Electronic equipment processing protection device and method

Abstract

The invention provides an electronic equipment processing protection device and method. The device comprises a positioning mechanism, a shielding mechanism and a guiding mechanism; the shielding mechanism comprises a cover plate, a carrying frame and a transferring mechanism, the cover plate is arranged on the carrying frame, the carrying frame is connected with the transferring mechanism, and the cover plate is provided with a notch communicating with the lower machining area; the guide mechanism comprises a controller and a detection device, the controller is in communication connection with the detection device and the transfer mechanism, the detection device is used for detecting the projection position of the notch on the electronic equipment, and the controller guides the movement of the transfer mechanism according to the detection value of the detection device, so that the notch is matched with the machining area. According to the protection device, the gap between the cover plate and the electronic equipment is remarkably reduced or eliminated, the reject ratio of products is reduced, the positioning precision and the machining consistency are improved, manual intervention is reduced, and the requirement for batch automatic production is met. In addition, the method can adapt to electronic equipment with different sizes, shapes and processing area distribution.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device processing protection, and in particular to an electronic device processing protection device and method. BACKGROUND

[0002] With the increasing requirements of notebook computers, tablets and other mobile terminal products on screen appearance and touch feeling, the multi-layer functional films such as fingerprint-resistant films and anti-glare films on the screen surface often need to be reliably shielded and protected during local partial etching, plasma cleaning or surface modification treatment after production, so as to avoid damage caused by plasma or sputtering substances.

[0003] A commonly used shielding and protecting method in the market is to cover a metal cover plate above the shielding area of the device to be processed. A cleaning gap or through hole is usually reserved on the cover plate to facilitate the application of process gas and energy to the treated area. However, the existing shielding cover plate is usually covered with a single metal cover plate on the shielding area of the device. The opening and closing, positioning and taking and placing of the cover plate usually rely on manual operation or simple mechanical positioning. Manual intervention leads to poor operation consistency, low positioning accuracy, and limited production line automation and capacity improvement. Moreover, due to the gap between the cover plate and the screen body or the incomplete fit of the mating surface, plasma and active particles can easily enter the space between the cover plate and the TP screen through the gap during atmospheric plasma treatment, causing shielding failure. The invasion of plasma or reaction products into the non-treatment area can damage the AF (anti-fingerprint) film and other functional film layers, causing surface defects and increasing the product failure rate.

[0004] In addition, the increasing number of product models and different specifications in the market have put forward higher requirements for the versatility and flexibility of production equipment. The existing fixed or manual shielding cover plate mechanism needs to be frequently replaced or manually adjusted when facing different sizes, shapes and processing area configurations of screens, which is low in efficiency, high in cost and prone to cause clamping errors. SUMMARY

[0005] The purpose of the present application is to provide an electronic device processing protection device and method that can support automated multi-degree-of-freedom positioning and automatically align the shielding cover plate with the processed area.

[0006] In order to achieve the above-mentioned purpose, the present application provides an electronic device processing protection device, which comprises: a positioning mechanism for placing an electronic device to be processed; The shielding mechanism comprises a cover plate, a carrier and a moving mechanism, the cover plate is arranged on the carrier, and the carrier is connected with the moving mechanism; the moving mechanism is used to drive the carrier to move in multiple degrees of freedom, so that the cover plate covers one side of a processing area of an electronic device to be processed, and the cover plate is provided with a slot communicating with the processing area below, which provides a channel for an operating object applied to the processing area; The guiding mechanism comprises a controller and a detection device, the controller is communicatively connected with the detection device and the moving mechanism, the detection device is used to detect a projection position of the slot on the electronic device, and the controller guides the action of the moving mechanism according to a detection value of the detection device, so that the slot matches the processing area.

[0007] Preferably, the positioning mechanism is provided with a set of shielding mechanisms on opposite sides, respectively, and the cover plates of the two shielding mechanisms are arranged on the two sides of the periphery of the electronic device, respectively.

[0008] Preferably, the detection device comprises a camera, the controller calculates a position difference between a projection point of the slot on the electronic device and the processing area according to an image of the slot and the electronic device captured by the camera, and controls the action of the moving mechanism based on the position difference.

