Multifunctional integrated semiconductor sintering and testing integrated equipment

Abstract

The invention relates to the technical field of semiconductor sintering and testing, and discloses multifunctional semiconductor sintering and testing integrated equipment which comprises a sintering assembly, the sintering assembly comprises a vacuum box, the outer wall of one side of the vacuum box is connected with a cooling box through bolts, and the outer walls of the two sides of the cooling box are provided with ventilation openings correspondingly; the cooling box is communicated with the vacuum box, a supporting frame is fixedly connected to the bottom of the inner wall of the vacuum box, a bearing assembly is arranged at the bottom of the inner wall of the supporting frame, a sample table is placed above the bearing assembly, and handles are fixedly connected to the two sides of the sample table respectively. Through the design that the pressure sensor is arranged in the bearing assembly, the test pressure during sintering and mechanical pressure testing of the semiconductor device can be sensed, in this way, the semiconductor device can complete respective operation and integrated design of sintering and testing in the equipment, and the production and processing efficiency of the semiconductor device is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor sintering and testing, in particular to a multifunctional integrated semiconductor sintering and testing integrated equipment. BACKGROUND

[0002] At present, when a semiconductor with nano-silver paste is produced and processed, the semiconductor device is first packaged and welded, and then the semiconductor device is detected by a testing equipment to ensure the quality of the semiconductor device output.

[0003] The existing semiconductor device sintering and testing are two processes, which are carried out in two devices respectively, resulting in the reduction of the production and processing efficiency of the semiconductor device. Therefore, in order to promote the industry technology and better realize the semiconductor sintering and testing function and improve the core technology competitiveness, the present application provides a new implementation scheme different from the existing semiconductor sintering and testing equipment. SUMMARY

[0004] (I) Technical problems to be solved

[0005] In view of the deficiencies of the prior art, the present application provides a multifunctional integrated semiconductor sintering and testing integrated equipment, which mainly solves the problem that the semiconductor device sintering and testing are two processes, which are carried out in two devices respectively, resulting in the reduction of the production and processing efficiency of the semiconductor device.

[0006] (II) Technical scheme

[0007] In order to achieve the above-mentioned purpose, the present application provides the following technical scheme:

[0008] A multifunctional integrated semiconductor sintering and testing integrated equipment, comprising a sintering assembly, the sintering assembly comprises a vacuum box, a cooling box is connected to one side outer wall of the vacuum box through bolts, ventilation openings are formed in the outer walls of the two sides of the cooling box, and the cooling box is in communication with the vacuum box, a support frame is fixedly connected to the inner wall bottom of the vacuum box, a bearing assembly is arranged on the inner wall bottom of the support frame, a sample table is placed above the bearing assembly, and handles are fixedly connected to the two sides of the sample table, two threaded rods are rotatably connected between the inner wall top and the inner wall bottom of the support frame, the same sliding plate is threadedly connected between the two threaded rods, a plurality of pressing heads are clamped to the bottom of the sliding plate, a plurality of guide rods are inserted between the inner wall top and the inner wall bottom of the support frame, and the sliding plate is slidably connected with the guide rods, a first electric push rod is fixedly connected to one side outer wall of the cooling box, a lifting assembly is arranged in the cooling box, a sealing plate is slidably connected to the top of the cooling box, a top plate is fixedly connected to the top of the sealing plate, a sealing sleeve is arranged on the outer surface of the sealing plate, guide rails are fixedly connected to the inner walls of the two sides of the cooling box, the sealing plate is slidably connected between the two guide rails, and the two sides of the outer surface of the sealing sleeve are in contact with the guide rails and the bottom inner wall of the cooling box.

[0009] Further, the sintering assembly further comprises a vacuum interface, a high-purity nitrogen gas interface, a formic acid interface and a waste gas interface, the vacuum interface, the high-purity nitrogen gas interface and the formic acid interface are located on one side of the outer wall of the vacuum box, the waste gas interface is located on the other side of the outer wall of the vacuum box, one end of the waste gas interface is flange-connected with a control valve, and one side of the outer wall of the vacuum box is rotationally connected with a glass door.

