Heat dissipation device

Abstract

The heat dissipation device comprises a heat conduction plate set, the heat conduction plate set comprises a middle heat conduction plate and side edge heat conduction plates, the side edge heat conduction plates are arranged on the two sides of the middle heat conduction plate, and heat conduction pipes are installed between the middle heat conduction plate and the side edge heat conduction plates. The middle heat conduction plate and the side heat conduction plates are provided with installation semi-circular grooves, the heat conduction pipes are attached to the installation semi-circular grooves, the two sides of the heat conduction plate set are connected with heat dissipation plate sets, heat dissipation flow channels are arranged in the heat dissipation plate sets, and the heat dissipation flow channels are connected with heat dissipation pipes. According to the heat dissipation device provided by the invention, the uniformity of heat dissipation can be ensured, each part of a pipe can be ensured to achieve a good heat dissipation effect in the heat dissipation process, and the tight fit between the heat dissipation device and the pipe is ensured.

Description

Technical Field

[0001] This invention relates to the field of radiator technology, and more particularly to a heat dissipation device. Background Technology

[0002] For example, publication number "CN119937746A" discloses "a semiconductor heat sink and its usage method," which includes a semiconductor heat sink inside a first housing, having a heat absorption end and a heat dissipation end. A first heat dissipation pipe is mounted above the heat dissipation end, with a heat-conducting fin placed between them. The first heat dissipation pipe is connected to a flexible hose via a first water pump, and the other end of the flexible hose is connected to a main heat sink. The main heat sink consists of a second housing and an internal second water pump, a second heat dissipation pipe, and a return water pipe. However, in practical applications, this type of heat sink cannot effectively dissipate heat from pipe-type fluid devices, cannot guarantee a complete fit with the pipe material, and exhibits uneven heat dissipation. Summary of the Invention

[0003] In view of the problem mentioned in the background art that the heat dissipation process cannot effectively fit the pipe, resulting in uneven heat dissipation, the present invention provides a heat dissipation device that can ensure the uniformity of heat dissipation, ensure that all parts of the pipe can achieve good heat dissipation effect during the heat dissipation process, and ensure a tight fit between the heat dissipation device and the pipe.

[0004] To achieve the above objectives, the present invention adopts the following technical solution.

[0005] A heat dissipation device includes a heat-conducting plate assembly, comprising a central heat-conducting plate and side heat-conducting plates. The side heat-conducting plates are disposed on both sides of the central heat-conducting plate. A heat transfer pipe is installed between the central and side heat-conducting plates. Semi-circular mounting grooves are provided on both the central and side heat-conducting plates, and the heat transfer pipes are fitted into these grooves. Heat dissipation plate assemblies are connected to both sides of the heat-conducting plate assembly. Heat dissipation channels are provided within the heat dissipation plate assembly, and these channels are connected to heat dissipation pipes. In existing technologies, the contact surface between the heat dissipation device and the heat-generating product is generally planar. This leads to uneven heat dissipation during the heat dissipation process of non-planar structures due to differences in the contact surfaces at various points, affecting the heat dissipation quality. This is especially true for pipe-like structures (where fluid flows through the pipe), where the radiator only contacts the top surface of the pipe structure, resulting in near-line contact and poor heat dissipation quality. Therefore, this application addresses the aforementioned problems by providing a semi-circular mounting groove between the intermediate heat-conducting plate and the side heat-conducting plate. During use, the intermediate and side heat-conducting plates combine to form a heat-conducting plate assembly, clamping the heat transfer pipe in the middle. This allows the semi-circular mounting grooves on both sides of the heat transfer pipe to fit tightly against it. If any area of ​​the heat transfer pipe is warped, the semi-circular mounting grooves on both sides can be used to smooth out the warped area, ensuring uniform contact between the heat transfer pipe and the semi-circular mounting grooves on both sides, thus guaranteeing heat dissipation efficiency. Furthermore, heat dissipation plate assemblies are provided on both sides of the heat-conducting plate assembly, each containing a heat dissipation channel through which cooling fluid flows. Preferably, a counter-flow design maximizes the temperature difference heat transfer efficiency; and because the cooling fluid in the heat dissipation plate assembly flows continuously, continuous heat dissipation quality is ensured.

