Circuit board and manufacturing method thereof

Abstract

The invention relates to the technical field of semiconductors, packaging and circuit boards, in particular to a circuit board and a manufacturing method thereof.In the circuit board, a first packaging layer is provided with a connecting plate and a heat conduction piece in the vertical direction; the power module is embedded in the first packaging layer, and the size of the power module is small, so that the internal thermal stress of the whole circuit board can be reduced, and the reliability is improved; the power module is downwards connected to the heat conduction piece through the insulating heat conduction block, so that the power module can transmit heat to the heat conduction piece, the chip is prevented from being electrically connected to the heat conduction piece, the length of a heat conduction path can be shortened, the heat resistance is reduced, the heat dissipation efficiency is improved, further, the insulating heat conduction block can be made of ceramic, the filling problem of polymer heat dissipation materials is solved, and the heat dissipation efficiency is improved. The circuit board is simple in structure, low in cost and lower in thermal resistance, meanwhile, the chip correspondingly penetrates through the through holes upwards through the connecting wires to be connected to the connecting plate, parasitic inductance of the circuit board can be reduced, and then the performance and reliability of the circuit board are improved.

Description

Technical Field

[0001] This invention relates to the fields of semiconductor, packaging and circuit board technology, and in particular to a circuit board and a method for manufacturing the same. Background Technology

[0002] Parasitic inductance inevitably forms on circuit boards. This parasitic inductance generates significant impedance in the high-frequency domain of AC circuits, thus affecting circuit performance. Parasitic inductance refers to inductance that appears in the circuit unintentionally in design or construction. The length of the circuit traces on a circuit board is closely related to the parasitic inductance mentioned above; specifically, the longer the trace, the greater the parasitic inductance, and the shorter the trace, the smaller the parasitic inductance. In commonly used circuit boards, the power module chips (such as silicon carbide chips) have connecting lines (such as aluminum and copper wires) extending from their top or side surfaces, then bending downwards to connect to the circuitry on the substrate (such as an AMB baseboard). This results in relatively long trace paths, leading to significant parasitic inductance and consequently, poor circuit board performance and reliability. Summary of the Invention

[0003] The purpose of this invention is to provide a circuit board and its manufacturing method to solve the technical problem that the wiring paths between the chip and the substrate in commonly used circuit boards are relatively long, which leads to large parasitic inductance and poor performance and reliability of the circuit board.

[0004] To achieve the above objectives, the present invention provides a circuit board including a thermally conductive component, a first encapsulation layer, a first connecting plate, a first connecting line, and a power module. The first encapsulation layer is disposed on the top surface of the thermally conductive component, the first connecting plate is disposed on the top surface of the first encapsulation layer, and the power module is embedded in the first encapsulation layer. The power module includes a chip and an insulating thermally conductive block. The chip is disposed at a distance from the first connecting plate and is connected to the first connecting plate through the first connecting line. The chip is connected to the thermally conductive component through the insulating thermally conductive block, and the bottom surface of the thermally conductive component is used to mount a heat sink.

[0005] Optionally, the power module further includes a first heat-conducting block and a second heat-conducting block, wherein the first heat-conducting block, the insulating heat-conducting block and the second heat-conducting block are arranged sequentially from top to bottom, the chip is fixedly disposed on the first heat-conducting block, and the second heat-conducting block is attached to the top surface of the heat-conducting component.

[0006] Optionally, the top surface of the first heat-conducting block is provided with a receiving groove, and the chip is fixedly disposed in the receiving groove, wherein the top surface of the chip is not higher than the top surface of the first heat-conducting block.

[0007] Optionally, the outer surface of the insulating heat-conducting block protrudes horizontally from the outer surface of the first heat-conducting block and the outer surface of the second heat-conducting block.

[0008] Optionally, it also includes a second connecting line and a connecting layer. The connecting layer is disposed above the first connecting plate. The connecting layer includes a second connecting plate and a second encapsulation layer arranged sequentially from top to bottom. The first connecting plate has a first through hole that runs through the vertical direction. The second connecting line passes through the first through hole. The chip is connected to the second connecting plate through the second connecting line.

[0009] Optionally, it may also include a plurality of connecting layers, which are sequentially disposed above the first connecting plate in a vertical direction. The second connecting plate is provided with a second through hole, and the second connecting line passes through the first through hole or passes through both the first through hole and the second through hole.