[0009] Preferably, the camera is arranged above the positioning mechanism.

[0010] Preferably, the moving mechanism comprises a first linear driver, a second linear driver and a third linear driver, the second linear driver is slidingly connected with the first linear driver, the third linear driver is slidingly connected with the second linear driver, and the carrier is connected with the third linear driver; the linear driver is used to drive the second linear driver, the third linear driver and the carrier to move along a first axis, the second linear driver is used to drive the third linear driver and the carrier to move along a second axis, and the third linear driver is used to drive the carrier to move along a third axis.

[0011] Preferably, the carrier is further provided with a pressure detection mechanism for detecting a pressure applied by the cover plate to the electronic device, and the moving mechanism is used to adjust the pressure applied by the cover plate to the electronic device according to a detection value of the pressure detection mechanism.

[0012] Preferably, the pressure detection mechanism comprises a pressure sensor and a supporting plate, the supporting plate comprises a connecting part and a supporting part, the connecting part is fixedly connected with the pressure sensor, and the supporting part is used to support the cover plate; the pressure sensor is a tension and compression bidirectional pressure sensor.

[0013] Preferably, vertical sliding rails are arranged on the carrier, and the cover plate is connected to the sliding rails through sliding blocks.

[0014] The application also provides a protection method for processing electronic devices, which comprises a positioning mechanism, a shielding mechanism and a guiding mechanism. The shielding mechanism comprises a cover plate, a carrier and a transfer mechanism, the cover plate is arranged on the carrier, and the carrier is connected to the transfer mechanism; the transfer mechanism is used to drive the carrier to move in multiple degrees of freedom, and the cover plate has a slot. The guiding mechanism comprises a controller and a detection device, and the controller is connected to the detection device and the transfer mechanism. The protection method comprises the following steps: The positioning mechanism receives and fixes the electronic device to be processed. The transfer mechanism is controlled to drive the cover plate to move above the electronic device. The controller receives the projection position of the slot on the electronic device detected by the detection device, and calculates the deviation data of the slot and the processing area of the electronic device according to the projection position. The controller adjusts the horizontal movement of the transfer mechanism according to the deviation data, so that the projection position of the slot on the electronic device is opposite to the processing area. The controller controls the vertical movement of the transfer mechanism, so that the cover plate covers one side of the processing area of the electronic device. The processing area of the electronic device is processed through the slot.

[0015] Preferably, the method for processing the processing area of the electronic device comprises the following steps: The slot projects plasma to the processing area of the electronic device to clean the residues on the surface of the processing area.

[0016] Compared with the prior art, the protection device provided by the above technical solution of the application can drive the carrier to move in multiple degrees of freedom through the transfer mechanism, so that the cover plate can be closely attached to the non-processing area of the electronic device to be processed, the gap between the cover plate and the electronic device (screen body) is significantly reduced or eliminated, the invasion of plasma, reactants or sputtering particles into the non-processing area is effectively prevented, the functional film layer is prevented from being damaged, and the product failure rate is reduced.

[0017] Secondly, the detection device detects the projection position of the slot on the electronic device in real time, and the controller automatically adjusts the action of the transfer mechanism according to the detection value, so as to achieve precise automatic alignment of the processing area, improve positioning accuracy and processing consistency, reduce manual intervention, and meet the needs of mass automated production.

[0018] Furthermore, the combination of the detection device and the controller enables the aforementioned protective device to adapt to electronic devices of different sizes, shapes, and processing area distributions, achieving high versatility and flexible production of the equipment. This eliminates the need for frequent fixture changes or manual adjustments, shortens changeover time, and reduces production costs. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present invention.

[0020] Figure 2 for Figure 1 Top view.

[0021] Figure 3 for Figure 1 A three-dimensional structural diagram of one of the shielding mechanisms.

[0022] Figure 4 This is a structural diagram showing the connection between the carrier and the cover plate in an embodiment of the present invention.

[0023] Figure 5 for Figure 4 Floor plan.

