A BC battery photovoltaic module encapsulation apparatus

Abstract

The application belongs to the technical field of battery packaging devices, and discloses a BC battery photovoltaic module packaging equipment, which comprises a feeding frame, a turnover frame arranged on one side of the feeding frame, a packaging rack arranged on the side of the turnover frame away from the feeding frame, and a base arranged on the side of the packaging rack away from the feeding frame. The feeding frame is provided with a feeding assembly for conveying the assembled N-type silicon wafer and back silver electrode to the turnover frame. The back silver electrode is located on the top of the N-type silicon wafer. The turnover frame is provided with a turnover mechanism for overturning the N-type silicon wafer conveyed by the feeding assembly to the top of the packaging rack. The packaging rack is provided with a limiting assembly for limiting the N-type silicon wafer. The base is provided with a packaging assembly for packaging the N-type silicon wafer. The application reduces the probability of collision damage caused by the contact between the back silver electrode and the feeding assembly, and ensures the product quality.

Description

Technical Field

[0001] This invention relates to the field of battery packaging equipment technology, and in particular to a BC battery photovoltaic module packaging device. Background Technology

[0002] BC cells, short for back-contact cells, are a type of solar cell technology characterized by their electrodes located on the reverse side (back side) of the cell, leaving the front side fully exposed to sunlight. This design improves light absorption efficiency and reduces current transmission paths, lowering resistance and thus enhancing cell performance. BC cells are naturally suited for distributed photovoltaic applications, such as rooftop solar systems and building-integrated photovoltaics (BIPV). Their aesthetic appeal particularly aligns with the architectural style favored by markets like Europe, where black roofs are preferred. Furthermore, BC cells can be fabricated into flexible modules for use in vehicles, ships, satellites, and buildings with limited load-bearing capacity.

[0003] BC cells typically include essential components such as tempered glass, silicon oxide film, N-type silicon wafer, and back silver electrode. In the BC cell photovoltaic module encapsulation process, after the silicon oxide film, N-type silicon wafer, and back silver electrode are assembled, the final step is to press the tempered glass onto the top of the silicon oxide film. To automate the encapsulation process, conveyor rollers or conveyor belts are usually used to transport the assembled back silver electrode to the encapsulation station. However, the back silver electrode is relatively fragile. When the conveyor rollers or conveyor belts transport the assembled N-type silicon wafer, the back silver electrode at the bottom of the N-type silicon wafer is easily scratched by the conveyor rollers or conveyor belts, which can damage the back silver electrode and affect the structural integrity of the BC cell photovoltaic module. Therefore, it is necessary to improve the design of related technologies. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a BC battery photovoltaic module packaging device.

[0005] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a BC cell photovoltaic module encapsulation device, including a loading rack, a flipping rack disposed on one side of the loading rack, an encapsulation frame disposed on the side of the flipping rack away from the loading rack, and a base disposed on the side of the encapsulation frame away from the loading rack. The loading rack is provided with a loading component for conveying the assembled N-type silicon wafer and back silver electrode to the flipping rack. The back silver electrode is located on the top of the N-type silicon wafer. The flipping rack is provided with a flipping mechanism for flipping the N-type silicon wafer conveyed by the loading component to the top of the encapsulation frame. The encapsulation frame is provided with a limiting component for limiting the N-type silicon wafer. The base is provided with an encapsulation component for encapsulating the N-type silicon wafer.

[0006] By adopting the above technical solution, during the process of the feeding assembly transferring the assembled N-type silicon wafer and the back silver electrode, the back silver electrode is located on top of the N-type silicon wafer, reducing the probability of impact damage caused by contact between the back silver electrode and the feeding assembly. The flipping mechanism can flip the N-type silicon wafer conveyed by the feeding assembly to the top of the packaging rack, and the packaging assembly encapsulates the flipped N-type silicon wafer, ensuring product quality.

