Alignment jacking mechanism and method and gluing system

Abstract

The invention provides an alignment jacking mechanism and method and a gluing system, and the alignment jacking mechanism comprises an ejector pin assembly for placing a semiconductor substrate, a first power part for driving the ejector pin assembly to move up and down, a guiding alignment assembly for guiding alignment of the semiconductor substrate, and a second power part for driving the guiding alignment assembly to move up and down, the first power part drives the ejector pin assembly to ascend from the first height position to the second height position and is used for receiving the semiconductor substrate transferred by the mechanical arm, and when the ejector pin assembly is driven to descend from the second height position to the first height, the semiconductor substrate is stably placed on the marble platform, and the phenomenon that the semiconductor substrate is deformed during transferring is avoided; the second power part drives the guiding alignment assembly to ascend and move from the third height position to the fourth height position, the guiding alignment assembly accurately guides and aligns the semiconductor substrate at the first height position to the gluing position on the marble platform at the fourth height position, and accurate gluing on the semiconductor substrate by the coating knife is facilitated.

Description

Technical Field

[0001] This invention relates to an adhesive application system, and also to an alignment and lifting mechanism and method applied to the adhesive application system. Background Technology

[0002] The adhesive coating system includes a marble platform for placing semiconductor substrates and a coating blade for applying adhesive to the semiconductor substrates. Before applying adhesive, the semiconductor substrates need to be sent to the adhesive coating station on the marble platform so that the coating blade can apply adhesive to their surfaces.

[0003] Because the semiconductor substrate is relatively thin (approximately 10–30 μm), it is prone to deformation during transport to the marble platform and cannot be placed on the adhesive application area of ​​the marble platform.

[0004] For the reasons mentioned above, there is an urgent need for a positioning and lifting mechanism for an adhesive application system that can solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a positioning lifting mechanism, method and adhesive coating system that can prevent the semiconductor substrate from deforming and accurately guide the semiconductor substrate to the adhesive coating position on the marble platform during the transfer of the semiconductor substrate.

[0006] This invention is implemented as follows: a positioning and lifting mechanism, applied in an adhesive application system, includes:

[0007] A push pin assembly having a placement position formed on its top for placing a semiconductor substrate;

[0008] A first power unit is used to drive the ejector assembly to rise from a first height position to a second height position or to fall from a second height position to a first height position. The ejector assembly at the second height position is used to enable the placement position to receive the semiconductor substrate transferred by the robot arm. The ejector assembly at the second height position is used to fall from the second height position to the first height position to place the semiconductor substrate on the placement position onto the marble platform.

[0009] Guiding and alignment components are used for guiding and aligning semiconductor substrates;

[0010] The second power unit drives the guide alignment component to rise from the third height position to the fourth height position or to fall from the fourth height position to the third height position. The guide alignment component guides the semiconductor substrate, which has fallen to the first height position, to the adhesive application position on the marble platform at the fourth height position. The third height position where the guide alignment component is located is lower than the height position of the adhesive application blade in the horizontal direction.

[0011] The present invention provides an adhesive application system, including the alignment and lifting mechanism described above, and further including:

[0012] Marble platform, used to place semiconductor substrates;

[0013] The vacuum adsorption device is capable of generating a vacuum adsorption force to adsorb and fix the semiconductor substrate on the marble platform;

[0014] The coating blade is translated relative to the marble platform to uniformly apply adhesive to the semiconductor substrate.

[0015] The present invention provides a positioning and lifting method, applied to an adhesive application system, comprising the following steps:

[0016] The drive pin assembly rises and moves from a first height position to a second height position, where the pin assembly at the second height position is used to enable the placement position to receive the semiconductor substrate transferred by the robot arm.

[0017] The guide alignment component is driven to rise and move from a third height position to a fourth height position, wherein the fourth height position is at the same height as the first height position;

[0018] When the drive pin assembly descends from the second height position to the first height position, the guide alignment assembly located at the fourth height position guides the semiconductor substrate at the first height position to the adhesive application position located on the marble platform;

[0019] The guide alignment component is driven to descend and move from the fourth height position to the third height position. The third height position where the guide alignment component is located is lower than the height position of the applicator when applying adhesive in the horizontal direction.

[0020] Another alignment and lifting method provided by this invention, applied to an adhesive application system, includes the following steps:

[0021] The drive pin assembly and the guide alignment assembly can be moved up from the first height position to the second height position or down from the second height position to the first height position;

[0022] In this process, the guide alignment component guides the semiconductor substrate transferred by the robot arm to a set position at the placement position at the second height position. During the process of the guide alignment component descending from the second height position to the first height position, the ejector pin component places the semiconductor substrate at the adhesive application position on the marble platform. The first height position is lower than the height of the adhesive application blade in the horizontal direction.

