A semiconductor production processing equipment

Abstract

The application discloses a kind of semiconductor production processing equipment, belongs to the field of semiconductor processing.A kind of semiconductor production processing equipment, including feeding box, further comprising: feeding port, symmetrically set up in the side wall of feeding box, the side of feeding box close to feeding port is provided with sealing mechanism, for sealing feeding box;Limiting rail, fixedly connected in the inside of feeding box, the inside of limiting rail is slidably connected with drive motor, the output end of drive motor is fixedly connected with reciprocating screw rod, the end of reciprocating screw rod away from drive motor is fixedly connected with rotating shaft, wherein, reciprocating screw rod is provided with movable disc, movable disc is fixedly connected with multiple groups of pneumatic components between drive motor, when reciprocating screw rod rotates, drive movable disc reciprocating movement along reciprocating screw rod, intermittently compresses pneumatic component;The application can overcome the problem of low semiconductor deposition efficiency, poor deposition quality.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a semiconductor manufacturing and processing equipment. Background Technology

[0002] Semiconductor manufacturing is an extremely complex and precise process involving hundreds of steps and a variety of high-precision equipment. Semiconductor thin film deposition is one of the key processes in semiconductor manufacturing, used to form nanoscale thin films on the wafer surface, including conductive layers (such as metals and polycrystalline silicon), insulating layers (such as SiO2 and Si3N4), and functional layers (such as high-k dielectrics). The core purpose is to precisely prepare thin film layers on the substrate that meet electrical, mechanical, or optical properties, thereby constructing device functions, improving performance, and supporting the continuous development of advanced processes.

[0003] Semiconductor thin film deposition mainly includes chemical vapor deposition: forming a solid thin film on the substrate surface through a gas chemical reaction, that is, introducing gas into the reaction chamber, and the reaction gas diffuses and adsorbs on the wafer surface; physical vapor deposition: depositing metal or compound thin films through physical methods (evaporation, sputtering), causing ions to condense into a film on the wafer surface.

[0004] Currently, most semiconductors require wet cleaning to remove surface contaminants and oxide layers before deposition, ensuring atomic-level surface cleanliness and preventing uneven deposition due to impurity adsorption. After cleaning, the semiconductors are dried immediately to prevent moisture re-adsorption. Existing equipment typically places the semiconductors in the deposition equipment after cleaning and drying, which not only affects the semiconductor deposition efficiency but also makes it easy for the semiconductors to come into contact with dust and other impurities in the air during placement, causing semiconductor contamination and affecting the quality of semiconductor deposition. Summary of the Invention

[0005] The purpose of this invention is to solve the problems of low semiconductor deposition efficiency and poor deposition quality in the prior art, and to propose a semiconductor manufacturing and processing equipment.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A semiconductor manufacturing equipment includes a feeding box, and further includes: a feeding port symmetrically arranged on the side wall of the feeding box; a sealing mechanism provided on the side of the feeding box near the feeding port for sealing the feeding box; a limiting rail fixedly connected inside the feeding box; a drive motor slidably connected inside the limiting rail; a reciprocating screw fixedly connected to the output end of the drive motor; a rotating shaft fixedly connected to the end of the reciprocating screw away from the drive motor; wherein a movable plate is provided on the reciprocating screw; and a fixed connection is made between the movable plate and the drive motor. Multiple sets of pneumatic components drive the movable disk to reciprocate along the reciprocating screw when the reciprocating screw rotates, intermittently compressing the pneumatic components; mounting blocks are symmetrically fixedly connected inside the feeding box, and storage racks are provided on the mounting blocks, with driving components disposed between the storage racks and the mounting blocks; a feeding mechanism is disposed between the rotating shaft and the mounting blocks, and when the rotating shaft rotates, it drives the semiconductor to rotate and move along the feeding box; a cleaning and drying mechanism is disposed between the two sets of mounting blocks, and is used to clean contaminants and oxide layers on the semiconductor surface and to dry it.

