Temperature detection device and method and process chamber

Abstract

The invention provides a temperature detection device, a temperature detection method, a process chamber and a computer readable storage medium. The temperature detection device comprises a cavity bottom plate which is provided with a plurality of temperature measurement cavities, and each temperature measurement cavity is in contact with the lower surface of a heating disc arranged in a process cavity; and the temperature measuring elements are arranged in the temperature measuring cavities on the cavity bottom plate so as to measure the temperature of the corresponding areas on the lower surface of the heating disc, so that the heating disc is prevented from being heated, cooled and opened for multiple times, and multi-point temperature monitoring can be directly carried out on the surface of the heating disc, so that the process efficiency of temperature detection of the heating disc is remarkably improved, and the production cost is reduced. And meanwhile, the stability of the cavity environment is ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a temperature detection device, a process chamber, a temperature detection method, and a computer-readable storage medium. Background Technology

[0002] In semiconductor manufacturing technology, temperature monitoring of heating plates is mainly concentrated in the pre-shipment quality inspection and the pre-shipment temperature testing stage after assembly into the equipment. Before shipment, single-point temperature measurement of the heating plate is performed using a single-point temperature sensing element (such as a thermocouple, which can be understood as a single-point thermometer) to monitor the heating plate temperature. However, during long-term use by the customer, if abnormal temperature uniformity of the heating plate causes process problems, the limitations of this single-point temperature measurement can mask actual temperature distribution defects, thus requiring a significant amount of time for troubleshooting and severely impacting process stability and problem-solving efficiency.

[0003] Currently, the common method for measuring the temperature uniformity of a heating plate is to use a multi-point temperature-sensing wafer to detect the temperature distribution at multiple points on the heating plate surface. However, this method has significant limitations: since the equipment operates at high temperatures for extended periods during normal use, while the multi-point temperature-sensing wafer measurement needs to be performed at room temperature, this method requires first cooling the high-temperature equipment to room temperature and opening the cavity to place the multi-point temperature-sensing wafer on the heating plate, then closing the cavity and heating up again to measure the temperature. After the measurement, it is necessary to cool down again, open the cavity, and remove the multi-point temperature-sensing wafer before proceeding with subsequent tests. Therefore, this uniformity detection process requires multiple heating and cooling cycles of the heating plate, and repeated opening and closing of the cavity. This not only significantly prolongs the testing time and reduces process efficiency but also easily introduces external contaminants during the cavity opening operation, further affecting the test accuracy and equipment stability.

[0004] In order to overcome the above-mentioned defects of the existing technology, there is an urgent need in the field for a temperature detection technology that can directly monitor the temperature of the heating plate surface at multiple points without having to perform multiple heating, cooling and opening operations on the heating plate, thereby significantly improving the process efficiency of heating plate temperature detection and ensuring the stability of the cavity environment. Summary of the Invention

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0006] To overcome the aforementioned deficiencies in the prior art, the present invention provides a temperature detection device, a process chamber, a temperature detection method, and a computer-readable storage medium, which can directly monitor the temperature of the heating plate surface at multiple points without performing multiple heating, cooling, and opening operations on the heating plate, thereby significantly improving the process efficiency of heating plate temperature detection while ensuring the stability of the chamber environment.

[0007] Specifically, the temperature detection device provided according to the first aspect of the present invention includes: a cavity base plate having a plurality of temperature measuring cavities thereon, each of the temperature measuring cavities being in contact with the lower surface of a heating plate disposed in a process chamber; and a temperature measuring element disposed in each of the temperature measuring cavities on the cavity base plate to measure the temperature of corresponding areas on the lower surface of the heating plate.

[0008] Furthermore, in some embodiments of the present invention, each of the temperature measuring cavities is formed by a through hole penetrating the bottom plate of the cavity and a hollow protrusion, wherein the hollow side of the protrusion is sealed to the end of the through hole facing the process chamber and protrudes from the upper surface of the bottom plate of the cavity.

