Paper tray processing method and device, electronic equipment and storage medium

Abstract

The invention relates to the technical field of paperboard processing, in particular to a processing method and device of a paper tray, electronic equipment and a storage medium. The method comprises the following steps: firstly, rolling a bonding surface of the footing to form a concave-convex surface; then filling glue into the concave part of the concave-convex surface to form a flat surface; and finally, gluing on the flat surface to form a bonding layer. Potential depressions on the bonding surfaces of the bottom feet are shown through pre-rolling, then the depressions are eliminated through glue filling to achieve surface smoothness, gluing is carried out on the basis, and therefore the reason for unevenness of a glue layer in the gluing process of the paper tray is solved in advance and then gluing is carried out. Therefore, the technical problem that the bonding stability is poor due to the fact that the glue layer is uneven in the gluing process of the paper tray is solved.

Description

Technical Field

[0001] This application relates to the technical field of paperboard processing, and more particularly to a method, apparatus, electronic device, and storage medium for processing paper pallets. Background Technology

[0002] Paper pallets, as environmentally friendly load-bearing devices made from recycled paper and corrugated paper, are widely used in logistics transportation, warehousing and stacking scenarios due to their advantages such as light weight, recyclability, and low cost. Their structure consists of a panel for carrying goods and feet supporting the panel, with the feet evenly distributed under the panel to form stable support. The production process of paper pallets includes raw material pretreatment, foot gluing, panel and foot assembly, pressure curing, and finished product finishing.

[0003] The base is mostly made of corrugated cardboard. This structure, consisting of multiple layers of corrugated core paper bonded to a flat linerboard, can distribute pressure and improve compressive strength through its corrugated design. However, the raised core paper creates contact points, and the recessed areas form gaps, resulting in an inherently uneven surface on the base. In existing technologies, the adhesive application process involves driving the base cardboard through an adhesive roller to achieve adhesive adhesion. However, the pressure applied by the adhesive roller to the adhesive surface of the base causes the concave areas to sink further, resulting in insufficient adhesive application in the concave areas and ultimately forming an uneven adhesive layer. This uneven adhesive layer reduces the effective bonding area between the base and the panel, lowers the bonding strength, and leads to stability problems such as loose bases and panel tilting when the paper pallet is under load.

[0004] Therefore, how to solve the problem of uneven adhesive layer during the glue application process on the bottom of paper pallets is an urgent technical issue that needs to be addressed. Summary of the Invention

[0005] To overcome the problems existing in the related technologies, this application provides a processing method, apparatus, electronic device and storage medium for paper pallets, which solves the technical problem of uneven adhesive layer during the adhesive application process of paper pallet bottoms in the prior art.

[0006] The first aspect of this invention provides a method for processing paper pallets, comprising: S1: Roll the bonding surface of the base to form a concave-convex surface; S2: Fill the recessed areas of the uneven surface with glue to form a smooth surface; S3: Apply adhesive to the flat surface to form an adhesive layer.

[0007] In the first possible implementation of the first aspect, S1 includes: S11: Obtain the width L of the base; S12: Based on L and the preset linear pressure value P 线 Calculate the total pressure F of the pressure roller 总 F 总 =L·P线 ; S13: With F 总 The adhesive surface of the base is rolled to form a concave-convex surface.

[0008] In the second possible implementation of the first aspect, after S2 and before S3, it also includes: S21: Curing of the flat surface.

[0009] In the third possible implementation of the first aspect, after S2 and before S3, it also includes: S22: Perform initial curing on the flat surface; S23: Roughen the flat surface to form a rough surface; S24: Curing the rough surface.

[0010] In conjunction with the third possible implementation of the first aspect, in the fourth possible implementation of the first aspect, the rough surface is presented as a cross-grid groove structure or a conical recessed matrix.

[0011] In the fifth possible implementation of the first aspect, the materials used for filling the adhesive in S2 include inorganic thickeners and microsphere fillers.

