A high-performance host for digital entertainment space and an efficient heat dissipation device thereof

The multi-dimensional collaborative heat dissipation system with adaptive temperature and humidity control solves the limitations of traditional heat dissipation solutions in digital entertainment spaces, achieving efficient and low-cost host heat dissipation and ensuring hardware safety and performance output.

CN120949911BActive Publication Date: 2026-02-17SHENZHEN AIWEI NETWORK TECH CO LTD
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Patent Information

Application Number
CN202511470433.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-10-15
Publication Date
2026-02-17
Estimated Expiration
2045-10-15

AI Technical Summary

Technical Problem

Traditional cooling solutions in digital entertainment spaces suffer from problems such as airflow dead zones, dust accumulation, condensation risks, inability to provide overall cooling and dehumidification, and the need for additional equipment and energy waste, failing to meet the stable cooling requirements of high-performance hosts.

Method used

The system employs a multi-dimensional collaborative heat dissipation system with adaptive temperature and humidity control, including a dust filtration and cleaning component, a dehumidification and cooling component, and a high-efficiency heat dissipation device. It utilizes temperature and humidity sensors to control the airflow path and combines a semiconductor cooling chip, a porous evaporative cold wall, and a water circulation system to achieve dynamic adjustment and efficient heat dissipation.

Benefits of technology

It achieves adaptive temperature and humidity regulation, multi-dimensional collaborative heat dissipation, reduces maintenance costs, ensures continuous output of host performance and hardware security, and avoids the risks of local heat accumulation, dust buildup and condensation.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to the field of host computer heat dissipation, and more particularly to a high-performance host computer for digital entertainment spaces and its efficient heat dissipation device. The technical problem this invention aims to solve is to provide a high-performance host computer and its efficient heat dissipation device that can achieve adaptive temperature and humidity regulation, multi-dimensional collaborative heat dissipation, low maintenance costs, and ensure continuous performance output and hardware security. A high-performance host computer for digital entertainment spaces and its efficient heat dissipation device include a chassis and core computer components housed within the chassis. The chassis includes a main body, an air intake box located at the lower end of the main body, and an exhaust box located at the upper end of the main body, wherein the air intake box and the exhaust box are respectively connected to the internal cavity of the main body. This invention achieves the effects of adaptive temperature and humidity regulation, multi-dimensional collaborative heat dissipation, low maintenance costs, and ensure continuous performance output and hardware security.
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Description

Technical Field

[0001] This invention relates to the field of digital entertainment, and more particularly to a high-performance host computer for digital entertainment spaces and its efficient heat dissipation device. Background Technology

[0002] With the rapid development of the digital entertainment industry, the market demand for the performance of mainframes used in digital entertainment spaces continues to rise. To meet the high-load computing requirements, mainframes typically integrate core components such as high-performance CPUs, GPUs, multiple memory modules, and high-speed storage devices. These components generate a lot of heat when running at high frequencies. If the heat cannot be dissipated in time, the internal temperature of the chassis will rise rapidly to over 45°C. This will not only trigger the frequency reduction protection mechanism of the core components, but also accelerate hardware aging, shorten the lifespan of the mainframe, and even cause failures such as system crashes and hardware burnout, seriously affecting the user experience in digital entertainment scenarios.

[0003] Currently, mainstream PC cooling solutions are mainly divided into two categories: air cooling and water cooling. However, in the specific application scenarios of digital entertainment spaces, both solutions have obvious drawbacks:

[0004] Traditional air cooling relies on the side panel fan of the chassis and the CPU / GPU's built-in cooling fan to create airflow circulation. However, due to the limited internal space of the chassis, airflow can easily become dead zones, leading to localized heat accumulation. At the same time, when outside air enters the chassis directly, it brings in dust that adheres to the surface of core components. Over time, this can clog the gaps between the heatsink fins, causing cooling efficiency to decrease year by year. Furthermore, manual dust cleaning requires disassembly, which is costly and difficult to maintain. In addition, when the humidity of the digital entertainment environment is high, humid air entering the chassis can easily condense on the surface of low-temperature components, posing a risk of short circuits.

