Plasma radiator and radiating method

Abstract

The invention provides a plasma radiator and a radiating method, and the radiator comprises a plurality of heat sink fins which are distributed in a first direction at intervals, and the first direction is perpendicular to the extension direction of the heat sink fins; a vibration electrode film is arranged between any two adjacent heat sink fins, the vibration electrode film comprises a first substrate layer, an insulating layer, a driving layer, a piezoelectric layer and a second substrate layer which are sequentially stacked in the first direction, and the first substrate layer and the second substrate layer are grounded; the circuit module comprises a plurality of first output ends and a plurality of second output ends, the circuit module is used for outputting an alternating current voltage signal to the driving layer of the vibration electrode film so as to drive the piezoelectric layer to drive the vibration electrode film to flap, and the circuit module is used for outputting a first voltage signal to the heat sink fin so as to drive the heat sink fin to flap. Therefore, the plasma radiator can realize stable and effective heat radiation with a small area.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a plasma heat sink and heat dissipation method. Background Technology

[0002] As the functionality of signal processing devices, represented by integrated circuit chips, continues to improve, their power density is increasing, and heat dissipation has become a major obstacle restricting the further development of integrated circuit chips. At the same time, as existing technologies demand increasingly higher integration levels for integrated circuit chips, the area of ​​these chips needs to be further reduced. However, to achieve a smaller chip size while effectively dissipating heat, current technologies require increasing the density of heat sink fins on the heatsink. This causes airflow stagnation, resulting in low and unstable heat dissipation efficiency.

[0003] Therefore, how to enable plasma radiators to achieve stable and effective heat dissipation with a small area has become a technical problem that urgently needs to be solved by existing technologies. Summary of the Invention

[0004] The technical problem solved by the present invention is to provide a plasma heat sink and a heat dissipation method, wherein the plasma heat sink achieves stable and effective heat dissipation with a small area.

[0005] According to a first aspect of the present invention, the technical solution of the present invention provides a plasma heat sink, comprising: First base; A plurality of heat sink fins are spaced apart in a first direction, the first direction being perpendicular to the extension direction of the heat sink fins, and the plurality of heat sink fins being perpendicular to the first substrate and fixed to one side of the first substrate. A plurality of vibrating electrode films are provided, wherein the vibrating electrode films and the heat sink fins are located on the same side relative to the first substrate, and one vibrating electrode film is provided between any two adjacent heat sink fins. Adjacent vibrating electrode films are spaced apart from the heat sink fins. The vibrating electrode films include a first substrate layer, an insulating layer, a driving layer, a piezoelectric layer and a second substrate layer stacked sequentially along a first direction. The first substrate layer and the second substrate layer are grounded. The circuit module includes a plurality of first output terminals corresponding to a plurality of heat sink fins and a plurality of second output terminals corresponding to a vibrating electrode. The first output terminals are coupled to the heat sink fins, and the second output terminals are coupled to the driving layer. The circuit module is used to output an AC voltage signal to the driving layer of the vibrating electrode film to drive the piezoelectric layer to fan the vibrating electrode film. The circuit module is also used to output a first voltage signal to the heat sink fins to form an electric field between adjacent vibrating electrode films and heat sink fins.

[0006] Optionally, the plasma radiator further includes: A plurality of first support structures are provided, the first support structures being located between the first substrate and the vibrating electrode film, the first support structures being used to fix the vibrating electrode film parallel to the edge of the substrate.

[0007] Optionally, the plasma radiator further includes: A plurality of second support structures are provided, wherein the second support structures are located on the same side of the heat sink fins relative to the first substrate, the second support structures support the vibrating electrode film such that the vibrating electrode film is spaced apart from the first substrate, the second support structures are used to fix the vibrating electrode film at an edge perpendicular to the first substrate, and the second support structures are located in a region outside the mutual projection area of ​​adjacent heat sink fins.

