Circuit board structure with inner-layer golden fingers

Abstract

The utility model provides a circuit board structure with an inner golden finger, the circuit board comprises a first daughter board and a second daughter board which are laminated through an insulating medium layer, the insulating medium layer simultaneously exposes the edge of at least one side of the first daughter board and the second daughter board, and the insulating medium layer and the edge form a groove structure. Internal golden fingers are oppositely arranged on the inner surface of the groove structure; the pluggable golden fingers are designed in the circuit board to replace a connector mounted on the surface of the circuit board, so that the mounting space is effectively saved, the design difficulty is reduced, the design flexibility is improved, the plugging and welding processes of the connector do not need to be replaced, the processing cost is reduced, the processing time is shortened, and the requirements of mounting an electronic module and connecting a circuit in a small space are met; the problems that in the prior art, a connector is installed on the surface of a circuit board, too large installation space is occupied, and the design difficulty is large are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the gold finger processing field of circuit board especially relates to a circuit board structure with inner layer gold finger. BACKGROUND

[0002] Some electronic modules with connector or plug-in device are usually designed to be independently arranged on the circuit board and connected with other plug-in circuits.

[0003] However, the above-mentioned independent installation of the connector or plug-in device on the circuit board occupies more mounting space of the circuit board, and for some electronic modules that need to be installed in a smaller space, it is difficult to meet the installation requirements, and the design and installation of the circuit board are increased in difficulty, and the connector and other devices need to be installed on the surface of the circuit board by plug-in, welding and other methods, which leads to complex process, increases the processing cost and processing time.

[0004] Therefore, in view of the above background and problems, a novel circuit board structure with inner layer gold finger is needed. UTILITY MODEL CONTENTS

[0005] The utility model aims at solving the problem that the connector or plug-in device is independently arranged on the circuit board at present, which leads to large space occupation and increases the installation design difficulty of the circuit board, and provides a circuit board structure with inner layer gold finger, the circuit board includes first sub-board and second sub-board which are laminated by insulating medium, the insulating medium layer exposes the edge of at least one side of the first sub-board and the second sub-board, the insulating medium layer and the edge form a groove structure, and the inner surface of the groove structure is provided with an internal gold finger.

[0006] Further, the outer surface of the first sub-board and the outer surface of the second sub-board are provided with surface gold fingers, and the surface gold fingers and the internal gold finger are distributed on different surfaces and different ends.

[0007] Further, the first sub-board and the second sub-board are provided with blind holes and conductive circuits, and the surface gold fingers and the internal gold finger are connected through the blind holes and the conductive circuits.

[0008] Further, the diameter of the blind hole is greater than or equal to the width of the conductive circuit on a single side.

[0009] Further, the depth of the groove structure is greater than the length of the internal gold finger.

[0010] Further, the material of the insulating medium layer is epoxy resin composite glass fiber or epoxy resin composite ceramic powder.

[0011] Further, the circuit board is a flexible circuit board.

[0012] Further, the material of the insulating medium layer of the flexible circuit board is polyimide.

[0013] Further, the groove structure of the flexible circuit board is attached with a reinforcing sheet on the corresponding outer surface.

[0014] Further, the size of the reinforcing sheet is greater than the groove structure.

[0015] The circuit board structure with inner layer gold finger provided by the utility model, through designing the gold finger which can be plugged in the circuit board, replaces the connector installed on the surface of the circuit board, saves the installation space, reduces the design difficulty, improves the design flexibility, and does not need the plugging and welding process of the replaced connector, reduces the processing cost, shortens the processing time, meets the effect of installing the electronic module and connecting the circuit in small space, solves the problem that the prior art installs the connector on the surface of the circuit board, and causes large installation space and high design difficulty. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the structure shown in the drawings without creative labor.

[0017] Figure 1 It is a cross-sectional schematic view of the circuit board structure with inner layer gold finger of the utility model;

[0018] Figure 2 It is a plane schematic view of the circuit board structure with inner layer gold finger of the utility model.

