Heat dissipation assembly and mainboard module

Abstract

The invention discloses a heat dissipation assembly and a mainboard module, the heat dissipation assembly is used for being immersed in cooling liquid in a groove body and thermally coupled to a heat source, and the heat dissipation assembly comprises a heat exchange plate and a boiling assisting structure. The heat exchange plate is provided with a heat absorption face, a heat dissipation face and a joint face, the heat absorption face is configured to be thermally coupled to a heat source, the heat dissipation face is opposite to the heat absorption face, and the joint face is located on the periphery of the heat dissipation face and used for being jointed with a cover body to form a fluid cavity. The boiling assisting structure is located on the heat dissipation face of the heat exchange plate and is configured to be exposed to the cooling liquid in the tank body.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat dissipation assembly and a motherboard module. BACKGROUND

[0002] For a heat source of a motherboard with an immersion heat sink, a boiler plate is usually directly used to heat couple with the heat source and immerse in the cooling liquid to perform testing (e.g. board function test). However, when a problem occurs in the testing, the cooling liquid is frequently extracted, which causes the cooling liquid to easily escape. Therefore, currently, a cold plate or a heat sink is usually used to replace the boiler plate to heat couple with the heat source and complete some testing items in an air environment, and then the boiler plate is replaced to immerse in the cooling liquid to perform other testing items, so as to reduce the opportunity of the cooling liquid escaping.

[0003] For the testing method of using the cold plate / heat sink and the boiler plate in sequence, the testing complexity is increased due to the repeated disassembly and assembly operations and the complicated disassembly and assembly steps. Therefore, the researchers in the field are trying to solve the above problems. SUMMARY

[0004] The present application provides a heat dissipation assembly and a motherboard module, which can reduce the testing complexity.

[0005] One embodiment of the present application discloses a heat dissipation assembly for immersion in a cooling liquid in a tank and heat coupling with a heat source. The heat dissipation assembly comprises a heat exchange plate and a boiler structure. The heat exchange plate has a heat absorbing surface, a heat dissipating surface and a joint surface. The heat absorbing surface is configured to heat couple with the heat source. The heat dissipating surface is opposite to the heat absorbing surface. The joint surface is located at the periphery of the heat dissipating surface. The joint surface is configured to joint with a cover to form a fluid chamber. The boiler structure is located at the heat dissipating surface of the heat exchange plate and is configured to be exposed to the cooling liquid in the tank.

[0006] Another embodiment of the present application discloses a motherboard module for immersion in a cooling liquid in a tank. The motherboard module comprises a motherboard and a heat dissipation module. The motherboard has a heat source. The heat dissipation module comprises a heat exchange plate and a boiler structure. The heat exchange plate has a heat absorbing surface, a heat dissipating surface and a joint surface. The heat absorbing surface heat couples with the heat source. The heat dissipating surface is opposite to the heat absorbing surface. The joint surface is located at the periphery of the heat dissipating surface. The joint surface is configured to joint with a cover to form a fluid chamber. The boiler structure is located at the heat dissipating surface of the heat exchange plate and is configured to be exposed to the cooling liquid in the tank.

[0007] Yet another embodiment of the present application discloses a heat dissipation assembly for selectively submerging in a cooling liquid in a tank and thermally coupling to a heat source. The heat dissipation assembly includes a heat exchange plate, a boiling-assisted structure, a cover, a liquid inlet connector and at least one liquid outlet connector. The heat exchange plate has a heat absorbing surface and a heat dissipating surface, the heat absorbing surface is configured to thermally couple to the heat source, and the heat dissipating surface is opposite to the heat absorbing surface. The boiling-assisted structure is disposed on the heat dissipating surface. The cover is coupled to the heat exchange plate and covers the boiling-assisted structure, and the cover and the heat exchange plate jointly form a fluid chamber. The liquid inlet connector is connected to the cover. The liquid outlet connector is connected to the cover. The liquid inlet connector, the at least one liquid outlet connector or the cover can be separated from the heat exchange plate, so that the boiling-assisted structure is exposed to the cooling liquid in the tank.