[0008] To facilitate sealing of the feeding box and reduce the intake of outside air, preferably, the sealing mechanism includes a receiving groove on the side wall of the feeding box near the feeding port, and a sealing plate is slidably connected inside the receiving groove, wherein one set of the feeding ports is connected to the deposition equipment.

[0009] To facilitate continuous air intake and exhaust during semiconductor transport, preferably, the movable disk has protrusions that match the reciprocating lead screw inside. The pneumatic assembly includes a sealing cylinder fixedly connected to the drive motor. A piston is slidably connected inside the sealing cylinder. A connecting rod that is slidably connected to the sealing cylinder is fixedly connected to the side of the piston away from the drive motor. The end of the connecting rod away from the piston is connected to the movable disk. The piston divides the interior of the sealing cylinder into two sets of sealing chambers. Two sets of first one-way valves are provided on the side wall of the sealing cylinder near the upper sealing chamber, and two sets of second one-way valves are provided on the side wall of the sealing cylinder near the lower sealing chamber. The directions of the two sets of first and second one-way valves are opposite.

[0010] To facilitate semiconductor transport, the feeding mechanism further includes a gear fixedly connected to a rotating shaft. Extensions are fixedly connected to the sides of the mounting blocks that are close to each other. One set of extensions is fixedly connected to a fixed toothed plate that meshes with the gear, and another set of extensions is fixedly connected to a positioning plate that fits against the rotating shaft. A suction cup is fixedly connected to the top of the rotating shaft. The suction cup is connected to one set of first and second one-way valves via a pipe and a slip ring. When the suction cup rotates, the first or second one-way valve is in a suction state.

[0011] To facilitate the placement of semiconductors in the loading bin and the transport of semiconductors to the deposition equipment, the drive assembly further includes electrically operated sealing grooves symmetrically arranged within the extension. An electric actuator is slidably connected inside the electrically operated sealing groove, with the end of the actuator away from the electrically operated sealing groove connected to a storage rack. The exhaust end of the electrically operated sealing groove is connected to the receiving groove via a pipe, and the air inlet end of the electrically operated sealing groove is connected to the interior of the loading bin. Pneumatic valves are installed on the side of the loading bin near the receiving groove and between the slip ring of the suction cup and the pipe. These pneumatic valves are connected to the air inlet end of the electrically operated sealing groove via pipes. When air is drawn into the pneumatic valves, the valve near the receiving groove is open, and the valve near the suction cup is closed.

[0012] To enhance the intelligence of the equipment and improve the stability of semiconductor deposition, the system further includes elastic telescopic rods that are symmetrically fixed to the inner wall of the feeding box near the limiting rail. A control switch is installed inside the elastic telescopic rods. The control switch is electrically connected to the drive motor and the electric sealing groove. The electric sealing groove and the electric push rod adopt a reciprocating stop drive mode. When the control switch is triggered, the drive motor rotates in the opposite direction.

[0013] To facilitate the cleaning of contaminants and oxide layers on the semiconductor surface, the cleaning and drying mechanism further includes a connecting plate fixedly connected to one side of the mounting block. A dust suction channel is provided on the side of the connecting plate near the storage rack. A cleaning plate is fixedly connected to the side of the connecting plate near the dust suction channel. A cleaning cotton is provided at one end of the connecting plate near the storage rack. An air extraction pipe connected to the dust suction channel is provided on the side of the connecting plate away from the cleaning cotton. The air extraction pipe is connected to a pipe near the suction cup. The air extraction pipe extends to the outside of the loading box and is equipped with a dust collection device to collect impurities in the gas.

[0014] To facilitate the drying of residual cleaning agent on the semiconductor surface, the system further includes multiple sets of mounting brackets fixedly connected between the two sets of mounting blocks. Multiple sets of nozzles are fixedly connected to the side of the mounting brackets near the storage rack. The mounting brackets are provided with exhaust pipes that communicate with the nozzles. A set of first and second one-way valves in the exhaust pipes are connected by a pipe. When the suction cup rotates, the first and second one-way valves are in the exhaust state.

