in a timely and automatic manner.

[0023] Furthermore, the temperature sensor is electrically connected to the chip tester. Each temperature sensor is equipped with a sleeve, which is installed on the upper surface of the cooling base. The temperature sensor passes through the middle of the sleeve, and the vertical position of the temperature sensor can be finely adjusted by rotating the sleeve.

[0024] By adopting the above technical solution, the temperature sensor can move inside the sleeve to adjust its vertical position.

[0025] In summary, this application includes at least one of the following beneficial technical effects: 1. Multiple temperature sensors spaced at intervals enable temperature measurement at multiple points on the chip under test, improving the stability and accuracy of the detection. 2. The cooling base is placed inside the heat sink. The heat sink made of heat-conducting plate improves the heat dissipation effect. The annular cooling pipe that circulates the coolant improves the cooling effect of the cooling base, further improving the heat dissipation efficiency and effect. 3. The highly automated testing methods, combined with the test sockets that have good heat dissipation, further improve the stability and accuracy of chip aging tests. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application; Figure 2 This is a cross-sectional view of an embodiment of this application; Figure 3 This is a schematic diagram of the disassembled state of an embodiment of this application; Figure 4 This is an exploded perspective view of an embodiment of this application.

[0027] Explanation of reference numerals in the attached drawings: 1. End cap; 11. Handle; 12. Threaded ring; 2. Housing; 21. Side pressure cap; 3. Heat sink; 31. Buffer; 4. Cooling seat; 41. Annular cooling pipe; 42. Soft protective cover layer; 5. Temperature sensor; 51. Sleeve; 6. Support base; 61. Support base; 62. Aging test board; 63. Base plate; 64. Frame; 65. Limiting plate; 66. PIN pin; 7. Chip under test. Detailed Implementation

[0028] The following is in conjunction with the appendix Figure 1 - Appendix Figure 4 This application will be described in further detail.

[0029] This application discloses a chip test socket and a testing method thereof. (Refer to...) Figure 1 As shown, the openable temperature-controlled cover and the carrier base 6 form a test socket. The test socket is connected to the host computer chip tester via the extended PIN pin 66. The chip under test 7 is placed on the carrier base 6 for testing. The temperature-controlled cover is placed on the carrier base 6 and the two are fixed by the side cover 21. The cooling seat 4 and multiple temperature sensors 5 passing through the cooling seat 4 abut against the chip under test 7. The chip tester provides parameter settings and control programs to realize automatic testing of the chip under test 7. During the test, the chip tester automatically adjusts the parameters of the test environment according to the implementation environment information provided by the environmental components. The water-cooled cooling seat 4 and the heat sink 3 with high heat dissipation effect improve heat dissipation efficiency and effect. The multiple temperature sensors 5 arranged at intervals can simultaneously measure the temperature of multiple points on the chip under test 7, improving the stability and accuracy of the aging test.

[0030] Reference Figures 1-4 As shown, the temperature control cover is located above the support base 6. The temperature control cover includes an end cap 1, a housing 2, a heat sink 3, and a cooling base 4. The end cap 1 has a handle 11 on one side, and a threaded ring 12 with external threads is provided at the lower end of the end cap 1. The bottom of the housing 2 rests on the support base 61, and a threaded hole with internal threads is provided in the middle of the housing 2. The threaded ring 12 is threadedly connected to the threaded hole. The heat sink 3 is located inside the housing 2. The heat sink 3 is composed of multiple heat-conducting plates arranged sequentially from top to bottom. Each heat-conducting plate has a rectangular opening in the middle. The rectangular openings on the multi-layer heat-conducting plates form a cavity. The cooling base 4 is placed in the cavity and extends through the cavity. The temperature sensor 5 passes through the cooling base 4 and extends out from the upper part of the cooling base 4. A sleeve 51 is installed on the upper end face of the cooling base 4. The threaded ring 12 A cavity is formed in the middle of the housing, and the terminal of the temperature sensor 5 extends out of the cavity. Buffers 31 are set at the four corners of the uppermost heat-conducting plate. The upper end of the buffer 31 extends into the housing 2 and the lower end extends into the heat-conducting plate. A spring is sleeved in the middle part. When in use, the end cover 1 is rotated by the handle 11. The end cover 1 drives the threaded ring 12 to rotate in the threaded hole. Based on the different movement paths when the threaded connection is forward and reversed, an upward or downward driving force is generated. When it moves downward, the threaded ring 12 presses on the heat sink 3 and moves downward, forcing the heat sink 3 to move downward synchronously. At this time, the cooling seat 4 and the temperature sensor 5 move downward synchronously until they press on the upper surface of the chip under test 7. When it moves upward, the end cover 1 reverses, the threaded ring 12 moves upward and the pressure on the heat sink 3 decreases, and the cooling seat 4 is separated from the chip under test 7.

