A vcse1 chip wafer high-temperature cleaning device and cleaning process

Abstract

The application discloses a VCSEL chip wafer high-temperature cleaning device and a cleaning process, and relates to the technical field of wafer cleaning.The high-temperature cleaning device comprises a machine body, a cleaning cavity is arranged at the middle position in the machine body, and a workbench is arranged in the cleaning cavity.Compared with the current wafer high-temperature cleaning device, the device is provided with a fixing mechanism, during the cleaning process, the staff can flexibly switch the fixing position of the wafer at different time periods according to the needs, so that the area of the wafer surface originally blocked by the adsorption assembly can be exposed to the high-temperature cleaning liquid, so that the high-temperature cleaning liquid can cover the upper and lower surfaces of the wafer in all directions without dead angles.In addition, a plurality of horseshoe-shaped flow guides are arranged in the nozzle, through the independent heating elements arranged in each flow guide and the temperature measuring elements in the connecting pipes, the segmented precise temperature control can be realized, and the phenomenon that the temperature of the high-temperature cleaning liquid does not meet the standards can be avoided.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, specifically a high-temperature cleaning device and cleaning process for VCSEL chip wafers. Background Technology

[0002] As a core device of third-generation semiconductors, VCSEL chips are widely used in high-end fields such as optical communication, 3D sensing, and lidar. The requirements for surface cleanliness and structural integrity in the wafer manufacturing process far exceed those of traditional semiconductor chips. Among them, high-temperature cleaning is one of the key steps in the VCSEL chip wafer manufacturing process, which requires the removal of residual photoresist, particulate impurities, metal ions and organic contaminants on the wafer surface through high-temperature cleaning solution.

[0003] Currently, to ensure temperature uniformity and cleaning efficiency, high-temperature wafer cleaning equipment typically has cleaning nozzles on both the top and bottom sides of the wafer. For example, patents "CN115513099A A High-Temperature Chemical Cleaning and Etching Equipment and Method for Wafers" and "CN213845234U A High-Temperature Chemical Cleaning Equipment for Wafers" disclose wafer cleaning technology solutions. However, existing wafer cleaning equipment often uses a single support design, where the contact area between the support structure and the wafer is always blocked, creating "cleaning dead zones" that cannot be covered by the cleaning solution. In such cases, to achieve thorough cleaning... Workers often need to manually change the position of the wafers, which is detrimental to improving cleaning efficiency. In addition, current high-temperature wafer cleaning equipment generally suffers from poor size adaptability. Most equipment usually requires the replacement of the support structure to clean wafers of different sizes, which seriously affects production efficiency. Finally, in order to ensure that the temperature of the cleaning fluid ejected from the nozzle of the cleaning device meets the requirements, current high-temperature wafer cleaning equipment usually sets up a secondary heating element at the nozzle. However, the existing secondary heating elements lack the function of segmented progressive temperature increase adjustment, resulting in large fluctuations in the temperature of the cleaning fluid, which in turn affects the removal effect of contaminants. Summary of the Invention

[0004] The purpose of this invention is to provide a high-temperature cleaning device and cleaning process for VCSEL chip wafers to solve the problems mentioned in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-temperature cleaning device for VCSEL chip wafers, the high-temperature cleaning device comprising a body, a cleaning chamber disposed in the middle of the body, a worktable disposed within the cleaning chamber, a cleaning fluid supply system disposed on the upper part of the body, a cleaning fluid recovery system disposed on the bottom of the body, and a display disposed on the outer side of the body to detect the remaining amount of cleaning fluid in the cleaning fluid supply system. A mounting base is disposed on the worktable, a fixing mechanism is disposed on the mounting base, an upper insulation plate is disposed directly above the fixing mechanism, the upper insulation plate is connected to the top of the cleaning chamber via a second cylinder, a nozzle is disposed on the upper insulation plate, the cleaning fluid supply system is connected to the nozzle, a drain hole is disposed on the worktable, the drain hole is connected to the cleaning fluid recovery system, the fixing mechanism serves to fix the wafer, and the high-temperature cleaning fluid from the cleaning fluid supply system is sprayed onto the wafer surface through the nozzle to clean the wafer.

