Turnover mechanism for semiconductor tank cleaning machine

Abstract

The application discloses a turnover mechanism of a semiconductor slot type cleaning machine, which comprises a turnover base, wherein the turnover base is connected with a right main plate and a left main plate; an installation support is arranged on the turnover base, the end of the installation support is provided with a first sensor, and the output end of the first sensor is connected with a control system; a turnover frame structure is arranged between the right main plate and the left main plate; the turnover frame structure comprises a frame left side plate, a frame main plate and a frame right side plate, the frame left side plate is connected with a driving structure, and the frame right side plate is provided with a rotating shaft structure; the rotating shaft structure is connected with a sensor monitoring plate, the sensor monitoring plate is provided with a second sensor, and the output end of the second sensor is connected with the control system; the inner side of the frame left side plate is provided with a first bearing bracket, and the inner side of the frame right side plate is provided with a second bearing bracket. The application has the advantages of higher controllability and stability, in addition, the motor driving makes the overall mechanical structure more compact and simple, and further reduces the overall production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor production, more particularly to a turnover mechanism of a semiconductor slot cleaning machine. BACKGROUND

[0002] A wafer refers to a silicon wafer used for manufacturing silicon semiconductor integrated circuits. Since the wafer has a circular shape, it is called a wafer. Various circuit element structures can be processed and manufactured on the silicon wafer to become IC products with specific electrical properties.

[0003] A 90° turnover mechanism of a semiconductor slot cleaning machine is a core transfer unit for realizing accurate conversion of wafer posture. The core function is to smoothly turn the wafer in the initial vertical plug state to a horizontal posture, providing a standardized operating posture for the subsequent robot gripper to pick up the wafer.

[0004] In the specific work flow, the wafer that has completed the turnover is accurately grabbed by the robot gripper and then transferred to the subsequent FOUP (front opening unified pod) loading area to complete the process connection. As a key module in the automatic production line of the slot cleaning machine, the turnover mechanism directly affects the transfer accuracy and efficiency of the wafer between different process links and is the core equipment for ensuring the continuity and stability of the cleaning process.

[0005] Traditional 90° turnover mechanisms mostly use cylinder drives to realize the turnover action, but the problem of insufficient running stability is particularly prominent. When the cylinder drive device performs the turnover, if there is a sudden change in speed (such as start-stop or change direction), it will cause instantaneous fluctuations in the force acting on the wafer, resulting in unexpected contact friction between the wafer and the groove that carries it. Such abnormal friction easily causes scratches, indentations, and other mechanical damage on the wafer surface, seriously threatening product yield and reliability.

[0006] Therefore, there is an urgent need for a turnover mechanism of a semiconductor slot cleaning machine. SUMMARY

[0007] The technical problem to be solved by the present application is to provide a turnover mechanism of a semiconductor slot cleaning machine to solve the problems in the background art.

[0008] To solve the above technical problems, the technical solutions adopted by the present application are as follows.

[0009] The application discloses a turnover mechanism of a semiconductor tank cleaning machine, which is used for turning over after a wafer is placed by a robot gripper under the control of a control system, and comprises a turnover base provided with an opening in the middle, right and left main plates which are arranged in parallel and connected to the two sides of the opening of the turnover base, an installation support which is arranged vertically on the turnover base and is provided with a first sensor at the end of the installation support, and an output end of the first sensor is connected to the control system, the right and left main plates are perpendicular to the turnover base, and a turnover frame structure is arranged between the right and left main plates, the turnover frame structure comprises a left frame plate, a main frame plate and a right frame plate which are connected together in sequence, the left frame plate is provided with a driving structure which penetrates through the left main plate and is used for driving the turnover frame structure, the right frame plate is provided with a rotating shaft structure which penetrates through the right main plate and is used in cooperation with the driving structure, a sensor monitoring plate is connected to the rotating shaft structure, two second sensors which are arranged perpendicularly to each other and are used for detecting the rotating angle of the sensor monitoring plate are arranged beside the sensor monitoring plate, and output ends of the two second sensors are connected to the control system, and the inner side of the left frame plate is provided with a first supporting frame used for placing the wafer, and the inner side of the right frame plate is provided with a second supporting frame used in cooperation with the first supporting frame.

[0010] Further optimization technical scheme, the back of the turnover base is provided with a horizontal plate provided with an opening in the middle, and the horizontal plate is the same in shape as the turnover base.

[0011] Further optimization technical scheme, a pair of fixing plates used for strengthening connection are connected between the right and left main plates and the turnover base, and the fixing plates are arranged perpendicularly to the turnover base.