[0008] According to the heat dissipation assembly and the motherboard module disclosed in the above embodiments, the cover is coupled to the heat exchange plate and covers the boiling-assisted structure, the cover and the heat exchange plate jointly form a fluid chamber, and the liquid inlet connector and the liquid outlet connector connected to the cover or the cover can be separated from the heat exchange plate, so that the boiling-assisted structure is exposed to the cooling liquid in the tank. In this way, the heat dissipation assembly has a cold plate mode and a boiling-assisted plate mode. In the cold plate mode, the cover is coupled to the heat exchange plate, and the liquid inlet connector and the liquid outlet connector are connected to the cover, so that the heat dissipation assembly is used as a cold plate to connect pipelines in an air environment. In the boiling-assisted plate mode, the cover is separated from the heat exchange plate, or the liquid inlet connector and the liquid outlet connector connected to the cover are separated from the cover, so that the heat dissipation assembly is used as a boiling-assisted plate to be submerged in the cooling liquid in the tank. In the process of switching between the two modes in the test heat source stage, the heat exchange plate does not need to be separated from the heat source, but only needs to be disassembled and assembled with the cover or the connector, so that the complexity of the test can be reduced.

[0009] The above description about the content of the present application and the following description of the embodiments are used to demonstrate and explain the principles of the present application, and provide further explanation of the scope of the patent application of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 A side view of a motherboard module of some embodiments of the present application;

[0011] Figure 2 An exploded view of a heat dissipation assembly of some embodiments of the present application;

[0012] Figure 3 A cross-sectional view of a motherboard module of some embodiments of the present application;

[0013] Figure 4 A bottom view of a cover of a heat dissipation assembly of some embodiments of the present application;

[0014] Figure 5 A cross-sectional view of a heat dissipation assembly of some embodiments of the present application in a boiling-assisted plate mode;

[0015] Figure 6A cross-sectional view of a host board module of some embodiments of the present application;

[0016] Figure 7 A cross-sectional view of a heat dissipation assembly of some embodiments of the present application in a boiling assisting mode.

[0017] Legend

[0018] 1, 3, 6: Host board module

[0019] 10, 30, 50, 60, 70: Host board

[0020] H1, H3, H5, H6, H7: Heat source

[0021] 100, 200, 300, 500, 600, 700: Heat dissipation assembly

[0022] 21, 31, 51, 61, 71: Heat exchange plate

[0023] 211, 311, 511: Heat exchange portion

[0024] 3111, 5111, 6111, 7111: Heat absorbing surface

[0025] 2112, 3112, 5112, 6112, 7112: Heat dissipating surface

[0026] 212, 312, 512: Outer frame portion

[0027] 2121, 3121, 5121, 6121, 7121: Joint surface

[0028] 2122: Lock hole

[0029] 22, 32, 52, 62, 72: Boiling assisting structure

[0030] 23, 33, 43, 63, 73: Cover body

[0031] 231, 331, 631, 731: Outer top surface

[0032] 232: Long outer side surface

[0033] 233, 333, 633, 733: Short outer side surface

[0034] 434: Long inner side surface

[0035] 435: Short inner side surface

[0036] 436: Flow guiding surface

[0037] 337: Bubble guiding surface

[0038] 638, 738: Joint assembly hole

[0039] 24: locking member

[0040] 25, 35, 45, 65: liquid inlet connector

[0041] 26, 36, 46, 66: liquid outlet connector

[0042] C: fluid chamber

[0043] C1, C2, C3, C4: center line

[0044] S: accommodating groove

[0045] O: sealing ring DETAILED DESCRIPTION

[0046] Please refer to Figure 1 , Figure 1 A side view of a host board module 1 according to some embodiments of the present application is shown. Figure 1 The structural features of the host board module 1 can be applied in some other embodiments of the present application.

[0047] In the present embodiment, the host board module 1 comprises a host board 10 and a heat dissipation assembly 100. The host board 10 has a heat source H1, such as a GPU or a CPU. The heat dissipation assembly 100 is thermally coupled to the heat source H1 of the host board 10. The heat dissipation assembly 100 will be described in detail below.

[0048] Please refer to Figure 2 , Figure 2 An exploded view of a heat dissipation assembly 200 according to some embodiments of the present application is shown. Figure 2 The structural features of the heat dissipation assembly 200 can be applied in some other embodiments of the present application. The heat dissipation assembly 200 comprises a heat exchange plate 21 and a boiling assisting structure 22. In addition, the heat dissipation assembly 200 can further comprise a cover 23, a plurality of locking members 24, a liquid inlet connector 25 and a liquid outlet connector 26.

[0049] The heat exchange plate 21 comprises a heat exchange portion 211 and an outer frame portion 212, which surrounds and is fixed to the heat exchange portion 211. The outer frame portion 212 has an engaging surface 2121 and a plurality of locking holes 2122. The engaging surface 2121 faces the same direction as the heat dissipation surface 2112 of the heat exchange portion 211, and the locking holes 2122 are spaced apart on the engaging surface 2121. In some embodiments, the heat exchange portion is made of copper, for example. In some embodiments, the heat exchange portion is a vapor chamber, for example. In some embodiments, the outer frame portion is made of aluminum, for example.

