Terminal

Abstract

The invention provides a terminal which comprises a main board and a cavity daughter board, the cavity daughter board is arranged on the main board, a heat dissipation channel is formed by a cavity of the cavity daughter board and the main board, and an inlet and an outlet which are communicated with the two ends of the heat dissipation channel respectively are formed in the main board.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a terminal. Background Technology

[0002] With the continuous development of technology, mobile phones, tablets, and other terminal devices are becoming increasingly widely used in people's daily lives and work. Furthermore, related products, especially performance-oriented categories such as gaming phones, are demanding ever-increasing battery capacity. Correspondingly, the demand for larger battery modules is also growing. However, with limitations on battery thickness and width, the need for longer battery lengths is increasing, leading to shorter motherboards and increasingly limited board space.

[0003] In existing fan cooling channel structures, a separate cooling channel structure is typically required to achieve both heat dissipation and waterproofing. This cooling channel structure necessitates an independent fan bracket, significantly increasing the required internal volume space. Furthermore, due to product thickness limitations, the motherboard airflow area cannot be expanded with additional laminates to increase the effective board area. This severely restricts the design of increasing battery length to reduce battery thickness, thus seriously hindering the achievement of product thinner and lighter designs. Summary of the Invention

[0004] This application aims to solve at least one of the technical problems existing in the prior art, and proposes a terminal that can at least solve the problems of large space occupation and limited board area of ​​independent fan brackets existing in the prior art.

[0005] To achieve the above objectives, this application provides a terminal including a motherboard and a cavity board, wherein the cavity board is disposed on the motherboard, and the cavity of the cavity board and the motherboard form a heat dissipation channel, and the motherboard is provided with an inlet and an outlet respectively communicating with the two ends of the heat dissipation channel.

[0006] Other objects and features of this application will become clear from reading the specification, claims and drawings. Attached Figure Description

[0007] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein:

[0008] Figure 1 This is an exploded view of the terminal structure provided in the embodiments of this application;

[0009] Figure 2 This is a cross-sectional view of the terminal along the thickness direction provided in the embodiment of this application;

[0010] Figure 3This is an assembly diagram of some of the motherboards and cavity boards used in the embodiments of this application;

[0011] Figure 4 This is an exploded view of some of the motherboards and cavity boards used in the embodiments of this application;

[0012] Figure 5 This is an assembly diagram of a portion of the motherboard, cavity board, first connector, second connector, and second flexible circuit board used in the embodiments of this application;

[0013] Figure 6 This is a partial assembly diagram of the terminal provided in this application embodiment at the location of the cavity plate;

[0014] Figure 7 This is an exploded view of the middle frame structure, support structure, first seal, and second seal used in the embodiments of this application;

[0015] Figure 8 This is an exploded view of the mid-frame structure, support frame, and fan module used in the embodiments of this application;

[0016] Figure 9 This is an assembly diagram of the mid-frame structure, support frame, and fan module used in the embodiments of this application. Detailed Implementation

[0017] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0018] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0019] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0020] The following disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0021] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0022] Currently, few mobile phones and tablets on the market utilize fans for active cooling. The main approaches fall into two categories: The first is a design without an independent air duct, where the fan intake is on the back and the exhaust on the side. However, this results in a small cooling area, unable to quickly dissipate heat from areas like the CPU. The second approach uses an independent cooling duct design, with the intake on one side and the exhaust on the other. A centrifugal fan is placed inside the duct support and isolated from the internal structure by waterproof foam to achieve active cooling. However, this design has a drawback: the dedicated fan cooling channel 12 occupies valuable internal structural space. The entire duct area can only be a single board, not a stacked structure, severely limiting the board area and consequently hindering battery capacity and product thinning.

[0023] Please refer to the following: Figures 1 to 3This application provides a terminal 100, such as a mobile phone or tablet. The terminal 100 includes a motherboard 1 and a cavity board 2. The cavity board 2 is a board used in the terminal to form a specific structure or space inside the terminal. The cavity board 2 has a cavity, which can be a space recessed into the cavity board 2. The motherboard 1 is the printed circuit board (PCB) of the terminal 100. Components such as the CPU, GPU, memory, and power management chip are soldered or plugged into the motherboard 1. The motherboard 1 provides mechanical fixation and electrical connection for these components.

