Chip hot spot heat dissipation method and device based on micro-robot

Abstract

The invention provides a chip hot spot heat dissipation method and device based on a micro-robot. The method comprises the following steps: acquiring surface temperature distribution and heat flux density distribution of a chip to position hot spot positions of the chip; a cooling medium is guided to flow through the chip, the micro-robot suspended in the cooling medium is placed under the action of the magnetic field, and the micro-robot is controlled to move to the position above the hot spot position in the cooling medium; determining initial heat flux change data of the micro-robot above the hot spot; and according to the initial heat flux change data, continuously adjusting the magnetic field control parameters until the current heat flux change data accords with an expected heat dissipation target. According to the invention, the hot spot position of the chip can be accurately positioned. The micro-robot is controlled to move to the area where the chip hot spot is located in the cooling medium, and dynamic tracking and heat dissipation of the hot spot are achieved; and according to the initial heat flux change data, the magnetic field control parameters are continuously adjusted, and effective heat dissipation of the chip hot spots is achieved.

Description

Technical Field

[0001] This invention relates to the field of thermal management technology for microelectronic devices, and specifically to a chip hotspot heat dissipation method and apparatus based on a microrobot. Background Technology

[0002] With continuous advancements in integrated circuit technology, transistor density has increased dramatically. This progress has driven significant improvements in chip performance, but it has also brought serious challenges—the ever-increasing power consumption density of chips. The heat generated during chip operation increases dramatically, while the thermal conductivity of the silicon substrate inside the chip is relatively limited. This makes it difficult for heat to dissipate quickly and effectively within the chip, leading to the formation of high-temperature hotspots. The presence of these hotspots poses a serious threat to the stable operation and performance of the chip.

[0003] Chip hotspot distribution has the characteristic of dynamic migration. Specifically, on the one hand, there are significant differences in the generation and accumulation of heat in different regions inside the chip; on the other hand, the location and intensity of chip hotspots will change continuously as the chip's operating conditions change.

[0004] Currently, chip cooling technologies mainly include overall passive cooling, overall active cooling, and hotspot-enhanced cooling. However, existing cooling methods cannot address the problem of dynamic hotspot migration in chips. Summary of the Invention

[0005] This invention provides a chip hotspot heat dissipation method and apparatus based on microrobots, which solves the defects of existing technologies that cannot adapt to the dynamic migration of chip hotspots and achieves efficient heat dissipation of chip hotspots.

[0006] A chip hotspot heat dissipation method based on microrobots includes:

[0007] Step 1: Obtain the surface temperature distribution of the chip and heat flux density distribution To locate the hot spots on the chip;

[0008] Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot in the cooling medium to the area where the chip's hot spot is located;

[0009] Step 3: Determine the initial heat flux change of the microrobot in the region where the chip hotspot is located;

[0010] Step 4: Based on the initial heat flux change, continuously adjust the magnetic field control parameters until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hotspots.

[0011] Furthermore, in the chip hotspot heat dissipation method based on microrobots described above, step one includes:

[0012] The surface temperature distribution of the chip With preset hotspot temperature threshold Heat flux density distribution of the chip With heat flux density threshold Compare;

[0013] exist and In this case, determine the surface temperature distribution The area in question is a hotspot.

[0014] Based on the hotspot area, determine the location of the chip hotspot.

[0015] Furthermore, in the chip hotspot heat dissipation method based on microrobots as described above, step two includes:

[0016] Determine the driving force and resistance experienced by the robot in the magnetic field;

[0017] The first rotational speed of the magnetic field is determined based on the driving force and resistance.

[0018] Based on the first rotational speed, the microrobot is manipulated to move in the cooling medium to above the hot spot location.

[0019] Furthermore, in the chip hotspot heat dissipation method based on microrobots described above, the driving force experienced by the robot in the magnetic field is:

[0020]

[0021] in, For the structural shape coefficient of the robot, Indicates the dynamic viscosity coefficient of the cooling medium. The self-rotation frequency of the microrobot Let be the equivalent radius of the microrobot;

[0022] The resistance experienced by the robot in the magnetic field is:

[0023]

[0024] in, Let v be the dynamic viscosity coefficient of the cooling medium, v be the robot's running speed, and L be the robot's equivalent radius.