[0007] Furthermore, the feeding assembly includes a feeding roller rotatably mounted between the frames on both sides of the feeding frame, an inner driven synchronous pulley rotatably mounted on the frame of the feeding frame, an inner main synchronous pulley rotatably mounted on the frame of the feeding frame near the tilting frame, and a synchronous belt meshing with both the inner main synchronous pulley and the inner driven synchronous pulley. The central rod of the feeding roller passes through the frame of the feeding frame and is rotatably connected. The feeding assembly also includes an outer main synchronous pulley fixed to the end of the central rod of the feeding roller. Multiple outer main synchronous pulleys are provided. The outer side of the synchronous belt is provided with a toothed belt that meshes with multiple outer main synchronous pulleys. The frame of the feeding frame is fixed with a device for driving the inner main synchronous pulleys to rotate. The rotating mechanism includes a motor; a rotating rod is rotatably mounted between the frames on both sides of the rotating frame near the top of the rotating frame; the rotating mechanism includes a transmission assembly, which includes a mounting plate fixedly sleeved on the rotating rod and a mounting rod connected to the upper end of the mounting plate; the mounting plate and the mounting rod are provided in two sets and are located at both ends of the rotating rod respectively; the transmission assembly also includes a transmission roller rotatably mounted between the two mounting rods and an external driven synchronous pulley fixed to the end of the central rod of the transmission roller and meshing with the toothed belt on the synchronous belt; the rotating mechanism also includes a pressing assembly set on the mounting plate and pressing down the N-type silicon wafer and a rotating assembly for driving the rotating rod to rotate.

[0008] By adopting the above technical solution, after the motor starts working, it drives the main synchronous pulley to rotate. The synchronous belt drives the inner driven synchronous pulley meshing with it, the toothed belt on the synchronous belt, the outer main synchronous pulley meshing with the toothed belt, and the feeding roller fixed to the center rod of the outer main synchronous pulley to rotate, thereby driving the N-type silicon wafers placed on multiple feeding rollers forward. When the N-type silicon wafer moves to a position close to the flipping frame, the N-type silicon wafer transferred from the feeding rollers moves to the mounting rod. The pressing component cooperates with the mounting rod to press down the N-type silicon wafer. After the rotating component drives the rotating rod to rotate, the mounting plate rotates synchronously with the rotating rod, so that the pressed N-type silicon wafer completes the flipping action and is finally flipped onto the packaging rack for the packaging assembly to perform the packaging operation.

[0009] Furthermore, the pressing assembly includes a connecting plate fixed to one side of the mounting plate and parallel to the mounting rod, a movable plate disposed on the side of the connecting plate away from the transmission roller, a crossbar fixed to the side of the movable plate close to the transmission roller, and a roller movably mounted on the crossbar and abutting against the surface of the N-type silicon wafer. The connecting plate is provided with a through hole for the roller to pass through. The flipping mechanism also includes a linkage assembly that drives the movable plate to move toward the side away from the transmission roller during the rotation of the rotating rod.

[0010] Furthermore, one end of the rotating rod passes through the frame of the tilting frame and is rotatably connected. The rotating assembly includes a transmission gear fixed to one end of the rotating rod and a motor fixed to the frame of the tilting frame. The output end of the motor passes through the frame of the tilting frame and is rotatably connected. The rotating assembly also includes a drive gear fixed to the output end of the motor and meshing with the transmission gear. The linkage assembly includes a guide rod fixed to the side of the connecting plate away from the transmission roller, a threaded rod rotatably mounted on the side of the connecting plate away from the transmission roller, and a driven gear fixedly sleeved on the threaded rod and meshing with the transmission gear. The guide rod passes through the movable plate and is slidably engaged. The threaded rod passes through the movable plate and is threadedly connected. The driven gear is located between the movable plate and the connecting plate.

[0011] By adopting the above technical solution, after the motor works, it drives the drive gear to rotate, thereby causing the transmission gear meshing with the drive gear, the rotating rod fixed to the transmission gear, and the threaded rod fixed to the transmission gear to rotate. Since the threaded rod is threadedly connected to the movable plate, and the guide rod is slidably engaged with the movable plate, the movable plate can move towards the side away from the mounting rod. The crossbar and roller move synchronously with the N-type silicon wafer until the roller and mounting rod separate from the N-type silicon wafer, and the pressing module separates from the N-type silicon wafer, so that the encapsulation module can perform the operation of pressing the tempered glass (with adhesive on the bottom) onto the N-type silicon wafer, completing an important step in the encapsulation of the BC cell photovoltaic module.

[0012] Furthermore, the crossbar on the side away from the movable plate includes a fixed bar fixed to the end of the crossbar and a movable bar detachably connected to the fixed bar. Both the fixed bar and the movable bar have cutting portions on their respective sides away from each other. The fixed bar is provided with bolts that are clearance-fitted with both the fixed bar and the movable bar, and nuts that are threaded to the ends of the bolts.

[0013] By adopting the above technical solution, it is convenient for staff to detachably install the rollers onto the crossbar.

