Chip heat dissipation method and device

Abstract

The invention provides a chip heat dissipation method and device. The method comprises the following steps: acquiring surface temperature distribution and heat flux density distribution of a chip to position hot spot positions of the chip; a cooling medium is guided to flow through the chip, the micro-robot suspended in the cooling medium is placed under the action of a magnetic field, and the micro-robot is controlled to move to the position above the hot spot position in the cooling medium; determining the initial heat exchange efficiency of the micro-robot above the hot spot; and according to the initial heat exchange efficiency, the magnetic field control parameters are continuously adjusted until the current heat exchange efficiency meets the expected heat exchange efficiency, and targeted heat dissipation is conducted on the chip hot spots. According to the invention, the hot spot position of the chip can be accurately positioned by acquiring the surface temperature distribution and the heat flux density distribution of the chip; the magnetic field control parameters are used for controlling the micro-robot to move to the position above the hot spot, and dynamic tracking and heat dissipation of the hot spot are achieved; in addition, the magnetic field control parameters can be continuously adjusted according to the initial heat exchange efficiency, and the purpose of effective heat dissipation of chip hot spots is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of microelectronic device thermal management, in particular to a chip heat dissipation method and device. BACKGROUND

[0002] With the continuous progress of integrated circuit technology, the transistor density has been greatly increased, which has promoted the significant improvement of chip performance, but at the same time, it has brought a serious challenge-the chip power density continues to rise. The heat generated by the chip during operation increases sharply, and the thermal conductivity of the silicon substrate inside the chip is relatively limited, which makes it difficult for heat to quickly and effectively spread out inside the chip, thereby forming high-temperature hot spots inside the chip. The existence of these high-temperature hot spots poses a serious threat to the stable operation and performance of the chip.

[0003] The chip hotspot distribution has the characteristics of dynamic migration, specifically, on the one hand, there are significant differences in heat generation and accumulation in different regions inside the chip; on the other hand, the location and intensity of the chip hotspots will change constantly with the conversion of the chip working condition.

[0004] At present, chip cooling technology mainly includes whole passive cooling, whole active cooling and hotspot enhanced cooling. However, the existing cooling method cannot adapt to the problem of dynamic migration of chip hotspots. SUMMARY

[0005] The present application provides a chip heat dissipation method and device to solve the defect that the prior art cannot adapt to the dynamic migration of chip hotspots, and to realize efficient heat dissipation of chip hotspots.

[0006] A chip heat dissipation method, comprising:

[0007] Step one: obtaining the surface temperature distribution of the chip and the heat flux density distribution to locate the chip hotspot position;

[0008] Step two: guiding the cooling medium to flow through the chip, and placing the micro-robot suspended in the cooling medium under the action of a magnetic field, and controlling the micro-robot to run in the cooling medium to the area where the chip hotspot is located;

[0009] Step three: determining the initial heat exchange efficiency of the micro-robot in the area where the chip hotspot is located;

[0010] Step four: continuously adjusting the magnetic field control parameters according to the initial heat exchange efficiency until the current heat exchange efficiency meets the expected heat exchange efficiency to dissipate heat from the chip hotspot.

[0011] Further, the chip heat dissipation method as described above, the step one comprises:

[0012] The surface temperature distribution of the chip With preset hotspot temperature threshold Heat flux density distribution of the chip With heat flux density threshold Compare;

[0013] exist and In this case, determine the surface temperature distribution The area in question is a hotspot.

[0014] Based on the hotspot area, determine the location of the chip hotspot.

[0015] Furthermore, in the chip heat dissipation method described above, step two includes:

[0016] Determine the driving force and resistance experienced by the robot in the magnetic field;

[0017] The first rotational speed of the magnetic field is determined based on the driving force and resistance.

[0018] Based on the first rotation speed, the microrobot is manipulated to move above the hot spot location in the cooling medium.

[0019] Furthermore, in the chip heat dissipation method described above, the driving force experienced by the robot in the magnetic field is:

[0020] (4)

[0021] in, This is the structural shape factor of the robot. Indicates the dynamic viscosity coefficient of the cooling medium. The self-rotation frequency of the microrobot Let be the equivalent radius of the microrobot;

[0022] The resistance experienced by the robot in the magnetic field is:

[0023] (5)

[0024] in, Let v be the dynamic viscosity coefficient of the cooling medium, v be the robot's running speed, and L be the robot's equivalent radius.