[0025] Furthermore, in the chip hotspot heat dissipation method based on microrobots described above, step three includes:

[0026] Before the microrobot moves to the hotspot, the heat flux at the hotspot is determined. And the heat flux at the hotspot after the microrobot moves to the hotspot. ;

[0027] According to the heat flux and heat flux Determine the heat flux changes of the microrobot at the hot spot. , .

[0028] Furthermore, in the microrobot-based chip hotspot heat dissipation method described above, the heat flux is determined according to the following formula. :

[0029]

[0030] in, The temperature at the hotspot before the microrobot moves to it; The initial temperature of the cooling medium. Let be the equivalent radius of the microrobot. The thermal conductivity of the cooling medium The convective heat transfer coefficient at the hot spot before the microrobot moves to the hot spot; Let be the Nusselt number before the microrobot moves to the hot spot; Gr is the Grashof number, and Pr is the Prandtl number;

[0031] The heat flux is determined according to the following formula. :

[0032]

[0033] in, The temperature at the hotspot after the microrobot moves to it; The convective heat transfer coefficient at the hot spot after the microrobot moves to the hot spot. The rotation frequency corresponding to the robot's movement to the hotspot and stable rotation. This is the kinematic viscosity coefficient of the cooling medium.

[0034] Furthermore, in the chip hotspot heat dissipation method based on microrobots as described above, step four includes:

[0035] The initial heat flux change data is compared with the preset heat flux change target value. If the difference between the initial heat flux change data and the heat flux change target value is greater than the preset difference, the magnetic field control parameters are continuously adjusted until the difference between the current heat flux change data and the heat flux change target value is less than or equal to the preset difference.

[0036] A chip hotspot heat dissipation device based on a microrobot includes:

[0037] Acquisition unit, used to acquire the surface temperature distribution of the chip. and heat flux density distribution To locate the hot spots on the chip;

[0038] The guiding unit is used to guide the cooling medium to flow through the chip;

[0039] The control unit is used to place the microrobot suspended in the cooling medium under the influence of a magnetic field and control the microrobot to move in the cooling medium to the area where the chip hot spot is located.

[0040] The determining unit is used to determine the initial heat flux change of the microrobot in the region where the chip hotspot is located;

[0041] The heat dissipation unit is used to continuously adjust the magnetic field control parameters according to the initial heat flux change until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hot spots.

[0042] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the chip hotspot heat dissipation device based on the microrobot described above.

[0043] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements a chip hotspot heat dissipation device based on a microrobot as described above.

[0044] The chip hotspot heat dissipation method and apparatus based on microrobots provided by this invention, on the one hand, can accurately locate the chip hotspot by acquiring the surface temperature distribution and heat flux density distribution of the chip, avoiding the blindness that may exist in traditional heat dissipation methods. On the other hand, by using magnetic field control parameters to control the movement of the microrobot to the area where the chip hotspot is located, dynamic tracking and heat dissipation of the hotspot are achieved. Furthermore, based on the initial heat flux change data, the magnetic field control parameters are continuously adjusted until the current heat flux change data meets the expected heat dissipation target, thereby achieving the purpose of effectively dissipating heat from the chip hotspot. Attached Figure Description

[0045] Figure 1 This is a flowchart illustrating the chip hotspot heat dissipation method based on microrobots provided by the present invention.

[0046] Figure 2 This is a schematic diagram of the chip hotspot heat dissipation device based on a microrobot provided by the present invention;

[0047] Figure 3 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0049] In today's era of rapid technological advancement, integrated circuit technology has made significant progress, resulting in a substantial increase in transistor density. While this progress has greatly improved chip performance and functionality, it has also brought about a series of serious challenges. Among these, the heat generation and dissipation issues of chips are particularly prominent and have become a key factor restricting further improvements in chip performance.