[0014] Furthermore, a connecting rod is fixed to one end of the mounting rod, and an installation port for installing the connecting rod is provided at the upper end of the mounting plate. A connecting shaft that is rotatably connected to the mounting plate is provided through the mounting plate. The connecting shaft passes through the connecting rod and is fixed. A receiving groove communicating with one side of the installation port is provided inside the mounting plate. A torsion spring that is fixed to both the side wall of the connecting shaft and the inner wall of the receiving groove is sleeved on the connecting shaft. A limit block is fixed on one side wall of the mounting plate near the installation port, and the top of the limit block abuts against the bottom of the connecting rod.

[0015] By adopting the above technical solution, under the torsion of the torsion spring, the limiting block and the connecting rod are pressed together, thereby enabling the roller on the mounting rod and the crossbar to cooperate and complete the limiting of the N-type silicon wafer. When the rotating component drives the rotating rod to rotate, when the N-type silicon wafer is horizontal, the roller has not yet disengaged from the bottom of the N-type silicon wafer (if the roller has already disengaged from the N-type silicon wafer when the mounting rod is horizontal, the N-type silicon wafer will fall off during the process of the mounting rod flipping to a horizontal state, affecting the smooth progress of the N-type silicon wafer encapsulation). When the rotating component continues to drive the rotating rod to rotate, the connecting rod stops rotating under the action of the limiting block, the torsion spring gradually tightens, and the crossbar and roller continue to move away from the mounting rod until they are completely disengaged from the N-type silicon wafer. Subsequently, the encapsulation component can perform the encapsulation action. After the encapsulation is completed, the N-type silicon wafer is removed, and the rotating component can drive the rotating rod, the mounting rod, and the pressing component to reset, so as to perform the next flipping action of the N-type silicon wafer.

[0016] Furthermore, a gantry frame is fixed to the top of the mounting rods on both sides, and multiple limit rods are rotatably installed at the bottom of the gantry frame.

[0017] By adopting the above technical solution, the limiting rod on the gantry plays a good limiting role in the N-type silicon wafer during the N-type silicon wafer flipping process, ensuring the smooth progress of the flipping operation.

[0018] Furthermore, the limiting assembly includes a horizontal plate fixed to the flipping frame, a limiting cylinder fixed to the bottom of the horizontal plate, a movable plate fixed to the upper end of the piston rod of the limiting cylinder, a positioning rod fixed to the top of the movable plate, and a support rod fixed to the top of the movable plate. There are four positioning rods, which respectively abut against the four side walls of the N-type silicon wafer after flipping. There are multiple support rods, and rubber blocks are fixed to the upper ends of the multiple support rods.

[0019] By adopting the above technical solution, after the N-type silicon wafer is flipped, the equipment's control system controls the limit cylinder to operate, so that the upper end of the support rod extends out of the top of the flipping frame and abuts against the bottom of the N-type silicon wafer (misaligned with the back silver electrode), while the positioning rod limits the periphery of the N-type silicon wafer, ensuring the stability of the N-type silicon wafer and tempered glass during the encapsulation process.

[0020] Furthermore, the encapsulation assembly includes a linear module fixed to the top of the base and perpendicular to the axial direction of the feeding roller, a mounting bracket disposed on the top of the base and controlled to move by the linear module, an encapsulation cylinder fixed to the mounting bracket, and a pressure plate fixed to the lower end of the piston rod of the encapsulation cylinder.

[0021] By adopting the above technical solution, during the flipping process of the N-type silicon wafer, the equipment's control system controls the linear module to move away from the packaging rack. After the flipping is completed, the equipment's control system controls the linear module to position the lower pressure plate directly above the N-type silicon wafer. Subsequently, it is placed on the coated tempered glass. The equipment's control system controls the packaging cylinder to run, and the piston rod of the packaging cylinder controls the lower pressure plate to press down, completing the pressing action of the N-type silicon wafer.

[0022] Furthermore, a position sensor for monitoring N-type silicon wafers is fixed at the top of the mounting rod near the loading rack.

[0023] In summary, the present invention has the following beneficial effects:

[0024] 1. In this application, during the process of the feeding assembly transferring the assembled N-type silicon wafer and the back silver electrode, the back silver electrode is located on top of the N-type silicon wafer, reducing the probability of impact damage caused by contact between the back silver electrode and the feeding assembly. The flipping mechanism can flip the N-type silicon wafer conveyed by the feeding assembly to the top of the packaging rack, and the packaging assembly encapsulates the flipped N-type silicon wafer, ensuring product quality;