[0015] To further reduce the entry of outside air during semiconductor placement, a sliding groove is further included within the mounting block. A compression rod is slidably connected inside the sliding groove, and the end of the compression rod is connected to a storage rack. A connecting member is fixedly connected to the top of the loading box on the side away from the deposition equipment, and the connecting member is connected to the sliding groove via a pipe.

[0016] To ensure the stability of semiconductor placement, the storage rack is further configured in a semi-circular shape, with holes on the storage rack that match the suction cups. The side of the storage rack near the suction cup holes is convex, and the top of the suction cups matches the storage rack.

[0017] Compared with the prior art, the present invention provides a semiconductor manufacturing and processing equipment, which has the following beneficial effects:

[0018] 1. The semiconductor manufacturing equipment can drive the storage rack on the side away from the deposition equipment to extend to the outside of the loading box through the drive component, so as to place the semiconductor to be deposited on the storage rack. During the movement of the storage rack, an air curtain is formed at the feeding port through the connecting part to reduce the entry of outside air and ensure the cleanliness of the inside of the loading box.

[0019] 2. This semiconductor manufacturing equipment can transport semiconductors into the deposition equipment via a drive component. After the transport is completed, the drive sealing plate seals the feed port. This ensures the cleanliness of the feed box and prevents gas exchange between the feed box and the deposition equipment during the semiconductor deposition process, thereby ensuring the stability of semiconductor deposition.

[0020] 3. This semiconductor manufacturing equipment enables the semiconductor to rotate and move via a feeding mechanism. Pneumatic components then continuously draw in and exhaust air from the cleaning and drying mechanism, thus cleaning and drying the semiconductor surface. This not only improves the efficiency and effectiveness of semiconductor cleaning and drying but also reduces energy consumption. Continuous cleaning, drying, and deposition of the semiconductor not only improves deposition efficiency but also prevents contamination from dust and other impurities in the air when the semiconductor is placed in the deposition equipment, thereby improving the deposition quality.

[0021] The parts of the device not involved are the same as or can be implemented using existing technologies. This invention can overcome the problems of low semiconductor deposition efficiency and poor deposition quality. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a semiconductor manufacturing and processing equipment proposed in this invention;

[0023] Figure 2 This is a schematic diagram of the internal structure of the feeding box in a semiconductor manufacturing and processing equipment proposed in this invention;

[0024] Figure 3 This is a partial structural diagram of a semiconductor manufacturing and processing equipment proposed in this invention. Figure 1 ;

[0025] Figure 4 This is a partial structural diagram of a semiconductor manufacturing and processing equipment proposed in this invention. Figure 2 ;

[0026] Figure 5 This is a schematic diagram of the structure of gears, fixed gear plates, rotating shafts, and positioning plates in a semiconductor manufacturing equipment proposed in this invention.

[0027] Figure 6 This is a schematic diagram of the structure of a connecting plate in a semiconductor manufacturing and processing equipment proposed in this invention;

[0028] Figure 7 This is a partial cross-sectional structural diagram of a pneumatic component in a semiconductor manufacturing and processing equipment proposed in this invention;

[0029] Figure 8 This is a cross-sectional structural diagram of the mounting plate and extension in a semiconductor manufacturing equipment proposed in this invention.