[0050] With the rapid increase in transistor density, chip power consumption density continues to rise, exacerbating the contradiction between heat generation and dissipation. Due to the limited thermal conductivity of silicon substrates, when a chip generates a large amount of heat, the heat is difficult to dissipate quickly within the chip, resulting in high-temperature hotspots in localized areas. These chip hotspots are not simply due to overheating, but involve complex electro-thermal-mechanical coupling. This complex coupling leads to a series of serious consequences. It accelerates electromigration within the chip, causing atomic migration in metal wires, which may lead to circuit breaks or short circuits; it also generates thermal stress in the chip, which, when exceeding the material's tolerance limit, can cause thermal stress cracking, damaging the chip's structural integrity; simultaneously, localized high temperatures can degrade transistor performance, affecting the chip's normal operating state; furthermore, to protect itself, the chip triggers a frequency reduction mechanism, which undoubtedly directly reduces the chip's computing power, severely impacting its performance in practical applications. From the perspective of the spatial distribution of chip power consumption, it exhibits a high degree of complexity. Chip hotspots are typically distributed discretely on the order of hundreds of micrometers, and their positions and intensities are not fixed but dynamically change with variations in chip operating conditions, exhibiting significant spatial non-uniformity and temporal dynamic variation. In other words, during chip operation, the positions of hotspots are not static but move between different areas over time—a phenomenon known as dynamic migration of hotspot positions. This places extremely high demands on chip heat dissipation technology, requiring it to respond to these changes in real-time and with precision.

[0051] Currently, chip cooling technologies mainly include overall passive cooling, overall active cooling, and hotspot-enhanced cooling. However, existing chip cooling technologies all have significant limitations in dealing with the dynamic migration of hotspots. To address this issue, this application guides the cooling medium to flow through the chip, then uses a magnetic field to control a chiral microrobot to move to the hotspot location. Under the influence of the magnetic field, the chiral microrobot rotates to agitate the cooling medium, thereby effectively dissipating heat from the chip's hotspots.

[0052] In this embodiment of the invention, the microrobot is a magnetic particle with chiral characteristics, typically in the micrometer or nanometer range, preferably with a diameter of 20 μm to 100 μm. The asymmetric structure of the chiral microrobot is key to its chiral characteristics and specific functions; common asymmetric structures include helical shapes and tadpole-shaped tails. Taking the helical structure as an example: the helical structure is a typical asymmetric structure, similar to the double helix of DNA or the thread of a screw. This structure has a continuous, helical extension characteristic, and its pitch, helical radius, and other parameters affect the performance of the microrobot. When the helical chiral microrobot is placed in a cooling medium and driven by an external magnetic field, it will rotate like a propeller. Due to the chirality of the helical structure, the rotational motion is converted into linear motion. For example, driven by a uniform magnetic field, the magnetic helical microrobot can move linearly to a local hot spot on the chip.

[0053] When the microrobot moves to a localized hotspot, the cooling medium continuously carries away heat, preventing heat accumulation in the hotspot area. Simultaneously, the cooling medium above the hotspot forms a liquid-cooled pool, providing a stable environment for the microrobot's movement and heat exchange. Within this liquid-cooled pool, the magnetic microrobot's rotation creates convection currents around the hotspot, accelerating the uniform diffusion of heat into the surrounding cooling medium and further enhancing the heat dissipation effect.

[0054] Figure 1 This is a flowchart illustrating the chip hotspot heat dissipation method based on microrobots provided by the present invention, as shown below. Figure 1 As shown, the method includes:

[0055] Step 1: Obtain the surface temperature distribution and heat flux density distribution of the chip to locate the hot spots on the chip.

[0056] Specifically, this application employs a high-precision infrared thermal imaging system to perform full-field temperature measurement on the chip surface to obtain the surface temperature distribution of the chip. This system can capture infrared radiation energy at different locations on the chip surface, converting it into temperature data to form a temperature distribution image of the chip surface. Furthermore, the system is equipped with a macro optical lens, enabling... The system achieves high spatial resolution (level 1) and temperature resolution (0.1K) to ensure accurate capture of hotspot distributions at the hundred-micron level. By acquiring the surface temperature distribution of the chip, it can precisely capture temperature changes at different locations on the chip surface, providing fundamental data for subsequent hotspot localization and thus improving the accuracy of hotspot location.