[0008] Optionally, the material of the driving layer is a conductive metal; The material of the first base layer is stainless steel or Hastelloy; The material of the second base layer is stainless steel or Hastelloy; The heat sink fins are made of conductive metal; The piezoelectric layer is made of a piezoelectric material; The piezoelectric material is an organic piezoelectric composite material or an inorganic ceramic. The organic composite piezoelectric material is poly(vinylidene fluoride-trifluoroethylene-trifluorochloroethylene) or polyvinylidene fluoride; The inorganic ceramic is lead zirconate titanate or aluminum nitride.

[0009] Optionally, the voltage amplitude of the AC voltage signal ranges from 0V to 2000V, and the frequency of the AC voltage signal is greater than 20kHz.

[0010] According to a second aspect of the present invention, the technical solution of the present invention provides a heat dissipation method applied to the above-mentioned plasma heat sink. The working method includes: continuously applying an AC voltage signal to a driving layer to drive a vibrating electrode film to fan, and continuously applying a first voltage signal to the heat sink fins adjacent to the vibrating electrode film. The method of applying the AC voltage signal and the first voltage signal includes: making the voltage of the first voltage signal equal to a first air discharge threshold voltage, wherein the first air threshold voltage is the minimum voltage required to be applied to the heat sink fins when the vibrating electrode film is in a static state without the AC voltage signal applied, so that the gas in the heat sink fins and the vibrating electrode film can ionize.

[0011] According to a third aspect of the present invention, the technical solution of the present invention provides a heat dissipation method applied to the above-mentioned plasma heat sink. The working method includes: continuously applying an AC voltage signal to a driving layer to drive a vibrating electrode film to fan, and continuously applying a first voltage signal to the heat sink fins adjacent to the vibrating electrode film. The method of applying the AC voltage signal and the first voltage signal includes: making the voltage of the first voltage signal reach a maximum value only when the vibrating electrode film and the heat sink fins reach the closest distance. The maximum value of the first voltage signal is equal to a first air discharge threshold voltage. The voltage of the first voltage signal is a variable voltage. The first air threshold voltage is the minimum voltage required to be applied to the heat sink fins when the vibrating electrode film is in a static state without the AC voltage signal applied, so that the gas in the heat sink fins and the vibrating electrode film can ionize.

[0012] According to a fourth aspect of the present invention, the technical solution of the present invention provides a heat dissipation method applied to the above-mentioned plasma heat sink, the working method comprising: continuously applying an AC voltage signal to a driving layer to drive a vibrating electrode film to fan, and continuously applying a first voltage signal to a heat sink fin adjacent to the vibrating electrode film, and the method of applying the first voltage signal comprising: controlling the voltage of the first voltage signal to be equal to a second air discharge threshold voltage, the second air discharge threshold voltage being the minimum voltage required to be applied to the heat sink fin when the vibrating electrode film and the heat sink fin reach the closest distance, so that the gas between the vibrating electrode film and the heat sink fin can be ionized.

[0013] Compared with the prior art, the technical solution of the embodiments of the present invention has the following beneficial effects: In the plasma heat sink and heat dissipation method of the present invention, a plurality of heat sink fins are spaced apart in a first direction, the first direction being perpendicular to the extension direction of the heat sink fins. The plurality of heat sink fins are perpendicular to the first substrate and fixed on the same side of the first substrate. A plurality of vibrating electrode films are located on the same side of the heat sink fins relative to the first substrate. One vibrating electrode film is provided between any two adjacent heat sink fins. The adjacent vibrating electrode films are spaced apart from the heat sink fins. The vibrating electrode film includes a first substrate layer, an insulating layer, a driving layer, a piezoelectric layer, and a second substrate layer stacked sequentially along the first direction. The first substrate layer and the second substrate layer are grounded. The circuit module includes a plurality of second output terminals corresponding to the vibrating electrode films. The second output terminals are coupled to the driving layer. The circuit module is used to output AC voltage signals to the driving layer. Therefore, the vibrating electrode film can fan between two adjacent heat sink fins, thereby driving airflow to blow and cool the heat sink fins. Based on this, the circuit module also includes several first output terminals coupled to the heat sink fins. The circuit module is also used to output a first voltage signal to the heat sink fins to form an electric field between adjacent vibrating electrode films. Therefore, the gas between the heat sink fins and the vibrating electrode films can be ionized. The plasma jet formed by the product of gas ionization under the fanning action of the vibrating electrode films is also blown toward the heat sink fins to cool them. At the same time, under the fanning action of the vibrating electrode films, the plasma jet can be rapidly pushed by the airflow of the vibrating electrode films during the formation process and contact the heat sink fins for conduction, reducing the residence time of the plasma jet between the vibrating electrode and the heat sink fins and improving the cooling capacity. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a cross-sectional structural diagram of the plasma generator according to the first embodiment of the present invention; Figure 2 This is a cross-sectional structural diagram of the plasma generator according to the second embodiment of the present invention; Figure 3 for Figure 2 A three-dimensional structural diagram of a plasma generator.