[0012] A second aspect of the present invention provides a paper pallet processing apparatus, employing any of the possible methods provided in the first aspect, comprising: Roll forming assembly, used to roll form the adhesive surface of the base; A filler assembly is used to fill the recesses in uneven surfaces with adhesive. Adhesive application assembly, used for applying adhesive to flat surfaces.

[0013] In a first possible implementation of the second aspect, the roller pressing assembly includes a pressure roller with an axially convex arcuate profile; The surface of the pressure roller is fitted with a depth-adaptive elastic liner.

[0014] A third aspect of this application provides an electronic device, comprising: Processor; and The memory stores executable code, which, when executed by the processor, causes the processor to execute any of the possible implementations provided in the first aspect.

[0015] The fourth aspect of this application provides a non-transitory machine-readable storage medium having executable code stored thereon, which, when executed by a processor of an electronic device, causes the processor to perform any of the possible implementations of the method provided in the first aspect.

[0016] The technical solution provided in this application may include the following beneficial effects: The technical solution of this application first rolls the bonding surface of the base to form a concave-convex surface; then fills the depressions of the concave-convex surface with glue to form a flat surface; finally, applies glue to the flat surface to form an adhesive layer. By pre-rolling to reveal the potential depressions of the bonding surface of the base, and then filling these depressions with glue to eliminate them and achieve a flat surface, the glue is applied on this basis. This solves the problem of uneven glue layer during the glue application process of paper pallets by addressing the cause of uneven glue layer beforehand.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0018] The above and other objects, features and advantages of this application will become more apparent from the more detailed description of exemplary embodiments thereof in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments thereof.

[0019] Figure 1 This is a schematic flowchart illustrating a paper pallet processing method according to an embodiment of this application; Figure 2 This is another schematic flowchart illustrating a paper pallet processing method according to an embodiment of this application; Figure 3 This is another schematic flowchart illustrating a paper pallet processing method according to an embodiment of this application; Figure 4 This is another schematic flowchart illustrating a paper pallet processing method according to an embodiment of this application; Figure 5 This is a schematic diagram of the structure of an electronic device shown in an embodiment of this application. Detailed Implementation

[0020] Preferred embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0021] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0022] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0023] In the description of this application, it should be understood that the terms "thickness", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. Example

[0025] Because the base of the paper pallet is made of corrugated cardboard, in existing technology, the adhesive application process involves driving the cardboard base through an adhesive roller to achieve adhesive adhesion. However, the pressure applied by the adhesive roller to the adhesive surface of the base causes the concave surface to sink further, resulting in insufficient adhesive application in the concave areas and ultimately forming an uneven adhesive layer. This uneven adhesive layer reduces the effective bonding area between the base and the panel, leading to reduced bond strength and consequently causing stability problems such as loose bases and panel tilting when the paper pallet is under load. Therefore, solving the problem of uneven adhesive layer during the adhesive application process of the paper pallet base is an urgent technical issue that needs to be addressed.

[0026] To address the aforementioned issues, this application provides a method for processing paper pallets.

[0027] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.

[0028] Figure 1 A flowchart of the paper pallet processing method.

[0029] See Figure 1 The processing method of the paper pallet in this embodiment includes: S1: Roll the bonding surface of the base to form a concave-convex surface; It should be noted that: the base refers to the columnar or block-shaped structure used to support the panel, usually made of multiple layers of corrugated cardboard glued together. Although corrugated cardboard has a flat layer of cardboard glued to the surface of the core paper, because the core paper is wavy, some areas lack support underneath. Under small-area external pressure, it is prone to collapse, especially during the glue application process. Because the glue roller has a limited range of action, when pressure is applied to unsupported areas, it causes the cardboard to sink. Since this sinking is uncontrollable, it leads to insufficient glue application.

[0030] This step involves pre-rolling the bonding surface of the base, revealing the depressions that were originally hidden beneath the cardboard, creating a textured surface. This transforms uncontrollable depressions into a controllable structure. The bonding surface refers to the surface of the base that connects to the panel of the paper tray; its flatness and adhesive uniformity directly affect the bonding strength between the base and the panel. Rolling refers to applying a preset pressure to the bonding surface by rolling a pre-pressure roller over it. The surface of the pre-pressure roller can be designed to be smooth or have a specific texture, causing plastic deformation of the bonding surface through pressure. The textured surface refers to the regular depressions and protrusions formed on the bonding surface of the base after rolling.

