Full-automatic sintering machine based on chip production and use method thereof

Abstract

The invention discloses a full-automatic sintering machine based on chip production and a use method thereof, and relates to the field of chip production, and the key points of the technical scheme are that the full-automatic sintering machine comprises a machine body, a standardized material receiving port, a visual identification unit, a preheating platform, a sintering mold, a cooling table, a standardized material outlet, a six-axis mechanical arm and an aviation connector; the beneficial effects are that after chips enter the machine body, the visual identification unit located at the downstream of the standardized material receiving port collects images through the industrial camera and the chip special coaxial light source, and then model identification and defect detection are completed through the classification algorithm module, so that accurate classification is realized; the classified chips are conveyed to a preheating platform with an integrated heat preservation structure to be preheated, then automatic transfer is achieved among a standardized material receiving opening, the preheating platform, a sintering mold, a cooling table and a standardized discharging opening through a six-axis mechanical arm with the repeated positioning precision smaller than or equal to 0.01 mm, and the problem of procedure connection fault is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip production, more particularly, it relates to a full-automatic sintering machine based on chip production and a use method thereof. BACKGROUND

[0002] In the field of chip manufacturing, the sintering process is the core step of the packaging link, and the performance of the equipment directly determines the electrical performance stability and production efficiency of the chip.

[0003] The current mainstream chip sintering equipment generally has the following technical bottlenecks: 1. Poor interface compatibility, the material receiving port and the material discharging port are designed by customization, which is difficult to adapt to different brands and different standards of chip mounters, preheaters and subsequent processing equipment, resulting in limited flexibility of production line layout; 2. Insufficient automation collaboration, the transfer of chips between material receiving, preheating, sintering and cooling processes relies on manual assistance or low-precision transmission mechanisms, and the repeated positioning error is often more than 0.05mm, which easily causes process connection faults; 3. Lack of core process control precision, there are problems such as insufficient displacement precision of the mold closing mechanism, uneven nitrogen protection atmosphere, and lagging response of the temperature control system, resulting in large fluctuations in chip sintering yield; 4. Insufficient stability of internal electrical connection components, which is prone to equipment failure due to poor contact, seriously restricting the demand for large-scale production of high-end chips.

[0004] Therefore, in order to solve the above technical problems, the present application provides a full-automatic sintering machine based on chip production and a use method thereof. SUMMARY

[0005] In view of the deficiencies of the prior art, the purpose of the present application is to provide a full-automatic sintering machine based on chip production and a use method thereof.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a full-automatic sintering machine based on chip production, comprising: a machine body; a standardized material receiving port installed at the side end of the machine body, which is suitable for the material discharging interface of international standard chip mounters and preheaters; a visual recognition unit installed inside the machine body and located downstream of the standardized material receiving port, comprising an industrial-grade camera, a chip-specific coaxial light source and a classification algorithm module; a preheating platform connected with the output end of the standardized material receiving port and having an integrated heat preservation structure; a sintering mold connected with the output end of the preheating platform, comprising: a mold closing control mechanism with a displacement precision of ≤0.01mm; a nitrogen nozzle array arranged on the side wall around the sintering mold; a cooling table connected with the output end of the sintering mold; a standardized material discharging port connected with the output end of the cooling table and conforming to the international equipment interface standard. A six-axis robotic arm is used to transport chips between a standardized receiving port, a preheating platform, a sintering mold, a cooling platform, and a standardized discharge port, with a repeatability accuracy of ≤0.01mm. Aviation connectors, with gold-plated pins, are used for connecting internal electrical components of sintering machines.

[0007] Preferably, the six-axis robotic arm is equipped with a precision gripper sensor with red and green dual-color indicator lights.

[0008] Preferably, the sintering mold has an integrated embedded ejector module containing more than two thousand replaceable ejector pins. The embedded ejector module covers the entire pressure area of ​​the sintering mold, and the ejector pin guide module is connected to the substrate of the embedded ejector module through a quick-release structure.

[0009] Preferably, the front and rear sides of the machine body are equipped with hovering safety doors that can be locked at any position within the opening and closing range of 30°-120°.

[0010] Preferably, the nitrogen nozzle array comprises twenty-two nozzles, which are equidistantly distributed on the sidewall of the mold according to a fluid dynamics model, with the nozzle axis at an elevation angle of 15°-30° to the horizontal plane.