[0006] Furthermore, a rotary motor is installed below the mounting base. The rotary motor is connected to the fixing mechanism via a transmission assembly. The fixing mechanism includes a turntable and an adsorption assembly. Several mounting slots are provided on the upper part of the turntable, and an adsorption assembly is installed in each slot. A lower insulation plate is installed inside the turntable. The lower insulation plate is connected to the bottom of the cleaning chamber via a first cylinder. Nozzles are also provided on the lower insulation plate. When the wafer is placed on the fixing mechanism, it is fixed by the adsorption assembly. During wafer cleaning, the lower and upper insulation plates are driven to approach the wafer by the first and second cylinders. Then, the nozzles on the lower and upper insulation plates are opened, and high-temperature cleaning fluid is sprayed onto both the upper and lower surfaces of the wafer to ensure temperature uniformity during wafer cleaning. Then, the rotary motor is turned on... The rotating motor and transmission components drive the fixing mechanism to rotate on the mounting base. During the rotation of the fixing mechanism, the high-temperature cleaning fluid sprayed from the nozzle will spread out after contacting the wafer. The spread of high-temperature cleaning fluid achieves all-round high-temperature cleaning of the wafer. Compared with the current high-temperature cleaning devices, this invention has several adsorption components, each of which is independent. When cleaning the wafer, the operator can control the adsorption components at specific positions to work alternately according to the preset program or manually set instructions. This allows the operator to switch the fixed position of the wafer at different times as needed during wafer cleaning. Through the above technical solution, it is ensured that all areas of the wafer can be exposed to the high-temperature cleaning fluid in one cleaning process, completely avoiding the cleaning dead spots caused by the positioning points of traditional fixing mechanisms.

[0007] Furthermore, several fixing mechanisms are evenly arranged on the mounting base. Each fixing mechanism has an upper insulation plate directly above it, and each upper insulation plate has a nozzle. The structure and internal configuration of each fixing mechanism are identical. A rotary motor is located below the mounting base. The rotary motor drives the several fixing mechanisms to rotate synchronously on the mounting base through a transmission component. Through the above technical solution, the present invention can simultaneously perform high-temperature cleaning on multiple wafers. That is, after placing wafers on several fixing mechanisms, the operator can control several upper insulation plates and several lower insulation plates to approach the matching wafers, then turn on the nozzles on the several upper insulation plates and several lower insulation plates, and finally, drive the several fixing mechanisms to rotate with several wafers through the rotary motor, thereby improving the wafer cleaning efficiency.

[0008] Furthermore, the adsorption assembly includes a fixed base and a positioning base. The positioning base is positioned above the fixed base and has several adsorption holes. The fixed base houses a second three-way valve and a vacuum pump. One end of the second three-way valve is connected to the air inlet of the vacuum pump, and the other end is connected to the environment inside the cleaning chamber. The last end of the second three-way valve is connected to the positioning base via a telescopic tube. A telescopic assembly is provided on the side of the mounting slot, controlling the raising and lowering of the positioning base. When the wafer is placed on the fixing mechanism, the adsorption assembly at a specific position is individually controlled according to a preset program or manual instruction. Specifically, first, the positioning base is raised by controlling the telescopic assembly on the side of the target adsorption assembly. Then, the second three-way valve of the target adsorption assembly is switched to the telescopic tube connection state with the vacuum pump. Next, the vacuum pump draws air away from the positioning base. This allows the target adsorption component to fix the wafer on the turntable through the negative pressure generated at the adsorption orifice. If the position of the wafer fixing point needs to be changed, the operator only needs to open the telescopic component on the side of the new target adsorption component to control the positioning seat to rise, and then switch the second three-way valve of the new target adsorption component to the telescopic tube and vacuum pump connection state. Then, the vacuum pump of the new target adsorption component sucks away the air in the positioning seat, so that the new target adsorption component can fix the wafer. Finally, the vacuum pump in the previous target adsorption component is turned off, and the telescopic component on the side of the previous target adsorption component is controlled to drive the positioning seat to descend. Through the above technical solution, the present invention can fix different positions of the wafer as needed by controlling the operation of the adsorption component at a specific position. Combined with the alternating working mode, it ensures that all areas of the wafer can be exposed to the high-temperature cleaning fluid during the cleaning process, completely eliminating the cleaning dead spots of the traditional fixing method.

[0009] Furthermore, the telescopic assembly includes two telescopic slots, which are respectively located on both sides of the mounting slot. Each telescopic slot contains a spring telescopic rod, and both spring telescopic rods are connected to the positioning seat. The fixed seat also contains a first three-way valve, one end of which is connected to the air outlet of the vacuum pump, and the other two ends of which are connected to the two telescopic slots respectively. When the telescopic assembly is not in operation, the fixed seat and the positioning seat are in contact, and the springs on the spring telescopic rods are in their natural state. When the operator needs the positioning seat of the target adsorption component at a specific location to rise, the cleaning chamber environment can be connected to the vacuum pump through the second three-way valve. Then, the vacuum pump delivers air from the cleaning chamber environment to the two telescopic slots. Under the action of air pressure, the two spring telescopic rods lift the positioning seat of the target adsorption component at the specific location. When the positioning seat of the target adsorption component at the specific location rises to its maximum extent, the telescopic tube is connected to the vacuum pump through the second three-way valve. At this time, the vacuum pump sucks away the air in the positioning seat.

