Temperature sampling device and method of power module and frequency converter

Abstract

The invention discloses a temperature sampling device and method for power modules and a frequency converter, the number of the power modules is more than one, and more than two power modules are connected in parallel; the temperature sampling device of the power module comprises a main board and more than one slave board, under the condition that the number of the power module is one, temperature sampling of one power module is achieved through the mainboard in the mode that the mainboard conducts timing access on the mainboard; under the condition that the number of the power modules is N, temperature sampling of the N power modules is achieved through the main board and the N-1 slave boards in the mode that the main board conducts timing access on the main board itself and conducts polling access on the N-1 slave boards, and N is a positive integer and is larger than or equal to 2. According to the scheme, the main board and the slave board are arranged, polling sampling is carried out on the temperature information of all the power modules through the single-signal data line, temperature sampling of all the power modules is achieved, accuracy is good, and cost is low.

Description

Technical Field

[0001] This invention belongs to the field of frequency converter technology, specifically relating to a temperature sampling device, method and frequency converter for a power module, and particularly to a distributed temperature sampling device, method and frequency converter applied to multiple parallel IGBT modules. Background Technology

[0002] With the deepening and expansion of the application of power modules such as Insulated-Gate Bipolar Transistors (IGBTs) and Silicon Carbide (SiC) in new energy vehicles, smart grids, and industrial automation, higher requirements are being placed on their performance and reliability. Temperature, as a crucial parameter of power modules, directly affects their switching speed, switching losses, on-resistance, and current sharing characteristics. Therefore, accurate temperature monitoring and control are essential for the stable operation of power modules.

[0003] In many high-power applications, in order to save costs, a multi-module parallel connection (i.e., multiple power modules connected in parallel) technical solution is generally adopted to improve power. However, temperature sampling of multi-module parallel connection is more difficult.

[0004] The above content is only used to help understand the technical solution of the present invention and does not represent an admission that the above content is prior art. Summary of the Invention

[0005] The purpose of this invention is to provide a temperature sampling device, method, and frequency converter for power modules, in order to solve the problem of difficulty in temperature sampling of multiple modules in parallel (i.e., multiple power modules in parallel). The invention achieves the effect of high accuracy and low cost by setting up a main board and slave board and using a single signal data line to poll and sample the temperature information of all power modules.

[0006] This invention provides a temperature sampling device for power modules, wherein the number of power modules is one or more, and two or more power modules are connected in parallel; the temperature sampling device for power modules includes: a main board and slave boards, wherein there is one main board and one or more slave boards; wherein, when there is one power module, temperature sampling of one power module is achieved by the main board performing timed access to itself; when there are N power modules, temperature sampling of N power modules is achieved by the main board and N-1 slave boards, using the main board performing timed access to itself and the main board performing polling access to the N-1 slave boards, where N is a positive integer and N≥2.

[0007] In some implementations, the main board and one or more slave boards are arranged in a distributed manner; the main board and one of the slave boards, as well as two adjacent slave boards, are connected by a single signal data line.

[0008] In some embodiments, each power module has its own temperature sensing module; the motherboard has a temperature sampling module, a main control chip, and a transmission module; the slave board has a temperature sampling module and a transmission module; the transmission module of the motherboard and the transmission module of one of the slave boards, as well as the transmission modules of two adjacent slave boards, are connected using a single signal data line; wherein, the temperature sampling module of the motherboard is used to sample the temperature information of the temperature sensing module to which the power module corresponding to the motherboard belongs, to obtain the temperature sampling value of the power module corresponding to the motherboard; the temperature sampling module of the slave board is used to sample the temperature information of the temperature sensing module to which the power module corresponding to the slave board belongs, to obtain the temperature sampling value of the power module corresponding to the slave board; the main control chip is used to periodically access the temperature sampling module of the motherboard; and to poll the temperature sampling module of one or more slave boards, to obtain the temperature sampling value of the power module to which the temperature sensor belongs through periodic access and / or polling access, thereby realizing temperature sampling of the power module to which the temperature sensor belongs.

[0009] In some embodiments, the motherboard further includes an isolation module; the main control chip is further configured to process the temperature sampling values ​​of the corresponding power module obtained through timed access and / or polling access to obtain the temperature processing value of the corresponding power module; the isolation module is configured to isolate the temperature processing value of the corresponding power module and output it to obtain the temperature sampling result of the corresponding power module, thereby realizing the temperature sampling of the corresponding power module.

[0010] In some embodiments, the temperature sampling module includes: a voltage divider module, a first filter module, an FPGA chip, and a DS2413 chip; wherein, a preset DC power supply is grounded after passing through the voltage divider module and the temperature sensing module of the corresponding power module; the first filter module is connected in parallel across the two ends of the temperature sensing module of the corresponding power module; the common terminal of the voltage divider module and the temperature sensing module of the corresponding power module is connected to the main control chip after passing through the FPGA chip and the DS2413 chip, or connected to the main control chip through the transmission module.

[0011] In some embodiments, the motherboard further includes an output module; the output module includes a pull-up module and a second filtering module; wherein a preset DC power supply is grounded after passing through the second filtering module; the preset DC power supply is also connected to the output terminal of the DS2413 chip after passing through the pull-up module; the output terminal of the DS2413 chip is connected to the main control chip, or connected to the main control chip through the transmission module.