[0031] Specifically, the pre-pressure roller applies pressure to the bonding surface of the bottom paper block. The pressure is preset. Because the bottom is made of corrugated cardboard, its stress resistance is weaker in areas without corrugated layer support. When subjected to the pressure of the pre-pressure roller, it will sink downwards due to the lack of support below. Therefore, the preset pressure setting must ensure that the cardboard between the support edges is deformed under pressure without the support edges collapsing. The method of rolling the bonding surface of the bottom includes passing the bottom paper block through a stationary pre-pressure roller, and also driving the pre-pressure roller to pass over the bonding surface of the bottom paper block to form a concave-convex surface.

[0032] S2: Fill the recessed areas of the uneven surface with glue to form a smooth surface; It should be noted that direct glue application can easily cause indentations on the adhesive surface of the base plate under stress, resulting in uneven glue application. This implementation pre-presses and fills the adhesive surface of the base plate before applying glue, preemptively addressing any indentations that could lead to uneven glue application. This step fills the indentations created by the pre-pressing process, smoothing out the original unevenness and forming a flat surface.

[0033] The recessed area refers to the region on the uneven surface that is lower than the raised support area; this is the target area for adhesive filling. Adhesive filling refers to the process of fully filling the recessed area and covering the raised support area with adhesive through methods such as soaking in an adhesive pool or applying adhesive with a scraper roller. The smooth surface refers to the smooth surface formed after adhesive filling, which prepares the surface for subsequent adhesive application.

[0034] For example, glue is applied by a scraper roller. First, the bottom paper block is driven through two sets of opposing rotating scraper rollers, and the roller surface is dipped in glue. Then, when the scraper roller comes into contact with the concave and convex surfaces, the glue is squeezed into the concave areas, while the roller surface pressure scrapes away the excess glue from the convex parts. In addition, the pressure of the scraper roller can be adjusted to ensure that the concave areas are filled and the surface is flat.

[0035] Preferably, in actual glue filling operations, when using a glue tank for filling, the amount of glue used directly affects the filling effect: if the amount of glue is too much, excess glue will easily adhere to the area around the base, resulting in material waste and affecting the appearance of the base; if the amount of glue is insufficient, the depressions cannot be fully filled, making it difficult to form a smooth adhesive surface, which in turn affects the uniformity and bonding strength of subsequent glue application. Therefore, this embodiment provides a preferred solution where the glue filling process includes: firstly, obtaining the maximum depression depth of the uneven surface, where the maximum depression depth refers to the deepest value of all depressions on the uneven surface. For example, if the depression depth distribution after rolling is 0.3-0.4mm, then the maximum depression depth is 0.4mm. The glue tank level must be no lower than this value to completely fill the deepest depression. Methods for obtaining the maximum depression depth include using a laser profilometer and a contact thickness gauge, etc., and the measurement process needs to cover the entire width of the adhesive surface. Then, adjust the glue level in the glue tank according to the maximum depression depth, ensuring the level is not lower than the maximum depression depth. The glue tank is a container for storing the glue used for filling, equipped with a level sensor and an automatic replenishment device, which can adjust the glue level in real time to ensure it matches the depression depth. The glue level refers to the vertical distance between the glue surface and the bottom of the tank. Finally, drive the bottom paper block into the glue tank so that the bonding surface is immersed in the adhesive, with an immersion depth greater than the maximum depression depth, allowing the adhesive to enter all depressions through capillary action and gravity.