[0006] Preferably, a cooling pad is disposed between the heat-conducting plate assembly and the heat-dissipating plate assembly, and thermally conductive silicone grease is applied between the cooling pad and the heat-conducting plate assembly. The cooling pad, preferably a semiconductor cooling pad, is disposed between the heat-conducting plate assembly and the heat-dissipating plate assembly to ensure efficient heat transfer. It can absorb and release heat on both sides to achieve cooling, while the released heat can be exchanged with the fluid in the heat-dissipating plate assembly.

[0007] Preferably, the intermediate heat-conducting plate and one of the side heat-conducting plates are provided with a central hollow groove, and the heat dissipation plate assembly near the central hollow groove is provided with an avoidance hollow groove. The central hollow groove and the avoidance hollow groove are aligned. The heat transfer pipe includes a central extension pipe, which extends through the central hollow groove and the avoidance hollow groove. A central perforated groove is provided on the middle heat-conducting plate and one of the side heat-conducting plates. That is, when a side heat-conducting plate is provided on each side of the middle heat-conducting plate, the heat-conducting plate assembly consists of three plates. Only two of the plates have a central perforated groove, and the other side heat-conducting plate does not have a groove. An avoidance perforated groove is provided on the heat dissipation plate assembly on the side heat-conducting plate with the central perforated groove. The avoidance perforated groove is aligned with the central perforated groove, so that the heat transfer tube can spiral and extend its end from the middle area, ensuring the flatness of the entire heat transfer tube heat dissipation area. At the same time, it ensures that the heat plate assembly is flush with the heat-conducting plate assembly. The central extension tube of the heat transfer tube is the end part of the heat transfer tube shown in the figure, which needs to pass through the central perforated groove and the avoidance perforated groove.

[0008] Preferably, the heat sink assembly includes an external end and a connecting end. Connecting heat sinks are connected to the connecting ends of the heat sink assemblies on both sides, and the connecting heat sinks have a "U"-shaped structure. The heat sink assembly includes an external end and a connecting end, wherein the external end is connected to an external heat sink. A connecting heat sink connects the two heat sink assemblies, thereby enabling fluid to be transported from one heat sink assembly to the other, thus achieving fluid circulation. The "U"-shaped structure of the connecting heat sink ensures that the connectors on the two external ends face the same direction, facilitating the installation of the connecting heat sink.

[0009] Preferably, the heat sink assembly is provided with a plurality of linear independent flow channels, each of the linear independent flow channels including a confluence opening that is interconnected, each of the linear independent flow channels including its own corresponding diversion opening, and an anti-slip groove provided in the linear independent flow channel, wherein a flow regulating rubber strip is slidably connected in the anti-slip groove, and the flow regulating rubber strip can be pulled out from the diversion opening. The heat dissipation channels in the heat sink assembly are filled with fluid to achieve heat exchange. The optimal heat dissipation state of the fluid is that the cross-section of the heat dissipation pipe is completely filled with fluid to ensure the maximum effective contact area. However, when the cross-sectional area of ​​the heat dissipation channel remains unchanged, the heat dissipation effect can only be changed by adjusting the fluid flow rate. This method may lead to a situation where the fluid flow rate is too low to fill the heat dissipation channel when a smaller heat dissipation is required, which will cause the heat dissipation calculation to be inaccurate. At the same time, since the heat sink in this application adopts a dual-sided heat dissipation method, that is, heat sink assemblies are set on both sides and there are two heat transfer pipes between the two heat sink assemblies. If the fluid cannot fill the channel completely, a certain gap will exist between the heat sink assembly and the cooling fins. For example, if the fluid in the lower heat sink assembly is not fully filled, the fluid will settle in the lower half of the heat dissipation channel under the action of gravity, while an air gap will be created in the upper half. This will prevent the heat from the cooling fins connected to the lower heat sink assembly from being quickly exchanged through the fluid, resulting in a difference in the heat dissipation efficiency of the upper and lower heat sink assemblies and uneven heat dissipation effect. Therefore, this application introduces a detachable flow regulating strip, eliminating the continuous bend-type heat dissipation channel in the heat sink assembly. Instead, several linear independent channels are used, each equipped with an anti-slip groove. The cross-sectional structure of the anti-slip groove is generally dovetail, T-shaped, or hook-shaped, ensuring the connection stability of the flow regulating strip. While the overall structure of the linear independent channels is straight, some bends are possible depending on the actual situation, without affecting the overall linearity. There are no large-angle bends, facilitating the installation and removal of the flow regulating strip. Since the flow regulating strip can be pulled out from the diversion opening, it can be adjusted according to the flow direction during use. Adjustments can be made according to usage requirements. For example, when a small flow rate is needed, the flow regulating strip is not removed. The strip occupies some space in the linear independent flow channel, ensuring that the fluid is in full contact with the sidewall of the channel, even with a small flow rate. This avoids air gaps and ensures efficient heat exchange. When a large flow rate is needed, the strip can be partially removed to increase the cross-sectional area of ​​the channel. This ensures that the large flow rate fills the entire channel while maintaining the contact area between the fluid and the channel, improving heat exchange efficiency. It also reduces the rapid increase in flow velocity and minimizes noise.Preferably, during use, when a small flow rate is required, the connection between the front and back of the heat dissipation plate assembly is adjusted so that the bottom of the anti-slip groove is set away from the heat conduction plate assembly, thereby reducing the impact of the flow regulation rubber strip on heat exchange; while when a large flow rate is required, the connection between the front and back of the heat dissipation plate assembly is adjusted so that the bottom of the anti-slip groove is set closer to the heat conduction plate assembly, thereby increasing the heat exchange contact area through the structure of the anti-slip groove and improving the heat exchange effect on the side closer to the heat conduction plate assembly.