[0012] In conjunction with the above-described device, the present invention further provides a frequency converter, comprising: the temperature sampling device for the power module described above.

[0013] In conjunction with the aforementioned device, the present invention further provides a temperature sampling method for a power module, comprising: when the motherboard and each of the slave boards have a temperature sampling module, obtaining the temperature sampling value of the corresponding power module using the temperature sampling module; when the number of power modules is one, implementing temperature sampling of one power module by periodically accessing the motherboard itself through the motherboard; when the number of power modules is N, implementing temperature sampling of N power modules by periodically accessing the motherboard itself through the motherboard and N-1 slave boards, and by polling the N-1 slave boards through the motherboard, where N is a positive integer and N≥2.

[0014] In some implementations, temperature sampling of a power module is achieved by periodically accessing the motherboard itself via the motherboard. This includes: when the motherboard has a main control chip and a DS2413 chip, having the DS2413 chip on the motherboard output the temperature sampling value of the power module corresponding to the motherboard; and having the main control chip periodically access the DS2413 chip on the motherboard to obtain the temperature sampling value of the power module corresponding to the motherboard, thereby achieving temperature sampling of a power module.

[0015] In some implementations, temperature sampling of N power modules is achieved through the motherboard and N-1 slave boards, using a method where the motherboard periodically accesses itself and polls the N-1 slave boards. This includes: when the motherboard has a master control chip and a DS2413 chip, and each of the N-1 slave boards has a DS2413 chip, the DS2413 chip on the motherboard and each DS2413 chip on each slave board outputs the temperature sampling value of the corresponding power module; the master control chip periodically accesses the DS2413 chip on the motherboard to obtain the temperature sampling value of the power module corresponding to the motherboard. The temperature sampling value of the block is used to sample the temperature of the power module corresponding to the motherboard; the main control chip sends a reset pulse, and the DS2413 chip of the N-1 slave boards resets itself and sends an acknowledgment pulse after receiving the reset pulse. After receiving the acknowledgment pulse of the corresponding slave board, the main control chip performs identity matching of the corresponding slave board in a polling manner until the identity matching is successful. Then, it accesses the DS2413 chip of the corresponding slave board to obtain the temperature sampling value of the power module corresponding to the corresponding slave board, thereby realizing temperature sampling of the power module corresponding to the corresponding slave board; in this way, the temperature sampling values ​​of the power modules corresponding to the N-1 slave boards are obtained, thereby realizing temperature sampling of the power modules corresponding to the N-1 slave boards.

[0016] Therefore, the solution of this invention sets up a main board and one or more slave boards. The main board has a temperature sampling circuit, an MCU2 chip, a DS2413 chip, and an MCU. The slave boards have a temperature sampling circuit, an MCU2 chip, and a DS2413 chip. The boards are connected to each other via a single data signal line. When sampling a single power module, the main board is used to collect the temperature information of the thermistor built into the power module using the temperature sampling circuit. After processing by the MCU2 chip and the DS2413 chip to obtain the temperature sampling value, the MCU obtains the temperature sampling value output by the DS2413 chip when accessing it, thus realizing the temperature sampling of a single power module. When sampling N power modules (i.e., two or more power modules) in parallel, the main board and N-1 slave boards are used. The MCU polls the slave boards through the single signal data line between the boards to obtain the temperature sampling value output by the DS2413 chip corresponding to each power module, thus realizing the temperature sampling of two or more power modules in parallel. Therefore, by setting up a main board and slave boards, and using a single signal data line to poll and sample the temperature information of all power modules, temperature sampling of all power modules is achieved, which is accurate and low-cost.

[0017] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention.

[0018] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the temperature sampling device for the power module of the present invention;

[0020] Figure 2 This is a topology diagram of a temperature sampling structure for a multi-parallel IGBT module provided by the present invention;

[0021] Figure 3 A schematic diagram of the NTC resistor sampling circuit for a multi-parallel IGBT module provided by the present invention;

[0022] Figure 4 A schematic flowchart of the IGBT module master-slave board temperature signal transmission method provided by the present invention;

[0023] Figure 5 This is a flowchart illustrating an embodiment of the temperature sampling method for the power module of the present invention;

[0024] Figure 6 This is a flowchart illustrating an embodiment of the method of the present invention, which utilizes the motherboard to periodically access itself to sample the temperature of a power module.

[0025] Figure 7 This is a schematic flowchart of an embodiment of the method of the present invention, which uses the motherboard to poll and access N-1 slave boards to sample the temperature of N power modules. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0027] Considering the challenges of temperature sampling in multi-module parallel operation (i.e., multiple power modules connected in parallel), several solutions typically employ three approaches: single-module temperature sampling, maximum temperature sampling across multiple modules, and multi-channel temperature sampling across all modules. Single-module temperature sampling selects only one module for temperature sampling, but this selection may not be the highest-temperature module, resulting in low reliability. Maximum temperature sampling across multiple modules compares the temperatures of all parallel modules and outputs the highest-temperature output; this method is cost-effective but struggles to assess the heat dissipation and current sharing characteristics of all modules. While multi-channel temperature sampling across all modules can achieve temperature sampling for all modules, this method requires an additional port and I / O (input / output) resource for each additional parallel module, leading to high cost and low versatility.

