High-precision IC die bonder and die bonding method thereof

Abstract

The invention relates to the technical field of die bonders, in particular to a high-precision IC die bonder and a die bonding method thereof.The high-precision IC die bonder comprises a die bonder body, a die bonding swing arm mechanism installed on the die bonder body, a suction nozzle installed on the die bonding swing arm mechanism, a dispensing mechanism installed on the die bonder body and a conveying table, and the conveying table is installed on the die bonder body; the supporting frame is arranged on the conveying table for conveying the substrate, the alignment mechanism is arranged on the supporting frame, the pushing mechanism is arranged at the die bonding swing arm mechanism, the pushing mechanism is matched with the alignment mechanism, and when a chip is placed at a die bonding position on the substrate at a suction nozzle of the die bonding swing arm mechanism, the alignment mechanism is matched with the die bonding swing arm mechanism. According to the technical scheme of the utility model, the chip can be positioned and pressed in an auxiliary manner, the non-parallel state of the chip when the chip is adhered to the substrate can be prevented, the die bonding precision can be further ensured, and the problems of non-uniform bonding strength, poor electrical contact or reduced optical performance of the chip can be effectively solved at the same time.

Description

Technical Field

[0001] This invention relates to the field of die bonder technology, specifically to a high-precision IC die bonder and its die bonding method. Background Technology

[0002] IC die bonders are key equipment in the semiconductor packaging process. Their core function is to precisely pick up the diced chips from the wafer and attach them to designated positions on a substrate (such as lead frames, PCBs, etc.). Mechanical fixation and electrical connection between the chip and the substrate are achieved through processes such as silver paste, eutectic bonding, or flip-chip bonding. This step directly affects the yield, performance, and reliability of chip packaging.

[0003] Existing IC die bonders often suffer from slight tilting of the contact surface between the nozzle and the chip during the die bonding process due to the small surface area and thinness of the chip. This causes the chip to deviate from its parallel state when picked up. Furthermore, as the positioning error of the die bonder's motion axes (such as X / Y / Z / θ axes) accumulates, the chip is not parallel to the substrate when placed, which further leads to uneven chip bonding strength, poor electrical contact, or degraded optical performance. To address these issues, we propose a high-precision IC die bonder and its die bonding method. Summary of the Invention

[0004] The purpose of this invention is to provide a high-precision IC die bonder and its die bonding method to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-precision IC die bonder, comprising a die bonder body, a die bonder arm mechanism mounted on the die bonder body, a nozzle mounted on the die bonder arm mechanism, a dispensing mechanism mounted on the die bonder body, and a transfer table. The transfer table is mounted on the die bonder body and is used to transfer substrates. A support frame is provided on the outside of the transfer table, and a lifting mechanism for connecting the support frame is mounted on the die bonder body.

[0006] The conveyor is provided with a first moving block and a second moving block above it, and the support frame is provided with a moving part for driving the first moving block and the second moving block.

[0007] An alignment mechanism is provided between the first moving block and the second moving block. A pushing mechanism is provided at the bottom of the die bonding arm mechanism and outside the nozzle. The pushing mechanism and the alignment mechanism cooperate with each other to stick the chip to the substrate in a parallel state.

[0008] Furthermore, the lifting mechanism includes an electric push rod, which is fixedly mounted on the die bonder body, and the output end of the electric push rod is fixedly connected to a support frame, which is U-shaped.

[0009] Furthermore, the alignment mechanism includes an air guide frame, an alignment shell, an alignment component, and an air guide component. The air guide frame is fixedly installed on the top between the first moving block and the second moving block, and the air guide frame is U-shaped.

[0010] The alignment shell is provided in four parts, and all four alignment shells are fixedly installed at the bottom of the air guide frame, and the four alignment shells are located around the chip.

[0011] The alignment components are mounted on the alignment shell, and multiple alignment components align the adhered chips with each other.

[0012] The air guide component is disposed between the four alignment shells and the air guide frame.

[0013] Furthermore, the alignment component includes a movable inclined block, a pushing component, a connecting component, a pushing block, a contact sliding sleeve, and a pressing component. The alignment shell has a hollow cavity inside, and a pushing port is provided on the side of the alignment shell near the chip. The movable inclined block is slidably connected to the hollow cavity. The pushing component is disposed on the alignment shell, and the pushing block pushes the movable inclined block through a pushing mechanism.