[0057] Furthermore, this application calculates the heat flux density distribution on the chip surface based on the chip's power consumption distribution and heat conduction theory using Fourier's law. Heat flux density reflects the intensity of heat transfer at various points on the chip surface and is an important basis for locating hot spots. This heat flux density distribution is calculated according to formula (1):

[0058]

[0059] Where k is the thermal conductivity of the chip material.

[0060] This application compares the surface temperature distribution with a preset hot spot temperature threshold and the heat flux density distribution with a preset heat flux density threshold. When both the temperature threshold and the heat flux density threshold conditions are met, the area is determined to be a hot spot area, and the location coordinates of the hot spot are located based on the hot spot area.

[0061] Specifically, setting a hotspot temperature threshold and heat flux density threshold The surface temperature distribution of the chip is respectively With preset temperature threshold Comparison and heat flux density distribution With heat flux density threshold Compare; in and In this case, determine the surface temperature distribution The area in question is a hotspot; based on this hotspot area, the location coordinates of the hotspot are obtained using a coordinate positioning algorithm. .

[0062] In this invention, the location coordinates of the hotspot can be obtained using a coordinate positioning algorithm. The specific method is as follows:

[0063] First, a correspondence is established between the infrared thermal imaging image of the chip acquired using a high-precision infrared thermal imaging system and the surface image of the chip acquired using an image acquisition device: the infrared thermal imaging system is calibrated to determine the proportional relationship between the pixel coordinates of the infrared thermal imaging image and the actual chip size corresponding to the chip's surface image. Assuming the number of pixels in the x-direction is Nx, and the corresponding actual chip length is Lx, then the actual length represented by each pixel in the x-direction is Δx = Lx / Nx; similarly, in the y-direction, if the number of pixels is Ny, and the corresponding actual chip width is Ly, then the actual length represented by each pixel in the y-direction is Δy = Ly / Ny. For the z-coordinate, since infrared thermal imaging typically only measures the temperature distribution on the object's surface, the z-coordinate is generally assumed to be the plane containing the chip surface, i.e., z = 0.

[0064] Determine the hot spot pixel coordinates: Find the point with the highest temperature in the infrared thermal imaging image, i.e., the hot spot, and record its pixel coordinates (i,j) in the image.

[0065] Calculate the actual coordinates of the hotspot: Based on the previously established correspondence, convert the pixel coordinates into actual coordinates. The actual coordinates of the hotspot in the x-direction are x = i * Δx, and the actual coordinates in the y-direction are y = j * Δy, z = 0. Thus, the chip hotspot location coordinates are calculated. .

[0066] Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot to move above the hot spot position in the cooling medium.

[0067] Specifically, the driving force and resistance force experienced by the robot in the magnetic field are determined respectively; based on the driving force and resistance force, a first rotational speed of the magnetic field is determined; based on the first rotational speed, the microrobot is manipulated to move in the cooling medium to above the hot spot position.

[0068] The magnetic field used in this application consists of three sets of orthogonal Helmholtz coils. The strength and direction of this magnetic field are adjusted by controlling the magnitude and direction of the current in the coils to generate a uniform rotating magnetic field in space. The robot's speed and direction are then adjusted based on the strength and direction of the rotating magnetic field. The rotating magnetic field... for:

[0069] ( )

[0070] in, The magnitudes of the magnetic field in each direction are given. The rotational angular frequency (JFF) of a rotating magnetic field describes how fast the field rotates. It determines the rate at which the magnetic field direction changes with time, influencing the motion of a microrobot within the magnetic field, such as its rotational frequency. When the JFF changes, the magnetic torque acting on the microrobot changes, thus altering its rotation and speed. Therefore, the JFF is essentially the magnetic field generated by the Helmholtz coil, characterizing a key property of the magnetic field's rotational motion. The JFF can be converted into the rotational frequency of the magnetic field. . This initial phase represents the state of the rotating magnetic field at the start. When a Helmholtz coil generates a rotating magnetic field, this initial state influences the subsequent changes in the magnetic field, as well as the forces and motion tendencies of the microrobot within the magnetic field at the initial moment. For example, different initial phases may cause the microrobot to begin rotating motion from different directions.