[0010] Further, the bearing assembly comprises a base fixedly connected to the inner wall bottom of the support frame, a pressure sensor fixedly connected above the base, a connecting block fixedly connected above the pressure sensor, an installation opening formed in the upper side of the connecting block, and a heating plate fixedly connected in the installation opening, and the bottom of the sample table is in contact with the upper surfaces of the connecting block and the heating plate.

[0011] Further, the lifting assembly comprises a main plate fixedly connected to the output end of the first electric push rod, two fixed plates fixedly connected to one side of the main plate, ground wheels fixedly connected to one side of the main plate and one end of the two fixed plates, respectively, the ground wheels roll on the inner wall bottom of the cooling box, a second electric push rod fixedly connected to the upper surface of the fixed plate, and a support seat fixedly connected to the top end of the second electric push rod.

[0012] Further, the two side outer walls of the cooling box are fixedly connected with third electric push rods, respectively, and the output ends of the two third electric push rods are fixedly connected with the top plate.

[0013] On the basis of the foregoing scheme, the top of the support frame is fixedly connected with a connecting cylinder, the top ends of the two threaded rods are fixedly connected with sprockets, the same chain is arranged between the two sprockets, the sprockets and the chain are located in the connecting cylinder, the top of the inner surface of the connecting cylinder is fixedly connected with a connecting plate, the top of the connecting plate is fixedly connected with a drive motor, and the output end of the drive motor is connected with the top of one of the threaded rods.

[0014] As a further scheme of the present application, the multiple side outer walls of the connecting block are fixedly connected with limiting plates, respectively, the sample table is slidingly connected between the multiple limiting plates, and one side of two of the limiting plates is fixedly connected with a temperature sensor.

[0015] Further, the side outer wall of the vacuum box is fixedly connected with a control host and a display screen, and the temperature sensor, the drive motor, the display screen, the third electric push rod, the second electric push rod, the first electric push rod, the heating plate and the pressure sensor are electrically connected with the control host.

[0016] On the basis of the foregoing scheme, a dustproof net is clamped on one side of each of the two ventilation openings, a fixed cylinder is fixedly connected to the side inner wall of the cooling box, a connecting frame is fixedly connected to one side of the inner surface of the fixed cylinder, and a cooling fan is fixedly connected to one side of the connecting frame.

[0017] (III) Beneficial Effects

[0018] Compared with the prior art, the present application provides a multifunctional integrated semiconductor sintering and testing integrated device, which has the following beneficial effects:

[0019] 1. By designing a pressure sensor in the bearing assembly, the test pressure during semiconductor device sintering and mechanical pressure testing can be sensed. In this way, the semiconductor device can complete separate sintering and testing operations in the device, and the integrated design improves the efficiency of semiconductor device production and processing.

[0020] 2. By combining the cooling box, the first electric push rod and the lifting assembly, the operator can move the sintered semiconductor device into the cooling box for cooling, which speeds up the cooling speed of the semiconductor device and facilitates the testing use of the sintered semiconductor device.

[0021] 3. By combining the two chain wheels and the chain, the two threaded rods can be rotated synchronously, and the two rotating threaded rods can drive the sliding plate to slide up and down, ensuring the stability of the sliding plate and the uniformity of the pressing force of the pressing head on the semiconductor device.

[0022] 4. By designing the limiting plate on the connecting block, the sample stage can be guided when placed on the bearing assembly, ensuring that the sample stage is aligned with the connecting block and the heating plate when placed on the bearing assembly. At the same time, it is also convenient for the lifting assembly to align with the handle on the sample stage, facilitating the accurate placement of the sample stage during sintering and testing of the semiconductor device.