[0014] The connector is located at the top of one end of the movable inclined block and is connected to the alignment shell. The push block slides through the push port and is fixedly connected to the movable inclined block. The contact sleeve is located outside the push port and is slidably sleeved on the outside of the push block. A buffer is provided between the contact sleeve and the push block.

[0015] The pressing component is mounted on the moving inclined block, and through the alignment component, it can adjust the chip.

[0016] Furthermore, the pushing component includes a contact inclined block, a pushing rod, a pushing plate, and a pushing spring. The contact inclined block is located inside the alignment shell. Multiple pushing rods are provided, and each pushing rod slides through the top of the alignment shell. One end of each pushing rod is fixedly connected to the contact inclined block, and the other end of each pushing rod is fixedly connected to the pushing plate. The pushing spring is sleeved on the outside of the pushing rod, and both ends of the pushing spring are fixedly connected to the pushing plate and the alignment shell, respectively. Through the provided pushing component, the moving inclined block is pushed.

[0017] Furthermore, the pushing mechanism includes a fixed frame and a lower pressure plate. The fixed frame is fixedly installed on the die bonding swing arm mechanism and is located above the suction nozzle. There are four lower pressure plates, all of which are fixedly installed on the fixed frame. The lower pressure plates are used to press down and push the pushing plate. Through the provided pushing mechanism, the function of pressing down and pushing the four pushing plates simultaneously can be achieved.

[0018] Furthermore, the connecting component includes an extension plate and a connecting spring. The extension plate is fixedly installed at one end of the movable inclined block, and the positioning shell has a moving opening at the position corresponding to the extension plate. The extension plate slides through the moving opening. Multiple connecting springs are provided. One end of the multiple connecting springs is fixedly connected to the positioning shell, and the other end of the multiple connecting springs is fixedly connected to the extension plate. Through the provided connecting component, the function of connecting the movable inclined block is realized.

[0019] Furthermore, the pressing component includes a pressing block, which is fixedly installed on one side of the movable inclined block and slides through the pushing port. The pressing block has a pushing inclined surface on the side near the chip. Through the provided pressing component, the chip is pressed vertically downward.

[0020] Furthermore, the movable inclined block has an air inlet chamber inside, and the pushing block has an air outlet chamber inside, and the bottom of the contact sliding sleeve has an air outlet oblique opening;

[0021] The air guide component includes air guide pipes located at the four corners of the bottom of the air guide frame. A first telescopic pipe is connected to the air guide pipe, and one end of the first telescopic pipe is connected to the air inlet chamber.

[0022] The second movable block has a through hole inside, and both ends of the through hole are connected to a second telescopic tube. The second movable block is also connected to an air supply pipe, which is connected to an air guide frame. One end of the second telescopic tube is connected to a fixed pipe, which passes through one side of the support frame. The other end of the fixed pipe is connected to an external cooling gas supply device. Through the provided air guide, the cooling speed of the adhesive and the chip can be accelerated while the die is being bonded, thereby ensuring stable bonding of the chip.

[0023] A die bonding method for a high-precision IC die bonder includes the following steps:

[0024] Step 1: The substrate is transported by the conveyor and first passes through the dispensing mechanism, which automatically identifies the dispensing position of the substrate and dispenses the adhesive.

[0025] Step 2: After dispensing, the substrate is transported to the die bonding arm mechanism via a conveyor. The die bonding arm mechanism then picks up the chip through a nozzle. While picking up the chip, the alignment mechanism moves to the die bonding position above the substrate.

[0026] Step 3: Subsequently, the die bonding arm mechanism uses a suction nozzle to vertically place the chip at the die bonding position on the substrate. While placing the chip vertically, the pushing mechanism works in conjunction with the alignment mechanism to ensure that the chip adheres stably and quickly to the substrate.

[0027] This invention has at least the following beneficial effects:

[0028] 1. When this invention is used, a support frame is provided on the conveyor table for conveying the substrate, and the support frame is provided with an alignment mechanism. At the same time, a pushing mechanism is provided at the die bonding arm mechanism. The pushing mechanism cooperates with the alignment mechanism to place the chip on the die bonding position on the substrate at the suction nozzle of the die bonding arm mechanism. At the same time, it can realize the positioning and assist in pressing down the chip, prevent the chip from being non-parallel when it is stuck to the substrate, further ensure the die bonding accuracy, and effectively solve the problems of uneven chip bonding strength, poor electrical contact or decreased optical performance.