[0010] Preferably, the linear independent flow channel is provided with a plurality of anti-slip grooves, and each anti-slip groove is connected to a flow regulating strip. The number of anti-slip grooves in each linear independent flow channel is the same. Providing multiple anti-slip grooves in the linear independent flow channel improves the adjustment accuracy and increases the upper limit of the heat exchange area. Ensuring that the number of anti-slip grooves in each linear independent flow channel is the same, allowing the same flow regulating strip to be withdrawn from the linear independent flow channel during use, thereby ensuring uniform heat exchange capacity and heat dissipation throughout the entire heat sink assembly area.

[0011] Preferably, both the intermediate heat-conducting plate and the heat dissipation plate assembly are equipped with temperature protection switches. This facilitates the detection of excessively high or low temperatures, thereby achieving the purpose of temperature alarm.

[0012] Preferably, a temperature sensor is connected to the intermediate heat-conducting plate. This facilitates the detection of excessively high or low temperatures, thereby achieving the purpose of temperature alarm.

[0013] Preferably, the extended shapes of the mounting semicircular grooves on both sides of the intermediate heat-conducting plate are mirror-symmetrically arranged. This mirror-symmetrical arrangement of the mounting semicircular grooves ensures that the heat transfer effect of the two heat transfer tubes is identical, thereby improving the uniformity of temperature detection.

[0014] Preferably, the heat transfer tube has a composite nano-ceramic coating on its outer surface. This coating can increase the thermal conductivity of the PFA to 0.38 W / m·K, while coating technologies (such as nano-ceramics or graphene-silica hybrid coatings) further extend its lifespan and improve its wear resistance and corrosion resistance.

[0015] The beneficial effects of this invention are as follows: (1) It can ensure the uniformity of heat dissipation, ensure that all parts of the pipe can achieve good heat dissipation effect during the heat dissipation process, and ensure the tight fit between the heat dissipation device and the pipe. (2) It can ensure that the fluid fills the inner wall of the entire linear independent flow channel while achieving adjustable flow rate, thereby ensuring the uniformity and effectiveness of heat dissipation, avoiding the generation of air gaps, and simultaneously controlling the effective heat exchange area of ​​the linear independent flow channel. Attached Figure Description

[0016] Figure 1 This is an exploded view of the present invention.

[0017] Figure 2 This is an isometric sectional view of the heat-conducting plate assembly in this invention.

[0018] Figure 3 This is an isometric sectional view of the heat sink assembly in this invention.

[0019] Figure 4 This is a cross-sectional view of Example 2.

[0020] Figure 5 This is a side view of Embodiment 2.