[0023] This invention provides an alignment and lifting mechanism, method, and adhesive application system, including a pin assembly for placing a semiconductor substrate, a first power component for driving the pin assembly to move up and down, a guide alignment component for guiding and aligning the semiconductor substrate, and a second power component for driving the guide alignment component to move up and down. The first power component drives the pin assembly to rise from a first height position to a second height position to receive the semiconductor substrate transferred by a robotic arm. When the pin assembly descends from the second height position to the first height position, it smoothly places the semiconductor substrate on a marble platform, avoiding deformation during transport. The second power component drives the guide alignment component to rise from a third height position to a fourth height position. At the fourth height position, the guide alignment component precisely guides the semiconductor substrate from the first height position to the adhesive application position on the marble platform, facilitating precise adhesive application by the applicator. Attached Figure Description

[0024] To more clearly illustrate the technical solution of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a structural diagram of the ejector pin assembly in the alignment and lifting mechanism provided in an embodiment of the present invention.

[0026] Figure 2 This is a structural diagram of the ejector pin assembly provided in the embodiment of the present invention.

[0027] Figure 3 This is a structural diagram of the guide alignment component in the alignment lifting mechanism provided in an embodiment of the present invention.

[0028] Figure 4 This is a structural diagram of the guide positioning frame in the guide alignment component provided in an embodiment of the present invention.

[0029] Figure 5 This is a schematic diagram of the guide region between the horizontal diameter and the vertical diameter of the roller in the guide alignment assembly provided in this embodiment of the invention.

[0030] Figure 6 This is a structural diagram of the guide alignment component in the length direction or the guide alignment component in the width direction provided in the embodiment of the present invention.

[0031] Figure 7 This is a structural diagram of the alignment and lifting mechanism provided in an embodiment of the present invention.

[0032] Figure 8This is a block diagram of the first intelligent control component in the alignment and lifting mechanism provided in an embodiment of the present invention.

[0033] Figure 9 This is a block diagram of the second intelligent control component in the alignment and lifting mechanism provided in an embodiment of the present invention.

[0034] Figure 10 This is a structural diagram of a positioning and lifting mechanism provided in another embodiment of the present invention.

[0035] Figure 11 This is a state diagram of the ejector pin assembly in the glue application system provided in this embodiment of the invention, showing its movement from a first height position to a second height position.

[0036] Figure 12 This is a state diagram of the ejector pin assembly in the glue application system provided in this embodiment of the invention, showing its movement from the second height position to the first height position.

[0037] Figure 13 This is a schematic diagram of a coating knife applying adhesive to a semiconductor substrate in the coating system provided in an embodiment of the present invention.

[0038] Figure 14 This is a structural diagram of the adsorption surface of the marble platform in the adhesive coating system provided in this embodiment of the invention.

[0039] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0040] The reference numerals in the attached figures are explained as follows:

[0041] Semiconductor substrate 10;

[0042] Ejector assembly 100, placement position 110, ejector module 120, ejector piece 120', ejector 121, connection position 1211, arc end 1212, positioning piece 122, horizontal section 1221, vertical section 1222, clearance opening 1223, sleeve 123, channel 124.

[0043] First power component 200;

[0044] Guide alignment component 300, roller 310, first guide alignment surface 311, second guide alignment surface 312, guide positioning frame 313, guide area 314, plate 315, roller bracket 316;

[0045] Second power component 400;

[0046] Marble platform 500, ejector pin guide hole 510, sliding hole 520, adsorption surface 530;

[0047] 600-grip trowel;

[0048] First intelligent control component 700, first position detector 710, first driver 720, first controller 730;

[0049] Second intelligent control component 800, third position detector 810, second driver 820, second controller 830;

[0050] Guide support assembly 900, first guide support assembly 910, first guide assembly 911, first linear slide rail 9111, first slider 9112, first support assembly 912, two upright plates (9121, 9121'), connecting plate 9122, guide opening 913, sliding connector 914, vertical section 9141, horizontal section 9142, rolling wheels (915, 915'), connecting rod 916, support frame 917, accommodating space 918, Rotary connection structure 919, Second guide support assembly 920, Second support assembly 921, Bracket 9211, Slide rod 9212, Second guide assembly 922, Second linear slide rail 9221, Second slider 9222, Cylinder 923, Connecting position 9231, Arc-shaped protrusion 9232, Limiting component 924, Horizontal position 9241, Vertical position 9242, Clearance opening 9243, Pad block 9244, Connecting block 9245. Detailed Implementation

[0051] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or state relationship based on the orientation or state relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to be constructed and operated in a specific orientation.

[0052] Furthermore, in addition to indicating location or state relationships, some of the aforementioned terms may also have other meanings. For example, the term "above" may, in certain circumstances, indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0053] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0054] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts, which may be the same or different in type and construction, and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0055] To clarify the directional relationships in the diagram, a coordinate system with the vertical direction as the Z-direction and the horizontal plane as the XY-plane is appropriately labeled.

[0056] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0057] Overview of a positioning lifting mechanism as an example

[0058] like Figures 1-3 and Figure 7 As shown, an alignment and lifting mechanism for a coating system provided in this embodiment of the invention includes a pin assembly 100 for placing a semiconductor substrate 10, a first power component 200 for driving the pin assembly 100 to move up and down, a guide alignment component 300 for guiding and aligning the semiconductor substrate 10, and a second power component 400 for driving the guide alignment component 300 to move up and down.