[0023] 5. By designing the dustproof net, the ventilation opening on the cooling box can be dustproofed, ensuring the cleanliness of the inside of the cooling box. By designing the cooling fan, the gas flow in the cooling box can be accelerated when cooling the semiconductor device in the cooling box, improving the cooling speed of the semiconductor device in the cooling box and facilitating the cooling use of the sintered semiconductor. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 FIG. 1 is a right side perspective structure schematic diagram of a multifunctional integrated semiconductor sintering and testing integrated device embodiment 1 according to the present application;

[0025] Figure 2 FIG. 2 is a left side perspective structure schematic diagram of a multifunctional integrated semiconductor sintering and testing integrated device embodiment 1 according to the present application;

[0026] Figure 3 FIG. 3 is a sintering box internal section structure schematic diagram of a multifunctional integrated semiconductor sintering and testing integrated device embodiment 1 according to the present application;

[0027] Figure 4 A three-dimensional structure schematic diagram of a bearing assembly of a multifunctional integrated semiconductor sintering and testing integrated equipment embodiment 1 according to the present application is provided;

[0028] Figure 5 A sectional structure schematic diagram of a bearing assembly of a multifunctional integrated semiconductor sintering and testing integrated equipment embodiment 1 according to the present application is provided;

[0029] Figure 6 A partial sectional structure schematic diagram of a multifunctional integrated semiconductor sintering and testing integrated equipment embodiment 1 according to the present application is provided;

[0030] Figure 7 A side structure schematic diagram of a multifunctional integrated semiconductor sintering and testing integrated equipment embodiment 1 according to the present application is provided;

[0031] Figure 8 A three-dimensional structure schematic diagram of a lifting assembly of a multifunctional integrated semiconductor sintering and testing integrated equipment embodiment 1 according to the present application is provided;

[0032] Figure 9 A sample table lifting state sectional structure schematic diagram of a multifunctional integrated semiconductor sintering and testing integrated equipment embodiment 1 according to the present application is provided;

[0033] Figure 10 A cooling box sectional structure schematic diagram of a multifunctional integrated semiconductor sintering and testing integrated equipment embodiment 2 according to the present application is provided.

[0034] In the figure: 1, sintering assembly; 101, vacuum box; 102, vacuum interface; 103, high-purity nitrogen gas interface; 104, formic acid interface; 105, waste gas interface; 2, cooling box; 3, support frame; 301, threaded rod; 4, bearing assembly; 401, base; 402, pressure sensor; 403, connecting block; 404, heating plate; 5, sample table; 6, handle; 7, sliding plate; 8, pressure head; 9, first electric push rod; 10, lifting assembly; 1001, main plate; 1002, fixed plate; 1003, second electric push rod; 1004, support seat; 11, sealing plate; 12, sealing sleeve; 13, top plate; 14, third electric push rod; 15, ventilation opening; 16, glass door; 17, control host; 18, display screen; 19, connecting cylinder; 20, chain wheel; 21, chain; 22, connecting plate; 23, drive motor; 24, guide rod; 25, limiting plate; 26, temperature sensor; 27, ground wheel; 28, dustproof net; 29, fixed cylinder; 30, connecting frame; 31, cooling fan. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the protection scope of the present application.