[0050] It should be noted that the heat exchange plate 21 is not limited to be a two-piece element (i.e. the heat exchange portion 211 and the outer frame portion 212). In other embodiments, the heat exchange plate 21 can be a one-piece element, such as a monolithic vapor chamber.

[0051] The boiling assisting structure 22 is located on the heat dissipation surface 2112 of the heat exchange portion 211 of the heat exchange plate 21, and is used to contact the cooling liquid (not shown). The function of the boiling assisting structure is to increase the bubble nucleation points, to generate more boiling bubbles per unit time, and to increase the area of contact with the cooling liquid. Although Figure 2 The boiling assisting structure shown is simplified as a sheet body, but in fact the boiling assisting structure mentioned in the present application can include at least one of a mesh metal structure, a sheet fin structure, a pin fin structure, or a sintered metal structure, for example.

[0052] The fasteners 24 are, for example, screws. The fasteners 24 are arranged (e.g. pass through) the cover 23 and are locked to the lock holes 2122 of the outer frame portion 212 of the heat exchange plate 21, so that the cover 23 can be detachably joined to the joining surface 2121 of the outer frame portion 212. The cover 23 and the heat exchange plate 21 jointly form a fluid chamber (not shown in the figure), and cover the boiling assisting structure 22 on the heat exchange portion 211 of the heat exchange plate 21.

[0053] The shape of the cover can be designed according to actual needs. For example, in Figure 2 Embodiments, the cover 23 is substantially a cuboid. The cover 23 has an outer top surface 231, two long outer side surfaces 232, and two short outer side surfaces 233. The two long outer side surfaces 232 and the two short outer side surfaces 233 are located on different sides of the periphery of the outer top surface 231. The two long outer side surfaces 232 are opposite to each other, and the two short outer side surfaces 233 are opposite to each other.

[0054] The cover is connected to the liquid inlet connector and the liquid outlet connector. For example, in Figure 2 Embodiments, the liquid inlet connector 25 is connected to one of the short outer side surfaces 233 of the cover 23, and the liquid outlet connector 26 is connected to the outer top surface 231 of the cover 23.

[0055] In some embodiments, the center line of the liquid inlet connector does not pass through the center line of the liquid outlet connector. In Figure 2 Embodiments, the center line C3 of the short outer side surface 233 of the cover 23 intersects the center line C4 of the outer top surface 231, the center line C1 of the liquid inlet connector 25 is offset from the center line C3 of the short outer side surface 233 of the cover 23, and the center line C2 of the liquid outlet connector 26 overlaps the center line C4 of the outer top surface 231 of the cover 23, so that the center line C1 of the liquid inlet connector 25 does not pass through the center line C2 of the liquid outlet connector 26.

[0056] Please refer to Figure 3 , Figure 3A cross-sectional view of a motherboard module 3 according to some embodiments of the present invention is shown. Figure 3 The structural features can be applied in other embodiments of the present invention. The heat exchange plate 31 of the heat dissipation assembly 300 includes a heat exchange section 311 and an outer frame section 312, the outer frame section 312 surrounding and fixed to the heat exchange section 311. The outer frame section 312 has a mating surface 3121. The heat exchange section 311 has a heat-absorbing surface 3111 and a heat-dissipating surface 3112 opposite to the heat-absorbing surface 3111, and the heat-absorbing surface 3111 of the heat exchange section 311 is thermally coupled to the heat source H3 of the motherboard 30. The boiling aid structure 32 is located on the heat-absorbing surface 3111 and is surrounded by the mating surface 3121 of the outer frame section 312. When the cover 33 seals over the mating surface 3121, the boiling aid structure 32 is exposed to the fluid chamber C. In one embodiment, the heat dissipation assembly 300 includes a sealing ring O, and the cover 33 has a receiving groove S. The sealing ring O is disposed in the receiving groove S of the cover 33, and the sealing ring O is clamped between the cover 33 and the mating surface 3121 to achieve a sealed connection between the cover 33 and the mating surface 3121. In some embodiments, the receiving groove and the sealing ring may be disposed on the mating surface of the heat exchange plate.

[0057] The cover 33 has an outer top surface 331 and two long outer surfaces (e.g., Figure 2 The cover 33 has a long outer surface 232 and two short outer surfaces 333 facing away from the fluid chamber C. The cover 33 also includes a plurality of bubble guiding surfaces 337. These bubble guiding surfaces 337 are, for example, inclined surfaces, and are located at corners of the fluid chamber on the side away from the heat exchange plate 31. On the other hand, these bubble guiding surfaces 337 are inclined surfaces and face the centerline C2 of the outlet connector 36. In other words, these bubble guiding surfaces 337 extend toward the outlet connector 36. In some embodiments, the bubble guiding surfaces are configured to define a portion of the fluid chamber, and the highest point of the bubble guiding surface abuts the outlet connector, thereby guiding bubbles located in the fluid chamber toward the outlet connector. Figure 3 For example, the bubble guiding surface 337 gradually rises from the edge of the fluid chamber C toward the location of the liquid outlet connector 36 (e.g., the central area of ​​the cover 33).