[0005] While conventional all-in-one liquid cooling offers superior heat dissipation efficiency compared to air cooling, it primarily targets single core components such as the CPU / GPU and cannot cool or dehumidify the overall environment of the computer case. Furthermore, liquid cooling systems rely on external radiators, occupying additional installation space in the digital entertainment area, which contradicts the need for a "compact and integrated" space layout. In addition, its heat dissipation process is not coordinated with air filtration and humidity regulation, still requiring additional air purifiers or dehumidifiers, increasing system complexity and operating costs.

[0006] Furthermore, digital entertainment spaces require long operating hours and high stability, and traditional cooling solutions cannot dynamically adjust their cooling strategies based on real-time temperature and humidity. Maintaining high-power cooling when the temperature is low and the humidity is low will result in energy waste. When the temperature is high and the humidity is high, the cooling and dehumidification capabilities cannot be quickly improved, leading to a mismatch between cooling efficiency and scenario requirements. Therefore, there is an urgent need to develop a high-performance host and its efficient cooling device that can achieve adaptive temperature and humidity adjustment, multi-dimensional collaborative cooling, low maintenance costs, and ensure continuous output of host performance and hardware security. Summary of the Invention

[0007] To overcome the shortcomings of traditional air cooling, such as airflow dead zones leading to localized heat accumulation, dust buildup causing reduced heat dissipation efficiency, and condensation in humid air posing a short-circuit risk, as well as the limitations of conventional water cooling, which can only cool a single component, requires an external radiator occupying extra space, lacks coordination between heat dissipation, filtration, and humidity control requiring additional equipment, and cannot dynamically adjust the heat dissipation strategy according to real-time temperature and humidity, leading to energy waste or insufficient heat dissipation, this invention aims to provide a high-performance host and its efficient heat dissipation device that can achieve adaptive temperature and humidity regulation, multi-dimensional coordinated heat dissipation, low maintenance costs, and ensure continuous output of host performance and hardware security.

[0008] This invention is achieved through the following specific technical means:

[0009] A high-performance host for digital entertainment spaces includes a chassis and core computer components housed within the chassis.

[0010] The chassis includes a main body, an air inlet box located at the lower end of the main body, and an air outlet box located at the upper end of the main body. The air inlet box and the air outlet box are respectively connected to the inner cavity of the main body.

[0011] A first air inlet is provided on one side of the air inlet box, and a fan is fixedly installed at the first air inlet. A pre-filter is also fixedly installed on the outside of the fan. A first exhaust port is opened at the upper end of the air inlet box facing the main body. A first ventilation duct and a second ventilation duct are provided inside the air inlet box. The two ends of the first ventilation duct are respectively connected to the first air inlet and the first exhaust port, and a dust filtration and cleaning component is provided on the first ventilation duct. The second ventilation duct is arranged in parallel with the first ventilation duct, with one end connected to the first ventilation duct and the other end connected to the first exhaust port. A dehumidification and cooling component is provided on the second ventilation duct. An electromagnetic reversing valve is provided at the connection between the first ventilation duct and the second ventilation duct.

[0012] The chassis is equipped with a temperature sensor and a humidity sensor, which are electrically connected to the electromagnetic reversing valve. When the temperature sensor detects a temperature greater than a preset temperature threshold or the humidity sensor detects a humidity greater than a preset humidity threshold, the electromagnetic reversing valve controls the airflow to flow only through the second ventilation duct.

[0013] The exhaust box has a second air inlet at the lower end facing the main box and a second exhaust outlet at the upper end. A fan is fixedly installed at the second exhaust outlet, and a one-way exhaust structure is provided at the upper end of the fan.

[0014] The chassis is also equipped with a high-efficiency heat dissipation device, which is used to dissipate heat from the heat dissipation end of the dehumidification and cooling components and to cool the hot air discharged from the exhaust box.