[0024] Figure 6 This is a control principle diagram in an embodiment of the present invention. Detailed Implementation

[0025] To illustrate the technical content, structural features, objectives, and effects of the present invention in detail, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0026] This embodiment discloses a protective device for electronic device processing. Taking the plasma-based process for removing plating from a laptop screen as an example, this protective device can prevent plasma from damaging the surface of non-processed areas.

[0027] like Figures 1 to 6 The protective device includes a positioning mechanism, a shielding mechanism 200, and a guiding mechanism.

[0028] The positioning mechanism (not shown in the figure) is used to place the electronic device to be processed, ensuring that the electronic device is fixed in position during the processing.

[0029] For the shielding mechanism 200, it includes a cover plate 210, a carrier 220, and a transfer mechanism 230, the cover plate 210 is arranged on the carrier 220, and the carrier 220 is connected with the transfer mechanism 230. The transfer mechanism 230 is used to drive the carrier 220 to move in multiple degrees of freedom, so that the cover plate 210 covers one side of the processing area of the electronic device to be processed, and the cover plate 210 has a slot 211 communicating with the processing area below, which provides a passage for the operation object applied to the processing area.

[0030] For the guiding mechanism, it includes a controller 310 and a detection device 300, the controller 310 is communicatively connected with the detection device 300 and the transfer mechanism 230, the detection device 300 is used to detect the projection position of the slot 211 on the electronic device, and the controller 310 guides the action of the transfer mechanism 230 according to the detection value of the detection device 300, so that the slot 211 matches the processing area.

[0031] The present application significantly improves the precision and efficiency of electronic device processing protection by introducing a shielding mechanism 200 with multiple degrees of freedom and a guiding mechanism based on detection. First, the multiple degrees of freedom of the transfer mechanism 230 enables the cover plate 210 to accurately cover one side of the processing area of electronic devices of different sizes and shapes, and ensures the accurate matching of the slot 211 and the processing area, effectively solving the problems of poor consistency and low positioning accuracy caused by manual operation in the prior art.

[0032] Secondly, the slot 211 formed on the cover plate 210 provides a stable passage for processing operations, while effectively preventing plasma or active particles from invading the non-processing area through the gap, thereby greatly reducing the product failure rate and protecting the functional film layers such as AF film.

[0033] Furthermore, the device also has high universality and can adapt to the increasing number of product models with different specifications in the market. When the product model changes, it is not necessary to frequently replace the clamp or manually adjust, but only to adjust the position of the cover plate 210 through the guiding mechanism, thereby reducing the production cost and clamping error.

[0034] Specifically, the positioning mechanism can use a vacuum adsorption table or a mechanical clamp to fix the electronic device to adapt to devices of different materials and shapes.

[0035] The cover plate 210 of the shielding mechanism 200 can be made of various corrosion-resistant and high-temperature-resistant materials, such as Teflon-coated metal, ceramic or high-performance composite materials, to meet the needs of different processing media (such as plasma, chemical solution). The shape and size of the slot 211 can be customized according to the specific processing area, such as rectangular, circular or irregular, to maximize the protection effect and optimize the operation passage.

[0036] In addition to the linear drive, the transfer mechanism 230 can also use a multi-axis robot arm, a parallel mechanism or a hybrid mechanism to achieve multi-degree-of-freedom movement, providing higher motion accuracy and flexibility.

[0037] On the other hand, as Figure 1 And Figure 2 The opposite sides of the positioning mechanism are respectively provided with a set of shielding mechanisms 200, and the cover plates 210 in the two shielding mechanisms 200 are respectively arranged opposite the cover on the two sides of the periphery of the electronic device.

[0038] When the electronic device is placed on the positioning mechanism, the transfer mechanisms 230 on both sides will drive the respective carriages 220 and cover plates 210 according to the preset program or the feedback of the detection device 300, so that they move above the processing areas on both sides of the electronic device. The two cover plates 210 will be arranged opposite each other on the two sides of the periphery of the electronic device, for example, if the electronic device is a tablet computer, the edges on both sides of the screen may need to be plasma cleaned, at which time the cover plates 210 of the two sets of shielding mechanisms 200 will simultaneously align and cover the corresponding processing areas from the left and right sides. This design allows multiple processing areas of the electronic device to be protected synchronously or quickly and continuously, greatly improving production efficiency. The controller 310 can coordinate the control of the two sets of shielding mechanisms 200 to ensure their synchronization, avoid collisions, and achieve precise matching of the respective notches 211 with the corresponding processing areas.