[0010] Furthermore, the adsorption holes are arranged in multiple rows, with a gap between adjacent rows. A sealing plate is positioned below each row of adsorption holes, and each sealing plate has the same number of sealing blocks as the corresponding row of adsorption holes. Each sealing plate is connected to a positioning seat via a compression spring. An electromagnet is positioned below each sealing plate. When the wafer is placed on the adsorption assembly, the operator can activate the corresponding electromagnet according to the wafer's diameter. That is, the electromagnet located in the area completely covered by the wafer remains open. At this time, the sealing plate in that area moves away from the adsorption holes under magnetic force (the sealing blocks and adsorption holes are separated), and the adsorption holes can normally generate negative pressure to adsorb the wafer. For areas not covered by the wafer... The electromagnets in the corresponding rows of the wafer-shielded adsorption holes are in a closed state. Under the action of the compression spring, the sealing plates in the corresponding rows approach the adsorption holes (the sealing blocks are inserted into the adsorption holes). Through the above technical solution, the present invention can accurately control the opening and closing of the electromagnets at the corresponding positions according to the diameter of the wafer. On the one hand, multi-point adsorption ensures that wafers of different diameters can be stably fixed on the positioning base, avoiding wafer displacement caused by unstable fixation during the cleaning process. On the other hand, the adsorption holes not covered by the wafer can be effectively prevented from the high-temperature cleaning fluid from seeping into the interior of the positioning base through these exposed adsorption holes during the cleaning process, preventing the cleaning fluid from damaging the positioning base, thereby ensuring the long-term stable operation of the adsorption assembly.

[0011] Furthermore, the transmission assembly includes a first gear and a second gear. Several first gears are provided, and each fixed mechanism is connected to one first gear. The second gear is arranged among several first gears. The rotary motor is connected to the second gear. During the cleaning of multiple wafers, the rotary motor and the second gear drive several first gears and several fixed mechanisms to rotate synchronously, thereby improving the wafer cleaning efficiency.

[0012] Furthermore, a first valve is provided above the nozzle, which is connected to the cleaning fluid supply system via a first hose. A second valve is provided on the side of the nozzle, which is connected to an external high-temperature gas delivery system via a second hose. When the wafer is being cleaned at high temperature, the first valve is in the open state and the second valve is in the closed state. At this time, the cleaning fluid supply system delivers high-temperature cleaning fluid into the nozzle. When the high-temperature cleaning of the wafer is finished, the first valve is in the closed state and the second valve is in the open state. At this time, the external high-temperature gas delivery system delivers high-temperature nitrogen gas into the nozzle to avoid high-temperature cleaning fluid residue on the wafer, which would affect subsequent removal.

[0013] Furthermore, the nozzle is internally equipped with several guide plates, each horseshoe-shaped, connected end-to-end by several connecting pipes. Each guide plate contains a heating element, and each connecting pipe contains a temperature sensing element. A baffle is installed on one of the guide plates near the first valve. This invention uses the baffle to ensure that the high-temperature cleaning fluid flowing from the first valve into the nozzle during wafer cleaning can flow along the guide plates. The heating elements in the guide plates provide secondary heating for the high-temperature cleaning fluid, ensuring that the temperature of the high-temperature cleaning fluid sprayed from the nozzle meets the rated temperature. Compared to current secondary heating technology installed at the nozzle, this invention, by incorporating an independent heating element in each guide plate and working with the temperature sensing element in the connecting pipe, can achieve segmented progressive heating to achieve precise temperature control (such as dynamically adjusting the heating power of each segment according to the cleaning fluid flow rate), avoiding local overheating or underheating, and ensuring the temperature uniformity of the high-temperature cleaning fluid when sprayed.

[0014] The cleaning process used in a high-temperature cleaning apparatus for VCSEL chip wafers includes the following steps:

[0015] S1: The wafer is fixed by a fixing mechanism, and the lower insulation plate and the upper insulation plate are driven to approach the wafer by the first cylinder and the second cylinder;

[0016] S2: High-temperature cleaning fluid is sprayed onto the wafer through nozzles on the lower and upper insulation plates;

[0017] S3: The fixed mechanism and wafer are rotated by a rotary motor;

[0018] S4: Wafer cleaning is complete. Turn off the nozzle, rotary motor and fixing mechanism, and remove the wafer from the fixing mechanism.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] 1. Compared with current wafer high-temperature cleaning devices, this invention has a fixing mechanism with several independently controllable adsorption components. Each adsorption component can be individually controlled by a preset program or manual command. During the cleaning process, the operator can flexibly switch the fixed position of the wafer at different time periods as needed, so that the area of ​​the wafer surface that was originally blocked by the adsorption components can be exposed to the high-temperature cleaning fluid. This alternating positioning working mode, combined with the design of the rotating motor driving the fixing mechanism to rotate the wafer, enables the high-temperature cleaning fluid to cover the upper and lower surfaces of the wafer in all directions without dead angles. This fundamentally solves the problem of cleaning dead angles caused by the fixing mechanism in traditional cleaning devices, and significantly improves the cleaning cleanliness of wafers used for VCSEL chip processing.