[0058] Figure 3 The inlet connector 35 of the heat dissipation assembly 300 is connected to one of the short outer surfaces 333 of the cover 33, and the outlet connector 36 is connected to the outer top surface 331 of the cover 33, and the centerline of the inlet connector 35 (e.g.) Figure 2 The centerline C1 shown does not pass through the centerline of the outlet connector 36 (e.g.) Figure 2 Centerline C2 (as shown).

[0059] Please refer to Figure 4 , Figure 4 A bottom view of the cover of a heat dissipation assembly according to some embodiments of the present invention is shown.Figure 4 The structural features can be applied in other embodiments of the present invention. Figure 4 The cover 43 has a surrounding fluid chamber (e.g. Figure 3 The fluid chamber C) has two long inner surfaces 434, two short inner surfaces 435, and a guide surface 436. The guide surface 436 is, for example, an arc surface, and is configured to guide the coolant into the fluid chamber.

[0060] It should be noted that the guide surface 436 is a selected structure and can be omitted in other embodiments.

[0061] Figure 4 The two long inner surfaces 434 and the two short inner surfaces 435 are respectively facing away from the two long outer surfaces (e.g. Figure 2 The long outer surface 232) and the two short outer surfaces (e.g. Figure 2 The short outer surface 233), and the two long inner surfaces 434 and the two short inner surfaces 435 are connected through these guide surfaces 436.

[0062] Figure 4 The centerline C1 of the inlet connector 45 does not pass through the centerline C2 of the outlet connector 46. For example, the centerline C3 of the short outer side of the cover 43 is parallel to the outer top surface (e.g., Figure 2 The center line C4 of the outer top surface 231) intersects, for example, the center line C1 of the liquid inlet connector 45 is offset from the center line C3 of the short outer side surface of the cover 43, and the center line C2 of the liquid outlet connector 46 overlaps with the center line C4 of the outer top surface of the cover 43, so that the center line C1 of the liquid inlet connector 45 does not pass through the center line C2 of the liquid outlet connector 46.

[0063] In the aforementioned embodiments, when the inlet and outlet connectors are connected to the cover and the cover is assembled onto the heat exchange plate, the heat dissipation assembly is in a cold plate configuration. In this case, the heat dissipation assembly and the motherboard are tested, for example, in an air environment, and the inlet and outlet connectors can be connected to pipes (not shown) to allow the coolant to enter the fluid chamber from the inlet connector to absorb heat from the heat source and transfer it to the heat exchange section and boiling aid structure of the heat exchange plate.

[0064] In the above embodiments, for example Figure 2 In one embodiment, the configuration where the centerline C1 of the inlet connector 25 does not pass through the centerline C2 of the outlet connector 26 reduces secondary flow in the fluid chamber C, thus helping to lower the pressure drop. Furthermore, the coolant can form eddies in the fluid chamber C, concentrating the bubbles formed after the coolant absorbs heat towards the outlet connector 26. It should be noted that other structures within the fluid chamber can suppress the generation of secondary flow. In other embodiments, the centerline of the inlet connector may pass through the centerline of the outlet connector.

[0065] In the above embodiments, for example in Figure 3In this embodiment, the bubble guiding surfaces 337 are sloped and arranged facing the centerline C2 of the outlet connector 36, which guides the bubbles formed after the coolant absorbs heat to the outlet connector 36, thus preventing bubbles from accumulating in the fluid chamber C and affecting heat exchange efficiency. It should be noted that other structures in the fluid chamber can also prevent bubble accumulation. In other embodiments, the cover may not have bubble guiding surfaces.

[0066] Next, please refer to Figure 5 , Figure 5 This is a cross-sectional view of an embodiment of the heat dissipation component 500 of the present invention in the boiling plate mode. Figure 5 The structural features can be applied to other embodiments of the present invention.