[0011] Preferably, it also includes a distributed temperature control system, which includes twenty-six temperature controllers embedded in the sintering mold. The temperature controllers on the distributed temperature control system are spaced ≤50mm apart and are embedded according to the mold thermal field distribution diagram. The power distribution is dynamically adjusted through an AI algorithm.

[0012] Preferably, the machine body has an integrated main frame, integrating the material receiving and discharging functions into a single machine.

[0013] Preferably, the industrial-grade camera on the visual recognition unit has 65 megapixels and is arranged opposite to the chip-specific coaxial light source to form a detection optical path.

[0014] Preferably, the six-axis robotic arm is a German brand KUKA, with its base fixed to the crossbeam in the middle of the machine body. The cooling platform is equipped with spiral water-cooling pipes and a deionizing fan is installed above it to eliminate the ions generated during the product sintering process.

[0015] The method using the aforementioned fully automated sintering machine for chip manufacturing includes the following steps: Step 1: The preceding equipment feeds the chip along with the tray containing the chip into the machine body through the standardized receiving port. After the sensor at the standardized receiving port detects the chip, the vision recognition unit is activated. Step 2: The industrial-grade camera of the vision recognition unit captures images of the chip under the illumination of a dedicated coaxial light source for the chip. The classification algorithm module analyzes the images, identifies the chip model and defects, and completes the classification. Then, a six-axis robotic arm moves the tray containing the appropriate chip to the preheating platform. Step 3: The preheating platform preheats the chip. Once the preset temperature is reached, the six-axis robotic arm moves to the preheating platform and uses its grippers to pick up the tray containing the chip. Step 4: The six-axis robotic arm moves the tray to the sintering mold according to the preset trajectory. After the precision gripper sensor detects that the tray is in place, the green light lights up, and the robotic arm releases the gripper and exits. Step 5: The mold closing control mechanism of the sintering mold is precisely closed under the control of the German Moog displacement ruler. At the same time, the nitrogen nozzle array sprays nitrogen to form a protective atmosphere. The distributed temperature control system uses AI algorithm to control the mold temperature within the preset range for sintering. Step Six: After sintering is completed, the mold closing mechanism opens, and the six-axis robotic arm removes the tray from the sintering mold and transfers it to the cooling table; Step 7: The cooling table rapidly cools the pallet to 30°C, and then the six-axis robotic arm moves the pallet to the standardized discharge port. Step 8: The standardized discharge port delivers the chip to subsequent equipment, completing the entire sintering process; Step 9: When different chip models need to be produced, loosen the quick-release clip of the embedded ejector module guide module, replace it with a guide module that is compatible with the new model, and debugging can be completed and production can begin within 30 minutes.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. This invention utilizes a standardized receiving port to connect to different brands and standards of chip mounters or preheaters, thus solving the interface compatibility problem; 2. In this invention, after the chip enters the machine body, a visual recognition unit located downstream of the standardized receiving port acquires images through an industrial-grade camera and a chip-specific coaxial light source. The images are then processed by a classification algorithm module to complete model identification and defect detection, achieving accurate classification. The classified chips are then transferred to a preheating platform with an integrated insulation structure for preheating treatment. Subsequently, a six-axis robotic arm with a repeatability accuracy of ≤0.01mm automatically transfers the chips between the standardized receiving port, the preheating platform, the sintering mold, the cooling table, and the standardized discharge port, solving the problem of process connection gaps. 3. After the chip enters the sintering mold, the mold closing control mechanism of this invention completes the mold closing with a displacement accuracy of ≤0.01mm. The nitrogen nozzle array on the four sides forms a uniform protective atmosphere. The distributed temperature control system strictly controls the temperature difference detected by a third party within ±3℃, thereby improving the core process control accuracy. 4. This invention uses a gold-plated pin aviation plug to ensure a stable connection of internal electrical components, avoiding equipment failure caused by poor contact; 5. This invention installs a precision gripper sensor with red and green dual-color indicator lights at the end of a six-axis robotic arm. When the gripper picks up the tray and feeds it into the sintering mold, the sensor can detect in real time whether the tray is in place. When it is in place, the green light lights up; when it is not in place, the red light lights up and sends a signal to control the robotic arm to readjust its position. This avoids problems such as sintering misalignment and uneven pressure caused by tray displacement from the source, and directly improves the product yield. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the specific structure of the present invention from another perspective; Figure 3 This is a schematic diagram of the specific structure of the present invention from another angle; Figure 4 This is a schematic diagram of the specific structure of the back of the present invention; Figure 5 This is a schematic diagram of the internal structure of the present invention (viewed from top to bottom).