[0015] Furthermore, the dust filtration and cleaning assembly includes a fine-mesh dust filter fixed inside the first ventilation duct, a cleaning device disposed on the side of the fine-mesh dust filter near the first air inlet, and a dust collection box disposed below the fine-mesh dust filter; the cleaning device includes a cleaning roller brush, a driving device for driving the cleaning roller brush to reciprocate along the surface of the fine-mesh dust filter, and a driving motor for driving the cleaning roller brush to rotate; the driving device is a lead screw and slider mechanism, the slider of the lead screw and slider mechanism is fixedly connected to the driving motor, and the output shaft of the driving motor is coaxially fixed with the cleaning roller brush.

[0016] Furthermore, the dehumidification and cooling assembly includes several semiconductor cooling chips, cooling fins fixed in the second ventilation duct, and a water collection tray located below the cooling fins; the cold ends of the cooling fins and semiconductor cooling chips are bonded together by thermally conductive silicone, and the hot ends of the semiconductor cooling chips are bonded together with the porous evaporative cold wall of the high-efficiency heat dissipation device; the water collection tray is used to collect condensate precipitated on the surface of the cooling fins, and the bottom wall of the water collection tray is inclined, with its lowest point connected to the first return water pipe.

[0017] Furthermore, an auxiliary cleaning component is provided at the upper end of the fine-pore dust filter near the first air inlet. The auxiliary cleaning component is a water spray pipe with several nozzles facing the mesh surface of the fine-pore dust filter. The water inlet end of the water spray pipe is connected to the water storage tank of the high-efficiency heat dissipation device through a pipeline, and a solenoid valve is connected in series on the pipeline.

[0018] Furthermore, the unidirectional exhaust structure is a louver hinged to the second exhaust port of the exhaust box. A torsion spring is sleeved on the hinge shaft of the louver. One end of the torsion spring is fixed to the louver and the other end is fixed to the inner wall of the exhaust box. When the fan in the exhaust box is started, the airflow thrust overcomes the torsion spring force to open the louver. When the fan is turned off, the torsion spring resets and drives the louver to close.

[0019] Furthermore, an installation port is provided on the side wall of the air inlet box, through which the dust collection box is inserted into the air inlet box, and a handle is provided on the outside of the dust collection box.

[0020] Furthermore, the high-efficiency heat dissipation device includes a water storage tank, a cooling component, a porous evaporative cold wall, and a cooling water tank; the water storage tank is located on one side of the dehumidification cooling component, the cooling component is located between the second air inlet and the second air outlet of the exhaust box, the porous evaporative cold wall is located at the hot end of the semiconductor cooling chip of the dehumidification cooling component, and the cooling water tank is located on one side of the water storage tank.

[0021] The water storage tank is connected to the water receiving tray of the dehumidification cooling component via a first return water pipe; the water inlet of the cooling component is connected to the water storage tank via a first water supply pipe, and the water outlet of the cooling component is connected to the cooling water tank via a second return water pipe; the water inlet of the porous evaporative cooling wall is connected to the water storage tank via a second water supply pipe, and the water outlet of the porous evaporative cooling wall is connected to the cooling water tank via a third return water pipe; the cooling water tank is connected to the water storage tank via a fourth return water pipe.

[0022] A water pump is installed on the first water supply pipe to drive the water in the storage tank to circulate along the path of "storage tank-cooling component-cooling water tank-storage tank"; another water pump is connected in series on the second water supply pipe to drive the water in the storage tank to circulate along the path of "storage tank-porous evaporative cold wall-cooling water tank-storage tank".

[0023] Furthermore, the cooling component is a serpentine coiled heat exchange copper tube, and a number of heat dissipation fins are integrally formed on the outer wall of the heat exchange copper tube, and the heat dissipation fins are distributed at intervals along the length direction of the heat exchange copper tube.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] This invention achieves the effects of adaptive temperature and humidity regulation, multi-dimensional collaborative heat dissipation, low maintenance costs, and ensures continuous output of host performance and hardware security. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0027] Figure 2 This is a schematic diagram of the internal framework structure of the present invention.

[0028] Figure 3 This is a schematic diagram of the high-efficiency heat dissipation device frame of the present invention.

[0029] Figure 4 This is a schematic diagram of the dust filtration and cleaning component structure of the present invention.

