Evaporator frost prevention device and method, and refrigeration apparatus, electronic apparatus, storage medium

Abstract

The application discloses an evaporator anti-frost device and method, and refrigeration equipment, electronic equipment and storage medium. The device comprises an evaporator support and a fin. The evaporator support is sequentially connected with an upper guard plate, an evaporator right side plate, a bottom plate and an evaporator left side plate. The fin is arranged at the bottom of the evaporator support. A piezoelectric vibration plate is arranged in the evaporator support. The piezoelectric vibration plate vibrates and transmits to the fin through the evaporator support. The outer surface of the fin is provided with a nano micro-protrusion array. The outer surface of the fin is coated with an electrochromic layer. The fin is connected with an electric field pulse generating device. The electric field pulse generating device generates an electric pulse signal to control the nano micro-protrusion array to generate a local eddy current, and makes the electrochromic layer form a continuous water film to inhibit the evaporator from frosting. The application realizes the blocking of the frosting physical process in a short time through the nano micro-protrusion array structure, electric field pulse, piezoelectric vibration, electrochromic layer and frequency converter linkage, and significantly improves the anti-frost efficiency.

Description

Technical Field

[0001] This application relates to the field of refrigeration equipment technology, specifically to an evaporator anti-frost device and method, and to refrigeration equipment, electronic equipment, and storage media. Background Technology

[0002] In humid environments, water vapor condenses and frosts on the surface of the fins of traditional evaporators. This frost problem has long restricted the performance of refrigeration equipment. Existing defrosting technologies are outdated. If hot gas defrosting is used, refrigeration must be interrupted, resulting in a decrease in cooling capacity. Furthermore, there is the problem that residual water vapor can quickly re-frost on the fin surface after defrosting, requiring frequent defrosting. Additionally, the backflow of hot gas during defrosting can cause pressure fluctuations in the compressor, leading to compressor damage, increased risk of compressor failure, and shortened compressor lifespan. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides an evaporator anti-frost device and method capable of blocking the physical process of frosting.

[0004] The present invention adopts the following technical solution.

[0005] The first aspect of the present invention discloses an evaporator anti-frost device, including an evaporator support and fins. The evaporator support is a rectangular frame composed of an upper protective plate, an evaporator right side plate, a bottom plate and an evaporator left side plate connected in sequence. The fins are disposed at the bottom of the rectangular frame.

[0006] The evaporator support is equipped with a piezoelectric vibrating plate. The vibration of the piezoelectric vibrating plate is transmitted to the fins through the evaporator support to prevent dust from covering the fin surface and hindering the spread of water molecules.

[0007] The outer surface of the fin is configured as a nano-micro protrusion array, and an electrochromic layer is coated on the outer surface of the fin. The fin is connected to an electric field pulse generator. The electric field pulse generator generates an electric pulse signal to control the nano-micro protrusion array to generate local eddy currents and cause the electrochromic layer to form a continuous water film, thereby suppressing frost formation on the evaporator.

[0008] Preferably, the nano-microbump array is a hemispherical microbump array, wherein the height of the hemispherical microbump is 50-100nm and the distance between the two hemispheres is 100-500nm.

[0009] A second aspect of the present invention discloses a method for preventing frost, controlling an evaporator frost prevention device as described in the first aspect, comprising the following steps:

[0010] Collect environmental parameters and compare them with preset thresholds to determine whether to enter anti-frost mode;

[0011] After determining that anti-frosting mode has been entered, the electric field pulse frequency is calculated based on environmental parameters;

[0012] The calculated electric field pulse frequency is input to the electrochromic layer to trigger an electric pulse signal, forming a continuous water film. At the same time, the nano-micro protrusion array generates local eddies, which inhibits ice crystal formation.

[0013] Simultaneously with the triggering of the electrical pulse signal, the piezoelectric ceramic vibrator is activated, outputting a mechanical vibration frequency that is transmitted to the fins via the evaporator support.

[0014] The system detects the residual moisture on the fin surface. If no moisture is detected on the fin surface, the anti-frosting process is considered complete, and the system enters standby mode. If moisture is detected but not completely removed, the above steps are repeated until the anti-frosting conditions are met.

[0015] Preferably, the environmental parameters include: ambient relative humidity and evaporator fin surface temperature.

[0016] Preferably, the electrical pulse signal range is 50μs to 200μs, and the mechanical vibration frequency range is 400Hz to 600Hz.

[0017] Preferably, when the electrical pulse signal is triggered, the compressor current value is collected. If the current mutation rate is detected to exceed the set threshold, the compressor speed is reduced. After the compressor speed is reduced, the compressor is restored to its original operating state.

[0018] Preferably, the set threshold is 0.5A / ms, and the speed reduction is to reduce the compressor speed by 10% for 0.1 seconds to counteract the current surge caused by the electrical pulse.

[0019] A third aspect of the present invention discloses a refrigeration device including an evaporator anti-frost device as described in the first aspect.