[0031] Reference Figure 2As shown, the cooling base 4 is equipped with an annular cooling pipe 41, which has a coolant inlet and outlet on the housing 2. The bottom of the cooling base 4 is also equipped with a soft protective cover layer 42, which is a cover made of soft silicone sheet. When in use, the cover is fastened to the bottom of the cooling base 4 and reinforced. The soft protective cover layer 42 is used to provide protection when the cooling base 4 comes into contact with the chip under test 7. At least three temperature sensors 5 are arranged at intervals, each corresponding to a different temperature measuring point on the chip under test 7. The temperature sensors 5 can be adjusted by raising and lowering through the sleeve 51. Multiple heat-conducting plates are made of materials with good thermal conductivity, preferably graphene plates. The space between adjacent heat-conducting plates is filled with a thermally conductive silicone layer to improve the adhesion and thermal conductivity between the heat-conducting plates.

[0032] Reference Figure 2 , Figure 3 , Figure 4 As shown, the support base 6 includes a support base 61, an aging test board 62, and a base plate 63. The base plate 63 is installed at the lower part of the support base 61. The support base 61 has an opening in the middle, and a frame 64 is set inside the opening. The aging test board 62 is installed inside the frame 64. Limiting plates 65 are respectively set on the four sides of the upper surface of the aging test board 62. A guide rod is set on the upper surface of each limiting plate 65, and a temperature and humidity sensor is embedded inside it. The detection part of the temperature and humidity sensor extends out of the limiting plate 65 and faces the chip under test 7. The chip under test 7 is placed on the aging test board 62 between the four limiting plates 65. At least four PIN pins 66 extend from the lower surface of the aging test board 62. The PIN pins 66 pass downward through the base plate 63 and connect to the chip tester.

[0033] Reference Figure 1 , Figure 2 As shown, side pressure covers 21 are respectively provided on both sides of the housing 2. The side pressure cover 21 includes a cover body, a hook at the bottom of the cover body, and a pin that passes through the cover body and the housing 2 respectively, so that the cover body and the housing 2 form a pivot connection. A spring is also sleeved in the middle of the pin. The spring is located between the cover body and the housing 2. The side pressure cover 21 is used to snap the temperature control cover and the support base 6. Specifically, the hook is snapped onto the side of the support base 61 when in use.