[0071] here, The calculation formula is as follows:

[0072] ( )

[0073] in, Let be the radius of the Helmholtz coil. Let be the distance from a point on the axis to the axis center. The number of turns of the coil. The current intensity passing through the coil, It is the permeability in vacuum, which is .

[0074] In this embodiment, the microrobot is a magnetic particle with a tail. When the microrobot contains magnetic material inside or on its surface, it generates driving force and resistance under the influence of a rotating magnetic field.

[0075] Here, the driving force experienced by the robot in the magnetic field. for:

[0076]

[0077] in, This is the structural shape factor of the robot. Indicates the dynamic viscosity coefficient of the cooling medium. The self-rotation frequency of the microrobot Let be the equivalent radius of the microrobot.

[0078] The Stokes drag experienced by the robot in the magnetic field for:

[0079]

[0080] in, Let v be the dynamic viscosity coefficient of the cooling medium, v be the robot's running speed, and L be the robot's equivalent radius.

[0081] When a chiral microrobot's asymmetric structure (such as a spiral or tadpole-shaped tail) rotates under a uniform rotating magnetic field, the interaction between the structural asymmetry and the fluid generates a propulsive force in a specific direction. In this application, since the rotational Reynolds number is much less than 1, the applicability conditions of Stokes' drag theory are met. The propulsive force generated in a specific direction by the interaction between the structural asymmetry and the fluid when the chiral microrobot rotates under a uniform rotating magnetic field is essentially the reaction force of the fluid on the rotating structure. In this case, Stokes' drag theory can be used to approximate the calculation of this propulsive force.

[0082] when At that moment, the robot accelerates forward.

[0083] when When the robot moves forward at a constant speed v, it will move forward at a constant speed v.

[0084] when When the robot rotates in place, it will remain stationary.

[0085] In this case, in order for the robot to move to the hot spot under the influence of the magnetic field, it is necessary to ensure that: .

[0086] when At that time, there were:

[0087]

[0088] The critical self-rotation frequency of the robot can then be determined according to formula (7). for:

[0089]

[0090] Then: Assume the robot's running speed is The corresponding robot's rotation frequency is Assume the robot's running speed is The corresponding robot's rotation frequency is To ensure Then the robot's rotation frequency needs to be guaranteed. .

[0091] Furthermore, when the magnetic robot is placed in a magnetic field, its rotational frequency will eventually approach the rotational frequency of the magnetic field. In this case, it is assumed that the rotational frequency of the magnetic robot... Equal to the rotation frequency of the magnetic field ,Right now Therefore, only the rotation frequency of the magnetic field... The robot will only operate when... The robot will rotate in place. Therefore, this application determines the robot's rotation frequency by setting a speed, and then determines the corresponding rotation frequency of the magnetic field based on the robot's rotation frequency. Thus, this application only needs to ensure the rotation frequency of the magnetic field, indirectly determined by the robot's running speed. Once the rotation frequency of the magnetic field is determined, it can be substituted into formulas (4) and (5) to determine the driving force and resistance experienced by the robot in the magnetic field, and then the running speed of the robot can be determined based on the driving force and resistance experienced by the robot in the magnetic field.

[0092] This application uses the following formula to control the robot to move to the area where the chip hotspot is located:

[0093]

[0094] in, The target position for the microrobot. This is the current position of the microrobot. Let be the initial velocity of the microrobot. For the movement time of the microrobot, Let be the acceleration of the microrobot. When the robot moves forward at a constant speed, the acceleration is 0.

[0095] Here, the acceleration of the microrobot in the magnetic field It can be obtained through the following methods:

[0096]

[0097] in, For the density of microrobots, For the volume of the microrobot, Let F be the acceleration of the microrobot in the magnetic field; and let F be the net force acting on the robot in the magnetic field. The driving force experienced by the robot in the magnetic field; This represents the resistance experienced by the robot in the rotating magnetic field.