[0059] Overview of the ejector pin assembly 100 as an example

[0060] The top of the ejector assembly 100 has a placement position 110 for placing the semiconductor substrate 10. The placement position 110 is arranged to have substantially the same external dimensions as the semiconductor substrate 10 and can uniformly support the weight of the semiconductor substrate 10. In this embodiment, the semiconductor substrate 10 may include, but is not limited to, various substrates such as glass substrates for liquid crystal display devices, glass substrates for PDP, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, substrates for electronic paper, rectangular glass substrates, flexible substrates for thin-film liquid crystals, and substrates for organic EL.

[0061] Preferably, the ejector pin assembly 100 includes multiple rows of ejector pin modules 120 arranged in parallel at intervals. Each row of ejector pin modules 120 includes multiple ejector pin components 120' arranged in sequence at intervals. Each ejector pin component 120' includes an ejector pin 121, a sleeve 123 screwed to the lower end of the ejector pin 121, and a positioning component 122 that slides horizontally and is axially fixedly engaged with the sleeve 123.

[0062] like Figure 2As shown, preferably, the outer circumferential surface of the sleeve 123 is radially provided with a connecting position 1211. The positioning member 122 includes a horizontal section 1221 that slides and fits with the connecting position 1211 and a vertical section 1222 that is fixedly connected to the horizontal section 1221. The horizontal section 1221 has a relief opening 1223 that avoids the sleeve 123. Applying a thrust in the radial direction to the sleeve 123 can cause the connecting position 1211 to translate relative to the horizontal section 1221, thereby adjusting the lower half of the sleeve 123 and the ejector pin 121 to a position corresponding to the ejector pin guide hole 510, so that the upper half of the ejector pin 121 can slide smoothly in the ejector pin guide hole 510.

[0063] Furthermore, the lower end of the sleeve 123 is provided with an arc-shaped end 1212 located on the connecting plate 9122 of the first support assembly 912. The arc-shaped end 1212 can reduce the contact area between the sleeve 123 and the connecting plate 9122, so that there is a suitable friction between the sleeve 123 and the connecting plate 9122. This friction facilitates the translation of the connecting position 1211 of the sleeve 123 relative to the horizontal section 1221, and also limits the position of the translated sleeve 123.

[0064] Two channels 124 are formed between two adjacent ejector pin modules 120, allowing a robot arm to pass through. This structure not only supports the vertical movement of the semiconductor substrate 10, but also facilitates the robot arm to pass through the two channels 124 to transfer the semiconductor substrate 10, thus increasing its functionality. Multiple ejector pins 121 are located at the same height, forming a flat placement position 110 on the top of the ejector pins 121, which enables the ejector pins 121 to stably support the semiconductor substrate 10.

[0065] Furthermore, the connecting plate 9122 is provided with weight reduction ports 9123 respectively corresponding to the two channels 124. The weight reduction ports 9123 can reduce the weight of the connecting plate 9122 and save the electrical energy of the first power component 200 that drives the connecting plate 9122 to move, while not interfering with the installation position of the ejector pin 120'.

[0066] Overview of the first power component 200 as an example

[0067] like Figure 11 and Figure 12As shown, the first power unit 200 is used to drive the ejector assembly 100 to rise from a first height position to a second height position or to fall from a second height position to a first height position. The ejector assembly 100 is used to receive the semiconductor substrate 10 transferred by the robot arm at the second height position. The ejector assembly 100 is used to place the semiconductor substrate 10 on the placement position 110 onto the marble platform 500 when it falls from the second height position to the first height position. In this embodiment, there are preferably two first power units 200, which are located on both sides of the lower end of the ejector assembly 100, so as to facilitate the synchronous driving of the ejector assembly 100 to rise or fall. Using two ejector assemblies 100 to drive the ejector assembly 100 synchronously is beneficial to the stability of the ejector assembly 100, and thus to the stability of the semiconductor substrate 10 placed on the top of the ejector assembly 100.

[0068] The first power component 200 includes, but is not limited to, a telescopic motor, a lead screw motor, or a telescopic cylinder. In this embodiment, the first power component 200 is preferably a lead screw motor. The lead screw motor rotates according to a set first number of revolutions, a first speed, and a first direction, and the linkage pin assembly 100 moves from a first height position to a second height position so that the placement position 110 can receive the semiconductor substrate 10 transferred by the robot arm.

[0069] The lead screw motor rotates according to the set second number of revolutions, second speed and second direction, and the linkage pin assembly 100 moves down from the second height position to the first height position to place the semiconductor substrate 10 on the placement position 110 onto the marble platform 500.

[0070] Overview of the guide alignment component as an example

[0071] The guiding and alignment component 300 is used to guide and align the semiconductor substrate 10, facilitating precise application of adhesive by the coating blade 600 onto the semiconductor substrate 10. The guiding and alignment component 300 includes:

[0072] At least two spaced-apart length direction guiding alignment components, each length direction guiding alignment component having a first guiding alignment surface 311 for length direction guiding alignment of semiconductor substrate 10;

[0073] At least two spaced-apart width-direction guide alignment components, each width-direction guide alignment component having a second guide alignment surface 312 for width-direction guide alignment of the semiconductor substrate 10.

[0074] In this embodiment, preferably, multiple length direction guiding alignment components and multiple width direction guiding alignment components are symmetrically arranged and have the same structure. By adopting a symmetrical structural design, the semiconductor substrate 10 can be subjected to uniform force in the length and width directions, resulting in the best guiding alignment effect.

