Urban rail traction control board card and assembling method thereof

Abstract

The invention provides an urban rail traction control board card which comprises a mother board, a DI circuit function board, a DO circuit function board, a voltage and current detection AD circuit function board, a temperature detection circuit function board and a pulse output circuit function board. Any one or more of the DI circuit function board, the DO circuit function board, the voltage and current detection AD circuit function board, the temperature detection circuit function board and the pulse output circuit function board are inserted on the mother board; and a power supply, a main control chip, a main control chip peripheral circuit and a cooling fin are arranged on the front surface of the mother board. According to the invention, a large number of the five functional board cards can be manufactured. In practical application, the number of each functional board card is increased or decreased according to the requirements of each project, so that a final main control unit is quickly formed, and the mother board is kept unchanged, so that the mother board can be hoarded and manufactured in large quantities. Therefore, the cost can be greatly reduced by assembling and matching the requirements of each project. The materials are few in types and convenient and fast to store.

Description

Technical Field

[0001] This invention relates to the field of control board technology, and more particularly to a traction control board for urban rail transit and its assembly method. Background Technology

[0003] At this stage, the production process needs to be as efficient as possible, enabling rapid assembly according to project requirements.

[0004] In the urban rail traction control unit, the resources such as voltage, current, temperature, digital input, and digital output are always different in each project.

[0005] If we can create a master board, we can rationally match the various boards in the control unit according to the quantity of various resources in the project each time. Summary of the Invention

[0006] In view of the technical problems mentioned in the background section above, a traction control board for urban rail transit and its assembly method are provided.

[0007] The technical means employed in this invention are as follows: A traction control board for urban rail transit includes: The motherboard, DI circuit function board, DO circuit function board, voltage and current detection AD circuit function board, temperature detection circuit function board and pulse output circuit function board are all the same size, are inserted into the motherboard in the same way, have the same size and relative position of the mounting holes on the diagonal of the board, and have the same pin arrangement for the internal connectors. One or more of the DI circuit function board, DO circuit function board, voltage and current detection AD circuit function board, temperature detection circuit function board and pulse output circuit function board can be randomly selected and inserted into the motherboard. The front side of the motherboard is provided with a power supply, a main control chip, peripheral circuits of the main control chip, and a heat sink. The DI circuit board, DO circuit board, voltage and current detection AD circuit board, temperature detection circuit board, and pulse output circuit board are all equipped with internal connectors and external connectors; each of the DI circuit board, DO circuit board, voltage and current detection AD circuit board, temperature detection circuit board, and pulse output circuit board has two diagonally arranged mounting holes.

[0008] Furthermore, the DI circuit functional board converts high-voltage digital signals into low-voltage digital signals. The low-voltage DI1, DI2, DI3, and DI4 in the internal interface of the DI circuit functional board correspond one-to-one with the high-voltage DIN1, DIN2, DIN3, and DIN4 in the external interface. The internal interfaces DO1, DO2, DO3, and DO4 of the DI circuit functional board are electrically connected to the motherboard but are not used.

[0009] Furthermore, the DO circuit function board uses low-voltage digital signals to control relays, connecting or disconnecting high-voltage digital signals. The low-voltage DO1 in the internal interface of the DO circuit functional board corresponds to the high-voltage relay I normally open contact KA1, relay I normally closed contact KB1, and relay I common contact KC1 in the external interface. The low-voltage DO2 in the internal interface corresponds to the high-voltage relay II normally open contact KA2, normally closed contact KB2, and common contact KC2 in the external interface. The low-voltage DO3 in the internal interface corresponds to the high-voltage relay III normally open contact KA3, normally closed contact KB3, and common contact KC3 in the external interface. The internal interfaces DO4, DI1, DI2, DI3, and DI4 are electrically connected to the motherboard but are not used.

[0010] Furthermore, the voltage and current detection AD circuit functional board introduces the voltage and current signals to be detected through an external interface, and after passing through the conditioning circuit, delivers them to the analog-to-digital converter (ADC) for detection. The DI pin of the voltage and current detection AD circuit board is connected to the conversion result of the analog-to-digital converter (ADC), and the DO pin is connected to the operation pin of the ADC, namely the chip select signal and the clock signal.

[0011] Furthermore, the analog-to-digital converter ADC1 of the voltage and current detection AD circuit functional board detects the voltage and current signals AIN1 in the external interface; the analog-to-digital converter ADC2 detects the voltage and current signals AIN2 in the external interface. The DO1 pin of the internal interface of the voltage and current detection AD circuit functional board is connected to the chip select signal operation pin of analog-to-digital converter ADC1 and analog-to-digital converter ADC2.