[0036] Embodiment 1

[0037] With reference to Figures 1-9 A multifunctional integrated semiconductor sintering and testing integrated equipment, comprising a sintering assembly 1, the sintering assembly 1 comprises a vacuum box 101, one side outer wall of the vacuum box 101 is connected with a cooling box 2 through bolts, both sides of the outer wall of the cooling box 2 are provided with ventilation openings 15, and the cooling box 2 is in communication with the vacuum box 101, the inner wall bottom of the vacuum box 101 is fixed with a support frame 3 through bolts, the inner wall bottom of the support frame 3 is provided with a bearing assembly 4, the upper of the bearing assembly 4 is placed with a sample table 5, and both sides of the sample table 5 are respectively welded with handles 6, the inner wall top and bottom of the support frame 3 are rotatably connected with two threaded rods 301, the same sliding plate 7 is threadedly connected between the two threaded rods 301, and the bottom of the sliding plate 7 is clamped with a plurality of pressure heads 8, a plurality of guide rods 24 are inserted between the inner wall top and bottom of the support frame 3, and the sliding plate 7 is slidably connected with the guide rods 24, one side outer wall of the cooling box 2 is fixed with a first electric push rod 9 through bolts, and the cooling box 2 is provided with a lifting assembly 10, the top of the cooling box 2 is slidably connected with a sealing plate 11, the top of the sealing plate 11 is fixed with a top plate 13 through bolts, the outer surface of the sealing plate 11 is bonded with a sealing sleeve 12, both side inner walls of the cooling box 2 are respectively welded with guide rails, the sealing plate 11 is slidably connected between the two guide rails, and both sides of the outer surface of the sealing sleeve 12 are respectively in contact with the guide rails and the bottom inner wall of the cooling box 2, through the combination design of the cooling box 2, the first electric push rod 9 and the lifting assembly 10, the worker can move the sintered semiconductor device into the cooling box 2 for cooling, which accelerates the cooling speed of the semiconductor device, and facilitates the testing use of the semiconductor device after sintering, both side outer walls of the cooling box 2 are respectively fixed with a third electric push rod 14 through bolts, and the output ends of the two third electric push rods 14 are both fixed with the top plate 13 through bolts.

[0038] The sintering assembly 1 further comprises a vacuum interface 102, a high-purity nitrogen gas interface 103, a formic acid interface 104 and a waste gas interface 105, the vacuum interface 102, the high-purity nitrogen gas interface 103 and the formic acid interface 104 are all located on one side outer wall of the vacuum box 101, the waste gas interface 105 is located on the other side outer wall of the vacuum box 101, one end of the waste gas interface 105 is flange-connected with a control valve, and one side outer wall of the vacuum box 101 is rotatably connected with a glass door 16.

[0039] The bearing assembly 4 comprises a base 401 fixed on the inner wall bottom of the support frame 3 by bolts, a pressure sensor 402 fixed above the base 401 by bolts, a connecting block 403 fixed above the pressure sensor 402 by bolts, an installation port formed above the connecting block 403, a heating plate 404 fixed in the installation port by bolts, and the bottom of the sample table 5 in contact with the upper surfaces of the connecting block 403 and the heating plate 404. The design of the pressure sensor 402 in the bearing assembly 4 can sense the test pressure during sintering and mechanical pressure testing of the semiconductor device. In this way, the semiconductor device can complete separate sintering and testing operations in the equipment, and the integrated design improves the efficiency of semiconductor device production and processing.

[0040] The lifting assembly 10 comprises a main plate 1001 fixed on the output end of the first electric push rod 9 by bolts, two fixed plates 1002 welded on one side of the main plate 1001, ground wheels 27 fixed on one side of the main plate 1001 and one end of the two fixed plates 1002 by bolts, respectively, the ground wheels 27 rolling on the inner wall bottom of the cooling box 2, a second electric push rod 1003 fixed on the upper surface of the fixed plate 1002 by bolts, and a support seat 1004 fixed on the top end of the second electric push rod 1003 by bolts.

[0041] The top of the support frame 3 is welded with a connecting cylinder 19, the top ends of the two threaded rods 301 are both keyed with a chain wheel 20, and the same chain 21 is arranged between the two chain wheels 20. The chain wheel 20 and the chain 21 are both located in the connecting cylinder 19, the top of the inner surface of the connecting cylinder 19 is fixed with a connecting plate 22 by bolts, and the top of the connecting plate 22 is fixed with a driving motor 23 by bolts. The driving motor 23 can be a reduction motor with a self-locking function, or other models of motors with a self-locking function can be selected to ensure the adaptability of power and function. The output end of the driving motor 23 is connected to the top of one of the threaded rods 301. The design of the combination of the two chain wheels 20 and the chain 21 enables the two threaded rods 301 to rotate synchronously, and the two rotating threaded rods 301 can drive the sliding plate 7 to slide up and down, ensuring the stability of the sliding plate 7 and the uniformity of the pressing force of the pressing head 8 on the semiconductor device.

