Multi-station chip magnetic field testing device and testing method

Abstract

The multi-station chip magnetic field testing method comprises the steps that first positioning columns are inserted into corresponding positioning holes in a sorting machine so that the device can be installed on the sorting machine, and the sorting machine judges whether the device is installed in place on the sorting machine or not according to the contact conditions of a second signal contactor and a first signal contactor till the device is installed in place; a to-be-tested chip in a test head on the sorting machine is installed at the chip placement position, and pins on the two sides of the to-be-tested chip are in one-to-one contact with bottom pins of the two pin modules respectively. A PCB on the testing machine is positioned on the cover plate, so that the top ends of the double-end probes and the coil probes are respectively contacted with corresponding point positions on the PCB; when the power-on chip is tested, the to-be-tested chip, the pin module, the PCB circular plate, the double-end probe and the PCB are conducted in sequence, the PCB, the coil probe, the PCB multi-station plate and the magnetic field coil are conducted in sequence, a magnetic field is generated, and the testing machine judges whether the to-be-tested chip is a good product or not according to the comparison of the current obtained through testing and the preset current condition.

Description

Technical Field

[0001] This invention relates to the field of chip testing equipment technology, and in particular to a multi-station chip magnetic field testing device and testing method. Background Technology

[0002] Existing chip testing devices have the following drawbacks: they lack magnetic field coils, making it impossible to determine whether a chip is good or bad using specific testing procedures. Therefore, the inventors of this invention have designed a chip magnetic field environment testing device that allows the chip under test to contact the pins on the testing device. After the pins contact the PCB board of the testing machine, a signal is transmitted to the testing machine, which can measure the specific current value of the chip. This specific current value is then compared with a reference standard to determine whether the chip under test is good or bad. Summary of the Invention

[0003] This invention addresses the problems and shortcomings of existing technologies by providing a multi-station chip magnetic field testing device and method.

[0004] The present invention solves the above-mentioned technical problems through the following technical solution:

[0005] This invention provides a multi-station chip magnetic field testing device, characterized in that it includes a back plate, with first positioning posts fixed at the four corners of the back of the back plate, each corresponding to a positioning hole on a sorting machine; a first signal contactor corresponding to a second signal contactor on the sorting machine is also fixed on the back of the back plate; multiple station slots are provided on the back plate, and a centering clamp is fixed in each station slot; a cover plate is provided on the back plate, and multiple second positioning posts corresponding to positioning holes on the PCB board of the testing machine are fixed on the top of the cover plate.

[0006] Each centering clamp includes a centering clamp base, with a test head through hole at the center of the centering clamp base. Centering clamp heads are fixed on the top of the centering clamp base and on the side opposite to the test head through hole. Each centering clamp head has a limiting structure on the inner bottom side and a pin module positioned on the top. A module centering ring with two pressure holes is placed on the top of the two centering clamp heads. When the module centering ring is fixed on the two centering clamp heads, its two pressure holes press and sleeve the corresponding pin module to press the two pin modules tightly on the corresponding centering clamp heads. The top of the module centering ring is fixed from bottom to top with a PCB circular board that constitutes the plug assembly and a double-ended probe mounting base. The gap between the bottom pins of the two pin modules constitutes a chip placement position, and the top pins contact the corresponding points of the PCB circular board. Two double-ended probes corresponding to the pin modules are inserted through the double-ended probe mounting base, and the bottom ends of the double-ended probes contact the corresponding points of the PCB circular board.

[0007] The back plate is fixed with magnetic field coils that correspond one-to-one with the plug assembly and surround it, and a PCB multi-station board connected to each magnetic field coil. The top of the PCB multi-station board is fixed with a coil probe mounting base, and a coil probe is inserted through the coil probe mounting base. The bottom end of the coil probe contacts the corresponding point of the PCB multi-station board.

[0008] The device is mounted on the sorting machine via a first positioning post. The sorting machine determines whether the device is properly installed based on the contact between the second and first signal contactors. When the test head on the sorting machine passes through the test head hole and touches the limiting structure, the chip under test inside the test head is precisely placed in the chip placement position, and the pins on both sides of the chip under test contact the bottom pins of the two pin modules one by one. The cover plate positions the PCB board on the test machine via the second positioning post, so that the tops of the double-headed probe and the coil probe contact the corresponding points on the PCB board. When the chip is powered on for testing, the chip under test, the pin modules, the PCB round board, the double-headed probe, and the PCB board are sequentially connected and conductive. The PCB board, the coil probe, the PCB multi-station board, and the magnetic field coil are sequentially connected and conductive, generating a magnetic field. The test machine determines whether the chip under test is good or not by comparing the current obtained from the test with the preset current conditions.