[0036] Preferably, in actual operation, the liquid adhesive used in the filling process, due to its own fluidity, is difficult to maintain a fixed shape after filling. It is prone to flowing under its own weight or displacement under the influence of external forces (such as mechanical contact forces in subsequent processing), causing secondary unevenness on the originally smooth surface formed by filling, thereby compromising surface smoothness. Therefore, see Figure 3 In a preferred embodiment, before S3, the method further includes: S21: curing the flat surface. It should be noted that curing refers to the process of changing the filler layer of the flat surface from a liquid to a solid state through temperature control. Specifically, a segmented gradient curing method is adopted: the first stage is hot air curing at 60-70℃, using hot air to quickly evaporate the surface moisture of the colloid, allowing the filler film to form; the second stage is cold air curing at 25℃, using a low-temperature environment to inhibit the internal thermal expansion of the colloid, reduce the curing shrinkage rate, and avoid secondary collapse caused by uneven shrinkage.

[0037] Preferably, in actual operation, the liquid adhesive used in the filling process often has excessive fluidity and insufficient thixotropy, making it difficult to fully penetrate the depressions in the base. Simultaneously, the adhesive layer formed after curing a single adhesive has poor stability, easily flowing under its own weight after filling and deforming under external forces (such as subsequent coating roller pressure), leading to insufficient filling of the depressions or secondary deformation of the smooth surface. Therefore, this embodiment provides a preferred solution where the filling material includes an inorganic thickener and microsphere fillers. It should be noted that the inorganic thickener includes fumed silica, which forms a three-dimensional network structure through surface hydroxyl groups, significantly improving the thixotropy of the adhesive. This makes the adhesive less prone to flowing when stationary. For example, adding 8-12 wt% fumed silica to the adhesive increases the fluidity of the liquid under gravity and conveying shear force when the base is submerged, allowing it to quickly penetrate the depressions. After standing, the liquid returns to a gel state, reducing flow due to its own weight. Microsphere fillers include hollow glass microspheres, which act as a lightweight rigid skeleton, reducing the volume shrinkage rate of the cured adhesive layer and decreasing the amount of adhesive used. Furthermore, the hollow structure can buffer impact forces and improve the peel resistance of the smooth layer. For example, adding 5-8 wt% hollow glass microspheres to the adhesive forms a rigid-flexible composite structure with the adhesive, increasing the compressive strength of the cured adhesive layer from 1.0 MPa to 1.5 MPa, allowing it to withstand the pressure of subsequent coating rollers without deformation.

[0038] S3: Apply adhesive to the flat surface to form an adhesive layer.

[0039] It should be noted that since the glue filling method is used to fill the recessed areas, the adhesive in the recessed areas cannot fully contact the cardboard. Therefore, a second layer of glue needs to be applied on the flat surface to form a functional adhesive layer suitable for panel bonding. The adhesive layer refers to the functional adhesive layer formed after the glue application, used for actual bonding to the paper pallet panel.

[0040] Specifically, gluing refers to the process of applying glue to a flat surface using a gluing component. The gluing roller dips the glue into the glue tank and allows the bottom paper piece to pass over the gluing roller. The gluing roller rotates as the bottom paper piece passes over the roller, applying the glue to the adhesive layer of the bottom paper piece.

[0041] The beneficial effects of this embodiment: In the processing method of the paper pallet in this embodiment, the bonding surface of the bottom foot is first rolled to form a concave-convex surface; then, the depressions of the concave-convex surface are filled with glue to form a flat surface; finally, glue is applied to the flat surface to form an adhesive layer. By pre-rolling to reveal the potential depressions of the bonding surface of the bottom foot, and then filling these depressions with glue to eliminate them to achieve a flat surface, the glue is applied on this basis. This solves the problem of uneven glue layer during the glue application process of the paper pallet by addressing the cause of uneven glue layer beforehand. Example

[0042] In practice, the precision of pressure control during pre-pressing the bonding surface of the base directly affects the subsequent processing results: excessive pressure can easily crush the corrugated cardboard structure, damaging the base support performance; insufficient pressure will prevent hidden depressions from being fully revealed, making it difficult to form a regular uneven surface, thus affecting the uniformity and quality of subsequent glue filling. Therefore, how to avoid base damage or insufficient pre-pressing due to improper pressure is a technical problem that urgently needs to be solved.