[0020] A fourth aspect of the present invention discloses an electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when loaded onto the processor, implements the anti-frost method described in the second aspect.

[0021] A fifth aspect of the present invention discloses a storage medium comprising a stored program, wherein, when the program is executed, it controls the device in which the storage medium is located to perform the anti-frost method described in the second aspect.

[0022] Compared with the prior art, the beneficial effects of the present invention include at least the following:

[0023] 1. Traditional fins have a planar structure, while this patent uses a nano-micro-protrusion array with height gradient (50nm→100nm) and spacing (200nm) to form local eddies on the fin surface, which significantly improves the shear rate. Combined with the dynamic coupling of electric field pulse frequency f and flow field shear rate γ, it solves the problem of water molecules easily accumulating on the surface of traditional fins, resulting in high adsorption energy and frost formation.

[0024] 2. Existing technologies mostly use static hydrophobic coatings, while this patent uses a WO3 electrochromic layer to dynamically switch between hydrophilic and hydrophobic states when triggered by an electrical pulse, which solves the problem that static hydrophobic coatings inhibit the spread of water molecules, resulting in water vapor residue and easy formation of frost.

[0025] 3. Traditional dust removal relies on mechanical vibration or blowing, while this patent uses piezoelectric vibrating plates to precisely match the resonant frequency band of dust (400-600Hz), shaking off 99.3% of the dust. This solves the problem of dust covering the fin surface, hindering the spread of water molecules, and increasing the risk of secondary frosting.

[0026] 4. Existing technologies do not link the frequency converter with the electrical pulse trigger, while this patent uses the frequency converter to monitor the compressor current change in real time and trigger the speed to reduce load (10% for 0.1 seconds), which solves the problem that the sudden increase in compressor current caused by the electrical pulse trigger may cause pressure fluctuations and affect the refrigeration efficiency.

[0027] In summary, existing technologies mostly employ a single anti-frost method (such as heating or hydrophobic coating), while this patent integrates real-time control of ambient humidity, fin temperature, and shear rate through a nano-micro-protrusion array structure, electric field pulses, piezoelectric vibration, electrochromic layer, and frequency converter linkage. This achieves rapid interruption of the physical process of frost formation, significantly improving anti-frost efficiency. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of an evaporator anti-frost device according to the present invention;

[0029] Figure 2 This is an isometric view of the fins in this invention;

[0030] Figure 3 This is a partially enlarged side view of the fins in this invention;

[0031] In the figure: 1. Right side plate of evaporator; 2. Upper protective plate; 3. Nanoscale micro-protrusion array; 4. Base plate; 5. Left side plate of evaporator. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of this invention. The embodiments described in this application are merely some embodiments of this invention, and not all embodiments. Based on the spirit of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this invention.

[0033] In the description of this invention, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0035] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0036] In this invention, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0037] like Figure 1 As shown, Embodiment 1 of the present invention provides an evaporator anti-frost device, including an evaporator support and fins. The evaporator support includes an upper protective plate 2, an evaporator right side plate 1, a bottom plate 4, and an evaporator left side plate 5 connected in sequence. The upper protective plate 2, the evaporator right side plate 1, the bottom plate 4, and the evaporator left side plate 5 form a rectangular frame, and the fins are disposed at the bottom of the rectangular frame.

[0038] Specifically, the two sides of the fins are connected to the upper guard plate 2 and the bottom plate 4 respectively, and the other two sides of the fins are connected to the right side plate 1 and the left side plate 5 of the evaporator respectively.

[0039] Inside the evaporator support, near the edge of the fins, a piezoelectric ceramic vibrator is embedded. The piezoelectric ceramic vibrator vibrates and transmits the vibration to the fins through the evaporator support. This prevents dust from covering the fin surface, hinders the spread of water molecules, and reduces the risk of secondary frosting.

[0040] The outer surface of the fins is designed as a nano-micro-protrusion array 3. The outer surface is the area where the airflow directly contacts the refrigerant (or water vapor), and is the main area for heat exchange and frost prevention. Therefore, the optimization of the nanostructure is concentrated in this area to maximize the efficiency of heat exchange and frost prevention. An electrochromic layer, such as WO3 electrochromic material (tungsten trioxide), is coated on the outer surface of the evaporator fins. When electricity is applied, the material turns deep blue, its hydrophilicity increases, and a water film spreads to prevent frost formation. When the power is turned off, the material returns to transparency, and its hydrophobicity increases.

[0041] Specifically, the fins are linear, and their outer surface is processed with a nanoscale micro-protrusion array, designing the outer surface of the evaporator fins as a hemispherical nanoscale micro-protrusion array. The height of the hemispherical micro-protrusions is 50-100 nm, and the distance between the two hemispheres is 100-500 nm.

[0042] In a preferred but non-limiting embodiment of the invention, such as Figure 2-3 As shown, the height of the protrusions on the outer surface follows a vertical gradient, with 50nm at the top, 70nm in the middle, and 100nm at the bottom.