[0012] Further optimization technical scheme, the driving structure comprises a motor, a speed reducer and a shaft, the shaft of the motor penetrates through the left main plate and the left frame plate, the motor is connected to the speed reducer through a shaft coupling, and the controlled ends of the motor and the speed reducer are connected to the control system, a motor cover connected to the left main plate is arranged outside the motor, and a mounting base used for mounting the motor is arranged in the motor cover.

[0013] Further optimization technical scheme, the shaft of the motor in the driving structure is connected to a pin key, the other end of the pin key is connected to a left turnover shaft, and the left turnover shaft is connected to the left main plate.

[0014] Further optimization technical scheme, the rotating shaft structure comprises a right turnover shaft which penetrates through the right main plate and is connected to the right frame plate through a bearing, a sleeve and a bearing seat are sleeved on the right turnover shaft, a cover body is sleeved on the right turnover shaft, the cover body is connected to the sensor monitoring plate, and a bearing cover connected to the right main plate is buckled outside the rotating shaft structure.

[0015] Further optimization technical scheme, the second sensor is arranged on the bearing cover, the second sensor is connected to a connecting frame, and the connecting frame is connected to the bearing cover.

[0016] Further optimize the technical scheme, the sensor monitoring plate includes a wafer part sleeved on the sleeve, the wafer part is connected with the cover by bolts, and the wafer part is connected with a semicircular ring type ring piece body arranged in the same plane.

[0017] Further optimize the technical scheme, the frame left side plate and the first supporting frame, and the frame right side plate and the second supporting frame are connected through a pair of parallel mounting plates.

[0018] Due to the adoption of the above technical scheme, the technical progress achieved by the application is as follows.

[0019] The turnover mechanism of the semiconductor slot type cleaning machine provided by the application is driven by a motor to actuate the turnover mechanism, and a first sensor and a second sensor are used to detect the action of a robot gripper and the turnover angle. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a structural schematic view of the application; Figure 2 is a split view of the application; Figure 3 is a structural schematic view of the rotating shaft mechanism in the application; Figure 4 is a working state view of the sensor detection plate in the application; Figure 5 is another working state view of the sensor detection plate in the application; 1, horizontal plate, 2, turnover base, 3, right side main plate, 4, fixed plate, 5, mounting bracket, 6, first sensor, 7, mounting plate, 8, left side main plate, 10, left side turnover shaft, 11, frame right side plate, 12, frame left side plate, 13, frame main plate, 15, first supporting frame, 16, second supporting frame, 17, motor cover, 18, bearing cover, 19, mounting base, 20, right side turnover shaft, 21, sleeve, 22, bearing seat, 23, cover, 28, motor, 29, speed reducer, 30, pin key, 31, second sensor, 32, connecting frame, 33, sensor monitoring plate. DETAILED DESCRIPTION

[0021] The application will be further described in detail below with reference to the drawings and specific embodiments.

[0022] A turnover mechanism of a semiconductor slot type cleaning machine is used to turn the wafer after the robot gripper is controlled by the control system to place the wafer, and the first sensor and the second sensor are used to detect the action of the robot gripper and the turnover angle. Figures 1 to 5As shown, it includes a horizontal plate 1, a flip base 2, a right main plate 3, a fixing plate 4, a mounting bracket 5, a first sensor 6, a mounting plate 7, a left main plate 8, a left flip shaft 10, a right side plate 11, a left side plate 12, a main plate 13, a first support bracket 15, a second support bracket 16, a rotating shaft structure, a drive structure, a second sensor 31, a connecting bracket 32, and a sensor monitoring plate 33.

[0023] The drive structure includes a motor 28, a reducer 29, a key pin 30, a mounting base 19, and a motor cover 17; the rotating shaft structure includes a right-side flip shaft 20, a sleeve 21, a bearing seat 22, a cover 23, and a bearing housing 18.

[0024] The flip base 2 has an opening in the middle for the robot arm to pass through, and a horizontal plate 1 is provided on the back of the flip base 2. The horizontal plate 1 has the same shape as the flip base 2.

[0025] The right main board 3 and the left main board 8 are connected to the two sides of the opening of the flip base 2, respectively. The right main board 3 and the left main board 8 are arranged in parallel and perpendicular to the flip base 2. A pair of fixing plates 4 are connected between the right main board 3, the left main board 8 and the flip base 2. The fixing plates 4 are arranged perpendicular to the flip base 2 and are used to strengthen the connection.

[0026] A mounting bracket 5 is vertically mounted on the flip base 2. A first sensor 6 is mounted on the end of the mounting bracket 5, and the output of the first sensor 6 is connected to the control system to detect the position of the robot gripper.

