Surface coating method and device for circuit board production

Abstract

The invention relates to the technical field of circuit board coating, and provides a surface coating method and device.The surface coating device for circuit board production comprises a sliding base, a butt joint strip and a curing lamp, the sliding base can drive an auxiliary tray mechanism to slide on a workbench, and the auxiliary tray mechanism is used for dynamically fixing a circuit board; the butt joint strip is arranged on the side, close to the valve needle coating structure, of the workbench, an inclination adjusting mechanism is arranged on the workbench, the butt joint strip is detachably connected with the auxiliary tray mechanism, the inclination adjusting mechanism is used for adjusting the inclination angle of the auxiliary tray mechanism, and the curing lamp is fixedly installed on the ram away from the valve needle coating structure. The curing lamp can move on the portal frame structure along with the tray, and by means of the technical scheme, the problem that in the prior art, when selective coating is conducted on a circuit board, control over the thickness and precision of a part of positions is possibly inaccurate is solved.

Description

Technical Field

[0001] This invention relates to the field of circuit board coating technology, specifically to a surface coating method and apparatus for circuit board production. Background Technology

[0002] In the manufacturing process of electronic products, a protective layer, collectively known as conformal coating, needs to be applied to the surface of the circuit board. This protective layer ensures the long-term reliable and stable operation of electronic products in various environments. It also provides moisture and water resistance, dust and dirt protection, and chemical corrosion protection, while also offering physical protection. Therefore, applying adhesive to the circuit board is crucial.

[0003] Currently, most circuit board coating methods are selective coating, often using valve needle coating devices for precise coating. After clamping the circuit board, the valve needle coating structure selectively and precisely coats the circuit board, followed by drying and solidification of the adhesive to complete the coating process. Currently, high-temperature curing, light-curing, or mixed adhesives are commonly used. The valve needle coating structure allows for precise control of the position and amount of adhesive applied to the circuit board. Different positions have different requirements for adhesive thickness, which need to be dynamically adjusted according to the protection level and component characteristics. However, due to the fluidity of the adhesive, traditionally, for coating positions requiring a thicker protective layer, multiple coats are often applied to increase the protective layer thickness. However, repeated curing of multiple layers of adhesive slows down the coating speed, and multiple coats may result in a large protective layer area. Therefore, a coating method that precisely controls the coating area and thickness is needed. Summary of the Invention

[0004] This invention proposes a surface coating method and apparatus for circuit board production, which solves the problem that the thickness and precision of some locations may be inaccurately controlled when selectively coating circuit boards in the prior art.

[0005] The technical solution of the present invention is as follows:

[0006] A surface coating method for circuit board manufacturing, comprising:

[0007] Step 1: Circuit board placement: Fix the circuit board onto the coating device, and the circuit board moves under the drive.

[0008] Step 2: Selective coating: The circuit board moves to a position below the valve needle coating structure, and selective coating is performed on the position on the circuit board. The valve needle coating structure drips adhesive onto the circuit board.

[0009] Step 3: Tilting the circuit board: The coating device tilts the circuit board at a certain angle to adjust the flow direction of the adhesive.

[0010] Step 4: Adhesive curing: After selectively coating the circuit board, the adhesive is cured before applying the next layer of adhesive.

[0011] A surface coating apparatus for circuit board production, referring to the aforementioned surface coating method for circuit board production, includes a worktable, a gantry structure, and a valve needle coating structure. Two gantry structures are provided, both slidably connected to the worktable. Each of the two gantry structures has a sliding ram slidably connected to it. The valve needle coating structure is fixedly mounted on one of the sliding rams. The apparatus also includes a slide block, a mating strip, and a curing lamp. The slide block is slidably connected to the worktable, and an auxiliary tray mechanism is connected to the slide block. The circuit board is detachably mounted on the auxiliary tray mechanism. The slide block can drive the auxiliary tray mechanism to slide on the worktable. The auxiliary tray mechanism is used for dynamically fixing the circuit board. The mating strip is located on the side of the worktable near the valve needle coating structure. A tilt adjustment mechanism is provided on the worktable, and the mating strip is connected to the tilt adjustment mechanism and detachably connected to the auxiliary tray mechanism. The tilt adjustment mechanism is used to adjust the tilt angle of the auxiliary tray mechanism. The curing lamp is fixedly mounted on the sliding ram away from the valve needle coating structure. The curing lamp can move with the tray on the gantry structure.