[0029] 2. The present invention, through the provided air guide, can accelerate the curing speed of the adhesive and chip on the substrate while performing die bonding, thereby ensuring stable die bonding of the chip. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 This is a side view of the overall structure of the present invention;

[0032] Figure 3 This is a top view of the die bonder body of the present invention;

[0033] Figure 4 This is a schematic diagram of the conveyor structure of the present invention;

[0034] Figure 5 This is a schematic diagram of the support frame structure of the present invention;

[0035] Figure 6 For the present invention Figure 5 Enlarged structural diagram of region A in the middle;

[0036] Figure 7 This is a schematic diagram of the electric actuator structure of the present invention;

[0037] Figure 8 For the present invention Figure 7 Enlarged structural diagram of region B in the middle;

[0038] Figure 9 This is a schematic diagram of the moving part structure of the present invention;

[0039] Figure 10 This is a schematic diagram of the air guide frame structure of the present invention;

[0040] Figure 11 This is a side view of the lower pressure block structure of the present invention;

[0041] Figure 12 This is a side sectional view of the alignment shell structure of the present invention;

[0042] Figure 13This is a schematic diagram of the push block structure of the present invention;

[0043] Figure 14 This is a schematic diagram of the contact sleeve structure of the present invention.

[0044] In the diagram: 1-Die bonding machine body; 2-Die bonding swing arm mechanism; 21-Nozzle; 3-Dispensing mechanism; 4-Transfer table; 41-First moving block; 42-Second moving block; 43-Insulation shell; 431-Heating coil; 432-Connecting plate; 5-Support frame; 6-Lifting mechanism; 61-Electric push rod; 7-Moving component; 8-Alignment mechanism; 81-Air guide frame; 82-Alignment shell; 83-Alignment component; 831-Moving inclined block; 8311-Air inlet cavity; 832-Pushing component; 8321-Contact inclined block; 8322-Push rod; 8323-Push plate; 8324 - Push spring; 833 - Connector; 8331 - Extension plate; 8332 - Connecting spring; 834 - Push block; 8341 - Air outlet chamber; 835 - Contact sleeve; 8351 - Air outlet slant; 836 - Pressing component; 8361 - Pressing block; 8362 - Pushing slant; 837 - Buffer component; 8371 - Buffer spring; 84 - Air guide component; 841 - Air guide pipe; 842 - First telescopic pipe; 843 - Second telescopic pipe; 844 - Air supply pipe; 845 - Fixed pipe; 9 - Pushing mechanism; 91 - Fixed frame; 92 - Pressing plate. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] Example 1

[0047] Please see Figures 1 to 3 A high-precision IC die bonder includes a die bonder body 1, a die bonder arm mechanism 2 mounted on the die bonder body 1, a suction nozzle 21 mounted on the die bonder arm mechanism 2, a dispensing mechanism 3 mounted on the die bonder body 1, and a transfer table 4. The transfer table 4 is mounted on the die bonder body 1 and is used to transfer substrates. In this embodiment, the transfer table 4 is an existing transfer table 4, which transfers the substrates via a conveyor belt. At the same time, the transfer table 4 is provided with guide grooves to clamp and guide the substrates while they are being transferred, ensuring the stability of the substrate transfer.

[0048] Please see Figures 4 to 5 A support frame 5 is provided on the outside of the conveyor table 4, and a lifting mechanism 6 for connecting the support frame 5 is installed on the die bonder body 1.

[0049] The lifting mechanism 6 includes an electric push rod 61, which is fixedly installed on the die bonder body 1, and the output end of the electric push rod 61 is fixedly connected to the support frame 5, which is U-shaped.

[0050] In this application, a lifting mechanism 6 is provided. That is, when the substrate is conveyed along with the conveyor table 4, the electric push rod 61 is operated, causing the support frame 5 to move upward relative to the conveyor table 4. So when the next row of glue dispensing position or fixed position on the substrate is adjusted, the alignment mechanism 8 on the support frame 5 does not affect the movement of the substrate.