[0012] The DO2 pin of the internal interface of the voltage and current detection AD circuit functional board is connected to the clock signal operation pin of analog-to-digital converter ADC1 and analog-to-digital converter ADC2. The DI1 in the internal interface of the voltage and current detection AD circuit functional board is connected to the conversion result of the analog-to-digital converter ADC1. The DI2 in the internal interface of the voltage and current detection AD circuit functional board is connected to the conversion result of the analog-to-digital converter ADC2. The internal interfaces of the voltage and current detection AD circuit functional board, DI3, DI4, DO3, and DO4, are electrically connected to the motherboard but are not used.

[0013] Furthermore, the temperature detection circuit board receives the voltage signal from the temperature sensor PT100 to be detected through an external interface. After passing through the conditioning circuit, the signal is delivered to the analog-to-digital converter (ADC) for detection. The DI pin is connected to the conversion result of the ADC. DI1 receives the digital conversion result of the first PT100. DI2 receives the digital conversion result of the first PT100. The DO pin is connected to the operation pin of the ADC, namely the clock signal and the chip select signal. DO1 provides the conversion clock signal for two PT100 channels, and DO2 provides the conversion chip select signal for two PT100 channels.

[0014] The internal interfaces DI3, DI4, DO3, and DO4 of the temperature detection circuit functional board are electrically connected to the motherboard but are not used.

[0015] Furthermore, the pulse output circuit functional board converts the low-voltage PWM signal into a high-voltage PWM signal; and converts the high-voltage drive fault signal into a low-voltage drive fault signal.

[0016] The low-voltage levels DO1, DO2, DO3, and DO4 in the internal interface correspond one-to-one with the high-voltage levels PWM1_DRV, PWM2_DRV, PWM3_DRV, and PWM4_DRV in the external interface.

[0017] The low-voltage level DI1 and DI2 in the internal interface correspond one-to-one with the high-voltage level drive fault signals ERR1_DRV and ERR2_DRV in the external interface.

[0018] DI3 and DI4 in the internal interface are electrically connected to the motherboard but are not used.

[0019] The present invention also includes a method for assembling a traction control board for urban rail transit, comprising the following steps: Arbitrarily select one or more DI circuit function boards, DO circuit function boards, voltage and current detection AD circuit function boards, temperature detection circuit function boards, and pulse output circuit function boards to insert onto the motherboard.

[0020] Compared with the prior art, the present invention has the following advantages: This invention enables the mass production of the five functional boards described above. In practical applications, the number of each functional board can be increased or decreased according to the needs of each project, thereby quickly forming the final main control unit. The motherboard remains unchanged, so it can also be mass-produced. This method of assembling to match the needs of various projects can significantly reduce costs. The number of material types is small, and storage is convenient and quick.

[0021] It not only has high engineering application value, but also has a broad market application prospect. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a top view of the various functional boards disclosed in this invention; Figure 2 This is a schematic diagram of the signal processing flow of the DI circuit functional board of the present invention; Figure 3 This is a schematic diagram of the signal processing flow of the DO circuit functional board of the present invention; Figure 4 This is a schematic diagram of the signal processing flow of the voltage and current detection AD circuit functional board of the present invention; Figure 5 This is a schematic diagram of the signal processing flow of the temperature detection circuit functional board of the present invention; Figure 6 This is a schematic diagram of the signal processing flow of the pulse output circuit functional board of the present invention; Figure 7 This is a top view of an embodiment in which 10 functional boards are simultaneously installed on a motherboard. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0025] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0026] like Figure 1 As shown, this invention provides a traction control board for urban rail transit, comprising: a motherboard, a DI circuit function board, a DO circuit function board, a voltage and current detection AD circuit function board, a temperature detection circuit function board, and a pulse output circuit function board. One or more of the DI circuit function board, DO circuit board, voltage and current detection AD circuit function board, temperature detection circuit function board, and pulse output circuit function board can be arbitrarily selected and inserted into the motherboard.

[0027] like Figure 1 As shown, the circuit includes one or more DI circuit boards, DO circuit boards, voltage and current detection AD circuit boards, temperature detection circuit boards, and pulse output circuit boards. All function boards are identical in size, and the positions of mounting holes 1 and 2 relative to the function board are the same. The internal connectors are also identical, with only VCC (power supply), GND (signal ground), DO1-DO4, and DI1-DI4 signals electrically connected to the motherboard. All external connectors on the function boards use a D-SUB9 connector.