[0012] The auxiliary tray mechanism includes a spherical shaft, a workpiece tray, and a lifting rod. The spherical shaft is fixedly connected to the center of the slide block, and the center of the workpiece tray is rotatably connected to the spherical shaft. The circuit board is detachably mounted on the workpiece tray. Multiple lifting rods are provided, and the multiple lifting rods are vertically slidably connected to the slide block. A spring is sleeved on each lifting rod, and one end of the lifting rod near the workpiece tray is set to an arc shape.

[0013] The workpiece tray has multiple arc-shaped protrusions on the side near the lifting rod. Each lifting rod is in contact with an arc-shaped protrusion. When the workpiece tray is rotated on the spherical shaft, the arc-shaped protrusion on the downward tilting side of the workpiece tray squeezes the lifting rod, causing the spring to be compressed, while the spring on the other side of the lifting rod extends.

[0014] The workpiece tray is rotatably connected to a sleeve rod on its side, and the mating bar is provided with multiple collars, the sleeve rod being able to extend into the collars.

[0015] The tilt adjustment mechanism includes a drive cylinder one, a drive cylinder two, and a slide rail. Drive cylinder one is fixedly mounted on the worktable, and a connector one is rotatably connected to the output end of drive cylinder one. Drive cylinder two is fixedly mounted on the worktable, and a connector two is rotatably connected to the output end of drive cylinder two. The output ends of drive cylinder one and drive cylinder two are both vertically arranged. The slide rail is fixedly arranged on one side of the docking bar, and the slide rail is slidably connected to the connector two. Connector one is fixedly connected to the side of the docking bar away from the slide rail. When the extension and retraction lengths of the output ends of drive cylinder one and drive cylinder two are different, the docking bar tilts, and the collar drives the sleeve rod to tilt.

[0016] A beam slant is fixedly connected to the curing lamp, with both the curing lamp and the beam slant facing downwards. The beam slant can be moved above the circuit board.

[0017] The working principle and beneficial effects of this invention are as follows:

[0018] 1. In this invention, by setting up a gantry structure and a curing lamp, after coating the circuit board, the gantry structure can be used to drive the curing lamp to align with the adhesive liquid, and quickly perform light curing. As the adhesive liquid is coated, curing can be carried out at any time, which can avoid the uncontrolled changes in the thickness and shape of the adhesive liquid during the flow process.

[0019] 2. In this invention, by setting a tilt adjustment mechanism, the circuit board can be tilted at multiple angles after it is fixed. By setting an auxiliary tray mechanism, the circuit board can be tilted. The combination of the tilt adjustment mechanism and the auxiliary tray mechanism can flexibly control the angle of the circuit board, thereby controlling the thickness and shape of the protective layer. Compared with the traditional valve needle coating device, which can only control the thickness of the protective layer by the amount of adhesive applied, this invention, combined with the angle of the circuit board and rapid curing, can accurately control the thickness and shape of the protective layer at the same time. Attached Figure Description

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the overall structure from another perspective in this invention;

[0023] Figure 3 This is a schematic diagram of the structure in which the workpiece tray and the auxiliary tray mechanism cooperate in this invention;

[0024] Figure 4 This is a cross-sectional view of the spherical shaft and the workpiece tray in this invention.

[0025] Figure 5 This is a schematic diagram of the structure of the tilt adjustment mechanism and the sleeve rod in this invention;

[0026] Figure 6 This is a partial structural diagram of the beam tube and circuit board working together in this invention.

[0027] In the diagram: 1. Workbench; 2. Gantry structure; 3. Valve needle coating structure; 4. Slide block; 5. Slide seat; 6. Connecting bar; 7. Curing lamp; 8. Spherical shaft; 9. Workpiece tray; 10. Lifting rod; 11. Arc-shaped protrusion; 12. Sleeve rod; 13. Collar; 14. Drive cylinder one; 15. Connector one; 16. Drive cylinder two; 17. Connector two; 18. Slide rail; 19. Beam slant. Detailed Implementation

[0028] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0029] Example 1

[0030] like Figures 1-6 As shown, this embodiment proposes a surface coating method for circuit board manufacturing, including:

[0031] Step 1: Circuit board placement: Fix the circuit board onto the coating device, and the circuit board moves under the drive.

[0032] Step 2: Selective coating: The circuit board moves to a position below the valve needle coating structure 3, and selective coating is performed on the position on the circuit board. The valve needle coating structure 3 drips adhesive onto the circuit board.