[0030] Figure 5 This is a schematic diagram of the dehumidification and cooling component structure of the present invention.

[0031] Figure 6 This is a partial structural diagram of the dust filter cleaning component of the present invention.

[0032] The labels in the attached diagram are as follows: 1-Main housing, 2-Air inlet box, 3-Exhaust box, 4-Humidity sensor, 5-Temperature sensor, 6-High-efficiency heat dissipation device, 21-First air inlet, 22-First exhaust outlet, 23-First ventilation duct, 24-Second ventilation duct, 25-Electromagnetic reversing valve, 26-Dust filter cleaning assembly, 261-Fine-pore dust filter, 262-Cleaning roller brush, 263-Drive device, 264-Drive motor, 265-Dust collection box, 2 66-Auxiliary cleaning component, 27-Dehumidification and cooling component, 271-Semiconductor cooling chip, 272-Cooling fins, 273-Water tray, 31-Second air inlet, 32-Second air outlet, 61-Water storage tank, 62-Cooling component, 63-Porous evaporative cooling wall, 64-Cooling water tank, 65-First return water pipe, 66-First water supply pipe, 67-Second return water pipe, 68-Second water supply pipe, 69-Third return water pipe, 610-Fourth return water pipe. Detailed Implementation

[0033] The present invention will be further described below with reference to the accompanying drawings: Example

[0034] A high-performance host for digital entertainment spaces, such as Figures 1-6 As shown, it includes a chassis and computer core components disposed inside the chassis; the chassis includes a main body 1, an air intake box 2 disposed at the lower end of the main body 1 and an exhaust box 3 disposed at the upper end of the main body 1, the air intake box 2 and the exhaust box 3 being connected to the inner cavity of the main body 1 respectively.

[0035] The air inlet box 2 has a first air inlet 21 on one side, and a fan is fixedly installed at the first air inlet 21. A primary filter screen is also fixedly installed on the outside of the fan. The air inlet box 2 has a first exhaust port 22 at the upper end facing the main box 1. The air inlet box 2 has a first ventilation duct 23 and a second ventilation duct 24. The first ventilation duct 23 is connected to the first air inlet 21 and the first exhaust port 22 at both ends, and a dust filter cleaning component 26 is installed on the first ventilation duct 23. The second ventilation duct 24 is connected in parallel with the first ventilation duct 23, with one end connected to the first ventilation duct 23 and the other end connected to the first exhaust port 22. A dehumidification and cooling component 27 is installed on the second ventilation duct 24. An electromagnetic reversing valve 25 is installed at the connection between the first ventilation duct 23 and the second ventilation duct 24.

[0036] The chassis is equipped with a temperature sensor 5 and a humidity sensor 4, which are electrically connected to the electromagnetic reversing valve 25. When the temperature sensor 5 detects a temperature greater than a preset temperature threshold or the humidity sensor 4 detects a humidity greater than a preset humidity threshold, the electromagnetic reversing valve 25 controls the airflow to flow only through the second ventilation duct 24. The exhaust box 3 has a second air inlet 31 at the lower end facing the main body 1 and a second exhaust outlet 32 ​​at the upper end. A fan is fixedly installed at the second exhaust outlet 32, and the upper end of the fan has a one-way exhaust structure. The chassis is also equipped with a high-efficiency heat dissipation device 6, which is used to dissipate heat from the heat dissipation end of the dehumidification cooling component 27 and to cool the hot air discharged from the exhaust box 3.

[0037] The high-efficiency heat dissipation device 6 includes a water storage tank 61, a cooling component 62, a porous evaporative cold wall 63, and a cooling water tank 64; the water storage tank 61 is located on one side of the dehumidification cooling component 27, the cooling component 62 is located between the second air inlet 31 and the second air outlet 32 ​​of the exhaust box 3, the porous evaporative cold wall 63 is located at the hot end of the semiconductor cooling chip 271 of the dehumidification cooling component 27, and the cooling water tank 64 is located on one side of the water storage tank 61;

[0038] The water storage tank 61 is connected to the water receiving tray 273 of the dehumidification cooling component 27 via the first return water pipe 65; the water inlet of the cooling component 62 is connected to the water storage tank 61 via the first water supply pipe 66, and the water outlet of the cooling component 62 is connected to the cooling water tank 64 via the second return water pipe 67; the water inlet of the porous evaporative cooling wall 63 is connected to the water storage tank 61 via the second water supply pipe 68, and the water outlet of the porous evaporative cooling wall 63 is connected to the cooling water tank 64 via the third return water pipe 69; the cooling water tank 64 is connected to the water storage tank 61 via the fourth return water pipe 610.