[0043] These tiny bumps cause the airflow to swirl around, blowing away water molecules. Traditional fins have a flat surface without these bumps, causing water molecules to stick to the fins and frost up. During an electric field pulse, the micro-bumps create localized eddies in the airflow, causing it to swirl and increasing the shear rate. At the same time, the electric field causes quantum jumps in the electronic states of water molecules, disrupting the hydrogen bond orientation and preventing the formation of ice crystals.

[0044] The evaporator anti-frost device also includes a detection module, a control module, and an execution module.

[0045] The detection module includes: an environmental parameter sensor, a fin status monitoring sensor, and a system operation data acquisition sensor.

[0046] In a preferred but non-limiting embodiment of the present invention, the environmental parameter sensor includes: a humidity sensor for measuring environmental humidity and a temperature sensor for measuring the surface temperature of the fins;

[0047] The fin status monitoring sensor includes: a water vapor residue sensor for detecting the water vapor residue amount on the fin surface through an optical or capacitive sensor, and a vibration sensor for monitoring the amplitude and frequency of the piezoelectric vibrating piece;

[0048] The system operation data acquisition sensor includes: a compressor current monitoring IC (integrated on the main board of the frequency converter, which real-time monitors sudden changes in compressor current (>0.5A / ms) and triggers speed reduction and load reduction), and a pressure sensor for monitoring the refrigerant pressure and assisting in judging the system operation status.

[0049] The control module (Control Module) is used to dynamically calculate parameters (such as k1, k2) based on the data of the detection module and generate control signals to coordinate the work of each execution module.

[0050] In a preferred but non-limiting embodiment of the present invention, the control module is specifically composed of: a microcontroller / programmable logic device (MCU / FPGA).

[0051] Algorithm core: Real-time calculate the electric field pulse frequency f = k1·TRH 2 , and adjust the shear rate γ = k2·f to ensure E_ads < E_cryst, where TRH represents relative humidity (Relative Humidity), and the unit is %.

[0052] Dynamically optimize the values of k1 and k2.

[0053] Linkage control logic: Trigger the electric field pulse generating device (100μs pulse) and the piezoelectric vibrating piece (500Hz vibration) to start synchronously.

[0054] When a sudden change in current is detected, send a speed reduction and load reduction instruction (10% speed, lasting for 0.1 seconds) to the frequency converter.

[0055] The execution module is used to perform defrosting operations (such as electric pulses, vibrations, frequency converter regulation) according to the instructions of the control module.

[0056] In a preferred but non-limiting embodiment of the present invention, the execution module is specifically composed of: an electric field pulse generating device, a piezoelectric vibrating piece, and a frequency converter linkage module.

[0057] The electric field pulse generating device includes: an electrode layer and a high-voltage power supply module;

[0058] Electrode layer: Shares an electrode with the electrochromic layer (such as WO3) on the fin surface to generate a 100μs electrical pulse.

[0059] High-voltage power supply module: Provides a stable voltage (e.g., 200-500V) for electric field pulses, ensuring that the electrochromic layer can quickly switch between hydrophilic and hydrophobic states.

[0060] The piezoelectric vibrating sheet includes: a resonant driving circuit and a mechanical structure;

[0061] Resonant drive circuit: The piezoelectric ceramic vibrator is controlled by a PWM signal to output a 500Hz vibration (matching the resonant frequency band of dust).

[0062] Mechanical structure: The evaporator support is embedded in the evaporator and the vibration is transmitted to the fin surface through the support.

[0063] The inverter linkage module includes: a current surge detection circuit and a communication interface;

[0064] Current surge detection circuit: Real-time monitoring of compressor current, triggering speed reduction (10% speed, lasting 0.1 seconds);

[0065] Communication interface: It interacts with the control module via CAN bus or SPI protocol to achieve dynamic speed adjustment.

[0066] The electric field pulse generator is directly connected to the electrochromic layer on the fin surface, and transmits electric field signals through the electrode layer. The electrode layer, high-voltage power supply module, signal generator and control circuit work together.

[0067] The electrode layer shares an electrode with the electrochromic layer (such as WO3) on the fin surface to generate a 100μs electric pulse. The electrode layer is connected to the high-voltage power supply module and control circuit through wires to ensure efficient transmission of electric field signals.

[0068] High-voltage power supply module: Provides a stable voltage (e.g., 200-500V) for electric field pulses, ensuring that the electrochromic layer quickly switches between hydrophilic and hydrophobic states. The output of the high-voltage power supply module is connected to the electrode layer through wires, and the input is connected to the control circuit to receive pulse trigger signals.

[0069] Signal generator: Generates a 100μs electrical pulse signal to drive the high-voltage power supply module to output a high-voltage electric field. The output terminal of the signal generator is connected to the control terminal of the high-voltage power supply module, and the input terminal is connected to the control circuit.