[0033] Step 3: Tilting the circuit board: The coating device tilts the circuit board at a certain angle to adjust the flow direction of the adhesive.

[0034] Step 4: Adhesive curing: After selectively coating the circuit board, the adhesive is cured before applying the next layer of adhesive.

[0035] When coating the surface of the circuit board, the coating is first applied to the corresponding positions. Then, the tilt adjustment mechanism drives the auxiliary tray mechanism to tilt at multiple angles, thereby controlling the flow of the adhesive and the thickness at different positions. Then, the adhesive is cured by light with the curing lamp 7, which allows the adhesive to cure quickly and thus precisely control the shape and thickness of the protective layer.

[0036] Example 2

[0037] like Figures 1-6 As shown, a surface coating apparatus for circuit board production, referring to the aforementioned surface coating method for circuit board production, includes a worktable 1, a gantry structure 2, and a valve needle coating structure 3. Two gantry structures 2 are provided, both slidably connected to the worktable 1. Sliders 4 are slidably connected to both gantry structures 2. The valve needle coating structure 3 is fixedly mounted on one of the sliders 4. The apparatus also includes a slide base 5, a mating strip 6, and a curing lamp 7. The slide base 5 is slidably connected to the worktable 1, and an auxiliary tray mechanism is connected to the slide base 5. The circuit board is detachably mounted on the auxiliary tray mechanism. The slide base 5 can drive the auxiliary tray mechanism on the worktable 1. The auxiliary tray mechanism is used to dynamically fix the circuit board. The mating strip 6 is set on the side of the worktable 1 near the valve needle coating structure 3. The worktable 1 is equipped with a tilt adjustment mechanism. The mating strip 6 is connected to the tilt adjustment mechanism and is detachably connected to the auxiliary tray mechanism. The tilt adjustment mechanism is used to adjust the tilt angle of the auxiliary tray mechanism. The curing lamp 7 is fixedly installed on the slide block 4 away from the valve needle coating structure 3. The curing lamp 7 can move with the tray on the gantry structure 2. In this application, by adding a photocuring device to the coating device, after the valve needle coating structure 3 is coated, the curing lamp can be used to fix the circuit board in the area where the coating is needed. When the enclosure and thickness are specially set, the adhesive can be quickly cured using a light curing device to achieve curing and determine the shape of the adhesive. Simultaneously, an auxiliary tray mechanism tilts the circuit board to adjust the shape and range of adhesive flow on the board. Compared to traditional coating devices that involve curing the adhesive after each layer and then repeating the process for areas requiring a thicker protective layer, this application's rapid curing method improves the efficiency of protective layer coating and enhances quality control. The gantry structure 2 is equipped with multiple motors and ball screws for transmission, which can drive the slide 4... The gantry structure 2 performs multi-directional movements in the horizontal, vertical, and longitudinal directions, thereby fulfilling the function of driving the slide 4 to move in multiple positions on the worktable 1. Similarly, the worktable 1 is also equipped with a motor and a ball screw, which can drive the slide 5 to slide. The valve needle coating structure 3 is set as a valve needle, which is connected to an external adhesive supply device. The adhesive is delivered by the adhesive supply device. When the valve needle coating structure 3 is under pressure, it squeezes the adhesive onto the circuit board to complete the coating. The adhesive used in this application can be a light-curing adhesive or a mixture of light-curing and high-temperature curing adhesives. The adhesive can be solidified by the curing lamp 7.

[0038] like Figures 1-4As shown, the auxiliary tray mechanism includes a spherical shaft 8, a workpiece tray 9, and lifting rods 10. The spherical shaft 8 is fixedly connected to the center of the slide block 5. The center of the workpiece tray 9 is rotatably connected to the spherical shaft 8. A circuit board is detachably mounted on the workpiece tray 9. Multiple lifting rods 10 are provided, and the multiple lifting rods 10 are vertically slidably connected to the slide block 5. Springs are sleeved on the lifting rods 10. One end of the lifting rod 10 near the workpiece tray 9 is set as an arc shape. In this application, four lifting rods 10 are provided, and the four lifting rods 10 are respectively set at the four corners of the slide block 5. The workpiece tray 9 is provided with a spherical groove, and the spherical shaft 8 rotates at multiple angles in the spherical groove. This allows the workpiece tray 9 to maintain balance when the tilt adjustment mechanism does not drive the sleeve rod 12 to move, as it is pushed by four lifting rods 10. When the tilt adjustment mechanism drives the sleeve rod 12 to tilt and lift, it can drive the workpiece tray 9 to tilt. When the workpiece tray 9 tilts, it rotates on the spherical shaft 8. When the workpiece tray 9 rotates, the downward tilting end presses down on the lifting rod 10, and the upward tilting end of the lifting rod 10 moves upward under the push of the spring.