[0043] The technical solution of this embodiment will be described in detail below with reference to the accompanying drawings.

[0044] See Figure 2 To solve the above-mentioned technical problems, this embodiment improves upon embodiment one. The paper pallet processing method of this embodiment, S1, includes: S11: Obtain the width L of the base; It should be noted that since the base is generally made of corrugated cardboard, its structure consists of multiple layers of corrugated core paper bonded to a flat linerboard. Its pressure-bearing capacity is directly related to its size. Larger sizes result in stronger overall rigidity of the corrugated cardboard, greater pressure dispersion, and stronger resistance to deformation; smaller sizes result in weaker rigidity and are more prone to over-compression under the same pressure. Since the key to the pressure roller's effect is the size of the contact area between the pressure roller and the base, the width L is chosen to represent the base's size. This step obtains the base width L to provide basic data for calculating the total pressure of the pressure roller in the next step, ensuring that the roller pressure matches the base size. For example, a 200mm wide base and a 100mm wide base, under the same linear pressure, require a total pressure difference of 100% to ensure consistent roller pressure results.

[0045] Specifically, the width L of the base refers to the dimension of the adhesive surface of the paper pallet base along the width direction, and is a key parameter determining the total pressure of the roller. For rectangular bases, the width is the length of the shorter side of the adhesive surface; for irregularly shaped bases, the width is the maximum width of the area where the adhesive surface contacts the pressure roller. For example, for a rectangular base made of 3-layer corrugated cardboard with an adhesive surface size of 200mm x 150mm, the width L = 200mm. The width of the base can be obtained by detection using a laser sensor or by real-time acquisition of the base width using a photoelectric rangefinder; the specific method is not limited.

[0046] S12: Based on L and the preset linear pressure value P 线 Calculate the total pressure F of the pressure roller 总 F 总 =L·P 线 ; It should be noted that: in order to avoid damaging the bottom paper block and to ensure sufficient pre-compression, the pressure should be adjusted according to L and the preset linear pressure value P. 线 Calculate the total pressure F of the pressure roller总 F 总 =L·P 线 Among them, the preset linear pressure value P 线 This refers to the rolling pressure applied per unit width, which is a preset process parameter based on the material parameters of the base plate. Specifically, the material parameters of the base plate include the upper and lower limits of core paper deformation, groove depth, and springback. For example, the P of a 3-layer corrugated base plate... 线 Typically set at 3-5 N / mm. Due to the increased thickness and rigidity of 5-layer corrugated cardboard, P... 线 It can increase the strength by 5-8 N / mm, ensuring that an effective uneven surface can be formed without crushing the paper layer.

[0047] Total pressure F of the pressure roller 总 The total force exerted by the pressure roller on the adhesive surface of the base plate is proportional to the width and pressure, therefore F 总 The base width L and the preset linear pressure P 线 The result of multiplication is the core control parameter of the rolling process. For example, L=200mm, P 线 When F = 5N / mm 总 =1000N.

[0048] Preferably, to prevent excessive compression of small-sized feet due to insufficient rigidity, in this preferred embodiment, when L < 300mm, a pressure compensation algorithm is automatically activated: P 补= P 线 ·[1+0.002·(300-L)] Among them, P 补 It is the compensated power, P 线 It represents line power, and L represents bandwidth.

[0049] S13: With F 总 The adhesive surface of the base is rolled to form a concave-convex surface.

[0050] It should be noted that: with F 总 Roller pressing is applied to the adhesive surface of the base to create a uniform uneven surface. (In F) 总 Under the control of the roller, the unsupported part of the adhesive surface of the base is concave due to the rolling contact between the roller and the adhesive surface, forming a concave-convex surface. For example, for the base of a 3-layer corrugated paper, F 总 When the pressure roller is at 800N, it can press the unsupported part inward by 0.4mm, forming a depression.