[0070] Control circuit: Coordinates the operation of the signal generator, high-voltage power supply module, and quantum flow field coupling chip to ensure dynamic matching between the electric field pulse and the flow field shear rate γ. The output of the control circuit is connected to the signal generator, and the input receives commands from the quantum flow field coupling chip.

[0071] A gradient nano-micro-protrusion array 3 is formed on the surface of the evaporator fins, and its height gradient (50nm→100nm) and spacing (200nm) constitute the control unit of the basic shear rate γ0.

[0072] like Figure 2-3 As shown, the spacing L refers to the lateral distance between the centers of adjacent micro-protrusions. The spacing ranges from 100 to 500 nm. This avoids excessively large gaps to ensure the interaction of vortices between adjacent protrusions and form a continuous shear field, while also avoiding excessively small gaps that could lead to blockage of the airflow channel.

[0073] The height gradient H refers to the vertical gradient of the bulge height (50nm at the top, 70nm in the middle, and 100nm at the bottom). When H ≥ 50nm, it can effectively disturb the boundary layer and form a stable vortex. When H ≤ 100nm, it can avoid excessive height of the structure, which may lead to airflow blockage or excessive energy loss.

[0074] The height gradient H is 50nm at the top, 70nm in the middle, and 100nm at the bottom to accommodate gravity and water film flow characteristics. On the vertical fin surface, the water film flows towards the bottom due to gravity. The higher bottom micro-protrusion enhances local eddies, accelerates the downward discharge of the water film, and reduces water molecule accumulation at the bottom. The lower top micro-protrusion reduces airflow resistance, prevents airflow separation at the top, and promotes rapid water film spreading at the top. The centrally located section balances frost prevention and energy consumption; optimizes the water film spreading speed, and prevents frost formation in the middle. Furthermore, the height variation creates a local shear rate gradient, enhancing the driving force for water molecule migration. Protrusions of different heights generate different electric field distributions, enhancing the disturbance effect on water molecules.

[0075] A micro quantum flow field coupling chip is integrated into the main board of the refrigerator. The ambient humidity RH, fin temperature T, and basic shear rate γ0 are input, and the electric field pulse frequency f = k1·(RH) is output in real time. 2 ·(T) -1 ;

[0076] That is, the higher the humidity RH, the greater the concentration of water molecules, and the higher the pulse frequency f is needed to suppress frost formation; the lower the fin temperature T, the stronger the tendency for ice crystal formation, and the higher the electric field pulse frequency f is needed.

[0077] The quantum flow field coupling chip is driven to output an electric field pulse frequency f and a flow field shear rate γ, which satisfy γ = k2·f;

[0078] It is worth noting that the nano-microbump array (height gradient H + spacing L) mentioned above is the physical control unit of the basic shear rate γ0, which is generated by the height gradient and spacing.

[0079] Height gradient (50nm→100nm): Changes in the height of the protrusion directly affect the flow path and vortex intensity of the airflow on the fin surface. For example, when the height increases from 50nm to 100nm, the basic shear rate γ0 of the airflow on the protrusion surface will increase significantly because the increase in the height of the protrusion will enhance the shear force of the airflow (γ∝1 / protrusion height).

[0080] Spacing (200nm): The bulge spacing determines the airflow interaction between adjacent bulges. A 200nm spacing can create local vortices, enhance the base shear rate γ0, and avoid energy dissipation caused by excessive airflow separation.

[0081] The formula for calculating the base shear rate γ0 is: γ0 = v / H, where v is the airflow velocity and H is the protrusion height. The initial value of γ, i.e., the base shear rate γ0, is achieved through the design of a nano-micro-protrusion array physical structure.

[0082] The electric field pulse frequency f is the control parameter of the flow field shear rate γ. The flow field shear rate γ (k2·f) is achieved by electric field pulse modulation. The physical structure (nano-protrusions) provides the basic shear rate, and the electric field pulse enhances the shear rate through dynamic perturbation. The two work together to achieve molecular-level anti-frost.

[0083] Therefore, the formula is integrated as follows: γtotal = γ0 + k2·f;

[0084] Wherein, γ0 is the basic shear rate of the nanostructure, i.e., the static shear rate, and k2·f is the dynamic contribution of the electric field pulse, i.e., the flow field shear rate γ.

[0085] At the instant of electric field pulse triggering, the flow field shear rate γ ensures that the adsorption energy of water molecules is lower than the crystallization energy to prevent frost formation. Here, k1 and k2 are adaptive parameters of the equipment, with k1 reflecting the dynamic relationship between the electric field pulse frequency and environmental parameters (RH and T). The value of k1 directly affects the calculation of the electric field pulse frequency f, which needs to be dynamically adjusted according to changes in ambient humidity (RH) and fin temperature (T). The optimal f value (making the adsorption energy E_ads < crystallization energy E_cryst) can be experimentally measured under different RH and T conditions and substituted into the formula f = k1·(RH). 2 ·(T) -1 , and obtain the value of k1.