[0010] Optionally, the heat-conducting component includes a heat-conducting column, a first heat-conducting plate, an intermediate layer, and a second heat-conducting plate arranged sequentially from top to bottom. The heat-conducting column passes through the intermediate layer, and its two ends are respectively connected to the first heat-conducting plate and the second heat-conducting plate.

[0011] This application also relates to a method for manufacturing the aforementioned circuit board, comprising the following steps: S1. Install the power module on the top surface of the heat-conducting component; S2. Divide the first packaging layer into a lower packaging layer and a lower packaging layer, and then open a through hole in the lower packaging layer that matches the power module. S3. Heat the lower layer of the package and press the lower layer of the package onto the top surface of the heat-conducting plate so that its through hole fits on the outside of the power module. S4. Heat the upper packaging layer and press the upper packaging layer and the first connecting plate onto the lower packaging layer; S5. A through hole is made in the first connecting plate; S6. Pass the first connecting line through the through hole to connect it to the first connecting board and the chip.

[0012] Optionally, the following steps may also be included: After step S6, the connection layer is installed above the first connection board, a first through hole is opened on the first connection board, a second through hole is opened on the second connection board, and the second connection line is passed through the first through hole and the second through hole to connect it to the second connection board and the chip.

[0013] Optionally, the first encapsulation layer is made of polypropylene. In step S3, the upper encapsulation layer is heated to 190°C to 210°C, and in step S4, the lower encapsulation layer is heated to 190°C to 210°C.

[0014] Compared with the prior art, the circuit board and its manufacturing method according to the present invention have the following advantages: In the circuit board of this invention, a connecting plate and a heat-conducting component are respectively provided in the upper and lower directions of the first encapsulation layer; further, a power module is embedded in the first encapsulation layer, and the size of the power module can be designed to be relatively small to reduce the internal thermal stress of the circuit board as a whole, thereby improving reliability; further, the power module is connected downward to the heat-conducting component through an insulating heat-conducting block, so that it can transfer heat to the heat-conducting component and avoid the chip being electrically connected to the heat-conducting component, and then heat is dissipated through a heat sink mounted on the heat-conducting component. The power module can be directly sintered or soldered to the heat sink to shorten the length of the heat conduction path, reduce thermal resistance, and improve heat dissipation efficiency. Further, the insulating heat-conducting block can be made of ceramic, specifically a ceramic sheet, to facilitate heat conduction... The thermal performance is superior to that of general materials based on a mixture of polymers and inorganic materials, and it does not have the filling problem of polymer heat dissipation materials. It is also inexpensive and has lower thermal resistance. At the same time, the high heat resistance and chemical stability of ceramic materials can ensure the stable operation of the circuit board in high-temperature environments, thereby extending the service life of the circuit board. Furthermore, the chip spacer connection board is set to prevent the chip from directly contacting the connection board and thus directly connecting to the circuit on the connection board. The chip is connected to the connection board through multiple connection lines passing upward through the through holes, and then connected to the circuit on the connection board. This allows the connection lines to connect the chip and the connection board in a straight line, thereby shortening the trace path between the chip and the connection board, reducing the parasitic inductance of the circuit board, and thus improving the performance and reliability of the circuit board. Attached Figure Description

[0015] Figure 1 This is a cross-sectional view of the circuit board of the present invention.

[0016] Figure 2 This is a cross-sectional view of the circuit board when the manufacturing method of the present invention is executed up to step S1.

[0017] Figure 3 This is a cross-sectional view of the circuit board when the manufacturing method of the present invention is executed up to step S3.

[0018] Figure 4 This is a cross-sectional view of the circuit board when the manufacturing method of the present invention is executed up to step S4.

[0019] Figure 5 This is a cross-sectional view of the circuit board when the manufacturing method of the present invention is executed up to step S6.

[0020] Reference numerals: 1. Power module; 11. Chip; 12. Insulating heat-conducting block; 13. First heat-conducting block; 14. Second heat-conducting block; 2. First encapsulation layer; 21. Upper encapsulation layer; 22. Lower encapsulation layer; 3. First connecting plate; 4. First connecting line; 5. Heat-conducting component; 51. Heat-conducting pillar; 52. First heat-conducting plate; 53. Intermediate layer; 54. Second heat-conducting plate; 6. Second connecting line; 7. Connecting layer; 71. Second connecting plate; 72. Second encapsulation layer. Detailed Implementation