[0019] Explanation of reference numerals:

[0020]

[0021] The realization, functional characteristics and advantages of the utility model will be further described with reference to the drawings combined with the embodiments. DETAILED DESCRIPTION

[0022] The technical scheme in the embodiments of the utility model will be clearly and completely described below combined with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only some embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0023] It should be noted that if the embodiment of the utility model has directionality indication (such as up, down, left, right, front, back, etc.), the directionality indication is only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture, if the specific posture changes, the directionality indication also changes accordingly.

[0024] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings.

[0025] Please refer to Figure 1 and Figure 2 , Figure 1 is a cross-sectional view of the circuit board structure with inner layer gold fingers of the utility model, Figure 2 is a plan view of the circuit board structure with inner layer gold fingers of the utility model.

[0026] Figure 1 The technical features of the embodiment of the utility model can be more intuitively represented, and Figure 1 is Figure 2 A-A cross-sectional structure view, which can further explain and describe the technical features of the embodiment of the utility model.

[0027] The circuit board structure 10 with inner layer gold fingers of the embodiment includes a first sub-board 120 and a second sub-board 130 stacked with each other through an insulating medium layer 110, that is, the two sub-boards are formed into a circuit board by setting the insulating medium layer 110 and then pressing. The insulating medium layer 110 of the embodiment has a certain thickness, so that even after pressing, a certain distance between the first sub-board 120 and the second sub-board 130 can be ensured, and further space for the groove structure is provided.

[0028] The key of the utility model lies in that the insulating medium layer 110 exposes the edges of at least one side of the first sub-board 120 and the second sub-board 130, the insulating medium layer 110 and the edges form a groove structure, and the inner surface of the groove structure is oppositely provided with an internal gold finger 140, that is, the gold finger is first made on the first sub-board 120 and the second sub-board 130 (i.e. the internal gold finger 140 formed in subsequent processing), and then the first sub-board 120 and the second sub-board 130 are pressed, the insulating medium layer 110 in the middle is provided with a release layer (such as a PTFE film) at a corresponding edge area of the two sub-boards, and after pressing, a forming process is performed, the invalid plate edge is milled off through deep milling from the two surfaces, the release layer is exposed, the release layer is taken out, the edge of the circuit board forms a groove structure, and the two side edges of the groove structure correspondingly form the internal gold finger 140, thereby forming a pluggable gold finger.

[0029] In particular, the insulating medium layer 110 is made of epoxy resin composite glass fiber or epoxy resin composite ceramic powder, both of which have good heat conduction performance and high insulation strength, and can provide good adhesion effect for the pressing between the first sub-plate 120 and the second sub-plate 130.

[0030] In the embodiment, the outer surface of the first sub-plate 120 and the outer surface of the second sub-plate 130 are provided with surface gold fingers 150, which are distributed with the internal gold fingers 140 in different planes and different ends. The gold fingers arranged in different planes and different ends can form a connection mode in which one end is in the form of the internal gold fingers 140 in the groove and the other end is in the form of the surface gold fingers in the form of plugging, so that the two ends of the gold fingers are in conduction, and the circuit board itself forms a circuit conversion function. The arrangement of the two gold fingers in different planes and different ends can better distribute and transmit current, reduce faults caused by poor contact or unstable current, and thus improve the overall performance and reliability of the circuit board.

[0031] Since the internal gold fingers 140 and the surface gold fingers 150 need to form conduction to transmit signals, in the embodiment, the first sub-plate 140 and the second sub-plate 150 are provided with blind holes 160 and conduction lines 170, and the surface gold fingers 150 and the internal gold fingers 140 are connected through the blind holes 160 and the conduction lines 170.