[0025] 2. In this application, after the motor is working, it drives the drive gear to rotate, thereby causing the transmission gear meshing with the drive gear, the rotating rod fixed to the transmission gear, and the threaded rod fixed to the transmission gear to rotate. Since the threaded rod is threadedly connected to the movable plate and the guide rod is slidably engaged with the movable plate, the movable plate can move towards the side away from the mounting rod. The crossbar and roller move synchronously with the N-type silicon wafer until the roller and mounting rod separate from the N-type silicon wafer, and the pressing component separates from the N-type silicon wafer, so that the encapsulation component can perform the operation of pressing the tempered glass (with adhesive coating on the bottom) onto the N-type silicon wafer. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention;

[0027] Figure 2 This is the present invention. Figure 1 A schematic diagram of the local structure from another perspective;

[0028] Figure 3 This is a structural schematic diagram of an embodiment of the present invention used to highlight the flipping mechanism;

[0029] Figure 4 This is a structural schematic diagram of an embodiment of the present invention used to highlight the crossbar;

[0030] Figure 5 yes Figure 4 Enlarged view of point A in the middle;

[0031] Figure 6 This is a schematic diagram illustrating the connection structure between the mounting plate and the rotating rod in an embodiment of the present invention;

[0032] Figure 7 yes Figure 6 Enlarged view of point B in the middle;

[0033] Figure 8 This is a schematic diagram of the structure of an N-type silicon wafer after it has been flipped, as shown in an embodiment of the present invention.

[0034] In the diagram: 1. Loading rack; 2. Tilting rack; 21. Rotating rod; 3. Packaging rack; 4. Base; 5. N-type silicon wafer; 51. Back silver electrode;

[0035] 6. Feeding assembly; 61. Feeding roller; 62. Inner driven synchronous pulley; 63. Inner main synchronous pulley; 64. Synchronous belt; 65. Outer main synchronous pulley;

[0036] 7. Tilting mechanism; 71. Transmission assembly; 711. Mounting plate; 7111. Mounting port; 7112. Connecting shaft; 7113. Receiving groove; 71131. Torsion spring; 7114. Limiting block; 712. Mounting rod; 7121. Connecting rod; 7122. Position sensor; 713. Transmission roller; 714. External driven synchronous pulley;

[0037] 72. Pressing assembly; 721. Connecting plate; 7211. Through hole; 722. Movable plate; 723. Crossbar; 7231. Fixed rod body; 72311. Cutting part; 7232. Movable rod body; 7233. Bolt; 7234. Nut; 724. Roller;

[0038] 73. Rotating assembly; 731. Transmission gear; 732. Motor; 733. Drive gear;

[0039] 74. Linkage assembly; 741. Guide rod; 742. Threaded rod; 743. Driven gear;

[0040] 8. Limiting assembly; 81. Horizontal plate; 82. Limiting cylinder; 83. Moving plate; 84. Support rod; 85. Positioning rod;

[0041] 9. Encapsulation component; 91. Linear module; 92. Mounting bracket; 93. Encapsulation cylinder; 94. Lower pressure plate; 10. Gantry frame; 101. Limit rod. Detailed Implementation

[0042] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0043] like Figure 1-8 As shown in the figure, this application discloses a BC cell photovoltaic module packaging device, including a loading rack 1, a flipping frame 2 disposed on one side of the loading rack 1, a packaging frame 3 disposed on the side of the flipping frame 2 away from the loading rack 1, and a base 4 disposed on the side of the packaging frame 3 away from the loading rack 1. The loading rack 1 is provided with a loading component 6 for conveying the assembled N-type silicon wafer 5 and back silver electrode 51 to the flipping frame 2. The back silver electrode 51 is located on the top of the N-type silicon wafer 5. The flipping frame 2 is provided with a flipping mechanism 7 for flipping the N-type silicon wafer 5 conveyed by the loading component 6 to the top of the packaging frame 3. The packaging frame 3 is provided with a limiting component 8 for limiting the N-type silicon wafer 5. The base 4 is provided with a packaging component 9 for packaging the N-type silicon wafer 5.

[0044] During the transfer of the assembled N-type silicon wafer 5 and the back silver electrode 51 by the feeding component 6, the back silver electrode 51 is located on top of the N-type silicon wafer 5, reducing the probability of impact damage caused by contact between the back silver electrode 51 and the feeding component 6. The flipping mechanism 7 can flip the N-type silicon wafer 5 conveyed by the feeding component 6 to the top of the packaging rack 3, and the packaging component 9 encapsulates the flipped N-type silicon wafer 5, ensuring product quality.