[0016] 100 - First basement; 200-Heat sink fins; 300 - Vibrating electrode thin film; 310 - First basal layer; 320 - Insulation layer; 330 - Driver Layer; 340-Piezoelectric layer; 350 - Second basal layer; 400-Circuit Module; 500 - First supporting structure; 600 - Second support structure. Detailed Implementation

[0017] As described in the background section, how to achieve stable and effective heat dissipation with a small area using plasma heat sinks has become a technical challenge that the industry needs to solve. This will be explained in detail below.

[0018] In view of this, the present invention proposes a plasma heat sink, comprising a plurality of heat sink fins spaced apart along a first direction perpendicular to the extension direction of the heat sink fins; a vibrating electrode film is disposed between any two adjacent heat sink fins, the vibrating electrode film comprising a first base layer, an insulating layer, a driving layer, a piezoelectric layer, and a second base layer stacked sequentially along the first direction, the first base layer and the second base layer being grounded; a circuit module comprising a plurality of first output terminals and a plurality of second output terminals, the circuit module being used to output an AC voltage signal to the driving layer of the vibrating electrode film to drive the piezoelectric layer to fan the vibrating electrode film, and the circuit module being used to output a first voltage signal to the heat sink fins to form an electric field between adjacent vibrating electrode films and heat sink fins. This allows the plasma heat sink to achieve stable and effective heat dissipation with a relatively small area.

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0020] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0021] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0022] To make the above-mentioned objectives, features and beneficial effects of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0023] [First Embodiment] Please refer to Figure 1 The plasma heat sink of this embodiment includes: a first substrate 100, a plurality of heat sink fins 200, a plurality of vibrating electrode films 300, and a circuit module 400.

[0024] A plurality of heat sink fins 200 are spaced apart in a first direction, the first direction being perpendicular to the extension direction of the heat sink fins 200, and the plurality of heat sink fins 200 are perpendicular to the first base 100 and fixed to one side of the first base 100.

[0025] The vibrating electrode film 300 and the heat sink fin 200 are located on the same side relative to the first substrate 100. A vibrating electrode film 300 is provided between any two adjacent heat sink fins 200. Adjacent vibrating electrode films 300 and heat sink fins 200 are spaced apart. The vibrating electrode film 300 includes a first substrate layer 310, an insulating layer 320, a driving layer 330, a piezoelectric layer 340 and a second substrate layer 350 stacked sequentially along a first direction. The first substrate layer 310 and the second substrate layer 350 are grounded.

[0026] The circuit module 400 includes several first output terminals corresponding to several heat sink fins 200 and several second output terminals corresponding to the vibrating electrode. The first output terminals are coupled to the heat sink fins 200, and the second output terminals are coupled to the driving layer 330. The circuit module 400 is used to output an AC voltage signal to the driving layer 330 of the vibrating electrode film 300 to drive the piezoelectric layer 340 to fan the vibrating electrode film 300. The circuit module 400 is also used to output a first voltage signal to the heat sink fins 200 to form an electric field between adjacent vibrating electrode films 300 and heat sink fins 200.