[0067] In this embodiment, the heat dissipation assembly 500 can be switched from a cold plate mode to a boiling plate mode. For example, while the heat exchange plate 51 remains thermally coupled to the heat source H5 of the motherboard 50, the cover (e.g., Figure 3 The cover 33) is removed from the heat exchange plate 51, allowing the heat dissipation assembly 500 to be in boiling plate mode. The heat exchange plate 51 includes a heat exchange section 511 and an outer frame section 512, the outer frame section 512 surrounding and fixed to the heat exchange section 511. The outer frame section 512 has a mating surface 5121. The heat exchange section 511 has a heat absorption surface 5111 and a heat dissipation surface 5112 opposite to the heat absorption surface 5111, and the heat absorption surface 5111 of the heat exchange section 511 is thermally coupled to the heat source H5 of the motherboard 50. The boiling structure 52 is located on the heat dissipation surface 5112 of the heat exchange section 511 of the heat exchange plate 51 and is used to contact the coolant (not shown). The heat dissipation assembly 500 in boiling plate mode is used to immerse the motherboard 50 together with the motherboard 50 in the coolant in a tank (not shown) during testing or normal operation. At this time, the boiling aid structure 52 on the heat exchange plate 51 is configured to be exposed to the coolant in the tank. As can be seen from the above, during the process of switching between the two modes when testing the heat source H5, the heat exchange plate 51 does not need to be separated from the heat source H5, thus reducing the complexity of the test.

[0068] In this embodiment, the heat dissipation assembly 500 in cold plate mode is not limited to being in boiling plate mode by removing the cover 33. In other embodiments, the heat dissipation assembly in cold plate mode can be moved to boiling plate mode by removing the inlet and outlet connectors on the cover. In this case, when the heat dissipation assembly in boiling plate mode is immersed in the coolant in the tank along with the motherboard, the coolant can enter the fluid chamber through the holes in the cover for assembling the inlet and outlet connectors, thus exposing the boiling structure to the coolant.

[0069] Next, please refer to Figure 6 , Figure 6 A cross-sectional view of a motherboard module 6 according to some embodiments of the present invention is shown.Figure 6 The structural features can be applied in other embodiments of the present invention.

[0070] In this embodiment, the heat exchange plate 61 is, for example, a one-piece component, such as an integral heat exchanger. The heat-absorbing surface 6111 and the heat-dissipating surface 6112 of the heat exchange plate 61 are located on opposite sides of the heat exchange plate 61, while the mating surface 6121 of the heat exchange plate 61 surrounds the heat-dissipating surface 6112. The heat-absorbing surface 6111 of the heat exchange plate 61 is thermally coupled to the heat source H6 of the motherboard 60. The boiling aid structure 62 is located on the heat-dissipating surface 6112 of the heat exchange plate 61 and is used to contact the coolant (not shown).

[0071] The cover 63 is inseparably joined to the mating surface 6121 of the heat exchange plate 61. That is, if the cover 63 is forcibly separated from the heat exchange plate 61, the cover 63 and the heat exchange plate 61 can only be separated in a destructive manner and are unlikely to remain intact. For example, the cover 63 may be integrally formed and joined to the mating surface 6121 of the heat exchange plate 61, or the cover 63 may be joined to the mating surface 6121 of the heat exchange plate 61 by welding.

[0072] In this embodiment, the cover 63 has a plurality of connector assembly holes 638, wherein two connector assembly holes 638 are located, for example, on two opposite short outer surfaces 633 of the cover 63, and the other connector assembly holes 638 are located, for example, on the outer top surface 631 of the cover 63. Furthermore, the heat dissipation assembly 600 includes a liquid inlet connector 65 and a plurality of liquid outlet connectors 66. The liquid inlet connector 65 and the liquid outlet connectors 66 are detachably assembled with these connector assembly holes 638 of the cover 63.

[0073] In this embodiment, with the inlet connector 65 and outlet connector 66 assembled on the cover 63, the heat dissipation assembly 600 is in a cold plate configuration. At this time, the heat dissipation assembly 600 and the motherboard 60 are tested, for example, in an air environment, and the inlet connector 65 and outlet connector 66 can be connected to pipes (not shown) to allow coolant to enter the fluid chamber C from the inlet connector 65 to absorb heat from the heat source H6 and transfer it to the heat exchange plate 61.

[0074] Next, please refer to Figure 7 , Figure 7 A cross-sectional view of a heat dissipation assembly 700 in boiling plate mode according to some embodiments of the present invention is shown. Figure 7 The structural features can be applied in other embodiments of the present invention.