[0024] The cavity plate 2 is mounted on the main plate 1, and the cavity of the cavity plate 2 and the main plate 1 form a heat dissipation channel 12. The main plate 1 has an inlet 11 and an outlet 13 that are respectively connected to both ends of the heat dissipation channel 12. The inlet 11 and outlet 13 on the main plate 1 are respectively connected to both ends of the heat dissipation channel 12, forming a complete airflow path, and the airflow direction is as follows: Figure 3 As indicated by the arrow in the diagram. The aforementioned heat dissipation channel 12 is formed by utilizing the unused space between the motherboard 1 and the cavity board 2. It can replace the heat dissipation channel 12 formed by the traditional independent fan heat dissipation bracket, thereby optimizing the internal space layout of the terminal, improving heat dissipation efficiency, and supporting the thin and light design of the terminal.

[0025] This embodiment utilizes a heat dissipation channel 12 formed between the cavity of the cavity board 2 and the main board 1, eliminating the need for a traditional independent fan heat sink bracket and reducing the space occupied by the heat dissipation structure within the terminal 100. This allows for a more compact internal layout of the terminal 100, providing more space for the installation of other components and the placement of the battery. The cavity of the cavity board 2 provides space for the heat dissipation channel 12, while its surface can also be used to arrange circuit components. This design increases the effective board area of ​​the main board 1, which helps to optimize circuit design, improve circuit integration and performance, and also supports the miniaturization and thinning design of the terminal 100.

[0026] In some embodiments, the main board 1 and the cavity board 2 can be structurally integrated and sealed through a precision welding process. Specifically, as shown in the figure... Figure 4 As shown, the area 14 (e.g., the area around the sidewall of the cavity plate 2 on the main board 1) can be... Figure 4 The pads are arranged in the cross-sectional area shown in the figure, and the main board 1 is soldered and fixed to the cavity board 2 using SMT (Surface Mount Technology). Simultaneously, a sealing structure (e.g., a solder layer, not shown in the figure) is used to initially seal the perimeter of the cavity board 2. To further enhance waterproof reliability, additional adhesive can be applied to the perimeter of the cavity board 2 to form a waterproof layer 24, such as... Figure 5As shown, the synergistic effect of the sealing structure and the waterproof layer 24 effectively resists moisture erosion during daily use. The composite sealing method combining SMT soldering and adhesive application achieves a balance between structural strength and waterproof reliability. Of course, in practical applications, the mainboard 1 and the cavity board 2 can also be structurally integrated and sealed using other methods.

[0027] In some embodiments, such as Figure 5 As shown, a first connector 15 is provided on the motherboard 1, and a second connector 23 is provided on the cavity board 2. The first connector 15 and the second connector 23 are electrically connected through a second flexible circuit board 25 to realize the electrical connection and signal transmission between the motherboard 1 and the cavity board 2. Figure 5 The first connector 15 and the second connector 23 shown are located between the second flexible circuit board 25 and the main board 1 and the cavity board 2, respectively.

[0028] In some embodiments, the terminal 100 further includes a fan module 4, which is disposed at the outlet 13 of the heat dissipation channel 12. The fan module 4 is an active cooling component that forces airflow, such as a centrifugal fan (turbo fan), a small axial fan, etc. The fan module 4 can push cool air into the heat dissipation channel 12 from the inlet 11, and after flowing through the heat dissipation channel 12, it is finally discharged from the outlet 13 of the heat dissipation channel 12, forming a forced convection circulation. As the cool air flows through the heat dissipation channel 12, it carries away the heat from the heat-generating components (such as the CPU and GPU) on the motherboard 1, thereby achieving a cooling effect.

[0029] Traditionally, the fan module 4 is set in a channel formed by an independent fan heat dissipation bracket. However, in this embodiment, the fan module 4 is set in a heat dissipation channel 12 formed by the idle space between the motherboard 1 and the cavity board 2. This eliminates the need for a fan heat dissipation bracket, optimizes the internal space layout of the terminal, improves heat dissipation efficiency, and supports the thin and light design of the terminal.

[0030] By placing a fan module 4 at the outlet 13 of the heat dissipation channel 12, active cooling can be achieved, enabling forced convection of air within the channel 12 to quickly dissipate heat, suitable for high-load scenarios (such as gaming and AI computing). Furthermore, placing the fan module 4 at the outlet 13 of the heat dissipation channel 12 improves cooling efficiency. Specifically, the fan module 4 at the outlet 13 can more directly expel hot air, preventing disordered airflow within the heat dissipation channel 12 and reducing heat retention, thereby enhancing airflow directionality and improving cooling efficiency. Simultaneously, the fan module 4 at the outlet 13 can create a negative pressure zone, ensuring rapid hot air expulsion while promoting the continuous intake of cool air from the inlet 11, forming a more stable airflow circulation. Of course, in practical applications, depending on specific needs, the fan module 4 can also be placed at the inlet 11 or any position within the heat dissipation vent, such as the center.