[0045] The feeding assembly 6 includes a feeding roller 61 rotatably mounted between the frames on both sides of the feeding frame 1, an inner driven synchronous pulley 62 rotatably mounted on the frame of the feeding frame 1, an inner main synchronous pulley 63 rotatably mounted on the frame of the feeding frame 1 near the tilting frame 2, and a synchronous belt 64 meshing with both the inner main synchronous pulley 63 and the inner driven synchronous pulley 62. The central rod of the feeding roller 61 passes through the frame of the feeding frame 1 and is rotatably connected. The feeding assembly 6 also includes an outer main synchronous pulley 65 fixed to the end of the central rod of the feeding roller 61. Multiple outer main synchronous pulleys 65 are provided. The outer side of the synchronous belt 64 is provided with a toothed belt (not shown in the figure) that meshes with multiple outer main synchronous pulleys 65. A motor (not shown in the figure) for driving the inner main synchronous pulley 63 to rotate is fixed on the frame of the feeding frame 1. A rotating rod 21 is rotatably mounted between the frames on both sides of the rotating frame 2 near the top of the rotating frame 2. The flipping mechanism 7 includes a transmission assembly 71, which includes a mounting plate 711 fixedly sleeved on the rotating rod 21 and a mounting rod 712 connected to the upper end of the mounting plate 711. The mounting plate 711 and the mounting rod 712 are provided in two sets and are located at both ends of the rotating rod 21 respectively. The transmission assembly 71 also includes a transmission roller 713 rotatably mounted between the two mounting rods 712 and an outer driven synchronous pulley 714 fixed to the end of the central rod of the transmission roller 713 and meshing with the toothed belt on the synchronous belt 64. The flipping mechanism 7 also includes a pressing assembly 72 set on the mounting plate 711 and pressing down the N-type silicon wafer 5, and a rotating assembly 73 for driving the rotating rod 21 to rotate.

[0046] After the motor starts working, it drives the main synchronous pulley to rotate. The synchronous belt 64 drives the inner driven synchronous pulley 62 that meshes with it, the toothed belt on the synchronous belt 64, the outer main synchronous pulley 65 that meshes with the toothed belt, and the feeding roller 61 that is fixed to the center rod of the outer main synchronous pulley 65 to rotate. This drives the N-type silicon wafer 5 placed on the multiple feeding rollers 61 to move forward. When the N-type silicon wafer 5 moves to a position close to the flipping frame 2, the N-type silicon wafer 5 transferred from the feeding roller 61 moves to the mounting rod 712. The pressing component 72 cooperates with the mounting rod 712 and presses down the N-type silicon wafer 5. After the rotating component 73 drives the rotating rod 21 to rotate, the mounting plate 711 rotates synchronously with the rotating rod 21, so that the pressed N-type silicon wafer 5 completes the flipping action and is finally flipped onto the packaging frame 3 so that the packaging component 9 can perform the packaging operation.

[0047] The pressing assembly 72 includes a connecting plate 721 fixed to one side of the mounting plate 711 and parallel to the mounting rod 712, a movable plate 722 disposed on the side of the connecting plate 721 away from the transmission roller 713, a crossbar 723 fixed to the side of the movable plate 722 near the transmission roller 713, and a roller 724 movably mounted on the crossbar 723 and abutting against the surface of the N-type silicon wafer 5. The connecting plate 721 has a through hole 7211 through which the roller 724 passes. The flipping mechanism 7 also includes a linkage assembly 74 that drives the movable plate 722 to move toward the side away from the transmission roller 713 during the rotation of the rotating rod 21.

[0048] One end of the rotating rod 21 passes through the frame of the tilting frame 2 and is rotatably connected. The rotating assembly 73 includes a transmission gear 731 fixed to one end of the rotating rod 21 and a motor 732 fixed to the frame of the tilting frame 2. The output end of the motor 732 passes through the frame of the tilting frame 2 and is rotatably connected. The rotating assembly 73 also includes a drive gear 733 fixed to the output end of the motor 732 and meshing with the transmission gear 731. The linkage assembly 74 includes a guide rod 741 fixed to the side of the connecting plate 721 away from the transmission roller 713, a threaded rod 742 rotatably mounted on the side of the connecting plate 721 away from the transmission roller 713, and a driven gear 743 fixedly sleeved on the threaded rod 742 and meshing with the transmission gear 731. The guide rod 741 passes through the movable plate 722 and is slidably engaged. The threaded rod 742 passes through the movable plate 722 and is threadedly connected. The driven gear 743 is located between the movable plate 722 and the connecting plate 721.