[0027] A flip frame structure is provided between the right main board 3 and the left main board 8. The flip frame structure includes a left frame plate 12, a frame main board 13, and a right frame plate 11 that are vertically connected together in sequence. An opening is provided on the frame main board 13.

[0028] A drive structure passing through the left main board 8 is connected to the left side plate 12 of the frame for driving the flip frame structure to flip. The drive structure includes a motor 28, whose shaft passes through the left main board 8 and the left side plate 12 of the frame. The motor 28 is connected to a reducer 29 via a coupling, and the controlled ends of the motor 28 and the reducer 29 are connected to the control system. A motor cover 17 connected to the left main board 8 is provided outside the motor, and a mounting base 19 for mounting the motor is provided inside the motor cover 17.

[0029] In the drive structure, the motor shaft is connected by a key 30, and the other end of the key 30 is connected to the left flip shaft 10. The left flip shaft 10 is connected to the left main board 8, thus realizing the connection between the motor and the flip frame structure.

[0030] A rotating shaft structure for use with the drive structure is connected to the right side plate 11 of the frame. The rotating shaft structure passes through the right main plate 3, and a bearing cover 18 connected to the right main plate 3 is fitted onto the outside of the rotating shaft structure. The rotating shaft structure includes a right-side flip shaft 20 that passes through the right main plate 3, and the right-side flip shaft 20 is connected to the right side plate 11 of the frame via a bearing. A sleeve 21 and a bearing seat 22 are fitted onto the right-side flip shaft 20, and a cover 23 is fitted onto the right-side flip shaft 20.

[0031] A sensor monitoring plate 33 is coaxially mounted on the rotating shaft structure. Two second sensors 31, perpendicularly arranged to each other, are disposed next to the sensor monitoring plate 33 to detect the rotation angle of the sensor monitoring plate 33. The outputs of both second sensors 31 are connected to the control system. The second sensors 31 are mounted on the bearing housing 18 and are connected to a connecting bracket 32. The connecting bracket 32 ​​is connected to the bearing housing 18 for mounting the second sensors 31.

[0032] The sensor monitoring plate 33 includes a circular plate portion fitted onto a sleeve. This circular plate portion is connected to the cover 23 by bolts, and a semi-circular ring-shaped piece is connected to the outer edge of the circular plate portion, arranged in the same plane. As the sensor monitoring plate 33 rotates with the right-side flip shaft 20, a signal is generated the instant the fan-shaped tip contacts the sensor, indicating that the overall mechanism is in a parallel position. After rotating 90°, a signal is generated again the instant the fan-shaped tip contacts another sensor, indicating that the overall mechanism is in a vertical position.

[0033] A first support 15 for placing wafers is provided on the inner side of the left side plate 12, and a second support 16 for use with the first support 15 is provided on the inner side of the right side plate 11. The left side plate 12 and the first support 15, and the right side plate 11 and the second support 16, are connected by a pair of parallel mounting plates 7. Both the first support 15 and the second support 16 are provided with several positioning slots for preventing wafers from falling, and sensors are installed in the positioning slots to detect whether a wafer is present.

[0034] In practical use, when the robot gripper passes through the opening in the flipping base and precisely places the wafer into the positioning slot of the first or second support, the sensor in the slot immediately detects the wafer's arrival signal and sends it back to the control system. After the robot gripper completes its withdrawal and exits the working space of the mechanism, the first sensor sends a signal to the control system, which then drives the motor to start according to a preset program. The motor smoothly drives the left flipping shaft to rotate at a precisely set speed, causing the wafer on the flipping mechanism to complete a 90° flipping motion. When the set angle is reached, the vertically positioned second sensor monitors the sensor monitoring plate 33 at the right flipping shaft end in real time. Once it detects that the wafer has reached the endpoint, it immediately sends a stop command, and the motor stops running. The robot gripper then transfers the wafer to the subsequent FOUP (Front-Open Unified Box) loading area to complete the process connection. Simultaneously, the control system drives the motor to flip and reset. When the horizontally positioned second sensor detects the sensor monitoring plate 33 at the right flipping shaft end, it stops the motor and resets the wafer, thus completing the entire wafer attitude conversion process. This process achieves high-precision and high-stability execution of the flipping motion through multi-sensor collaboration and programmed control.

[0035] In this invention, motor drive exhibits significant advantages in control performance and system economy, with the precision and stability of motor control surpassing pneumatic control across the board. Motor drive can achieve stepless smooth speed adjustment (covering the full range of requirements from low to high speed) through technologies such as frequency conversion and servo. Combined with a closed-loop feedback mechanism, it can dynamically respond to load changes, ensuring operational accuracy and stability. In contrast, traditional pneumatic control is affected by factors such as air source pressure fluctuations and pipeline leaks, resulting in limited speed adjustment accuracy and a tendency to experience response lag.