[0039] This double-sided protection design allows the electronic device to complete multi-area processing without flipping or repositioning, thereby reducing the number of operation steps and reducing human error and equipment wear and tear. At the same time, the two independent shielding mechanisms 200 can provide more flexible configuration to adapt to electronic devices of different sizes and shapes, as well as processing areas distributed in different positions. This not only improves the versatility and flexibility of the device, but also provides a more reliable solution for complex processing tasks.

[0040] On the other hand, the detection device 300 includes a camera 300, and the controller 310 calculates the position difference between the projection point of the notch 211 on the electronic device and the processing area based on the image of the notch 211 and the electronic device captured by the camera 300, and controls the movement of the transfer mechanism 230 based on the position difference.

[0041] Specifically, the camera 300 is arranged above the positioning mechanism.

[0042] In this embodiment, the detection device 300 specifically adopts a camera 300 to achieve accurate detection of the relative position of the slot 211 and the electronic device. When the cover plate 210 is moved over the electronic device by the transfer mechanism 230, the camera 300 captures images containing the edges of the slot 211 and the features of the processing area of the electronic device. These image data are transmitted to the controller 310 in real time. The controller 310 has an image processing module built-in, which identifies the accurate profile of the slot 211 and the boundary of the processing area on the electronic device through pre-set image recognition algorithms (such as edge detection, feature matching, etc.).

[0043] Subsequently, the controller 310 calculates the position difference in X and Y directions between the projection center point of the slot 211 on the electronic device and the center point of the processing area, and even the deviation of the rotation angle based on these identification results. For example, if the processing area is a rectangle, the controller 310 calculates the horizontal and vertical distances between the center point of the slot 211 and the center point of the rectangle. Based on these accurately calculated position difference data, the controller 310 generates corresponding motion instructions and sends them to the transfer mechanism 230.

[0044] The transfer mechanism 230 adjusts according to these instructions, such as translation in the X and Y planes, or even small-angle rotation, until the camera 300 feedbacks an image showing that the slot 211 is completely aligned with the processing area. The whole process forms a closed-loop control system, ensuring extremely high alignment accuracy.

[0045] The present application uses the camera 300 to collect on-site images, and performs image processing and position difference calculation through the controller 310, significantly improving the alignment accuracy and automation level of the slot 211 and the processing area. This visual guidance alignment method overcomes the limitations of traditional mechanical limiting or manual visual inspection, and can achieve micron-level accurate alignment, thereby effectively avoiding damage to non-processing areas and ensuring processing quality.

[0046] In this embodiment, the camera 300 can use a high-resolution industrial camera to capture clearer and finer images, further improving recognition accuracy. In addition to visible light cameras, infrared cameras or X-ray cameras can also be considered to adapt to the detection needs of different materials or opaque electronic devices. The image processing algorithm can be upgraded to a neural network model based on deep learning, which can more robustly identify the slot 211 and the processing area in complex backgrounds and handle various lighting conditions or surface texture changes through a large amount of image data training. In addition, the controller 310 can be integrated with the production line MES system to realize real-time recording and tracing of alignment data, providing data support for quality control and process optimization.

[0047] On the other hand, the transfer mechanism 230 comprises a first linear actuator 231, a second linear actuator 232, and a third linear actuator 233, the second linear actuator 232 being slidingly connected with the first linear actuator 231, the third linear actuator 233 being slidingly connected with the second linear actuator 232, and the carrier 220 being connected with the third linear actuator 233; the linear actuators are configured to drive the second linear actuator 232 and the third linear actuator 233 along with the carrier 220 to move along a first axis, the second linear actuator 232 is configured to drive the third linear actuator 233 along with the carrier 220 to move along a second axis, and the third linear actuator 233 is configured to drive the carrier 220 to move along a third axis.

[0048] In this embodiment, the transfer mechanism 230 adopts a structure composed of three mutually orthogonal linear actuators in series to realize the multi-degree-of-freedom movement of the carrier 220 (and thus the cover plate 210).