[0049] After the motor 732 starts working, it drives the drive gear 733 to rotate, which causes the transmission gear 731 meshing with the drive gear 733, the rotating rod 21 fixed with the transmission gear 731, and the threaded rod 742 fixed with the transmission gear 731 to rotate. Since the threaded rod 742 is threadedly connected to the movable plate 722, and the guide rod 741 is slidably engaged with the movable plate 722, the movable plate 722 can move towards the side away from the mounting rod 712. The crossbar 723 and the roller 724 move synchronously with the N-type silicon wafer 5 until the roller 724 and the mounting rod 712 separate from the N-type silicon wafer 5, and the pressing component 72 separates from the N-type silicon wafer 5, so that the encapsulation component 9 can perform the operation of pressing the tempered glass (with adhesive on the bottom) onto the N-type silicon wafer 5, thus completing an important step in the encapsulation of the BC cell photovoltaic module.

[0050] To facilitate the detachable installation of roller 724 onto crossbar 723, the crossbar 723 on the side away from movable plate 722 includes a fixed rod 7231 fixed to the end of crossbar 723 and a movable rod 7232 detachably connected to the fixed rod 7231. Both the fixed rod 7231 and the movable rod 7232 are provided with cutting portions 72311 on their respective sides away from each other. The fixed rod 7231 is provided with bolts 7233 that are clearance-fitted with both the fixed rod 7231 and the movable rod 7232, and nuts 7234 that are threaded to the ends of bolts 7233.

[0051] One end of the mounting rod 712 is fixed with a connecting rod 7121. The upper end of the mounting plate 711 is provided with a mounting port 7111 for mounting the connecting rod 7121. A connecting shaft 7112 is rotatably connected to the mounting plate 711 through the mounting plate 711. The connecting shaft 7112 passes through the connecting rod 7121 and is fixed. The mounting plate 711 is provided with a receiving groove 7113 communicating with one side of the mounting port 7111. A torsion spring 71131 is sleeved on the connecting shaft 7112 and is fixed to both the side wall of the connecting shaft 7112 and the inner wall of the receiving groove 7113. A limit block 7114 is fixed on one side wall of the mounting plate 711 near the mounting port 7111. The top of the limit block 7114 abuts against the bottom of the connecting rod 7121.

[0052] Under the torsion of the torsion spring 71131, the limiting block 7114 abuts against the connecting rod 7121, thereby enabling the mounting rod 712 and the roller 724 on the crossbar 723 to cooperate and complete the limiting of the N-type silicon wafer 5. When the rotating assembly 73 drives the rotating rod 21 to rotate, when the N-type silicon wafer 5 is horizontal, the roller 724 has not yet disengaged from the bottom of the N-type silicon wafer 5 (if the roller 724 has already disengaged from the N-type silicon wafer 5 when the mounting rod 712 is horizontal, the N-type silicon wafer 5 will fall off during the process of the mounting rod 712 flipping to a horizontal state, affecting the smooth progress of the N-type silicon wafer 5 encapsulation). When the rotating assembly 73 continues to drive the rotating rod 21 to rotate, the connecting rod 7121 stops rotating under the action of the limiting block 7114, the torsion spring 71131 gradually tightens, and the crossbar 723 and the roller 724 continue to move towards the side away from the mounting rod 712 until they are completely disengaged from the N-type silicon wafer 5. Subsequently, the encapsulation component 9 can perform the encapsulation action. After the encapsulation is completed, the N-type silicon wafer 5 is removed. The rotation component 73 can drive the rotation rod 21, the mounting rod 712 and the pressing component 72 to reset so as to perform the next flipping action of the N-type silicon wafer 5.

[0053] The top of the mounting rods 712 on both sides is fixed with a gantry frame 10, and multiple limit rods 101 are rotatably mounted on the bottom of the gantry frame 10. The limit rods 101 on the gantry frame 10 play a good limiting role in the N-type silicon wafer 5 during the flipping process, ensuring the smooth progress of the flipping operation.

[0054] The limiting assembly 8 includes a horizontal plate 81 fixed to the flipping frame 2, a limiting cylinder 82 fixed to the bottom of the horizontal plate 81, a movable plate 83 fixed to the upper end of the piston rod of the limiting cylinder 82, a positioning rod 85 fixed to the top of the movable plate 83, and a support rod 84 fixed to the top of the movable plate 83. There are four positioning rods 85, each abutting against one of the four side walls of the flipped N-type silicon wafer 5. Multiple support rods 84 are provided, and each support rod 84 has a rubber block fixed to its upper end. After the flipping action of the N-type silicon wafer 5 is completed, the equipment's control system controls the limiting cylinder 82 to operate, causing the upper end of the support rod 84 to extend beyond the top of the flipping frame 2 and abut against the bottom of the N-type silicon wafer 5 (misaligned with the back silver electrode 51). The positioning rod 85 then limits the periphery of the N-type silicon wafer 5, ensuring the stability of the N-type silicon wafer 5 during the tempered glass encapsulation process.