[0021] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0022] In the description of this invention, it should be understood that the terms "top", "bottom", "inner", "outer", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] like Figure 1 As shown, a circuit board of the present invention includes a heat-conducting component 5, a first encapsulation layer 2, a first connecting plate 3, a first connecting line 4, and a power module 1. The first encapsulation layer 2 is disposed on the top surface of the heat-conducting component 5, the first connecting plate 3 is disposed on the top surface of the first encapsulation layer 2, and the power module 1 is embedded in the first encapsulation layer 2. The power module 1 includes a chip 11 and an insulating heat-conducting block 12. The chip 11 is disposed at a distance from the first connecting plate 3 and is connected to the first connecting plate 3 through the first connecting line 4. The chip 11 is connected to the heat-conducting component 5 through the insulating heat-conducting block 12. The bottom surface of the heat-conducting component 5 is used to mount a heat sink.

[0025] In the above technical solution, the first encapsulation layer 2 is provided with a connecting plate and a heat-conducting component 5 in the upper and lower directions, respectively; further, the power module 1 is embedded in the first encapsulation layer 2, and the size of the power module 1 can be designed to be relatively small to reduce the internal thermal stress of the circuit board as a whole, thereby improving reliability; further, the power module 1 is connected downward to the heat-conducting component 5 through an insulating heat-conducting block 12, so that it can transfer heat to the heat-conducting component 5 and avoid the chip 11 being electrically connected to the heat-conducting component 5, and then heat is dissipated through the heat sink installed on the heat-conducting component 5. The power module can be directly sintered or welded to the heat sink to shorten the length of the heat conduction path, reduce thermal resistance, and improve heat dissipation efficiency. Further, the insulating heat-conducting block 12 can be made of ceramic, specifically a ceramic sheet, so that it can... The thermal conductivity is superior to that of general materials based on a mixture of polymers and inorganic materials, and it does not have the filling problem of polymer heat dissipation materials. It is also inexpensive and has lower thermal resistance. At the same time, the high heat resistance and chemical stability of ceramic materials can ensure the stable operation of the circuit board in high-temperature environments, thereby extending the service life of the circuit board. Furthermore, the chip 11 is separated from the connection board to prevent the chip 11 from directly contacting the connection board and thus directly connecting to the circuit on the connection board. The chip 11 is connected to the connection board through multiple connecting lines passing upward through the through holes, so that the connecting lines can be directly connected to the chip 11 and the connection board, thereby shortening the trace path between the chip 11 and the connection board, which can reduce the parasitic inductance of the circuit board and thus improve the performance and reliability of the circuit board.

[0026] The first encapsulation layer 2 can embed multiple power modules 1 and other components, and the top surface of the connecting plate can also be directly mounted with modules and components.

[0027] The insulating heat-conducting block 12 can be a ceramic block.

[0028] The outer wall of the first connecting line 4 may be provided with an insulating sleeve to prevent the first connecting line 4 from being interfered with or causing interference to other components.

[0029] The first encapsulation layer 2 may include an upper encapsulation layer 21 and a lower encapsulation layer 22 arranged sequentially from top to bottom. The lower encapsulation layer 22 has a through hole that matches the power module 1. During encapsulation, the lower encapsulation layer 22 and the upper encapsulation layer 21 are heated to a semi-cured flow state. Then, the lower encapsulation layer 22 is pressed onto the top surface of the heat-conducting component 5, so that the through hole fits on the outside of the power module 1. The lower encapsulation layer 22 flows to fill the gap between the through hole and the power module 1. Then, the upper encapsulation layer 21 is pressed onto the top surface of the power module 1. The upper encapsulation layer 21 flows to fill the gap between the upper encapsulation layer 21 and the power module 1. The first encapsulation layer 2 is cooled to complete the encapsulation.

[0030] Furthermore, the power module 1 also includes a first heat-conducting block 13 and a second heat-conducting block 14, the first heat-conducting block 13, the insulating heat-conducting block 12 and the second heat-conducting block 14 are arranged sequentially from top to bottom, the chip 11 is fixedly disposed on the first heat-conducting block 13, and the second heat-conducting block 14 is attached to the top surface of the heat-conducting component 5.

[0031] The structure in which the first heat-conducting block 13 and the second heat-conducting block 14 sandwich the insulating heat-conducting block 12 can effectively transfer the heat of the chip 11 to the heat-conducting component 5 and prevent the chip 11 from being electrically connected to the heat-conducting component 5.