[0031] It should be noted that in practical applications, the fan module 4 can also be omitted. In this case, the heat dissipation channel 12 achieves heat dissipation in a passive way. Passive heat dissipation is achieved by natural air convection to remove the heat from the heat-generating components on the motherboard 1. It is suitable for application scenarios with low heat dissipation requirements (such as mid-to-low-end mobile phones and thin and light tablets) or those that require extreme silence.

[0032] In some embodiments, the terminal 100 further includes a mid-frame structure 3, which provides a mounting base and connection for components such as the motherboard 1, the front screen module, and the rear cover. The mid-frame structure 3 includes, for example, a bottom wall 32 and a frame 31 surrounding the edge of the bottom wall 32. The bottom wall 32 and the frame 31 form an inner space 33 inside the frame 31. The motherboard 1 and the cavity plate 2 are disposed within the inner space 33 enclosed by the mid-frame structure 3 (i.e., the frame 31), and the motherboard 1 is supported by the bottom wall 32. Figure 6 As shown, the main board 1, cavity plate 2, and bottom wall 32 can be fixedly connected by fasteners 82 such as screws. Figure 1 and Figure 2 As shown, the cavity plate 2 is located on the side of the main board 1 away from the bottom wall 32. The middle frame structure 3 is provided with an air inlet channel 34 and an air outlet channel 35. One end of the air inlet channel 34 is connected to the inlet 11 of the heat dissipation channel 12, and the other end is located on the outer surface of the middle frame structure 3 away from the inner space 33, such as the outer side of the frame 31. One end of the air outlet channel 35 is connected to the outlet 13 of the heat dissipation channel 12, and the other end is located on the outer surface of the middle frame structure 3 away from the inner space 33, such as the outer side of the frame 31. In this way, cold air from the outside can smoothly enter the heat dissipation channel 12 through the air inlet channel 34, while hot air in the heat dissipation channel 12 can be quickly discharged to the outside through the air outlet channel 35, forming an efficient air circulation path and significantly improving heat dissipation efficiency.

[0033] In some embodiments, such as Figure 1 and Figure 2 As shown, the bottom wall 32 of the inner space 33 formed by the middle frame structure 3 is provided with a support structure 6. The support structure 6 is used to support the motherboard 1, and the surface of the motherboard 1 facing away from the cavity board 2 is spaced apart from the bottom wall 32. In this way, a space 63 can be formed between the motherboard 1 and the bottom wall 32 to facilitate the installation and wiring of components such as the fan module 4 and wiring, and can also be used to accommodate the motherboard protective cover 5 (described in detail later). At the same time, a part of the space 63 can also serve as part of the air intake channel 34 and the air exhaust channel 35. In addition, the space 63 also helps to dissipate heat from the motherboard 1.

[0034] In embodiments where terminal 100 includes fan module 4, such as Figures 7 to 9 As shown, the support structure 6 that achieves the above functions includes, for example, a support frame 61 disposed on the bottom wall 32, a portion of the air outlet channel 35 passing through the support frame 61, and another portion passing through the frame 31 of the middle frame structure 3 forming the inner space 33; the motherboard 1 has a through hole at the position corresponding to the support frame 61, which serves as the outlet 13; the fan module 4 is disposed in the space 611 enclosed by the support frame 61, and the air inlet of the fan module 4 is connected to the heat dissipation channel 12 through the outlet 13, and the air outlet of the fan module 4 is connected to the air outlet channel 35. Specifically, by disposing of the outlet 13 at the position of the motherboard 1 corresponding to the support frame 61, the heat dissipation channel 12 and the space 611 enclosed by the support frame 61 can be connected at the outlet 13. The space 611 enclosed by the support frame 61 is used to accommodate at least a portion of the fan module 4. That is, the fan module 4 can be completely located within the space 611 enclosed by the support frame 61, or it can be partially located within the space 611 enclosed by the support frame 61, while another part is located outside the space 611 enclosed by the support frame 61, extending through the aforementioned outlet 13 into the heat dissipation channel 12. The fan module 4 is supported by the bottom wall 32, and the fan module 4 can be fixed to the bottom wall 32 by a cushioning adhesive 81 such as foam double-sided tape, ensuring that the fan module 4 does not shift under mechanical impacts such as vibration and drops. By placing the fan module 4 within the space 611 enclosed by the support frame 61, the heat dissipation structure is made compact. At the same time, the support frame 61 provides a stable mounting base for the fan module 4 and also serves as a component of the channel, achieving multiple uses with one component.