[0042] Meanwhile, the multiple side outer walls of the connecting block 403 are fixed with limit plates 25 through bolts respectively, the sample table 5 is slidingly connected between the multiple limit plates 25, and one side of two limit plates 25 is fixed with a temperature sensor 26 through a bolt, wherein the model of the pressure sensor 26 is 9017A100. Through the design of the limit plate 25 on the connecting block 403, the sample table 5 can be guided when placed on the bearing assembly 4, so as to ensure that the sample table 5 is aligned with the connecting block 403 and the heating plate 404 on the bearing assembly 4, and also facilitate the alignment of the lifting assembly 10 and the handle 6 on the sample table 5, so as to facilitate the accurate placement of the semiconductor device during sintering and testing.

[0043] The side outer wall of the vacuum box 101 is fixed with a control host 17 and a display screen 18 through bolts, and the temperature sensor 26, the driving motor 23, the display screen 18, the third electric push rod 14, the second electric push rod 1003, the first electric push rod 9, the heating plate 404 and the pressure sensor 402 are electrically connected with the control host 17.

[0044] The working principle of the embodiment is as follows: in use, the operator first connects the vacuum interface 102 with the vacuum pump, connects the high-purity nitrogen gas interface 103 and the formic acid interface 104 with the nitrogen pipe and the formic acid pipe through the connecting valve respectively, and connects the exhaust gas interface 105 with the exhaust pipe through the air pump at one end of the control valve; then, the operator opens the glass door 16, holds the handle 6 to take the sample table 5 off the bearing assembly 4, places the semiconductor device to be sintered on the upper surface of the sample table 5, and then places the sample table 5 back on the bearing assembly 4, closes the glass door 16 and locks it; then, the operator performs vacuumization on the vacuum box 101 through the vacuum pump, and introduces nitrogen and formic acid through the high-purity nitrogen gas interface 103 and the formic acid interface 104, and then starts the driving motor 23, so that the two threaded rods 301 rotate simultaneously under the action of the sprocket 20 and the chain 21, the sliding plate 7 and the pressure head 8 thereon slide downward, until the pressure head 8 contacts the semiconductor device, and continues to move downward, and in the process of moving downward, the semiconductor device is subjected to a pressing force, the pressing force of the semiconductor device during sintering is 5.0MPa, the heating plate 404 generates heat, the heat is conducted to the semiconductor device on the sample table 5 through the sample table 5, the pre-sintering temperature is controlled to be 130-170℃, and the time is controlled to be 50-100s, then the temperature during pressing is controlled to be 250-300℃, and the pressing time is controlled to be 5-20min, the pressure sensor 402 and the temperature sensor 26 are used to monitor the change of the pressing force and the temperature in real time during the pre-sintering and pressing processes, so as to make relevant adjustments in time, so as to ensure that the semiconductor device is subjected to uniform force and heat during the whole processing process, and thus the sintering of the semiconductor device by the equipment is completed.

[0045] After the semiconductor device is completed sintering, the operator first discharges the residual gas in the vacuum box 101 to the exhaust pipe through the exhaust port 105, then slides the top plate 13 and the sealing plate 11 upward through the third electric push rod 14, slides the lifting assembly 10 to the anti-skid slide of the bearing assembly 4 through the first electric push rod 9, until the support seat 1004 in the lifting assembly 10 is located directly below the handle 6, then drives the support seat 1004 to slide upward through the two second electric push rods 1003, slides the handle 6 and the sample table 5 upward through the support seat 1004, until the sample table 5 is separated from the limiting plate 25, then the first electric push rod 9 is retracted, so that the position of the lifting assembly 10 is reset, at this time, the semiconductor device on the sample table 5 is located in the cooling box 2, and the cooling box 2 ventilates from the air vent 15 to cool the semiconductor device, so that the cooling use of the device on the semiconductor device is completed;