[0098] This application determines the position of a microrobot by real-time monitoring and comparing it with the coordinates of a specified location above a hotspot. Common monitoring methods include microscopic imaging combined with image recognition algorithms, or magnetic field positioning technology. Assuming the coordinates of the specified location above the hotspot are (x, y, z), the real-time position coordinates of the microrobot obtained through monitoring are: Calculate the distance between the two. Set an allowable error range Δd. When d ≤ Δd, the microrobot is considered to have moved to the hot spot position.

[0099] Step 3: Determine the initial heat flux change data of the microrobot above the hot spot.

[0100] Specifically, the change in heat flux (Δq) is the difference in heat transferred per unit area and per unit time at the chip hotspot before and after the microrobot's movement, i.e.:

[0101]

[0102] in, The heat flux at the hotspot before the microrobot moves to it. This refers to the heat flux at the hotspot after the microrobot moves to it.

[0103] Changes in heat flux directly reflect the degree to which the movement of the microrobot enhances heat transfer at hot spots. By comparing the heat flux before and after the intervention of the microrobot (… The improvement in its convective heat transfer capacity can be quantitatively assessed. A positive heat difference (Δq>0) indicates that the microrobot has enhanced heat dissipation, with more heat being carried away by the cooling medium; a negative heat difference (Δq<0) may indicate operational abnormalities (such as the microrobot not working effectively).

[0104] Here, before the microrobot moves to the hotspot, the heat flux at the hotspot is... The following formula is used for calculation:

[0105]

[0106] in, The temperature at the hotspot before the microrobot moves to it; The initial temperature of the cooling medium, i.e., the temperature at which the cooling medium has not yet dissipated heat from the hot spot, can be approximated as a relatively stable reference temperature. The convective heat transfer coefficient at the hot spot before the microrobot moves to the hot spot; For the equivalent radius, For fluid thermal conductivity, The convective heat transfer coefficient at the hot spot before the microrobot moves to the hot spot; Let be the Nusselt number before the microrobot moves to the hot spot; Gr is the Grashof number, and Pr is the Prandtl number. The specific heat capacity of the cooling medium. The dynamic viscosity coefficient, It refers to thermal conductivity.

[0107] Here, after the microrobot moves to the hotspot, the heat flux at the hotspot... The following formula is used for calculation:

[0108]

[0109] in, The temperature at the hotspot after the microrobot moves to it; The convective heat transfer coefficient at the hot spot after the microrobot moves to the hot spot; For the rotational Reynolds number, The Nusselt number after the microrobot moves to the hotspot, where Pr is the Prandtl number. The rotation frequency corresponding to the robot's movement to the hotspot and stable rotation. This is the kinematic viscosity coefficient of the cooling medium.

[0110] According to formulas (11)-(19), once the robot's rotation frequency is determined, the initial heat flux change of the robot in the hot spot area of ​​the chip can be determined. When the robot is in the rotating magnetic field, its rotation frequency will gradually approach the rotation frequency of the magnetic field. Therefore, as long as the rotation frequency of the rotating magnetic field is controlled, the initial heat flux change of the robot in the hot spot area can be determined. When the initial heat flux change does not meet the heat dissipation requirements, the rotation frequency of the magnetic field can be continuously adjusted until the initial heat flux change meets the expected heat exchange efficiency, thereby achieving effective heat dissipation of the chip.

[0111] It should be noted that when adjusting the rotation frequency of the magnetic field, it is necessary to ensure that the rotation frequency of the magnetic field is less than the critical rotation frequency of the magnetic field, while the critical rotation frequency of the magnetic field is equal to the critical self-rotation frequency of the robot. .

[0112] Step 4: Based on the initial heat flux change, continuously adjust the magnetic field control parameters until the current heat flux change data meets the expected heat dissipation target, so as to effectively dissipate heat from the chip hotspots.

[0113] Specifically, in this embodiment of the invention, the magnetic field control parameter is the rotation frequency of the rotating magnetic field. The initial heat flux change is compared with a preset heat flux change threshold. If the difference between the initial heat flux change and the heat flux change threshold is greater than a preset difference, the magnetic field control parameter is continuously adjusted until the difference between the current heat flux change and the target heat flux change value is less than or equal to the preset difference, thus achieving effective heat dissipation for the chip hotspots.