[0075] There are n first guiding alignment surfaces 311 and n second guiding alignment surfaces 312, where n is an even number greater than 1. In this embodiment, preferably, there are four first guiding alignment surfaces 311 and four second guiding alignment surfaces 312, which are symmetrically arranged in pairs, enabling rapid guidance of the semiconductor substrate 10 and improving the guiding alignment efficiency.

[0076] Preferably, the first guide alignment surface 311 and the second guide alignment surface 312 are, but are not limited to, inclined surfaces, arc surfaces or a combination of inclined surfaces and arc surfaces, all of which can achieve the effect of guide alignment;

[0077] like Figure 4 As shown, the upper ends of the two opposing first guide alignment surfaces 311 and the upper ends of the two opposing second guide alignment surfaces 312 are used to guide the semiconductor substrate 10. In this embodiment, the distance L between the upper ends of the two opposing first guide alignment surfaces 311 and the distance M between the upper ends of the two opposing second guide alignment surfaces 312 are both greater than the outer dimensions of the semiconductor substrate 10, and are used to guide the semiconductor substrate 10 to the lower ends of the first guide alignment surfaces 311 and the second guide alignment surfaces 312.

[0078] The lower ends of the two opposing first guide alignment surfaces 311 and the two opposing second guide alignment surfaces 312 are used to align the semiconductor substrate 10. In this embodiment, the distance L' between the lower ends of the two opposing first guide alignment surfaces 311 and the distance M' between the lower ends of the two opposing second guide alignment surfaces 312 are adapted to the outer dimensions of the semiconductor substrate 10. Preferably, the distance L' between the lower ends of the two opposing first guide alignment surfaces 311 and the distance M' between the lower ends of the two opposing second guide alignment surfaces 312 are equal to or 0.01 to 0.02 mm larger than the outer dimensions of the semiconductor substrate 10, which facilitates the precise positioning of the semiconductor substrate 10 to the adhesive application position on the marble platform 500.

[0079] In this embodiment, preferably, a plurality of first guide alignment surfaces 311 and a plurality of second guide alignment surfaces 312 form a guide positioning frame 313 with a larger upper end and a smaller lower end, and the guide positioning frame 313 is located directly above the adhesive application position of the marble platform 500.

[0080] Overview of roller 310 as an example

[0081] like Figure 5As shown, preferably, both the length direction guiding alignment component and the width direction guiding alignment component include multiple rollers 310 that rotate along their axes. The first guiding alignment surface 311 and the second guiding alignment surface 312 are respectively located within the arc-shaped guiding area 314 between the vertical diameter D1 and the horizontal diameter D2 of the multiple rollers 310. The guiding area 314 is all oriented towards the semiconductor substrate 10. Since the rolling friction resistance of the rollers 310 is less than the sliding friction resistance, the semiconductor substrate 10 can be quickly moved to the adhesive application position, thus improving the guiding alignment efficiency.

[0082] In another embodiment, the roller 310 can be set to not rotate, which can also achieve the function of guiding and positioning. At the same time, a slope and a guide surface combining the slope and the arc surface can be set on the non-rotating roller 310, which can achieve the effect of guiding and aligning the semiconductor substrate 10.

[0083] Preferably, the position corresponding to the horizontal diameter D2 of the roller 310, which is arranged opposite to the roller in the X and Y directions, is used to align the semiconductor substrate 10 in the length and width directions. In this embodiment, the position corresponding to the horizontal diameter D2 of the roller 310 is at the same height as the adsorption surface 530 of the marble platform 500. With this structural design, the roller 310, at the fourth height position, can guide and position the semiconductor substrate 10 at the adhesive application position of the marble platform 500, which is beneficial for the applicator 600 to accurately apply adhesive to the semiconductor substrate 10.

[0084] Overview of the second power component 400 as an example

[0085] The second power unit 400 drives the guide alignment component 300 to rise from the third height position to the fourth height position or to fall from the fourth height position to the third height position. The guide alignment component 300 guides the semiconductor substrate 10, which is in the first position, to the adhesive application position on the marble platform 500 at the fourth height position. The third height position of the guide alignment component 300 is lower than the height position of the adhesive application blade 600 in the horizontal direction.

[0086] The second power component 400 includes, but is not limited to, a telescopic motor, a lead screw motor, or a telescopic cylinder. In this embodiment, the second power component 400 is preferably a lead screw motor.

[0087] Overview of roller mounting structure and slide bar correction structure as examples

[0088] like Figure 6 As shown in this embodiment, each roller 310 is supported by two spaced and vertically arranged slide rods 9212. The two slide rods 9212 are at the same height. A roller mounting structure is detachably connected to the top of the two slide rods 9212. A slide rod correction structure is installed at the lower end of each slide rod 9212.

[0089] The roller mounting structure includes a flat plate 315 horizontally mounted on the top of the two slide bars 9212 and a detachable roller bracket 316 fixed on the flat plate 315. The roller 310 is rotatably mounted on the roller bracket 316. The two ends of the flat plate 315 in the length direction are respectively screwed to the two slide bars 9212 by screws (not shown). The screw connection method is convenient for disassembly and assembly, and facilitates timely replacement of damaged rollers 310.