[0021] In the picture: 1 Heat-conducting plate assembly, 11 Middle heat-conducting plate, 12 Side heat-conducting plate, 13 Mounting semi-circular groove, 14 Central hollow groove; 2 heat transfer tubes; 3 Heat sink assembly, 31 heat dissipation channel, 32 heat pipe, 321 external heat pipe, 322 connecting heat pipe, 33 clearance slot, 34 external end, 35 connecting end, 36 linear independent flow channel, 361 confluence opening, 362 diversion opening, 363 anti-slip groove, 364 flow regulating rubber strip. 4. Cooling chips; 5. Temperature protection switch; 6. Temperature sensor. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0023] Example 1: like Figure 1As shown, a heat dissipation device includes a heat-conducting plate assembly 1, which includes a middle heat-conducting plate 11 and side heat-conducting plates 12. The side heat-conducting plates 12 are provided on both sides of the middle heat-conducting plate 11. A heat transfer pipe 2 is installed between the middle heat-conducting plate 11 and the side heat-conducting plate 12. A semi-circular groove 13 is provided on the middle heat-conducting plate 11 and the side heat-conducting plate 12. The heat transfer pipe 2 is fitted into the semi-circular groove 13. Heat dissipation plate assemblies 3 are connected to both sides of the heat-conducting plate assembly 1. A heat dissipation channel 31 is provided in the heat dissipation plate assembly 3. A heat dissipation pipe 32 is connected to the heat dissipation channel 31. In existing technologies, the contact surface between the heat dissipation device and the heat-generating product is generally a planar structure. This leads to uneven heat dissipation due to differences in the contact surfaces at different parts during the heat dissipation process of non-planar structures, affecting the heat dissipation quality. This is especially true for pipe-type structures (where fluid flows through the pipe structure), where the heat sink only contacts the top surface of the pipe structure, resulting in near-line contact and poor heat dissipation quality. Therefore, this application addresses the above problems by providing a semi-circular groove 13 between the intermediate heat-conducting plate 11 and the side heat-conducting plate 12. During use, the intermediate heat-conducting plate 11 and the side heat-conducting plate 12 combine to form a heat-conducting plate assembly 1, which clamps the heat transfer pipe 2 in the middle. This allows the semi-circular grooves 13 on both sides of the heat transfer pipe 2 to fit tightly against it. If there is any local warping of the heat transfer pipe 2, the semi-circular grooves 13 on both sides can be used to press and flatten the warped area, ensuring that the heat transfer pipe 2 fits evenly against the semi-circular grooves 13 on both sides, thus guaranteeing heat dissipation efficiency. Furthermore, heat dissipation plate groups 3 are respectively provided on both sides of the heat conduction plate group 1. Heat dissipation flow channels 31 are provided in the heat dissipation plate group 3. Cooling fluid can flow through the heat dissipation flow channels 31. Preferably, the temperature difference heat transfer efficiency is maximized by counterflow design. Since the cooling fluid of the heat dissipation plate group 3 flows continuously, the continuous heat dissipation quality is guaranteed.

[0024] like Figure 1 As shown, a cooling pad 4 is disposed between the heat-conducting plate assembly 1 and the heat sink assembly 3, and thermally conductive silicone grease is applied between the cooling pad 4 and the heat-conducting plate assembly 1. The cooling pad 4, preferably a semiconductor cooling pad 4, is disposed between the heat-conducting plate assembly 1 and the heat sink assembly 3 to ensure heat transfer efficiency. It can absorb and release heat on both sides of the cooling pad 4 to achieve the purpose of cooling, while the released heat can be exchanged with the fluid in the heat sink assembly 3.

[0025] like Figure 1 , 2As shown in Figure 3, a central hollow groove 14 is provided on the middle heat-conducting plate and one of the side heat-conducting plates 12. An avoidance hollow groove 33 is provided on the heat dissipation plate group 3 near the central hollow groove 14. The central hollow groove 14 and the avoidance hollow groove 33 are aligned. The heat transfer pipe 2 includes a central extension pipe, which extends out from the central hollow groove 14 and the avoidance hollow groove 33. A central perforated groove 14 is provided on the middle heat-conducting plate and one of the side heat-conducting plates 12. That is, when a side heat-conducting plate 12 is provided on each side of the middle heat-conducting plate, the heat-conducting plate group 1 consists of three plates. The central perforated groove 14 is provided on only two of the plates, and the other side heat-conducting plate 12 is not provided with a groove. An avoidance perforated groove 33 is provided on the heat dissipation plate group 3 on the side of the side heat-conducting plate 12 on the side where the central perforated groove 14 is provided. The avoidance perforated groove 33 is aligned with the central perforated groove 14, so that the heat transfer pipe 2 can spiral and extend its end from the middle area, ensuring the flatness of the heat dissipation area of ​​the entire heat transfer pipe 2, and at the same time ensuring that the heat plate group can be flush with the heat-conducting plate group 1.