[0030] In the diagram: 1. Feeding box; 2. Feeding port; 3. Storage slot; 4. Sealing plate; 5. Mounting block; 6. Limit rail; 7. Drive motor; 8. Reciprocating screw; 9. Movable disc; 10. Rotating shaft; 11. Gear; 12. Pneumatic assembly; 121. Sealing cylinder; 122. Piston; 123. Connecting rod; 124. First one-way valve; 125. Second one-way valve; 13. Elastic telescopic rod; 14. Suction cup; 15. Extension piece; 16. Fixed toothed plate; 17. Positioning plate; 18. Electric sealing groove; 19. Electric push rod; 20. Storage rack; 21. Sliding groove; 22. Compression rod; 23. Connecting plate; 24. Dust suction channel; 25. Cleaning plate; 26. Cleaning cotton; 27. Suction pipe; 28. Fixing frame; 29. ​​Nozzle; 30. Exhaust pipe; 31. Connecting piece. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0032] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0033] Example:

[0034] Reference Figures 1-8 A semiconductor manufacturing equipment includes a feeding box 1, and further includes: a feeding port 2 symmetrically arranged on the side wall of the feeding box 1, a sealing mechanism provided on the side of the feeding box 1 near the feeding port 2 for sealing the feeding box 1; a limiting rail 6 fixedly connected inside the feeding box 1, a drive motor 7 slidably connected inside the limiting rail 6, a reciprocating screw 8 fixedly connected to the output end of the drive motor 7, and a rotating shaft 10 fixedly connected to the end of the reciprocating screw 8 away from the drive motor 7; wherein a movable disk 9 is provided on the reciprocating screw 8, and multiple sets of pneumatic components 12 are fixedly connected between the movable disk 9 and the drive motor 7; when the reciprocating screw 8 rotates, the driven movable disk 9 reciprocates along the reciprocating screw 8 intermittently. The pneumatic assembly 12 is compressed; the mounting block 5 is symmetrically fixed inside the loading box 1, and a storage rack 20 is provided on the mounting block 5. The storage rack 20 is semi-circular and has holes that match the suction cup 14. The side of the storage rack 20 near the hole of the suction cup 14 is protruding. The top of the suction cup 14 matches the storage rack 20. A drive assembly is provided between the storage rack 20 and the mounting block 5; the feeding mechanism is provided between the rotating shaft 10 and the mounting block 5. When the rotating shaft 10 rotates, it is used to drive the semiconductor to rotate and move along the loading box 1; the cleaning and drying mechanism is provided between the two sets of mounting blocks 5 and is used to clean contaminants and oxide layers on the semiconductor surface and dry them.

[0035] In this embodiment, before semiconductor deposition, the storage rack 20 is first transported to the outside of the loading box 1 by the drive assembly. After the semiconductor is placed on the storage rack 20, the storage rack 20 is stored in the loading box 1. At the same time, the drive motor 7 drives the feeding mechanism to rotate, and the pneumatic assembly 12 causes the suction cup 14 to adsorb and fix the semiconductor, realizing the rotation and movement of the semiconductor. During this process, the suction end and exhaust end of the pneumatic assembly 12 drive the cleaning and drying mechanism to clean and dry the semiconductor surface until the semiconductor is transported to the storage rack 20 near the deposition equipment. Then the storage rack 20 transports the semiconductor into the deposition equipment. The mechanical gripper in the deposition equipment grabs the semiconductor to the designated position in the deposition equipment to complete the semiconductor deposition. It should be noted that when the storage rack 20 moves out of the loading box 1, the sealing mechanism stops sealing the feeding port 2. When the storage rack 20 moves into the loading box 1, the sealing mechanism seals the feeding port 2 to ensure the cleanliness of the loading box 1.

[0036] Reference Figures 1-2 The sealing mechanism includes a receiving groove 3 located on the side wall of the feeding box 1 near the feeding port 2. A sealing plate 4 is slidably connected inside the receiving groove 3, and one set of feeding ports 2 is connected to the deposition equipment.

[0037] In this embodiment, when the air pressure in the receiving groove 3 increases, it will drive the sealing plate 4 to move upward along the receiving groove 3 until it is in contact with the upper part of the inner wall of the feeding box 1. On the one hand, it can prevent outside air from entering the interior of the feeding box 1, and on the other hand, it can prevent gas exchange between the feeding box 1 and the deposition equipment, thereby ensuring the cleanliness of the semiconductor surface during deposition and the stability of the semiconductor during deposition.