[0051] A first moving block 41 and a second moving block 42 are provided above the conveyor 4, and a moving part 7 for driving the first moving block 41 and the second moving block 42 is provided on the support frame 5.

[0052] As a supplementary explanation, the moving part 7 includes a moving lead screw, a drive motor and a guide plate. The moving lead screw is located above the conveyor table 4 and its two ends are rotatably connected to the support frame 5. The first moving block 41 is threaded onto the outside of the moving lead screw. The drive motor is fixedly installed on one side of the support frame 5 and is used to drive the moving lead screw.

[0053] The guide plate is fixedly installed on the support frame 5. The second moving block 42 is provided with a sliding opening at the position corresponding to the guide plate, and the second moving block 42 is slidably sleeved on the outside of the guide plate through the sliding opening.

[0054] Therefore, when the first moving block 41 and the second moving block 42 are driven synchronously, the moving screw is rotated by the forward and reverse operation of the drive motor. When the moving screw rotates, it provides driving force to the first moving block 41. Under the limiting action of the alignment mechanism 8 and the second moving block 42 and the guide plate, the first moving block 41 and the second moving block 42 move laterally and reciprocally relative to the top of the substrate.

[0055] Please see Figures 5 to 14 An alignment mechanism 8 is provided between the first moving block 41 and the second moving block 42. A pushing mechanism 9 is provided at the bottom of the die bonding arm mechanism 2 and outside the nozzle 21. The pushing mechanism 9 cooperates with the alignment mechanism 8 to stick the chip to the substrate in a parallel state.

[0056] The alignment mechanism 8 includes an air guide frame 81, an alignment shell 82, an alignment member 83, and an air guide member 84. The air guide frame 81 is fixedly installed on the top between the first moving block 41 and the second moving block 42, and the air guide frame 81 is in the shape of a loop.

[0057] There are four alignment shells 82, all of which are fixedly installed at the bottom of the air guide frame 81 and are located around the chip.

[0058] Alignment components 83 are mounted on alignment shell 82, and multiple alignment components 83 align the adhered chips with each other.

[0059] The air guide 84 is disposed between the four alignment shells 82 and the air guide frame 81.

[0060] The alignment component 83 includes a movable inclined block 831, a pushing component 832, a connecting component 833, a pushing block 834, a contact sliding sleeve 835, and a pressing component 836. The alignment shell 82 has a hollow cavity inside, and a pushing port is provided on the side of the alignment shell 82 near the chip. The movable inclined block 831 is slidably connected to the hollow cavity. The pushing component 832 is disposed on the alignment shell 82, and the pushing block 834 pushes the movable inclined block 831 through the pushing mechanism 9.

[0061] A connector 833 is located at the top of one end of the movable inclined block 831 and is connected to the alignment shell 82. The pushing block 834 slides through the pushing port and is fixedly connected to the movable inclined block 831. The contact sleeve 835 is located outside the pushing port and is slidably sleeved on the outside of the pushing block 834. A buffer 837 is provided between the contact sleeve 835 and the pushing block 834. As a supplementary explanation, the buffer 837 includes a buffer spring 8371. Multiple buffer springs 8371 are provided. One end of the multiple buffer springs 8371 is fixedly connected to the pushing block 834, and the other end of the multiple buffer springs 8371 is engaged with the contact sleeve 835. In this embodiment, the buffer springs are made of rubber material. The contact sleeve 835 is slidably sleeved on the outside of the pushing block 834, which enables the contact sleeve 835 and the pushing block 834 to maintain a relatively sealed state.

[0062] The pressing component 836 is mounted on the moving inclined block 831.

[0063] Please see Figures 11 to 12 The pusher 832 includes a contact inclined block 8321, a push rod 8322, a push plate 8323, and a push spring 8324. The contact inclined block 8321 is located inside the alignment shell 82. Multiple push rods 8322 are provided, and all push rods 8322 slide through the top of the alignment shell 82. One end of the multiple push rods 8322 is fixedly connected to the contact inclined block 8321, and the other end of the multiple push rods 8322 is fixedly connected to the push plate 8323. The push spring 8324 is sleeved on the outside of the push rod 8322, and both ends of the push spring 8324 are fixedly connected to the push plate 8323 and the alignment shell 82, respectively.