[0028] Therefore, the present invention proposes a temperature sampling device for power modules (such as multi-parallel IGBT modules or multi-parallel SiC modules), specifically a distributed temperature sampling device applied to multi-parallel IGBT modules. By using a single data signal line to identify all IGBT modules and perform real-time polling sampling, the difficulty of temperature sampling of multiple parallel modules is greatly reduced.

[0029] According to an embodiment of the present invention, a temperature sampling device for a power module is provided. See also Figure 1 The diagram shows a structural schematic of an embodiment of the device of the present invention. The number of power modules is one or more; when the number of power modules is two or more, the two or more power modules are connected in parallel. The power modules include, for example, IGBT modules, SiC modules, GaN modules, etc.; in the solution of the present invention, such as... Figure 1 As shown, the temperature sampling device of the power module includes: a main board and slave boards. There is one main board and one or more slave boards. The main board is as follows: Figure 2 The M_Board shown is from the board as follows Figure 2 The S_Board shown.

[0030] In the case where there is only one power module, the temperature of the power module is sampled by the motherboard through a periodic access to the motherboard itself.

[0031] When there are N power modules, the temperature of N power modules is sampled by the motherboard and N-1 slave boards through the motherboard's timed access to itself and the motherboard's polling access to the N-1 slave boards. N is a positive integer and N≥2.

[0032] The present invention proposes a distributed temperature sampling scheme for multiple parallel IGBT modules. By using a single data signal line to identify and poll all IGBT modules in real time, the difficulty of temperature sampling for multiple parallel modules is greatly reduced. It can accurately and conveniently realize temperature sampling of parallel power modules (such as multiple parallel IGBT modules or multiple parallel SiC modules). Thus, it solves the problem of low reliability of single-module temperature sampling, the problem of difficulty in judging the heat dissipation and current sharing characteristics of all modules by maximum temperature sampling of multiple modules, and the problem of high cost and low versatility of multi-channel temperature sampling of all modules.

[0033] In some implementations, the main board and one or more slave boards are arranged in a distributed manner.

[0034] A single signal data line is used to connect one of the mainboards and one of the slave boards, as well as between two adjacent slave boards.

[0035] In the solution of this invention, a single data line is used for signal transmission, which solves the problem of occupying multiple ports and chip pins when multiple modules are connected in parallel. That is, it solves the problem of high hardware resource consumption and low versatility when collecting temperature data from the module, saves hardware resources, improves the versatility of the driver board, and reduces development costs.

[0036] In some embodiments, each power module has its own temperature sensing module, such as an NTC resistor module; the motherboard has a temperature sampling module, a main control chip, and a transmission module, the main control chip being such as... Figure 2 The MCU shown has a transmission module as follows: Figure 2 The transmitting terminal NTC_Tx and receiving terminal NTC_Rx are shown; the slave board has a temperature sampling module and a transmission module; the transmission module of the main board and the transmission module of one of the slave boards, as well as the transmission modules of two adjacent slave boards, are all connected by a single signal data line. Figure 2 This is a topology diagram of a temperature sampling structure for multiple parallel IGBT modules provided by the present invention. The solution of the present invention is applicable to the field of frequency converter control. The topology of the temperature sampling structure for multiple parallel IGBT modules is as follows: Figure 2As shown, M_Board is the motherboard, S_Board is the slave board, NTC_Tx is the transmitting terminal, and NTC_Rx is the receiving terminal. The boards are connected (i.e., between the motherboard and slave boards, and between slave boards) via a single data signal line. The IGBT module has a built-in NTC thermistor, i.e., a negative temperature coefficient thermistor. The single data signal line connection means that the boards are connected via a single wire. This single wire is used to transmit temperature signals via a 1-wire protocol, for example: Figure 2 As shown, the connection is as follows: NTC_TX terminal → wire → NTC_RX terminal → NTC_TX terminal → wire, which together form a very long data cable. In the solution of this invention, signal transmission between boards is achieved through only a single data signal line, saving hardware resources, improving the versatility of the driver board, and reducing development costs.

[0037] The motherboard's temperature sampling module is used to sample the temperature information of the temperature sensing module to which the power module corresponding to the motherboard belongs, and obtain the temperature sampling value of the power module corresponding to the motherboard.

[0038] The temperature sampling module of the slave board is used to sample the temperature information of the temperature sensing module to which the power module corresponding to the slave board belongs, and obtain the temperature sampling value of the power module corresponding to the slave board; that is, for the temperature sensing module of the power module corresponding to the temperature sampling module itself, both the temperature sampling module of the motherboard and the temperature sampling module of the slave board are used to sample the temperature information of the temperature sensing module to obtain the temperature sampling value.

[0039] The main control chip is used to periodically access the temperature sampling module of the motherboard; and to poll the temperature sampling module of one or more slave boards, to obtain the temperature sampling value of the power module to which the temperature sensor belongs through periodic access and / or polling access, thereby realizing temperature sampling of the power module to which the temperature sensor belongs.

[0040] In the M_Board (main board), the NTC Sampling Circuit is connected to the first connection terminal of the DS2413 chip via the MCU2; the second connection terminal of the DS2413 chip is interconnected with the first connection terminal of the MCU, and the second connection terminal of the MCU is interconnected with the NTC_Rx (receive terminal) as a temperature sampling signal.