[0049] Specifically, the first linear actuator 231 serves as a base to provide the movement capability along a first axis (e.g., X-axis). The second linear actuator 232 is slidingly connected with the first linear actuator 231, which means that the second linear actuator 232 itself can move along the first axis with the first linear actuator 231, while the second linear actuator 232 itself provides the movement along a second axis (e.g., Y-axis, perpendicular to the first axis). The third linear actuator 233 is slidingly connected with the second linear actuator 232, which can move along the first axis and the second axis with the second linear actuator 232, while the third linear actuator 233 itself provides the movement along a third axis (e.g., Z-axis, perpendicular to the first axis and the second axis). The carrier 220 is directly connected with the third linear actuator 233, so that the carrier 220 and the cover plate 210 thereon can realize the precise X, Y, Z direction translation in three-dimensional space through the coordinated action of the three linear actuators.

[0050] For example, to move the cover plate 210 from the current position to the target position, the controller 310 calculates the displacement amounts in the X, Y, Z directions and drives the corresponding linear actuators to perform the corresponding movements. This hierarchical driving design makes the movement of each axis independent of each other, simplifies the complexity of motion control, and provides high-precision positioning capability.

[0051] The linear actuators can adopt different driving technologies, such as a lead screw driven by a stepper motor, a synchronous belt driven by a servo motor, or a linear motor, to adapt to different speed, precision, and load requirements.

[0052] In another aspect, the carrier 220 is also provided with a pressure detection mechanism for detecting the amount of pressure applied by the cover plate 210 to the electronic device, and the transfer mechanism 230 is configured to adjust the pressure applied by the cover plate 210 to the electronic device based on the detection value of the pressure detection mechanism.

[0053] When the transfer mechanism 230 drives the carrier 220 and the cover plate 210 to descend and the cover plate 210 contacts the surface of the electronic device, the pressure detection mechanism will immediately sense and quantify the contact pressure. The detection value of the pressure detection mechanism will be transmitted to the controller 310 in real time.

[0054] The controller 310 is pre-set with an ideal pressure range or target pressure value. Once it receives the feedback from the pressure detection mechanism, the controller 310 will compare it with the target value. If the detected pressure is too high, the controller 310 will instruct the transfer mechanism 230 (particularly the third linear driver 233 responsible for Z-axis movement) to slightly lift the cover plate 210 to reduce the pressure; if the detected pressure is too low, the controller 310 will instruct the transfer mechanism 230 to slightly lower the cover plate 210 to increase the pressure. This process is a dynamic closed-loop feedback control, and the transfer mechanism 230 will continue to adjust until the pressure applied by the cover plate 210 to the electronic device reaches the pre-set optimal range.

[0055] For example, in the processing of precision screens, it may be necessary to control the pressure between 0.5N and 1.5N to ensure the sealing effect while avoiding damage to the screen. This precise pressure control ensures that the cover plate 210 closely fits the surface of the electronic device, effectively preventing plasma or reaction products from entering the non-processing area, while avoiding physical damage to the electronic device.

[0056] The pressure adjustment strategy can be upgraded to an adaptive control algorithm that automatically adjusts the optimal pressure range based on the material, hardness, or processing technology of the electronic device.

[0057] In another aspect, the pressure detection mechanism includes a pressure sensor 240 and a support plate, the support plate including a connecting portion 241 and a supporting portion 242, the connecting portion 241 being fixedly connected with the pressure sensor 240, and the supporting portion 242 being configured to support the cover plate 210; the pressure sensor 240 is a tension and compression bi-directional pressure sensor 240.

[0058] In this embodiment, the support plate is designed to have a connecting portion 241 and a supporting portion 242. The supporting portion 242 is the part that directly contacts or supports the cover plate 210, and its function is to uniformly transmit the force applied by the cover plate 210. The connecting portion 241 is fixedly connected with the pressure sensor 240. This means that the weight of the cover plate 210, as well as the contact force generated during its descent and contact with the electronic device, will be transmitted to the pressure sensor 240 through the support plate.