[0025] Furthermore, in the chip heat dissipation method described above, step three includes:

[0026] Step 31: Determine the actual heat exchange between the cooling medium and the chip based on the area of ​​the chip through which the cooling medium flows, the temperature of the cooling medium before entering the chip, and the temperature of the cooling medium after exiting the chip. ;

[0027] Step 32: Determine the maximum heat exchange between the cooling medium and the chip based on the highest temperature at the chip hotspot, the temperature at which the cooling medium enters the chip, and the flow rate of the cooling medium. ;

[0028] Step 33: Based on the stated heat exchange... With the maximum heat exchange The heat exchange efficiency of the microrobot above the hot spot was determined.

[0029] Furthermore, in the chip heat dissipation method described above, step 31 includes: determining the actual heat exchange according to the following formula. :

[0030]

[0031]

[0032] (13)

[0033] (14)

[0034] (15)

[0035] in, Where is the area through which the cooling medium flows across the chip, and h is the convective heat transfer coefficient. The average temperature difference between the chip surface and the cooling medium. This represents the average temperature at the hot spot of the chip. The temperature before the cooling medium enters the chip. The temperature is the temperature after the cooling medium flows out of the chip, and Nu is the Nusselt number corresponding to the area where the robot runs to the hot spot. Where is the thermal conductivity of the cooling medium, L is the equivalent radius of the robot, and Pr is the Prandtl number. The rotation frequency corresponding to the robot's movement to the hotspot and stable rotation. This is the kinematic viscosity coefficient of the cooling medium.

[0036] Furthermore, in the chip heat dissipation method described above, step 32 includes:

[0037] The maximum heat transfer between the cooling medium and the chip is determined using the following formula. :

[0038]

[0039] in, For the cooling medium flow rate, The specific heat capacity of the cooling medium. This represents the highest temperature at the hot spot of the chip. This refers to the temperature at which the cooling medium enters the chip.

[0040] A chip heat dissipation device, comprising:

[0041] Acquisition unit, used to acquire the surface temperature distribution of the chip. and heat flux density distribution To locate the hot spots on the chip;

[0042] The guiding unit is used to guide the cooling medium to flow through the chip;

[0043] The control unit is used to place the microrobot suspended in the cooling medium under the influence of a magnetic field and control the microrobot to move to the area where the chip hot spot is located in the cooling medium.

[0044] A determining unit is used to determine the initial heat exchange efficiency of the microrobot in the region where the chip hotspot is located.

[0045] The heat dissipation unit is used to continuously adjust the magnetic field control parameters according to the initial heat exchange efficiency until the current heat exchange efficiency meets the expected heat exchange efficiency, so as to dissipate heat from the hot spots of the chip.

[0046] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the chip heat dissipation method as described above.

[0047] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the chip heat dissipation method as described above.

[0048] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements the chip heat dissipation method as described above.

[0049] The chip heat dissipation method and apparatus provided by this invention can accurately locate hot spots on the chip by acquiring the surface temperature distribution and heat flux density distribution, avoiding the blind spots that may exist in traditional heat dissipation methods. Next, a microrobot is manipulated to move above the hot spot using magnetic field control parameters, achieving dynamic tracking and heat dissipation of the hot spot. Finally, based on the initial heat transfer efficiency, the magnetic field control parameters are continuously adjusted until the current heat transfer efficiency meets the expected heat dissipation target, thereby achieving effective heat dissipation of the chip hot spot. Attached Figure Description

[0050] Figure 1 This is a schematic flowchart of the chip heat dissipation method provided by the present invention;

[0051] Figure 2 This is a schematic diagram of the chip heat dissipation device provided by the present invention;

[0052] Figure 3 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0054] In today's era of rapid technological advancement, integrated circuit technology has made significant progress, resulting in a substantial increase in transistor density. While this progress has greatly improved chip performance and functionality, it has also brought about a series of serious challenges. Among these, the heat generation and dissipation issues of chips are particularly prominent and have become a key factor restricting further improvements in chip performance.