[0038] Reference Figure 2 , Figure 3 and Figure 7 The movable disc 9 has protrusions inside that match the reciprocating screw 8. The pneumatic assembly 12 includes a sealing cylinder 121 fixedly connected to the drive motor 7. A piston 122 is slidably connected inside the sealing cylinder 121. A connecting rod 123 that is slidably connected to the sealing cylinder 121 is fixedly connected to the side of the piston 122 away from the drive motor 7. The end of the connecting rod 123 away from the piston 122 is connected to the movable disc 9. The piston 122 divides the interior of the sealing cylinder 121 into two sets of sealing chambers. Two sets of first one-way valves 124 are provided on the side wall of the sealing cylinder 121 near the upper sealing chamber, and two sets of second one-way valves 125 are provided on the side wall of the sealing cylinder 121 near the lower sealing chamber. The directions of the two sets of first one-way valves 124 and second one-way valves 125 are opposite.

[0039] In this embodiment, when the drive motor 7 drives the reciprocating screw 8 to rotate, it will drive the movable disk 9 to move up and down along the reciprocating screw 8, thereby driving the piston 122 to move up and down along the inside of the sealing cylinder 121 through the connecting rod 123, intermittently compressing and adsorbing the gas in the sealing cavities on both sides. During this process, only one set of the first one-way valve 124 and the second one-way valve 125 is in the open state, realizing the adsorption and discharge of gas. While ensuring stable gas delivery, it can reduce energy consumption and is more energy-saving and environmentally friendly.

[0040] Reference Figure 2 , Figure 3 and Figure 5 The feeding mechanism includes a gear 11 fixedly connected to the rotating shaft 10. An extension 15 is fixedly connected to one side of the mounting blocks 5 that are close to each other. A fixed toothed plate 16 that meshes with the gear 11 is fixedly connected to one set of extensions 15. A positioning plate 17 that fits against the rotating shaft 10 is fixedly connected to the other set of extensions 15. A suction cup 14 is fixedly connected to the top of the rotating shaft 10. The suction cup 14 is connected to one set of first one-way valves 124 and second one-way valves 125 through a pipe and a slip ring. When the suction cup 14 rotates, the first one-way valve 124 or the second one-way valve 125 is in the suction state.

[0041] In this embodiment, when the drive motor 7 drives the reciprocating screw 8 to rotate, it will drive the rotating shaft 10 and the gear 11 to rotate. Under the action of the fixed gear plate 16, the gear 11 moves along the fixed gear plate 16 while rotating. Under the action of the positioning plate 17, the gear 11 is always meshed with the fixed gear plate 16 during the rotation process, thereby driving the suction cup 14 to move while rotating, that is, driving the semiconductor on the suction cup 14 to rotate and move, so as to clean and dry the surface of the semiconductor during the transportation process.

[0042] Reference Figure 4 and Figure 8 The drive assembly includes an electric sealing groove 18 symmetrically arranged within the extension 15. An electric push rod 19 is slidably connected inside the electric sealing groove 18. The end of the electric push rod 19 away from the electric sealing groove 18 is connected to the storage rack 20. The exhaust end of the electric sealing groove 18 is connected to the receiving groove 3 through a pipe. The air inlet end of the electric sealing groove 18 is connected to the inside of the loading box 1. Pneumatic valves are provided on the side of the loading box 1 near the receiving groove 3 and between the slip ring of the suction cup 14 and the pipe. The pneumatic valves are connected to the air inlet end of the electric sealing groove 18 through a pipe. When the pneumatic valve is sucked, the pneumatic valve on the side near the receiving groove 3 is in the open state, and the pneumatic valve on the side near the suction cup 14 is in the closed state.