[0018] In the diagram: 1. Machine body; 2. Standardized material receiving port; 3. Vision recognition unit; 4. Preheating platform; 5. Sintering mold; 501. Nitrogen nozzle array; 502. Embedded ejector pin module; 6. Cooling platform; 7. Standardized material discharge port; 8. Robotic arm; 9. Suspended safety door. Detailed Implementation

[0019] like Figures 1 to 5 As shown, this invention provides a fully automated sintering machine for chip manufacturing, including a machine body 1, a standardized material receiving port 2, a vision recognition unit 3, a preheating platform 4, a sintering mold 5, a cooling platform 6, a standardized material discharge port 7, a six-axis robotic arm 8, an aviation connector 10, and a distributed temperature control system, etc., which will be described in detail below: Unit 1: The main frame is constructed from welded steel profiles. Its overall dimensions have been optimized to perfectly integrate redundant auxiliary units from imported equipment into the main unit, reducing the footprint by 40% compared to traditional distributed equipment. The front and rear suspended safety doors 9 utilize aluminum alloy frames and tempered glass, and are suspended at any position within a 30°-120° range via gas springs. This facilitates observation of the equipment's internal operating status and convenient maintenance. Standardized receiving port 2: The interface size conforms to international standards. It is equipped with an internal adaptive adjustment mechanism, which can accurately connect with the standardized discharge ports of European molds, mainstream domestic SMTs, and preheaters. During the connection process, the connection status is detected in real time by sensors to ensure a stable connection. The visual recognition unit 3 features a 65-megapixel Hikvision industrial-grade camera mounted on a precision bracket directly above the conveyor path downstream of the standardized receiving port 2. A dedicated coaxial light source for chips surrounds the camera lens, providing uniform and stable illumination. The classification algorithm module can quickly identify chip models and surface defects, and based on the identification results, controls the six-axis robotic arm 8 to divert the chips to different channels. Preheating Platform 4: Made of HP8 alloy material in one piece, with a surface flatness error ≤0.05mm. It has an embedded heating tube and temperature sensor, and is wrapped with 50mm thick high-grade insulation material, which can stably control the temperature within the preset range. The preheating temperature can be adjusted between 50-200℃, with a temperature control accuracy of ±2℃.

[0020] Sintering mold 5: The German Moog displacement gauge in the mold closing control mechanism is connected to the mold closing drive mechanism through gear meshing, providing real-time feedback on the mold closing displacement and performing precise control to ensure that the mold closing displacement accuracy is ≤0.01mm.

[0021] The 22 nozzles of the nitrogen nozzle array 501 are distributed at the optimal angle calculated by hydrodynamics, with the nozzle axis at an elevation angle of 15°-30° to the horizontal plane. This creates a uniform nitrogen protective atmosphere inside the mold, effectively preventing DBC sintering oxidation. The two thousand precision ejector pins of the embedded ejector pin module 502 are made of tungsten carbide, with a diameter of 0.5mm. They are distributed in a matrix at 5mm intervals in the pressure output area of ​​the sintering mold 5. The ejector pin guide module is connected to the substrate of the embedded ejector pin module via quick-release clips. Replacement is quick and easy by simply loosening the clips, allowing for preparation for the production of another chip model in just 10 minutes.

[0022] Cooling platform 6: It is equipped with a spiral water cooling pipe inside and a deion fan installed above to eliminate the ions generated during the product sintering process. It can quickly cool the sintered tray to 30°C within 3 minutes.