[0055] With the rapid increase in transistor density, chip power consumption density continues to rise, exacerbating the contradiction between heat generation and dissipation. Due to the limited thermal conductivity of silicon substrates, when a chip generates a large amount of heat, the heat is difficult to dissipate quickly within the chip, resulting in high-temperature hotspots in localized areas. These chip hotspots are not simply due to overheating, but involve complex electro-thermal-mechanical coupling. This complex coupling leads to a series of serious consequences. It accelerates electromigration within the chip, causing atomic migration in metal wires, which may lead to circuit breaks or short circuits; it also generates thermal stress in the chip, which, when exceeding the material's tolerance limit, can cause thermal stress cracking, damaging the chip's structural integrity; simultaneously, localized high temperatures can degrade transistor performance, affecting the chip's normal operating state; furthermore, to protect itself, the chip triggers a frequency reduction mechanism, which undoubtedly directly reduces the chip's computing power, severely impacting its performance in practical applications. From the perspective of the spatial distribution of chip power consumption, it exhibits a high degree of complexity. Chip hotspots are typically distributed discretely on the order of hundreds of micrometers, and their positions and intensities are not fixed but dynamically change with variations in chip operating conditions, exhibiting significant spatial non-uniformity and temporal dynamic variation. In other words, during chip operation, the positions of hotspots are not static but move between different areas over time—a phenomenon known as hotspot location dynamic migration. This places extremely high demands on chip heat dissipation technology, requiring it to respond to these changes in real-time and with precision.

[0056] Currently, chip cooling technologies mainly include overall passive cooling, overall active cooling, and hotspot-enhanced cooling. However, existing chip cooling technologies all have significant limitations in dealing with the dynamic migration of hotspot locations. To address this issue, this application employs a method of guiding the cooling medium to the hotspot location on the chip, then using a magnetic field to control a chiral microrobot to move to the hotspot location. Under the influence of the magnetic field, the chiral microrobot rotates to agitate the cooling medium, thereby achieving effective heat dissipation for the chip's hotspots.

[0057] In this embodiment of the invention, the microrobot is a magnetic particle with chiral characteristics, typically in the micrometer or nanometer range in size. Preferably, the diameter of the magnetic particle is 20 μm to 100 μm. The asymmetric structure of the chiral microrobot is key to its chiral characteristics and the realization of specific functions. Common asymmetric structures include helical shapes and tadpole-shaped tails. Taking the helical structure as an example: the helical structure is a typical asymmetric structure, similar to the double helix of DNA or the thread of a screw. This structure has a continuous, helical extension characteristic, and its pitch, helical radius, and other parameters affect the performance of the microrobot. When the helical chiral microrobot is placed in a cooling medium and driven by an external magnetic field, it will generate rotational motion like a propeller. Due to the chirality of the helical structure, the rotational motion is converted into linear motion. For example, driven by a uniform magnetic field, the magnetic helical microrobot can move linearly to a local hot spot on the chip.

[0058] When the microrobot moves to a localized hotspot, the cooling medium continuously removes heat, preventing heat accumulation in the hotspot area. Simultaneously, the cooling medium above the hotspot forms a liquid-cooled pool, providing a stable environment for the microrobot's movement and heat exchange. Within this liquid-cooled pool, the chiral robot's rotational motion creates convection currents around the localized hotspot, accelerating the uniform diffusion of heat into the surrounding cooling medium and further enhancing the heat dissipation effect.

[0059] Figure 1 This is a schematic flowchart of the chip heat dissipation method provided by the present invention, as shown below. Figure 1 As shown, the method includes:

[0060] Step 1: Obtain the surface temperature distribution and heat flux density distribution of the chip to locate the hot spots on the chip.

[0061] Specifically, this application employs a high-precision infrared thermal imaging system to perform full-field temperature measurement on the chip surface to obtain the surface temperature distribution of the chip. This system can capture infrared radiation energy at different locations on the chip surface, converting it into temperature data to form a temperature distribution image of the chip surface. Furthermore, the system is equipped with a macro optical lens, enabling... The system achieves high spatial resolution (level 1) and temperature resolution (0.1K) to ensure accurate capture of hotspot distributions at the hundred-micron level. By acquiring the surface temperature distribution of the chip, it can precisely capture temperature changes at different locations on the chip surface, providing fundamental data for subsequent hotspot localization and thus improving the accuracy of hotspot location.

[0062] Furthermore, this application calculates the heat flux density distribution on the chip surface based on the chip's power consumption distribution and heat conduction theory using Fourier's law. Heat flux density reflects the intensity of heat transfer at various points on the chip surface and is an important basis for locating hot spots. This heat flux density distribution is calculated according to formula (1):

[0063] ( )

[0064] Where k is the thermal conductivity of the chip material.