[0075] In this embodiment, the heat dissipation assembly 700 can be switched from a cold plate mode to a boiling plate mode. For example, while the heat exchange plate 71 remains thermally coupled to the heat source H7 of the motherboard 70, the liquid inlet connector (e.g., Figure 6 The inlet connector 65) and the outlet connector (e.g.Figure 6 The liquid outlet connector 66 is detached from the cover 73, and the heat dissipation assembly 700 is in the boiling-assisted mode. The heat absorption surface 7111 and the heat dissipation surface 7112 of the heat exchange plate 71 are located on opposite sides of the heat exchange plate 71, and the joint surface 7121 of the heat exchange plate 71 surrounds the heat dissipation surface 7112. The heat absorption surface 7111 of the heat exchange plate 71 is thermally coupled to the heat source H7 of the mainboard 70. The boiling-assisted structure 72 is located on the heat dissipation surface 7112 of the heat exchange plate 71 and is used to contact the cooling liquid (not shown). The cover 73 has a plurality of connector assembly holes 738, two of which are located on opposite short outer side surfaces 733 of the cover 73, for example, and the other connector assembly holes 738 are located on the outer top surface 731 of the cover 73. The heat dissipation assembly 700 in the boiling-assisted mode is used to be immersed in the cooling liquid in a tank (not shown) together with the mainboard 70 when the mainboard 70 is tested or normally operated, so that the cooling liquid can enter the fluid chamber C through the connector assembly holes 738 to expose the boiling-assisted structure 72 on the heat exchange plate 71 to the cooling liquid in the tank. As can be seen from the above, in the process of switching between the two modes in the test heat source H7 stage, the heat exchange plate 71 can not be separated from the heat source H7, so as to reduce the complexity of the test.

[0076] According to the heat dissipation assembly and the mainboard module disclosed in the above embodiments, the cover is engaged with the heat exchange plate and covers the boiling-assisted structure, the cover and the heat exchange plate jointly form a fluid chamber, and the liquid inlet connector and the liquid outlet connector connected to the cover or the cover can be separated from the heat exchange plate, so that the boiling-assisted structure is exposed to the cooling liquid in the tank. The arrangement can make the heat dissipation assembly have a cold plate mode and a boiling-assisted mode. In the cold plate mode, the cover is engaged with the heat exchange plate, and the liquid inlet connector and the liquid outlet connector are connected to the cover, so that the heat dissipation assembly is used as a cold plate to connect the pipeline in the air environment. In the boiling-assisted mode, the cover is separated from the heat exchange plate, or the liquid inlet connector and the liquid outlet connector connected to the cover are separated from the cover, so that the heat dissipation assembly is used as a boiling-assisted plate to be immersed in the cooling liquid in the tank. In the process of switching between the two modes in the test heat source stage, the heat exchange plate can not be separated from the heat source, and only the cover or the connector needs to be disassembled, so as to reduce the complexity of the test.

[0077] In addition, the arrangement that the center line of the liquid inlet connector does not pass through the center line of the liquid outlet connector can reduce the secondary flow in the fluid chamber, so as to help reduce the pressure drop. In addition, the fluid can form a vortex in the fluid chamber, and the bubbles formed after the cooling liquid absorbs heat are concentrated towards the liquid outlet connector.

[0078] Furthermore, the arrangement that the bubble guide surface is inclined and faces the center line of the liquid outlet connector can guide the bubbles formed after the cooling liquid absorbs heat to the liquid outlet connector, so as to avoid the bubbles accumulated in the fluid chamber affecting the heat exchange efficiency.

[0079] Accordingly, one aspect of the present disclosure provides a heat dissipation assembly for immersion in a cooling liquid in a tank and thermally coupled to a heat source, the heat dissipation assembly comprising: a heat exchange plate having a heat absorbing surface, a heat dissipating surface, and an engaging surface, the heat absorbing surface configured to be thermally coupled to the heat source, the heat dissipating surface opposite to the heat absorbing surface, the engaging surface located at a periphery of the heat dissipating surface, the engaging surface configured to engage with a cover to form a fluid chamber; and a boiling-assisted structure located at the heat dissipating surface of the heat exchange plate and configured to be exposed to the cooling liquid in the tank.

[0080] In some embodiments, the heat exchange plate comprises an outer frame portion surrounding a heat exchange portion, the heat absorbing surface and the heat dissipating surface are located at opposite sides of the heat exchange portion, and the engaging surface is located at the outer frame portion.

[0081] In some embodiments, the outer frame portion and the cover are made of aluminum, and the heat exchange portion is made of copper.

[0082] In some embodiments, the heat exchange plate is at least partially a uniform temperature plate.

[0083] In some embodiments, the heat exchange plate has a plurality of screw holes disposed at the engaging surface and separated from each other, and the screw holes are respectively configured to be locked by a plurality of screws passing through the cover.

[0084] In some embodiments, the engaging surface of the heat exchange plate is configured to be engaged by the cover in a welding manner.