[0023] Standardized discharge port 7: Its interface is the same as that of the standardized receiving port 2, and its size also conforms to international standards; The six-axis robotic arm 8 is a German brand HUKA. Its base is fixed to the central crossbeam of the machine body 1 with high-strength bolts, achieving a repeatability accuracy of ≤0.01mm. The end effector of the six-axis robotic arm 8 is equipped with a precision gripper sensor with red and green dual-color indicator lights. When the gripper picks up the tray and feeds it into the sintering mold 5, the sensor can detect in real time whether the tray is in position. A green light illuminates when the tray is in position, and a red light illuminates and a signal is sent when the tray is not in position, controlling the robotic arm to readjust its position. Aviation plug 10: It adopts the Swiss Remo F5B model and is installed in the electrical cabinet on the side of the fuselage. The gold plating layer of the pin is 8μm thick. It is connected to the electrical components inside the sintering machine through shielded cables to ensure excellent conductivity and stable contact. Distributed temperature control system: This system achieves high-precision control of the temperature field of sintering mold 5 through the dense, customized layout of twenty-six temperature controllers and the collaboration of intelligent algorithms. The twenty-six temperature controllers are integrated into the sintering mold 5 using an embedded installation method, rather than an external design. This installation method minimizes the heat conduction path between the temperature control elements and the mold, reducing the lag in temperature detection and control. The spacing between the temperature controllers is strictly controlled within 50mm to ensure high-density sampling of the mold surface and internal temperature, avoiding blind spots in temperature detection. Furthermore, the installation positions of the temperature controllers are not uniformly distributed, but rather strategically arranged according to the mold thermal field distribution map (i.e., the heat distribution patterns of different areas of the mold determined through simulation or actual measurement, such as faster heat dissipation in corner areas and easier heat accumulation in the central area). This allows the temperature controllers to focus on covering key areas where temperature fluctuations are prone to occur, improving the targeting and effectiveness of temperature detection. During system operation, each temperature controller collects temperature data at its location in real time and transmits it to the AI ​​temperature control module via the bus. The AI ​​algorithm comprehensively analyzes the temperature data from 26 points, accurately identifies the distribution of the mold temperature field (such as local overheating or underheating), and dynamically adjusts the heating power distribution of the corresponding area based on the analysis results—increasing the heating power in areas with low temperatures and decreasing the heating power in areas with high temperatures, forming a closed-loop dynamic control, ultimately achieving uniformity of the overall mold temperature, meeting the stringent requirements of chip sintering process for temperature stability, and strictly controlling the temperature difference of the mold by third-party random detection within ±3℃.

[0024] This invention integrates various functional modules into a single unit through an integrated frame of the main body 1. Firstly, a standardized receiving port 2 is used to connect to different brands and standards of chip mounters or preheating machines, resolving interface compatibility issues. After the chip enters the main body, a vision recognition unit 3 located downstream of the standardized receiving port 2 captures images using an industrial-grade camera and a dedicated coaxial light source for the chip. A classification algorithm module then performs model identification and defect detection, achieving accurate classification. The classified chip is then transferred to a preheating platform 4 with an integrated insulation structure for preheating. Subsequently, a six-axis robotic arm 8 with a repeatability accuracy ≤0.01mm automates the transfer between the standardized receiving port 2, preheating platform 4, sintering mold 5, cooling platform 6, and standardized discharge port 7, resolving process connection gaps. After the chip enters the sintering mold 5, its mold closing control mechanism achieves a ≤0.01mm... The displacement accuracy completes the mold closing, and the nitrogen nozzle array 501 on the four sides of the wall forms a uniform protective atmosphere, improving the core process control accuracy. After sintering, the chip is transferred to the cooling platform 6 for cooling, and then sent by a six-axis robotic arm to the standardized discharge port 7 that meets international standards for output. At the same time, the sintering machine ensures stable connection of internal electrical components through the aviation plug 10 with gold-plated pins. Finally, through the coordinated work of each module, efficient and high-precision chip sintering is achieved, meeting the needs of large-scale production of high-end chips.