[0086] k2 reflects the dynamic relationship between the flow field shear rate γ and the electric field pulse frequency f. The value of k2 directly affects the calculation of the flow field shear rate γ and needs to be dynamically adjusted according to the change of the electric field pulse frequency f. By simulating the flow field shear rate γ under different f values ​​using computational fluid dynamics (CFD), and substituting it into γ = k2·f, the value of k2 is fitted.

[0087] The higher the pulse frequency f, the greater the shear rate γ of the flow field, and the stronger the driving force for water molecules to be stripped. At the same time, the system adjusts k2 (the coupling coefficient between the shear rate and the electric field) to ensure that the adsorption energy E_ads < the crystallization energy E_cryst under any working conditions. Therefore, the anti-frosting condition is E_ads < E_cryst:

[0088] The adsorption energy E_ads is the binding energy between water molecules and the fin surface, such as van der Waals forces, hydrogen bonds, charge interactions, etc. Through the mechanical stripping effect of hydrodynamics (shear rate γ), water molecules are "blown away" from the surface, reducing their adsorption tendency. The formula is: E_ads ∝ 1 / γ, that is, the greater γ, the smaller E_ads.

[0089] The crystallization energy E_cryst is the energy required for water molecules to form ice crystals, such as the ordering energy of the hydrogen bond network. By triggering the quantum transition (electronic state perturbation) of water molecules through electric field pulses, the orderliness of the hydrogen bond network is disrupted, reducing the crystallization energy. The formula is: E_cryst ∝ 1 / f, that is, the higher f, the smaller E_cryst.

[0090] When E_ads < E_cryst, water molecules tend to remain in the liquid state (low adsorption energy) rather than form ice crystals (high crystallization energy); when E_ads > E_cryst, water molecules tend to crystallize (low crystallization energy), resulting in frosting.

[0091] Therefore, the control logic for anti-frosting is that the system enhances the flow field shear rate γ (reducing E_ads) and increases the pulse frequency f (reducing E_cryst), but the reduction amplitude of γ is greater, thus ensuring that E_ads is always lower than E_cryst.

[0092] Specifically, the increase in the shear rate γ directly enhances the mechanical stripping force of the air flow on water molecules. Through the "directness" of mechanical stripping, E_ads can be significantly reduced. Therefore, the enhancement of the flow field shear rate γ has a more significant effect on reducing E_ads. The frequency f of the electric field pulse disrupts the hydrogen bond network through quantum transition, reducing E_cryst. The reduction of E_cryst by the pulse frequency f is an "indirect" quantum perturbation, so the influence is not as large as the reduction amplitude of E_ads by the flow field shear rate γ. Therefore, by adjusting the pulse frequency f and the flow field shear rate γ in real time, and making the change amplitudes of the two satisfy: E_ads < E_cryst, anti-frosting can be achieved.

[0093] In a specific anti-frosting embodiment, assume the environmental parameters are: RH = 80% (high humidity, high water molecule concentration), T = -5°C (low temperature, strong driving force for ice crystal formation);

[0094] (1)Calculation of the electric field pulse frequency f: f = k1·RH 2 / T ≈ k1·23.5

[0095] The system outputs high-frequency electric field pulses f to inhibit ice crystal formation.

[0096] (2) Generation of the flow field shear rate γ: γ = k2·f = k2·23.5 k1

[0097] A high γ value enhances the stripping effect of the airflow on water molecules, significantly reducing E_ads.

[0098] (3) Results of the dynamic equilibrium

[0099] E_ads: Significantly reduced due to high γ (e.g., from 0.5 eV → 0.1 eV).

[0100] E_cryst: Moderately reduced due to high f (e.g., from 0.3 eV → 0.2 eV).

[0101] Final result: E_ads = 0.1 eV < E_cryst = 0.2 eV, keeping water molecules in a liquid state and avoiding frosting.

[0102] During the operation of the system, by real-time monitoring of the environmental parameters (RH, T) and the shear rate γ, the values of k1 and k2 are dynamically adjusted to ensure E_ads < E_cryst.

[0103] Dynamic adjustment of k1: According to the real-time RH and T, calculate the current required electric field pulse frequency f = k1·(RH) 2 ·(T) -1 ;

[0104] If it is detected that E_ads > E_cryst, by increasing the value of k1, f is increased, thereby reducing E_cryst.

[0105] Dynamic adjustment of k2: According to the real-time γ and f, γ = k2·f, calculate the current shear rate - electric field frequency coupling coefficient;

[0106] If it is detected that E_ads > E_cryst, by increasing the value of k2, γ is increased, thereby reducing E_ads.

[0107] An electrochromic layer is coated on the outer surface of the evaporator fins, such as WO3 electrochromic material (tungsten trioxide). When powered on, the material turns dark blue and its hydrophilicity increases, and the water film spreads to prevent frosting. When powered off, the material returns to transparent and its hydrophobicity increases. Here, the electrochromic layer becoming hydrophilic occurs simultaneously with the above-mentioned anti-frosting condition of E_ads < E_cryst.