[0064] The pushing mechanism 9 includes a fixed frame 91 and a lower pressure plate 92. The fixed frame 91 is fixedly installed on the die bonding swing arm mechanism 2 and is located above the suction nozzle 21. There are four lower pressure plates 92, all of which are fixedly installed on the fixed frame 91. The lower pressure plates 92 are used to press down and push the pushing plate 8323.

[0065] The connector 833 includes an extension plate 8331 and a connecting spring 8332. The extension plate 8331 is fixedly installed at one end of the movable inclined block 831, and the alignment shell 82 is provided with a moving opening corresponding to the position of the extension plate 8331. The extension plate 8331 slides through the moving opening. Multiple connecting springs 8332 are provided. One end of the multiple connecting springs 8332 is fixedly connected to the alignment shell 82, and the other end of the multiple connecting springs 8332 is fixedly connected to the extension plate 8331.

[0066] The pressing component 836 includes a pressing block 8361, which is fixedly installed on one side of the movable inclined block 831. The pressing block 8361 slides through the push port, and the pressing block 8361 has a push inclined surface 8362 on the side of the pressing block 8361 near the chip.

[0067] Specific implementation process: After the die-bonding arm mechanism 2 picks up the chip through the suction nozzle 21, one end of the fixed arm mechanism moves to directly above the die-bonding position of the substrate. Then, the die-bonding arm mechanism 2 presses down vertically. First, the four pressing plates 92 at the fixed frame 91 contact the four pushing plates 8323 respectively and press the pushing plates 8323 down vertically. When the pushing plates 8323 push, the pushing rod 8322 pushes the contact inclined block 8321. When the contact inclined block 8321 moves down, it pushes the moving inclined block 831. When the chip moves vertically down to contact the four... When the chip is at the same plane position as the contact sleeve 835, as the moving inclined block 831 moves, the four contact sleeves 835 move towards each other and clamp and position the chip. As the nozzle 21 continues to move downward, the chip is adhered along the die bonding position. At the same time, the moving inclined block 831 continues to move, and while the contact sleeve 835 clamps the outside of the chip, the pushing block 834 moves at the position corresponding to the contact sleeve 835. At the same time, the four pressing blocks 8361 contact the top of the chip and push the chip vertically downward, so that the chip is detached from the nozzle 21 and the chip is quickly and stably adhered to the die bonding position.

[0068] The movable inclined block 831 has an air inlet chamber 8311 inside, and the push block 834 has an air outlet chamber 8341 inside. The bottom of the contact sleeve 835 has an air outlet inclined port 8351.

[0069] The air guide component 84 includes an air guide pipe 841 located at the four corners of the bottom of the air guide frame 81. A first telescopic pipe 842 is connected to the air guide pipe 841, and one end of the first telescopic pipe 842 is connected to the air inlet chamber 8311.

[0070] The second movable block 42 has a through hole inside, and both ends of the through hole are connected to a second telescopic tube 843. The second movable block 42 is also connected to an air supply pipe 844, which is connected to the air guide frame 81. The other end of one of the second telescopic tubes 843 is connected to a fixed pipe 845, which passes through one side of the support frame 5. The other end of the fixed pipe 845 is connected to an external cooling gas supply device. At the same time, a solenoid valve is also provided on the fixed pipe 845. In this embodiment, the external cooling gas supply device is an existing mechanism, such as a micro vapor compression refrigeration system or a micro semiconductor refrigeration system, which will not be described in detail.

[0071] Specific implementation process: When the four pressing blocks 8361 contact the upper surface of the chip and press down to bond the chip, the solenoid valve on the fixing tube 845 opens, and the cooling gas enters the through hole through the second telescopic tube 843. Then, it enters the air guide frame 81 through the air supply pipe 844 and enters the four air guide pipes 841 through the air guide frame 81. Subsequently, the cooling gas is sprayed through the air inlet chamber 8311 and the air outlet chamber 8341 and finally through the air outlet oblique port 8351 to the bottom of the chip bonded with adhesive, thereby accelerating the curing of adhesive and enabling the chip to be quickly and stably connected to the substrate. Then, the suction nozzle 21 moves vertically upward, and the next chip is picked up and rebonded by the die bonding swing arm mechanism 2.