[0090] The slide bar correction structure includes a cylinder 923 screwed to the lower end of the slide bar 9212 and a limiting component 924 that is axially limited and radially slidingly engaged with the cylinder 923. The limiting component 924 is directly or indirectly detachably fixedly connected to the bracket 9211 and applies a thrust in the radial direction to the cylinder 923, so that the cylinder 923 can be translated relative to the limiting component 924 to the position corresponding to the second guide hole 520.

[0091] The axial limiting and radial sliding fit structure includes:

[0092] An annular connecting position 9231 is provided on the outer peripheral surface of the cylinder 923. The connecting position 9231 extends in the radial direction of the cylinder 923. The limiting member 924 has a horizontal position 9241 that slides and fits against the upper surface of the connecting position 9231 and a vertical position 9242 that is fixedly connected to the horizontal position 9241. The vertical position 9242 is directly or indirectly detachably fixedly connected to the bracket 9211.

[0093] Furthermore, the horizontal position 9241 is provided with a clearance opening 9243 through which the cylinder 923 can pass. The clearance opening 9243 can increase the contact area between the connecting position 9231 and the horizontal position 9241, and expand the range of translation of the connecting position 9231.

[0094] Furthermore, the bottom of the cylinder 923 is an arc-shaped protrusion 9232 that reduces the contact area between the cylinder and the support 9211. The connecting position 9231 is located near the arc-shaped protrusion 9232. The cylinder 923 can be translated relative to the horizontal end 131 (such as moving back and forth or left and right) to adjust the slide rod 9212 to the position corresponding to the second guide hole 520 of the marble platform 500. Since the contact area between the support 9211 and the arc-shaped protrusion 9232 is small, there is a suitable friction between them. This friction can both make the connecting position 9231 translate along the horizontal position 9241 and limit the translation of the connecting position 9231.

[0095] Furthermore, a pad 9244 is provided parallel to the bracket 9211 and the arc-shaped protrusion 9232, and is detachably fixedly connected to the bracket 9211. A detachable fixed connection block 9245 is provided vertically on the side of the pad 9244 and is fixedly connected to the vertical position 9242. In this embodiment, the detachable fixed connection is fixedly connected by screws, which is simple to disassemble and assemble, and facilitates timely replacement of damaged pads 9244. This avoids the phenomenon that the height of the slide bar 9212 is reduced due to wear of the pad 9244, which would cause the roller 310 to be inaccurately aligned with the semiconductor substrate 300.

[0096] Overview of the first intelligent control component as an example

[0097] like Figure 1 and Figure 8 As shown, the alignment and lifting mechanism further includes a first intelligent control component 700, which:

[0098] The first position detector 710 is used to detect the first height position of the displacement of the ejector assembly 100 and output the first height position signal to the outside.

[0099] The second position detector 710' is used to detect the second height position of the ejector pin assembly 100 and output the second height position signal to the outside.

[0100] The first driver 720 is used to drive the first power component 200 to rotate;

[0101] The first controller 730 outputs control commands to the first driver 720 based on the received first height position signal or second height position signal. The first driver 720 controls the first power unit 200 to start or stop working based on the received control commands.

[0102] Preferably, the second power component 400 rotates according to a set third number of revolutions, a third rotation speed and a third direction, and the linkage guide alignment component 300 moves up from the third height position to the fourth height position. The guide alignment component 300 guides the semiconductor substrate 10 at the first height position to the adhesive application position on the marble platform 500 at the fourth height position.

[0103] The second power unit 400 rotates according to the set fourth number of revolutions, fourth speed and fourth direction, and the linkage guide alignment component 300 moves down from the fourth height position to the third height position. This third height position is lower than the height of the applicator 600 when applying glue in the horizontal direction, so as to avoid the phenomenon that the roller 310 in the guide alignment component 300 is located within the stroke of the applicator 600 and causes the applicator 600 to collide with the roller 310 during the translational glue application process.

[0104] Overview of the second intelligent control component 800 as an example

[0105] like Figure 3 and Figure 9 As shown, the alignment and lifting mechanism includes a second intelligent control component 800, which includes:

[0106] The third position detector 810 is used to detect the third height position of the guide alignment component 300 and output the third height position signal to the outside.

[0107] The fourth position detector 810' is used to detect the fourth height position of the guide alignment component 300 and output the fourth height position signal to the outside.

[0108] The second drive 820 is used to control the second power unit 400;

[0109] The second controller 830 outputs control commands to the second driver 820 based on the received third or fourth height position signal. The second driver 820 then controls the second power unit 400 to start or stop operating according to the received control commands. In this embodiment, the first controller 730 and the second controller 830 are the same controller. The controller stores parameter information such as the motor's speed, direction, and number of revolutions. It adopts intelligent control for guiding and aligning the semiconductor substrate 10, improving the efficiency of semiconductor substrate 10 alignment. It is simple to operate and convenient to use.

[0110] Overview of guide support components as an example

[0111] like Figures 1-3 and Figure 7 As shown, the alignment and lifting mechanism further includes a guide support component 900 for limiting the vertical movement of the ejector assembly 100 and the guide alignment component 300. The guide support component 900 includes a first guide support component 910 for limiting the vertical movement of the ejector assembly 100 and a second guide support component 920 for limiting the vertical movement of the guide alignment component 300.