[0009] Furthermore, in some embodiments of the present invention, the upper surface of the protrusion contacts the lower surface of the heating plate, the temperature measuring element is a thermocouple, the outer circumferential surface of the thermocouple is fixedly connected to the inner surface of the through hole, and contacts the inner surface of the hollow side of the protrusion, so as to measure the temperature of the corresponding area of ​​the lower surface of the heating plate.

[0010] Furthermore, in some embodiments of the present invention, each of the temperature measuring cavities is uniformly distributed on the cavity base plate, and / or each of the temperature measuring cavities is arranged in multiple rings on the cavity base plate, wherein each of the temperature measuring cavities located in the same ring maintains equal circumferential angles and radial intervals relative to the center of the cavity base plate.

[0011] Furthermore, in some embodiments of the present invention, the number of temperature measuring cavities is 24, and each temperature measuring cavity is arranged in two concentric rings.

[0012] Furthermore, in some embodiments of the present invention, the outer contour of the protrusion is cylindrical.

[0013] Furthermore, in some embodiments of the present invention, the protrusion is made of aluminum oxide.

[0014] Furthermore, in some embodiments of the present invention, the temperature detection device further includes: a sliding table mechanism, which is fixedly connected to the heating plate and drives the heating plate to move toward the cavity bottom plate so that the heating plate contacts the upper surface of each protrusion on the cavity bottom plate.

[0015] Furthermore, the process chamber provided according to the second aspect of the present invention includes: a heating plate for performing a thin film deposition process on a wafer thereon; and a temperature detection device as described in any one of the first aspects of the present invention.

[0016] Furthermore, the temperature detection method provided by the third aspect of the present invention includes the following steps: raising the temperature of the heating plate to a preset target temperature; moving the heating plate toward the cavity bottom plate of the temperature detection device as described in any one of the first aspects of the present invention, so that each of the temperature measuring cavities contacts the lower surface of the heating plate; and obtaining the temperature at the contact point between each of the temperature measuring cavities on the cavity bottom plate and the lower surface of the heating plate via a temperature measuring element.

[0017] Furthermore, according to the fourth aspect of the present invention, a computer-readable storage medium has computer instructions stored thereon. When the computer instructions are executed by a processor, the temperature detection method as described in the third aspect of the present invention is implemented. Attached Figure Description

[0018] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0019] Figure 1 A schematic diagram of the structure of a process chamber provided according to some embodiments of the present invention is shown.

[0020] Figure 2 A schematic diagram of the structure of a temperature measuring cavity provided according to some embodiments of the present invention is shown.

[0021] Figure 3 A schematic diagram of the distribution of a temperature measuring cavity provided according to some embodiments of the present invention is shown.

[0022] Figure 4 A schematic diagram of thermocouple storage distribution according to some embodiments of the present invention is shown.

[0023] Figure 5 A schematic flowchart of a temperature detection method according to some embodiments of the present invention is shown.

[0024] Figure label:

[0025] 10 Heating Plates

[0026] 20 Cavity base plate

[0027] 21 protrusions

[0028] 30 Thermocouple

[0029] 31 Storage Organizations Detailed Implementation

[0030] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0033] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0034] As mentioned above, the commonly used method in the prior art for measuring the temperature uniformity of a heating plate is to use a multi-point temperature-sensing wafer to detect the temperature distribution at multiple points on the surface of the heating plate. However, the implementation of this measurement method has significant limitations: since the equipment is in a high-temperature state for a long time during normal use, while the measurement of the multi-point temperature-sensing wafer needs to be performed at room temperature, this measurement method requires first cooling the high-temperature equipment to room temperature and opening the cavity, placing the multi-point temperature-sensing wafer on the heating plate, and then closing the cavity and heating up to measure the temperature. After the measurement is completed, it is necessary to cool down again, open the cavity, and remove the multi-point temperature-sensing wafer before proceeding with other tests. Thus, this uniformity detection process requires multiple heating and cooling cycles of the heating plate and repeated opening and closing of the cavity, which not only significantly prolongs the testing time and reduces process efficiency, but also easily introduces external contaminants due to the cavity opening operation, further affecting the test accuracy and equipment stability.