[0021] 2. This invention also includes a sealing plate and an electromagnet in the positioning seat of the adsorption component. The cooperation of the sealing plate and the electromagnet ensures that wafers of different diameters can be stably fixed on the positioning seat, avoiding wafer displacement caused by unstable fixing during the cleaning process. On the other hand, it effectively prevents high-temperature cleaning fluid from seeping into the adsorption component, avoiding corrosion and damage to the internal parts of the adsorption component, ensuring the long-term stable operation of the adsorption component, and reducing equipment downtime caused by component damage. In addition, this invention also includes several horseshoe-shaped guide plates inside the nozzle. Through the independent heating element built into each guide plate and the temperature measuring element in the connecting pipe, segmented and precise temperature control can be achieved, thereby avoiding local overheating or insufficient heating, and preventing the temperature of the high-temperature cleaning fluid from being substandard, which would affect the wafer cleaning effect.

[0022] 3. This invention adopts a design with multiple fixing mechanisms working synchronously. Several fixing mechanisms are evenly arranged on the mounting base. Each fixing mechanism has an upper insulation plate and a nozzle directly above it. All fixing mechanisms can rotate synchronously under the drive of a rotary motor and transmission components. Workers can place wafers on multiple fixing mechanisms at the same time. By controlling the upper and lower insulation plates to move closer to the wafers and opening the nozzles, multiple wafers can be cleaned synchronously. Compared with the traditional single wafer cleaning mode, this batch cleaning method can significantly shorten the cleaning time and increase the wafer processing capacity per unit time. It can achieve synchronous cleaning of multiple wafers and greatly improve the cleaning efficiency. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the appearance of the present invention;

[0024] Figure 2 This is a schematic diagram of the internal structure of the cleaning chamber of the present invention;

[0025] Figure 3 This is a schematic diagram showing the position of the fixing mechanism of the present invention;

[0026] Figure 4 This is a schematic diagram of the transmission component structure of the present invention;

[0027] Figure 5 This is a schematic diagram of the fixing mechanism structure of the present invention;

[0028] Figure 6 This is a schematic diagram of the telescopic component structure of the present invention;

[0029] Figure 7 This is a schematic diagram of the internal structure of the fixing base of the present invention;

[0030] Figure 8 This is a schematic diagram of the internal structure of the positioning seat of the present invention;

[0031] Figure 9 This is a schematic diagram of the nozzle appearance of the present invention;

[0032] Figure 10 This is a schematic diagram of the internal structure of the nozzle of the present invention;

[0033] Figure 11 For the present invention Figure 6 Schematic diagram of the structure of section A.

[0034] In the diagram: 1. Machine body; 2. Display; 3. Workbench; 31. Mounting base; 311. First gear; 312. Second gear; 313. Rotary motor; 32. Turntable; 321. First cylinder; 322. Lower insulation plate; 323. Fixed base; 3231. First three-way valve; 3232. Second three-way valve; 3233. Telescopic tube; 3234. Vacuum pump; 324. Positioning base; 3241. Sealing plate; 3242. Electromagnet; 325. Mounting slot; 326. Telescopic slot; 3261. Spring telescopic rod; 4. Upper insulation plate; 41. Second cylinder; 5. Wafer; 6. Nozzle; 61. First valve; 62. Second valve; 63. Guide plate; 631. Connecting pipe; 632. Partition plate. Detailed Implementation

[0035] Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Example: Figures 1-10As shown, the present invention provides a technical solution: a high-temperature cleaning device for VCSEL chip wafers. The high-temperature cleaning device includes a body 1, a cleaning chamber located in the middle of the body 1, a worktable 3 inside the cleaning chamber, a cleaning fluid supply system on the upper part of the body 1, and a display 2 on the outer side of the body 1 to detect the remaining amount of cleaning fluid in the cleaning fluid supply system. A cleaning fluid recovery system is located at the bottom of the body 1. A mounting base 31 is located on the worktable 3, and a fixing mechanism is located on the mounting base 31. An upper heat preservation plate 4 is located directly above the fixing mechanism and is connected to the top of the cleaning chamber via a second cylinder 41. A nozzle 6 is located on the upper heat preservation plate 4, and the cleaning fluid supply system is connected to the nozzle 6. A drain hole is located on the worktable 3 and is connected to the cleaning fluid recovery system. The fixing mechanism serves to fix the wafer 5, and the high-temperature cleaning fluid from the cleaning fluid supply system is sprayed onto the surface of the wafer 5 through the nozzle 6 to clean the wafer 5.