[0027] Both the first substrate 310 and the second substrate 350 are grounded, and the voltage on both the first substrate 310 and the second substrate is 0.

[0028] In the aforementioned plasma heat sink, by applying an AC voltage signal to the vibrating electrode film, the vibrating electrode film can fan between two adjacent heat sink fins, thereby driving airflow to blow towards and cool the heat sink fins. Furthermore, by applying a first voltage signal to the heat sink fins, an electric field is formed between the vibrating electrode film and the adjacent heat sink fins, causing the gas between the heat sink fins and the vibrating electrode film to ionize. The ionization products, under the action of the fanning action of the vibrating electrode film, form a plasma jet that is also blown towards the heat sink fins, cooling them. Simultaneously, under the fanning action of the vibrating electrode film, the plasma jet can be rapidly propelled by the airflow of the vibrating electrode film during its formation and contact the heat sink fins for conduction, reducing the residence time of the plasma jet between the vibrating electrode and the fins and improving the cooling capacity.

[0029] In this embodiment, the plasma heat sink may include: a plurality of first support structures 500, the first support structures 500 being located between the first substrate 100 and the vibrating electrode film 300, and the first support structures 500 being used to fix the vibrating electrode film 300 parallel to the edge of the first substrate 100.

[0030] As an example, the voltage amplitude of an AC voltage signal ranges from 0 V to 2000 V, and the frequency of the AC voltage signal is greater than 20 kHz.

[0031] In this embodiment, the driving layer 330 is made of conductive metal.

[0032] The first base layer 310 is made of stainless steel or Hastelloy.

[0033] The material of the second base layer 350 is stainless steel or Hastelloy.

[0034] The heat sink fin 200 is made of conductive metal.

[0035] For example, the heat sink fin 200 can be made of aluminum.

[0036] The material of piezoelectric layer 340 is a piezoelectric material.

[0037] Specifically, piezoelectric materials include organic piezoelectric composites and / or inorganic ceramics.

[0038] Organic composite piezoelectric materials include poly(vinylidene fluoride-trifluoroethylene-trifluorochloroethylene) (P(VDF-TrFE-CTFE)) and polyvinylidene fluoride (PVDF).

[0039] Inorganic ceramics include lead zirconate titanate (PZT) and / or aluminum nitride (AlN).

[0040] Accordingly, please continue to refer to Figure 1 The embodiments of the present invention also provide a heat dissipation method applicable to the above-mentioned plasma heat sink, specifically including: continuously applying an AC voltage signal to the driving layer 310 to drive the vibrating electrode film 300 to fan, and continuously applying a first voltage signal to the heat sink fins 200 adjacent to the vibrating electrode film 300. The method of applying the AC voltage signal and the first voltage signal includes: making the voltage of the first voltage signal equal to a first air discharge threshold voltage, wherein the first air threshold voltage is the minimum voltage required to be applied to the heat sink fins 200 so that the gas in the heat sink fins 200 and the vibrating electrode film 300 can ionize when the vibrating electrode film 300 is in a static state without an AC voltage signal applied.

[0041] The first air threshold voltage can be understood as the voltage applied to the heat sink fin 200 when the vibrating electrode film 300 is in a static state without the AC voltage signal applied, and when the gas in the vibrating electrode film 300 and the heat sink fin 200 is in a critical state from unionized to ionized. Specifically, the first air threshold voltage can be obtained by measurement, and those skilled in the art can reduce the measurement error of the first air threshold voltage by averaging the results of multiple actual measurements.

[0042] In the above heat dissipation method, when the distance between the vibrating electrode film 300 and the heat sink fin 200 is less than or equal to the distance between the vibrating electrode film 300 and the heat sink fin 200 in a stationary state, the gas between the vibrating electrode film 300 and the heat sink fin 200 will ionize. When the distance between the vibrating electrode film 300 and the heat sink fin 200 is greater than the distance between the vibrating electrode film 300 and the heat sink fin 200 in a stationary state, the gas between the vibrating electrode film 300 and the heat sink fin 200 will not ionize. This method enables the gas between the vibrating electrode film 300 and the heat sink fin 200 to discharge intermittently during the operation of the plasma heat sink, which can improve the stability of the gas discharge during the discharge process in the plasma heat sink.