[0043] In this embodiment, it should be explained that the specific structure of the electric sealing groove 18 and the electric push rod 19 can refer to the technical solutions in the prior art, which can be known by those skilled in the art. In addition, after the electric push rod 19 extends outward along the electric sealing groove 18 once, it pauses for a specified time and then automatically resets. This is a conventional method in the prior art and will not be described in detail here. When the storage rack 20 moves to the outside of the upper material box 1, the electric sealing groove 18 is in a negative pressure state, which makes the pneumatic valve in the receiving groove 3 open. Under the action of the sealing plate 4's own gravity, the sealing plate 4 is quickly stored in the receiving groove 3. When the storage rack 20 moves into the upper material box 1, the electric sealing groove 18 is in a compressed state, which delivers gas to the receiving groove 3, thereby pushing the sealing plate 4 to the outside of the receiving groove 3 until the feeding port 2 is sealed to ensure the cleanliness of the air in the feeding box 1.

[0044] Reference Figure 3 It also includes an elastic telescopic rod 13 that is symmetrically fixedly connected to the inner wall of the feeding box 1 near the limit rail 6. The elastic telescopic rod 13 is equipped with a control switch. The control switch is electrically connected to the drive motor 7 and the electric sealing groove 18. The electric sealing groove 18 and the electric push rod 19 adopt a reciprocating stop drive mode. When the control switch is triggered, the drive motor 7 rotates in the opposite direction.

[0045] In this embodiment, a structure such as a ball bearing or roller can be provided at the bottom of the drive motor 7 to reduce the friction between the drive motor 7 and the limiting rail 6, thereby ensuring the stability of the drive motor 7's movement. When the drive motor 7 moves to the elastic telescopic rod 13 and compresses the elastic telescopic rod 13 to a specified length, a control switch is triggered, and then the drive motor 7 rotates in the opposite direction, causing the drive motor 7 to move in the opposite direction, so as to continuously deliver semiconductors.

[0046] Reference Figure 2 , Figure 4 and Figure 6 The cleaning and drying mechanism includes a connecting plate 23 fixedly connected to the mounting block 5 on one side close to each other. A dust suction channel 24 is provided on the side of the connecting plate 23 near the storage rack 20. A cleaning plate 25 is fixedly connected to the side of the connecting plate 23 near the dust suction channel 24. A cleaning cotton 26 is provided at one end of the connecting plate 23 near the storage rack 20. An air extraction pipe 27 connected to the dust suction channel 24 is provided on the side of the connecting plate 23 away from the cleaning cotton 26. The air extraction pipe 27 is connected to a pipe near the suction cup 14. The air extraction pipe 27 extends to the outside of the loading box 1. The unit also includes a dust collection device on the exhaust pipe 27 for collecting impurities in the gas, and multiple sets of fixing frames 28 fixedly connected between the two sets of mounting blocks 5. Multiple sets of nozzles 29 are fixedly connected to the side of the fixing frame 28 near the storage rack 20. An exhaust pipe 30 connected to the nozzles 29 is provided on the fixing frame 28. The first one-way valve 124 and the second one-way valve 125 of the exhaust pipe 30 are connected by a pipe. When the suction cup 14 rotates, the first one-way valve 124 and the second one-way valve 125 are in the exhaust state.

[0047] In this embodiment, during the transport process, the semiconductor first passes through the cleaning plate 25. The cleaning plate 25 can block impurities with larger particle sizes on the semiconductor surface and adsorb the blocked impurities through the dust suction channel 24, and finally collect them into the dust collection device. Then, the cleaning cotton 26 cleans the contaminants and oxide layer remaining on the semiconductor surface (wet cleaning, the cleaning cotton 26 is wet and contains cleaning solution) to ensure atomic-level cleanliness of the semiconductor surface. Then, the semiconductor moves to the nozzle 29 and is dried by rotation to prevent moisture from being re-adsorbed on the semiconductor.

[0048] Reference Figure 1 and Figure 8 It also includes a sliding groove 21 opened in the mounting block 5, a compression rod 22 is slidably connected inside the sliding groove 21, the end of the compression rod 22 is connected to the storage rack 20, and a connecting piece 31 is fixedly connected to the top of the feeding box 1 on the side away from the sedimentation equipment, and the connecting piece 31 is connected to the sliding groove 21 through a pipe.