[0039] A water pump is installed on the first water supply pipe 66 to drive the water in the water storage tank 61 to circulate along the path of "water storage tank 61 - cooling component 62 - cooling water tank 64 - water storage tank 61"; another water pump is connected in series on the second water supply pipe 68 to drive the water in the water storage tank 61 to circulate along the path of "water storage tank 61 - porous evaporative cold wall 63 - cooling water tank 64 - water storage tank 61".

[0040] Example 1:

[0041] The main unit's ventilation and filtration system operates as follows: After the main unit starts, the fan at the first air inlet 21 of the air inlet box 2 operates, drawing in outside air. The air first passes through the pre-filter on the outside of the fan, removing large particles and preventing them from entering subsequent ducts and causing blockages. The temperature sensor 5 and humidity sensor 4 inside the main unit 1 monitor the internal temperature and humidity in real time and transmit the data to the control module of the electromagnetic reversing valve 25. When the detected temperature and humidity are below the preset thresholds, the electromagnetic reversing valve 25 switches to the first ventilation duct 23, allowing air to pass through the pre-filter. Air flows along the first ventilation duct 23 and undergoes secondary filtration through the fine-pore dust filter 261 of the dust cleaning component 26 to remove fine dust. If the temperature or humidity exceeds the preset threshold, the electromagnetic reversing valve 25 switches to the second ventilation duct 24. After entering the second ventilation duct 24, the air comes into contact with the cooling fins 272 of the dehumidification and cooling component 27 to achieve cooling and dehumidification. The cooling fins 272 are cooled by the cold end of the semiconductor cooling chip 271. Water vapor in the air condenses into water on the surface of the fins and drips into the water collection tray 273 below for collection.

[0042] After the fine-pore dust filter 261 has been used for a period of time, the cleaning device is activated. The drive motor 264 drives the cleaning roller brush 262 to rotate. At the same time, the lead screw and slider mechanism drives the cleaning roller brush 262 to move back and forth along the surface of the fine-pore dust filter 261, sweeping the dust attached to the filter screen to the dust collection box 265 below. If the dust is stubborn, the solenoid valve of the auxiliary cleaning component 266 is opened, and the water in the water tank 61 is sprayed onto the dust filter screen through the nozzle of the water spray pipe. This, together with the roller brush, achieves deep cleaning. The wastewater after cleaning falls into the dust collection box 265 along with the dust. The dust collection box 265 can be pulled out for cleaning through the installation port on the side wall of the air inlet box 2.

[0043] Example 2:

[0044] The efficient heat dissipation device 6 works in conjunction with the heat dissipation process: the heat generated at the hot end of the semiconductor cooling chip 271 in the dehumidification cooling component 27 is conducted to the wall through the porous evaporative cold wall 63 that is attached to the hot end; in the second water supply pipe 68 of the efficient heat dissipation device 6, the water pump drives the water in the water storage tank 61 to flow into the porous evaporative cold wall 63, the water permeates and evaporates inside the porous wall, quickly absorbing the heat at the hot end, thereby cooling down the semiconductor cooling chip 271; to avoid heat accumulation at the hot end leading to a decrease in cooling efficiency, the water after absorbing heat flows back to the cooling water tank 64 through the third return water pipe 69 to cool down, and then returns to the water storage tank 61 through the fourth return water pipe 610 for recycling;