[0041] exist Figure 2In the example shown, in the S_Board (slave board), the NTC_Tx (transmit terminal) is interconnected with the NTC_Rx (receive terminal) in the M_Board (main board), and the NTC_Rx (receive terminal) is interconnected with the NTC_Tx (transmit terminal) in another S_Board (slave board); the NTC Sampling Circuit is connected to the first connection terminal of the DS2413 chip via MCU2; the second connection terminal of the S2413 chip is interconnected with the NTC_Tx (transmit terminal).

[0042] exist Figure 2 In the example shown, if a single module is operating (i.e., the IGBT modules are not connected in parallel), a single motherboard is sufficient. Using a single motherboard for temperature sampling of a single module specifically means that when the single module is not connected in parallel, it only needs to be connected to the M_Board (motherboard), without the S_Board (slave board). The temperature of the single module is reflected by the resistance change of the built-in thermistor NTC in the single module. The temperature information is collected by the NTC Sampling Circuit and transmitted to MCU2 (microprocessor). MCU2 processes the temperature information and continuously sends it to the DS2413 chip. The MCU periodically accesses the DS2413 chip, at which time the DS2413 chip transmits the temperature information to the MCU, which then processes the temperature information and uses it as the single-module temperature sampling signal. The MCU is a more advanced processor; temperature sampling is only one part of its processing. It also needs to handle a series of information such as PWM waves, fault signals, undervoltage, and overcurrent. MCU2 is a simpler processor with basic functions; FPGA, STM32, etc., are both suitable. In terms of price and size, the price of MCU is higher than that of MCU2, and the size of MCU is larger than that of MCU2.

[0043] exist Figure 2 In the example shown, if multiple modules operate in parallel, only the required number of slave boards need to be connected after the main board. When temperature sampling is required, the MCU on the main board simply polls the slave boards via the data lines between the terminals, and then outputs the sampled data. This master-slave board approach improves the versatility of the driver board. Specifically, temperature sampling of parallel modules is achieved by the main board polling the slave boards: when multiple modules are connected in parallel, such as... Figure 2The diagram shows four modules connected in parallel. One module is connected to the M_Board (main board), and the other three modules are connected to the S_Board (slave board). These modules are then connected to the NTC_TX and NTC_RX terminals between the boards via a single data signal line. This connection allows the MCU to access the DS2413 chips on all boards in turn. The accessed DS2413 chip transmits its temperature information to the MCU via the data line and terminals. This invention not only outputs the temperature of all modules but also requires only one port to output the NTC signal, regardless of the number of modules connected in parallel, thus saving hardware resources.

[0044] In some implementations, the motherboard further includes an isolation module, such as... Figure 2 The Isolator (isolation circuit) shown.

[0045] The main control chip is also used to process the temperature sampling values ​​of the corresponding power modules obtained through timed access and / or polling access to obtain the temperature processing values ​​of the corresponding power modules.

[0046] The isolation module is used to isolate and output the temperature processing value of the corresponding power module, thereby obtaining the temperature sampling result of the corresponding power module and realizing the temperature sampling of the corresponding power module.

[0047] exist Figure 2 In the example shown, in the M_Board (main board), the NTC Sampling Circuit is connected to the first connection terminal of the DS2413 chip after passing through MCU2; the second connection terminal of the DS2413 chip is interconnected with the first connection terminal of the MCU; the second connection terminal of the MCU is interconnected with the NTC_Rx (receive terminal); and the third connection terminal of the MCU outputs an NTC signal after passing through the Isolator (isolation circuit) as a temperature sampling signal.

[0048] exist Figure 2 In the example shown, if a single module is operating (i.e., IGBT modules are not connected in parallel), a single motherboard is sufficient. The MCU periodically accesses the DS2413 chip, which transmits temperature information to the MCU. The MCU processes the temperature information and outputs the final NTC signal as the single-module temperature sampling signal after isolation via an isolator. If multiple modules are operating in parallel, only the required number of slave boards need to be connected after the motherboard. When temperature sampling is required, the MCU on the motherboard simply polls and samples the slave boards through the data lines between the terminals. The MCU then isolates and outputs the sampled data.

[0049] In the solution of this invention, the temperature information of all modules is converted into analog signal output after being isolated by the motherboard, thereby improving the sampling accuracy.

[0050] In some embodiments, the temperature sampling module includes: a voltage divider module, a first filter module, an FPGA chip, and a DS2413 chip, wherein the voltage divider module is as follows: Figure 3 The resistor R1 shown, etc., the FPGA chip, such as Figure 3 The chip shown is U1B, etc., and the DS2413 chip is as follows: Figure 3 The chip U1A shown, etc., the first filtering module is as follows: Figure 3 The capacitor C1 shown is an example.

[0051] The preset DC power supply is grounded after passing through the voltage divider module and the temperature sensing module of the corresponding power module; the first filter module is connected in parallel across the temperature sensing module of the corresponding power module.

[0052] The common terminal of the temperature sensing module of the voltage divider module and the corresponding power module is connected to the main control chip via the FPGA chip and the DS2413 chip, or connected to the main control chip via the transmission module. Specifically, in the motherboard, the common terminal of the temperature sensing module of the voltage divider module and the corresponding power module can be directly connected to the main control chip via the FPGA chip and the DS2413 chip. In the slave board, the common terminal of the temperature sensing module of the voltage divider module and the corresponding power module is connected to the main control chip via the transmission module via the FPGA chip and the DS2413 chip.