[0035] To overcome the aforementioned deficiencies in the prior art, the present invention provides a temperature detection device, a process chamber, a temperature detection method, and a computer-readable storage medium, which can directly monitor the temperature of the heating plate surface at multiple points without performing multiple heating, cooling, and opening operations on the heating plate, thereby significantly improving the process efficiency of heating plate temperature detection while ensuring the stability of the chamber environment.

[0036] In some non-limiting embodiments, the temperature detection device provided in the first aspect of the present invention can be configured in the process chamber provided in the second aspect of the present invention, and the temperature detection method provided in the third aspect of the present invention can be implemented based on the temperature detection device provided in the first aspect of the present invention. Specifically, the temperature detection device is equipped with a memory and a processor. The memory includes, but is not limited to, the computer-readable storage medium provided in the fourth aspect of the present invention, on which computer instructions are stored. The controller is connected to the memory and configured to execute the computer instructions on the memory to implement the temperature detection method provided in the third aspect of the present invention.

[0037] Please refer to the details. Figure 1 , Figure 1 A schematic diagram of the structure of a process chamber provided according to some embodiments of the present invention is shown.

[0038] like Figure 1 As shown, the process chamber includes a heating plate 10 and a temperature detection device. The heating plate 10 is used to perform thin film deposition processes on the wafers thereon.

[0039] The temperature detection device includes a cavity base plate 20 and temperature measuring elements. The cavity base plate 20 has multiple temperature measuring chambers, each in contact with the lower surface of the heating plate 10 located within the process chamber. Temperature measuring elements are located within each temperature measuring chamber on the cavity base plate 20 to measure the temperature of corresponding areas on the lower surface of the heating plate 10.

[0040] Here, the temperature sensing element can be directly inserted into the temperature sensing cavity that contacts the back of the heating plate 10, and the temperature of the area in contact with the back of the heating plate 10 within the cavity can be obtained. This enables multi-point temperature monitoring of the surface of the heating plate 10, eliminating the need for multiple heating / cooling and cavity opening operations in the process chamber. Multi-point temperature detection of the heating plate 10 can be completed in real-time or on demand. This design effectively avoids the time consumption and cavity contamination risks associated with individual heating plates 10 malfunctioning after long-term use in large quantities, requiring heating / cooling and cavity opening. It significantly improves the process efficiency of heating plate 10 temperature detection while ensuring the stability of the cavity environment.

[0041] Furthermore, the heating plate 10 can be configured as a multi-drive plate (e.g., 6-drive plate, 8-drive plate) layout, meaning it contains multiple heating wires, each evenly distributed across different areas within the cavity. When uneven heating in a particular area leads to lower or higher temperatures, the multi-drive plate can control the temperature of the heating wires by adjusting the current ratio, thereby controlling the surface temperature of the heating plate. Therefore, when a fault occurs in one group of heating wires, the fault can be detected promptly through temperature changes, and other parameters can be adjusted at high temperatures to temporarily resolve the problem, effectively improving the efficiency and accuracy of troubleshooting the heating plate 10.

[0042] Please refer to Figure 2 , Figure 2 A schematic diagram of the structure of a temperature measuring cavity provided according to some embodiments of the present invention is shown.

[0043] like Figure 2 As shown, each temperature measuring chamber is formed by a through hole penetrating the bottom plate 20 of the chamber and a hollow protrusion 21. The hollow side of the protrusion 21 is sealed to the end of the through hole facing the process chamber and protrudes from the upper surface of the bottom plate 20 of the chamber.