[0009] This invention also provides a multi-station chip magnetic field testing method, characterized in that it utilizes the aforementioned multi-station chip magnetic field testing device, and the method includes the following steps:

[0010] Step 1: The first positioning pins are inserted into the corresponding positioning holes on the sorting machine, so that the device is installed on the sorting machine. The sorting machine determines whether the device is installed on the sorting machine according to the contact between the second signal contactor and the first signal contactor, until the device is installed on the sorting machine.

[0011] Step 2: The PCB board on the testing machine is positioned on the cover plate by the second positioning post, so that the tops of the double-headed probe and the coil probe respectively contact the corresponding points on the PCB board;

[0012] Step 3: The test head on the sorting machine is inserted through a test head hole. When the test head touches the limiting structure, the chip under test inside the test head is placed exactly in the chip placement position and the pins on both sides of the chip under test are respectively in contact with the bottom pins of the two pin modules.

[0013] Step 4: Power-on chip test. The chip under test, pin module, PCB round board, double-headed probe and PCB board are connected and conductive in sequence. The PCB board, coil probe, PCB multi-station board and magnetic field coil are connected and conductive in sequence to generate a magnetic field. The test machine determines whether the chip under test is good or not by comparing the current obtained by the test with the preset current conditions.

[0014] The positive and progressive effects of this invention are as follows:

[0015] This invention designs a multi-station chip magnetic field testing device. One station tests one chip under test, and multiple stations can test multiple chips under test at the same time. Each chip under test is placed on the chip placement position by the test head of the sorting machine and clamped on this device. The pins of the chip under test are fed back to the PCB board of the test machine through the pins that contact this device. The magnetic field coil of this device generates a magnetic field. The test machine determines whether the chip under test is good or bad by comparing the current obtained by the test with the preset current conditions. Attached Figure Description

[0016] Figure 1 This is a front perspective view of a multi-station chip magnetic field testing device according to a preferred embodiment of the present invention.

[0017] Figure 2 This is a rear perspective view of the multi-station chip magnetic field testing device according to a preferred embodiment of the present invention.

[0018] Figure 3-5 This is an internal perspective view of the multi-station chip magnetic field testing device according to a preferred embodiment of the present invention.

[0019] Figure 6 This is a front perspective view of the centering clamp and its mounting components, which are preferred embodiments of the present invention.

[0020] Figure 7 This is a perspective view of the back of the centering clamp and its mounting components, which is a preferred embodiment of the present invention.

[0021] Figure 8 This is a perspective view of the centering clamp and the pin module mounted on it, which is a preferred embodiment of the present invention.

[0022] Figure 9 This is a perspective view of the centering clamp according to a preferred embodiment of the present invention.

[0023] Figure 10 This is a perspective view of a coil probe mounting base according to a preferred embodiment of the present invention.

[0024] Figure 11 This is a perspective view of the pin module according to a preferred embodiment of the present invention.

[0025] Figure 12This is an exploded view of the pin module according to a preferred embodiment of the present invention.

[0026] Figure 13 This is a perspective view of the back plate of a preferred embodiment of the present invention.

[0027] Figure 14 This is a front perspective view of the air blowing plate according to a preferred embodiment of the present invention.

[0028] Figure 15 This is a perspective view of the back of the air blowing plate according to a preferred embodiment of the present invention. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] For ease of description, only the parts relevant to the present invention are shown in the accompanying drawings. The terms "first," "second," etc., used in this invention are merely for the convenience of describing the technical solutions of the invention and do not have a specific limiting effect; they are all general references and do not constitute a limitation on the technical solutions of the present invention. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. Terms indicating positional relationships, such as "middle," "horizontal," "vertical," "longitudinal," "front," "rear," "left," "right," "inner," and "outer," are based on the positional relationships shown in the illustrated drawings and do not imply that the components referred to must be presented in the described positional relationships, and do not constitute a limitation on the technical solutions of the present invention.