[0049] In this embodiment, during the movement of the storage rack 20, if the storage rack 20 moves to the outside of the upper material box 1, the sliding groove 21 is in a negative pressure state, and the gas at the feeding port 2 is adsorbed through the connecting member 31, thus adsorbing impurities in the air when the outside enters the upper material box 1. If the storage rack 20 moves to the inside of the upper material box 1, the sliding groove 21 is in a compressed state, so that the gas is blown from the connecting member 31 to the feeding port 2, thereby reducing the entry of outside air and ensuring the cleanliness of the upper material box 1.

[0050] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor production processing equipment comprising a loading box (1), characterized in that, Also include: The feeding port (2) is symmetrically opened on the side wall of the feeding box (1), and the feeding box (1) is provided with a sealing mechanism on the side close to the feeding port (2), which is used for sealing the feeding box (1); The limiting rail (6) is fixedly connected inside the feeding box (1), the driving motor (7) is slidably connected inside the limiting rail (6), the output end of the driving motor (7) is fixedly connected with the reciprocating screw (8), and the end of the reciprocating screw (8) away from the driving motor (7) is fixedly connected with the rotating shaft (10), Wherein, the reciprocating screw (8) is provided with a movable disc (9), a plurality of groups of pneumatic components (12) are fixedly connected between the movable disc (9) and the driving motor (7), when the reciprocating screw (8) rotates, the movable disc (9) is driven to reciprocate along the reciprocating screw (8), and the pneumatic components (12) are intermittently compressed; The mounting block (5) is symmetrically fixedly connected inside the feeding box (1), the mounting block (5) is provided with a storage rack (20), and the storage rack (20) and the mounting block (5) are provided with a driving assembly; The feeding mechanism is arranged between the rotating shaft (10) and the mounting block (5), and when the rotating shaft (10) rotates, it is used for driving the semiconductor to rotate and move along the feeding box (1); The cleaning and drying mechanism is arranged between the two groups of mounting blocks (5), which is used for cleaning and drying the contaminants and oxidation layer on the surface of the semiconductor.

2. The semiconductor manufacturing apparatus according to claim 1, wherein The sealing mechanism includes a receiving groove (3) opened on the side wall of the feeding box (1) close to the feeding port (2), the inside of the receiving groove (3) is slidably connected with a sealing plate (4), and one group of the feeding port (2) is connected with the deposition equipment.

3. The semiconductor manufacturing apparatus according to claim 2, wherein The inside of the movable disc (9) is provided with a protrusion matched with the reciprocating screw (8), the pneumatic component (12) includes a sealing cylinder (121) fixedly connected on the driving motor (7), the inside of the sealing cylinder (121) is slidably connected with a piston (122), the side of the piston (122) away from the driving motor (7) is fixedly connected with a connecting rod (123) slidably connected with the sealing cylinder (121), Wherein, the end of the connecting rod (123) away from the piston (122) is connected with the movable disc (9), the piston (122) divides the inside of the sealing cylinder (121) into two groups of sealing cavities, the side wall of the sealing cylinder (121) close to the upper sealing cavity is provided with two groups of first one-way valves (124), the side wall of the sealing cylinder (121) close to the lower sealing cavity is provided with two groups of second one-way valves (125), and the directions of the two groups of first one-way valves (124) and second one-way valves (125) are opposite.

4. The semiconductor manufacturing apparatus according to claim 3, wherein The feeding mechanism includes a gear (11) fixedly connected to the rotating shaft (10), and the side of the mounting block (5) close to each other is fixedly connected with an extension piece (15), one group of the extension piece (15) is fixedly connected with a fixed tooth plate (16) engaged with the gear (11), and the other group of the extension piece (15) is fixedly connected with a positioning plate (17) fitted with the rotating shaft (10), and the top end of the rotating shaft (10) is fixedly connected with a suction cup (14), Wherein, the suction cup (14) and one group of the first one-way valve (124) and the second one-way valve (125) are connected through the pipeline and the slip ring, when the suction cup (14) rotates, the first one-way valve (124) or the second one-way valve (125) is in the state of inhaling.