[0059] In particular, the pressure sensor 240 employed in the present application is a tension and compression bi-directional pressure sensor 240. This type of sensor is capable of measuring not only the pressure received (force pushing against the sensor), but also the tension received (force pulling away from the sensor).

[0060] For example, when the cover plate 210 is not in abutment with the electronic device, the pressure sensor 240 measures the pressure caused by the self-gravity of the support plate. When the cover plate 210 is in abutment with the electronic device, due to the abutting force of the electronic device on the cover plate 210, the cover plate 210 and the support plate have a tendency to lift up, and then the force transmitted to the pressure sensor 240 becomes an upward tension.

[0061] The present application builds a more accurate pressure detection mechanism by combining the tension and compression bi-directional pressure sensor 240 with the structured support plate. This design can accurately control the pressing force of the cover plate 210 on the electronic device, effectively preventing overpressure damage or underpressure leakage. The design of the support plate ensures the uniformity and accuracy of pressure transmission, further improving the accuracy of measurement.

[0062] On the other hand, the carrier 220 is provided with a vertically extending slide rail 221, and the cover plate 210 is slidingly connected with the slide rail 221 through a sliding block 212.

[0063] In this embodiment, the cover plate 210 and the carrier 220 are slidingly connected through the slide rail 221 and the sliding block 212. This connection allows the cover plate 210 to slide up and down in the vertical direction (i.e., the Z-axis direction) relative to the carrier 220 in a small amount and smoothly. When the transfer mechanism 230 drives the carrier 220 to descend, the cover plate 210 gradually approaches and contacts the surface of the electronic device, and the cover plate 210 is not rigidly fixed by the carrier 220. Instead, it will freely slide down along the slide rail 221 until it is in close contact with the surface of the electronic device. Once in contact, the pressure detection mechanism begins to work, and at this time the sliding of the cover plate 210 will be subject to the feedback of the surface support of the electronic device.

[0064] In another preferred embodiment of the present application, an electronic device processing protection method based on the above-mentioned protection device is also provided, which comprises the following steps: The positioning mechanism receives and fixes the electronic device to be processed; The transfer mechanism 230 is controlled to move the cover plate 210 above the electronic device; The controller 310 receives the projected position of the slot 211 on the electronic device detected by the detection device 300, and calculates the deviation data of the slot 211 from the processing area of the electronic device according to the projected position; The controller 310 adjusts the horizontal movement of the transfer mechanism 230 according to the deviation data, so that the projected position of the slot 211 on the electronic device is directly opposite to the processing area; The controller 310 controls the vertical movement of the transfer mechanism 230 to cover one side of the processing area of the electronic device with the cover plate 210. The processing area of the electronic device is processed through the slot 211, such as plasma cleaning, film coating, surface modification, etc.

[0065] The electronic device processing protection method provided by the present application significantly improves the efficiency, accuracy and reliability of processing protection through automated and high-precision alignment and covering process. This method overcomes the problems of poor consistency and low positioning accuracy caused by traditional manual operation, realizes millimeter-level or even micron-level accurate matching between the slot 211 and the processing area, effectively avoids damage to the non-processing area, and greatly reduces the product failure rate. At the same time, the automated process reduces manual intervention, reduces labor intensity and operation errors, and improves the intelligent level and production capacity of the production line.

[0066] The entire method process can be integrated with MES (Manufacturing Execution System) or SCADA system to realize real-time monitoring, tracing and remote management of production data.

[0067] In addition, when the plasma is projected through the slot 211 to the processing area of the electronic device to clean the residues on the surface of the processing area, the type and parameters (such as gas type, flow, power, processing time) of the plasma can be accurately adjusted according to the material properties of the processing area and the required cleanliness. For example, hydrogen plasma can be used to remove metal oxides, and oxygen plasma can be used to remove organic matter. The plasma generator can use different technologies such as radio frequency (RF) plasma, microwave plasma or atmospheric pressure plasma to adapt to different application scenarios and processing efficiency requirements.

[0068] The above only discloses the preferred embodiments of the present application, and of course cannot limit the scope of the present application. Therefore, any equivalent changes made within the scope of the patent application of the present application are still within the scope of the present application.