[0053] In the solution of this invention, temperature sampling is performed by using the MCU to poll each board in a time-division manner. This can monitor the temperature of all parallel modules and provide timely protection when the temperature of any module is too high, effectively preventing the problem of IGBT module overheating and damage, and extending its service life.

[0054] In some embodiments, the motherboard further includes an output module; the output module includes a pull-up module and a second filtering module, the pull-up module being as follows: Figure 3 The resistor R0 shown is used in the second filter module. Figure 3 The capacitor C0 is shown.

[0055] The preset DC power supply is grounded after passing through the second filter module; the preset DC power supply is also connected to the output terminal of the DS2413 chip after passing through the pull-up module; the output terminal of the DS2413 chip is connected to the main control chip, or connected to the main control chip through the transmission module. Specifically, in the motherboard, the output terminal of the DS2413 chip is connected to the main control chip. In the slave board, the output terminal of the DS2413 chip is connected to the main control chip through the transmission module.

[0056] Figure 3 This is a schematic diagram of the NTC resistor sampling circuit for a multi-parallel IGBT module provided by the present invention. Figure 3 As shown, MCU is chip U0, and MCU2 is an FPGA chip. On the M_Board (main board), the NTC resistor sampling circuit includes: resistor R1, thermistor RT1, capacitor C1, chip U1A, chip U1B, resistor R0, and capacitor C0; the DC power supply VCC is grounded to GND through resistor R1 and thermistor RT1. Capacitor C1 is connected in parallel with thermistor RT1. The common terminal of resistor R1 and thermistor RT1 is output to chip U0 through chip U1B and chip U1A. The output terminal of chip U1A is also grounded to GND through resistor R0 and capacitor C0. The common terminal of resistor R0 and capacitor C0 is connected to the DC power supply VCC. On the S_Board (slave board), the NTC sampling circuit includes: resistor R2, thermistor RT2, capacitor C2, chip U2A, and chip U2B; the DC power supply VCC is grounded to GND through resistor R2 and thermistor RT2, capacitor C2 is connected in parallel with thermistor RT2, and the common terminal of resistor R2 and thermistor RT2 is output to chip U0 through chips U2B and U2A. Alternatively, on the S_Board (slave board), the NTC sampling circuit includes: resistor RN, thermistor RTN, capacitor CN, chip UNA, and chip UNB; the DC power supply VCC is grounded to GND through resistor RN and thermistor RTN, capacitor CN is connected in parallel with thermistor RTN, and the common terminal of resistor RN and thermistor RTN is output to chip U0 through chips UNB and UNA.

[0057] The principle of the NTC resistor sampling circuit for multiple parallel IGBT modules is as follows: Figure 3 As shown, the MCU is the master chip on the main board, capable of identifying, sending commands, and receiving data from the DS2413 chips on the main board or slave boards. These operations are all predefined by the 1-wire communication protocol. Identification: Each DS2413 chip has a unique 64-bit read-only memory (ROM) serial number (i.e., identifier), making each DS2413 chip on a board unique. During operation, the MCU sends ROM function commands defined by the 1-wire protocol on the data lines. Each DS2413 chip on the board listens for these commands and sends its own ROM serial number. Sending Commands: This refers to the MCU sending ROM function commands, read commands, and write commands to the data lines. Receiving Data: When a DS2413 chip is called by the MCU, it sends its own temperature information to the data lines, which the MCU receives.

[0058] exist Figure 3In the example shown, capacitors C0, C1, C2, and CN are filter capacitors; resistor R0 is a pull-up resistor, used to pull up the single data signal line; 1-wire is a communication protocol. The data line is a physical object; pulling up the data line means increasing the voltage level of the wire. Resistors RT1, RT2, and RTN are NTC resistors on the IGBT module; chips U1B, U2B, and UNB are Field Programmable Gate Array (FPGA) chips. Resistor RT1 samples the voltage divider circuit formed by resistors R1 and R1 and performs A / D conversion; chip U1A is a DS2413 1-wire device chip with a unique 64-bit ROM serial number. It can communicate with the MCU using the 1-wire protocol. When it receives a ROM command from the MCU, it can receive data transmitted from the FPGA through the PIO port of the DS2413 chip and send it to the MCU. A 1-wire device is one with a unique 64-bit ROM serial number, which can be identified through 1-wire communication. The DS2413 chip is a dual-channel programmable I / O 1-wire chip. It can receive dedicated device-level command protocols through its I / O ports to control and detect PIO pins, and output the data received from the PIO ports. Resistor RT1 is a built-in NTC resistor. After being divided by the VCC voltage on the board and resistor R1, a voltage signal is generated. This signal is filtered by capacitor C1 and then transmitted to the FPGA chip. The FPGA chip converts the voltage signal into two digital signals, which are output to the PIOA and PIOB pins of the DS2413 chip. When the MCU on the motherboard sends a read command to the DS2413 chip, the DS2413 chip sends the data from PIOA and PIOB to the MCU through the I / O ports.

[0059] In the solution of this invention, the temperature of all modules is sampled, which can protect the IGBT module in time when the temperature of any module is too high, effectively preventing the IGBT module from being damaged by overheating, extending its service life, and solving the problem of not being able to monitor the temperature of all parallel modules.