[0032] The two blind holes 160 of the embodiment are respectively located between the surface layer of the two sub-plates and the layer where the internal gold fingers 140 are located, and are used for the connection of the surface gold fingers 150, the conduction lines 170 and the internal gold fingers 140. In particular, the diameter of the blind hole 160 is greater than or equal to the width of the conduction line 170 on one side, so as to ensure the reliability and stability of the line connection, and also help to improve the mechanical strength and durability of the circuit board, thereby enhancing the reliability and safety of the entire circuit board.

[0033] It is worth noting that the depth of the groove structure is greater than the length of the internal gold fingers 140, thereby increasing the contact area between the internal gold fingers 140 and the groove, which helps to improve the stability of the internal gold fingers 140 in plugging, and the increased contact area can better distribute the pressure and reduce the damage to the circuit board structure 10 caused by stress concentration during the plugging process.

[0034] In the embodiment, the circuit board is a flexible circuit board, which has flexible conversion ability and installation function of plugging and being plugged. The material of the insulating medium layer of the flexible circuit board is polyimide, which has high tear strength and can withstand the temperature during pressing. Therefore, the flexible circuit board can provide mechanical protection and good insulation performance.

[0035] It is worth mentioning that, due to the large softness of the flexible circuit board, the strength of the insertion position of the internal gold finger 140 is low, and when the internal gold finger 140 is inserted, the circuit board structure 10 is more likely to be damaged due to excessive stress of the insertion, therefore, in the embodiment, the reinforcing sheet is attached to the outer surface corresponding to the groove structure of the flexible circuit board, mechanical support is provided for the insertion area of the internal gold finger 140, and the stability and reliability of the connection are ensured.

[0036] In particular, the size of the reinforcing sheet is larger than the groove structure, so that the reinforcing sheet can cover the area of the circuit board surface corresponding to the internal gold finger 140, thereby significantly improving the strength of the insertion part of the internal gold finger 140 and enhancing the firmness of the connection.

[0037] The above is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model embodiment, and any equivalent structural transformation, direct / indirect application in other related technical fields under the utility model concept of the utility model embodiment, or the content of the utility model embodiment specification and the drawings are included in the patent protection range of the utility model embodiment.

Claims

1. A circuit board structure having inner layer gold fingers, said circuit board comprising a first sub-board and a second sub-board laminated to each other through an insulating medium, characterized in that, The insulating medium layer exposes edges of at least one side of the first sub-board and the second sub-board, and forms a groove structure with the edges, and the inner surface of the groove structure is oppositely provided with an internal gold finger.

2. The circuit board structure having inner layer gold fingers as recited in claim 1, wherein, The outer surface of the first sub-board and the outer surface of the second sub-board are both provided with a surface gold finger, and the surface gold finger and the internal gold finger are distributed on different surfaces and different ends.

3. The circuit board structure having inner layer gold fingers of claim 2, wherein, The first sub-board and the second sub-board are both provided with a blind hole and a conductive circuit, and the surface gold finger and the internal gold finger are connected through the blind hole and the conductive circuit.

4. The circuit board structure having inner layer gold fingers of claim 3, wherein, The diameter of the blind hole is greater than or equal to the width of the conductive circuit on a single side.

5. The circuit board structure having inner layer gold fingers of claim 1, wherein, The depth of the groove structure is greater than the length of the internal gold finger.

6. The circuit board structure having inner layer gold fingers of claim 1, wherein, The material of the insulating medium layer is epoxy resin composite glass fiber or epoxy resin composite ceramic powder.

7. The circuit board structure having inner layer gold fingers of claim 1, wherein, The circuit board is a flexible circuit board.

8. The circuit board structure having inner layer gold fingers of claim 7, wherein, The material of the insulating medium layer of the flexible circuit board is polyimide.

9. A circuit board structure having inner layer gold fingers as claimed in claim 7 or 8, characterized in that, The corresponding outer surface of the groove structure of the flexible circuit board is attached with a reinforcing sheet.

10. The circuit board structure having inner layer gold fingers of claim 9, wherein, The size of the reinforcing sheet is greater than that of the groove structure.

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