[0072] A die bonding method for a high-precision IC die bonder includes the following steps:

[0073] Step 1: The substrate is transported by the conveyor 4 and then passes through the dispensing mechanism 3. The dispensing mechanism 3 automatically identifies the dispensing position of the substrate and dispenses the adhesive.

[0074] Step 2: After dispensing, the substrate is transported to the die bonding arm mechanism 2 via the conveyor 4. The die bonding arm mechanism 2 then picks up the chip via the nozzle 21. While picking up the chip, the alignment mechanism 8 moves to the die bonding position above the substrate.

[0075] Step 3: Subsequently, the die bonding arm mechanism 2 uses the suction nozzle 21 to vertically place the chip at the die bonding position on the substrate. While placing the chip vertically, the pushing mechanism 9 cooperates with the alignment mechanism 8 to ensure that the chip is stably and quickly bonded to the substrate.

[0076] Example 2

[0077] Please see Figures 7 to 8Example 2 is a further supplement to Example 1. Specifically, multiple heat-insulating shells 43 are provided above the conveyor table 4. The heat-insulating shells 43 are positioned with their openings facing downwards above the base. Each heat-insulating shell 43 is equipped with a heating coil 431 inside. The shape of the heating coil 431 corresponds to the shape of the adhesive distributed on the substrate. The multiple heat-insulating shells 43 are fixedly connected to each other by connecting plates 432. One end of the two connecting plates 432 near the two sides of the conveyor table 4 is fixedly connected to the support frame 5.

[0078] In this configuration, the substrate with the applied adhesive moves along the conveyor 4 and first moves to the area under multiple heat-insulating shells 43. The heating coils 431 at the heat-insulating shells 43 correspond to the shape of the adhesive, thereby keeping the adhesive warm and preventing it from curing. This also facilitates stable bonding between the subsequent chip and the adhesive.

[0079] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0080] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision IC die bonder, comprising a die bonder body (1), a die bonder arm mechanism (2) mounted on the die bonder body (1), a nozzle (21) mounted on the die bonder arm mechanism (2), a dispensing mechanism (3) mounted on the die bonder body (1), and a transfer table (4), wherein the transfer table (4) is mounted on the die bonder body (1) and is used to transfer substrates, characterized in that: The outer side of the conveyor (4) is provided with a support frame (5), and the die bonder body (1) is equipped with a lifting mechanism (6) for connecting the support frame (5). The conveyor (4) is provided with a first moving block (41) and a second moving block (42) above it, and the support frame (5) is provided with a moving part (7) for driving the first moving block (41) and the second moving block (42). An alignment mechanism (8) is provided between the first moving block (41) and the second moving block (42). A pushing mechanism (9) is provided at the bottom of the die-bonding arm mechanism (2) and outside the nozzle (21). The pushing mechanism (9) cooperates with the alignment mechanism (8) to stick the chip in a parallel state onto the substrate.

2. The high-precision IC die bonder according to claim 1, characterized in that: The lifting mechanism (6) includes an electric push rod (61), which is fixedly installed on the die bonder body (1), and the output end of the electric push rod (61) is fixedly connected to the support frame (5), which is U-shaped.

3. The high-precision IC die bonder according to claim 1, characterized in that: The alignment mechanism (8) includes an air guide frame (81), an alignment shell (82), an alignment component (83), and an air guide component (84). The air guide frame (81) is fixedly installed on the top between the first moving block (41) and the second moving block (42), and the air guide frame (81) is in the shape of a loop. The alignment shell (82) is provided in four parts. All four alignment shells (82) are fixedly installed at the bottom of the air guide frame (81), and the four alignment shells (82) are located around the chip. The alignment member (83) is mounted on the alignment shell (82), and multiple alignment members (83) align the adhered chips with each other; The air guide (84) is disposed between the four alignment shells (82) and the air guide frame (81).