[0026] like Figure 3 As shown, the heat sink assembly 3 includes an external end 34 and a connecting end 35. Connecting heat pipes 322 are connected to the connecting ends 35 on both sides of the heat sink assembly 3. The connecting heat pipes 322 have a "U"-shaped structure. The heat sink assembly 3 includes an external end 34 and a connecting end 35, where the external end 34 is connected to an external heat pipe 321. A connecting heat pipe 322 connects the two heat sink assemblies 3, thereby enabling fluid to be transported from one heat sink assembly 3 to the other, thus achieving the circulation of the cooling fluid. The "U"-shaped structure of the connecting heat pipe 322 ensures that the connectors on the two external ends 34 face the same direction, facilitating the installation of the connecting heat pipe 322.

[0027] like Figure 1 As shown, temperature protection switches 5 are connected to both the intermediate heat-conducting plate and the heat dissipation plate assembly 3. This facilitates the detection of excessively high or low temperatures, thereby achieving the purpose of temperature alarm.

[0028] like Figure 1 As shown, a temperature sensor 6 is connected to the middle heat-conducting plate. This facilitates the detection of excessively high or low temperatures, thereby achieving the purpose of temperature alarm.

[0029] like Figure 2 As shown, the extended shapes of the mounting semicircular grooves 13 on both sides of the middle heat-conducting plate 11 are mirror-symmetrically arranged. By mirror-symmetrically arranging the mounting semicircular grooves 13 on both sides, the heat transfer effect of the two heat transfer tubes 2 is made the same, which can improve the uniformity of temperature detection.

[0030] A composite nano-ceramic coating is applied to the outer surface of the heat transfer tube 2. This coating can increase the thermal conductivity of the PFA to 0.38 W / m·K. At the same time, coating technologies (such as nano-ceramics and graphene-silica hybrid coatings) further extend the lifespan and improve wear resistance and corrosion resistance.

[0031] The specific assembly structure in this embodiment is as follows: In this embodiment, the heat-conducting plate assembly is located in the middle position. The heat-conducting plate assembly includes a central heat-conducting plate and two side heat-conducting plates. Semi-circular mounting grooves are provided on both the upper and lower sides of the central heat-conducting plate, while semi-circular mounting grooves are provided only on the side of the side heat-conducting plate closest to the central heat-conducting plate. The two semi-circular mounting grooves between the central heat-conducting plate and the adjacent side heat-conducting plate can be joined to form a complete circular groove structure. This circular groove structure can fit snugly with the heat transfer tubes. The coiled shapes of the semi-circular mounting grooves on both sides of the central heat-conducting plate are mirror-symmetrically arranged, thus ensuring that the heat transfer tubes located on both sides of the central heat-conducting plate are placed in the same position. Temperature sensors connected to the central heat-conducting plate ensure accurate measurement data. Cooling fins are placed between the two side heat-conducting plates and the heat sink assembly. Silicone grease is applied between the cooling fins and the side heat-conducting plates to ensure heat exchange quality. Heat dissipation channels are set inside the two heat sink assemblies, with heat pipes connected to both sides of the channels. The heat pipes on the external ends of the heat sink assemblies are external heat pipes, while those on the connecting ends are connecting heat pipes. The connecting heat pipes connect the heat dissipation channels of the two heat sink assemblies, thereby enabling fluid circulation. Temperature protection switches are installed on the central plate assembly and the heat sink assemblies on both sides. In this embodiment, a central hollow groove is provided on the intermediate heat-conducting plate. The heat transfer pipe on one side of the intermediate heat-conducting plate can extend directly upward, while the heat transfer pipe on the other side of the intermediate heat-conducting plate can extend in the same direction through the central hollow groove. A central hollow groove is also provided on the side heat-conducting plate in the extension direction, and an avoidance hollow groove is provided on the heat dissipation plate assembly in the extension direction, so that the heat transfer pipe in the middle part can extend out.

[0032] Example 2: like Figure 4 , 5 As shown, in this embodiment, the heat sink assembly 3 is provided with a plurality of linear independent flow channels 36. Each linear independent flow channel 36 includes a confluence opening 361 that is interconnected with each other. Each linear independent flow channel 36 includes its own corresponding diversion opening 362. An anti-slip groove 363 is provided in the linear independent flow channel 36. A flow regulating rubber strip 364 is slidably connected in the anti-slip groove 363. The flow regulating rubber strip 364 can be pulled out from the diversion opening 362.