[0114] The method provided in this application firstly, by acquiring the surface temperature distribution and heat flux density distribution of the chip, can accurately locate the hot spot position on the chip, ensuring that the microrobot can accurately move above the hot spot for heat dissipation, avoiding the blindness that may exist in traditional heat dissipation methods. Next, by using magnetic field control parameters to manipulate the microrobot to move above the hot spot, dynamic tracking and heat dissipation of the hot spot are achieved. Furthermore, the magnetic field control parameters also control the microrobot to rotate in place in the area where the hot spot is located, enabling the robot to agitate the cooling medium, thereby accelerating the transfer of heat from the chip hot spot area to the cooling medium and effectively improving heat dissipation efficiency. Furthermore, by comparing the initial heat flux change data with the preset heat flux change target value, the magnetic field control parameters are continuously adjusted to maximize the heat flux change, thereby further enhancing the heat dissipation effect. This dynamic adjustment mechanism ensures that the heat dissipation system can respond in real time to changes in the chip's heat generation, maintaining highly efficient heat dissipation performance.

[0115] Figure 2 This is a schematic diagram of the chip hotspot heat dissipation device based on a microrobot provided by the present invention, as shown below. Figure 2 As shown, the device includes:

[0116] Acquisition unit 201 is used to acquire the surface temperature distribution of the chip. and heat flux density distribution To locate the hot spots on the chip;

[0117] The guiding unit 202 is used to guide the cooling medium to flow through the chip;

[0118] The control unit 203 is used to place the microrobot suspended in the cooling medium under the influence of a magnetic field and control the microrobot to move in the cooling medium to the area where the chip hot spot is located.

[0119] Determining unit 204 is used to determine the initial heat flux change of the microrobot in the region where the chip hotspot is located;

[0120] The heat dissipation unit 205 is used to continuously adjust the magnetic field control parameters according to the initial heat flux change until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hot spots.

[0121] Figure 3 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 3As shown, the electronic device may include: a processor 310, a communication interface 320, a memory 830, and a communication bus 340, wherein the processor 310, the communication interface 320, and the memory 330 communicate with each other via the communication bus 340. The processor 310 can call logic instructions in the memory 830 to execute a chip hotspot heat dissipation method based on a microrobot, the method including:

[0122] Step 1: Obtain the surface temperature distribution of the chip and heat flux density distribution To locate the hot spots on the chip;

[0123] Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot in the cooling medium to the area where the chip's hot spot is located;

[0124] Step 3: Determine the initial heat flux change of the microrobot in the region where the chip hotspot is located;

[0125] Step 4: Based on the initial heat flux change, continuously adjust the magnetic field control parameters until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hotspots.

[0126] Furthermore, the logical instructions in the aforementioned memory 330 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0127] On the other hand, the present invention also provides a computer program product, the computer program product comprising a computer program that can be stored on a non-transitory computer-readable storage medium, wherein when the computer program is executed by a processor, the computer is able to execute the chip hotspot heat dissipation method based on microrobots provided by the above methods, the method comprising:

[0128] Step 1: Obtain the surface temperature distribution of the chip and heat flux density distribution To locate the hot spots on the chip;

[0129] Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot in the cooling medium to the area where the chip's hot spot is located;

[0130] Step 3: Determine the initial heat flux change of the microrobot in the region where the chip hotspot is located;

[0131] Step 4: Based on the initial heat flux change, continuously adjust the magnetic field control parameters until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hotspots.

[0132] In another aspect, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to perform the chip hotspot heat dissipation method based on microrobots provided by the above methods, the method comprising:

[0133] Step 1: Obtain the surface temperature distribution of the chip and heat flux density distribution To locate the hot spots on the chip;

[0134] Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot in the cooling medium to the area where the chip's hot spot is located;

[0135] Step 3: Determine the initial heat flux change of the microrobot in the region where the chip hotspot is located;

[0136] Step 4: Based on the initial heat flux change, continuously adjust the magnetic field control parameters until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hotspots.