[0051] The beneficial effects of this embodiment: The paper pallet processing method in this embodiment first obtains the width L of the base, and then processes it according to L and a preset line pressure value P. 线 Calculate the total pressure F of the pressure roller 总 F总 =L·P 线 Finally, by using F 总 The adhesive surface of the base is rolled to form a concave-convex surface. This method is based on the correlation between the stress on the base and its width. By adjusting the total pressure of the pressure rollers according to the width parameter of the base itself, the pressure is adapted to the properties of the base, thereby solving the technical problem of base damage or insufficient pre-compression caused by improper pressure. Example

[0052] In practice, when applying adhesive to the smooth layer formed by the filler, the smooth surface reduces the adhesion between the adhesive and the surface, making it difficult for the adhesive layer to adhere evenly. This can lead to problems such as insufficient adhesive in certain areas or adhesive dripping, ultimately resulting in an uneven adhesive layer that affects the bonding reliability between the base and the panel. Therefore, improving the adhesive application effect on smooth surfaces is a technical problem that urgently needs to be solved.

[0053] The technical solution will be described in detail below with reference to the accompanying drawings.

[0054] See Figure 4 To solve this technical problem, this embodiment is optimized based on embodiment one. The paper pallet processing method in this embodiment further includes the following step before step S3: S22: Perform initial curing on the flat surface; It should be noted that if the smooth surface formed by the filler is directly roughened, the structural integrity of the roughened surface cannot be guaranteed due to the softness of the adhesive layer. Preliminary curing ensures that the edges of the roughened surface are clear and burr-free. Specifically, preliminary curing differs from the complete curing of S21; its purpose is to shape the surface rather than completely cure it, ensuring that the adhesive layer can resist external forces while retaining a certain degree of cohesion during subsequent roughening. The specific method involves using short-term, low-temperature heating to give the surface of the smoothing layer adhesive layer preliminary strength. For example, short-term treatment with hot air at 40-50℃ causes the surface moisture of the adhesive layer to evaporate rapidly, forming a semi-cured surface layer.

[0055] S23: Roughen the flat surface to create a rough surface; It should be noted that, to compensate for the low adhesion of smooth surfaces, this step involves controlled roughening. While maintaining overall flatness, microscopic roughness is achieved, increasing the contact area between the adhesive layer and the roughened surface compared to the smooth surface, resulting in a more stable adhesive layer. Specifically, roughening refers to the process of creating regular textures on a smooth surface through mechanical scratching or laser engraving. The processing tool must be precisely fitted to the smooth surface to ensure consistent texture depth. The roughened surface refers to the functional surface formed after roughening. It is important to note that the roughened surface differs from the indentations of cardboard: First, the roughened surface is a regular structure actively formed through mechanical processing; its geometry, distribution density, and depth are controllable, thus eliminating dead zones where adhesive cannot penetrate. Second, the roughened surface is completely visible and can be directly observed and used for subsequent adhesive application after processing; whereas the initial unevenness of cardboard is a naturally hidden defect of the corrugated structure. Without pre-pressing, the depth and distribution of its indentations are random and cannot be directly observed.

[0056] Preferably, if the structure of the rough surface is irregular, it can easily lead to weak points after the adhesive cures. Therefore, in the preferred embodiment provided by this example, the rough surface presents a cross-shaped mesh groove structure or a conical recess matrix. It should be noted that: the cross-shaped mesh groove structure refers to a grid-like texture formed by interwoven mutually perpendicular linear grooves through mechanical engraving on a flat surface. By forming a continuous mesh skeleton, it can not only make fuller contact with the adhesive, but also improve the resistance of the adhesive layer to vertical static pressure. The conical recess matrix refers to an array of inverted conical pits formed by stamping or laser engraving on a flat surface. Each pit forms a barbed anchor point, which can not only make fuller contact with the adhesive, but also improve the resistance of the adhesive layer to horizontal impact.

[0057] S24: Curing the rough surface.