[0108] When it is detected that the environmental humidity ≥ 85% and the evaporator surface temperature ≤ 5°C, the system determines that water vapor is about to be adsorbed, triggers a 100 μs electric pulse, the electrochromic layer becomes hydrophilic, and the water film spreads.

[0109] Preferably, the range of the electric pulse is: 50 μs ≤ pulse width ≤ 200 μs. The lower limit (50 μs) ensures that the electric field disturbance is sufficient to trigger the breaking of hydrogen bonds in water molecules, allowing water molecules to spread out in a limited manner while reducing energy consumption. The upper limit (200 μs) avoids excessively long pulses that could lead to over-response of the electrochromic layer or energy waste.

[0110] The hydrophilic state increases the water film spreading speed by 3 times, preventing water molecules from crystallizing on the fin surface. Water molecules spread into a continuous water film in the hydrophilic layer, and synchronous electrical pulses scatter the water molecules, causing them to fall apart like building blocks, preventing them from forming ice crystals. The airflow carries away the water film, leaving no frost residue on the fin surface.

[0111] A piezoelectric ceramic vibrator is embedded in the evaporator support. A 100μs electrical pulse triggers synchronous 500Hz vibration for 10ms. The vibration frequency is higher than the dust resonance frequency, and the 500Hz vibration frequency precisely matches the dust resonance frequency band (400-600Hz), shaking off 99.3% of the dust. Dust particles on the fins resonate and detach, increasing the water film spreading speed. This reduces the residual water vapor after defrosting by 99.9%.

[0112] Among them, 50μs ≤ electric pulse trigger time ≤ 200μs, the lower limit (50μs) is to ensure that the electric field disturbance is sufficient to trigger the start of the vibrator, while reducing energy consumption, and the upper limit (200μs) is to avoid the vibrator from overheating or mechanical fatigue due to excessively long pulses.

[0113] 400Hz ≤ Vibration frequency ≤ 600Hz, lower limit (400Hz): resonant frequency band covering large dust particles, upper limit (600Hz): resonant frequency band covering fine dust particles.

[0114] Vibration time ≤ 20ms, lower limit (5ms): ensures the resonant detachment of fine dust particles, upper limit (20ms): ensures the resonant detachment of large dust particles, while avoiding excessive energy consumption.

[0115] The inverter monitors the compressor current in real time. A current monitoring IC is integrated on the inverter's main board, which is linked to the electrical pulse trigger signal. At the moment the electrical pulse is triggered, the inverter detects a sudden change in current. When the detected current change rate is >0.5A / ms, it triggers the compressor speed to reduce load. The inverter automatically reduces the compressor speed by 10% (lasting 0.1 seconds) to offset the electrical pulse current impact and avoid pressure fluctuations.

[0116] When the electrical pulse ends and no moisture residue is detected on the fins, the system enters a state of waiting for the next trigger.

[0117] Embodiment 2 of the present invention discloses a frost prevention method, based on the evaporator frost prevention device described in Embodiment 1, comprising the following steps:

[0118] Collect environmental parameters and compare them with preset thresholds to determine whether to enter anti-frost mode;

[0119] After determining that anti-frosting mode has been entered, the electric field pulse frequency is calculated based on environmental parameters;

[0120] The calculated electric field pulse frequency is input to the electrochromic layer to trigger an electric pulse signal, forming a continuous water film. At the same time, the nano-micro protrusion array 3 generates local eddies to inhibit ice crystal formation.

[0121] Simultaneously with the triggering of the electrical pulse signal, the piezoelectric ceramic vibrator is activated, outputting a mechanical vibration frequency that is transmitted to the fins via the evaporator support.

[0122] The system detects the residual moisture on the fin surface. If no moisture is detected on the fin surface, the anti-frosting process is considered complete, and the system enters standby mode. If moisture is detected as not being completely removed, the above steps are repeated until the anti-frosting conditions are met.

[0123] In a preferred but non-limiting embodiment of the present invention, the steps specifically include:

[0124] Step 1: Environmental parameter acquisition and anti-frost mode determination;

[0125] Specifically, step 1 includes:

[0126] Step 1.1: Collect the ambient relative humidity (RH) value in real time using a humidity sensor, and collect the surface temperature (T) value of the evaporator fins in real time using a temperature sensor;

[0127] Step 1.2: Compare the collected RH and T values ​​with the preset thresholds: If the condition "RH≥85% and T≤5℃" is met, the evaporator is determined to enter the anti-frost mode and the anti-frost process is started; otherwise, the normal operation status is maintained.