[0032] The first heat-conducting block 13 and the second heat-conducting block 14 need to have high thermal conductivity, while the insulating heat-conducting block 12 needs to have both high thermal conductivity and insulation properties.

[0033] Preferably, the first heat-conducting block 13 and the second heat-conducting block 14 can be copper blocks, the insulating heat-conducting block 12 is a ceramic block, and the chip 11 can be disposed on the top surface of the first heat-conducting block 13.

[0034] Furthermore, the top surface of the first heat-conducting block 13 is provided with a receiving groove, and the chip 11 is fixedly disposed in the receiving groove. The top surface of the chip 11 is not higher than the top surface of the first heat-conducting block 13, so as to reduce the thickness of the power module 1 in the vertical direction, thereby reducing the thickness of the circuit board, and increasing the area where the chip 11 can contact the first heat-conducting block 13, thereby increasing the efficiency of heat transfer.

[0035] Furthermore, the outer surface of the insulating heat-conducting block 12 protrudes horizontally from the outer surface of the first heat-conducting block 13 and the outer surface of the second heat-conducting block 14. Specifically, each outer surface of the insulating heat-conducting block 12 protrudes from each outer surface of the two heat-conducting blocks. In a top view, the insulating heat-conducting block 12 completely covers the first heat-conducting block 13 and the second heat-conducting block 14, so that the insulating heat-conducting block 12 can fully contact the two heat-conducting blocks, increase the efficiency of heat transfer, and ensure that the two heat-conducting blocks are isolated from each other.

[0036] Furthermore, it also includes a second connecting line 6 and a connecting layer 7. The connecting layer 7 is disposed above the first connecting plate 3. The connecting layer 7 includes a second connecting plate 71 and a second encapsulation layer 72 arranged sequentially from top to bottom. The first connecting plate 3 is provided with a first through hole that runs through the vertical direction. The second connecting line 6 is disposed through the first through hole. The chip 11 is connected to the second connecting plate 71 through the second connecting line 6.

[0037] The first connecting plate 3 and the second connecting plate 71 are spaced apart in the vertical direction, so that the circuit board forms a double-layer circuit. The chip 11 is connected to the circuit of the first connecting plate 3 through the first connecting line 4 and to the circuit of the second connecting plate 71 through the second connecting line 6.

[0038] An insulating sleeve may be fitted on the outside of the second connecting line 6 to prevent the second connecting line 6 from being interfered with or causing interference to other components.

[0039] Furthermore, it also includes a plurality of connecting layers 7, which are sequentially arranged above the first connecting plate 3 in a vertical direction. The second connecting plate 71 is provided with a second through hole, and the second connecting line 6 passes through the first through hole or passes through both the first through hole and the second through hole.

[0040] The first connecting plate 3 and multiple second connecting plates 71 are spaced apart in the vertical direction, so that the circuit board forms a multi-layer circuit.

[0041] Furthermore, the heat-conducting component 5 includes a heat-conducting column 51, a first heat-conducting plate 52, an intermediate layer 53, and a second heat-conducting plate 54 arranged sequentially from top to bottom. The heat-conducting column 51 passes through the intermediate layer 53, and its two ends are respectively connected to the first heat-conducting plate 52 and the second heat-conducting plate 54.

[0042] In this process, the heat from the power module 1 is sequentially transferred to the first heat-conducting plate 52, the heat-conducting pillar 51, and the second heat-conducting plate 54, forming a high-strength structure to prevent deformation of the heat-conducting component 5. In addition, the intermediate layer 53 has an insulating and shielding function to reduce external electromagnetic interference to the first encapsulation layer 2. Preferably, the combination of the first heat-conducting plate 52, the second heat-conducting plate 54, and the intermediate layer 53 can be a Core board.

[0043] In addition, since the first encapsulation layer 2 and the second encapsulation layer 72 are heated to a semi-solid and semi-fluid state during the manufacturing of the circuit board, holes are generally not deliberately made in the first encapsulation layer 5 and the second encapsulation layer 72. Connecting wires can be easily installed to pass through the first encapsulation layer 2 and the second encapsulation layer 72.