[0112] Overview of the first guide support component as an example

[0113] like Figure 1 As shown, preferably, the first guide support assembly 910 includes a first guide assembly 911 for vertically guiding the ejector assembly 100. The first guide assembly 911 includes two symmetrically arranged first linear slide rails 9111 and first sliders 9112 respectively slidably mounted on the first linear slide rails 9111. The ejector assembly 100 is fixed on the first sliders 9112. The first power component 200 drives the ejector assembly 100 to rise or fall along the linear slide rails at a uniform speed.

[0114] Furthermore, the first guide support assembly 910 includes a first support assembly 912 for supporting the ejector pin assembly 100. The first support assembly 912 includes a gate-shaped structure for adjusting the parallelism of the ejector pin module 120. The gate-shaped structure includes two spaced vertical plates (9121, 9121') and a connecting plate 9122 disposed between the two vertical plates (9121, 9121') for mounting the ejector pin assembly 100.

[0115] Among them, the two upright plates (9121, 9121') are directly or indirectly fixed on the two first sliders 9112, and the two first sliders 9112 are directly or indirectly connected to the power output ends of the two first power components 200.

[0116] One end of the connecting plate 9122 is rotatably connected to one of the upright plates 9121, and the other end of the connecting plate 9122 is vertically fixed and horizontally slidingly engaged with another upright plate 9121'. Preferably, the structure of vertically fixed and horizontally slidingly engaged is: a guide opening 913 horizontally provided in the other upright plate 9121' and a sliding connector 914 with one end sliding through the guide opening 913 and the other end vertically provided and fixedly connected to the connecting plate 9122; preferably, the guide opening 913 is formed between two vertically spaced rolling wheels (915, 915'), and the rotating shafts of the two rolling wheels (915, 915') are fixedly connected to the other upright plate 9121' through a vertically provided connecting rod 916.

[0117] In this embodiment, there are two rotating connection structures 919 (preferably rotating shafts) between one end of the connecting plate 9122 and one of the upright plates 9121, respectively located at both ends between the connecting plate 9122 and one of the upright plates 9121; a structure that is fixed in the vertical direction and has a sliding fit in the horizontal direction is located at the middle position between the connecting plate 9122 and the other upright plate 9121'; the two rotating structures and the structure that is fixed in the vertical direction and has a sliding fit in the horizontal direction are arranged in a triangle. This structural design improves the stability between the connecting plate 9122 and the two upright plates (9121, 9121') and the convenience of adjusting the parallelism.

[0118] The sliding connector is preferably an L-shaped connector, in which the vertical section 9141 of the L-shaped connector is fixedly connected to the connecting plate 9122, and the horizontal section 9142 slides through the guide opening 913. With the above structure, when adjusting the parallelism of the ejector assembly 100, there is a movable gap between the other vertical plate 9121' and the connecting plate 9122, which facilitates the rotation of the connecting plate 9122 relative to the vertical plate 9121. The two rolling wheels 915 also have a guiding function, which facilitates the quick insertion of the horizontal section 9142 of the sliding connector 914 into the guide opening 913, saving installation time.

[0119] One of the first power components 200 drives one of the vertical plates 9121 to rise or fall, which can adjust the parallelism of the ejector pin assembly 100, reduce the friction between the ejector pin 121 and the ejector pin guide hole 510 of the marble platform 500, facilitate the smooth sliding of the ejector pin 121 in the ejector pin guide hole 510, and at the same time ensure the stability of the semiconductor substrate 10 on the top of the ejector pin 121.

[0120] Overview of the second guide support component as an example

[0121] like Figure 3 As shown, the second guide support assembly 920 further includes a second support assembly 921. The second support assembly 921 includes a hollow bracket 9211 and a plurality of slide rods 9212 disposed on the bracket 9211 for mounting rollers 310. The slide rods 9212 slide through the sliding holes 520 of the marble platform 500. The bracket 9211 is located below the marble platform 500 and is arranged parallel to the marble platform 500. The slide rods 9212 are located on the outer periphery of the semiconductor substrate 10, and the rollers 310 on the plurality of slide rods 9212 limit the semiconductor substrate 10 around its periphery.

[0122] Furthermore, the second guide support assembly 920 includes a second guide assembly 922 for moving the linkage bracket 9211 up and down. The second guide assembly 922 includes two symmetrically arranged second linear slide rails 9221 and second sliders 9222 respectively slidably mounted on the second linear slide rails 9221. The bracket 9211 is directly or indirectly fixed on the two spaced second sliders 9222. With this structure, the second power component 400 can drive the guide alignment assembly 300 to rise or fall at a uniform speed along the linear slide rail, which is beneficial to the stability of the guide alignment assembly 300.

[0123] Overview of the positioning and lifting mechanism as another embodiment

[0124] like Figure 10 As shown, the present invention also provides another positioning and lifting mechanism, comprising:

[0125] The ejector assembly 100 has a placement position 110 formed on its top for placing the semiconductor substrate 10;

[0126] The guide alignment component 300 is mounted on the ejector pin assembly 100 for guiding and aligning the semiconductor substrate 10.