[0044] Furthermore, the upper surface of the protrusion 21 contacts the lower surface of the heating plate 10, and the temperature sensing element is a thermocouple 30. The outer circumferential surface of the thermocouple 30 is fixedly connected to the inner surface of the through hole (e.g., threaded connection) and contacts the inner surface of the hollow side of the protrusion 21 to measure the temperature of the corresponding area on the lower surface of the heating plate 10.

[0045] Please refer to Figure 3 , Figure 3 A schematic diagram of the distribution of a temperature measuring cavity provided according to some embodiments of the present invention is shown.

[0046] like Figure 3 As shown, each temperature measuring chamber is evenly distributed on the bottom plate 20 of the chamber, thereby detecting the temperature uniformity of the entire back surface of the heating plate 10, so as to avoid process problems caused by uneven temperature distribution of the heating plate 10.

[0047] In some embodiments, the temperature measuring chambers are arranged in multiple rings on the cavity base plate 20. Each temperature measuring chamber located within the same ring maintains an equal circumferential angle and radial spacing relative to the center of the cavity base plate 20, ensuring that the multiple temperature measuring chambers can achieve balanced temperature detection coverage over different areas of the cavity base plate 20. Here, the multiple rings can be evenly distributed radially or non-uniformly distributed radially to measure the corresponding temperature at preset measurement points.

[0048] In some embodiments, the number of temperature measuring cavities is 24, and each temperature measuring cavity is arranged in two rings.

[0049] In some embodiments, the outer contour of the protrusion 21 is cylindrical to facilitate processing. Simultaneously, the cylindrical external structure offers low air resistance, preventing airflow turbulence and avoiding adverse effects on gas uniformity within the process chamber.

[0050] In some embodiments, the protrusion 21 is made of alumina. Here, the alumina contains no more than 0.3% impurities.

[0051] In addition, the temperature detection device may also include a sliding mechanism. The sliding mechanism is fixedly connected to the heating plate 10 and drives the heating plate 10 to move toward the cavity bottom plate 20 so that the heating plate 10 contacts the upper surface of each protrusion 21 on the cavity bottom plate 20.

[0052] Please refer to Figure 4 , Figure 4 A schematic diagram of thermocouple storage distribution according to some embodiments of the present invention is shown.

[0053] like Figure 4 As shown, each thermocouple 30 extends out of the bottom plate from one side of the chamber bottom plate for storage and unified power supply via the storage mechanism 31, thereby saving space in the area below the process chamber and reducing the possibility of particle generation.

[0054] The working principle of the above-mentioned temperature detection device will be described below with reference to some embodiments of temperature detection methods. Those skilled in the art will understand that these embodiments of temperature detection methods are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concept of the invention and provide specific solutions convenient for public implementation, rather than limiting all functions or operating methods of the temperature detection device. Similarly, the temperature detection device is also merely a non-limiting implementation of the present invention and does not constitute a limitation on the executing entity or execution order of the steps in these temperature detection methods.

[0055] Please refer to Figure 5 , Figure 5A schematic flowchart of a temperature detection method according to some embodiments of the present invention is shown.

[0056] like Figure 5 As shown, the temperature of the heating plate 10 can first be raised to a preset target temperature. Then, the heating plate 10 is moved towards the cavity base plate 20 of the temperature sensing device so that each temperature sensing cavity contacts the lower surface of the heating plate 10. Finally, the temperature at the contact point between each temperature sensing cavity on the cavity base plate 20 and the lower surface of the heating plate 10 is obtained via a temperature sensing element. Here, since the temperature difference between the front and back sides of the heating plate 10 is negligible, the surface temperature can usually be indirectly reflected by detecting the back side temperature.

[0057] Alternatively, those skilled in the art can obtain the accurate actual temperature by simulating or actually measuring the temperature distribution difference between the front and back sides.

[0058] Those skilled in the art will understand that during the process, the heating plate 10 is moved away from the cavity bottom plate 20 of the temperature detection device to detach from the cavity bottom plate 20 for thin film deposition. After the process is completed or before the process is executed, the heating plate 10 descends and contacts the lower surface of the temperature measuring cavity for temperature detection.