[0128] Step 2: Electric field pulse triggering and water film spreading control;

[0129] Specifically, step 2 includes:

[0130] Step 2.1: After determining that the anti-frost mode has been entered, the micro quantum flow field coupling chip is activated to dynamically calculate the electric field pulse frequency based on real-time environmental parameters (RH, T, γ0): f=k1·(RH) 2 ·(T) -1 And adjust the shear rate γ=k2·f to ensure E_ads <E_cryst;

[0131] Wherein, k1 and k2 are device adaptive parameters, which are adjusted in real time through a preset algorithm;

[0132] Step 2.2: Input the calculated electric field pulse frequency f into the electrochromic layer (such as WO3 material) to trigger the electric pulse signal;

[0133] Step 2.3: Under the action of an electric pulse, the electrochromic layer undergoes a quantum transition, its surface hydrophilicity is significantly enhanced, the adsorption energy of water molecules is reduced, and a continuous water film is formed;

[0134] Step 2.4: Simultaneously, the nano-micro-protrusion array (gradient height 50nm→100nm, spacing 200nm) generates local eddies under the action of electric field pulses, which enhances the flow field shear rate γ, further destroys the hydrogen bond structure of water molecules, and inhibits ice crystal formation.

[0135] Step 3: Piezoelectric vibration-assisted ash removal and water film enhancement;

[0136] Specifically, step 3 includes:

[0137] Step 3.1: Simultaneously with the electrical pulse triggering, the piezoelectric ceramic vibrator is activated, outputting a mechanical vibration signal with a resonant frequency of 500Hz;

[0138] Step 3.2: The vibration signal is transmitted to the fins through the evaporator support, and 99.3% of the attached dust is shaken off by the resonance effect of the dust particles (400-600Hz frequency band);

[0139] Step 3.3: During the vibration process, the water film spreading speed increases by 3 times, and at the same time the airflow carries the water film to the edge of the fins, reducing water vapor residue.

[0140] Step 4: Dynamic adjustment of compressor speed and control of system stability

[0141] Specifically, step 4 includes:

[0142] Step 4.1: Collect the compressor current value in real time through the current monitoring IC built into the frequency converter;

[0143] Step 4.2: At the moment of electrical pulse triggering, if the detected current surge rate exceeds 0.5A / ms, trigger the compressor speed to reduce load.

[0144] Reduce the compressor speed by 10% for 0.1 seconds to counteract the current surge caused by the electrical pulse;

[0145] After the load reduction is completed, gradually restore the compressor to its original operating state to avoid system pressure fluctuations.

[0146] Step 5: Verify the anti-frost effect and end the process;

[0147] Specifically, step 5 includes:

[0148] Step 5.1: Monitor the residual moisture state on the fin surface using optical or capacitive sensors;

[0149] Step 5.2: If no moisture residue is detected on the fin surface, the anti-frost process is considered complete, and the system enters standby mode;

[0150] Step 5.3: If residual moisture is detected and not completely removed, repeat steps 2-4 until the anti-frost conditions are met.

[0151] It is worth noting that in the embodiments of the present invention, "steps + numbers" is only an expression for clearly describing the specific implementation of the test method, and not an absolute restriction on the order of the steps. Under the guidance of the core concept of the present invention, changing the order of these steps to obtain the same or similar technical effects all fall within the scope of the present invention.

[0152] The evaporator anti-frost method of the present invention generates local eddies through a nano-micro-protrusion array (gradient 50nm→100nm), achieves rapid water film spreading through an electrochromic layer, and shakes off dust with 500Hz vibration. The three synergistic effects block the physical process of frost formation within 100μs.

[0153] Embodiment 3 of the present invention discloses a refrigeration device, including the evaporator anti-frost device as described in Embodiment 1.

[0154] Embodiment 4 of the present invention provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the computer program is loaded onto the processor, it implements the anti-frost method according to Embodiment 2.

[0155] Embodiment 5 of the present invention provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the anti-frost method according to Embodiment 2.

[0156] Compared with the prior art, the beneficial effects of the present invention include at least the following:

[0157] 1. Traditional fins have a planar structure, while this patent uses a nano-micro-protrusion array with height gradient (50nm→100nm) and spacing (200nm) to form local eddies on the fin surface, which significantly improves the shear rate. Combined with the dynamic coupling of electric field pulse frequency f and flow field shear rate γ, it solves the problem of water molecules easily accumulating on the surface of traditional fins, resulting in high adsorption energy and frost formation.

[0158] 2. Existing technologies mostly use static hydrophobic coatings, while this patent uses a WO3 electrochromic layer to dynamically switch between hydrophilic and hydrophobic states when triggered by an electrical pulse, which solves the problem that static hydrophobic coatings inhibit the spread of water molecules, resulting in water vapor residue and easy formation of frost.

[0159] 3. Traditional dust removal relies on mechanical vibration or blowing, while this patent uses piezoelectric vibrating plates to precisely match the resonant frequency band of dust (400-600Hz), shaking off 99.3% of the dust. This solves the problem of dust covering the fin surface, hindering the spread of water molecules, and increasing the risk of secondary frosting.

[0160] 4. Existing technologies do not link the frequency converter with the electrical pulse trigger, while this patent uses the frequency converter to monitor the compressor current change in real time and trigger the speed to reduce load (10% for 0.1 seconds), which solves the problem that the sudden increase in compressor current caused by the electrical pulse trigger may cause pressure fluctuations and affect the refrigeration efficiency.