[0055] In this embodiment, the encapsulation assembly 9 includes a linear module 91 fixed to the top of the base 4 and perpendicular to the axial direction of the feeding roller 61, a mounting frame 92 disposed on the top of the base 4 and controlled to move by the linear module 91, an encapsulation cylinder 93 fixed to the mounting frame 92, and a lower pressure plate 94 fixed to the lower end of the piston rod of the encapsulation cylinder 93. During the flipping process of the N-type silicon wafer 5, the equipment's control system controls the linear module 91 to move away from the encapsulation frame 3. After the flipping is completed, the equipment's control system controls the linear module 91 to position the lower pressure plate 94 directly above the N-type silicon wafer 5. Subsequently, it is placed on the coated tempered glass, and the equipment's control system controls the encapsulation cylinder 93 to operate. The piston rod of the encapsulation cylinder 93 controls the lower pressure plate 94 to press down, completing the pressing action of the N-type silicon wafer 5.

[0056] To improve the accuracy of the equipment's control system operation, a position sensor 7122 for monitoring the N-type silicon wafer 5 is fixed on the top of the mounting rod 712 near the loading rack 1, so as to monitor the position of the N-type silicon wafer 5 in real time and improve the accuracy of equipment operation.

[0057] The above description is merely a preferred embodiment of the present invention, and the scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A BC battery photovoltaic module encapsulation apparatus characterized by: The utility model relates to a kind of automatic N-type silicon wafer packaging machine, including upper loading Frame (1), set in upper loading frame (1) one side's turnover frame (2), set in turnover frame (2) far from upper loading frame (1) one side's packaging frame (3) and set in packaging frame (3) far from upper loading frame (1) one side's pedestal (4), upper loading frame (1) is provided with for the upper loading assembly (6) for transporting the assembled N-type silicon wafer (5) with back silver electrode (51) to turnover frame (2), back silver electrode (51) is located N-type silicon wafer (5) top, turnover frame (2) is provided with for the turnover mechanism (7) for overturning N-type silicon wafer (5) transported by upper loading assembly (6) to packaging frame (3) top, packaging frame (3) is provided with for the limiting assembly (8) for limiting N-type silicon wafer (5), pedestal (4) is provided with for the packaging assembly (9) for packaging N-type silicon wafer (5); Upper loading assembly (6) includes upper loading roller (61) rotationally installed between the frame body of upper loading frame (1) two sides, inner slave sprocket (62) rotationally installed on the frame body of upper loading frame (1), inner master sprocket (63) rotationally installed on the frame body of upper loading frame (1) close to the position of turnover frame (2), and synchronous belt (64) engaged with inner master sprocket (63) and inner slave sprocket (62), the center rod of upper loading roller (61) penetrates the frame body of upper loading frame (1) and rotationally connects, upper loading assembly (6) further includes outer master sprocket (65) fixed to the end of the center rod of upper loading roller (61), outer master sprocket (65) is provided with a plurality of, the band body on the outside of synchronous belt (64) is provided with click belt engaged with a plurality of outer master sprocket (65), the frame body of upper loading frame (1) is fixed with motor for driving inner master sprocket (63) to rotate; Rotating rod (21) is rotationally installed between the frame body of turnover frame (2) two sides close to the position of turnover frame (2) top, turnover mechanism (7) includes transmission assembly (71), and transmission assembly (71) includes mounting plate (711) fixedly sleeved on rotating rod (21) and mounting rod (712) connected with the upper end of mounting plate (711), mounting plate (711) and mounting rod (712) are both provided with two groups and are located rotating rod (21) two ends respectively, transmission assembly (71) further includes transmission roller (713) rotationally installed between two mounting rods (712) and outer slave sprocket (714) fixed to the end of the center rod of transmission roller (713) and engaged with the click belt on synchronous belt (64); Turnover mechanism (7) further includes lower pressing assembly (72) set on mounting plate (711) and press N-type silicon wafer (5) and rotating assembly (73) for driving rotating rod (21) to rotate.

2. A BC battery photovoltaic module encapsulant apparatus according to claim 1, wherein: The pressing assembly (72) comprises a connecting plate (721) fixed on one side of the mounting plate (711) and parallel to the mounting rod (712), a movable plate (722) arranged on the side of the connecting plate (721) away from the transmission roller (713), a cross rod (723) fixed on the side of the movable plate (722) close to the transmission roller (713), and a roller (724) movably mounted on the cross rod (723) and abutting against the surface of the N-type silicon wafer (5), and a through hole (7211) is arranged on the connecting plate (721) and penetrates through the connecting plate (721) to allow the roller (724) to pass through, and the turnover mechanism (7) further comprises a linkage assembly (74) for driving the movable plate (722) to move away from the transmission roller (713) during the rotation of the rotating rod (21).