5. The semiconductor manufacturing apparatus according to claim 4, wherein The driving assembly includes a motorized sealing groove (18) symmetrically opened in the extension piece (15), the inside of the motorized sealing groove (18) is slidably connected with an electric push rod (19), the end of the electric push rod (19) away from the motorized sealing groove (18) is connected with a storage rack (20), Wherein, the exhaust end of the motorized sealing groove (18) and the receiving groove (3) are connected through the pipeline, the air inlet end of the motorized sealing groove (18) and the inside of the feeding box (1) are connected, the side of the feeding box (1) close to the receiving groove (3) and the slip ring of the suction cup (14) and the pipeline are provided with pneumatic valves, the pneumatic valves and the air inlet end of the motorized sealing groove (18) are connected through the pipeline, when the pneumatic valve inhales, the pneumatic valve close to the receiving groove (3) is in the open state, and the pneumatic valve close to the suction cup (14) is in the closed state.

6. The semiconductor manufacturing apparatus according to claim 5, wherein It also includes a flexible telescopic rod (13) fixedly connected to the inner wall of the feeding box (1) close to the limiting rail (6), the inside of the flexible telescopic rod (13) is provided with a control switch, and the control switch is electrically connected with the driving motor (7) and the motorized sealing groove (18), Wherein, the driving mode between the motorized sealing groove (18) and the electric push rod (19) is reciprocating and stagnation, when the control switch is triggered, the driving motor (7) rotates in the opposite direction.

7. The semiconductor manufacturing apparatus according to claim 4, wherein The cleaning and drying mechanism includes a connecting plate (23) fixedly connected to the side of the mounting block (5) close to each other, the connecting plate (23) close to the storage rack (20) side is provided with a dust suction channel (24), the connecting plate (23) close to the dust suction channel (24) side is fixedly connected with a cleaning plate (25), the connecting plate (23) close to the storage rack (20) side is provided with a cleaning cotton (26), the connecting plate (23) away from the cleaning cotton (26) side is provided with an air suction pipe (27) connected with the dust suction channel (24), and the air suction pipe (27) is connected with the pipeline close to the suction cup (14) side, Wherein, the air suction pipe (27) extends to the outside of the feeding box (1), and the air suction pipe (27) is provided with a dust collecting device for collecting impurities in the gas.

8. The semiconductor manufacturing apparatus according to claim 7, wherein Also include a plurality of fixed frame (28) fixedly connected between the two groups of mounting block (5), the fixed frame (28) is fixedly connected with a plurality of nozzles (29) near the side of the storage rack (20), the fixed frame (28) is provided with exhaust pipe (30) communicated with the nozzle (29), Wherein, the exhaust pipe (30) one group of first one-way valve (124) and second one-way valve (125) through the pipeline is communicated, when the suction cup (14) rotates, the first one-way valve (124) and the second one-way valve (125) are in exhaust state.

9. The semiconductor manufacturing apparatus according to claim 1, wherein Also includes a sliding groove (21) opened in the mounting block (5), the sliding groove (21) is slidably connected with the compression rod (22), the end of the compression rod (22) is connected with the storage rack (20), the top of the feeding box (1) is fixedly connected with the communication piece (31) away from the deposition equipment side, the communication piece (31) and the sliding groove (21) are communicated through the pipeline.

10. The semiconductor manufacturing apparatus according to claim 4, wherein The storage rack (20) is semicircular, the storage rack (20) is provided with a hole matched with the suction cup (14), the side of the storage rack (20) near the hole of the suction cup (14) is convex, and the top of the suction cup (14) is matched with the storage rack (20).

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