[0034] The chip aging test method is implemented by the following steps: 1) Open the side pressure cover 21 to separate the temperature control pressure cover from the carrier base 6, and place the chip under test 7 on the corresponding position on the aging test board 62. Finally, reset the temperature control pressure cover to press the chip under test 7 in place to form a sealed test environment. 2) The chip tester initializes the test parameters and settings, and the environmental component detects the environmental conditions at the location of the chip under test 7 and feeds back the information to the chip tester through the aging test board 62; 3) The chip tester loads preset parameters based on the current environmental information, the heat source starts to heat the test environment, the environmental components detect the current environmental information in real time, and when the preset parameters are reached, the aging test board 62 applies the set working voltage to the chip under test 7 and exchanges information. 4. Synchronously, apply the operating voltage to the chip at high temperature, while providing clock signals and functional test vectors, so that the chip under test 7 can simulate the actual working state as much as possible, continuously or periodically apply the input vector to the chip under test 7, and collect the output response of the chip under test 7. 5) Multiple temperature sensors 5 are arranged at intervals to detect the temperature at multiple points on the chip 7 under test. The chip tester adjusts the environmental parameters based on real-time environmental information to increase the ambient heat or reduce the ambient heat through the cooling base 4. 6) After the preset aging test time is reached, first remove the electrical stress, then control the heat source and cooling base 4 to slowly reduce the temperature of the test environment to a safe temperature, and finally open the side pressure cover 21, open the temperature control pressure cover, and remove the chip that has completed aging.

[0035] The implementation principle of the chip test socket and its testing method in this application is as follows: First, rotate the end cover 1 in the reverse direction to move the cooling base 4 away from the aging test board 62. Then, loosen the side pressure cover 21 to open the temperature control cover and the support base 6. Place the chip to be tested 7 on the corresponding position of the aging test board 62. Then, align the guide post and guide rod with the guide holes on the heat sink 3 and the housing 2. Place the temperature control cover on the support base 6. Then, lock the temperature control cover and the support base 6 with the side pressure cover 21. Rotate the handle 11 to make the end cover 1 drive the threaded ring 12 to move, and synchronously drive the heat sink 3 to move downward until the cooling base 4 and the temperature sensor 5 come into contact with the chip to be tested 7. The chip tester loads a preset program, starts the heat source for heating, and the environmental components monitor the test environment in real time. When the test environment reaches the preset parameters, the aging test board 62 applies a working voltage to the chip at high temperature, while providing a clock signal and functional test vectors to make the chip under test 7 simulate the actual working state as much as possible. The input vector is continuously or periodically applied to the chip under test 7, and the output response of the chip under test 7 is collected. After the preset aging test time is reached, the electrical stress is removed first, and then the heat source and cooling base 4 are controlled to slowly reduce the temperature of the test environment to a safe temperature. Finally, the side pressure cover 21 is opened, the temperature control pressure cover is opened, and the chip that has completed aging is removed.

[0036] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A chip test socket, characterized in that: It includes an openable temperature-controlled cover and a support base (6). The temperature-controlled cover includes a cooling seat (4) and multiple temperature sensors (5) spaced apart. A chip to be tested (7) is placed on the support base (6). The cooling seat (4) abuts against the upper surface of the chip to be tested (7). The temperature sensors (5) pass through the cooling seat (4) and abut against the upper surface of the chip to be tested (7). The support base (6) is provided with a heat source for heating the chip to be tested (7).

2. The chip test socket according to claim 1, characterized in that: The temperature control cover also includes an end cap (1), a housing (2), and a heat sink (3) disposed in the housing (2). The end cap (1) is disposed above the housing (2). A threaded ring (12) is installed on the lower part of the end cap (1). The threaded ring (12) is threadedly connected to the housing (2). A cavity is opened inside the heat sink (3). The cooling seat (4) is embedded in the cavity. An annular cooling pipe (41) is provided on the cooling seat (4). Cooling liquid flows in the annular cooling pipe (41).

3. The chip test socket according to claim 2, characterized in that: The bottom end of the threaded ring (12) abuts against the upper surface of the heat sink (3). The end cap (1) has a handle (11). The heat sink (3) is composed of multiple heat-conducting plates connected sequentially from top to bottom. The heat-conducting plates are made of one or more of the following: graphene plates, aluminum alloy plates, and copper plates with good thermal conductivity. A thermally conductive silicone layer is filled between two adjacent heat-conducting plates. Multiple buffers (31) are provided on the uppermost heat-conducting plate. The upper end of the buffer (31) extends into the housing (2). A spring is provided on the buffer (31).