[0059] In some embodiments, the temperature detection method may first move the heating plate 10 away from the cavity base plate 20 of the temperature detection device to perform a thin film deposition process. Then, in response to the process count or process time reaching a preset threshold, the heating plate 10 is moved closer to the cavity base plate 20 of the temperature detection device so that each temperature measuring cavity contacts the lower surface of the heating plate 10. Subsequently, in response to the detection result meeting a preset standard, the heating plate 10 is moved to a process position away from the cavity base plate 20 of the temperature detection device to continue performing the thin film deposition process.

[0060] Here, the preset standard can be either a uniform temperature distribution on the heating plate 10 or a pre-set temperature distribution gradient to adapt to the needs of different processes. Furthermore, when the heating plate 10 malfunctions, other parameters can be adjusted at high temperatures to temporarily resolve the problem (e.g., adjusting the heating wire current).

[0061] In summary, the temperature detection device, process chamber, temperature detection method, and computer-readable storage medium provided by this invention can be used to directly monitor the temperature of the heating plate surface at multiple points without performing multiple heating, cooling, and cavity opening operations on the heating plate. This significantly improves the process efficiency of heating plate temperature detection while ensuring the stability of the cavity environment.

[0062] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0063] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A temperature detection device, characterized in that, include: A cavity base plate is provided with multiple temperature measuring cavities, each of which is in contact with the lower surface of a heating plate located inside the process cavity; as well as Temperature sensing elements are disposed in each of the temperature sensing cavities on the bottom plate of the cavity to measure the temperature of each corresponding area on the lower surface of the heating plate.

2. The temperature detection device as described in claim 1, characterized in that, Each of the temperature measuring cavities is formed by a through hole penetrating the bottom plate of the cavity and a hollow protrusion. The hollow side of the protrusion is sealed to the end of the through hole facing the process chamber and protrudes from the upper surface of the bottom plate of the cavity.

3. The temperature detection device as described in claim 2, characterized in that, The upper surface of the protrusion contacts the lower surface of the heating plate. The temperature measuring element is a thermocouple. The outer circumferential surface of the thermocouple is fixedly connected to the inner surface of the through hole and contacts the inner surface of the hollow side of the protrusion to measure the temperature of the corresponding area on the lower surface of the heating plate.

4. The temperature detection device as described in claim 1, characterized in that, Each of the temperature measuring cavities is evenly distributed on the cavity base plate, and / or Each of the temperature measuring cavities is arranged in multiple rings on the cavity base plate, wherein each of the temperature measuring cavities located in the same ring maintains an equal circumferential angle and radial spacing relative to the center of the cavity base plate.

5. The temperature detection device as described in claim 4, characterized in that, The number of temperature measuring chambers is 24, and each temperature measuring chamber is arranged in two concentric rings.

6. The temperature detection device as described in claim 2, characterized in that, The outer contour of the protrusion is cylindrical.

7. The temperature detection device as described in claim 2, characterized in that, The protrusion is made of aluminum oxide.

8. The temperature detection device as described in claim 2, characterized in that, Also includes: A sliding mechanism is fixedly connected to the heating plate and drives the heating plate to move closer to the bottom plate of the cavity so that the heating plate contacts the upper surface of each protrusion on the bottom plate of the cavity.

9. A process chamber, characterized in that, include: A heating plate is used to perform thin film deposition processes on wafers. as well as The temperature detection device as described in any one of claims 1 to 8.

10. A temperature detection method, characterized in that, Includes the following steps: Raise the temperature of the heating plate to the preset target temperature; The heating plate is moved toward the cavity bottom plate of the temperature detection device as described in any one of claims 1 to 8, so that each of the temperature measuring cavities contacts the lower surface of the heating plate; and The temperature at the contact point between each temperature measuring cavity on the bottom plate of the cavity and the lower surface of the heating plate is obtained via a temperature measuring element.

11. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the temperature detection method as described in claim 10 is implemented.

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