[0037] like Figures 2-9 As shown, a rotary motor 313 is installed below the mounting base 31. The rotary motor 313 is connected to the fixing mechanism through a transmission assembly. The fixing mechanism includes a turntable 32 and an adsorption assembly. Several mounting slots 325 are provided on the upper end of the turntable 32, and an adsorption assembly is installed in each mounting slot 325. A lower insulation plate 322 is installed inside the turntable 32. The lower insulation plate 322 is connected to the bottom of the cleaning chamber through a first cylinder 321. A nozzle 6 is also provided on the lower insulation plate 322. When the wafer 5 is placed on the fixing mechanism, it is fixed by the adsorption assembly. When cleaning the wafer 5, the lower insulation plate 322 and the upper insulation plate 4 are driven to approach the wafer 5 by the first cylinder 321 and the second cylinder 41. Then, the nozzles 6 on the lower insulation plate 322 and the upper insulation plate 4 are opened. At this time, the high-temperature cleaning fluid will be sprayed onto the upper and lower surfaces of the wafer 5 to ensure the uniformity of the temperature of the wafer 5 during cleaning. Next, the rotary motor 313 is turned on, and the fixed mechanism is driven to rotate on the mounting base 31 by the rotary motor 313 and the transmission assembly. During the rotation of the fixed mechanism, the high-temperature cleaning fluid sprayed from the nozzle 6 will spread out after contacting the wafer 5. The high-temperature cleaning fluid spread out to achieve all-round high-temperature cleaning of the wafer 5. Compared with the current high-temperature cleaning device, the present invention has a number of adsorption components, each of which is independent. When cleaning the wafer 5, the operator can control the adsorption components at specific positions to work alternately according to the preset program or manually set instructions. In this way, the operator can switch the fixed position of the wafer 5 at different times as needed. Through the above technical solution, it is ensured that all areas of the wafer can be exposed to the high-temperature cleaning fluid in one cleaning process, and the cleaning dead corners caused by the positioning point of the traditional fixed mechanism are completely avoided.

[0038] like Figures 2-4As shown, several fixing mechanisms are evenly arranged on the mounting base 31. Each fixing mechanism has an upper insulation plate 4 directly above it, and each upper insulation plate 4 has a nozzle 6. The structure and internal configuration of each fixing mechanism are the same. A rotary motor 313 is arranged below the mounting base 31. The rotary motor 313 drives the several fixing mechanisms to rotate synchronously on the mounting base 31 through a transmission component. Through the above technical solution, the present invention can simultaneously perform high-temperature cleaning on multiple wafers. That is, after placing wafers 5 on several fixing mechanisms, the operator can control several upper insulation plates 4 and several lower insulation plates 322 to approach the matching wafers 5, then turn on the nozzles 6 on several upper insulation plates 4 and several lower insulation plates 322, and finally, drive several fixing mechanisms to rotate with several wafers 5 through the rotary motor 313, thereby improving the cleaning efficiency of wafers 5.

[0039] like Figure 3 , Figures 5-8 , Figure 11As shown, the adsorption assembly includes a fixed base 323 and a positioning base 324. The positioning base 324 is positioned above the fixed base 323 and has several adsorption holes. The fixed base 323 houses a second three-way valve 3232 and a vacuum pump 3234. One end of the second three-way valve 3232 is connected to the air inlet of the vacuum pump 3234, and the other end is connected to the environment inside the cleaning chamber. The last end of the second three-way valve 3232 is connected to the positioning base 324 via a telescopic tube 3233. The connection and mounting slot 325 is equipped with a telescopic component on its side. This telescopic component controls the raising and lowering of the positioning seat 324. When the wafer 5 is placed on the fixing mechanism, the adsorption component at a specific position is individually controlled according to a preset program or manual instruction. Specifically, the positioning seat 324 is first raised by controlling the telescopic component on the side of the target adsorption component. Then, the second three-way valve 3232 of the target adsorption component is switched to the state where the telescopic tube 3233 connects to the vacuum pump 3234. Finally, the vacuum pump 3234 is used to position the... Air is drawn out of the seat 324 so that the target adsorption component can fix the wafer 5 on the turntable 32 through the negative pressure generated at the adsorption hole. If it is necessary to change the position of the wafer 5, the operator only needs to open the telescopic component on the side of the new target adsorption component to control the positioning seat 324 to rise, and then switch the second three-way valve 3232 of the new target adsorption component to the state of connecting the telescopic tube 3233 and the vacuum pump 3234. Then, the vacuum pump 3234 of the new target adsorption component draws out the air in the positioning seat 324 so that the new target adsorption component can fix the wafer 5. Finally, the vacuum pump 3234 in the previous target adsorption component is turned off, and the telescopic component on the side of the previous target adsorption component is controlled to drive the positioning seat 324 to descend. Through the above technical solution, the present invention can fix the wafer 5 at different positions as needed by controlling the adsorption component at a specific position. Combined with the alternating working mode, it ensures that all areas of the wafer 5 can be exposed to the high temperature cleaning fluid during the cleaning process, completely eliminating the cleaning dead corners of the traditional fixing method.