[0031] like Figure 1-15 As shown, this embodiment of the invention provides a multi-station chip magnetic field testing device, including a back plate 1. Four first positioning posts 11, corresponding one-to-one with corresponding positioning holes on a sorting machine, are fixed at the four corners of the back of the back plate 1. By inserting these four first positioning posts 11 into the corresponding positioning holes on the sorting machine, the device can be installed on the sorting machine, which is an existing device. Furthermore, each first positioning post 11 has a locking groove 111. By using the locking structure on the existing sorting machine to lock the locking groove 111, the device can be securely locked onto the sorting machine.

[0032] The back of the back plate 1 is also fixed with a signal contactor (as the first signal contactor 12) corresponding to the signal contactor (as the second signal contactor) on the sorting machine. When this device is installed on the sorting machine, if the first signal contactor 12 and the second signal contactor make good contact, a signal will be sent to the sorting machine, indicating that the device is installed correctly on the sorting machine. If the contact is poor, no signal will be sent to the sorting machine, indicating that the device is not installed correctly on the sorting machine. Based on this, the sorting machine can determine whether the device is installed correctly on the sorting machine.

[0033] The backplate 1 has multiple workstation slots 16, and a centering clip 2 is fixed in each workstation slot 16. In this embodiment, the backplate 1 has 8 workstation slots 16, arranged in 2 rows of 4 workstation slots 16 each. A centering clip 2 is fixed in each of the 8 workstation slots, and there are a total of 8 centering clips 2. Each centering clip 2 can position one chip under test, so this device can test 8 chips under test at a time.

[0034] Each centering clamp 2 includes a centering clamp base 21, a test head through hole 22 for the test head of the sorting machine to pass through at the middle position of the centering clamp base 21, a centering clamp head 23 is fixed on the top of the centering clamp base 21 and on the opposite side of the test head through hole 22, and a limiting structure 24 for limiting the test head is provided on the bottom inner side of each centering clamp head 23.

[0035] Each centering clamp base 21 has a clamping groove 211 on its back. An air blowing plate 10 is fixed in the clamping groove 211. The air blowing plate 10 includes a C-shaped air blowing plate 101 and an L-shaped air blowing plate 102. The vertical bottom end of the L-shaped air blowing plate 102 is fixed at the top middle position of the C-shaped air blowing plate 101, and the horizontal top end is located exactly at the top edge of the clamping groove 211 and is fixed with an air blowing nozzle 103 for docking with the air filling nozzle on the sorting machine. The two ends of the C-shaped air blowing plate 101 are respectively located at the measuring... On both sides of the bottom of the test head perforation 22, the bottom of the L-shaped air blowing plate 102 is provided with a longitudinal air vent 1021, and the bottom of the C-shaped air blowing plate 101 is provided with a C-shaped air vent 1011. The air blowing nozzle 103, the longitudinal air vent 1021 and the C-shaped air vent 1011 are connected in sequence. Each centering chuck 23 is provided with a vertical air vent that is connected to the end of the C-shaped air vent 1011 and an oblique air guide hole 231 that is connected to the vertical air vent. The oblique air guide hole 231 faces the chip placement position.

[0036] In this embodiment, the air inlet of the sorting machine provides gas, which flows sequentially through the air inlet 103, the longitudinal air hole 1021, the C-shaped air hole 1011, the vertical air hole and the oblique air guide hole 231, and then blows onto the chip under test 100 at the chip placement position.

[0037] Each centering chuck 23 has a pin module 3 positioned on its top. The top of each of the two centering chucks 23 has a module centering ring 4 with two pressing holes (the shape of the pressing holes matches the outer shape of the pin module). The module centering ring 4 is fixed on the two centering chucks 23. When the module centering ring 4 is fixed on the two centering chucks 23, its two pressing holes press against the corresponding pin module 3, thereby pressing the two pin modules 3 tightly onto the corresponding centering chucks 23.