[0035] like Figure 8 As shown, one end of the air outlet duct 35 is located on the inner surface of the support frame 61, facing the air outlet end of the fan module 4. The other end of the air outlet duct 35 is located on the outer surface of the middle frame structure 3 away from the inner space 33, that is, the outer side of the frame 31, so that the air outlet duct 35 can communicate with the outside. The air flowing out from the outlet 13 of the heat dissipation channel 12 can enter the air outlet duct 35 through the fan module 4, and then flow out to the outside from the air outlet duct 35.

[0036] Furthermore, in some embodiments, such as Figure 8 and Figure 9 As shown, an opening 612 is provided through the support frame 61, through which the first flexible circuit board 42 of the fan module 4 extends and is electrically connected to the motherboard 1. This shortens the connection distance between the fan module 4 and the motherboard 1, avoids complex wiring designs, and reduces signal transmission loss. Furthermore, by having the first flexible circuit board 42 extend from the opening 612, the stacking height within a limited thickness is reduced. Additionally, the portion of the first flexible circuit board 42 extending from the opening 612 can be fixed to the bottom wall 32 with double-sided adhesive tape, effectively preventing displacement of the flexible circuit board during equipment vibration or drops, avoiding poor contact or signal interference problems, and reducing frictional losses with surrounding components. Of course, in practical applications, the first flexible circuit board 42 can also be fixed to the bottom wall 32 in other ways.

[0037] In some embodiments, the first flexible circuit board 42 may be electrically connected to the pads or contacts of the motherboard 1 via an elastic contact structure (e.g., a spring) on ​​the motherboard 1.

[0038] In some embodiments, the opening 612 in the support frame 61 can be sealed with adhesive to seal the opening 612 and achieve a waterproof effect.

[0039] In some embodiments, a first sealing element 71 is provided between the support surface of the support frame 61 and the surface of the back-facing cavity plate 2 of the main board 1. The first sealing element 71 surrounds the space 611 enclosed by the support frame 61 and the outlet 13 to seal both, thereby ensuring the airtightness and waterproofness of the heat dissipation channel 12. The first sealing element 71 is, for example, a waterproof sealing foam, which can be fixed to the support surface of the support frame 61 by double-sided adhesive.

[0040] In some embodiments, such as Figure 7 As shown, the support structure 6 also includes a support boss 62 disposed on the bottom wall 32. A portion of the air intake channel 34 passes through the support boss 62, and the outlet end 621 of the air intake channel 34 is located on the support surface of the support boss 62. The other portion of the air intake channel 34 passes through the frame 31 of the middle frame structure 3 forming the inner space 33. The motherboard 1 has a through hole at the position corresponding to the support boss 62, which serves as the inlet 11 for the heat dissipation channel 12. Specifically, by setting the inlet 11 at the position corresponding to the support boss 62 on the motherboard 1, the inlet 11 of the heat dissipation channel 12 can be connected to the outlet end 621 of the air intake channel 34 on the support surface of the support boss 62. The other end of the air intake channel 34 is located on the outer surface of the middle frame structure 3 away from the inner space 33, so that the air intake channel 34 is connected to the outside, thereby allowing outside air to enter the heat dissipation channel 12 through the air intake channel 34.

[0041] Furthermore, in some embodiments, a second seal 72 is provided between the support surface of the support boss 62 and the surface of the back-facing cavity plate 2 of the motherboard 1. The second seal 72 surrounds the outlet end 621 and inlet 11 of the air inlet channel 34 to seal them, thereby ensuring the airtightness and waterproofness of the heat dissipation channel 12. The second seal 72 is, for example, a waterproof sealing foam, which can be fixed to the support surface of the support boss 62 with double-sided adhesive.