[0085] One aspect of the present disclosure provides a motherboard module for immersion in a cooling liquid in a tank, the motherboard module comprising: a motherboard having a heat source; and a heat dissipation module comprising: a heat exchange plate having a heat absorbing surface, a heat dissipating surface, and an engaging surface, the heat absorbing surface thermally coupled to the heat source, the heat dissipating surface opposite to the heat absorbing surface, the engaging surface located at a periphery of the heat dissipating surface, the engaging surface configured to engage with a cover to form a fluid chamber; and a boiling-assisted structure located at the heat dissipating surface of the heat exchange plate and configured to be exposed to the cooling liquid in the tank.

[0086] In some embodiments, the heat exchange plate comprises an outer frame portion surrounding a heat exchange portion, the heat absorbing surface and the heat dissipating surface are located at opposite sides of the heat exchange portion, and the engaging surface is located at the outer frame portion.

[0087] In some embodiments, the outer frame portion and the cover are made of aluminum, and the heat exchange portion is made of copper.

[0088] In some embodiments, the heat exchange plate is at least partially a uniform temperature plate.

[0089] In some embodiments, the heat exchange plate has a plurality of screw holes disposed on the joint surface and separated from each other, and each of the screw holes is used for locking a plurality of screws passing through the cover.

[0090] In some embodiments, the joint surface of the heat exchange plate is used for the cover to be welded.

[0091] One aspect of the present application provides a heat dissipation assembly for selectively immersing in a cooling liquid in a tank and thermally coupling to a heat source, the heat dissipation assembly comprising: a heat exchange plate having a heat absorbing surface and a heat dissipating surface, the heat absorbing surface being used for thermally coupling to the heat source, and the heat dissipating surface being opposite to the heat absorbing surface; a boiling assisting structure disposed on the heat dissipating surface; a cover joined to the heat exchange plate and covering the boiling assisting structure, the cover and the heat exchange plate jointly forming a fluid chamber; a liquid inlet connector connected to the cover; and at least one liquid outlet connector connected to the cover; wherein the liquid inlet connector, the at least one liquid outlet connector or the cover is separable from the heat exchange plate, so that the boiling assisting structure is exposed to the cooling liquid in the tank.

[0092] In some embodiments, the cover is separably joined to the heat exchange plate.

[0093] In some embodiments, the cover is inseparably joined to the heat exchange plate, and the liquid inlet connector and the at least one liquid outlet connector are separably connected to the cover.

[0094] In some embodiments, the cover has an outer top surface, two long outer side surfaces and two short outer side surfaces, the two long outer side surfaces and the two short outer side surfaces are respectively located on different sides of the outer top surface, the two long outer side surfaces are opposite to each other, and the two short outer side surfaces are opposite to each other, the liquid inlet connector is connected to one of the short outer side surfaces of the cover, and the at least one liquid outlet connector is connected to the outer top surface of the cover.

[0095] In some embodiments, the center line of the liquid inlet connector does not pass through the center line of the at least one liquid outlet connector.

[0096] In some embodiments, the cover further has two long inner side surfaces, two short inner side surfaces and a plurality of flow guide surfaces, the two long inner side surfaces and the two short inner side surfaces are respectively opposite to the two long outer side surfaces and the two short outer side surfaces, and the two long inner side surfaces and the two short inner side surfaces are connected by the flow guide surfaces.

[0097] In some embodiments, the cover has a plurality of bubble guide surfaces, and the bubble guide surfaces are respectively located at the corners of the side of the fluid chamber away from the heat exchange plate.

[0098] In some embodiments, the bubble guide surfaces are inclined surfaces and face the center line of the at least one liquid outlet connector.

[0099] In some embodiments, the cover has a plurality of bubble guides configured to define a portion of the fluid chamber, the bubble guides having a highest point adjacent to the liquid outlet fitting.

Claims

1. A heat dissipation assembly for immersion in a coolant within a tank and thermally coupled to a heat source, the heat dissipation assembly comprising: A heat exchange plate has a heat-absorbing surface, a heat-dissipating surface, and a mating surface. The heat-absorbing surface is configured to be thermally coupled to the heat source. The heat-dissipating surface faces away from the heat-absorbing surface. The mating surface is located on the periphery of the heat-dissipating surface and is used to engage with a cover to form a fluid chamber. A boiling aid structure is located on the heat dissipation surface of the heat exchange plate and is configured to be exposed to the coolant in the tank.

2. The heat dissipation assembly as claimed in claim 1, wherein the heat exchange plate includes an outer frame portion and a heat exchange portion, the outer frame portion surrounds the heat exchange portion, the heat absorption surface and the heat dissipation surface are respectively located on opposite sides of the heat exchange portion, and the mating surface is located on the outer frame portion.