[0033] The heat dissipation channel 31 in the heat dissipation plate assembly 3 is filled with fluid to achieve heat exchange. The optimal heat dissipation state of the fluid is that the cross-section of the heat dissipation pipe 32 is completely filled with fluid to ensure the maximum effective contact area. However, when the cross-sectional area of ​​the heat dissipation channel 31 remains unchanged, the heat dissipation effect can only be changed by adjusting the fluid flow rate. This method may lead to a situation where the fluid flow rate is too small to fill the heat dissipation channel 31 when a smaller heat dissipation is required, which will cause the heat dissipation calculation to be inaccurate. At the same time, since the heat sink in this application adopts a dual-sided heat dissipation method, that is, heat dissipation plate assemblies 3 are set on both sides, and there are two heat transfer pipes 2 between the two heat dissipation plate assemblies 3, if the fluid cannot fill the channel completely, there will be a certain gap between the heat dissipation plate assembly 3 and the cooling plate 4. For example, if the fluid in the lower heat dissipation plate assembly 3 is not fully filled, the fluid will settle in the lower half of the heat dissipation channel 31 under the action of gravity, while an air gap will be generated in the upper half. This will prevent the heat of the cooling plate 4 connected to the lower heat dissipation plate assembly 3 from being quickly exchanged through the fluid, resulting in a difference in the heat dissipation efficiency of the upper and lower heat dissipation plate assemblies 3 and uneven heat dissipation effect. Therefore, this application introduces a detachable flow regulating strip 364, eliminating the continuous bend-type heat dissipation channel 31 in the heat sink assembly 3, and instead using several linear independent channels 36. Each linear independent channel 36 has an anti-slip groove 363, the cross-sectional structure of which is generally dovetail, T-shaped, or hook-shaped, thus ensuring the connection stability of the flow regulating strip 364. Since the overall structure of the linear independent channel 36 is straight, it can have some bends depending on the actual situation, but this does not affect the overall linearity. There are no large-angle bends, thus facilitating the installation and removal of the flow regulating strip 364. Because the flow regulating strip 364 can be pulled out from the diversion opening 362, it is convenient to install and remove the flow regulating strip 364 during use. The flow rate adjustment strip 364 can be adjusted according to usage requirements. For example, when a small flow rate is required, the flow rate adjustment strip 364 is not removed. The flow rate adjustment strip 364 will occupy a certain space in the linear independent flow channel 36, so that even when the flow rate is small, the fluid can be fully in contact with the side wall of the linear independent flow channel 36, avoiding air gaps and ensuring heat exchange effect. When a large flow rate is required, part of the flow rate adjustment strip 364 can be removed, thereby increasing the cross-sectional area of ​​the linear independent flow channel 36. This ensures that the large flow rate can fill the entire linear independent flow channel 36, while maintaining the contact area between the fluid and the linear independent flow channel 36, improving heat exchange efficiency, and also reducing the rapid increase of flow velocity and noise generation.Preferably, during use, when a small flow rate is required, the connection between the front and back sides of the heat sink assembly 3 is adjusted so that the bottom of the anti-slip groove 363 is set away from the heat conduction plate assembly 1, thereby reducing the impact of the flow regulating rubber strip 364 on heat exchange; while when a large flow rate is required, the connection between the front and back sides of the heat sink assembly 3 is adjusted so that the bottom of the anti-slip groove 363 is set closer to the heat conduction plate assembly 1, thereby increasing the heat exchange contact area through the structure of the anti-slip groove 363 and improving the heat exchange effect on the side closer to the heat conduction plate assembly 1.

[0034] like Figure 4 , 5 As shown, several anti-slip grooves 363 are provided within the linear independent flow channel 36, and each anti-slip groove 363 is connected to a flow regulating strip 364. The number of anti-slip grooves 363 is the same in each linear independent flow channel 36. Providing multiple anti-slip grooves 363 in the linear independent flow channel 36 improves the adjustment accuracy and increases the upper limit of the heat exchange area. Ensuring that the number of anti-slip grooves 363 is the same in each linear independent flow channel 36 allows for the removal of identical flow regulating strips 364 during use, thus ensuring uniform heat exchange capacity and heat dissipation throughout the entire heat sink assembly 3 area.

[0035] like Figure 5 As shown in the figure, the flow regulating rubber strip 364 occupies the space inside the linear independent flow channel 36, thereby avoiding the formation of air gaps under low flow conditions. The size and specifications of the flow regulating rubber strip 364 can be replaced and adjusted adaptively according to the flow rate, thereby ensuring the elimination of air gaps. After the flow regulating rubber strip 364 is removed, the anti-slip groove 363 can also allow fluid to flow through, thereby increasing the heat exchange area and accommodating the passage of large flow rates.