[0028] On the internal connectors, VCC and GND are provided with the same voltage by the motherboard and are electrically connected to the motherboard.

[0029] Each function board has a different external interface definition.

[0030] The shaded areas on each functional board represent the parts that perform the functions. The circuit structures are all different.

[0031] When the function board is a DI circuit function board The motherboard is electrically connected to all DI1, DI2, DI3, DI4, DO1, DO2, DO3, and DO4. However, only DI1, DI2, DI3, and DI4 are used to represent the four external high-voltage digital input signals. The four signals DO1, DO2, DO3, and DO4 are not actually used.

[0032] The front side of the motherboard is provided with a power supply, a main control chip, peripheral circuits of the main control chip, and a heat sink. The DI circuit board, DO circuit board, voltage and current detection AD circuit board, temperature detection circuit board, and pulse output circuit board are all equipped with internal connectors and external connectors; each of the DI circuit board, DO circuit board, voltage and current detection AD circuit board, temperature detection circuit board, and pulse output circuit board has two diagonally arranged mounting holes.

[0033] In a preferred embodiment, the DI circuit board in this application converts high-voltage digital signals into low-voltage digital signals, involving necessary electrical isolation and electrical protection.

[0034] In this application, the low-voltage DI1, DI2, DI3, and DI4 in the internal interface of the DI circuit functional board correspond one-to-one with the high-voltage DIN1, DIN2, DIN3, and DIN4 in the external interface; the DO1, DO2, DO3, and DO4 in the internal interface of the DI circuit functional board are electrically connected to the motherboard but are not used.

[0035] In a preferred embodiment, in this application, the DO circuit function board controls the relays to connect or disconnect the high-voltage digital signals using low-voltage digital signals. The low-voltage DO1 in the internal interface of the DO circuit function board corresponds to the normally open contact KA1, normally closed contact KB1, and common contact KC1 of relay I in the external interface, representing the high voltage level. The low-voltage DO2 in the internal interface corresponds to the normally open contact KA2, normally closed contact KB2, and common contact KC2 of relay II in the external interface, representing the high voltage level. The low-voltage DO3 in the internal interface corresponds to the normally open contact KA3, normally closed contact KB3, and common contact KC3 of relay III in the external interface, representing the high voltage level. DO4, DI1, DI2, DI3, and DI4 in the internal interface are electrically connected to the motherboard but are not used.

[0036] Preferably, the voltage and current detection AD circuit functional board introduces the voltage and current signals to be detected through an external interface, and after passing through the conditioning circuit, delivers them to the analog-to-digital converter (ADC) for detection. The analog-to-digital converter (ADC1) of the voltage and current detection AD circuit board detects the voltage and current signals AIN1 from the external interface; the analog-to-digital converter (ADC2) detects the voltage and current signals AIN2 from the external interface. DO1 in the internal interface of the voltage and current detection AD circuit board is connected to the chip select signal operation pins of ADC1 and ADC2. DO2 in the internal interface of the voltage and current detection AD circuit board is connected to the clock signal operation pins of ADC1 and ADC2. DI1 in the internal interface of the voltage and current detection AD circuit board is connected to the conversion result of ADC1. DI2 in the internal interface of the voltage and current detection AD circuit board is connected to the conversion result of ADC2. DI3, DI4, DO3, and DO4 in the internal interface of the voltage and current detection AD circuit board are electrically connected to the motherboard but are not used.

[0037] Preferably, the temperature detection circuit board receives the voltage signal from the temperature sensor PT100 to be detected through an external interface, and after passing through the conditioning circuit, delivers it to the analog-to-digital converter (ADC) for detection. The following is described using a 4-line system: The analog-to-digital converter ADC1 detects the voltage signal of the temperature sensor PT100 in the external interface (interfaces: PT100A1, PT100B1, PT100C1, PT100D1).

[0038] The analog-to-digital converter ADC2 detects the voltage signal of the temperature sensor PT100 in the external interface (interfaces: PT100A2, PT100B2, PT100C2, PT100D2).

[0039] The DO1 pin in the internal interface is connected to the "chip select signal" operation pin of analog-to-digital converters ADC1 and ADC2.

[0040] The DO2 pin in the internal interface is connected to the "clock signal" operation pin of analog-to-digital converters ADC1 and ADC2.