[0040] like Figures 6-8 , Figure 11As shown, the telescopic assembly includes two telescopic slots 326, which are respectively disposed on both sides of the mounting slot 325. Each telescopic slot 326 contains a spring telescopic rod 3261, and both spring telescopic rods 3261 are connected to the positioning seat 324. The fixed seat 323 also contains a first three-way valve 3231. One end of the first three-way valve 3231 is connected to the outlet of the vacuum pump 3234, and the other two ends of the first three-way valve 3231 are respectively connected to the two telescopic slots 326. When the telescopic assembly is not in operation, the fixed seat 323 is in contact with the positioning seat 324, and the springs on the spring telescopic rods 3261 are in their natural state. When in operation... When the operator needs the target adsorption component positioning seat 324 at a specific location to rise, the cleaning chamber environment can be connected to the vacuum pump 3234 through the second three-way valve 3232. Then, the vacuum pump 3234 delivers air from the cleaning chamber environment to the two telescopic grooves 326. Under the action of air pressure, the two spring telescopic rods 3261 raise the target adsorption component positioning seat 324 at the specific location. When the target adsorption component positioning seat 324 at the specific location rises to its maximum height, the telescopic tube 3233 is connected to the vacuum pump 3234 through the second three-way valve 3232. At this time, the vacuum pump 3234 sucks away the air in the positioning seat 324.

[0041] like Figure 8As shown, the adsorption holes are arranged in multiple rows, with a gap between adjacent rows. A sealing plate 3241 is positioned below each row of adsorption holes. Each sealing plate 3241 has the same number of sealing blocks as the corresponding row of adsorption holes. Each sealing plate 3241 is connected to a positioning seat 324 via a compression spring. An electromagnet 3242 is positioned below each sealing plate 3241. When the wafer 5 is placed on the adsorption assembly, the operator can activate the corresponding electromagnet 3242 according to the diameter of the wafer 5. That is, the electromagnet 3242 located in the area completely covered by the wafer 5 remains open. At this time, the sealing plate 3241 in this area moves away from the adsorption hole under the action of magnetic force (the sealing block and the adsorption hole are in a separated state), and the adsorption hole can normally generate negative pressure to adsorb the wafer 5; while for the adsorption holes that are not blocked by the wafer 5, the electromagnets 3242 in the corresponding row are in a closed state. Under the action of the compression spring, the sealing plate 3241 in the corresponding row moves closer to the adsorption hole (the sealing block is inserted into the adsorption hole). Through the above technical solution, the present invention can accurately control the opening and closing of the corresponding electromagnets 3242 according to the diameter of the wafer 5. On the one hand, multi-point adsorption ensures that wafers 5 of different diameters can be stably fixed on the positioning seat 324, avoiding the wafer 5 from shifting due to unstable fixation during the cleaning process; on the other hand, the adsorption holes that are not blocked by the wafer 5 can effectively prevent the high temperature cleaning fluid from seeping into the interior of the positioning seat 324 through these exposed adsorption holes during the cleaning process, preventing the cleaning fluid from damaging the positioning seat 324, thereby ensuring the long-term stable operation of the adsorption assembly.

[0042] like Figures 3-4 As shown, the transmission assembly includes a first gear 311 and a second gear 312. Several first gears 311 are provided, and each fixed mechanism is connected to one first gear 311. The second gear 312 is arranged among several first gears 311. A rotary motor 313 is connected to the second gear 312. During the cleaning process of multiple wafers 5, the rotary motor 313 and the second gear 312 drive several first gears 311 and several fixed mechanisms to rotate synchronously, thereby achieving the purpose of improving the cleaning efficiency of wafers 5.