[0039] like Figures 3-5 As shown, multiple arc-shaped protrusions 11 are provided on the side of the workpiece tray 9 near the lifting rod 10. Each lifting rod 10 is in contact with an arc-shaped protrusion 11. When the workpiece tray 9 is rotatably connected on the spherical shaft 8, the arc-shaped protrusion 11 on the downward tilting side of the workpiece tray 9 presses against the lifting rod 10, causing the spring to be compressed, while the spring on the other side of the lifting rod 10 extends. A sleeve rod 12 is rotatably connected to the side of the workpiece tray 9, and multiple collars 13 are provided on the mating bar 6. The sleeve rod 12 can extend into... In the collar 13, the arc-shaped protrusion 11 contacts the end of the push rod 10, so that when the workpiece tray 9 is tilted, the contact area between the arc-shaped protrusion 11 and the arc surface of the end of the push rod 10 is large, thereby maintaining the stability of the push rod 10 in supporting the workpiece tray 9. A coil spring can be set at the rotatable connection between the sleeve rod 12 and the workpiece tray 9 to push the sleeve rod 12 to rotate directly under the workpiece tray 9, preventing the sleeve rod 12 and the collar 13 from being misaligned when the workpiece tray 9 drives the sleeve rod 12 to dock with the collar 13.

[0040] like Figures 5-6As shown, the tilt adjustment mechanism includes a drive cylinder 14, a drive cylinder 16, and a slide rail 18. Drive cylinder 14 is fixedly mounted on the worktable 1, and a connector 15 is rotatably connected to its output end. Drive cylinder 16 is fixedly mounted on the worktable 1, and a connector 27 is rotatably connected to its output end. The output ends of both drive cylinders 14 and 16 are vertically oriented. The slide rail 18 is fixedly mounted on one side of the mating bar 6, and is slidably connected to connector 27. Connector 15 is fixedly connected to the side of the mating bar 6 furthest from the slide rail 18. When the extension / retraction lengths of the output ends of drive cylinders 14 and 16 are different, the mating bar 6 tilts. Ring 13 drives sleeve rod 12 to tilt. The output ends of drive cylinder 14 and drive cylinder 2 16 cooperate. When the output ends of drive cylinder 14 and drive cylinder 2 16 shorten or extend at the same time, they can push the workpiece tray 9 to tilt in one direction. When the output ends of drive cylinder 14 and drive cylinder 2 16 extend and shorten respectively, they can tilt in another direction. The tilting direction and angle of workpiece tray 9 can be controlled by the extension and shortening of the output ends of drive cylinder 14 and drive cylinder 2 16. When the output ends of drive cylinder 14 and drive cylinder 2 16 extend and shorten, connector 2 17 slides on slide rail 18. At the same time, ring 13 can drive sleeve rod 12 to rotate on workpiece tray 9.

[0041] like Figure 1 and Figure 6 As shown, a beam snoot 19 is fixedly connected to the curing lamp 7. The curing lamp 7 and the beam snoot 19 face downwards. The beam snoot 19 can be moved above the circuit board. The inside of the beam snoot 19 can be set as a reflective surface. The light from the curing lamp 7 is irradiated onto the circuit board through the beam snoot 19. The beam snoot 19 can focus the light from the curing lamp 7, irradiating only the area that needs to be cured, so as to accurately control the curing of the adhesive.

[0042] In this embodiment, when the circuit board is placed on the workpiece tray 9, the slide block 5 slides below the valve needle coating structure 3, the sleeve rod 12 extends into the collar 13, and the gantry structure 2 drives the valve needle coating structure 3 to coat the circuit board. After coating, the curing lamp 7 moves to the coating position on the circuit board driven by the gantry structure 2 to irradiate and cure the adhesive. When it is necessary to control the range and shape of the adhesive, the output ends of the drive cylinder 14 and drive cylinder 2 16 extend or shorten. At this time, the connector 2 17 slides on the slide rail 18, the mating bar 6 tilts, and drives the sleeve rod 12 to tilt. The sleeve rod 12 then drives the workpiece tray 9 to tilt in various directions. At the same time, the curing lamp 7 can move in coordination to cure the adhesive, thereby precisely controlling the shape and thickness of the adhesive.