[0043] Accordingly, embodiments of the present invention also provide another heat dissipation method applicable to the aforementioned plasma heat sink, specifically including: continuously applying an AC voltage signal to the driving layer to drive the vibrating electrode film 300 to fan, and continuously applying a first voltage signal to the heat sink fins 200 adjacent to the vibrating electrode film 300. The method of applying the AC voltage signal and the first voltage signal includes: only when the vibrating electrode film 300 and the heat sink fins 200 reach the closest distance, the voltage of the first voltage signal reaches a maximum value, the maximum value of the first voltage signal is equal to a first air discharge threshold voltage, the voltage of the first voltage signal is a variable voltage, and the first air threshold voltage is the minimum voltage required to be applied to the heat sink fins 300 when the vibrating electrode film 300 is in a static state without an AC voltage signal applied, so that the gas in the heat sink fins 200 and the vibrating electrode film 300 can ionize.

[0044] As an example, the first air threshold voltage can be understood as the voltage applied to the heat sink fin 200 when the vibrating electrode film 300 is in a static state without the AC voltage signal applied, and when the gas in the vibrating electrode film 300 and the heat sink fin 200 is in a critical state from unionized to ionized. Specifically, the first air threshold voltage can be obtained by measurement, and those skilled in the art can reduce the measurement error of the first air threshold voltage by averaging the results of multiple actual measurements.

[0045] The closest distance is the minimum distance that can be achieved between the heat sink fin 200 and the vibrating electrode film 300.

[0046] As an example, in this embodiment, the first voltage signal is transformed into a changing voltage, and the waveform of the first voltage signal can be a triangular wave, a sine wave, a square wave, or a pulse.

[0047] In this embodiment, the electric field between the vibrating electrode film 300 and the heat sink fin 200 is strongest when they reach their closest distance. At this time, the degree of gas ionization between the vibrating electrode film 300 and the heat sink fin 200 is strongest. Specifically, when the distance between the vibrating electrode film 300 and the heat sink fin is greater than the closest distance, and the distance between the vibrating electrode film 300 and the heat sink fin 200 is less than or equal to the distance between the vibrating electrode film 300 and the heat sink fin 200 when it is stationary, the gas between the vibrating electrode film 300 and the heat sink fin 200 may or may not ionize. Furthermore, when the distance between the vibrating electrode film 300 and the heat sink fin 200 is greater than the distance between the vibrating electrode film 300 and the heat sink fin 200 when it is in a stationary state, the gas between the vibrating electrode film 300 and the heat sink fin 200 will not ionize. It can be seen that the gas between the vibrating electrode film 300 and the heat sink fin 200 is intermittently ionized, and the products generated by gas ionization will not accumulate excessively between the vibrating electrode film 300 and the heat sink fin 200, which can further improve the stability of the plasma radiator discharge process.

[0048] Furthermore, embodiments of the present invention also provide another heat dissipation method applicable to the aforementioned plasma heat sink, specifically including: An AC voltage signal is continuously applied to the driving layer 330 to drive the vibrating electrode film 300 to fan; and a first voltage signal is continuously applied to the heat sink fin 200 adjacent to the vibrating electrode film 300. The method of applying the first voltage signal includes controlling the voltage of the first voltage signal to be equal to a second air discharge threshold voltage, wherein the second air discharge threshold voltage is the minimum voltage required to be applied to the heat sink fin 200 when the vibrating electrode film 300 and the heat sink fin 200 reach the closest distance so that the gas between the vibrating electrode film 300 and the heat sink fin 200 can be ionized.