[0065] This application compares the surface temperature distribution with a preset hot spot temperature threshold and the heat flux density distribution with a preset heat flux density threshold. When both the temperature threshold and the heat flux density threshold conditions are met, the area is determined to be a hot spot area, and the location coordinates of the hot spot are located based on the hot spot area.

[0066] Specifically, setting a hotspot temperature threshold and heat flux density threshold The surface temperature distribution of the chip is respectively With preset temperature threshold Comparison and heat flux density distribution With heat flux density threshold Compare; in and In this case, determine the surface temperature distribution The area in question is a hotspot; based on this hotspot area, the location coordinates of the hotspot are obtained using a coordinate positioning algorithm. .

[0067] In this invention, the location coordinates of the hotspot can be obtained using a coordinate positioning algorithm. The specific method is as follows:

[0068] First, a correspondence is established between the infrared thermal imaging image of the chip acquired using a high-precision infrared thermal imaging system and the surface image of the chip acquired using an image acquisition device: the infrared thermal imaging system is calibrated to determine the proportional relationship between the pixel coordinates of the infrared thermal imaging image and the actual chip size corresponding to the chip's surface image. Assuming the number of pixels in the x-direction is Nx, and the corresponding actual chip length is Lx, then the actual length represented by each pixel in the x-direction is Δx = Lx / Nx; similarly, in the y-direction, if the number of pixels is Ny, and the corresponding actual chip width is Ly, then the actual length represented by each pixel in the y-direction is Δy = Ly / Ny. For the z-coordinate, since infrared thermal imaging typically only measures the temperature distribution on the object's surface, the z-coordinate is generally assumed to be the plane containing the chip surface, i.e., z = 0.

[0069] Determine the hot spot pixel coordinates: Find the point with the highest temperature in the infrared thermal imaging image, i.e., the hot spot, and record its pixel coordinates (i,j) in the image.

[0070] Calculate the actual coordinates of the hotspot: Based on the previously established correspondence, convert the pixel coordinates into actual coordinates. The actual coordinates of the hotspot in the x-direction are x = i * Δx, and the actual coordinates in the y-direction are y = j * Δy, z = 0. Thus, the chip hotspot location coordinates are calculated. .

[0071] Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of the magnetic field, maneuvering the microrobot to move above the hot spot position in the cooling medium.

[0072] Specifically, the driving force and resistance experienced by the robot in the magnetic field are determined respectively; based on the driving force and resistance, a first rotational speed of the magnetic field is determined; based on the first rotational speed, the microrobot is manipulated to move above the hot spot position in the cooling medium.

[0073] The magnetic field used in this application consists of three sets of orthogonal Helmholtz coils. The strength and direction of this magnetic field are adjusted by controlling the magnitude and direction of the current in the coils to generate a uniform rotating magnetic field in space. The robot's speed and direction are then adjusted based on the strength and direction of the rotating magnetic field. The rotating magnetic field... for:

[0074] ( )

[0075] in, The magnitudes of the magnetic field in each direction are given. The rotational angular frequency (JFF) of a rotating magnetic field describes how fast the field rotates. It determines the rate at which the magnetic field direction changes with time, influencing the motion of a microrobot within the magnetic field, such as its rotational frequency. When the JFF changes, the magnetic torque acting on the microrobot changes, thus altering its rotation and speed. Therefore, the JFF is essentially the magnetic field generated by the Helmholtz coil, characterizing a key property of the magnetic field's rotational motion. The JFF can be converted into the rotational frequency of the magnetic field. . , , This initial phase represents the state of the rotating magnetic field at the start. When a Helmholtz coil generates a rotating magnetic field, this initial state influences the subsequent changes in the magnetic field, as well as the forces and motion tendencies of the microrobot within the magnetic field at the initial moment. For example, different initial phases may cause the microrobot to begin rotating motion from different directions.

[0076] here, The calculation formula is as follows:

[0077] ( )

[0078] in, Let be the radius of the Helmholtz coil. Let be the distance from a point on the axis to the axis center. The number of turns of the coil. The current intensity passing through the coil, It is the permeability in vacuum, which is .

[0079] In this embodiment, the microrobot is a magnetic particle with a tail. When the microrobot contains magnetic material inside or on its surface, it generates driving force and resistance under the influence of a rotating magnetic field.

[0080] Among them, the driving force experienced by the robot in the magnetic field for:

[0081] (4)

[0082] in, This is the structural shape factor of the robot. Indicates the dynamic viscosity coefficient of the cooling medium. The self-rotation frequency of the microrobot Let be the equivalent radius of the microrobot.