[0058] It should be noted that an incompletely cured rough surface will deform under stress. To improve the overall strength of the adhesive layer, the roughened surface is cured. Curing refers to the process of transforming the roughened adhesive layer from a semi-cured state to a fully cured state through temperature treatment. This differs from the initial curing in S22. Its purpose is to enhance structural stability and improve the strength of the adhesive layer, permanently fixing the rough texture and enabling it to bear loads. For example, curing is performed using a hot air circulating oven. Curing can be divided into two stages: the first stage involves rapidly evaporating the internal moisture of the adhesive layer using hot air; the second stage allows the adhesive layer to slowly cool to room temperature, releasing internal stress.

[0059] The beneficial effects of this embodiment: This embodiment first performs preliminary curing on the flat surface, then roughens the flat surface to form a rough surface, and finally cures the rough surface. This transforms the original flat surface into a textured rough surface, increasing the contact area between the adhesive and the adhesive layer during subsequent adhesive application, and forming a more stable adhesive structure. This results in a smoother subsequent adhesive layer and improves the adhesive application effect on the flat surface. Example

[0060] This embodiment provides a paper pallet processing apparatus for implementing the paper pallet processing method provided in the aforementioned embodiment, including: A roll forming assembly is used to roll the adhesive surface of the base. The roll forming assembly includes a pressure roller with an axially slightly convex arc profile; the surface of the pressure roller is fitted with a depth-adaptive elastic liner. The pressure roller with an axially slightly convex arc profile refers to a surface design where the pressure axis is slightly convex, rather than a traditional pure cylindrical shape. The depth-adaptive elastic liner is a flexible layer fitted onto the surface of the pressure roller to prevent irregularities caused by localized elastic rebound of the adhesive surface of the base. For example, the liner material is highly elastic rubber with embedded micro-pressure-sensitive particles.

[0061] The glue-filling assembly is used to fill the depressions in uneven surfaces with glue. Specifically, the assembly includes a glue tank, a level sensor, and an automatic replenishment device. The glue tank is a container for storing the adhesive used for filling; its dimensions match the width of the base, or at least exceed it. The glue tank has a built-in heating element to enhance the flowability of the adhesive. The level sensor is a high-precision detection element installed on the inner wall of the glue tank to monitor the glue level in real time. The automatic replenishment device replenishes the glue tank with glue through pipes until the target level is reached.

[0062] The adhesive application assembly is used to apply adhesive to a flat surface. Specifically, the assembly includes an adhesive roller and an adhesive tank. The adhesive roller is used to directly contact the flat surface and apply the adhesive. The adhesive tank is a container for storing the adhesive, with its bottom in contact with the adhesive roller to ensure that the roller surface is evenly coated with adhesive. The adhesive tank has a built-in agitator to prevent adhesive sedimentation and is equipped with a level switch.

[0063] Preferably, the roller pressing assembly, glue filling assembly, glue coating assembly, and bonding assembly are arranged in a straight line. In this way, multiple feet can be driven by a guide rail to pass through the roller pressing assembly, glue filling assembly, and glue coating assembly in sequence, and then reach the bonding assembly. The bonding assembly presses and adheres the adhesive surface of the feet to the preset position of the panel. Example

[0064] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated further here.

[0065] Figure 5 This is a schematic diagram of the structure of an electronic device shown in an embodiment of this application.

[0066] See Figure 5 The electronic device 1000 includes a memory 1010 and a processor 1020.

[0067] The processor 1020 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0068] Memory 1010 may include various types of storage units, such as system memory, read-only memory (ROM), and permanent storage devices. ROM may store static data or instructions required by the processor 1020 or other modules of the computer. Permanent storage devices may be read-write storage devices. Permanent storage devices may be non-volatile storage devices that retain stored instructions and data even when the computer is powered off. In some embodiments, permanent storage devices use mass storage devices (e.g., magnetic or optical disks, flash memory) as permanent storage devices. In other embodiments, permanent storage devices may be removable storage devices (e.g., floppy disks, optical drives). System memory may be a read-write storage device or a volatile read-write storage device, such as dynamic random access memory. System memory may store some or all of the instructions and data required by the processor during operation. Furthermore, memory 1010 may include any combination of computer-readable storage media, including various types of semiconductor memory chips (DRAM, SRAM, SDRAM, flash memory, programmable read-only memory), and disks and / or optical disks may also be used. In some implementations, memory 1010 may include a removable storage device that is readable and / or writable, such as a laser disc (CD), a read-only digital multifunction optical disc (e.g., DVD-ROM, dual-layer DVD-ROM), a read-only Blu-ray disc, an ultra-high density optical disc, a flash memory card (e.g., SD card, mini SD card, Micro-SD card, etc.), a magnetic floppy disk, etc. Computer-readable storage media do not contain carrier waves or transient electronic signals transmitted wirelessly or via wired connections.