[0038] The specific structure of the pin module 3 is as follows: each pin module 3 includes a pin cover plate 31, a pin mounting base 32, a pin group including a first group of pins 33 and a second group of pins 34, a pin partition plate 35, and a pin latching base 36. The number of the first group of pins 33 and the second group of pins 34 is the same as the number of pins on one side of the chip under test 100. The pins in the first group of pins 33 and the pins in the second group of pins 34 are configured one-to-one. Each pin in the first group of pins 33 and the second group of pins 34 is a U-shaped pin lying on its side. The top end of the U-shape extends vertically upward to form a top pin, and the bottom end of the U-shape extends vertically downward to form a bottom pin. The pin mounting base 32 is provided with a first pin mounting groove 321 that corresponds one-to-one with the first group of pins 33. The outer side of the pin partition plate 35 is provided with a second pin mounting groove 351 that matches the first pin mounting groove 321. Both the first pin mounting groove 321 and the second pin mounting groove 351 are U-shaped pins lying on their side.

[0039] The specific assembly relationship of the pin module 3 is as follows: the first pin mounting slots 321 are equipped with a first group of pins 33, such that the top pins of the first group of pins 33 extend vertically upward and are arranged side by side, and the bottom pins extend vertically downward and are arranged side by side. The pin partition 35 is inserted into the first pin mounting slots 321 and is located on the outer layer of the first group of pins 33. The second pin mounting slots 351 are equipped with a second group of pins 34, such that the top pins of the second group of pins 34 extend vertically upward and are arranged side by side, and the bottom pins extend vertically downward and are arranged side by side. The pin cover plate 31 is installed on the top of the pin mounting base 32 and has holes 311 for the two rows of top pins to pass through. The pin buckle seat 36 is fastened to the side of the pin mounting base 32 to press down the second group of pins 34.

[0040] Furthermore, the bottom surface of the pin mounting base 32 is provided with multiple first pin holes, and the top of the centering chuck 23 is provided with second pin holes 232 that correspond one-to-one with the first pin holes. The first pin holes and the corresponding second pin holes are fixed by positioning pins, so that the top of the centering chuck 23 is positioned with the corresponding pin module 3.

[0041] In this embodiment, two sets of pins (a first set of pins 33 and a second set of pins 34) are provided. The top pins of both sets of pins are connected to corresponding points on the PCB circular board 5, and the bottom pins of both sets of pins are connected to corresponding side pins of the chip under test 100. The bottom of a certain pin in the first set of pins 33 and the bottom of a corresponding pin in the second set of pins 34 are both connected to the corresponding side of the same chip in the chip under test 100. Using two sets of pins can better ensure that the chip under test 100 is in contact with the pins.

[0042] The top of the module centering ring 4 is fixed from bottom to top with the PCB circular plate 5, which constitutes the plug assembly, and the dual-headed probe mounting base 6. The gap between the bottom pins of the two pin modules 3 forms a chip placement position for placing the chip under test 100. Specifically, the bottom pins of the first group of pins 33 and the second group of pins 34 are in contact with the corresponding side pins of the chip under test 100. The top pins of the two pin modules 3 are in contact with the corresponding points on the PCB circular plate 5. The top pins of the first group of pins 33 and the second group of pins 34 are in contact with the corresponding points on the PCB circular plate 5. Two dual-headed probes 7 corresponding to the pin modules 3 are mounted on the dual-headed probe mounting base 6. The bottom of the dual-headed probes 7 is in contact with the corresponding points on the PCB circular plate 5, and the top is used to contact the corresponding points on the PCB board of the testing machine. This forms a sequential contact and connection relationship between the PCB board of the testing machine, the dual-headed probes 7, the PCB circular plate 5, the two pin modules 3, and the chip under test 100.

[0043] The dual-headed probe mounting base 6 includes a dual-headed probe mounting base 61 and a dual-headed probe mounting cover 62. The dual-headed probe mounting base 61 is fixed to the top of the PCB circular board 5. The top of the dual-headed probe mounting base 61 is covered by the dual-headed probe mounting cover 62. The dual-headed probe 7 passes through the dual-headed probe mounting cover 62 and the dual-headed probe mounting base 61. A non-magnetic stainless steel positioning pin 621 is installed on the top of the dual-headed probe mounting cover 62.

[0044] A surrounding panel 13 is fixed around the perimeter of the back panel 1. The top edge of the back panel 1 is flush with the top of the surrounding panel 13. The back panel 1 and the surrounding panel 13 together form the base plane of this device. Air guide plates 8 are fixed to the top of the front and rear sides of the surrounding panel 13. Air connectors 81 for connecting to external gas cylinders are fixed to the sides of the air guide plates 8. Multiple air guide holes 82 connected to the air connectors 81 are opened on the air guide plates 8. Protective plates 9 are fixed to the top of the left and right sides of the surrounding panel 13. The tops of the air guide plates 8 and the protective plates 9 are flush. The air guide plates 8 and the protective plates 9 together form the middle frame of this device.