[0025] This invention also provides a method for using the aforementioned fully automated sintering machine based on chip manufacturing: Step 1: The preceding equipment feeds the chip, along with the tray holding the chip, into the machine body 1 through the standardized receiving port 2. After the sensor at the standardized receiving port 2 detects the chip, the vision recognition unit 3 is activated; Step 2: The industrial-grade camera of the visual recognition unit 3 captures images of the chip under the illumination of a dedicated coaxial light source for the chip. The classification algorithm module analyzes the images, identifies the chip model and defects, and completes the classification. Then, the six-axis robotic arm 8 moves the tray containing the appropriate chip (correct model and no defects) to the preheating platform 4. Step 3: The preheating platform 4 preheats the chip. After reaching the preset temperature, the six-axis robotic arm 8 moves to the preheating platform 4 and uses its grippers to grab the tray containing the chip. Step 4: The six-axis robotic arm 8 moves the tray to the sintering mold 5 according to the preset trajectory. After the precision gripper sensor detects that the tray is in place, the green light lights up, and the robotic arm releases the gripper and exits. Step 5: The mold closing control mechanism of sintering mold 5 is precisely closed under the control of the German Moog displacement ruler. At the same time, nitrogen nozzle array 501 sprays nitrogen to form a protective atmosphere. The distributed temperature control system controls the mold temperature within the preset range through AI algorithm to carry out sintering operation. Step 6: After sintering is completed, the mold closing mechanism opens, and the six-axis robotic arm 8 removes the tray from the sintering mold 5 and transfers it to the cooling table 6; Step 7: The cooling table 6 rapidly cools the pallet to 30°C, and then the six-axis robotic arm 8 moves the pallet to the standardized discharge port 7. Step 8: Standardized discharge port 7 delivers the chip to subsequent equipment, completing the entire sintering process; Step 9: When different chip models need to be produced, loosen the quick-release clip of the 502 embedded pin module guide module, replace it with a guide module that is compatible with the new model, and debugging can be completed and production can begin within 30 minutes.

[0026] The fully automated sintering machine for chip manufacturing and its usage method of the present invention have the following advantages: The standardized material inlet 2 is used to connect to different brands and standards of pick-and-place machines or preheaters, solving the interface compatibility problem; After the chip enters the machine, the visual recognition unit 3, located downstream of the standardized receiving port 2, acquires images through an industrial-grade camera and a chip-specific coaxial light source. The classification algorithm module then completes model identification and defect detection to achieve accurate classification. The classified chip is then transferred to the preheating platform 4 with an integrated heat preservation structure for preheating treatment. Subsequently, a six-axis robotic arm 8 with a repeatability accuracy of ≤0.01mm automatically transfers the chip between the standardized receiving port 2, the preheating platform 4, the sintering mold 5, the cooling platform 6, and the standardized discharge port 7, solving the problem of process connection gaps. After the chip enters the sintering mold 5, its mold closing control mechanism completes the mold closing with a displacement accuracy of ≤0.01mm. The nitrogen nozzle array 501 on the four sides of the wall forms a uniform protective atmosphere. The distributed temperature control system strictly controls the temperature difference detected by a third party within ±3℃, improving the core process control accuracy. The aviation plug 10 with gold-plated pins ensures a stable connection of internal electrical components and avoids equipment failure caused by poor contact. A precision gripper sensor with red and green dual-color indicator lights is installed at the end of the six-axis robotic arm 8. When the gripper picks up the tray and sends it into the sintering mold 5, the sensor can detect in real time whether the tray is in place. When it is in place, the green light is on, and when it is not in place, the red light is on and a signal is sent to control the robotic arm to readjust its position. This avoids problems such as sintering misalignment and uneven pressure caused by tray displacement from the source, and directly improves the product yield.

[0027] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Those skilled in the art can readily implement the present invention based on the accompanying drawings and the above description. However, any modifications, alterations, or variations made by those skilled in the art without departing from the scope of the present invention, utilizing the disclosed technical content, are equivalent embodiments of the present invention. Furthermore, any modifications, alterations, or variations made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the present invention.

Claims

1. A fully automated sintering machine based on chip manufacturing, characterized in that: include: Body (1); Standardized receiving port (2), which is installed on the side of the machine body (1) and is compatible with the international standard chip mounter and preheater discharge interface; The visual recognition unit (3) is installed inside the body (1) and located downstream of the standardized receiving port (2). It includes an industrial-grade camera, a chip-specific coaxial light source, and a classification algorithm module. The preheating platform (4) is connected to the output end of the standardized material inlet (2) and has an integrated heat preservation structure; The sintering mold (5), which is connected to the output end of the preheating platform (4), includes: The mold closing control mechanism has a displacement accuracy of ≤0.01mm; A nitrogen nozzle array (501) is arranged on the four sides of the sintering mold (5); Cooling platform (6), which is connected to the output end of sintering mold (5); The standardized discharge port (7) is connected to the output end of the cooling platform (6) and conforms to international equipment interface standards; A six-axis robotic arm (8) is used to transport chips between a standardized receiving port (2), a preheating platform (4), a sintering mold (5), a cooling platform (6), and a standardized discharge port (7), with a repeatability accuracy of ≤0.01mm; Aviation plug (10), whose gold-plated pins are used for connecting electrical components inside the sintering machine.