[0083] Stokes drag on the robot in a magnetic field for:

[0084] (5)

[0085] in, Let v be the dynamic viscosity coefficient of the cooling medium, v be the robot's running speed, and L be the robot's equivalent radius.

[0086] When a chiral microrobot's asymmetric structure (such as a spiral or tadpole-shaped tail) rotates under a uniform rotating magnetic field, the interaction between the structural asymmetry and the fluid generates a propulsive force in a specific direction. In this application, since the rotational Reynolds number is much less than 1, the applicability conditions of Stokes' drag theory are met. The propulsive force generated in a specific direction by the interaction between the structural asymmetry and the fluid when the chiral microrobot rotates under a uniform rotating magnetic field is essentially the reaction force of the fluid on the rotating structure. In this case, Stokes' drag theory can be used to approximate the calculation of this propulsive force.

[0087] when > At that moment, the robot accelerates forward.

[0088] when = When the robot moves forward at a constant speed v, it will move forward at a constant speed v.

[0089] when < When the robot rotates in place, it will remain stationary.

[0090] In this case, in order for the robot to move to the hot spot under the influence of the magnetic field, it is necessary to ensure that: ≥ .

[0091] when = At that time, there were:

[0092] = (6)

[0093] The critical self-rotation frequency of the robot can then be determined according to formula (7). for:

[0094] (7)

[0095] Then: Assume the robot's running speed is The corresponding robot's rotation frequency is Assume the robot's running speed is The corresponding robot's rotation frequency is To ensure ≥ Therefore, it is necessary to ensure the robot's self-rotation frequency. ≥ .

[0096] Furthermore, when the magnetic robot is placed in a magnetic field, its rotational frequency will eventually approach the rotational frequency of the magnetic field. In this case, it is assumed that the rotational frequency of the magnetic robot... Equal to the rotation frequency of the magnetic field ,Right now = Therefore, only the rotation frequency of the magnetic field... ≥ The robot will only operate when... < The robot will rotate in place. Therefore, this application determines the robot's rotation frequency by setting a speed, and then determines the corresponding rotation frequency of the magnetic field based on the robot's rotation frequency. Thus, this application only needs to ensure the rotation frequency of the magnetic field, indirectly determined by the robot's running speed. ≥ Once the rotation frequency of the magnetic field is determined, it can be substituted into formulas (4) and (5) to determine the driving force and resistance experienced by the robot in the magnetic field, and then the running speed of the robot can be determined based on the driving force and resistance experienced by the robot in the magnetic field.

[0097] This application uses the following formula to control the robot to move to the area where the chip hotspot is located:

[0098] (8)

[0099] in, The target position for the microrobot. This is the current position of the microrobot. Let be the initial velocity of the microrobot. For the movement time of the microrobot, Let be the acceleration of the microrobot. When the robot moves forward at a constant speed, the acceleration is 0.

[0100] Here, the acceleration of the microrobot in the magnetic field It can be obtained through the following methods:

[0101] (9)

[0102] (10)

[0103] in, For the density of microrobots, For the volume of the microrobot, Let F be the acceleration of the microrobot in the magnetic field; and let F be the net force acting on the robot in the magnetic field. The driving force experienced by the robot in the magnetic field; This represents the resistance experienced by the robot in the rotating magnetic field.

[0104] This application determines the position of a microrobot by real-time monitoring and comparing it with the coordinates of a specified location above a hotspot. Common monitoring methods include microscopic imaging combined with image recognition algorithms, or magnetic field positioning technology. Assuming the coordinates of the specified location above the hotspot are (x, y, z), the real-time position coordinates of the microrobot obtained through monitoring are: Calculate the distance between the two. Set an allowable error range Δd. When d ≤ Δd, the microrobot is considered to have moved to the hot spot position.

[0105] Step 3: Determine the initial heat exchange efficiency of the microrobot above the hot spot.

[0106] Heat transfer efficiency refers to the efficiency with which heat is transferred from a high-temperature object (in this case, the chip hotspot) to a low-temperature object (cooling medium). It reflects the completeness of the heat exchange process. Specifically, when the cooling medium flows past the chip hotspot, heat is transferred from the chip to the cooling medium. Higher heat transfer efficiency means that more heat is transferred from the chip hotspot to the cooling medium per unit time, and the chip hotspot temperature drops faster. Conversely, lower heat transfer efficiency means less efficient heat transfer, and the chip hotspot temperature is difficult to reduce effectively.