[0127] The first power unit 200 is used to drive the ejector pin assembly 100 and the guide alignment assembly 300 to rise from the first height position to the second height position or to fall from the second height position to the first height position. The guide alignment assembly 300 is used in the second height position to guide the semiconductor substrate 10 transferred by the robot arm to the adhesive application position of the placement position 110. During the process of the ejector pin assembly 100 falling from the second height position to the first height position, it is used to place the semiconductor substrate 10 on the placement position 110 on the adhesive application position of the marble platform. The first height position is lower than the height of the adhesive application blade in the horizontal direction.

[0128] The difference between this embodiment and the above embodiment is that only one power component is needed to drive the guide alignment component 300 and the ejector pin component 100 to move up and down simultaneously, thereby saving the second power component 400 and the first guide component 911, simplifying the product structure and reducing production costs.

[0129] Overview of an adhesive application system as an example

[0130] like Figures 11-14 As shown, the present invention also provides an adhesive application system, including the above-mentioned alignment and lifting mechanism, and further comprising:

[0131] Marble platform 500, used to place semiconductor substrate 10;

[0132] The vacuum adsorption device is capable of generating a vacuum adsorption force to adsorb and fix the semiconductor substrate 10 onto the marble platform 500.

[0133] The coating blade 600 is translated relative to the marble platform 500 to uniformly apply adhesive to the semiconductor substrate 10.

[0134] Furthermore, the adhesive application system also includes a support frame 917 with a receiving space 918. The ejector pin assembly 100, the first power component 200, the second power component 400, the first guide support assembly 910, and the second guide support assembly 920 are all located within the receiving space 918. The first guide support assembly 910 is vertically fixed on the support frame 917. By placing the ejector pin assembly 100, the first power component 200, the second power component 400, and the first guide support assembly 910 within the receiving space 918, the installation space of the product is saved, which is conducive to the miniaturization of the product.

[0135] Overview of the alignment lifting method as an example

[0136] The present invention also provides an alignment and lifting method for use in an adhesive application system, comprising the following steps:

[0137] S1. Drive the ejector pin assembly 100 to rise from the first height position to the second height position. The ejector pin assembly 100 is used to receive the semiconductor substrate 10 transferred by the robot arm at the second height position.

[0138] S2, The drive guide alignment component 300 rises and moves from the third height position to the fourth height position, wherein the fourth height position is at the same height as the first height position;

[0139] S3. When the drive pin assembly 100 moves down from the second height position to the first height position, the guide alignment assembly 300 located at the fourth height position guides the semiconductor substrate 10 at the first height position to the adhesive application position on the marble platform 500.

[0140] S4. Drive the guide alignment component 300 to descend from the fourth height position to the third height position. The third height position where the guide alignment component 300 is located is lower than the height position of the applicator 600 when applying adhesive in the horizontal direction.

[0141] For detailed information on the alignment and lifting method, please refer to the content in the alignment and lifting structure section, which will not be repeated here.

[0142] Overview of the alignment lifting method as another embodiment

[0143] The present invention also provides another alignment and lifting method for use in an adhesive application system, comprising the following steps:

[0144] The drive pin assembly 100 and the guide alignment assembly 300 are moved up from the first height position to the second height position or down from the second height position to the first height position;

[0145] In this process, the guide alignment component 300 guides the semiconductor substrate 10 transferred by the robot arm to the set position of the placement position 110 at the second height position. During the process of the guide alignment component 300 descending from the second height position to the first height position, the ejector pin component 100 places the semiconductor substrate 10 at the glue application position of the marble platform 500. The first height position is lower than the height of the glue application blade in the horizontal direction. The set position is set vertically corresponding to the glue application position.

[0146] For detailed information on the alignment and lifting method, please refer to the alignment and lifting structure and the alignment and lifting structure in another embodiment, which will not be repeated here.

[0147] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A positioning and lifting mechanism, applied in an adhesive application system, characterized in that, include: A ejector pin assembly having a placement position formed on its top for mounting a semiconductor substrate; A first power unit is used to drive the ejector assembly to rise from a first height position to a second height position or to fall from a second height position to a first height position. The ejector assembly at the second height position is used to enable the placement position to receive the semiconductor substrate transferred by the robot arm. The ejector assembly at the second height position is used to fall from the second height position to the first height position to place the semiconductor substrate on the placement position onto the marble platform. Guiding and alignment components are used for guiding and aligning semiconductor substrates; The second power unit drives the guide alignment component to rise from the third height position to the fourth height position or to fall from the fourth height position to the third height position. The guide alignment component at the fourth height position is used to guide the semiconductor substrate that has fallen to the first height position to the adhesive application position on the marble platform. The third height position where the guide alignment component is located is lower than the height position of the adhesive application blade when it moves horizontally.

2. The positioning and lifting mechanism according to claim 1, characterized in that, The first power component rotates according to a set first number of revolutions, a first speed, and a first direction, which in turn moves the ejector pin assembly from a first height position to a second height position, so that the placement position receives the semiconductor substrate transferred by the robot arm. The first power component rotates according to a set second number of revolutions, a second rotation speed, and a second direction, which in turn moves the ejector pin assembly from a second height position to a first height position, so as to place the semiconductor substrate on the placement position onto the marble platform, wherein the first direction and the second direction are opposite directions.