[0069] The memory 1010 stores executable code, which, when processed by the processor 1020, can cause the processor 1020 to execute part or all of the methods described above.

[0070] The solution of this application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of each embodiment have different emphases; for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. Those skilled in the art should also understand that the actions and modules involved in the specification are not necessarily essential to this application. Furthermore, it is understood that the steps in the method of this application's embodiments can be adjusted, combined, and deleted according to actual needs, and the modules in the device of this application's embodiments can be combined, divided, and deleted according to actual needs.

[0071] Furthermore, the method according to this application can also be implemented as a computer program or computer program product, which includes computer program code instructions for performing some or all of the steps in the method described above.

[0072] Alternatively, this application may be implemented as a non-transitory machine-readable storage medium (or computer-readable storage medium, or machine-readable storage medium) storing executable code (or computer program, or computer instruction code) thereon, which, when executed by a processor of an electronic device (or electronic device, server, etc.), causes the processor to perform part or all of the steps of the methods described above according to this application.

[0073] Those skilled in the art will also understand that the various exemplary logic blocks, modules, circuits, and algorithm steps described in connection with the present application can be implemented as electronic hardware, computer software, or a combination of both.

[0074] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems and methods according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0075] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A method for processing a paper pallet, characterized in that, include: S1: Roll the bonding surface of the base to form a concave-convex surface; S2: Fill the recessed areas of the uneven surface with glue to form a smooth surface; S3: Apply adhesive to the flat surface to form an adhesive layer.

2. The paper pallet processing method according to claim 1, characterized in that, S1 includes: S11: Obtain the width L of the base; S12: Based on L and the preset linear pressure value P 线 Calculate the total pressure F of the pressure roller 总 F 总 =L·P 线 ; S13: With F 总 The adhesive surface of the base is rolled to form a concave-convex surface.

3. The paper pallet processing method according to claim 1, characterized in that, After S2 and before S3, it also includes: S21: Curing the flat surface.

4. The paper pallet processing method according to claim 1, characterized in that, After S2 and before S3, it also includes: S22: Perform preliminary curing on the flat surface; S23: Roughen the flat surface to form a rough surface; S24: Curing the rough surface.

5. A paper pallet processing method according to claim 4, characterized in that: The rough surface is presented as a cross-grid groove structure or a matrix of conical depressions.

6. A paper pallet processing method according to claim 1, characterized in that: The filler materials used in S2 include inorganic thickeners and microsphere fillers.

7. A paper pallet processing device, characterized in that, The paper pallet is processed using the paper pallet processing method as described in any one of claims 1 to 6, comprising: Roll forming assembly, used to roll form the adhesive surface of the base; A filler assembly is used to fill the recesses in uneven surfaces with adhesive. Adhesive application assembly, used for applying adhesive to flat surfaces.

8. A paper pallet processing device according to claim 7, characterized in that: The roll forming assembly includes a pressure roller with an axially convex arcuate profile; The surface of the pressure roller is fitted with a depth-adaptive elastic liner.

9. An electronic device, characterized in that, include: processor; as well as A memory having executable code stored thereon, which, when executed by the processor, causes the processor to perform the paper pallet processing method as described in any one of claims 1-6.

10. A non-transitory machine-readable storage medium, characterized in that, It stores executable code that, when executed by a processor of an electronic device, causes the processor to perform the paper pallet processing method as described in any one of claims 1-6.

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