[0036] In addition to the above structure, this application also includes a heat-conducting plate assembly 1, which includes a middle heat-conducting plate 11 and side heat-conducting plates 12. The side heat-conducting plates 12 are disposed on both sides of the middle heat-conducting plate 11. A heat transfer pipe 2 is installed between the middle heat-conducting plate 11 and the side heat-conducting plates 12. Semi-circular mounting grooves 13 are provided on the respective middle heat-conducting plate 11 and the side heat-conducting plates 12, and the heat transfer pipe 2 is fitted into the semi-circular mounting grooves 13. Heat dissipation plate assemblies 3 are connected to both sides of the heat-conducting plate assembly 1. Heat dissipation channels 31 are provided within the heat dissipation channels 31, and heat dissipation pipes 32 are connected to the heat dissipation channels 31. A cooling plate 4 is disposed between the heat-conducting plate assembly 1 and the heat dissipation plate assembly 3, and thermally conductive silicone grease is applied between the cooling plate 4 and the heat-conducting plate assembly 1. A central perforated groove 14 is provided on the intermediate heat-conducting plate and one of the side heat-conducting plates 12. An avoidance perforated groove 33 is provided on the heat dissipation plate assembly 3 near the central perforated groove 14. The central perforated groove 14 and the avoidance perforated groove 33 are aligned. The heat transfer pipe 2 includes a central extension pipe that extends through the central perforated groove 14 and the avoidance perforated groove 33. The heat dissipation plate assembly 3 includes an external end 34 and a connecting end 35. Connecting heat dissipation pipes 322 are connected to the connecting ends 35 on both sides of the heat dissipation plate assemblies 3. The connecting heat dissipation pipes 322 have a "U"-shaped structure. Temperature protection switches 5 are connected to both the intermediate heat-conducting plate and the heat dissipation plate assembly 3. A temperature sensor 6 is connected to the intermediate heat-conducting plate. The extended shapes of the mounting semi-circular grooves 13 on both sides of the intermediate heat-conducting plate 11 are mirror-symmetrically arranged. A composite nano-ceramic coating is provided on the outer surface of the heat transfer pipe 2.

[0037] In existing technologies, the contact surface between the heat dissipation device and the heat-generating product is generally a planar structure. This leads to uneven heat dissipation due to differences in the contact surfaces at different parts during the heat dissipation process of non-planar structures, affecting the heat dissipation quality. This is especially true for pipe-type structures (where fluid flows through the pipe structure), where the heat sink only contacts the top surface of the pipe structure, resulting in near-line contact and poor heat dissipation quality. Therefore, this application addresses the above problems by providing a semi-circular groove 13 between the intermediate heat-conducting plate 11 and the side heat-conducting plate 12. During use, the intermediate heat-conducting plate 11 and the side heat-conducting plate 12 combine to form a heat-conducting plate assembly 1, which clamps the heat transfer pipe 2 in the middle. This allows the semi-circular grooves 13 on both sides of the heat transfer pipe 2 to fit tightly against it. If there is any local warping of the heat transfer pipe 2, the semi-circular grooves 13 on both sides can be used to press and flatten the warped area, ensuring that the heat transfer pipe 2 fits evenly against the semi-circular grooves 13 on both sides, thus guaranteeing heat dissipation efficiency. Furthermore, heat dissipation plate groups 3 are respectively arranged on both sides of the heat conduction plate group 1. Heat dissipation channels 31 are provided within the heat dissipation plate group 3, through which cooling fluid can flow. Preferably, a counter-flow design maximizes the temperature difference heat transfer efficiency. Since the cooling fluid in the heat dissipation plate group 3 flows continuously, continuous heat dissipation quality is ensured. A cooling chip 4 is arranged between the heat conduction plate group 1 and the heat dissipation plate group 3. The cooling chip 4 is preferably a semiconductor cooling chip 4, thereby ensuring heat transfer efficiency. It can absorb and release heat on both sides of the cooling chip 4 respectively, achieving the purpose of cooling. Simultaneously, the released heat can be exchanged with the fluid in the heat dissipation plate group 3.