[0060] The technical solution of this invention involves setting up a main board and one or more slave boards. The main board has a temperature sampling circuit, an MCU2 chip, a DS2413 chip, and an MCU. The slave boards also have temperature sampling circuits, MCU2 chips, and DS2413 chips. The boards are connected via a single data signal line. When sampling a single power module, the main board collects the temperature information of the thermistor built into the power module using the temperature sampling circuit. After processing by the MCU2 chip and the DS2413 chip to obtain the temperature sampling value, the MCU obtains the temperature sampling value output by the DS2413 chip when accessing the module, thus realizing temperature sampling for a single power module. When sampling N power modules (i.e., two or more power modules) in parallel, the main board and N-1 slave boards are used. The MCU polls the slave boards through the single signal data line between the boards to obtain the temperature sampling value output by the DS2413 chip corresponding to each power module, thus realizing temperature sampling for two or more power modules in parallel. Therefore, by setting up a main board and slave boards, and using a single signal data line to poll and sample the temperature information of all power modules, temperature sampling of all power modules is achieved with good accuracy and low cost.

[0061] According to an embodiment of the present invention, a frequency converter corresponding to a temperature sampling device for a power module is also provided. This frequency converter may include the temperature sampling device for the power module described above.

[0062] Since the processing and functions implemented by the frequency converter in this embodiment are basically the same as those in the embodiments, principles and examples of the device, any details not covered in this embodiment can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0063] According to embodiments of the present invention, a temperature sampling method for a power module corresponding to a temperature sampling device for a power module is also provided, such as... Figure 5 The diagram shows a flowchart of an embodiment of the method of the present invention. The temperature sampling method of the power module may include steps S110 to S130.

[0064] In step S110, if the motherboard and each of the slave boards have a temperature sampling module, the temperature sampling value of the corresponding power module is obtained by using the temperature sampling module.

[0065] In step S120, when there is only one power module, the temperature of one power module is sampled by the motherboard through a timed access to the motherboard itself.

[0066] In step S130, when the number of power modules is N, the temperature of the N power modules is sampled by the motherboard and the N-1 slave boards through the motherboard's timed access to itself and the motherboard's polling access to the N-1 slave boards. N is a positive integer and N≥2.

[0067] The solution of this invention, by using a single data signal line to identify and perform real-time polling sampling of all IGBT modules, greatly reduces the difficulty of temperature sampling of multiple parallel modules. It can accurately and conveniently realize temperature sampling of parallel power modules (such as multiple parallel IGBT modules or multiple parallel SiC modules), thereby solving the problem of low reliability of single-module temperature sampling, the problem of difficulty in judging the heat dissipation and current sharing characteristics of all modules by sampling the maximum temperature of multiple modules, and the problem of high cost and low versatility of multi-channel temperature sampling of all modules.

[0068] In some implementations, step S120 involves using the motherboard to periodically access itself to sample the temperature of one of the power modules, as illustrated in the following exemplary description.

[0069] The following is combined with Figure 6 The diagram illustrates an embodiment of the method of the present invention, which utilizes the motherboard to periodically access itself to sample the temperature of a power module. Further explanation is provided regarding the specific process of sampling the temperature of a power module using the motherboard to periodically access itself in step S120, which includes steps S210 to S220.

[0070] Step S210: If the motherboard has a main control chip and a DS2413 chip, the DS2413 chip of the motherboard outputs the temperature sampling value of the power module corresponding to the motherboard.

[0071] Step S220: The main control chip periodically accesses the DS2413 chip of the motherboard to obtain the temperature sampling value of the power module corresponding to the motherboard, thereby realizing temperature sampling of one of the power modules.

[0072] exist Figure 2In the example shown, if a single module is operating (i.e., the IGBT modules are not connected in parallel), a single motherboard is sufficient. Using a single motherboard for temperature sampling of a single module specifically means that when the single module is not connected in parallel, it only needs to be connected to the M_Board (motherboard), without the S_Board (slave board). The temperature of the single module is reflected by the resistance change of the built-in thermistor NTC. Temperature information is collected by the NTC Sampling Circuit and transmitted to MCU2 (microprocessor). MCU2 processes the temperature information and continuously sends it to the DS2413 chip. The MCU periodically accesses the DS2413 chip, at which time the DS2413 chip transmits temperature information to the MCU, which then processes the temperature information and uses it as the single-module temperature sampling signal.

[0073] In some implementations, step S130 involves sampling the temperature of N power modules by using the motherboard and N-1 slave boards, through the motherboard's periodic access to itself and the motherboard's polling access to the N-1 slave boards. See the following exemplary description.

[0074] The following is combined with Figure 7 The illustrated flowchart shows an embodiment of the method of the present invention in which the motherboard polls N-1 slave boards to sample the temperature of N power modules. The flowchart further illustrates the specific process of sampling the temperature of N power modules in step S130 by polling N-1 slave boards using the motherboard, including steps S310 to S330.

[0075] In step S310, when the motherboard has a main control chip and a DS2413 chip, and each of the N-1 slave boards has a DS2413 chip, the DS2413 chip of the motherboard and each DS2413 chip of each slave board outputs the temperature sampling value of the corresponding power module.