[0042] In some embodiments, such as Figure 2 As shown, at least one of the surfaces of the motherboard 1 near the cavity board 2 and away from the cavity board 2 is provided with a motherboard protective cover 5 for protecting the components of the motherboard 1. It is readily understood that the motherboard protective cover 5 located on the surface of the motherboard 1 near the cavity board 2 is situated within the heat dissipation channel 12. The motherboard protective cover 5 located on the surface of the motherboard 1 away from the cavity board 2 is situated within the space 63 between the motherboard 1 and the bottom wall 32. The motherboard protective cover 5 provides mechanical protection, pressure resistance, dust and short-circuit protection, and waterproofing. In addition, the aforementioned protective cover can also provide electromagnetic shielding. Furthermore, a sub-board protective cover 21 can also be provided on the surface of the cavity board 2 away from the motherboard 1.

[0043] Specifically, the motherboard protective cover 5 is attached to the surface of the motherboard 1 near or away from the cavity board 2, and its structure is integrated and sealed with the motherboard 1 through a precision welding process. Pads are arranged on the sidewalls around the protective cover, and the motherboard 1 is welded to the protective cover using SMT (Surface Mount Technology). Simultaneously, a sealing structure (such as a solder layer) is used to initially seal the perimeter of the protective cover. Furthermore, to enhance waterproof reliability, additional adhesive can be applied to the perimeter of the protective cover to form a waterproof layer. The synergistic effect of the sealing structure and the waterproof layer effectively resists moisture erosion during daily use. This composite sealing method combining SMT welding and adhesive application balances structural strength and waterproof reliability.

[0044] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this application, and this application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this application, and these modifications and improvements are also considered to be within the scope of protection of this application.

Claims

1. A terminal, characterized in that, The system includes a main board and a cavity board, wherein the cavity board is disposed on the main board, and the cavity of the cavity board and the main board form a heat dissipation channel. The main board is provided with an inlet and an outlet respectively connected to the two ends of the heat dissipation channel.

2. The terminal according to claim 1, characterized in that, It also includes a mid-frame structure, wherein the main board and the cavity sub-board are disposed in the inner space enclosed by the mid-frame structure; The middle frame structure is provided with an air inlet channel and an air outlet channel. One end of the air inlet channel is connected to the inlet, and the other end is located on the outer surface of the middle frame structure away from the inner space. One end of the air outlet channel is connected to the outlet, and the other end is located on the outer surface of the middle frame structure away from the inner space.

3. The terminal according to claim 2, characterized in that, The bottom wall of the inner space formed by the middle frame structure is provided with a support structure, which is used to support the motherboard and the surface of the motherboard facing away from the cavity plate is spaced apart from the bottom wall.

4. The terminal according to claim 3, characterized in that, The support structure includes a support frame disposed on the bottom wall, a portion of the air outlet channel is disposed through the support frame, and another portion is disposed through the middle frame structure forming the border of the inner space. The motherboard has an outlet at the position corresponding to the support frame. The terminal also includes a fan module, which is disposed in the space enclosed by the support frame. The air inlet of the fan module is connected to the heat dissipation channel through the outlet, and the air outlet of the fan module is connected to the air outlet channel.

5. The terminal according to claim 4, characterized in that, An opening is provided through the support frame, and the first flexible circuit board of the fan module extends out from the opening and is electrically connected to the motherboard.

6. The terminal according to claim 4, characterized in that, A first sealing element is provided between the support surface of the support frame and the surface of the main board that is away from the cavity plate. The first sealing element surrounds the space enclosed by the support frame and the outlet to seal both.

7. The terminal according to claim 3, characterized in that, The support structure also includes a support boss disposed on the bottom wall, a portion of the air inlet channel passes through the support boss, and the outlet end of the air inlet channel is located on the support surface of the support boss, and another portion of the air inlet channel passes through the middle frame structure to form the border of the inner space. The motherboard has the entrance located at the position corresponding to the support boss.

8. The terminal according to claim 7, characterized in that, A second sealing element is provided between the supporting surface of the supporting boss and the surface of the main board that is away from the cavity plate. The second sealing element surrounds the outlet end of the air inlet channel and the inlet to seal both.

9. The terminal according to claim 2 or 3, characterized in that, It also includes a fan module, which is located at the connection between the outlet of the heat dissipation channel and the air outlet channel.

10. The terminal according to any one of claims 1-8, characterized in that, At least one of the surfaces of the motherboard near the cavity plate and away from the cavity plate is provided with a motherboard protective cover for protecting the devices of the motherboard.

11. The terminal according to any one of claims 1-8, characterized in that, The motherboard is provided with a first connector, and the cavity board is provided with a second connector. The first connector and the second connector are electrically connected through a second flexible circuit board to realize the electrical connection and signal transmission between the motherboard and the cavity board.

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