3. A BC battery photovoltaic module encapsulant apparatus according to claim 2, wherein: One end of the rotating rod (21) penetrates through the frame body of the turnover frame (2) and is rotationally connected, the rotating assembly (73) comprises a transmission gear (731) fixed on one end of the rotating rod (21) and a motor (732) fixed on the frame body of the turnover frame (2), the output end of the motor (732) penetrates through the frame body of the turnover frame (2) and is rotationally connected, and the rotating assembly (73) further comprises a driving gear (733) fixed on the output end of the motor (732) and meshing with the transmission gear (731). The linkage assembly (74) comprises a guide rod (741) fixed on the side of the connecting plate (721) away from the transmission roller (713), a threaded rod (742) rotationally mounted on the side of the connecting plate (721) away from the transmission roller (713), and a driven gear (743) fixedly sleeved on the threaded rod (742) and meshing with the transmission gear (731), the guide rod (741) penetrates through the movable plate (722) and is slidingly connected, the threaded rod (742) penetrates through the movable plate (722) and is screwedly connected, and the driven gear (743) is located between the movable plate (722) and the connecting plate (721).

4. A BC battery photovoltaic module encapsulant apparatus according to claim 3, wherein: The rod body on the side of the cross rod (723) away from the movable plate (722) comprises a fixed rod body (7231) fixed on the end of the cross rod (723) and a movable rod body (7232) detachably connected with the fixed rod body (7231), the side of the fixed rod body (7231) and the movable rod body (7232) away from each other is provided with a cutting portion (72311), and a bolt (7233) in gap connection with the fixed rod body (7231) and the movable rod body (7232) and a nut (7234) in screw connection with the end of the bolt (7233) are arranged on the fixed rod body (7231) and penetrate through the fixed rod body (7231).

5. A BC battery photovoltaic module encapsulant apparatus according to claim 3, wherein: One end of the mounting rod (712) is fixedly connected with a connecting rod (7121), the upper end of the mounting plate (711) is provided with a mounting opening (7111) for mounting the connecting rod (7121), a connecting shaft (7112) rotatingly connected with the mounting plate (711) is provided through the mounting plate (711), the connecting shaft (7112) penetrates through the connecting rod (7121) and is fixed, the mounting plate (711) is provided with a containing groove (7113) in communication with one side of the mounting opening (7111), a torsional spring (71131) is sleeved on the connecting shaft (7112) and is fixed to the side wall of the connecting shaft (7112) and the inner wall of the containing groove (7113), a limiting block (7114) is fixed to the position of the side wall of the mounting plate (711) close to the mounting opening (7111), and the top of the limiting block (7114) abuts against the bottom of the connecting rod (7121).

6. A BC battery photovoltaic module encapsulant apparatus according to claim 5, wherein: The top of the mounting rod (712) on the two sides is fixedly connected with a portal frame (10), and a plurality of limiting rods (101) are rotatably installed at the bottom of the portal frame (10).

7. A BC battery photovoltaic module encapsulant apparatus according to claim 5, wherein: The limiting assembly (8) comprises a cross plate (81) fixed to the turnover frame (2), a limiting cylinder (82) fixed to the bottom of the cross plate (81), a moving plate (83) fixed to the upper end of the piston rod of the limiting cylinder (82), a positioning rod (85) fixed to the top of the moving plate (83), and a supporting rod (84) fixed to the top of the moving plate (83), the positioning rod (85) is provided with four and abuts against four side walls of the N-type silicon wafer (5) after turnover, and the supporting rod (84) is provided with a plurality of rubber blocks fixed to the upper ends of the plurality of supporting rods (84).

8. A BC battery photovoltaic module encapsulant apparatus according to claim 5, wherein: The packaging assembly (9) comprises a linear module (91) fixed to the top of the base (4) and axially perpendicular to the feeding roller (61), a mounting frame (92) provided on the top of the base (4) and controlled to move by the linear module (91), a packaging cylinder (93) fixed to the mounting frame (92), and a pressing plate (94) fixed to the lower end of the piston rod of the packaging cylinder (93).

9. A BC battery photovoltaic module encapsulant apparatus according to claim 5, wherein: The top of the mounting rod (712) is fixed with a position sensor (7122) for monitoring the N-type silicon wafer (5) at a position close to the feeding frame (1).

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