Claims

1. A protective device for processing electronic equipment, characterized in that, include: A positioning mechanism used to place electronic devices to be processed; A shielding mechanism includes a cover plate, a carrier, and a transfer mechanism. The cover plate is disposed on the carrier, and the carrier is connected to the transfer mechanism. The transfer mechanism is used to drive the carrier to move in multiple degrees of freedom so that the cover plate covers one side of the processing area of ​​the electronic device to be processed, and the cover plate has a slot communicating with the processing area below, the slot providing a channel for the operation object to be applied to the processing area. A guiding mechanism includes a controller and a detection device. The controller is communicatively connected to the detection device and the transfer mechanism. The detection device is used to detect the projected position of the slot on the electronic device. The controller guides the movement of the transfer mechanism according to the detection value of the detection device so that the slot matches the processing area.

2. The protective device for electronic equipment processing according to claim 1, characterized in that, A set of shielding mechanisms is provided on each of the opposite sides of the positioning mechanism, and the cover plates of the two shielding mechanisms are respectively positioned to cover the two sides of the periphery of the electronic device.

3. The electronic equipment processing protection device according to claim 1, characterized in that, The detection device includes a camera. The controller calculates the position difference between the projection point of the slot on the electronic device and the processing area based on the image of the slot and the electronic device captured by the camera, and controls the action of the transfer mechanism based on the position difference.

4. The protective device for electronic equipment processing according to claim 3, characterized in that, The camera is positioned above the positioning mechanism.

5. The protective device for electronic equipment processing according to claim 1, characterized in that, The transfer mechanism includes a first linear driver, a second linear driver, and a third linear driver. The second linear driver is slidably connected to the first linear driver, the third linear driver is slidably connected to the second linear driver, and the carrier is connected to the third linear driver. The linear actuator is used to drive the second linear actuator, the third linear actuator, and the carrier together to move along a first axis; the second linear actuator is used to drive the third linear actuator and the carrier together to move along a second axis; and the third linear actuator is used to drive the carrier to move along a third axis.

6. The protective device for electronic equipment processing according to claim 1, characterized in that, The carrier is also equipped with a pressure detection mechanism for detecting the pressure applied by the cover plate to the electronic device. The transfer mechanism is used to adjust the pressure of the cover plate on the electronic device according to the detection value of the pressure detection mechanism.

7. The electronic equipment processing protection device according to claim 6, characterized in that, The pressure detection mechanism includes a pressure sensor and a support plate. The support plate includes a connecting part and a supporting part. The connecting part is fixedly connected to the pressure sensor, and the supporting part is used to support the cover plate. The pressure sensor is a bidirectional pressure sensor.

8. The protective device for electronic equipment processing according to claim 7, characterized in that, The carrier is provided with a vertically extending slide rail, and the cover plate is slidably connected to the slide rail by a slider.

9. A method for protecting electronic equipment during processing, characterized in that, Provide positioning, blocking, and guiding mechanisms; The shielding mechanism includes a cover plate, a carrier, and a transfer mechanism. The cover plate is mounted on the carrier, and the carrier is connected to the transfer mechanism. The transfer mechanism is used to drive the carrier to move in multiple degrees of freedom, and the cover plate has a slot. The guiding mechanism includes a controller and a detection device, wherein the controller is communicatively connected to the detection device and the transfer mechanism; The protection method includes: The positioning mechanism receives and fixes the electronic equipment to be processed. Control the movement of the transfer mechanism to move the cover plate above the electronic device; The controller receives the projection position of the slot on the electronic device detected by the detection device, and calculates the deviation data between the slot and the processing area of ​​the electronic device accordingly. The controller adjusts the horizontal movement of the transfer mechanism according to the deviation data so that the projection position of the slot on the electronic device is directly opposite to the processing area; The controller controls the vertical movement of the transfer mechanism so that the cover plate covers one side of the processing area on the electronic device; The processing area of ​​the electronic device is processed through the slot.

10. The method for protecting electronic devices during processing according to claim 9, characterized in that, The method for performing processing operations on the processing area of ​​the electronic device includes: Plasma is projected onto the processing area of ​​the electronic device through the slot to clean residues on the surface of the processing area.

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