2. The fully automated sintering machine based on chip manufacturing according to claim 1, characterized in that: The six-axis robotic arm (8) is equipped with a precision gripper sensor with red and green dual-color indicator lights.

3. The fully automated sintering machine based on chip manufacturing according to claim 2, characterized in that: The sintering mold (5) has an embedded ejector module (502) inside, which contains more than two thousand replaceable ejector pins. The embedded ejector module (502) covers the entire pressure area of ​​the sintering mold (5). The ejector pin guide module is connected to the substrate of the embedded ejector module (502) through a quick-release structure.

4. The fully automated sintering machine based on chip manufacturing according to claim 1, characterized in that: The front and rear sides of the body (1) are equipped with hovering safety doors (9), which can be locked at any position within the opening and closing range of 30°-120°.

5. The fully automated sintering machine based on chip manufacturing according to claim 1, characterized in that: The nitrogen nozzle array (501) contains twenty-two nozzles, which are equidistantly distributed on the side wall of the mold according to the fluid dynamics model, and the nozzle axis is at an elevation angle of 15°-30° to the horizontal plane.

6. The fully automated sintering machine based on chip manufacturing according to claim 3, characterized in that: It also includes a distributed temperature control system, which includes twenty-six temperature controllers embedded in the sintering mold (5). The temperature controllers on the distributed temperature control system are spaced ≤50mm apart and are embedded according to the mold thermal field distribution diagram. The power distribution is dynamically adjusted by AI algorithm.

7. The fully automated sintering machine based on chip manufacturing according to claim 1, characterized in that: The machine body (1) has an integrated main frame, which integrates the material receiving and discharging functions into a single machine.

8. The fully automated sintering machine based on chip manufacturing according to claim 7, characterized in that: The industrial-grade camera on the visual recognition unit (3) has 65 million pixels and is set opposite to the chip-specific coaxial light source to form a detection optical path.

9. The fully automated sintering machine based on chip manufacturing according to claim 4, characterized in that: The six-axis robotic arm (8) is a German brand KUKA. Its base is fixed on the crossbeam in the middle of the body (1). The cooling platform (6) is equipped with a spiral water cooling pipe and a deionizing fan is installed above it to eliminate the electroions generated during the product sintering process.

10. A method of using the fully automated sintering machine for chip manufacturing according to any one of claims 1-9, characterized in that: Includes the following steps: Step 1: The preceding equipment sends the chip along with the tray on which the chip is placed into the machine body (1) through the standardized receiving port (2). After the sensor of the standardized receiving port (2) detects the chip, the vision recognition unit (3) is activated. Step 2: The industrial-grade camera of the visual recognition unit (3) takes pictures of the chip under the illumination of the chip-specific coaxial light source. The classification algorithm module analyzes the image, identifies the chip model and defects and completes the classification. Then, the six-axis robotic arm (8) moves the tray containing the appropriate chip to the preheating platform (4). Step 3: The preheating platform (4) preheats the chip. After reaching the preset temperature, the six-axis robotic arm (8) moves to the preheating platform (4) and grabs the tray containing the chip using the gripper. Step 4: The six-axis robotic arm (8) moves the tray to the sintering mold (5) according to the preset trajectory. After the precision gripper sensor detects that the tray is in place, the green light turns on and the robotic arm (8) releases the gripper and exits. Step 5: The mold closing control mechanism of the sintering mold (5) is precisely closed under the control of the German Moog displacement ruler. At the same time, the nitrogen nozzle array (501) sprays nitrogen to form a protective atmosphere. The distributed temperature control system controls the mold temperature within the preset range through AI algorithm to carry out the sintering operation. Step 6: After sintering is completed, the mold closing mechanism is opened, and the six-axis robotic arm (8) removes the tray from the sintering mold (5) and transfers it to the cooling table (6). Step 7: The cooling table (6) rapidly cools the pallet to 30°C. Then, the six-axis robotic arm (8) moves the pallet to the standardized discharge port (7). Step 8: Standardized discharge port (7) delivers the chip to subsequent equipment to complete the entire sintering process; Step 9: When different models of chips need to be produced, loosen the quick-release buckle of the embedded pin module (502) guide module, replace it with a guide module that is compatible with the new model, and the debugging can be completed and production can begin within 30 minutes.

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