[0046] After the semiconductor device is completed cooling, the first electric push rod 9 and the second electric push rod 1003 are reversely operated in sequence until the sample table 5 is reset on the bearing assembly 4, and the lifting assembly 10 and the sealing plate 11 are reset, the operator drives the motor 23, and the two threaded rods 301 are rotated under the action of the sprocket 20 and the chain 21, so that the sliding plate 7 and the pressure head 8 thereon slide downward, until the pressure head 8 contacts the semiconductor device, and continues to move downward, and in the downward movement process, the semiconductor device is subjected to a pressing force, the pressure is sensed by the pressure sensor 402 below the semiconductor device and displayed on the display screen 18, at this time, the operator tests the mechanical pressure of the semiconductor device according to the integrated circuit stress test pressure standard, that is, JEDEC JESD47K-2018, judges whether the sintering of the semiconductor device is qualified according to the test pressure standard, so that the pressure test use after the sintering of the semiconductor device is completed.

[0047] Embodiment 2

[0048] With reference to Figure 10 One side of the two air vents 15 is clamped with a dust screen 28, the dust screen 28 can prevent dust from entering the air vent 15 on the cooling box 2, and ensure the cleanliness of the inside of the cooling box 2, the inner wall of one side of the cooling box 2 is fixed with a fixed cylinder 29 through bolts, the inner surface of one side of the fixed cylinder 29 is fixed with a connecting frame 30 through bolts, and the one side of the connecting frame 30 is fixed with a cooling fan 31 through bolts, the design of the cooling fan 31 can accelerate the flow of gas in the cooling box 2 when the semiconductor device in the cooling box 2 is cooled, and improve the cooling speed of the semiconductor device in the cooling box 2, facilitating the cooling use after the semiconductor sintering.

[0049] The working principle of the embodiment is that when the semiconductor device is located in the cooling box 2, the operator can start the cooling fan 31 to accelerate the air flow in the cooling box 2 and improve the cooling efficiency of the semiconductor device after sintering.

[0050] The electrical components in the present application are electrically connected with the main controller and 220V mains, and the main controller can be a computer or other conventional known device that can be controlled.

[0051] In the description in the present application, it should be noted that, unless otherwise specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

Claims

1. A multifunctional integrated semiconductor sintering and testing integrated device comprising a sintering assembly (1), characterized in that, The sintering assembly (1) includes a vacuum box (101), one side outer wall of the vacuum box (101) is connected with a cooling box (2) through bolts, both sides of the outer wall of the cooling box (2) are provided with air vents (15), and the cooling box (2) is communicated with the vacuum box (101), the inner wall bottom of the vacuum box (101) is fixedly connected with a support frame (3), the inner wall bottom of the support frame (3) is provided with a bearing assembly (4), the upper side of the bearing assembly (4) is placed with a sample table (5), and both sides of the sample table (5) are fixedly connected with handles (6), the inner wall top and bottom of the support frame (3) are rotatably connected with two threaded rods (301), the same sliding plate (7) is threadedly connected between the two threaded rods (301), the bottom of the sliding plate (7) is clamped with a plurality of pressure heads (8), a plurality of guide rods (24) are inserted between the inner wall top and bottom of the support frame (3), and the sliding plate (7) is slidably connected with the guide rods (24), one side outer wall of the cooling box (2) is fixedly connected with a first electric push rod (9), and the cooling box (2) is provided with a lifting assembly (10), the top of the cooling box (2) is slidably connected with a sealing plate (11), the top of the sealing plate (11) is fixedly connected with a top plate (13), the outer surface of the sealing plate (11) is provided with a sealing sleeve (12), both side inner walls of the cooling box (2) are fixedly connected with guide rails, the sealing plate (11) is slidably connected between the two guide rails, and both sides of the outer surface of the sealing sleeve (12) are in contact with the guide rails and the bottom inner wall of the cooling box (2).