[0076] Step S320: The main control chip periodically accesses the DS2413 chip of the motherboard to obtain the temperature sampling value of the power module corresponding to the motherboard, thereby realizing temperature sampling of the power module corresponding to the motherboard.

[0077] Step S330: The main control chip sends a reset pulse, and the DS2413 chips of the N-1 slave boards reset themselves and send response pulses after receiving the reset pulse. After receiving the response pulse of the corresponding slave board, the main control chip performs identity matching on the corresponding slave board in a polling manner until the identity matching is successful. Then, it accesses the DS2413 chip of the corresponding slave board to obtain the temperature sampling value of the power module corresponding to the corresponding slave board, thereby realizing temperature sampling of the power module corresponding to the corresponding slave board. In this way, the temperature sampling values ​​of the power modules corresponding to the N-1 slave boards are obtained, thereby realizing temperature sampling of the power modules corresponding to the N-1 slave boards.

[0078] exist Figure 2 In the example shown, if multiple modules operate in parallel, only the required number of slave boards need to be connected after the main board. When temperature sampling is required, the MCU on the main board simply polls the slave boards via the data lines between the terminals, and then outputs the sampled data. This master-slave board approach improves the versatility of the driver board. Specifically, temperature sampling of parallel modules is achieved by the main board polling the slave boards: when multiple modules are connected in parallel, such as... Figure 2 The diagram shows four modules connected in parallel. One module is connected to the M_Board (main board), and the other three modules are connected to the S_Board (slave board). These modules are then connected to the NTC_TX and NTC_RX terminals between the boards via a single data signal line. This connection allows the MCU to access the DS2413 chips on all boards in turn. The accessed DS2413 chip transmits its temperature information to the MCU via the data line and terminals. This invention not only outputs the temperature of all modules but also requires only one port to output the NTC signal, regardless of the number of modules connected in parallel, thus saving hardware resources.

[0079] Figure 4 This is a flowchart illustrating the IGBT module master-slave board temperature signal transmission method provided by the present invention. Figure 4 As shown, the temperature signal transmission process between the master and slave boards of the IGBT module includes:

[0080] Step 1: After the driver board is powered on and running, it begins to collect the temperature information of the IGBT module. The specific operation process is as follows: the MCU of the motherboard sends a reset pulse to the data signal line, and then executes Step 2.

[0081] Step 2: When the DS2413 chip on the slave board detects a reset pulse on the data signal line, it resets itself and sends an acknowledgment pulse to the data signal line, and then proceeds to step 3.

[0082] Step 3: If the motherboard MCU receives an acknowledgment pulse, it indicates that one or more devices are connected to the data signal line. At this time, the motherboard MCU sends a ROM instruction to the data line and then executes step 4.

[0083] Step 4: Since each slave board DS2413 chip has a unique ROM serial number, if none of them match the ROM instructions, the motherboard will use the ROM instruction search method to identify the ROM serial numbers of all slave board DS2413 chips and store them on the MCU, then return to initialization and repeat the above steps; if they match the ROM instructions, the corresponding DS2413 chip will respond, the motherboard will send a write instruction to it, control the PIOA and PIOB inside the DS2413 chip to be turned on, thereby reading the data sent by the FPGA chip and sending the read temperature information to the MCU.

[0084] During steps 1 to 4, if the motherboard resets, it returns to initialization; otherwise, it continues reading temperature information until the specified number of bytes are read, at which point it returns to initialization, and the PIOA and PIOB internal parameters of the DS2413 chip are disabled. The motherboard accesses different DS2413 chips on different slave boards by sending different ROM commands, thereby achieving the effect of polling temperature sampling.

[0085] The above embodiments only illustrate temperature sampling for IGBT modules. The solution of the present invention can be applied to other types of modules, such as SiC modules and gallium nitride (GaN) modules, according to actual needs. The above embodiments include specific chips, but it should be understood that similar chips can be used as substitutes.

[0086] In this invention, sampling is achieved through a single data line connection, requiring only a slave board connected to the motherboard. Control is based on a 1-wire communication protocol, using a single data line for both control and polling sampling. Signal transmission occurs between adjacent boards, allowing for the direct addition of slave boards as needed, resulting in a simple structure and high versatility. Control and sampling are completed via a single data signal line, saving hardware resources such as I / O ports.

[0087] Since the processing and functions implemented by the method in this embodiment are basically the same as the embodiments, principles and examples of the temperature sampling device of the aforementioned power module, any details not covered in the description of this embodiment can be found in the relevant descriptions in the aforementioned embodiments, and will not be repeated here.

[0088] In summary, it is readily understood by those skilled in the art that, without conflict, the aforementioned advantageous methods can be freely combined and superimposed.

[0089] The above description is merely an embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A temperature sampling device for a power module, characterized in that, The power module may be one or more, with two or more power modules connected in parallel; the temperature sampling device of the power module includes: a main board and a slave board, wherein there is one main board and one or more slave boards; wherein... When there is only one power module, the temperature of one power module is sampled by the motherboard through the motherboard itself by periodically accessing the motherboard itself. When there are N power modules, the temperature of N power modules is sampled by the motherboard and N-1 slave boards through the motherboard's timed access to itself and the motherboard's polling access to the N-1 slave boards. N is a positive integer and N≥2.