[0049] The second air threshold voltage can be understood as the voltage applied to the heat sink fin 200 when the vibrating electrode film 300 and the heat sink fin 200 reach their closest distance and the gas in the vibrating electrode film 300 and the heat sink fin 200 is in a critical state from unionized to ionized. The specific second air threshold voltage can be obtained through actual measurement, and those skilled in the art can reduce the measurement error of the second air threshold voltage by averaging the results of multiple actual measurements.

[0050] In this embodiment, the gas between the vibrating electrode film 300 and the heat sink fin 200 can undergo instantaneous ionization only when they reach their closest achievable distance. The products generated by gas ionization do not accumulate excessively between the vibrating electrode film 300 and the heat sink fin 200, further improving the stability of the plasma radiator discharge process.

[0051] [Second Embodiment] This embodiment is a modified version of the first embodiment. Please refer to [the original text]. Figure 2 as well as Figure 3 The plasma heat sink may further include: a plurality of second support structures 600, the second support structures 600 being located on the same side of the heat sink fins 200 relative to the first substrate 100, supporting the vibrating electrode film 300 such that the vibrating electrode film 300 is spaced apart from the first substrate 100, the second support structures 600 being used to fix the edge of the vibrating electrode film 300 perpendicular to the first substrate 100, and the second support structures being located in the region outside the mutual projection area of ​​adjacent heat sink fins.

[0052] In this embodiment, the vibrating electrode film 300 fans between two adjacent heat sink fins 200 under the action of an AC voltage signal.

[0053] In summary, due to the several heat sink fins 200 spaced apart in the first direction, with the first direction perpendicular to the extension direction of the heat sink fins 200, the several heat sink fins 200 are perpendicular to and fixed on the same side of the first substrate 100; several vibration electrode films 300 are located on the same side of the heat sink fins 200 relative to the first substrate 100, and one vibration electrode film 300 is provided between any two adjacent heat sink fins 200, with adjacent vibration electrode films 300 spaced apart from the heat sink fins 200, and the vibration electrode films 300 include components sequentially along the first direction. The stacked first base layer 310, insulating layer 320, driving layer 330, piezoelectric layer 340, and second base layer 350 are grounded. The circuit module 400 includes several second output terminals corresponding to the vibrating electrode film 300. The second output terminals are coupled to the driving layer 330. The circuit module 400 is used to output AC voltage signals to the driving layer 330. Therefore, the vibrating electrode film 300 can fan between two adjacent heat sink fins 200, thereby driving airflow to blow and cool the heat sink fins 200. Based on this, the circuit module 400 also includes several first output terminals coupled to the heat sink fins 200. The circuit module 400 is also used to output a first voltage signal to the heat sink fins 200 to form an electric field between adjacent vibrating electrode films 300. Therefore, the airflow between the heat sink fins 200 and the vibrating electrode film 300 can be ionized. The plasma jet formed by the ionization products of the gas is also blown toward the heat sink fins 200 under the fanning action of the vibrating electrode film 300 to cool the heat sink fins 200. At the same time, under the fanning action of the vibrating electrode film 300, the plasma jet can be quickly pushed by the airflow of the vibrating electrode film 300 and contact the heat sink fins 200 for conduction during the formation process, reducing the residence time of the plasma jet between the vibrating electrode and the heat sink fins and improving the cooling capacity.

[0054] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A plasma heat sink, characterized in that, include: First base; A plurality of heat sink fins are spaced apart in a first direction, the first direction being perpendicular to the extension direction of the heat sink fins, and the plurality of heat sink fins being perpendicular to the first substrate and fixed to one side of the first substrate. A plurality of vibrating electrode films are provided, wherein the vibrating electrode films and the heat sink fins are located on the same side relative to the first substrate, and one vibrating electrode film is provided between any two adjacent heat sink fins. Adjacent vibrating electrode films are spaced apart from the heat sink fins. The vibrating electrode films include a first substrate layer, an insulating layer, a driving layer, a piezoelectric layer and a second substrate layer stacked sequentially along a first direction. The first substrate layer and the second substrate layer are grounded. The circuit module includes a plurality of first output terminals corresponding to a plurality of heat sink fins and a plurality of second output terminals corresponding to a vibrating electrode. The first output terminals are coupled to the heat sink fins, and the second output terminals are coupled to the driving layer. The circuit module is used to output an AC voltage signal to the driving layer of the vibrating electrode film to drive the piezoelectric layer to fan the vibrating electrode film. The circuit module is also used to output a first voltage signal to the heat sink fins to form an electric field between adjacent vibrating electrode films and heat sink fins.