[0107] This application obtains the initial heat exchange efficiency of the microrobot above the hotspot, including:

[0108] Step 31: Determine the actual heat exchange between the cooling medium and the chip based on the area of ​​the chip through which the cooling medium flows, the temperature of the cooling medium before entering the chip, and the temperature of the cooling medium after exiting the chip. ;

[0109] (11)

[0110] (12)

[0111] (13)

[0112] (14)

[0113] (15)

[0114] in, Where is the area through which the cooling medium flows across the chip, and h is the convective heat transfer coefficient. The average temperature difference between the chip surface and the cooling medium. This represents the average temperature at the hot spot of the chip. The temperature before the cooling medium enters the chip. The temperature of the cooling medium after it flows out of the chip is represented by Nu, and the Nusselt number is the corresponding number after the robot moves to the hot spot area. The change in the Nusselt number is used to measure the degree of enhancement of rotational convection heat transfer at the hot spot by the microrobot's movement; the larger the value, the more significant the enhancement effect. Where is the thermal conductivity of the cooling medium, L is the equivalent radius of the robot, and Pr is the Prandtl number. , The specific heat capacity of the cooling medium. The dynamic viscosity coefficient of the cooling medium. It is the thermal conductivity of the cooling medium. The rotation frequency of the robot after it reaches the hotspot and rotates stably. This is the kinematic viscosity coefficient of the cooling medium.

[0115] Step 32: Determine the maximum heat exchange between the cooling medium and the chip based on the highest temperature at the chip hotspot, the temperature at which the cooling medium enters the chip, and the flow rate of the cooling medium. ;

[0116] (16)

[0117] in, For the cooling medium flow rate, The specific heat capacity of the cooling medium. The highest temperature at the chip's hot spot This is the temperature before the cooling medium enters the chip.

[0118] Step 33: Based on the stated heat exchange... With the maximum heat exchange The heat exchange efficiency of the microrobot above the hot spot was determined.

[0119] (17)

[0120] According to formulas (11)-(17), once the robot's rotation frequency is determined, the heat transfer efficiency of the robot above the hot spot can be determined. When the robot is in the rotating magnetic field, its rotation frequency will gradually approach the rotation frequency of the magnetic field. Therefore, as long as the rotation frequency of the rotating magnetic field is controlled, the initial heat transfer efficiency of the robot in the area where the hot spot is located can be determined. When the initial heat transfer efficiency does not meet the heat dissipation requirements, the rotation frequency of the magnetic field can be continuously adjusted until the current heat transfer efficiency meets the expected heat transfer efficiency, thereby achieving effective heat dissipation of the chip.

[0121] It should be noted that when adjusting the rotation frequency of the magnetic field, it is necessary to ensure that the rotation frequency of the magnetic field is less than the critical rotation frequency of the magnetic field, while the critical rotation frequency of the magnetic field is equal to the critical self-rotation frequency of the robot. .

[0122] Step 4: Based on the initial heat exchange efficiency, continuously adjust the magnetic field control parameters until the current heat exchange efficiency meets the expected heat exchange efficiency, so as to dissipate heat from the chip hotspots.

[0123] Specifically, because the location and intensity of hotspots on the chip change dynamically, different hotspot conditions may require different heat dissipation strategies. By monitoring heat transfer efficiency, heat dissipation parameters can be adjusted according to the actual situation to achieve optimal heat dissipation. In the given steps, the initial heat transfer efficiency of the microrobot above the hotspot is first determined, and then the magnetic field control parameters are continuously adjusted based on this initial value until the current heat transfer efficiency meets the expected efficiency. This is because the magnetic field control parameters affect the movement and distribution of the microrobot, thereby affecting the contact and heat transfer between the cooling medium and the chip hotspot. By adjusting the magnetic field control parameters to optimize heat transfer efficiency, efficient heat dissipation can be ensured under different hotspot locations and intensities.

[0124] In this embodiment of the invention, the magnetic field control parameter is the rotation frequency of the rotating magnetic field. The initial heat transfer efficiency is compared with a preset heat transfer efficiency threshold. If the difference between the initial heat transfer efficiency and the heat transfer efficiency threshold is greater than the preset difference, the magnetic field control parameter is continuously adjusted until the difference between the current heat transfer efficiency and the heat transfer efficiency threshold is less than or equal to the preset difference, thus achieving effective heat dissipation for the chip hotspots.