2. The temperature sampling device for the power module according to claim 1, characterized in that, The motherboard and one or more slave boards are configured in a distributed manner. A single signal data line is used to connect one of the mainboards and one of the slave boards, as well as between two adjacent slave boards.

3. The temperature sampling device for the power module according to claim 1, characterized in that, Each power module has its own temperature sensing module; the main board has a temperature sampling module, a main control chip, and a transmission module; the slave board has a temperature sampling module and a transmission module; the transmission module of the main board is connected to the transmission module of one of the slave boards, and the transmission modules of two adjacent slave boards are connected via a single signal data line; wherein, The temperature sampling module of the motherboard is used to sample the temperature information of the temperature sensing module to which the power module of the motherboard belongs, and obtain the temperature sampling value of the power module of the motherboard. The temperature sampling module of the slave board is used to sample the temperature information of the temperature sensing module to which the power module corresponding to the slave board belongs, and obtain the temperature sampling value of the power module corresponding to the slave board. The main control chip is used to periodically access the temperature sampling module of the motherboard; and to poll the temperature sampling module of one or more slave boards, to obtain the temperature sampling value of the power module to which the temperature sensor belongs through periodic access and / or polling access, thereby realizing temperature sampling of the power module to which the temperature sensor belongs.

4. The temperature sampling device for the power module according to claim 3, characterized in that, The motherboard also has an isolation module; The main control chip is also used to process the temperature sampling values ​​of the corresponding power modules obtained by timed access and / or polling access to obtain the temperature processing values ​​of the corresponding power modules. The isolation module is used to isolate and output the temperature processing value of the corresponding power module, thereby obtaining the temperature sampling result of the corresponding power module and realizing the temperature sampling of the corresponding power module.

5. The temperature sampling device for the power module according to claim 3 or 4, characterized in that, The temperature sampling module includes: a voltage divider module, a first filter module, an FPGA chip, and a DS2413 chip; wherein, The preset DC power supply is grounded after passing through the voltage divider module and the temperature sensing module of the corresponding power module; the first filter module is connected in parallel across the two ends of the temperature sensing module of the corresponding power module. The common terminal of the temperature sensing module of the voltage divider module and the corresponding power module is connected to the main control chip via the FPGA chip and the DS2413 chip, or connected to the main control chip via the transmission module.

6. The temperature sampling device for the power module according to claim 5, characterized in that, The motherboard also includes an output module; the output module includes a pull-up module and a second filtering module; wherein, The preset DC power supply is grounded after passing through the second filter module; the preset DC power supply is also connected to the output terminal of the DS2413 chip after passing through the pull-up module; the output terminal of the DS2413 chip is connected to the main control chip, or connected to the main control chip through the transmission module.

7. A frequency converter, characterized in that, include: The temperature sampling device for the power module as described in any one of claims 1 to 6.

8. A temperature sampling method for a power module corresponding to the temperature sampling device of a power module as described in any one of claims 1 to 6, characterized in that, include: With the motherboard and each of the slave boards having a temperature sampling module, the temperature sampling value of the corresponding power module is obtained using the temperature sampling module; When there is only one power module, the temperature of one power module is sampled by the motherboard through the motherboard itself by periodically accessing the motherboard itself. When there are N power modules, the temperature of N power modules is sampled by the motherboard and N-1 slave boards through the motherboard's timed access to itself and the motherboard's polling access to the N-1 slave boards. N is a positive integer and N≥2.

9. The temperature sampling method for the power module according to claim 8, characterized in that, Temperature sampling of one of the power modules is achieved by periodically accessing the motherboard itself via the motherboard, including: When the motherboard has a main control chip and a DS2413 chip, the DS2413 chip of the motherboard outputs the temperature sampling value of the power module corresponding to the motherboard. The main control chip periodically accesses the DS2413 chip on the motherboard to obtain the temperature sampling value of the power module corresponding to the motherboard, thereby realizing temperature sampling of one of the power modules.

10. The temperature sampling method for the power module according to claim 8, characterized in that, Temperature sampling of N power modules is achieved through the motherboard and N-1 slave boards, using a method of the motherboard periodically accessing itself and a method of the motherboard polling the N-1 slave boards, including: When the motherboard has a main control chip and a DS2413 chip, and each of the N-1 slave boards has a DS2413 chip, the DS2413 chip of the motherboard and each of the DS2413 chips of each slave board output the temperature sampling value of the corresponding power module. The main control chip periodically accesses the DS2413 chip on the motherboard to obtain the temperature sampling value of the power module corresponding to the motherboard, thereby realizing temperature sampling of the power module corresponding to the motherboard. The master control chip sends a reset pulse, and the DS2413 chips of the N-1 slave boards reset themselves and send an acknowledgment pulse after receiving the reset pulse. After receiving the acknowledgment pulse of the corresponding slave board, the master control chip performs identity matching on the corresponding slave board in a polling manner until the identity matching is successful. Then, it accesses the DS2413 chip of the corresponding slave board to obtain the temperature sampling value of the power module corresponding to the corresponding slave board, thereby realizing temperature sampling of the power module corresponding to the corresponding slave board. In this way, the temperature sampling values ​​of the power modules corresponding to the N-1 slave boards are obtained, thereby realizing temperature sampling of the power modules corresponding to the N-1 slave boards.

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