2. The plasma heat sink as described in claim 1, characterized in that, The plasma radiator also includes: A plurality of first support structures are provided, the first support structures being located between the first substrate and the vibrating electrode film, the first support structures being used to fix the vibrating electrode film parallel to the edge of the substrate.

3. The plasma heat sink as described in claim 1, characterized in that, The plasma radiator also includes: A plurality of second support structures are provided, wherein the second support structures are located on the same side of the heat sink fins relative to the first substrate, the second support structures support the vibrating electrode film such that the vibrating electrode film is spaced apart from the first substrate, the second support structures are used to fix the vibrating electrode film at an edge perpendicular to the first substrate, and the second support structures are located in a region outside the mutual projection area of ​​adjacent heat sink fins.

4. The plasma heat sink as described in claim 1, characterized in that, The material of the driving layer is a conductive metal; The material of the first base layer is stainless steel or Hastelloy; The material of the second base layer is stainless steel or Hastelloy; The heat sink fins are made of conductive metal; The piezoelectric layer is made of a piezoelectric material; The piezoelectric material is an organic piezoelectric composite material or an inorganic ceramic. The organic composite piezoelectric material is poly(vinylidene fluoride-trifluoroethylene-trifluorochloroethylene) or polyvinylidene fluoride; The inorganic ceramic is lead zirconate titanate or aluminum nitride.

5. The plasma heat sink as described in claim 1, characterized in that, The voltage amplitude of the AC voltage signal ranges from 0V to 2000V, and the frequency of the AC voltage signal is greater than 20kHz.

6. A heat dissipation method, characterized in that, The method, applicable to any one of claims 1 to 5, comprises: A continuous AC voltage signal is applied to the driving layer to drive the vibrating electrode film to fan, and a first voltage signal is continuously applied to the heat sink fins. The method of applying the AC voltage signal and the first voltage signal includes: making the voltage of the first voltage signal equal to a first air discharge threshold voltage, wherein the first air threshold voltage is the minimum voltage required to be applied to the heat sink fins when the vibrating electrode film is in a static state without the AC voltage signal applied, so that the gas in the heat sink fins and the vibrating electrode film can be ionized.

7. A heat dissipation method, characterized in that, The method, applicable to any one of claims 1 to 5, comprises: continuously applying an AC voltage signal to a driving layer to drive a vibrating electrode film to fan out; and continuously applying a first voltage signal to a heat sink fin adjacent to the vibrating electrode film. The method of applying the AC voltage signal and the first voltage signal comprises: maximizing the voltage of the first voltage signal only when the vibrating electrode film and the heat sink fin reach their closest distance. The maximum voltage of the first voltage signal is equal to a first air discharge threshold voltage. The voltage of the first voltage signal is a variable voltage. The first air threshold voltage is the minimum voltage required to ionize the gas in the heat sink fin and the vibrating electrode film when the vibrating electrode film is in a stationary state without the AC voltage signal applied.

8. A heat dissipation method, characterized in that, The method is applicable to the plasma heat sink according to any one of claims 1 to 5, comprising: continuously applying an AC voltage signal to a driving layer to drive a vibrating electrode film to fan out, and continuously applying a first voltage signal to a heat sink fin adjacent to the vibrating electrode film, wherein the method of applying the first voltage signal comprises: controlling the voltage of the first voltage signal to be equal to a second air discharge threshold voltage, the second air discharge threshold voltage being the minimum voltage required to be applied to the heat sink fin when the vibrating electrode film and the heat sink fin reach the closest distance, so that the gas between the vibrating electrode film and the heat sink fin can be ionized.

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