4. The chip test socket according to claim 2, characterized in that: The cooling base (4) is also provided with a soft protective cover layer (42), which is attached to the bottom of the cooling base (4). The soft protective cover layer (42) is made of soft silicone sheet, and the bottom wall thickness of the soft protective cover layer (42) is 1-5mm. The soft protective cover layer (42) abuts against the chip under test (7).

5. The chip test socket according to claim 1, characterized in that: The support base (6) includes a support base (61), an aging test board (62), and a base plate (63). The support base (61) has an installation opening in the middle, and a frame (64) is embedded in the installation opening. The aging test board (62) is set in the frame (64). Limiting plates (65) are respectively provided on the four sides of the upper surface of the aging test board (62). The chip to be tested (7) is placed on the aging test board (62) between the four limiting plates (65). The base plate (63) is fixed to the lower part of the support base (61).

6. The chip test socket according to claim 5, characterized in that: Each of the limiting plates (65) is provided with a guide rod, and the upper part of the bearing seat (61) is also provided with a guide post. The guide rod and the guide post are slidably connected to the temperature control cover. The lower end face of the aging test plate (62) is also provided with multiple PIN pins (66). The PIN pins (66) pass downward through the base plate (63). The PIN pins (66) are used to connect to the chip tester.

7. The chip test socket according to claim 2, characterized in that: The housing (2) is also provided with at least two side pressure covers (21). The two side pressure covers (21) are symmetrically and oppositely arranged on both sides of the housing (2). Each side pressure cover (21) includes a cover body, a hook at the bottom of the cover body, and a pin that passes through the cover body and the housing (2) respectively, so that the cover body and the housing (2) form a pivot connection. A spring is also sleeved in the middle of the pin. The spring is located between the cover body and the housing (2). The side pressure cover (21) is used to snap the temperature control cover and the support base (6).

8. A chip testing method, using the chip testing socket according to any one of claims 1-7, characterized in that: Includes the following steps: 1) Open the side cover (21) to separate the temperature control cover from the carrier base (6), and place the chip under test (7) on the aging test board (62) at the corresponding position. Finally, reset the temperature control cover to press down the chip under test (7) to form a sealed test environment. 2) The chip tester initializes the test parameters and settings, the environmental component detects the environmental conditions at the location of the chip under test (7), and feeds back the information to the chip tester through the aging test board (62); 3) The chip tester loads preset parameters based on the current environmental information, the heat source starts to heat the test environment, the environmental components detect the current environmental information in real time, and when the preset parameters are reached, the aging test board (62) applies the set working voltage and information interaction to the chip under test (7); Synchronously, the operating voltage is applied to the chip at high temperature, while providing clock signals and functional test vectors, so that the chip under test (7) can simulate the actual working state as much as possible, continuously or periodically apply the input vector to the chip under test (7), and collect the output response of the chip under test (7); 5) Multiple temperature sensors (5) are arranged at intervals to detect the temperature at multiple points on the chip (7) to be tested. The chip tester adjusts the environmental parameters based on real-time environmental information to increase the ambient heat or reduce the ambient heat through the cooling seat (4). 6) After the preset aging test time is reached, first remove the electrical stress, then control the heat source and cooling seat (4) to slowly reduce the temperature of the test environment to a safe temperature, and finally open the side pressure cover (21), open the temperature control pressure cover, and take away the chip that has completed aging.

9. The chip testing method according to claim 8, characterized in that: The environmental components include multiple temperature and humidity sensors mounted on a limiting plate (65), with the multiple temperature and humidity sensors arranged in pairs around the chip under test (7), and the temperature and humidity sensors embedded in the limiting plate (65).

10. The chip testing method according to claim 8, characterized in that: The temperature sensor (5) is electrically connected to the chip tester. Each temperature sensor (5) is provided with a sleeve (51). The sleeve (51) is installed on the upper end face of the cooling seat (4). The temperature sensor (5) passes through the middle of the sleeve (51). By rotating the sleeve (51), the vertical position of the temperature sensor (5) can be finely adjusted.

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