[0044] Reference Figures 2 to 5As shown, this embodiment also relates to a method for manufacturing the aforementioned circuit board, including the following steps: S1, mounting the power module 1 on the top surface of the heat-conducting component 5; S2, dividing the first encapsulation layer 2 into a lower encapsulation layer 22 and a lower encapsulation layer 22, and then opening a through hole in the lower encapsulation layer 22 that matches the power module 1; S3, heating the lower encapsulation layer 22 and pressing it onto the top surface of the heat-conducting plate, so that its through hole fits over the outside of the power module 1; S4, heating the upper encapsulation layer 21 and pressing the upper encapsulation layer 21 and the first connecting plate 3 onto the upper encapsulation layer 22; S5, opening a through hole in the first connecting plate 3; S6, passing the first connecting wire 4 through the through hole to connect it to the first connecting plate 3 and the chip 11.

[0045] In step S1, the bottom surface of the power module 1 can be welded to the top surface.

[0046] In step S3, the lower package layer 22 should be heated to a semi-solid, semi-fluid state so that it can be fitted onto the outside of the power module 1 and connected to the heat-conducting component 5 and the power module 1, and can also fill the gap between the lower package layer 22 and the power module 1; in step S4, the upper package layer 21 should be heated to a semi-solid, semi-fluid state so that it can be connected to the lower package layer 22 and the power module 1, and fill the gap between the upper package layer and the power module 1, as well as the gap between the chip 11 and the heat-conducting block.

[0047] Furthermore, the method also includes the following steps: after step S6, the connecting layer 7 is installed above the first connecting plate 3, a first through hole is opened on the first connecting plate 3, a second through hole is opened on the second connecting plate 71, and the second connecting line 6 is passed through the first through hole and the second through hole to connect it to the second connecting plate 71 and the chip 11, so as to manufacture a three-dimensional multi-loop circuit board.

[0048] The first through hole can be opened on the first connecting plate 3 before the connecting layer 7 is installed above the first connecting plate 3, or the first through hole can be opened on the first connecting plate 3 after the connecting layer 7 is installed above the first connecting plate 3. Both the first through hole and the second through hole should be opened corresponding to the chip 11 to ensure that the second connecting line 6 is set in a straight line in the vertical direction.

[0049] Furthermore, the first encapsulation layer 2 is made of polypropylene. In step S3, the upper encapsulation layer 21 is heated to 190°C to 210°C. In step S4, the lower encapsulation layer 22 is heated to 190°C to 210°C, so that the upper encapsulation layer 21 and the lower encapsulation layer 22 are in a semi-cured and semi-fluid state when pressed together.

[0050] Furthermore, fixed setting and fixed connection refer to the fixed relative positional relationship of two components, including but not limited to fixing by connectors, fixing by welding, fixing by adhesive, fixing by integral molding, and fixing by snap-fit ​​connection.

[0051] Furthermore, the connectors include, but are not limited to, fasteners, straps, ropes, pneumatic connectors, hydraulic connectors, flanges, Velcro, and buttons.

[0052] In summary, the embodiments of the present invention provide a circuit board and a method for manufacturing the same, the technical effects of which are as follows: In the circuit board of the present invention, a connecting plate and a heat-conducting component 5 are respectively provided in the upper and lower directions of the first encapsulation layer 2; further, the power module 1 is embedded in the first encapsulation layer 2, and the size of the power module 1 can be designed to be relatively small to reduce the internal thermal stress of the circuit board as a whole, thereby improving reliability; further, the power module 1 is connected downward to the heat-conducting component 5 through an insulating heat-conducting block 12, so that it can transfer heat to the heat-conducting component 5 and avoid the chip 11 being electrically connected to the heat-conducting component 5, and then heat is dissipated through the heat sink mounted on the heat-conducting component 5. The power module can be directly sintered or soldered to the heat sink to shorten the length of the heat conduction path, reduce thermal resistance, and improve heat dissipation efficiency. Further, the insulating heat-conducting block 12 can be made of ceramic, specifically a ceramic sheet, to... This makes its thermal conductivity superior to that of general materials based on a mixture of polymers and inorganic materials, and it avoids the filling problem of polymer heat dissipation materials. It is also low in cost and has lower thermal resistance. At the same time, the high heat resistance and chemical stability of ceramic materials can ensure the stable operation of the circuit board in high-temperature environments, thereby extending the service life of the circuit board. Furthermore, the chip 11 is separated from the connection board to prevent the chip 11 from directly contacting the connection board and thus directly connecting to the circuit on the connection board. The chip 11 is connected to the connection board through multiple connecting lines passing upward through the through holes, so that the connecting lines can be directly connected to the chip 11 and the connection board, thereby shortening the trace path between the chip 11 and the connection board, which can reduce the parasitic inductance of the circuit board and thus improve the performance and reliability of the circuit board.