[0045] Hot air inside the main casing 1 enters the exhaust box 3 through the second air inlet 31 at the lower end of the exhaust box 3. At this time, the fan inside the exhaust box 3 operates, pushing the hot air upward. The hot air passes through the cooling component 62 inside the exhaust box 3. The cooling component 62 is a serpentine heat exchange copper tube with heat dissipation fins on the outer wall. The hot air exchanges heat with the cold water flowing inside the copper tube. The water in the water storage tank 61 flows into the heat exchange copper tube through the first water supply pipe 66. After absorbing the heat of the hot air, it flows into the cooling water tank 64 through the second return water pipe 67 for cooling. The cooled water then flows back to the water storage tank 61, completing the water circulation. The cooled hot air is finally discharged through the second exhaust outlet 32 ​​at the upper end of the exhaust box 3. The louvers at the second exhaust outlet 32 ​​open under the action of airflow to overcome the spring force of the torsion spring, ensuring that the hot air is discharged smoothly. When the fan is turned off, the torsion spring resets and drives the louvers to close, preventing external dust from flowing back into the casing.

[0046] The condensate collected by the drip tray 273 flows into the water storage tank 61 through the first return water pipe 65, realizing the recycling of condensate and replenishing the water circulation source of the heat dissipation device; the cooling water tank 64 always provides a low-temperature water source to the water storage tank 61, ensuring the evaporative heat dissipation efficiency of the porous evaporative cold wall 63 and the heat exchange efficiency of the heat exchange copper tube, forming a closed-loop working system of air purification, temperature and humidity regulation, heat recovery and water circulation, providing continuous and stable heat dissipation guarantee for the high-performance host of the digital entertainment space.

[0047] The control method of this invention is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art. The power supply is also common knowledge in the art. Furthermore, since this invention is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail here.

[0048] Although this disclosure has been described in detail with reference to exemplary embodiments, it is not limited thereto, and it will be apparent to those skilled in the art that various modifications and changes may be made thereto without departing from the scope of this disclosure.

Claims

1. A high-performance host for digital entertainment spaces, comprising a chassis and core computer components disposed within the chassis; Its features are, The chassis includes a main body (1), an air inlet box (2) located at the lower end of the main body (1), and an exhaust box (3) located at the upper end of the main body (1). The air inlet box (2) and the exhaust box (3) are respectively connected to the inner cavity of the main body (1). The air inlet box (2) has a first air inlet (21) on one side, and a fan is fixedly installed at the first air inlet (21). A primary filter screen is also fixedly installed on the outside of the fan. The air inlet box (2) has a first exhaust port (22) at the upper end facing the main box (1). The air inlet box (2) has a first ventilation duct (23) and a second ventilation duct (24). The first ventilation duct (23) is connected to the first air inlet (21) and the first exhaust port (22) at both ends, and a dust cleaning component (26) is installed on the first ventilation duct (23). The second ventilation duct (24) is connected in parallel with the first ventilation duct (23), with one end connected to the first ventilation duct (23) and the other end connected to the first exhaust port (22). A dehumidification and cooling component (27) is installed on the second ventilation duct (24). An electromagnetic reversing valve (25) is installed at the connection between the first ventilation duct (23) and the second ventilation duct (24). The chassis is equipped with a temperature sensor (5) and a humidity sensor (4). The temperature sensor (5) and the humidity sensor (4) are electrically connected to the electromagnetic reversing valve (25). When the temperature sensor (5) detects that the temperature is greater than the preset temperature threshold or the humidity sensor (4) detects that the humidity is greater than the preset humidity threshold, the electromagnetic reversing valve (25) controls the airflow to flow only through the second ventilation duct (24). The exhaust box (3) has a second air inlet (31) at the lower end facing the main box (1), and a second exhaust outlet (32) at the upper end of the exhaust box (3). A fan is fixedly installed at the second exhaust outlet (32), and a one-way exhaust structure is provided at the upper end of the fan. The chassis is also equipped with a high-efficiency heat dissipation device (6) for dissipating heat from the heat dissipation end of the dehumidification cooling component (27) and cooling the hot air discharged from the exhaust box (3).