[0137] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0138] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0139] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip hotspot heat dissipation method based on microrobots, characterized in that, include: Step 1: Obtain the surface temperature distribution of the chip and heat flux density distribution To locate the hot spots on the chip; Step 2: Guide the cooling medium to flow through the chip, and place the microrobot suspended in the cooling medium under the influence of a magnetic field, maneuvering the microrobot in the cooling medium to the area where the chip's hot spot is located; Step 3: Determine the initial heat flux change of the microrobot in the region where the chip hotspot is located; Step 4: Based on the initial heat flux change, continuously adjust the magnetic field control parameters until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hotspots.

2. The chip hotspot heat dissipation method based on microrobots according to claim 1, characterized in that, Step one includes: The surface temperature distribution of the chip With preset hotspot temperature threshold Heat flux density distribution of the chip With heat flux density threshold Compare; exist and In this case, determine the surface temperature distribution The area in question is a hotspot. Based on the hotspot area, determine the location of the chip hotspot.

3. The chip hotspot heat dissipation method based on microrobots according to claim 1, characterized in that, Step two includes: Determine the driving force and resistance experienced by the robot in the magnetic field; The first rotational speed of the magnetic field is determined based on the driving force and resistance. Based on the first rotational speed, the microrobot is manipulated to move in the cooling medium to above the hot spot location.

4. The chip heat dissipation method according to claim 3, characterized in that, The driving force on the robot in the magnetic field is: in, For the structural shape coefficient of the robot, Indicates the dynamic viscosity coefficient of the cooling medium. The self-rotation frequency of the microrobot Let be the equivalent radius of the microrobot; The resistance experienced by the robot in the magnetic field is: in, Let v be the dynamic viscosity coefficient of the cooling medium, and v be the robot's operating speed. Let be the robot's equivalent radius.

5. The chip hotspot heat dissipation method based on microrobots according to claim 1, characterized in that, Step three includes: Before the microrobot moves to the hotspot, the heat flux at the hotspot is determined. And the heat flux at the hotspot after the microrobot moves to the hotspot. ; According to the heat flux and heat flux Determine the heat flux changes of the microrobot at the hot spot. , .

6. The chip hotspot heat dissipation method based on microrobots according to claim 5, characterized in that, The heat flux is determined according to the following formula. : in, The temperature at the hotspot before the microrobot moves to it; The initial temperature of the cooling medium. Let be the equivalent radius of the microrobot. The thermal conductivity of the cooling medium The convective heat transfer coefficient at the hot spot before the microrobot moves to the hot spot; Let be the Nusselt number before the microrobot moves to the hot spot; Gr is the Grashof number, and Pr is the Prandtl number; The heat flux is determined according to the following formula. : in, The temperature at the hotspot after the microrobot moves to it; The convective heat transfer coefficient at the hot spot after the microrobot moves to the hot spot; The rotation frequency corresponding to the robot's movement to the hotspot and stable rotation. Let L be the kinematic viscosity coefficient of the cooling medium, and L be the equivalent radius of the robot.

7. The chip hotspot heat dissipation method based on microrobots according to claim 5, characterized in that, Step four includes: The initial heat flux change data is compared with the preset heat flux change target value. If the difference between the initial heat flux change data and the heat flux change target value is greater than the preset difference, the magnetic field control parameters are continuously adjusted until the difference between the current heat flux change data and the heat flux change target value is less than or equal to the preset difference.

8. A chip hotspot heat dissipation device based on a microrobot, characterized in that, include: Acquisition unit, used to acquire the surface temperature distribution of the chip. and heat flux density distribution To locate the hot spots on the chip; The guiding unit is used to guide the cooling medium to flow through the chip; The control unit is used to place the microrobot suspended in the cooling medium under the influence of a magnetic field and control the microrobot to move to the area where the chip hot spot is located in the cooling medium. The determining unit is used to determine the initial heat flux change of the microrobot in the region where the chip hotspot is located; The heat dissipation unit is used to continuously adjust the magnetic field control parameters according to the initial heat flux change until the current heat flux change data meets the expected heat dissipation target, so as to dissipate heat from the chip hot spots.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the chip hotspot heat dissipation method based on microrobots as described in any one of claims 1 to 7.

10. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the chip hotspot heat dissipation method based on microrobots as described in any one of claims 1 to 7.

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