[0043] like Figures 9-10As shown, a first valve 61 is provided above the nozzle 6. The first valve 61 is connected to the cleaning fluid supply system through a first hose. A second valve 62 is provided on the side of the nozzle 6. The second valve 62 is connected to an external high-temperature gas delivery system through a second hose. When the wafer 5 is being cleaned at high temperature, the first valve 61 is in the open state and the second valve 62 is in the closed state. At this time, the cleaning fluid supply system delivers high-temperature cleaning fluid into the nozzle 6. When the high-temperature cleaning of the wafer 5 is finished, the first valve 61 is in the closed state and the second valve 62 is in the open state. At this time, the external high-temperature gas delivery system delivers high-temperature nitrogen gas into the nozzle 6 to avoid high-temperature cleaning fluid residue on the wafer 5, which would affect subsequent removal.

[0044] like Figures 9-10 As shown, the nozzle 6 has several guide plates 63 inside, each of which is horseshoe-shaped. These guide plates 63 are connected end-to-end by several connecting pipes 631. Each guide plate 63 has a heating element inside, and each connecting pipe 631 has a temperature sensing element inside. A baffle 632 is installed on one of the guide plates 63 near the first valve 61. This invention uses the baffle 632 to ensure that during cleaning of the wafer 5, the high-temperature cleaning fluid flowing from the first valve 61 into the nozzle 6 can flow along the guide plates 63 and through the several... The heating element within each guide plate 63 serves to reheat the high-temperature cleaning fluid, ensuring that the temperature of the high-temperature cleaning fluid sprayed from the nozzle 6 meets the rated temperature. Compared to the current secondary heating technology installed at the nozzle 6, this invention, by incorporating an independent heating element within each guide plate 63 and cooperating with the temperature sensing element within the connecting pipe 631, can achieve segmented progressive heating to achieve precise temperature control (such as dynamically adjusting the heating power of each segment according to the cleaning fluid flow rate), avoiding local overheating or insufficient heating, and ensuring the uniformity of the temperature of the high-temperature cleaning fluid when sprayed.

[0045] The cleaning process used in a high-temperature cleaning apparatus for VCSEL chip wafers includes the following steps:

[0046] S1: The wafer 5 is fixed by the fixing mechanism, and the lower insulation plate 322 and the upper insulation plate 4 are driven to approach the wafer 5 by the first cylinder 321 and the second cylinder 41.

[0047] S2: High-temperature cleaning fluid is sprayed onto the wafer 5 through nozzles 6 on the lower insulation plate 322 and the upper insulation plate 4;

[0048] S3: The fixing mechanism and wafer 5 are rotated by a rotary motor 313;

[0049] S4: Wafer 5 cleaning is complete. Close nozzle 6, rotary motor 313 and fixing mechanism, and remove wafer 5 from fixing mechanism.

[0050] The working principle of this invention is as follows: During operation, the wafer 5 is placed on the fixing mechanism, and then the adsorption component at a specific position is controlled to hold the wafer 5 in place. Next, the first cylinder 321 and the second cylinder 41 drive the lower insulation plate 322 and the upper insulation plate 4 closer to the wafer 5, and the nozzles 6 on the lower insulation plate 322 and the upper insulation plate 4 are activated. At this time, high-temperature cleaning fluid is sprayed onto the upper and lower surfaces of the wafer 5. Finally, the rotary motor 313 is activated, and the rotary motor 313 and the transmission component drive the fixing mechanism to rotate on the mounting base 31. During the cleaning of the wafer 5... Staff can control the adsorption components at specific locations to work alternately according to preset programs or manually set instructions. This allows staff to switch the fixed position of wafer 5 at different times as needed during wafer 5 cleaning, ensuring that all areas of the wafer are exposed to the high-temperature cleaning fluid during one cleaning process. Finally, after wafer 5 is cleaned, the first valve 61 is closed and the second valve 62 is opened. At this time, the external high-temperature gas delivery system delivers high-temperature nitrogen gas into the nozzle 6, which can prevent the high-temperature cleaning fluid from remaining on wafer 5 and affecting subsequent removal.