[0036] Furthermore, the system structure of motor-driven systems is simpler, resulting in a more advantageous overall cost. Cylinder-driven systems require complex auxiliary systems such as air pumps, air tanks, solenoid valve assemblies, and air pipelines, while motor-driven systems only require a driver and the motor itself to complete power output, significantly reducing installation space and the number of components. At the same time, motor-driven systems do not require complex air circuit maintenance, resulting in superior overall performance in terms of procurement costs, maintenance difficulty, and energy efficiency. The energy conversion rate of motors is higher than that of pneumatic systems, leading to lower long-term operating costs.

Claims

1. A flipping mechanism for a semiconductor tank cleaning machine, which flips a wafer after the control system controls the robot gripper to place it in place, characterized in that: The system includes a flip base (2) with an opening in the middle, and a right main board (3) and a left main board (8) connected to the two sides of the opening of the flip base (2) respectively. A mounting bracket (5) is vertically mounted on the flip base (2), and a first sensor (6) is mounted at the end of the mounting bracket (5), and the output end of the first sensor (6) is connected to the control system. The right main board (3) and the left main board (8) are perpendicular to the flip base (2), and a flip frame structure is provided between the right main board (3) and the left main board (8). The flip frame structure includes a left frame plate (12), a frame main board (13), and a right frame plate (11) connected vertically together in sequence. The left frame plate (12) is connected to... A drive structure is connected through the left main board (8) to drive the flip frame structure. A rotating shaft structure is installed on the right side plate (11) of the frame to cooperate with the drive structure and to pass through the right main board (3). A sensor monitoring board (33) is connected to the rotating shaft structure. Two second sensors (31) are arranged perpendicularly to each other to detect the rotation angle of the sensor monitoring board (33). The output ends of the two second sensors (31) are connected to the control system. A first support bracket (15) for placing wafers is provided on the inner side of the left side plate (12) of the frame. A second support bracket (16) for cooperating with the first support bracket (15) is provided on the inner side of the right side plate (11).

2. The flipping mechanism of the semiconductor tank cleaning machine according to claim 1, characterized in that: The back of the flip base (2) is provided with a horizontal plate (1) with an opening in the middle, and the horizontal plate (1) has the same shape as the flip base (2).

3. The flipping mechanism of the semiconductor tank cleaning machine according to claim 1, characterized in that: A pair of fixing plates (4) for strengthening the connection are connected between the right main board (3), the left main board (8) and the flip base (2), and the fixing plates (4) are set perpendicular to the flip base (2).

4. The flipping mechanism of the semiconductor tank cleaning machine according to claim 1, characterized in that: The drive structure includes a motor (28) whose shaft passes through the left main board (8) and the left side plate (12) of the frame. The motor (28) is connected to a reducer (29) via a coupling, and the controlled ends of the motor (28) and the reducer (29) are connected to the control system. The motor is provided with a motor cover (17) connected to the left main board (8), and a mounting base (19) for installing the motor is provided inside the motor cover (17).

5. The flipping mechanism of the semiconductor tank cleaning machine according to claim 4, characterized in that: The motor shaft in the drive structure is connected to a key (30), and the other end of the key (30) is connected to the left flip shaft (10), which is connected to the left main board (8).

6. The flipping mechanism of the semiconductor tank cleaning machine according to claim 1, characterized in that: The rotating shaft structure includes a right flip shaft (20) that passes through the right main board (3) and is connected to the right side plate (11) of the frame via a bearing. A sleeve (21) and a bearing seat (22) are fitted on the right flip shaft (20). A cover (23) is fitted on the right flip shaft (20). The cover (23) is connected to the sensor monitoring board (33). A bearing cover (18) connected to the right main board (3) is fastened to the outside of the rotating shaft structure.

7. The flipping mechanism of the semiconductor tank cleaning machine according to claim 6, characterized in that: The second sensor (31) is mounted on the bearing housing (18), and the second sensor (31) is connected to a connecting frame (32), which is connected to the bearing housing (18).

8. The flipping mechanism of the semiconductor tank cleaning machine according to claim 6, characterized in that: The sensor monitoring board (33) includes a circular piece portion sleeved on the sleeve (21). The circular piece portion is connected to the cover (23) by bolts, and a ring piece body with the same plane and in a semi-circular shape is connected to the outer edge of the circular piece portion.

9. The flipping mechanism of the semiconductor tank cleaning machine according to claim 1, characterized in that: The left side plate (12) of the frame is connected to the first support frame (15), and the right side plate (11) of the frame is connected to the second support frame (16) by a pair of parallel mounting plates (7).

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