[0045] The back plate 1 is provided with magnetic field coils 20 that correspond one-to-one with the plug assembly and surround the plug assembly. The back plate 1 is fixed with coil limiting blocks 14 around each work station slot. The coil limiting blocks 14 limit and fix the corresponding magnetic field coils 20. The top of these coil limiting blocks 14 is covered with heat insulation cotton 30 to avoid the magnetic field coils 20.

[0046] A vent plate 40 is fixed to the top of the air guide plate 8 and the protective plate 9, avoiding the magnetic field coil 20. The vent plate 40 is located above the insulation cotton 30. The vent plate 40 has multiple vent holes 401 that communicate with the air guide holes 82. A PCB multi-station board 50 connected to each magnetic field coil 20 is fixed to the vent plate 40. A coil probe mounting seat 60 is fixed to the top of the PCB multi-station board 50. A coil probe 70 is inserted through the coil probe mounting seat 60. The bottom end of the coil probe 70 contacts the corresponding point of the PCB multi-station board 50, and the top end contacts the corresponding point of the PCB board of the testing machine. This forms a contact connection between the PCB board of the testing machine, the coil probe 70, the PCB multi-station board 50, and the magnetic field coil 20. In addition, an O-ring sealing strip 41 is fixed to the inner edge of the vent plate 40. The O-ring sealing strip 41 avoids the vent holes 401, and the vent plate 40 and the magnetic field coil 20 are sealed by an O-ring sealing ring 42.

[0047] The coil probe mounting base 60 includes a coil probe mounting base 601 and a coil probe mounting cover 602. The coil probe mounting base 601 is fixed to the top of the PCB multi-station board 50. The top of the coil probe mounting base 601 is covered with the coil probe mounting cover 602. The coil probe 70 passes through the coil probe mounting cover 602 and the coil probe mounting base 601.

[0048] The vent plate 40 is covered with a cover plate 80. The top left and right sides of the cover plate 80 are respectively fixed with second positioning pins 801 that correspond one-to-one with the positioning holes on the PCB of the testing machine. A double-headed probe 7 protrudes from the cover plate 80, a coil probe 70 protrudes from the cover plate, and a non-magnetic stainless steel positioning pin 621 protrudes from the cover plate 80 for insertion into the corresponding positioning holes on the PCB. Furthermore, multiple positioning studs 15 are fixed around the front perimeter of the back plate 1. These positioning studs 15 pass through the vent plate 40 and the cover plate 80 in sequence, and are also used to position the corresponding positioning holes on the PCB.

[0049] In this embodiment, the second positioning post 801, the positioning stud 15, and the non-magnetic stainless steel positioning pin 621 are all used to install the PCB board of the positioning tester. When the PCB board of the positioning tester is installed, the double-headed probe 7 and the coil probe 70 respectively contact the corresponding points of the PCB board of the tester.

[0050] In this embodiment of the invention, the device is installed on a sorting machine via a first positioning post 11. The sorting machine is used to determine whether the device is properly installed on the sorting machine based on the contact between the second signal contactor and the first signal contactor 12. When the test head on the sorting machine passes through the test head hole 22 and touches the limiting structure 24, the chip under test 100 inside the test head is exactly placed in the chip placement position, and the pins on both sides of the chip under test are in contact with the bottom pins of the two pin modules 3. The cover plate 80 positions the PCB board on the test machine via the second positioning post 801, so that the tops of the double-headed probe 7 and the coil probe 8 are in contact with the corresponding points on the PCB board. When the chip is powered on for testing, the chip under test 100, the pin module 3, the PCB round plate 5, the double-headed probe 7 and the PCB board are connected and conductive in sequence. The PCB board, the coil probe 8, the PCB multi-station board 50 and the magnetic field coil 20 are connected and conductive in sequence to generate a magnetic field. The test machine is used to determine whether the chip under test 100 is a good product by comparing the current obtained by the test with the preset current conditions.