3. The positioning and lifting mechanism according to claim 2, characterized in that, include: The first position detector is used to detect the first height position of the ejector pin assembly and output the first height position signal to the outside. The second position detector is used to detect the second height position of the ejector pin assembly shown and output the second height position signal to the outside. A first driver is used to control the first power component; The first controller outputs control commands to the first driver based on the received first height position signal or second height position signal. The first driver controls the first power component to start or stop working based on the received control commands.

4. The positioning and lifting mechanism according to claim 1, characterized in that, The second power component rotates according to the set third number of revolutions, third speed and third direction, and the guide alignment component moves up from the third height position to the fourth height position. The guide alignment component guides the semiconductor substrate that has descended to the first height position to the adhesive application position on the marble platform at the fourth height position. The second power unit rotates according to the set fourth number of revolutions, fourth speed and fourth direction, and the guide alignment component moves down from the fourth height position to the third height position. The third height position is lower than the height of the applicator when applying glue in the horizontal direction. The third direction is the opposite of the fourth direction.

5. The alignment and lifting mechanism according to claim 4, characterized in that, include: The third position detector is used to detect the third height position of the guide alignment component and output the third height position signal. The fourth position detector is used to detect the fourth height position of the guide alignment component and output the fourth height position signal. The second driver is used to control the second power component; The second controller outputs control commands to the second driver based on the received third or fourth altitude position signal. The second driver then controls the second power unit to start or stop working based on the received control commands.

6. The positioning and lifting mechanism according to claim 1, characterized in that, The ejector pin assembly includes multiple rows of ejector pin modules arranged in parallel and spaced apart. Each row of ejector pin modules includes multiple ejector pin components arranged in sequence and spaced apart. Each ejector pin component includes an ejector pin, a sleeve screwed to the lower end of the ejector pin, and a positioning component that slides horizontally and is axially fixedly engaged with the sleeve.

7. The positioning and lifting mechanism according to claim 1, characterized in that, The guiding alignment component includes: A length-direction guiding and alignment component is used for guiding and aligning a semiconductor substrate along its length. Width-direction guiding and alignment components are used for guiding and aligning semiconductor substrates in the width direction. Both the length direction guiding alignment component and the width direction guiding alignment component include at least two rollers that are spaced apart. The space between the two rollers is used for guiding alignment of the semiconductor substrate in the length direction, and the space between the two rollers is used for guiding alignment of the semiconductor substrate in the width direction. When the guide alignment assembly is at the fourth height position, the horizontal diameter of each of the rollers is arranged at the same height as the adsorption surface of the marble platform.

8. The positioning and lifting mechanism according to claim 2, characterized in that, It includes a guide support component for limiting the vertical movement of the ejector pin assembly and the guide alignment assembly.

9. A positioning and lifting mechanism, characterized in that, include: A push pin assembly having a placement position formed on its top for placing a semiconductor substrate; A guide alignment component is mounted on the ejector pin assembly for guiding and aligning the semiconductor substrate; A first power unit is used to drive the ejector pin assembly and the guide alignment assembly to rise from a first height position to a second height position or to fall from a second height position to a first height position. The guide alignment assembly is used at the second height position to guide the semiconductor substrate transferred by the robot arm to a set position of the placement position. During the process of the ejector pin assembly falling from the second height position to the first height position, it is used to place the semiconductor substrate on the placement position on the adhesive application position of the marble platform. The first height position is lower than the height of the adhesive application blade in the horizontal direction.

10. An adhesive application system, characterized in that, The alignment and lifting mechanism according to any one of claims 1 to 9 further includes: Marble platform, used to place semiconductor substrates; The vacuum adsorption device is capable of generating a vacuum adsorption force to adsorb and fix the semiconductor substrate on the marble platform; A coating blade, configured to translate relative to the marble, is used to uniformly coat the semiconductor substrate with adhesive.

11. A positioning and lifting method, applied to the adhesive application system of claim 10, characterized in that, Includes the following steps: The drive pin assembly rises and moves from a first height position to a second height position, where the pin assembly at the second height position is used to enable the placement position to receive the semiconductor substrate transferred by the robot arm. The guide alignment component is driven to rise and move from a third height position to a fourth height position, wherein the fourth height position is at the same height as the first height position; When the drive pin assembly descends from the second height position to the first height position, the guide alignment assembly located at the fourth height position guides the semiconductor substrate at the first height position to the adhesive application position located on the marble platform; The guide alignment component is driven to descend and move from the fourth height position to the third height position. The third height position where the guide alignment component is located is lower than the height position of the applicator when applying adhesive in the horizontal direction.

12. A positioning and lifting method, applied to the adhesive application system of claim 10, characterized in that, Includes the following steps: The drive pin assembly and the guide alignment assembly can be moved up from the first height position to the second height position or down from the second height position to the first height position; In this process, the guide alignment component guides the semiconductor substrate transferred by the robot arm to a set position at the placement position at the second height position. During the process of the guide alignment component descending from the second height position to the first height position, the ejector pin component places the semiconductor substrate at the adhesive application position on the marble platform. The first height position is lower than the height of the adhesive application blade in the horizontal direction.

Images