[0038] A central perforated groove 14 is provided on the middle heat-conducting plate and one of the side heat-conducting plates 12. That is, when a side heat-conducting plate 12 is provided on each side of the middle heat-conducting plate, the heat-conducting plate group 1 consists of three plates. The central perforated groove 14 is provided on only two of the plates, and the other side heat-conducting plate 12 is not provided with a groove. An avoidance perforated groove 33 is provided on the heat dissipation plate group 3 on the side of the side heat-conducting plate 12 on the side where the central perforated groove 14 is provided. The avoidance perforated groove 33 is aligned with the central perforated groove 14, so that the heat transfer pipe 2 can spiral and extend its end from the middle area, ensuring the flatness of the heat dissipation area of ​​the entire heat transfer pipe 2, and at the same time ensuring that the heat plate group can be flush with the heat-conducting plate group 1. The heat sink assembly 3 includes an external end 34 and a connecting end 35. The external end 34 is connected to an external heat dissipation pipe 321. A connecting heat dissipation pipe 322 connects the two heat sink assemblies 3, thereby enabling fluid to be transported from one heat sink assembly 3 to the other, thus achieving the circulation of the heat dissipation fluid. The structure of the connecting heat dissipation pipe 322 is set in a "U" shape, so that the joints on the two external ends 34 face the same direction, facilitating the installation of the connecting heat dissipation pipe 322. This facilitates the detection of excessively high or low temperatures, thereby achieving the purpose of temperature alarm. The mounting semi-circular grooves 13 on both sides are mirror-symmetrically arranged, so that the heat transfer effect of the two heat transfer pipes 2 is the same, which can improve the uniformity of temperature detection. The outer surface of the heat transfer pipe 2 is coated with a composite nano-ceramic coating, which can increase the thermal conductivity of PFA to 0.38W / m·K. At the same time, the coating technology (such as nano-ceramic, graphene-silica hybrid coating) further extends the service life and improves wear resistance and corrosion resistance.

Claims

1. A heat dissipation device, characterized in that, The device includes a heat-conducting plate assembly, which comprises a central heat-conducting plate and side heat-conducting plates. The side heat-conducting plates are disposed on both sides of the central heat-conducting plate. A heat transfer pipe is installed between the central heat-conducting plate and the side heat-conducting plates. The central heat-conducting plate and the side heat-conducting plates are provided with mounting semi-circular grooves, and the heat transfer pipes are fitted into the mounting semi-circular grooves. Heat dissipation plate assemblies are connected to both sides of the heat-conducting plate assembly. Heat dissipation channels are provided within the heat dissipation plate assemblies, and heat dissipation channels are connected to heat dissipation pipes.

2. The heat dissipation device according to claim 1, characterized in that, A cooling pad is disposed between the heat-conducting plate assembly and the heat dissipation plate assembly, and thermally conductive silicone grease is applied between the cooling pad and the heat-conducting plate assembly.

3. A heat dissipation device according to claim 1, characterized in that, The intermediate heat-conducting plate and one of the side heat-conducting plates are provided with a central hollow groove. The heat dissipation plate assembly near the central hollow groove is provided with an avoidance hollow groove. The central hollow groove and the avoidance hollow groove are aligned. The heat transfer pipe includes a central extension pipe, which extends out from the central hollow groove and the avoidance hollow groove.

4. A heat dissipation device according to claim 1, characterized in that, The heat sink assembly includes an external end and a connecting end. The heat sink assemblies on both sides are connected to a connecting heat sink pipe at the connecting end. The connecting heat sink pipe has a "U" shaped structure.

5. A heat dissipation device according to claim 1, characterized in that, The heat sink assembly is provided with several linear independent flow channels. Each linear independent flow channel includes a confluence opening that is interconnected with each other, and each linear independent flow channel includes its own corresponding diversion opening. Each linear independent flow channel is provided with an anti-slip groove, and a flow regulating rubber strip is slidably connected in the anti-slip groove. The flow regulating rubber strip can be pulled out from the diversion opening.

6. A heat dissipation device according to claim 5, characterized in that, The linear independent flow channel is provided with a number of anti-slip grooves, and each anti-slip groove is connected to a flow regulating rubber strip. The number of anti-slip grooves provided in each linear independent flow channel is the same.

7. A heat dissipation device according to any one of claims 1-6, characterized in that, Temperature protection switches are connected to both the intermediate heat-conducting plate and the heat dissipation plate assembly.

8. A heat dissipation device according to any one of claims 1-6, characterized in that, A temperature sensor is connected to the intermediate heat-conducting plate.

9. A heat dissipation device according to any one of claims 1-6, characterized in that, The extended shapes of the mounting semicircular grooves on both sides of the intermediate heat-conducting plate are mirror-symmetrically arranged.

10. A heat dissipation device according to any one of claims 1-6, characterized in that, The outer surface of the heat transfer tube is coated with a composite nano-ceramic coating.

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