[0051] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-temperature cleaning device for VCSEL chip wafers, characterized in that: The high-temperature cleaning device includes a body (1), a cleaning chamber is provided in the middle of the body (1), a workbench (3) is provided in the cleaning chamber, a cleaning fluid supply system is provided on the upper part of the body (1), a cleaning fluid recovery system is provided at the bottom of the body (1), a mounting base (31) is provided on the workbench (3), a fixing mechanism is provided on the mounting base (31), the fixing mechanism can fix the wafer (5) at different positions as needed, an upper heat preservation plate (4) is provided directly above the fixing mechanism, the upper heat preservation plate (4) is connected to the top of the cleaning chamber through a second cylinder (41), and a nozzle (6) is provided on the upper heat preservation plate (4). The fixing mechanism includes a turntable (32) and an adsorption component. The upper end of the turntable (32) is provided with several mounting slots (325), and each mounting slot (325) is provided with an adsorption component. The turntable (32) is provided with a lower insulation plate (322), which is connected to the bottom of the cleaning chamber through a first cylinder (321). The lower insulation plate (322) is also provided with a nozzle (6). Several independent and controllable adsorption components are set on the fixed mechanism. Each adsorption component can be controlled individually through a preset program or manual instruction. During the cleaning process, the staff can flexibly switch the fixed position of the wafer (5) at different time periods as needed, so that the area on the surface of the wafer (5) that was originally covered by the adsorption components can be exposed to the high temperature cleaning liquid. The fixing mechanism is provided in several ways, and the fixing mechanism is evenly arranged on the mounting base (31). Each fixing mechanism is provided with an upper insulation plate (4) directly above it, and each upper insulation plate (4) is provided with a nozzle (6). The structure and internal configuration of each fixing mechanism are the same. A rotary motor (313) is provided below the mounting base (31). The rotary motor (313) drives the fixing mechanism to rotate synchronously on the mounting base (31) through a transmission component. The adsorption assembly includes a fixed seat (323) and a positioning seat (324). The positioning seat (324) is located above the fixed seat (323) and has several adsorption holes. The fixed seat (323) is equipped with a second three-way valve (3232) and a vacuum pump (3234). One end of the second three-way valve (3232) is connected to the air inlet of the vacuum pump (3234), and the other end of the second three-way valve (3232) is connected to the environment inside the cleaning chamber. The last end of the second three-way valve (3232) is connected to the positioning seat (324) through a telescopic tube (3233). A telescopic assembly is provided on the side of the mounting groove (325) to control the raising and lowering of the positioning seat (324). The telescopic assembly includes two telescopic grooves (326), which are respectively arranged on both sides of the mounting groove (325). Each telescopic groove (326) is provided with a spring telescopic rod (3261). Both spring telescopic rods (3261) are connected to the positioning seat (324). The fixed seat (323) is also provided with a first three-way valve (3231). One end of the first three-way valve (3231) is connected to the air outlet of the vacuum pump (3234), and the other two ends of the first three-way valve (3231) are respectively connected to the two telescopic grooves (326).

2. The VCSEL chip wafer high-temperature cleaning device according to claim 1, characterized in that: The adsorption holes are arranged in multiple rows with a gap between adjacent rows. A sealing plate (3241) is provided below each row of adsorption holes. Each sealing plate (3241) has the same number of sealing blocks as the corresponding row of adsorption holes. Each sealing plate (3241) is connected to the positioning seat (324) by a compression spring. An electromagnet (3242) is provided below each sealing plate (3241).

3. The VCSEL chip wafer high-temperature cleaning apparatus according to claim 2, characterized in that: The transmission assembly includes a first gear (311) and a second gear (312). There are several first gears (311), and each fixing mechanism is connected to one first gear (311). The second gear (312) is arranged between several first gears (311). The rotary motor (313) is connected to the second gear (312).

4. The VCSEL chip wafer high-temperature cleaning apparatus according to claim 1, characterized in that: A first valve (61) is provided above the nozzle (6), and the first valve (61) is connected to the cleaning fluid supply system through a first hose. A second valve (62) is provided on the side of the nozzle (6), and the second valve (62) is connected to the external high-temperature gas delivery system through a second hose.

5. The VCSEL chip wafer high-temperature cleaning apparatus according to claim 4, characterized in that: The nozzle (6) is provided with several guide plates (63), each of which is horseshoe-shaped. The guide plates (63) are connected end to end by several connecting pipes (631). Each guide plate (63) is provided with a heating element, and each connecting pipe (631) is provided with a temperature measuring element. A baffle (632) is provided on one of the guide plates (63) near the first valve (61).

6. The cleaning process using the VCSEL chip wafer high-temperature cleaning apparatus as described in claim 1, characterized in that... The steps include the following: S1: The wafer (5) is fixed by a fixing mechanism, and the lower insulation plate (322) and the upper insulation plate (4) are driven to approach the wafer (5) by the first cylinder (321) and the second cylinder (41). S2: High-temperature cleaning fluid is sprayed onto the wafer (5) through nozzles (6) on the lower insulation plate (322) and the upper insulation plate (4); S3: The fixing mechanism and the wafer (5) are rotated by a rotary motor (313); S4: The cleaning of the wafer (5) is completed. The nozzle (6), the rotary motor (313) and the fixing mechanism are turned off, and the wafer (5) is removed from the fixing mechanism.

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