[0161] In summary, existing technologies mostly employ a single anti-frost method (such as heating or hydrophobic coating), while this patent integrates real-time control of ambient humidity, fin temperature, and shear rate through a nano-micro-protrusion array structure, electric field pulses, piezoelectric vibration, electrochromic layer, and frequency converter linkage. This achieves rapid interruption of the physical process of frost formation, significantly improving anti-frost efficiency.

[0162] This disclosure can be a system, method, and / or computer program product. A computer program product may include a computer-readable storage medium having computer-readable program instructions loaded thereon for causing a processor to implement various aspects of this disclosure.

[0163] Computer-readable storage media can be tangible devices capable of holding and storing instructions for use by an instruction execution device. Computer-readable storage media can be, for example—but not limited to—electrical storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of computer-readable storage media include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital multifunction disc (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or recessed protrusions storing instructions thereon, and any suitable combination of the foregoing. The computer-readable storage media used herein are not to be construed as transient signals themselves, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media (e.g., light pulses through fiber optic cables), or electrical signals transmitted through wires.

[0164] The computer-readable program instructions described herein can be downloaded from computer-readable storage media to various computing / processing devices, or downloaded via a network, such as the Internet, local area network, wide area network, and / or wireless network, to an external computer or external storage device. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards them to the computer-readable storage media in the respective computing / processing device.

[0165] Computer program instructions used to perform the operations of this disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, status setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The computer-readable program instructions may execute entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or may be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, electronic circuitry, such as programmable logic circuitry, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), is personalized by utilizing the status information of the computer-readable program instructions to implement various aspects of this disclosure.

[0166] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the protection scope of the claims of the present invention.

Claims

1. An evaporator anti-frost device, comprising an evaporator support and fins, characterized in that: The evaporator support is a rectangular frame consisting of an upper protective plate (2), an evaporator right side plate (1), a bottom plate (4), and an evaporator left side plate (5) connected in sequence, with the fins set at the bottom of the rectangular frame; The evaporator support is equipped with a piezoelectric vibrating plate. The vibration of the piezoelectric vibrating plate is transmitted to the fins through the evaporator support to prevent dust from covering the fin surface and hindering the spread of water molecules. The outer surface of the fin is configured as a nano-micro protrusion array (3), and an electrochromic layer is coated on the outer surface of the fin. The fin is connected to an electric field pulse generator. The electric field pulse generator generates an electric pulse signal to control the nano-micro protrusion array (3) to generate local eddies and make the electrochromic layer form a continuous water film to suppress frost formation on the evaporator.

2. The evaporator anti-frost device according to claim 1, characterized in that: The nano-microbump array (3) is a hemispherical microbump array, the height of the hemispherical microbump is 50-100nm, and the distance between the two hemispheres is 100-500nm.

3. A method for preventing frost, controlling an evaporator anti-frost device according to any one of claims 1-2, characterized in that: Includes the following steps: Collect environmental parameters and compare them with preset thresholds to determine whether to enter anti-frost mode; After determining that anti-frosting mode has been entered, the electric field pulse frequency is calculated based on environmental parameters; The calculated electric field pulse frequency is input to the electrochromic layer to trigger the electric pulse signal, forming a continuous water film. At the same time, the nano-micro protrusion array (3) generates local eddies to inhibit the formation of ice crystals. Simultaneously with the triggering of the electrical pulse signal, the piezoelectric ceramic vibrator is activated, outputting a mechanical vibration frequency that is transmitted to the fins via the evaporator support. The system detects the residual moisture on the fin surface. If no moisture is detected on the fin surface, the anti-frosting process is considered complete, and the system enters standby mode. If moisture is detected but not completely removed, the above steps are repeated until the anti-frosting conditions are met.

4. The anti-frost method according to claim 3, characterized in that: The environmental parameters include: ambient relative humidity and evaporator fin surface temperature.

5. The anti-frost method according to claim 3, characterized in that: The electrical pulse signal range is 50μs to 200μs, and the mechanical vibration frequency range is 400Hz to 600Hz.

6. The anti-frost method according to claim 3, characterized in that: When the electrical pulse signal is triggered, the compressor current value is collected. If the current mutation rate is detected to exceed the set threshold, the compressor speed is reduced. After the compressor speed is reduced, the compressor is restored to its original operating state.

7. The anti-frost method according to claim 6, characterized in that: The set threshold is 0.5A / ms, and the speed reduction is to reduce the compressor speed by 10% for 0.1 seconds to counteract the current surge caused by the electrical pulse.

8. A refrigeration device, characterized in that, Includes the evaporator anti-frost device as described in any one of claims 1-2.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the computer program is loaded into the processor, it implements the anti-frost method according to any one of claims 3-7.

10. A storage medium, characterized in that: The storage medium includes a stored program, wherein, when the program is executed, it controls the device containing the storage medium to perform the anti-frost method according to any one of claims 3-7.

Images