[0041] The conversion result of analog-to-digital converter ADC1 is connected to DI1 in the internal interface.

[0042] The conversion result of analog-to-digital converter ADC2 is connected to DI2 in the internal interface.

[0043] The internal interfaces DI3, DI4, DO3, and DO4 are electrically connected to the motherboard but are not used.

[0044] Furthermore, the pulse output circuit board converts low-voltage PWM signals into high-voltage PWM signals and high-voltage drive fault signals into low-voltage drive fault signals. The low-voltage D01, DO2, DO3, and DO4 signals in the internal interface correspond one-to-one with the high-voltage PWM1_DRV, PWM2_DRV, PWM3_DRV, and PWM4_DRV signals in the external interface (two-way up / down bridge arm drive signals). The low-voltage DI1 and DI2 signals in the internal interface correspond one-to-one with the high-voltage ERR1_DRV and ERR2_DRV signals in the external interface (two-way drive fault feedback signals).

[0045] DI3 and DI4 in the internal interface are electrically connected to the motherboard but are not used.

[0046] The present invention also includes a method for assembling a traction control board for urban rail transit, comprising the following steps: Arbitrarily select one or more DI circuit function boards, DO circuit function boards, voltage and current detection AD circuit function boards, temperature detection circuit function boards, and pulse output circuit function boards to insert onto the motherboard.

[0047] like Figure 2 As shown, when the function board is a DO circuit function board, the motherboard is electrically connected to all DI1, DI2, DI3, DI4, DO1, DO2, DO3, and DO4. However, only DO1, DO2, and DO3 are used to control the three digital output relay control signals. The five signals DO4, DI1, DI2, DI3, and DI4 are not actually used.

[0048] like Figure 3 As shown, when the function board is a voltage and current detection AD circuit function board, the motherboard is electrically connected to all DI1, DI2, DI3, DI4, DO1, DO2, DO3, and DO4. However, only DI1 and DI2 are used to receive the analog-to-digital conversion signal, and DO1 and DO2 are used as chip select signals and clock signals, respectively. The four signals DI3, DI4, DO3, and DO4 are not actually used.

[0049] like Figure 4 As shown, when the function board is a temperature detection circuit function board, the motherboard is electrically connected to all DI1, DI2, DI3, DI4, DO1, DO2, DO3, and DO4. However, only DI1 and DI2 are used to receive analog-to-digital signals, while DO1 and DO2 are used as chip select signals and clock signals, respectively. The four signals DI3, DI4, DO3, and DO4 are not actually used.

[0050] like Figure 5As shown, when the function board is a pulse output circuit function board, the motherboard is electrically connected to all DI1, DI2, DI3, DI4, DO1, DO2, DO3, and DO4. However, only DI1 and DI2 are used to receive the fault feedback signals from the two drives, while DO1, DO2, DO3, and DO4 are used as drive signals for the upper and lower bridge arms of the two drives, respectively. Signals DI3 and DI4 are not actually used.

[0051] Ultimately, depending on the project, different functional boards can be arranged to achieve different functions of the entire system. Since all functional boards are the same size and have the same internal interfaces, and since all functional boards DI1-DI4 and DO1-DO4 can be placed arbitrarily (based on ease of wiring).

[0052] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0053] In the above embodiments of the present invention, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0054] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. The device embodiments described above are merely illustrative; for example, the division of units can be a logical functional division, and in actual implementation, there may be other division methods. For instance, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual coupling, direct coupling, or communication connection may be through some interfaces; the indirect coupling or communication connection between units or modules may be electrical or other forms.

[0055] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0056] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0057] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A traction control board for urban rail transit, characterized in that, include: Motherboard, DI circuit function board, DO circuit function board, voltage and current detection AD circuit function board, temperature detection circuit function board, and pulse output circuit function board; One or more of the DI circuit function board, DO circuit function board, voltage and current detection AD circuit function board, temperature detection circuit function board and pulse output circuit function board can be randomly selected and inserted into the motherboard. The front side of the motherboard is provided with a power supply, a main control chip, peripheral circuits of the main control chip, and a heat sink. The DI circuit board, DO circuit board, voltage and current detection AD circuit board, temperature detection circuit board, and pulse output circuit board are all equipped with internal connectors and external connectors; each of the DI circuit board, DO circuit board, voltage and current detection AD circuit board, temperature detection circuit board, and pulse output circuit board has two diagonally arranged mounting holes.