[0051] This invention also provides a multi-station chip magnetic field testing method, which utilizes the aforementioned multi-station chip magnetic field testing device. The method includes the following steps:

[0052] Step 1: The first positioning pin 11 is inserted into the corresponding positioning hole on the sorting machine so that the device is installed on the sorting machine. The sorting machine determines whether the device is installed on the sorting machine according to the contact between the second signal contactor and the first signal contactor 12 until the device is installed on the sorting machine.

[0053] Step 2: The PCB board on the testing machine is mounted and positioned on the cover plate 80 by means of the second positioning post 801, so that the tops of the double-headed probe 7 and the coil probe 8 are in contact with the corresponding points on the PCB board on the testing machine.

[0054] Step 3: The test head on the sorting machine passes through the test head hole 22. When the test head touches the limiting structure 24, the chip under test 100 inside the test head is exactly placed in the chip placement position, and the pins on both sides of the chip under test 100 contact and abut with the bottom pins of the two pin modules 3 one by one.

[0055] Step 4: Power-on chip test. The chip under test 100, pin module 3, PCB round board 5, double-headed probe 7 and the PCB board on the test machine are connected and made conductive in sequence. The PCB board on the test machine, coil probe 8, PCB multi-station board 50 and magnetic field coil 20 are connected and made conductive in sequence to generate a magnetic field. The test machine determines whether the chip under test 100 is good or not by comparing the current obtained by the test with the preset current conditions.

[0056] In this embodiment, the sorting machine can provide a variety of testing environments, such as normal temperature testing environment, high temperature testing environment and low temperature testing environment.

[0057] Normal temperature testing environment: The air inlet of the sorting machine does not supply gas. The chip under test 100 is in a normal temperature testing environment. When powered on in a normal temperature testing environment, a magnetic field is generated. The testing machine determines whether the chip under test 100 is good or not by comparing the current obtained by the test with the preset current conditions.

[0058] High-temperature testing environment: The air supply nozzle of the sorting machine provides gas, which is heated compressed air. The heated compressed air flows sequentially through the air nozzle 103, the longitudinal vent 1021, the C-shaped vent 1011, the vertical vent, and the oblique guide hole 231 before being blown onto the chip under test 100 at the chip placement position. This places the chip under test 100 in a high-temperature testing environment. When powered on under high-temperature testing conditions, a magnetic field is generated. The testing machine determines whether the chip under test 100 is a good product by comparing the current obtained during the test with the preset current conditions. In order to maintain a dry, room-temperature environment inside the cover plate, during the test, dry, room-temperature air from an external gas cylinder flows into the inside of the cover plate sequentially through the air connector 81, the guide hole 82, and the vent 401.

[0059] Low-temperature testing environment: The gas supply nozzle of the sorting machine provides gas, which is liquid nitrogen evaporated from liquid to gaseous state by an evaporator. The gaseous nitrogen flows sequentially through the air nozzle 103, the longitudinal vent 1021, the C-shaped vent 1011, the vertical vent, and the oblique guide hole 231 before being blown onto the chip under test 100 at the chip placement position, thus placing the chip under test 100 in a low-temperature testing environment. Power is applied under this environment, generating a magnetic field. The testing machine compares the current obtained during the test with the preset current conditions to determine whether the chip under test 100 is a good product. To ensure a dry, room-temperature environment inside the cover plate, during the test, dry, room-temperature air from an external gas cylinder flows into the inside of the cover plate sequentially through the air connector 81, the guide hole 82, and the vent 401.