[0043] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A surface coating method for circuit board manufacturing, characterized in that, include: S1: Circuit board placement: The circuit board is fixed on the coating device and moved under the drive. S2: Selective coating: The circuit board moves to the position below the valve needle coating structure (3) and selectively coats the position on the circuit board. The valve needle coating structure (3) drips adhesive onto the circuit board. S3: Circuit board tilt: The coating device tilts the circuit board at a certain angle to adjust the flow direction of the adhesive. S4: Adhesive curing: After selectively coating the circuit board, the adhesive is cured before coating it again.

2. A surface coating apparatus for circuit board production, referring to the surface coating method for circuit board production according to claim 1, comprising a worktable (1), a gantry structure (2), and a valve needle coating structure (3), wherein two gantry structures (2) are provided, both gantry structures (2) are slidably connected to the worktable (1), and both gantry structures (2) are slidably connected to slide blocks (4), and the valve needle coating structure (3) is fixedly disposed on one of the slide blocks (4), characterized in that, Also includes: A slide (5) is slidably connected to the worktable (1). An auxiliary tray mechanism is connected to the slide (5). The circuit board is detachably mounted on the auxiliary tray mechanism. The slide (5) can drive the auxiliary tray mechanism to slide on the worktable (1). The auxiliary tray mechanism is used to dynamically fix the circuit board. A docking strip (6) is provided on the workbench (1) on one side near the valve needle coating structure (3). The workbench (1) is provided with a tilt adjustment mechanism. The docking strip (6) is connected to the tilt adjustment mechanism. The docking strip (6) is detachably connected to the auxiliary tray mechanism. The tilt adjustment mechanism is used to adjust the tilt angle of the auxiliary tray mechanism. A curing lamp (7) is fixedly installed on the slide (4) away from the valve needle coating structure (3), and the curing lamp (7) can move with the tray on the gantry structure (2).

3. The surface coating apparatus for circuit board production according to claim 2, characterized in that, The auxiliary tray mechanism includes: A spherical shaft (8) is fixedly connected to the center of the slide block (5); The workpiece tray (9) is rotatably connected to the spherical shaft (8) at its central position, and the circuit board is detachably mounted on the workpiece tray (9); Multiple lifting rods (10) are provided, and the multiple lifting rods (10) are vertically slidably connected to the slide block (5). A spring is sleeved on the lifting rod (10). The end of the push rod (10) near the workpiece tray (9) is set in an arc shape.

4. The surface coating apparatus for circuit board production according to claim 3, characterized in that, On the side of the workpiece tray (9) near the push rod (10), there are multiple arc-shaped protrusions (11). Each push rod (10) is in contact with the arc-shaped protrusion (11). When the workpiece tray (9) is rotatably connected on the spherical shaft (8), the arc-shaped protrusion (11) on the downward tilting side of the workpiece tray (9) squeezes the push rod (10), causing the spring to be compressed, while the spring on the push rod (10) on the other side extends.

5. The surface coating apparatus for circuit board production according to claim 4, characterized in that, The workpiece tray (9) is rotatably connected to a sleeve rod (12) on its side, and the docking bar (6) is provided with a plurality of collars (13), and the sleeve rod (12) can extend into the collars (13).

6. The surface coating apparatus for circuit board production according to claim 5, characterized in that, The tilt adjustment mechanism includes: A drive cylinder (14) is fixedly installed on the worktable (1), and a connector (15) is rotatably connected to the output end of the drive cylinder (14). Drive cylinder two (16) is fixedly installed on the workbench (1). Connector two (17) is rotatably connected to the output end of drive cylinder two (16). The output ends of drive cylinder one (14) and drive cylinder two (16) are both vertically arranged. A slide rail (18) is fixedly installed on one side of the docking bar (6), and the slide rail (18) is slidably connected to the connecting member two (17); The connector (15) is fixedly connected to the side of the docking bar (6) away from the slide rail (18).

7. The surface coating apparatus for circuit board production according to claim 6, characterized in that, When the output extension lengths of the first drive cylinder (14) and the second drive cylinder (16) are different, the docking bar (6) tilts, and the collar (13) drives the sleeve rod (12) to tilt.

8. The surface coating apparatus for circuit board production according to claim 7, characterized in that, A beam tube (19) is fixedly connected to the curing lamp (7). The curing lamp (7) and the beam tube (19) face downwards. The beam tube (19) can be moved above the circuit board.

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