[0125] The method provided in this application firstly, by acquiring the surface temperature distribution and heat flux density distribution of the chip, can accurately locate the hot spot position on the chip, ensuring that the microrobot can accurately move above the hot spot for heat dissipation, avoiding the blindness that may exist in traditional heat dissipation methods. Next, the microrobot is controlled by magnetic field parameters to move above the hot spot, achieving dynamic tracking and heat dissipation of the hot spot. Furthermore, the microrobot rotates under the influence of the magnetic field, forming local hot spot rotational convection in the cooling medium through its chiral characteristics, accelerating the diffusion of heat to the surrounding cooling medium. Finally, the initial heat transfer efficiency is compared with a preset heat transfer efficiency. If the target value is not reached, the movement state of the microrobot is optimized by adjusting the magnetic field control parameters, thereby enhancing the heat dissipation effect. This dynamic adjustment mechanism ensures that the heat dissipation system can respond in real time to changes in the chip's heat generation, maintaining high-efficiency heat dissipation performance.

[0126] Figure 2 This is a schematic diagram of the chip heat dissipation device provided by the present invention, as shown below. Figure 2 As shown, the device includes:

[0127] Acquisition unit 201 is used to acquire the surface temperature distribution of the chip. and heat flux density distribution To locate the hot spots on the chip;

[0128] The guiding unit 202 is used to guide the cooling medium to flow through the chip;

[0129] The control unit 203 is used to place the microrobot suspended in the cooling medium under the influence of a magnetic field and control the microrobot to move to the area where the chip hot spot is located in the cooling medium.

[0130] The determining unit 204 is used to determine the initial heat transfer efficiency of the microrobot in the area where the chip hotspot is located;

[0131] The heat dissipation unit 205 is used to continuously adjust the magnetic field control parameters according to the initial heat exchange efficiency until the current heat exchange efficiency meets the expected heat exchange efficiency, so as to dissipate heat from the hot spots of the chip.

[0132] Figure 3 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 3 As shown, the electronic device may include: a processor 310, a communication interface 320, a memory 830, and a communication bus 340, wherein the processor 310, the communication interface 320, and the memory 330 communicate with each other via the communication bus 340. The processor 310 can call logic instructions in the memory 830 to execute a chip hotspot heat dissipation method based on a microrobot, the method including:

[0133] Step 1: Obtain the surface temperature distribution of the chip and heat flux density distribution To locate the hot spots on the chip;

[0134] Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot to the area where the chip's hot spot is located within the cooling medium;

[0135] Step 3: Determine the initial heat transfer efficiency of the microrobot in the area where the chip hotspot is located;

[0136] Step 4: Based on the initial heat exchange efficiency, continuously adjust the magnetic field control parameters until the current heat exchange efficiency meets the expected heat exchange efficiency, so as to dissipate heat from the chip hotspots.

[0137] Furthermore, the logical instructions in the aforementioned memory 330 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0138] On the other hand, the present invention also provides a computer program product, the computer program product comprising a computer program that can be stored on a non-transitory computer-readable storage medium, wherein when the computer program is executed by a processor, the computer is able to execute the chip hotspot heat dissipation method based on microrobots provided by the above methods, the method comprising:

[0139] Step 1: Obtain the surface temperature distribution of the chip and heat flux density distribution To locate the hot spots on the chip;

[0140] Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot to the area where the chip's hot spot is located within the cooling medium;

[0141] Step 3: Determine the initial heat transfer efficiency of the microrobot in the area where the chip hotspot is located;

[0142] Step 4: Based on the initial heat exchange efficiency, continuously adjust the magnetic field control parameters until the current heat exchange efficiency meets the expected heat exchange efficiency, so as to dissipate heat from the chip hotspots.

[0143] In another aspect, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to perform the chip hotspot heat dissipation method based on microrobots provided by the above methods, the method comprising:

[0144] Step 1: Obtain the surface temperature distribution of the chip and heat flux density distribution To locate the hot spots on the chip;

[0145] Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot to the area where the chip's hot spot is located within the cooling medium;

[0146] Step 3: Determine the initial heat transfer efficiency of the microrobot in the area where the chip hotspot is located;

[0147] Step 4: Based on the initial heat exchange efficiency, continuously adjust the magnetic field control parameters until the current heat exchange efficiency meets the expected heat exchange efficiency, so as to dissipate heat from the chip hotspots.