[0060] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. A multi-station chip magnetic field testing device, characterized in that, The back plate includes a back plate, and each of the four corners of the back of the back plate is fixed with a first positioning post corresponding to a positioning hole on the sorting machine. The back of the back plate is also fixed with a first signal contactor corresponding to a second signal contactor on the sorting machine. The back plate has multiple work station slots, and each work station slot is fixed with a centering clamp. The back plate is covered with a cover plate, and the top of the cover plate is fixed with multiple second positioning posts corresponding to positioning holes on the PCB board of the testing machine. Each centering clamp includes a centering clamp base, with a test head through hole at the center of the centering clamp base. Centering clamp heads are fixed on the top of the centering clamp base and on the side opposite to the test head through hole. Each centering clamp head has a limiting structure on the inner bottom side and a pin module positioned on the top. A module centering ring with two pressure holes is placed on the top of the two centering clamp heads. When the module centering ring is fixed on the two centering clamp heads, its two pressure holes press and sleeve the corresponding pin module to press the two pin modules tightly on the corresponding centering clamp heads. The top of the module centering ring is fixed from bottom to top with a PCB circular board that constitutes the plug assembly and a double-ended probe mounting base. The gap between the bottom pins of the two pin modules constitutes a chip placement position, and the top pins contact the corresponding points of the PCB circular board. Two double-ended probes corresponding to the pin modules are inserted through the double-ended probe mounting base, and the bottom ends of the double-ended probes contact the corresponding points of the PCB circular board. The back plate is fixed with magnetic field coils that correspond one-to-one with the plug assembly and surround it, and a PCB multi-station board connected to each magnetic field coil. The top of the PCB multi-station board is fixed with a coil probe mounting base, and a coil probe is inserted through the coil probe mounting base. The bottom end of the coil probe contacts the corresponding point of the PCB multi-station board. The device is mounted on the sorting machine via a first positioning post. The sorting machine determines whether the device is properly installed based on the contact between the second and first signal contactors. When the test head on the sorting machine passes through the test head hole and touches the limiting structure, the chip under test inside the test head is precisely placed in the chip placement position, and the pins on both sides of the chip under test contact the bottom pins of the two pin modules one by one. The cover plate positions the PCB board on the test machine via the second positioning post, so that the tops of the double-headed probe and the coil probe contact the corresponding points on the PCB board. When the chip is powered on for testing, the chip under test, the pin modules, the PCB round board, the double-headed probe, and the PCB board are sequentially connected and conductive. The PCB board, the coil probe, the PCB multi-station board, and the magnetic field coil are sequentially connected and conductive, generating a magnetic field. The test machine determines whether the chip under test is good or not by comparing the current obtained from the test with the preset current conditions.

2. The multi-station chip magnetic field testing device as described in claim 1, characterized in that, Each of the centering clamp bases has a clamping groove on its back. An air blowing plate is fixed in the clamping groove. The air blowing plate includes a C-shaped air blowing plate and an L-shaped air blowing plate. One end of the L-shaped air blowing plate is fixed at the top middle position of the C-shaped air blowing plate, and the top of the other end is exactly located at the top edge of the clamping groove and is fixed with an air blowing nozzle for docking with the air filling nozzle on the sorting machine. The two ends of the C-shaped air blowing plate are respectively located on both sides of the test head through hole. The bottom of the L-shaped air blowing plate has a longitudinal air vent, and the bottom of the C-shaped air blowing plate has a C-shaped air vent. The air blowing nozzle, the longitudinal air vent, and the C-shaped air vent are connected in sequence. Each of the centering clamps is provided with a vertical vent hole that is connected to the end corresponding to the C-shaped vent hole and an oblique vent hole that is connected to the vertical vent hole. The oblique vent hole faces the chip placement position.

3. The multi-station chip magnetic field testing device as described in claim 1, characterized in that, Each pin module includes a pin cover, a pin mounting base, a pin group, a pin partition, and a pin latch. The pin group includes a first group of pins and a second group of pins. The number of the first group of pins and the second group of pins are the same as the number of pins on one side of the chip under test. The pin mounting base has first pin mounting slots corresponding to the first group of pins. The first group of pins is installed in these first pin mounting slots such that the top pins of the first group of pins extend vertically upward and are arranged side by side, and the bottom pins extend vertically downward and are arranged side by side. The pin partition is inserted into the first pin mounting slots and is located on the outer layer of the first group of pins. The pin partition has second pin mounting slots that match the first pin mounting slots. The second group of pins is installed in these second pin mounting slots such that the top pins of the second group of pins extend vertically upward and are arranged side by side, and the bottom pins extend vertically downward and are arranged side by side. The pin cover is installed on the top of the pin mounting base and has holes for the two rows of top pins to pass through. The pin buckle is fastened to the side of the pin mounting base to press down the second group of pins. The top pins of the first group of pins and the second group of pins are connected to the corresponding points on the PCB circular board, and the bottom pins of the first group of pins and the second group of pins are connected to the corresponding side pins of the chip under test.