[0053] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A circuit board, characterized in that, The device includes a heat-conducting component (5), a first encapsulation layer (2), a first connecting plate (3), a first connecting line (4), and a power module (1). The first encapsulation layer (2) is disposed on the top surface of the heat-conducting component (5), and the first connecting plate (3) is disposed on the top surface of the first encapsulation layer (2). The power module (1) is embedded in the first encapsulation layer (2). The power module (1) includes a chip (11) and an insulating heat-conducting block (12). The chip (11) is disposed at a distance from the first connecting plate (3) and is connected to the first connecting plate (3) through the first connecting line (4). The chip (11) is connected to the heat-conducting component (5) through the insulating heat-conducting block (12). The bottom surface of the heat-conducting component (5) is used to install a heat sink.

2. The circuit board according to claim 1, characterized in that, The power module (1) further includes a first heat-conducting block (13) and a second heat-conducting block (14). The first heat-conducting block (13), the insulating heat-conducting block (12) and the second heat-conducting block (14) are arranged sequentially from top to bottom. The chip (11) is fixedly disposed on the first heat-conducting block (13) and the second heat-conducting block (14) is attached to the top surface of the heat-conducting component (5).

3. The circuit board according to claim 2, characterized in that, The top surface of the first heat-conducting block (13) is provided with a receiving groove, and the chip (11) is fixedly disposed in the receiving groove. The top surface of the chip (11) is not higher than the top surface of the first heat-conducting block (13).

4. The circuit board according to claim 2, characterized in that, The outer side of the insulating heat-conducting block (12) protrudes horizontally from the outer side of the first heat-conducting block (13) and the outer side of the second heat-conducting block (14).

5. The circuit board according to claim 1, characterized in that, It also includes a second connecting line (6) and a connecting layer (7). The connecting layer (7) is disposed above the first connecting plate (3). The connecting layer (7) includes a second connecting plate (71) and a second encapsulation layer (72) arranged sequentially from top to bottom. The first connecting plate (3) is provided with a first through hole that runs through the vertical direction. The second connecting line (6) passes through the first through hole. The chip (11) is connected to the second connecting plate (71) through the second connecting line (6).

6. The circuit board according to claim 5, characterized in that, It also includes multiple connecting layers (7), which are arranged sequentially above the first connecting plate (3) in the vertical direction. The second connecting plate (71) is provided with a second through hole, and the second connecting line (6) passes through the first through hole or passes through both the first through hole and the second through hole.

7. The circuit board according to claim 1, characterized in that, The heat-conducting component (5) includes a heat-conducting column (51), a first heat-conducting plate (52), an intermediate layer (53), and a second heat-conducting plate (54) arranged sequentially from top to bottom. The heat-conducting column (51) passes through the intermediate layer (53), and the two ends of the heat-conducting column (51) are respectively connected to the first heat-conducting plate (52) and the second heat-conducting plate (54).

8. A method for manufacturing a circuit board according to any one of claims 1 to 7, characterized in that, Includes the following steps: S1. Install the power module (1) on the top surface of the heat-conducting component (5); S2. Divide the first packaging layer (2) into a lower packaging layer (22) and a lower packaging layer (22), and then open a through hole in the lower packaging layer (22) that matches the power module (1); S3. Heat the lower layer of the encapsulation (22), press the lower layer of the encapsulation (22) onto the top surface of the heat-conducting plate, so that its through hole fits on the outside of the power module (1); S4. Heat the upper packaging layer (21) and press the upper packaging layer (21) and the first connecting plate (3) onto the upper packaging layer (22); S5. A through hole is made in the first connecting plate (3); S6. Pass the first connecting line (4) through the through hole to connect it to the first connecting plate (3) and the chip (11).

9. The method for manufacturing a circuit board according to claim 8, characterized in that, It also includes the following steps: After step S6, the connecting layer (7) is installed above the first connecting plate (3), a first through hole is opened on the first connecting plate (3), a second through hole is opened on the second connecting plate (71), and the second connecting line (6) is passed through the first through hole and the second through hole to connect the second connecting plate (71) and the chip (11).

10. The method for manufacturing a circuit board according to claim 8, characterized in that, The first encapsulation layer (2) is made of polypropylene. In step S3, the upper encapsulation layer (21) is heated to 190°C to 210°C. In step S4, the lower encapsulation layer (22) is heated to 190°C to 210°C.

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