3. The heat dissipation assembly as claimed in claim 2, wherein the outer frame and the cover are made of aluminum, and the heat exchange part is made of copper.

4. The heat dissipation assembly of claim 1, wherein the heat exchange plate is at least partially a heat spreader.

5. The heat dissipation assembly as claimed in claim 1, wherein the heat exchange plate has a plurality of screw holes disposed on the mating surface and separated from each other, and the screw holes are respectively used for screws disposed on the cover to be locked in.

6. The heat dissipation assembly of claim 1, wherein the mating surface of the heat exchange plate is used for welding the cover.

7. A motherboard module for immersion in coolant within a tank, the motherboard module comprising: The motherboard has a heat source; and The heat dissipation module includes: A heat exchange plate has a heat-absorbing surface, a heat-dissipating surface, and a mating surface. The heat-absorbing surface is thermally coupled to the heat source, the heat-dissipating surface faces away from the heat-absorbing surface, and the mating surface is located on the periphery of the heat-dissipating surface. The mating surface is configured to engage with a cover to form a fluid chamber. A boiling aid structure is located on the heat dissipation surface of the heat exchange plate and is configured to be exposed to the coolant in the tank.

8. The motherboard module as claimed in claim 7, wherein the heat exchange plate includes an outer frame portion and a heat exchange portion, the outer frame portion surrounds the heat exchange portion, the heat absorption surface and the heat dissipation surface are respectively located on opposite sides of the heat exchange portion, and the mating surface is located on the outer frame portion.

9. The motherboard module of claim 8, wherein the outer frame and the cover are made of aluminum, and the heat exchange section is made of copper.

10. The motherboard module of claim 7, wherein the heat exchange plate is at least partially a vapor chamber.

11. The motherboard module of claim 7, wherein the heat exchange plate has a plurality of screw holes disposed on the mating surface and separated from each other, the screw holes being respectively used for screws disposed on the cover to be engaged.

12. The motherboard module of claim 7, wherein the mating surface of the heat exchange plate is used for welding the cover.

13. A heat dissipation assembly for selectively immersing in a coolant within a tank and thermally coupled to a heat source, the heat dissipation assembly comprising: A heat exchange plate has a heat-absorbing surface and a heat-dissipating surface, wherein the heat-absorbing surface is configured to be thermally coupled to the heat source, and the heat-dissipating surface faces away from the heat-absorbing surface. A boiling aid structure is provided on this heat dissipation surface; The cover is joined to the heat exchange plate and covers the boiling aid structure, and the cover and the heat exchange plate together form a fluid chamber; Liquid inlet connector, connected to the cover; and At least one liquid outlet connector is connected to the cover; in, The inlet connector, the at least one outlet connector, or the cover can be separated from the heat exchange plate, thereby exposing the boiling aid structure to the coolant in the tank.

14. The heat dissipation assembly of claim 13, wherein the cover is detachably attached to the heat exchange plate.

15. The heat dissipation assembly of claim 13, wherein the cover is inseparably joined to the heat exchange plate, and the liquid inlet and the at least one liquid outlet are detachably connected to the cover.

16. The heat dissipation assembly of claim 13, wherein the cover has an outer top surface, two long outer surfaces and two short outer surfaces, the two long outer surfaces and the two short outer surfaces are respectively located on opposite sides of the outer top surface, the two long outer surfaces are opposite to each other, the two short outer surfaces are opposite to each other, the liquid inlet connector is connected to one of the short outer surfaces of the cover, and the at least one liquid outlet connector is connected to the outer top surface of the cover.

17. The heat dissipation assembly of claim 16, wherein the centerline of the inlet connector does not pass through the centerline of the at least one outlet connector.

18. The heat dissipation assembly of claim 16, wherein the cover further has two long inner sides, two short inner sides and a plurality of flow guiding surfaces, the two long inner sides and the two short inner sides respectively facing away from the two long outer sides and the two short outer sides, and the two long inner sides and the two short inner sides are connected through the flow guiding surfaces.

19. The heat dissipation assembly of claim 13, wherein the cover has a plurality of bubble guiding surfaces, the bubble guiding surfaces being located at corners of the fluid chamber on the side away from the heat exchange plate.

20. The heat dissipation assembly of claim 19, wherein the bubble guiding surfaces are beveled and face the centerline of the at least one liquid outlet connector.

21. The heat dissipation assembly of claim 13, wherein the cover has a plurality of bubble guide surfaces configured to define a portion of the fluid chamber, the highest point of the bubble guide surfaces being adjacent to the liquid outlet connector.

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