2. The multi-functional integrated semiconductor sintering and testing apparatus according to claim 1, wherein: The sintering assembly (1) further includes a vacuum interface (102), a high-purity nitrogen gas interface (103), a formic acid interface (104) and a waste gas interface (105), the vacuum interface (102), the high-purity nitrogen gas interface (103) and the formic acid interface (104) are located on one side outer wall of the vacuum box (101), the waste gas interface (105) is located on the other side outer wall of the vacuum box (101), one end of the waste gas interface (105) is flange-connected with a control valve, and one side outer wall of the vacuum box (101) is rotatably connected with a glass door (16).

3. The multi-functional integrated semiconductor sintering and testing apparatus according to claim 2, wherein: The bearing assembly (4) includes a base (401) fixedly connected to the inner wall bottom of the support frame (3), a pressure sensor (402) fixedly connected above the base (401), a connecting block (403) fixedly connected above the pressure sensor (402), an installation opening formed in the upper side of the connecting block (403), a heating plate (404) fixedly connected in the installation opening, and the bottom of the sample table (5) in contact with the upper surfaces of the connecting block (403) and the heating plate (404).

4. The multi-functional integrated semiconductor sintering and testing apparatus according to claim 3, wherein: The lifting assembly (10) comprises a main plate (1001) fixedly connected at the output end of the first electric push rod (9), one side of the main plate (1001) is fixedly connected with two fixed plates (1002), one side of the main plate (1001) and one end of the two fixed plates (1002) are fixedly connected with ground wheels (27), the ground wheels (27) roll on the inner wall bottom of the cooling box (2), the upper surface of the fixed plate (1002) is fixedly connected with the second electric push rod (1003), and the top end of the second electric push rod (1003) is fixedly connected with a support seat (1004).

5. The multi-functional integrated semiconductor sintering and testing apparatus according to claim 4, wherein: The two sides of the cooling box (2) are fixedly connected with third electric push rods (14), and the output ends of the two third electric push rods (14) are fixedly connected with the top plate (13).

6. The multi-functional integrated semiconductor sintering and testing apparatus according to claim 5, wherein: The top of the support frame (3) is fixedly connected with a connecting barrel (19), the top ends of the two threaded rods (301) are fixedly connected with sprockets (20), and the same chain (21) is arranged between the two sprockets (20), the sprockets (20) and the chain (21) are located in the connecting barrel (19), the top of the inner surface of the connecting barrel (19) is fixedly connected with a connecting plate (22), the top of the connecting plate (22) is fixedly connected with a driving motor (23), and the output end of the driving motor (23) is connected with the top of one of the threaded rods (301).

7. The multi-functional integrated semiconductor sintering and testing apparatus according to claim 6, wherein: The multiple side outer walls of the connecting block (403) are fixedly connected with limiting plates (25), the sample table (5) is slidingly connected between the multiple limiting plates (25), and one side of two of the limiting plates (25) is fixedly connected with a temperature sensor (26).

8. The multi-functional integrated semiconductor sintering and testing apparatus according to claim 7, wherein: The side outer wall of the vacuum box (101) is fixedly connected with a control host (17) and a display screen (18), and the temperature sensor (26), the driving motor (23), the display screen (18), the third electric push rod (14), the second electric push rod (1003), the first electric push rod (9), the heating plate (404) and the pressure sensor (402) are electrically connected with the control host (17).

9. The multi-functional integrated semiconductor sintering and testing apparatus according to claim 1, wherein: The side of the two ventilation openings (15) is clamped with a dustproof net (28), one side of the inner wall of the cooling box (2) is fixedly connected with a fixed cylinder (29), one side of the inner surface of the fixed cylinder (29) is fixedly connected with a connecting frame (30), and one side of the connecting frame (30) is fixedly connected with a cooling fan (31).

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