4. A high-precision IC die bonder according to claim 3, characterized in that: The alignment component (83) includes a movable inclined block (831), a pusher (832), a connector (833), a pusher block (834), a contact sleeve (835), and a pressing component (836). The alignment shell (82) has a hollow cavity inside, and a push port is provided on the side of the alignment shell (82) near the chip. The movable inclined block (831) is slidably connected to the hollow cavity. The pusher block (832) is disposed on the alignment shell (82), and the pusher block (834) pushes the movable inclined block (831) through the pusher mechanism (9). The connector (833) is located at the top of one end of the movable inclined block (831) and is connected to the alignment shell (82). The push block (834) slides through the push port and is fixedly connected to the movable inclined block (831). The contact sleeve (835) is located outside the push port and is slidably sleeved on the outside of the push block (834). A buffer (837) is provided between the contact sleeve (835) and the push block (834). The pressing member (836) is mounted on the moving inclined block (831).

5. A high-precision IC die bonder according to claim 4, characterized in that: The pusher (832) includes a contact wedge (8321), a push rod (8322), a push plate (8323), and a push spring (8324). The contact wedge (8321) is located inside the alignment shell (82). There are multiple push rods (8322), and all of the push rods (8322) slide through the top of the alignment shell (82). One end of each push rod (8322) is fixedly connected to the contact wedge (8321), and the other end of each push rod (8322) is fixedly connected to the push plate (8323). The push spring (8324) is sleeved on the outside of the push rod (8322), and both ends of the push spring (8324) are fixedly connected to the push plate (8323) and the alignment shell (82), respectively.

6. A high-precision IC die bonder according to claim 5, characterized in that: The pushing mechanism (9) includes a fixed frame (91) and a lower pressure plate (92). The fixed frame (91) is fixedly installed on the die bonding swing arm mechanism (2) and is located above the suction nozzle (21). There are four lower pressure plates (92), and all four lower pressure plates (92) are fixedly installed on the fixed frame (91). The lower pressure plates (92) are used to press down and push the pushing plate (8323).

7. A high-precision IC die bonder according to claim 4, characterized in that: The connector (833) includes an extension plate (8331) and a connecting spring (8332). The extension plate (8331) is fixedly installed at one end of the movable inclined block (831), and the alignment shell (82) is provided with a moving opening corresponding to the position of the extension plate (8331). The extension plate (8331) slides through the moving opening. There are multiple connecting springs (8332). One end of the multiple connecting springs (8332) is fixedly connected to the alignment shell (82), and the other end of the multiple connecting springs (8332) is fixedly connected to the extension plate (8331).

8. A high-precision IC die bonder according to claim 7, characterized in that: The pressing component (836) includes a pressing block (8361), which is fixedly installed on one side of the movable inclined block (831) and slides through the pushing port. The pressing block (8361) has a pushing inclined surface (8362) on the side of the pressing block (8361) near the chip.

9. A high-precision IC die bonder according to claim 8, characterized in that: The movable inclined block (831) is provided with an air inlet chamber (8311) and the push block (834) is provided with an air outlet chamber (8341). The bottom of the contact sleeve (835) is provided with an air outlet inclined port (8351). The air guide (84) includes an air guide pipe (841) located at the four corners of the bottom of the air guide frame (81), and a first telescopic pipe (842) is connected to the air guide pipe (841), and one end of the first telescopic pipe (842) is connected to the air inlet chamber (8311). The second movable block (42) has a through hole inside, and both ends of the through hole are connected to a second telescopic pipe (843). The second movable block (42) is also connected to an air supply pipe (844), and the air supply pipe (844) is connected to the air guide frame (81). The other end of one of the second telescopic pipes (843) is connected to a fixed pipe (845), and the fixed pipe (845) passes through one side of the support frame (5). The other end of the fixed pipe (845) is connected to an external cooling gas supply device.

10. A die bonding method for a die bonder according to any one of claims 1-9, characterized in that, Includes the following steps: Step 1: The substrate is transported by the conveyor (4), and then first passes through the dispensing mechanism (3). The dispensing mechanism (3) automatically identifies the dispensing position of the substrate and dispenses the adhesive. Step 2: After dispensing, the substrate is transported to the die bonding arm mechanism (2) via the conveyor (4). The die bonding arm mechanism (2) picks up the chip through the nozzle (21). While picking up the chip, the alignment mechanism (8) moves to the die bonding position above the substrate. Step 3: Subsequently, the die bonding arm mechanism (2) uses the suction nozzle (21) to vertically place the chip at the die bonding position on the substrate. While placing the chip vertically, the pushing mechanism (9) and the alignment mechanism (8) work together to make the chip adhere to the substrate stably and quickly.

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