2. The high-performance host for digital entertainment spaces according to claim 1, characterized in that, The dust cleaning assembly (26) includes a fine-mesh dust filter (261) fixed in the first ventilation duct (23), a cleaning device disposed on the side of the fine-mesh dust filter (261) near the first air inlet (21), and a dust collection box (265) disposed below the fine-mesh dust filter (261); the cleaning device includes a cleaning roller brush (262), a driving device (263) for driving the cleaning roller brush (262) to reciprocate along the surface of the fine-mesh dust filter (261), and a driving motor (264) for driving the cleaning roller brush (262) to rotate; the driving device (263) is a screw-slider mechanism, the slider of the screw-slider mechanism is fixedly connected to the driving motor (264), and the output shaft of the driving motor (264) is coaxially fixed with the cleaning roller brush (262).

3. A high-performance host for digital entertainment spaces according to claim 1, characterized in that, The dehumidification and cooling assembly (27) includes several semiconductor cooling chips (271), cooling fins (272) fixed in the second ventilation duct (24), and a water collection tray (273) located below the cooling fins (272); the cooling fins (272) and the cold ends of the semiconductor cooling chips (271) are bonded together by thermally conductive silicone; the water collection tray (273) is used to collect the condensate on the surface of the cooling fins (272), and the bottom wall of the water collection tray (273) is inclined.

4. A high-performance host for digital entertainment spaces according to claim 2, characterized in that, The fine-pore dust filter (261) has an auxiliary cleaning component (266) at its upper end near the first air inlet (21). The auxiliary cleaning component (266) is a water spray pipe with several nozzles facing the mesh surface of the fine-pore dust filter (261).

5. A high-performance host for digital entertainment spaces according to claim 1, characterized in that, The unidirectional exhaust structure is a louvered slat hinged to the second exhaust port (32) of the exhaust box (3). A torsion spring is sleeved on the hinge shaft of the louvered slat. One end of the torsion spring is fixed to the louvered slat, and the other end is fixed to the inner wall of the exhaust box (3).

6. A high-performance host for digital entertainment spaces according to claim 2, characterized in that, An installation port is provided on the side wall of the air inlet box (2), and the dust collection box (265) is inserted into the air inlet box (2) through the installation port. A handle is provided on the outside of the dust collection box (265).

7. A high-performance host for digital entertainment spaces according to claim 1, characterized in that, The high-efficiency heat dissipation device (6) includes a water storage tank (61), a cooling component (62), a porous evaporative cold wall (63), and a cooling water tank (64); the water storage tank (61) is located on one side of the dehumidification cooling component (27), the cooling component (62) is located between the second air inlet (31) and the second air outlet (32) of the exhaust box (3), the porous evaporative cold wall (63) is attached to the hot end of the semiconductor cooling chip (271) of the dehumidification cooling component (27), and the cooling water tank (64) is located on one side of the water storage tank (61); The water storage tank (61) is connected to the water receiving tray (273) of the dehumidification cooling component (27) through the first return water pipe (65); the water inlet of the cooling component (62) is connected to the water storage tank (61) through the first water supply pipe (66), and the water outlet of the cooling component (62) is connected to the cooling water tank (64) through the second return water pipe (67); the water inlet of the porous evaporative cold wall (63) is connected to the water storage tank (61) through the second water supply pipe (68), and the water outlet of the porous evaporative cold wall (63) is connected to the cooling water tank (64) through the third return water pipe (69); the cooling water tank (64) is connected to the water storage tank (61) through the fourth return water pipe (610). A water pump is installed on the first water supply pipe (66) to drive the water in the water storage tank (61) to circulate along the path of "water storage tank (61) - cooling component (62) - cooling water tank (64) - water storage tank (61)"; another water pump is connected in series on the second water supply pipe (68) to drive the water in the water storage tank (61) to circulate along the path of "water storage tank (61) - porous evaporative cold wall (63) - cooling water tank (64) - water storage tank (61)".

8. A high-performance host for digital entertainment spaces according to claim 7, characterized in that, The cooling component (62) is a serpentine coiled heat exchange copper tube. Several heat dissipation fins are integrally formed on the outer wall of the heat exchange copper tube, and the heat dissipation fins are distributed at intervals along the length of the heat exchange copper tube.

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