2. The urban rail traction control board according to claim 1, characterized in that, The DI circuit board converts high-voltage digital signals into low-voltage digital signals. The low-voltage DI1, DI2, DI3, and DI4 in the internal interface of the DI circuit functional board correspond one-to-one with the high-voltage DIN1, DIN2, DIN3, and DIN4 in the external interface. The internal interfaces DO1, DO2, DO3, and DO4 of the DI circuit functional board are electrically connected to the motherboard but are not used.

3. The urban rail traction control board according to claim 1, characterized in that, The DO circuit board controls the relay to connect or disconnect the high-voltage digital signal using the low-voltage digital signal. The low-voltage DO1 in the internal interface of the DO circuit functional board corresponds to the high-voltage relay I normally open contact KA1, relay I normally closed contact KB1, and relay I common contact KC1 in the external interface. The low-voltage DO2 in the internal interface corresponds to the high-voltage relay II normally open contact KA2, normally closed contact KB2, and common contact KC2 in the external interface. The low-voltage DO3 in the internal interface corresponds to the high-voltage relay III normally open contact KA3, normally closed contact KB3, and common contact KC3 in the external interface. The internal interfaces DO4, DI1, DI2, DI3, and DI4 are electrically connected to the motherboard but are not used.

4. The urban rail traction control board according to claim 1, characterized in that, The voltage and current detection AD circuit board receives the voltage and current signals to be detected through an external interface, and after passing through the conditioning circuit, delivers them to the analog-to-digital converter (ADC) for detection. The DI pin of the voltage and current detection AD circuit board is connected to the conversion result of the analog-to-digital converter (ADC), and the DO pin is connected to the operation pin of the ADC, namely the chip select signal and the clock signal.

5. A traction control board for urban rail transit according to claim 1 or 4, characterized in that, The analog-to-digital converter ADC1 of the voltage and current detection AD circuit functional board detects the voltage and current signals AIN1 in the external interface; the analog-to-digital converter ADC2 detects the voltage and current signals AIN2 in the external interface. The DO1 pin of the internal interface of the voltage and current detection AD circuit functional board is connected to the chip select signal operation pin of analog-to-digital converter ADC1 and analog-to-digital converter ADC2. The DO2 pin of the internal interface of the voltage and current detection AD circuit functional board is connected to the clock signal operation pin of analog-to-digital converter ADC1 and analog-to-digital converter ADC2. The DI1 in the internal interface of the voltage and current detection AD circuit functional board is connected to the conversion result of the analog-to-digital converter ADC1. The DI2 in the internal interface of the voltage and current detection AD circuit functional board is connected to the conversion result of the analog-to-digital converter ADC2. The internal interfaces of the voltage and current detection AD circuit functional board, DI3, DI4, DO3, and DO4, are electrically connected to the motherboard but are not used.

6. A traction control board for urban rail transit according to claim 1, characterized in that, The temperature detection circuit board receives the voltage signal from the PT100 temperature sensor through an external interface. After conditioning, the signal is delivered to the analog-to-digital converter (ADC) for detection. The DI pin is connected to the conversion result of the ADC. DI1 receives the digital conversion result of the first PT100. DI2 receives the digital conversion result of the first PT100. The DO pin is connected to the operation pin of the ADC, namely the clock signal and chip select signal. DO1 provides two PT100 conversion clock signals, and DO2 provides two PT100 conversion chip select signals. The internal interfaces DI3, DI4, DO3, and DO4 of the temperature detection circuit functional board are electrically connected to the motherboard but are not used.

7. A traction control board for urban rail transit according to claim 1, characterized in that, The pulse output circuit board converts low-voltage PWM signals into high-voltage PWM signals and high-voltage drive fault signals into low-voltage drive fault signals. The low-voltage levels DO1, DO2, DO3, and DO4 in the internal interface correspond one-to-one with the high-voltage levels PWM1_DRV, PWM2_DRV, PWM3_DRV, and PWM4_DRV in the external interface. The low-voltage level DI1 and DI2 in the internal interface correspond one-to-one with the high-voltage level drive fault signals ERR1_DRV and ERR2_DRV in the external interface. DI3 and DI4 in the internal interface are electrically connected to the motherboard but are not used.

8. A method for assembling a traction control board for urban rail transit, using the control board described in any one of claims 1-7, characterized in that, Includes the following steps: Arbitrarily select one or more DI circuit function boards, DO circuit function boards, voltage and current detection AD circuit function boards, temperature detection circuit function boards, and pulse output circuit function boards to insert onto the motherboard.

Images