[0148] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip heat dissipation method, characterized in that, include: Step 1: Obtain the surface temperature distribution of the chip and heat flux density distribution To locate the hot spots on the chip; Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot in the cooling medium to the area where the chip's hot spot is located; Step 3: Determine the initial heat exchange efficiency of the microrobot in the area where the chip hotspot is located; Step 4: Based on the initial heat exchange efficiency, continuously adjust the magnetic field control parameters until the current heat exchange efficiency meets the expected heat exchange efficiency, so as to dissipate heat from the chip hotspots.

2. The chip heat dissipation method according to claim 1, characterized in that, Step one includes: The surface temperature distribution of the chip With preset hotspot temperature threshold Heat flux density distribution of the chip With heat flux density threshold Compare; exist and In this case, determine the surface temperature distribution The area in question is a hotspot. Based on the hotspot area, determine the location of the chip hotspot.

3. The chip heat dissipation method according to claim 1, characterized in that, Step two includes: Determine the driving force and resistance experienced by the robot in the magnetic field; The first rotational speed of the magnetic field is determined based on the driving force and resistance. Based on the first rotation speed, the microrobot is manipulated to move above the hot spot location in the cooling medium.

4. The chip heat dissipation method according to claim 3, characterized in that, The driving force on the robot in the magnetic field is: （4） in, For the structural shape coefficient of the robot, Indicates the dynamic viscosity coefficient of the cooling medium. The self-rotation frequency of the microrobot The characteristic length of the microrobot; The resistance experienced by the robot in the magnetic field is: （5） in, Let v be the dynamic viscosity coefficient of the cooling medium, v be the robot's running speed, and L be the robot's equivalent radius.

5. The chip heat dissipation method according to claim 1, characterized in that, Step three includes: Step 31: Determine the actual heat exchange between the cooling medium and the chip based on the area of ​​the chip through which the cooling medium flows, the temperature of the cooling medium before entering the chip, and the temperature of the cooling medium after exiting the chip. ; Step 32: Determine the maximum heat exchange between the cooling medium and the chip based on the highest temperature at the chip hotspot, the temperature at which the cooling medium enters the chip, and the flow rate of the cooling medium. ; Step 33: Based on the stated heat exchange... With the maximum heat exchange The heat exchange efficiency of the microrobot above the hot spot was determined.

6. The chip heat dissipation method according to claim 5, characterized in that, Step 31 includes: determining the actual heat exchange according to the following formula. : （13） （14） （15） in, Where is the area through which the cooling medium flows across the chip, and h is the convective heat transfer coefficient. The average temperature difference between the chip surface and the cooling medium. This represents the average temperature at the hot spot of the chip. The temperature before the cooling medium enters the chip. The temperature is the temperature after the cooling medium flows out of the chip, and Nu is the Nusselt number corresponding to the area where the robot runs to the hot spot. Let L be the thermal conductivity of the cooling medium, L be the equivalent radius of the robot, and Pr be the Prandtl number. The rotation frequency corresponding to the robot's movement to the hotspot and stable rotation. This is the kinematic viscosity coefficient of the cooling medium.

7. The chip heat dissipation method according to claim 5, characterized in that, Step 32 includes: The maximum heat transfer between the cooling medium and the chip is determined using the following formula. : in, For the cooling medium flow rate, The specific heat capacity of the cooling medium. This represents the highest temperature at the hot spot of the chip. This refers to the temperature at which the cooling medium enters the chip.

8. A chip heat dissipation device, characterized in that, include: Acquisition unit, used to acquire the surface temperature distribution of the chip. and heat flux density distribution To locate the hot spots on the chip; The guiding unit is used to guide the cooling medium to flow through the chip; The control unit is used to place the microrobot suspended in the cooling medium under the influence of a magnetic field and control the microrobot to move to the area where the chip hot spot is located in the cooling medium. A determining unit is used to determine the initial heat exchange efficiency of the microrobot in the region where the chip hotspot is located. The heat dissipation unit is used to continuously adjust the magnetic field control parameters according to the initial heat exchange efficiency until the current heat exchange efficiency meets the expected heat exchange efficiency, so as to dissipate heat from the hot spots of the chip.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the chip heat dissipation method as described in any one of claims 1 to 7.

10. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the chip heat dissipation method as described in any one of claims 1 to 7.

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