4. The multi-station chip magnetic field testing device as described in claim 3, characterized in that, The first pin mounting slot and the second pin mounting slot are U-shaped and lying on their sides. Each pin in the first group of pins and the second group of pins is U-shaped and lying on its side. The top end of the U-shape extends vertically upward to form a top pin and the bottom end of the U-shape extends vertically downward to form a bottom pin. The bottom surface of the pin mounting base is provided with a plurality of first pin holes, and the top of the centering chuck is provided with second pin holes that correspond one-to-one with the first pin holes. The first pin holes and the corresponding second pin holes are fixed by positioning pins, so that the top of the centering chuck is positioned with the corresponding pin module.

5. The multi-station chip magnetic field testing device as described in claim 1, characterized in that, A surrounding panel is fixed around the back plate, and the top edge of the back plate is flush with the top edge of the surrounding panel. Air guide plates are fixed to the top of the front and rear sides of the enclosure, and air connectors for connecting to external gas cylinders are fixed to the sides of the air guide plates. Multiple air guide holes connected to the air connectors are opened on the air guide plates. Protective plates are fixed to the top of the left and right sides of the enclosure, and the tops of the air guide plates and the protective plates are flush. The top of the air guide plate and the protective plate is fixed with a vent plate that avoids the magnetic field coil. The vent plate has multiple vent holes that are connected to the air guide holes. The vent plate is fixed with a PCB multi-station board that is connected to each magnetic field coil. The vent plate is covered with a cover plate.

6. The multi-station chip magnetic field testing device as described in claim 5, characterized in that, An O-ring sealing strip is fixed to the inner edge of the vent plate, and the O-ring sealing strip avoids the vent hole; The ventilation plate and the magnetic field coil are sealed by an O-ring.

7. The multi-station chip magnetic field testing device as described in claim 5, characterized in that, Multiple positioning studs are fixed around the front of the back plate. These positioning studs pass through the vent plate and the cover plate in sequence to position the corresponding positioning holes on the PCB board.

8. The multi-station chip magnetic field testing device as described in claim 1, characterized in that, The dual-headed probe mounting base includes a dual-headed probe mounting base and a dual-headed probe mounting cover. The dual-headed probe mounting base is fixed to the top of the PCB circular board, and the dual-headed probe mounting cover is provided on the top of the dual-headed probe mounting base. The dual-headed probe passes through the dual-headed probe mounting cover and the dual-headed probe mounting base, and the dual-headed probe protrudes from the cover. A non-magnetic positioning pin is installed on the top of the dual-headed probe mounting cover. The non-magnetic positioning pin protrudes from the cover and is used to insert into the corresponding positioning hole on the PCB.

9. The multi-station chip magnetic field testing device as described in claim 1, characterized in that, The coil probe mounting base includes a coil probe mounting base and a coil probe mounting cover. The coil probe mounting base is fixed to the top of the PCB multi-station board. The top of the coil probe mounting base is covered with the coil probe mounting cover. The coil probe passes through the coil probe mounting cover and the coil probe mounting base, and the coil probe protrudes from the cover.

10. The multi-station chip magnetic field testing device as described in claim 1, characterized in that, The back plate is fixed with coil limiting blocks around each workstation slot. The coil limiting blocks limit and fix the corresponding magnetic field coil. Insulation cotton is laid above these coil limiting blocks to avoid the magnetic field coil. The ventilation plate is located above the insulation cotton.

11. A method for testing the magnetic field of a multi-station chip, characterized in that, It is implemented using the multi-station chip magnetic field testing device according to any one of claims 1-10, and the method includes the following steps: Step 1: The first positioning pins are inserted into the corresponding positioning holes on the sorting machine, so that the device is installed on the sorting machine. The sorting machine determines whether the device is installed on the sorting machine according to the contact between the second signal contactor and the first signal contactor, until the device is installed on the sorting machine. Step 2: The PCB board on the testing machine is positioned on the cover plate by the second positioning post, so that the tops of the double-headed probe and the coil probe respectively contact the corresponding points on the PCB board; Step 3: The test head on the sorting machine is inserted through a test head hole. When the test head touches the limiting structure, the chip under test inside the test head is placed exactly in the chip placement position and the pins on both sides of the chip under test are respectively in contact with the bottom pins of the two pin modules. Step 4: Power-on chip test. The chip under test, pin module, PCB round board, double-headed probe and PCB board are connected and conductive in sequence. The PCB board, coil probe, PCB multi-station board and magnetic field coil are connected and conductive in sequence to generate a magnetic field. The test machine determines whether the chip under test is good or not by comparing the current obtained by the test with the preset current conditions.

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